NXP Semiconductors - MRF9002NR2

MRF9002NR2 by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number MRF9002NR2
Description N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): 4 W; Case Connection: SOURCE; Package Body Material: PLASTIC/EPOXY;
Datasheet MRF9002NR2 Datasheet
In Stock4,326
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Maximum Time At Peak Reflow Temperature (s): 30
Configuration: SINGLE
Transistor Element Material: SILICON
Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR
Transistor Application: AMPLIFIER
Sub-Category: FET General Purpose Power
Surface Mount: YES
No. of Terminals: 16
Maximum Power Dissipation (Abs): 4 W
Terminal Position: DUAL
Package Style (Meter): SMALL OUTLINE
JESD-30 Code: R-PDSO-G16
No. of Elements: 1
Package Shape: RECTANGULAR
Terminal Form: GULL WING
Operating Mode: ENHANCEMENT MODE
Highest Frequency Band: ULTRA HIGH FREQUENCY BAND
Maximum Operating Temperature: 150 Cel
Case Connection: SOURCE
Moisture Sensitivity Level (MSL): 3
Polarity or Channel Type: N-CHANNEL
Minimum DS Breakdown Voltage: 65 V
Qualification: Not Qualified
Peak Reflow Temperature (C): 240
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Pricing (USD)

Qty. Unit Price Ext. Price
4,326 $16.180 $69,994.680

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