Part | RoHS | Manufacturer | Converter Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | Maximum Analog Output Voltage | No. of Analog In Channels | Surface Mount | Maximum Supply Voltage | Maximum Analog Input Voltage | Sample Rate | No. of Functions | Technology | Screening Level | No. of Bits | Maximum Settling Time | Maximum Supply Current | Maximum Linearity Error (EL) | Input Format | Nominal Supply Voltage | Output Bit Code | Power Supplies (V) | Nominal Negative Supply Voltage | Package Style (Meter) | Package Equivalence Code | Sub-Category | Nominal Settling Time (tstl) | Minimum Supply Voltage | Terminal Pitch | Maximum Operating Temperature | Minimum Analog Input Voltage | Output Format | Minimum Operating Temperature | Terminal Finish | Sample and Hold/Track and Hold | Terminal Position | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Minimum Analog Output Voltage | Length | Input Bit Code |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Analog Devices |
Digital to Analog converter |
Commercial |
Ball |
170 |
LFBGA |
Rectangular |
Plastic/Epoxy |
1 V |
Yes |
1 |
CMOS |
16 |
790 mA |
0.0061 % |
Serial, Parallel, Word |
1.8 V |
Grid Array, Low Profile, Fine Pitch |
BGA170,11X17,32 |
2.2 ns |
0.031 in (0.8 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Bottom |
R-PBGA-B170 |
3 |
0.067 in (1.69 mm) |
0.354 in (9 mm) |
30 s |
260 °C (500 °F) |
-1 V |
0.591 in (15 mm) |
2's Complement Binary |
||||||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Industrial |
Ball |
160 |
LFBGA |
Square |
Plastic/Epoxy |
2.5 V |
Yes |
1 |
CMOS |
14 |
327 mA |
Parallel, Word |
1.8 V |
1.8 V |
-1.5 V |
Grid Array, Low Profile, Fine Pitch |
BGA160,14X14,32 |
Other Converters |
13 ns |
0.031 in (0.8 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B160 |
3 |
0.055 in (1.4 mm) |
0.472 in (12 mm) |
No |
e1 |
1.5 V |
0.472 in (12 mm) |
Binary |
|||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Industrial |
Ball |
144 |
FBGA |
Square |
Plastic/Epoxy |
Yes |
1 |
16 |
1.07 A |
Parallel |
1 V |
Grid Array, Fine Pitch |
BGA144,12X12,32 |
0.031 in (0.8 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Bottom |
S-PBGA-B144 |
0.067 in (1.71 mm) |
0.394 in (10 mm) |
0.394 in (10 mm) |
2's Complement |
||||||||||||||||||||||||||||
|
Texas Instruments |
Digital to Analog converter |
Automotive |
Ball |
16 |
VFBGA |
Square |
Plastic/Epoxy |
11 V |
Yes |
200 kHz |
1 |
16 |
5 µs |
0.0015 % |
Serial |
Grid Array, Very Thin Profile, Fine Pitch |
5 µs |
0.02 in (0.5 mm) |
125 °C (257 °F) |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B16 |
1 |
0.025 in (0.625 mm) |
0.094 in (2.39 mm) |
e1 |
30 s |
260 °C (500 °F) |
0 V |
0.094 in (2.39 mm) |
Binary |
||||||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Industrial |
Ball |
144 |
FBGA |
Square |
Plastic/Epoxy |
Yes |
1 |
16 |
1.07 A |
Parallel |
1 V |
Grid Array, Fine Pitch |
BGA144,12X12,32 |
0.031 in (0.8 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Bottom |
S-PBGA-B144 |
0.067 in (1.71 mm) |
0.394 in (10 mm) |
0.394 in (10 mm) |
2's Complement |
||||||||||||||||||||||||||||
|
Texas Instruments |
Digital to Analog converter |
Automotive |
Ball |
16 |
VFBGA |
Square |
Plastic/Epoxy |
11 V |
Yes |
200 kHz |
1 |
16 |
5 µs |
0.0015 % |
Serial |
Grid Array, Very Thin Profile, Fine Pitch |
