Part | RoHS | Manufacturer | Polarity or Channel Type | Configuration | Surface Mount | Maximum Power Dissipation (Abs) | Maximum Collector Current (IC) | Package Body Material | Transistor Application | Maximum Rise Time (tr) | Maximum VCEsat | Minimum DS Breakdown Voltage | Terminal Form | Package Shape | Operating Mode | No. of Elements | Highest Frequency Band | Maximum Pulsed Drain Current (IDM) | Avalanche Energy Rating (EAS) | Maximum Fall Time (tf) | Maximum Drain Current (Abs) (ID) | Nominal Turn Off Time (toff) | No. of Terminals | Package Style (Meter) | Sub-Category | Field Effect Transistor Technology | Maximum Power Dissipation Ambient | Minimum DC Current Gain (hFE) | Maximum Operating Temperature | Transistor Element Material | Maximum Turn On Time (ton) | Minimum Operating Temperature | Maximum Turn Off Time (toff) | Maximum Gate-Emitter Threshold Voltage | Terminal Finish | Maximum Drain-Source On Resistance | Maximum Drain Current (ID) | Terminal Position | JESD-30 Code | Moisture Sensitivity Level (MSL) | Case Connection | Qualification | Additional Features | JEDEC-95 Code | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Nominal Turn On Time (ton) | Maximum Feedback Capacitance (Crss) | Reference Standard |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Vishay Intertechnology |
P-CHANNEL |
SINGLE WITH BUILT-IN DIODE |
YES |
4 W |
PLASTIC/EPOXY |
30 V |
GULL WING |
RECTANGULAR |
ENHANCEMENT MODE |
1 |
100 A |
15 A |
2 |
SMALL OUTLINE |
Other Transistors |
METAL-OXIDE SEMICONDUCTOR |
150 Cel |
SILICON |
MATTE TIN OVER NICKEL |
.018 ohm |
15 A |
SINGLE |
R-PSSO-G2 |
1 |
DRAIN |
Not Qualified |
TO-252 |
e3 |
|||||||||||||||||||||
|
STMicroelectronics |
N-CHANNEL |
SINGLE WITH BUILT-IN DIODE |
YES |
4 W |
PLASTIC/EPOXY |
SWITCHING |
30 V |
NO LEAD |
RECTANGULAR |
ENHANCEMENT MODE |
1 |
60 A |
150 mJ |
55 A |
5 |
SMALL OUTLINE |
FET General Purpose Power |
METAL-OXIDE SEMICONDUCTOR |
150 Cel |
SILICON |
MATTE TIN |
.0115 ohm |
15 A |
DUAL |
R-PDSO-N5 |
1 |
DRAIN |
Not Qualified |
LOW THRESHOLD |
e3 |
|||||||||||||||||||
Toshiba |
N-CHANNEL AND P-CHANNEL |
COMMON SOURCE, 2 ELEMENTS WITH BUILT-IN DIODE |
NO |
4 W |
PLASTIC/EPOXY |
SWITCHING |
60 V |
THROUGH-HOLE |
RECTANGULAR |
ENHANCEMENT MODE |
2 |
20 A |
129 mJ |
10 |
IN-LINE |
Other Transistors |
METAL-OXIDE SEMICONDUCTOR |
SILICON |
.32 ohm |
5 A |
SINGLE |
R-PSIP-T10 |
ISOLATED |
Not Qualified |
||||||||||||||||||||||||||
NXP Semiconductors |
N-CHANNEL |
SINGLE WITH BUILT-IN DIODE |
YES |
4 W |
PLASTIC/EPOXY |
SWITCHING |
50 V |
GULL WING |
