NXP Semiconductors - MSB11900Y

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MSB11900Y by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number MSB11900Y
Description NPN; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): 1000 W; Maximum Collector Current (IC): 50 A; Package Body Material: CERAMIC, METAL-SEALED COFIRED;
Datasheet MSB11900Y Datasheet
In Stock1,623
NAME DESCRIPTION
Minimum Power Gain (Gp): 7 dB
Package Body Material: CERAMIC, METAL-SEALED COFIRED
Maximum Collector Current (IC): 50 A
Configuration: SINGLE
Transistor Element Material: SILICON
Sub-Category: Other Transistors
Polarity or Channel Type: NPN
Surface Mount: YES
No. of Terminals: 4
Qualification: Not Qualified
Maximum Power Dissipation (Abs): 1000 W
Terminal Position: DUAL
Package Style (Meter): FLANGE MOUNT
JESD-30 Code: R-CDFM-F4
No. of Elements: 1
Package Shape: RECTANGULAR
Terminal Form: FLAT
Highest Frequency Band: L BAND
Maximum Operating Temperature: 200 Cel
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