5 µs |
0.02 in (0.5 mm) |
125 °C (257 °F) |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B16 |
1 |
0.025 in (0.625 mm) |
0.094 in (2.39 mm) |
e1 |
30 s |
260 °C (500 °F) |
0 V |
0.094 in (2.39 mm) |
Binary |
||||||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Industrial |
Ball |
169 |
VFBGA |
Square |
Plastic/Epoxy |
Yes |
1 |
16 |
Serial, Parallel, Word |
1.2 V |
-1.2 V |
Grid Array, Very Thin Profile, Fine Pitch |
0.031 in (0.8 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B169 |
3 |
0.037 in (0.95 mm) |
0.433 in (11 mm) |
e1 |
0.433 in (11 mm) |
2's Complement |
||||||||||||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Industrial |
Ball |
160 |
LFBGA |
Square |
Plastic/Epoxy |
2.5 V |
Yes |
1 |
CMOS |
14 |
327 mA |
Parallel, Word |
1.8 V |
1.8 V |
-1.5 V |
Grid Array, Low Profile, Fine Pitch |
BGA160,14X14,32 |
Other Converters |
13 ns |
0.031 in (0.8 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B160 |
3 |
0.055 in (1.4 mm) |
0.472 in (12 mm) |
No |
e1 |
1.5 V |
0.472 in (12 mm) |
Binary |
|||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Commercial |
Ball |
170 |
LFBGA |
Rectangular |
Plastic/Epoxy |
1 V |
Yes |
1 |
CMOS |
16 |
0.0061 % |
Serial, Parallel, Word |
1.86 V |
Grid Array, Low Profile, Fine Pitch |
2.2 ns |
0.031 in (0.8 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Tin Silver Copper |
Bottom |
R-PBGA-B170 |
3 |
0.067 in (1.69 mm) |
0.354 in (9 mm) |
e1 |
-1 V |
0.591 in (15 mm) |
2's Complement Binary |
||||||||||||||||||||||
|
Texas Instruments |
Digital to Analog converter |
Automotive |
Ball |
16 |
VFBGA |
Square |
Plastic/Epoxy |
11 V |
Yes |
200 kHz |
1 |
16 |
5 µs |
0.0015 % |
Serial |
Grid Array, Very Thin Profile, Fine Pitch |
5 µs |
0.02 in (0.5 mm) |
125 °C (257 °F) |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B16 |
1 |
0.025 in (0.625 mm) |
0.094 in (2.39 mm) |
e1 |
30 s |
260 °C (500 °F) |
0 V |
0.094 in (2.39 mm) |
Binary |
||||||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Industrial |
Ball |
170 |
LFBGA |
Rectangular |
Plastic/Epoxy |
1 V |
Yes |
1 |
CMOS |
16 |
0.0061 % |
Serial, Parallel, Word |
1.86 V |
Grid Array, Low Profile, Fine Pitch |
2.2 ns |
0.031 in (0.8 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
R-PBGA-B170 |
3 |
0.067 in (1.69 mm) |
0.354 in (9 mm) |
e1 |
-1 V |
0.591 in (15 mm) |
2's Complement Binary |
||||||||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Industrial |
Ball |
160 |
LFBGA |
Square |
Plastic/Epoxy |
1 V |
Yes |
1 |
CMOS |
14 |
183 mA |
Parallel, Word |
3.3 V |
1.8,3.3 V |
Grid Array, Low Profile, Fine Pitch |
BGA160,14X14,32 |
Other Converters |
13 ns |
0.031 in (0.8 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B160 |
3 |
0.055 in (1.4 mm) |
0.472 in (12 mm) |
No |
e1 |
30 s |
260 °C (500 °F) |
-1 V |
0.472 in (12 mm) |
Offset Binary, 2's Complement Binary |
||||||||||||||||
|
Teledyne E2v (Uk) |
Digital to Analog converter |
Industrial |
Ball |
196 |
BGA |
Square |
Plastic/Epoxy |
1.08 V |
Yes |
1 |
12 |
122 mA |
0.0732 % |
Parallel, Word |
3.3 V |
Grid Array |
BGA196,14X14,40 |
0.039 in (1 mm) |
110 °C (230 °F) |
-40 °C (-40 °F) |
Bottom |
S-PBGA-B196 |
0.069 in (1.75 mm) |
0.591 in (15 mm) |
-1.08 V |
0.591 in (15 mm) |
Binary |
|||||||||||||||||||||||||
|
Texas Instruments |