RECTANGULAR |
ENHANCEMENT MODE |
1 |
8 A |
3 |
SMALL OUTLINE |
FET General Purpose Power |
METAL-OXIDE SEMICONDUCTOR |
150 Cel |
SILICON |
.2 ohm |
8 A |
SINGLE |
R-PSSO-G3 |
DRAIN |
Not Qualified |
LOGIC LEVEL COMPATIBLE, ESD PROTECTED |
|||||||||||||||||||||||||
NXP Semiconductors |
N-CHANNEL |
SINGLE WITH BUILT-IN DIODE |
YES |
4 W |
PLASTIC/EPOXY |
SWITCHING |
30 V |
GULL WING |
RECTANGULAR |
ENHANCEMENT MODE |
1 |
64 A |
77 mJ |
16 A |
8 |
SMALL OUTLINE |
FET General Purpose Power |
METAL-OXIDE SEMICONDUCTOR |
150 Cel |
SILICON |
.013 ohm |
16 A |
DUAL |
R-PDSO-G8 |
Not Qualified |
MS-012AA |
||||||||||||||||||||||||
NXP Semiconductors |
P-CHANNEL |
SINGLE WITH BUILT-IN DIODE |
YES |
4 W |
PLASTIC/EPOXY |
SWITCHING |
300 V |
GULL WING |
RECTANGULAR |
ENHANCEMENT MODE |
1 |
1.3 A |
.325 A |
4 |
SMALL OUTLINE |
Other Transistors |
METAL-OXIDE SEMICONDUCTOR |
4 W |
150 Cel |
SILICON |
17 ohm |
.325 A |
DUAL |
R-PDSO-G4 |
DRAIN |
Not Qualified |
LOGIC LEVEL COMPATIBLE |
|||||||||||||||||||||||
Infineon Technologies |
P-CHANNEL |
SINGLE WITH BUILT-IN DIODE |
NO |
4 W |
CERAMIC, METAL-SEALED COFIRED |
SWITCHING |
200 V |
PIN/PEG |
SQUARE |
ENHANCEMENT MODE |
1 |
56 A |
500 mJ |
14 A |
3 |
FLANGE MOUNT |
Other Transistors |
METAL-OXIDE SEMICONDUCTOR |
150 Cel |
SILICON |
TIN LEAD |
.33 ohm |
14 A |
SINGLE |
S-CSFM-P3 |
Qualified |
AVALANCHE RATED |
TO-254AA |
e0 |
MIL-19500/662 |
||||||||||||||||||||
Infineon Technologies |
N-CHANNEL AND P-CHANNEL |
SINGLE |
YES |
4 W |
UNSPECIFIED |
NO LEAD |
RECTANGULAR |
ENHANCEMENT MODE |
1 |
35 A |
3 |
UNCASED CHIP |
FET General Purpose Power |
METAL-OXIDE SEMICONDUCTOR |
150 Cel |
SILICON |
35 A |
UPPER |
R-XUUC-N3 |
1 |
DRAIN |
Qualified |
RADIATION HARDENED |
MIL-19500/657A |
||||||||||||||||||||||||||
Infineon Technologies |
P-CHANNEL |
SINGLE WITH BUILT-IN DIODE |
NO |
4 W |
CERAMIC, METAL-SEALED COFIRED |
SWITCHING |
100 V |
PIN/PEG |
SQUARE |
ENHANCEMENT MODE |
1 |
88 A |
500 mJ |
22 A |
3 |
FLANGE MOUNT |
Other Transistors |
METAL-OXIDE SEMICONDUCTOR |
150 Cel |
SILICON |
TIN LEAD |
.085 ohm |
22 A |
SINGLE |
S-CSFM-P3 |
Qualified |
HIGH RELIABILITY |
TO-254AA |
e0 |
MIL-19500/662 |
||||||||||||||||||||
Infineon Technologies |
P-CHANNEL |
SINGLE WITH BUILT-IN DIODE |
YES |
4 W |
CERAMIC, METAL-SEALED COFIRED |
SWITCHING |
200 V |
NO LEAD |
RECTANGULAR |
ENHANCEMENT MODE |
1 |
56 A |
500 mJ |
14 A |
3 |
CHIP CARRIER |
Other Transistors |
METAL-OXIDE SEMICONDUCTOR |
150 Cel |
SILICON |
TIN LEAD |
.33 ohm |
14 A |
BOTTOM |
R-CBCC-N3 |
DRAIN |
Qualified |
HIGH RELIABILITY |
e0 |
