NXP Semiconductors - PHB44N06LT

PHB44N06LT by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number PHB44N06LT
Description N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 114 W; Transistor Element Material: SILICON; Maximum Drain-Source On Resistance: .028 ohm;
Datasheet PHB44N06LT Datasheet
In Stock4,911
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Configuration: SINGLE WITH BUILT-IN DIODE
Transistor Element Material: SILICON
Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR
Transistor Application: SWITCHING
Maximum Turn On Time (ton): 157 ns
Maximum Drain Current (ID): 44 A
Maximum Pulsed Drain Current (IDM): 176 A
Sub-Category: FET General Purpose Powers
Surface Mount: YES
No. of Terminals: 2
Maximum Power Dissipation (Abs): 114 W
Terminal Position: SINGLE
Package Style (Meter): SMALL OUTLINE
Maximum Turn Off Time (toff): 180 ns
JESD-30 Code: R-PSSO-G2
No. of Elements: 1
Package Shape: RECTANGULAR
Terminal Form: GULL WING
Operating Mode: ENHANCEMENT MODE
Maximum Operating Temperature: 175 Cel
Case Connection: DRAIN
Maximum Power Dissipation Ambient: 114 W
Maximum Drain-Source On Resistance: .028 ohm
Avalanche Energy Rating (EAS): 70 mJ
Maximum Feedback Capacitance (Crss): 180 pF
Polarity or Channel Type: N-CHANNEL
Minimum DS Breakdown Voltage: 55 V
Qualification: Not Qualified
Maximum Drain Current (Abs) (ID): 44 A
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