Digital to Analog converter |
Industrial |
Ball |
196 |
LFBGA |
Square |
Plastic/Epoxy |
.6 V |
Yes |
1250 MHz |
1 |
16 |
450 mA |
Serial |
3.3 V |
1.2,3.3 V |
Grid Array, Low Profile, Fine Pitch |
BGA196,14X14,32 |
Other Converters |
10 ns |
0.031 in (0.8 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B196 |
3 |
0.055 in (1.4 mm) |
0.472 in (12 mm) |
No |
e1 |
30 s |
260 °C (500 °F) |
-.5 V |
0.472 in (12 mm) |
Offset Binary, 2's Complement Binary |
||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Industrial |
Ball |
169 |
VFBGA |
Square |
Plastic/Epoxy |
Yes |
1 |
16 |
Serial |
1.2 V |
-1.2 V |
Grid Array, Very Thin Profile, Fine Pitch |
0.031 in (0.8 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B169 |
3 |
0.037 in (0.95 mm) |
0.433 in (11 mm) |
e1 |
0.433 in (11 mm) |
2's Complement |
||||||||||||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Other |
Ball |
124 |
LBGA |
Square |
Plastic/Epoxy |
224 V |
Yes |
1 |
CMOS |
14 |
20 mA |
Serial |
5 V |
Grid Array, Low Profile |
BGA124,14X14,40 |
60 µs |
0.039 in (1 mm) |
85 °C (185 °F) |
-10 °C (14 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B124 |
3 |
0.067 in (1.7 mm) |
0.591 in (15 mm) |
e1 |
30 s |
260 °C (500 °F) |
1 V |
0.591 in (15 mm) |
Binary |
|||||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Industrial |
Ball |
169 |
VFBGA |
Square |
Plastic/Epoxy |
Yes |
1 |
16 |
Serial, Parallel, Word |
1.2 V |
-1.2 V |
Grid Array, Very Thin Profile, Fine Pitch |
0.031 in (0.8 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B169 |
3 |
0.037 in (0.95 mm) |
0.433 in (11 mm) |
e1 |
0.433 in (11 mm) |
2's Complement |
||||||||||||||||||||||||||
|
Texas Instruments |
Digital to Analog converter |
Automotive |
Ball |
16 |
VFBGA |
Square |
Plastic/Epoxy |
11 V |
Yes |
1 MHz |
1 |
12 |
5 µs |
6 mA |
0.0244 % |
Serial |
Grid Array, Very Thin Profile, Fine Pitch |
5 µs |
0.02 in (0.5 mm) |
125 °C (257 °F) |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B16 |
1 |
0.025 in (0.625 mm) |
0.094 in (2.39 mm) |
e1 |
30 s |
260 °C (500 °F) |
0 V |
0.094 in (2.39 mm) |
Binary |
|||||||||||||||||||
Asahi Kasei Microdevices |
Digital to Analog converter |
Industrial |
Ball |
36 |
VFBGA |
Rectangular |
Plastic/Epoxy |
Yes |
1 |
32 |
30 mA |
Serial |
1.8 V |
Grid Array, Very Thin Profile, Fine Pitch |
BGA36,6X6,16 |
0.016 in (0.4 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Bottom |
R-PBGA-B36 |
0.022 in (0.565 mm) |
0.101 in (2.56 mm) |
0.108 in (2.74 mm) |
Binary |
|||||||||||||||||||||||||||||
|
Texas Instruments |
Digital to Analog converter |
Industrial |
Ball |
196 |
LFBGA |
Square |
Plastic/Epoxy |
.6 V |
Yes |
1250 MHz |
1 |
16 |
450 mA |
Serial |
3.3 V |
1.2,3.3 V |
Grid Array, Low Profile, Fine Pitch |
BGA196,14X14,32 |
Other Converters |
10 ns |
0.031 in (0.8 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B196 |
3 |
0.055 in (1.4 mm) |
0.472 in (12 mm) |
No |
e1 |
30 s |
260 °C (500 °F) |
-.5 V |
0.472 in (12 mm) |
Offset Binary, 2's Complement Binary |
||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Other |
Ball |
9 |
VFBGA |
Rectangular |
Plastic/Epoxy |
5.5 V |
Yes |
1 |
CMOS |
10 |
1 mA |
0.3906 % |
Serial |
3 V |
3/5 V |
Grid Array, Very Thin Profile, Fine Pitch |
BGA9,3X3,20 |
Other Converters |
250 µs |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-30 °C (-22 °F) |