MIL-19500/662 |
||||||||||||||||||||
Infineon Technologies |
P-CHANNEL |
SINGLE WITH BUILT-IN DIODE |
YES |
4 W |
CERAMIC, METAL-SEALED COFIRED |
SWITCHING |
100 V |
NO LEAD |
RECTANGULAR |
ENHANCEMENT MODE |
1 |
88 A |
500 mJ |
22 A |
3 |
CHIP CARRIER |
Other Transistors |
METAL-OXIDE SEMICONDUCTOR |
150 Cel |
SILICON |
TIN LEAD |
.085 ohm |
22 A |
BOTTOM |
R-CBCC-N3 |
DRAIN |
Qualified |
HIGH RELIABILITY, RADIATION HARDENED |
e0 |
MIL-19500/662 |
||||||||||||||||||||
Infineon Technologies |
N-CHANNEL |
SINGLE WITH BUILT-IN DIODE |
NO |
4 W |
CERAMIC, METAL-SEALED COFIRED |
SWITCHING |
60 V |
PIN/PEG |
SQUARE |
ENHANCEMENT MODE |
1 |
140 A |
500 mJ |
35 A |
3 |
FLANGE MOUNT |
FET General Purpose Power |
METAL-OXIDE SEMICONDUCTOR |
150 Cel |
SILICON |
TIN LEAD |
.03 ohm |
35 A |
SINGLE |
S-CSFM-P3 |
Qualified |
RADIATION HARDENED |
TO-254AA |
e0 |
MIL-19500/663 |
||||||||||||||||||||
Infineon Technologies |
P-CHANNEL |
SINGLE |
YES |
4 W |
CERAMIC, METAL-SEALED COFIRED |
200 V |
NO LEAD |
RECTANGULAR |
ENHANCEMENT MODE |
1 |
56 A |
500 mJ |
14 A |
3 |
CHIP CARRIER |
Other Transistors |
METAL-OXIDE SEMICONDUCTOR |
150 Cel |
SILICON |
TIN LEAD |
14 A |
BOTTOM |
R-CBCC-N3 |
ISOLATED |
Qualified |
RADIATION HARDENED |
e0 |
MIL-19500/662A |
||||||||||||||||||||||
Toshiba |
N-CHANNEL |
NO |
4 W |
ENHANCEMENT MODE |
3 A |
FET General Purpose Power |
METAL-OXIDE SEMICONDUCTOR |
150 Cel |
Tin/Lead (Sn/Pb) |
3 A |
e0 |
|||||||||||||||||||||||||||||||||||||||
Toshiba |
P-CHANNEL |
2 BANKS, COMMON SOURCE, 2 ELEMENTS WITH BUILT-IN DIODE |
NO |
4 W |
PLASTIC/EPOXY |
SWITCHING |
60 V |
THROUGH-HOLE |
RECTANGULAR |
ENHANCEMENT MODE |
4 |
20 A |
273 mJ |
5 A |
10 |
IN-LINE |
Other Transistors |
METAL-OXIDE SEMICONDUCTOR |
150 Cel |
SILICON |
.28 ohm |
5 A |
SINGLE |
R-PSIP-T10 |
ISOLATED |
Not Qualified |
||||||||||||||||||||||||
Toshiba |
N-CHANNEL |
2 BANKS, COMMON SOURCE, 2 ELEMENTS WITH BUILT-IN DIODE |
NO |
4 W |
PLASTIC/EPOXY |
SWITCHING |
60 V |
THROUGH-HOLE |
RECTANGULAR |
ENHANCEMENT MODE |
4 |
20 A |
129 mJ |
5 A |
10 |
IN-LINE |
FET General Purpose Power |
METAL-OXIDE SEMICONDUCTOR |
150 Cel |
SILICON |
.32 ohm |
5 A |
SINGLE |
R-PSIP-T10 |
Not Qualified |
|||||||||||||||||||||||||
Toshiba |
P-CHANNEL |
2 BANKS, COMMON SOURCE, 2 ELEMENTS WITH BUILT-IN DIODE |
NO |
4 W |
PLASTIC/EPOXY |
SWITCHING |
60 V |
THROUGH-HOLE |
RECTANGULAR |
ENHANCEMENT MODE |
4 |
10 A |
5 A |
10 |
IN-LINE |
Other Transistors |
METAL-OXIDE SEMICONDUCTOR |
150 Cel |
SILICON |
Tin/Lead (Sn/Pb) |
.8 ohm |
5 A |
SINGLE |
R-PSIP-T10 |
Not Qualified |