Tin Silver Copper |
Bottom |
R-PBGA-B9 |
1 |
0.026 in (0.65 mm) |
0.06 in (1.515 mm) |
No |
e1 |
260 °C (500 °F) |
.48 V |
0.067 in (1.69 mm) |
Binary |
||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Industrial |
Ball |
144 |
HBGA |
Square |
Plastic/Epoxy |
Yes |
1 |
16 |
Parallel, Word |
1 V |
Grid Array, Heat Sink/Slug |
0.031 in (0.8 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B144 |
3 |
0.067 in (1.71 mm) |
0.394 in (10 mm) |
e1 |
30 s |
260 °C (500 °F) |
0.394 in (10 mm) |
2's Complement |
|||||||||||||||||||||||||
|
Texas Instruments |
Digital to Analog converter |
Industrial |
Ball |
196 |
LBGA |
Square |
Plastic/Epoxy |
10.5 V |
Yes |
15 kHz |
1 |
12 |
65 µs |
0.0244 % |
Serial |
12 V |
-12 V |
Grid Array, Low Profile |
65 µs |
0.039 in (1 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B196 |
3 |
0.058 in (1.48 mm) |
0.591 in (15 mm) |
e1 |
30 s |
260 °C (500 °F) |
-10.5 V |
0.591 in (15 mm) |
2's Complement Binary |
||||||||||||||||||
|
Texas Instruments |
Digital to Analog converter |
Automotive |
Ball |
16 |
VFBGA |
Square |
Plastic/Epoxy |
11 V |
Yes |
1 MHz |
1 |
14 |
5 µs |
6 mA |
0.0061 % |
Serial |
Grid Array, Very Thin Profile, Fine Pitch |
5 µs |
0.02 in (0.5 mm) |
125 °C (257 °F) |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B16 |
1 |
0.025 in (0.625 mm) |
0.094 in (2.39 mm) |
e1 |
30 s |
260 °C (500 °F) |
0 V |
0.094 in (2.39 mm) |
Binary |
|||||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Industrial |
Ball |
169 |
VFBGA |
Square |
Plastic/Epoxy |
Yes |
1 |
16 |
Serial |
1.2 V |
-1.2 V |
Grid Array, Very Thin Profile, Fine Pitch |
0.031 in (0.8 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B169 |
3 |
0.037 in (0.95 mm) |
0.433 in (11 mm) |
e1 |
260 °C (500 °F) |
0.433 in (11 mm) |
2's Complement |
|||||||||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Other |
Ball |
124 |
LBGA |
Square |
Plastic/Epoxy |
224 V |
Yes |
1 |
CMOS |
14 |
20 mA |
Serial |
5 V |
Grid Array, Low Profile |
BGA124,14X14,40 |
60 µs |
0.039 in (1 mm) |
85 °C (185 °F) |
-10 °C (14 °F) |
Bottom |
S-PBGA-B124 |
0.067 in (1.7 mm) |
0.591 in (15 mm) |
No |
1 V |
0.591 in (15 mm) |
Binary |
||||||||||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Industrial |
Ball |
49 |
VFBGA |
Square |
Plastic/Epoxy |
10 V |
Yes |
1 |
16 |
0.0244 % |
Serial |
Grid Array, Very Thin Profile, Fine Pitch |
16 µs |
0.02 in (0.5 mm) |
105 °C (221 °F) |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B49 |
1 |
0.026 in (0.65 mm) |
0.156 in (3.96 mm) |
e1 |
-10 V |
0.156 in (3.96 mm) |
Binary |
||||||||||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Industrial |
Ball |
164 |
LFBGA |
Square |
Plastic/Epoxy |
1 V |
Yes |
1 |
CMOS |
14 |
556 mA |
Parallel, Word |
3.3 V |
1.5,1.8,3.3 V |
Grid Array, Low Profile, Fine Pitch |
BGA164,14X14,32 |
Other Converters |
13 ns |
0.031 in (0.8 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B164 |
3 |
0.051 in (1.3 mm) |
0.472 in (12 mm) |
No |
e1 |
30 s |
260 °C (500 °F) |
-1 V |
0.472 in (12 mm) |
Binary, 2's Complement Binary |
||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Industrial |
Ball |
9 |
VFBGA |
Rectangular |
Plastic/Epoxy |
5.5 V |
Yes |
1 |
CMOS |
10 |
4 mA |
0.3906 % |
Serial |
3.6 V |
3/5 V |
Grid Array, Very Thin Profile, Fine Pitch |
BGA9,3X3,20 |
Other Converters |
250 µs |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
R-PBGA-B9 |
1 |
0.026 in (0.65 mm) |
0.06 in (1.515 mm) |
No |
e1 |
260 °C (500 °F) |
.6 V |
0.067 in (1.69 mm) |
Binary |
||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Industrial |
Ball |
9 |
VFBGA |
Rectangular |
5.5 V |
Yes |
1 |
CMOS |
10 |
4 mA |
0.3906 % |
Serial |
5 V |
3/5 V |
Grid Array, Very Thin Profile, Fine Pitch |
BGA9,3X3,20 |
Other Converters |
250 µs |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
R-XBGA-B9 |
1 |
0.026 in (0.65 mm) |
0.06 in (1.515 mm) |
No |
e1 |
260 °C (500 °F) |
.6 V |
0.067 in (1.69 mm) |
Binary |
|||||||||||||||||
Analog Devices |
Digital to Analog converter |
Industrial |
Ball |
164 |
LFBGA |
Square |
Plastic/Epoxy |
1 V |
Yes |
1 |
CMOS |
14 |
556 mA |
Parallel, Word |
3.3 V |
1.5,1.8,3.3 V |
Grid Array, Low Profile, Fine Pitch |
BGA164,14X14,32 |
Other Converters |
13 ns |
0.031 in (0.8 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Bottom |
S-PBGA-B164 |
1 |
0.051 in (1.3 mm) |
0.472 in (12 mm) |
No |
-1 V |
0.472 in (12 mm) |
Binary, 2's Complement Binary |
|||||||||||||||||||||
|
Texas Instruments |
Digital to Analog converter |
Automotive |
Ball |
16 |
VFBGA |
Square |
Plastic/Epoxy |
11 V |
Yes |
1 MHz |
1 |
12 |
5 µs |
0.0244 % |
Serial |
Grid Array, Very Thin Profile, Fine Pitch |
5 µs |
0.02 in (0.5 mm) |
125 °C (257 °F) |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B16 |
1 |
0.025 in (0.625 mm) |
0.094 in (2.39 mm) |
e1 |
30 s |
260 °C (500 °F) |
0 V |
0.094 in (2.39 mm) |
Binary |
||||||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Industrial |
Ball |
108 |
BGA |
Square |
Plastic/Epoxy |
5 V |
Yes |
1 |
Bipolar |
14 |
30 µs |
0.0183 % |
Serial, Parallel, Word |
5 V |
3/5,±12/±15 V |
Grid Array |
BGA108,12X12,40 |
Other Converters |
20 µs |
0.039 in (1 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B108 |
3 |
0.073 in (1.85 mm) |
0.512 in (13 mm) |
No |
e1 |
30 s |
260 °C (500 °F) |
-3.5 V |
0.512 in (13 mm) |
Binary |
|||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Other |
Ball |
9 |
VFBGA |
Rectangular |
Plastic/Epoxy |
5.5 V |
Yes |
1 |
CMOS |
10 |
1 mA |
0.3906 % |
Serial |
3 V |
3/5 V |
Grid Array, Very Thin Profile, Fine Pitch |
BGA9,3X3,20 |
Other Converters |
250 µs |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-30 °C (-22 °F) |
Matte Tin |
Bottom |
R-PBGA-B9 |
1 |
0.026 in (0.65 mm) |
0.06 in (1.515 mm) |
No |
e3 |
.48 V |
0.067 in (1.69 mm) |
Binary |
|||||||||||||||||
|
Texas Instruments |
Digital to Analog converter |
Industrial |
Ball |
144 |
HBGA |
Square |
Plastic/Epoxy |
.6 V |
Yes |
2500 MHz |
1 |
CMOS |
16 |
Parallel, Word |
.9 V |
Grid Array, Heat Sink/Slug |
10 ns |
0.031 in (0.8 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B144 |
3 |
0.076 in (1.94 mm) |
0.394 in (10 mm) |
e1 |
30 s |
260 °C (500 °F) |
-.5 V |
0.394 in (10 mm) |
Offset Binary, 2's Complement Binary |
||||||||||||||||||||
|
Texas Instruments |
Digital to Analog converter |
Industrial |
Ball |
144 |
HBGA |
Square |
Plastic/Epoxy |
.6 V |
Yes |
2500 MHz |
1 |
CMOS |
16 |
Parallel, Word |
.9 V |
Grid Array, Heat Sink/Slug |
10 ns |
0.031 in (0.8 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B144 |
3 |
0.076 in (1.94 mm) |
0.394 in (10 mm) |