e0 |
||||||||||||||||||||||||
Toshiba |
N-CHANNEL |
2 BANKS, COMMON SOURCE, 2 ELEMENTS WITH BUILT-IN DIODE |
NO |
4 W |
PLASTIC/EPOXY |
SWITCHING |
100 V |
THROUGH-HOLE |
RECTANGULAR |
ENHANCEMENT MODE |
2 |
12 A |
140 mJ |
3 A |
10 |
IN-LINE |
FET General Purpose Power |
METAL-OXIDE SEMICONDUCTOR |
150 Cel |
SILICON |
.45 ohm |
3 A |
SINGLE |
R-PSIP-T10 |
ISOLATED |
Not Qualified |
||||||||||||||||||||||||
Toshiba |
N-CHANNEL AND P-CHANNEL |
2 BANKS, COMMON SOURCE, 2 ELEMENTS WITH BUILT-IN DIODE |
NO |
4 W |
PLASTIC/EPOXY |
SWITCHING |
60 V |
THROUGH-HOLE |
RECTANGULAR |
ENHANCEMENT MODE |
4 |
10 A |
5 A |
10 |
IN-LINE |
Other Transistors |
METAL-OXIDE SEMICONDUCTOR |
150 Cel |
SILICON |
120 ns |
600 ns |
.2 ohm |
5 A |
SINGLE |
R-PSIP-T10 |
Not Qualified |
NOT SPECIFIED |
240 |
180 pF |
|||||||||||||||||||||
Toshiba |
N-CHANNEL |
NO |
4 W |
ENHANCEMENT MODE |
5 A |
FET General Purpose Power |
METAL-OXIDE SEMICONDUCTOR |
150 Cel |
Tin/Lead (Sn/Pb) |
5 A |
e0 |
|||||||||||||||||||||||||||||||||||||||
Toshiba |
N-CHANNEL |
2 BANKS, COMMON SOURCE, 2 ELEMENTS WITH BUILT-IN DIODE |
NO |
4 W |
PLASTIC/EPOXY |
SWITCHING |
60 V |
THROUGH-HOLE |
RECTANGULAR |
ENHANCEMENT MODE |
4 |
10 A |
5 A |
10 |
IN-LINE |
FET General Purpose Power |
METAL-OXIDE SEMICONDUCTOR |
150 Cel |
SILICON |
Tin/Lead (Sn/Pb) |
.32 ohm |
5 A |
SINGLE |
R-PSIP-T10 |
Not Qualified |
FAST SWITCHING |
e0 |
|||||||||||||||||||||||
Toshiba |
N-CHANNEL |
2 BANKS, COMMON SOURCE, 2 ELEMENTS WITH BUILT-IN DIODE |
NO |
4 W |
PLASTIC/EPOXY |
SWITCHING |
120 V |
THROUGH-HOLE |
RECTANGULAR |
ENHANCEMENT MODE |
4 |
6 A |
3 A |
10 |
IN-LINE |
FET General Purpose Power |
METAL-OXIDE SEMICONDUCTOR |
150 Cel |
SILICON |
Tin/Lead (Sn/Pb) |
.74 ohm |
3 A |
SINGLE |
R-PSIP-T10 |
Not Qualified |
FAST SWITCHING |
e0 |
|||||||||||||||||||||||
Toshiba |
P-CHANNEL |
COMMON SOURCE, 4 ELEMENTS WITH BUILT-IN DIODE |
NO |
4 W |
PLASTIC/EPOXY |
SWITCHING |
60 V |
THROUGH-HOLE |
RECTANGULAR |
ENHANCEMENT MODE |
4 |
10 A |
5 A |
10 |
IN-LINE |
FET General Purpose Power |
METAL-OXIDE SEMICONDUCTOR |
150 Cel |
SILICON |
.5 ohm |
5 A |
SINGLE |
R-PSIP-T10 |
Not Qualified |
||||||||||||||||||||||||||
Renesas Electronics |
N-CHANNEL |
COMPLEX |
NO |
4 W |
PLASTIC/EPOXY |
SWITCHING |
120 V |
THROUGH-HOLE |
RECTANGULAR |
ENHANCEMENT MODE |
4 |
12 A |
3 A |
12 |
IN-LINE |
FET General Purpose Power |
METAL-OXIDE SEMICONDUCTOR |
150 Cel |
SILICON |
TIN LEAD |
.65 ohm |
3 A |
SINGLE |
R-PSIP-T12 |
Not Qualified |
e0 |
||||||||||||||||||||||||
Renesas Electronics |
P-CHANNEL |
SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE |
YES |
4 W |
PLASTIC/EPOXY |
SWITCHING |
60 V |
GULL WING |
RECTANGULAR |
ENHANCEMENT MODE |
2 |
28 A |
3.5 A |
8 |
SMALL OUTLINE |
Other Transistors |
METAL-OXIDE SEMICONDUCTOR |
150 Cel |
SILICON |
.23 ohm |
3.5 A |
DUAL |
R-PDSO-G8 |
Not Qualified |
MS-012AA |
|||||||||||||||||||||||||
Renesas Electronics |
P-CHANNEL |
SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE |
YES |
4 W |
PLASTIC/EPOXY |
SWITCHING |
60 V |
GULL WING |
RECTANGULAR |
ENHANCEMENT MODE |
2 |
28 A |
3.5 A |
8 |
SMALL OUTLINE |
Other Transistors |
METAL-OXIDE SEMICONDUCTOR |
150 Cel |
SILICON |
.23 ohm |
3.5 A |
DUAL |
R-PDSO-G8 |
Not Qualified |
MS-012AA |
|||||||||||||||||||||||||
Renesas Electronics |
N-CHANNEL |
NO |
4 W |
ENHANCEMENT MODE |
10 A |
FET General Purpose Power |
METAL-OXIDE SEMICONDUCTOR |
150 Cel |
10 A |
|||||||||||||||||||||||||||||||||||||||||
|
Renesas Electronics |
N-CHANNEL |
COMPLEX |
NO |
4 W |
PLASTIC/EPOXY |
SWITCHING |
120 V |
THROUGH-HOLE |
RECTANGULAR |
ENHANCEMENT MODE |
4 |
12 A |
3 A |
12 |
IN-LINE |
FET General Purpose Power |
METAL-OXIDE SEMICONDUCTOR |
150 Cel |
SILICON |
.65 ohm |
3 A |
SINGLE |
R-PSIP-T12 |
Not Qualified |
10 |
260 |
Power Field Effect Transistors (FET) are electronic devices used in power electronics to control and switch high current and voltage levels. They are commonly used in applications such as motor drives, power supplies, and switching regulators.
The Power FET is a three-terminal device that works by controlling the flow of majority charge carriers (electrons or holes) between the source and drain regions through a gate electrode. The gate electrode is insulated from the channel region by a thin oxide layer, which can be controlled by applying a voltage to the gate terminal. When a voltage is applied to the gate electrode, it creates an electric field that modifies the conductivity of the channel, allowing current to flow between the source and drain.
Power FETs are designed to handle high current and voltage levels, and have a low on-resistance and high switching speed. They are typically used in applications that require efficient and precise control of power, such as motor drives and power supplies.
Power FETs are available in various types and configurations, including N-channel and P-channel FETs, and can handle power levels ranging from a few watts to several kilowatts. They are subject to various standards and regulations, such as UL (Underwriters Laboratories) and CE (Conformité Européenne), to ensure their safety and performance.