e1 |
30 s |
260 °C (500 °F) |
-.5 V |
0.394 in (10 mm) |
Offset Binary, 2's Complement Binary |
||||||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Commercial |
Ball |
170 |
LFBGA |
Rectangular |
Plastic/Epoxy |
1 V |
Yes |
1 |
CMOS |
14 |
0.0122 % |
Serial, Parallel, Word |
1.86 V |
Grid Array, Low Profile, Fine Pitch |
2.2 ns |
0.031 in (0.8 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Tin Silver Copper |
Bottom |
R-PBGA-B170 |
3 |
0.067 in (1.69 mm) |
0.354 in (9 mm) |
e1 |
-1 V |
0.591 in (15 mm) |
2's Complement Binary |
||||||||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Industrial |
Ball |
170 |
LFBGA |
Rectangular |
Plastic/Epoxy |
1 V |
Yes |
1 |
CMOS |
14 |
0.0122 % |
Serial, Parallel, Word |
1.86 V |
Grid Array, Low Profile, Fine Pitch |
2.2 ns |
0.031 in (0.8 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
R-PBGA-B170 |
3 |
0.067 in (1.69 mm) |
0.354 in (9 mm) |
e1 |
-1 V |
0.591 in (15 mm) |
2's Complement Binary |
||||||||||||||||||||||
Texas Instruments |
Digital to Analog converter |
Industrial |
Ball |
144 |
HBGA |
Square |
Plastic/Epoxy |
.6 V |
Yes |
1 |
16 |
Serial |
3.3 V |
Grid Array, Heat Sink/Slug |
10 ns |
0.031 in (0.8 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Bottom |
S-PBGA-B144 |
0.076 in (1.94 mm) |
0.394 in (10 mm) |
-.5 V |
0.394 in (10 mm) |
Binary |
||||||||||||||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Industrial |
Ball |
49 |
VFBGA |
Square |
Plastic/Epoxy |
Yes |
1 |
12 |
0.0244 % |
Serial |
Grid Array, Very Thin Profile, Fine Pitch |
10 µs |
0.02 in (0.5 mm) |
105 °C (221 °F) |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B49 |
1 |
0.026 in (0.65 mm) |
0.156 in (3.96 mm) |
e1 |
0.156 in (3.96 mm) |
Binary |
||||||||||||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Industrial |
Ball |
9 |
VFBGA |
Rectangular |
Plastic/Epoxy |
5.5 V |
Yes |
1 |
CMOS |
10 |
4 mA |
0.3906 % |
Serial |
3.6 V |
3/5 V |
Grid Array, Very Thin Profile, Fine Pitch |
BGA9,3X3,20 |
Other Converters |
250 µs |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
R-PBGA-B9 |
1 |
0.026 in (0.65 mm) |
0.06 in (1.515 mm) |
No |
e1 |
260 °C (500 °F) |
.6 V |
0.067 in (1.69 mm) |
Binary |
||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Industrial |
Ball |
160 |
LFBGA |
Square |
Plastic/Epoxy |
1 V |
Yes |
1 |
CMOS |
14 |
183 mA |
Parallel, Word |
3.3 V |
1.8,3.3 V |
Grid Array, Low Profile, Fine Pitch |
BGA160,14X14,32 |
Other Converters |
13 ns |
0.031 in (0.8 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B160 |
3 |
0.055 in (1.4 mm) |
0.472 in (12 mm) |
No |
e1 |
30 s |
260 °C (500 °F) |
-1 V |
0.472 in (12 mm) |
Offset Binary, 2's Complement Binary |
||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Industrial |
Ball |
100 |
LFBGA |
Square |
Plastic/Epoxy |
15.1 V |
Yes |
1 |
CMOS |
14 |
30 µs |
0.0061 % |
Serial |
15 V |
3/5,±12/±16.5 V |
-15 V |
Grid Array, Low Profile, Fine Pitch |
BGA100,12X12,32 |
Other Converters |
20 µs |
0.031 in (0.8 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B100 |
3 |
0.055 in (1.4 mm) |
0.394 in (10 mm) |
No |
e1 |
30 s |
260 °C (500 °F) |
-15.1 V |
0.394 in (10 mm) |
Binary |
||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Industrial |
Ball |
196 |
LFBGA |
Square |
Plastic/Epoxy |
1 V |
Yes |
1 |
CMOS |
16 |
Serial |
3.3 V |
1.8,3.3 V |
Grid Array |
BGA196,14X14,32 |
Other Converters |
20 ns |
0.031 in (0.8 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Bottom |
S-PBGA-B196 |
3 |
0.059 in (1.5 mm) |
0.472 in (12 mm) |
No |
30 s |
260 °C (500 °F) |
-1 V |
0.472 in (12 mm) |
Binary, 2's Complement Binary |
|||||||||||||||||||
|
Analog Devices |
Digital to Analog Converter 16 bit |
Ball |
144 |
HBGA |
Square |
Plastic/Epoxy |
Yes |
1 |
16 |
0.01068 % |
Serial |
1 V |
Grid Array, Heat Sink/Slug |
bga144,12X12,32 |
0.031 in (0.8 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Bottom |
S-PBGA-B144 |
0.067 in (1.71 mm) |
0.394 in (10 mm) |
0.394 in (10 mm) |
2's Complement |
|||||||||||||||||||||||||||||
|
Texas Instruments |
Digital to Analog converter |
Automotive |
Ball |
16 |
VFBGA |
Square |
Plastic/Epoxy |
11 V |
Yes |
1 MHz |
1 |
12 |
5 µs |
0.0244 % |
Serial |
Grid Array, Very Thin Profile, Fine Pitch |
5 µs |
0.02 in (0.5 mm) |
125 °C (257 °F) |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B16 |
1 |
0.025 in (0.625 mm) |
0.094 in (2.39 mm) |
e1 |
30 s |
260 °C (500 °F) |
0 V |
0.094 in (2.39 mm) |
Binary |
||||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Industrial |
Ball |
160 |
LFBGA |
Square |
Plastic/Epoxy |
2.5 V |
Yes |
1 |
CMOS |
14 |
327 mA |
Parallel, Word |
1.8 V |
1.8 V |
-1.5 V |
Grid Array, Low Profile, Fine Pitch |
BGA160,14X14,32 |
Other Converters |
13 ns |
0.031 in (0.8 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin Lead Silver |
Bottom |
S-PBGA-B160 |
3 |
0.055 in (1.4 mm) |
0.472 in (12 mm) |
No |
e0 |
20 s |
240 °C (464 °F) |
1.5 V |
0.472 in (12 mm) |
Binary |
||||||||||||||||
Analog Devices |
Digital to Analog converter |
Industrial |
Ball |
160 |
LFBGA |
Square |
Plastic/Epoxy |
2.5 V |
Yes |
1 |
CMOS |
14 |
327 mA |
Parallel, Word |
1.8 V |
1.8 V |
-1.5 V |
Grid Array, Low Profile, Fine Pitch |
BGA160,14X14,32 |
Other Converters |
13 ns |
0.031 in (0.8 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin Lead Silver |
Bottom |
S-PBGA-B160 |
3 |
0.055 in (1.4 mm) |
0.472 in (12 mm) |
No |
e0 |
20 s |
240 °C (464 °F) |
1.5 V |
0.472 in (12 mm) |
Binary |
Digital-to-analog converters (DACs) are electronic devices that convert digital signals into analog signals with a specific voltage or current output. They play a critical role in many electronic systems, converting digital data into analog signals that can be used to control actuators, motors, and other devices.
DACs work by sampling the digital signal at regular intervals and converting each sample into an analog signal with a specific voltage or current output. The accuracy and resolution of the DAC determine the quality of the analog signal, with higher resolution and accuracy leading to a more precise output signal.
DACs can be classified based on their architecture and their application. The most common types of DACs are binary-weighted DACs, R-2R ladder DACs, and sigma-delta DACs. Each type has its advantages and limitations, depending on the application and the required performance.
DACs are used in a wide range of applications, from audio equipment and video systems, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of digital data into analog signals, allowing the control and manipulation of physical systems based on digital signals.