Ball Digital-to-Analog Converters 270

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Part RoHS Manufacturer Converter Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Maximum Analog Output Voltage No. of Analog In Channels Surface Mount Maximum Supply Voltage Maximum Analog Input Voltage Sample Rate No. of Functions Technology Screening Level No. of Bits Maximum Settling Time Maximum Supply Current Maximum Linearity Error (EL) Input Format Nominal Supply Voltage Output Bit Code Power Supplies (V) Nominal Negative Supply Voltage Package Style (Meter) Package Equivalence Code Sub-Category Nominal Settling Time (tstl) Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Minimum Analog Input Voltage Output Format Minimum Operating Temperature Terminal Finish Sample and Hold/Track and Hold Terminal Position JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Minimum Analog Output Voltage Length Input Bit Code

LTC2000CY-16#PBF

Analog Devices

Digital to Analog converter

Commercial

Ball

170

LFBGA

Rectangular

Plastic/Epoxy

1 V

Yes

1

CMOS

16

790 mA

0.0061 %

Serial, Parallel, Word

1.8 V

Grid Array, Low Profile, Fine Pitch

BGA170,11X17,32

2.2 ns

0.031 in (0.8 mm)

70 °C (158 °F)

0 °C (32 °F)

Bottom

R-PBGA-B170

3

0.067 in (1.69 mm)

0.354 in (9 mm)

30 s

260 °C (500 °F)

-1 V

0.591 in (15 mm)

2's Complement Binary

AD9129BBCZ

Analog Devices

Digital to Analog converter

Industrial

Ball

160

LFBGA

Square

Plastic/Epoxy

2.5 V

Yes

1

CMOS

14

327 mA

Parallel, Word

1.8 V

1.8 V

-1.5 V

Grid Array, Low Profile, Fine Pitch

BGA160,14X14,32

Other Converters

13 ns

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B160

3

0.055 in (1.4 mm)

0.472 in (12 mm)

No

e1

1.5 V

0.472 in (12 mm)

Binary

AD9171BBPZ

Analog Devices

Digital to Analog converter

Industrial

Ball

144

FBGA

Square

Plastic/Epoxy

Yes

1

16

1.07 A

Parallel

1 V

Grid Array, Fine Pitch

BGA144,12X12,32

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B144

0.067 in (1.71 mm)

0.394 in (10 mm)

0.394 in (10 mm)

2's Complement

DAC80508ZCYZFT

Texas Instruments

Digital to Analog converter

Automotive

Ball

16

VFBGA

Square

Plastic/Epoxy

11 V

Yes

200 kHz

1

16

5 µs

0.0015 %

Serial

Grid Array, Very Thin Profile, Fine Pitch

5 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B16

1

0.025 in (0.625 mm)

0.094 in (2.39 mm)

e1

30 s

260 °C (500 °F)

0 V

0.094 in (2.39 mm)

Binary

AD9171BBPZRL

Analog Devices

Digital to Analog converter

Industrial

Ball

144

FBGA

Square

Plastic/Epoxy

Yes

1

16

1.07 A

Parallel

1 V

Grid Array, Fine Pitch

BGA144,12X12,32

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B144

0.067 in (1.71 mm)

0.394 in (10 mm)

0.394 in (10 mm)

2's Complement

DAC80508ZYZFT

Texas Instruments

Digital to Analog converter

Automotive

Ball

16

VFBGA

Square

Plastic/Epoxy

11 V

Yes

200 kHz

1

16

5 µs

0.0015 %

Serial

Grid Array, Very Thin Profile, Fine Pitch

5 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B16

1

0.025 in (0.625 mm)

0.094 in (2.39 mm)

e1

30 s

260 °C (500 °F)

0 V

0.094 in (2.39 mm)

Binary

AD9162BBCAZ

Analog Devices

Digital to Analog converter

Industrial

Ball

169

VFBGA

Square

Plastic/Epoxy

Yes

1

16

Serial, Parallel, Word

1.2 V

-1.2 V

Grid Array, Very Thin Profile, Fine Pitch

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B169

3

0.037 in (0.95 mm)

0.433 in (11 mm)

e1

0.433 in (11 mm)

2's Complement

AD9129BBCZRL

Analog Devices

Digital to Analog converter

Industrial

Ball

160

LFBGA

Square

Plastic/Epoxy

2.5 V

Yes

1

CMOS

14

327 mA

Parallel, Word

1.8 V

1.8 V

-1.5 V

Grid Array, Low Profile, Fine Pitch

BGA160,14X14,32

Other Converters

13 ns

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B160

3

0.055 in (1.4 mm)

0.472 in (12 mm)

No

e1

1.5 V

0.472 in (12 mm)

Binary

LTC2000ACY-16#PBF

Analog Devices

Digital to Analog converter

Commercial

Ball

170

LFBGA

Rectangular

Plastic/Epoxy

1 V

Yes

1

CMOS

16

0.0061 %

Serial, Parallel, Word

1.86 V

Grid Array, Low Profile, Fine Pitch

2.2 ns

0.031 in (0.8 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Silver Copper

Bottom

R-PBGA-B170

3

0.067 in (1.69 mm)

0.354 in (9 mm)

e1

-1 V

0.591 in (15 mm)

2's Complement Binary

DAC80508MYZFT

Texas Instruments

Digital to Analog converter

Automotive

Ball

16

VFBGA

Square

Plastic/Epoxy

11 V

Yes

200 kHz

1

16

5 µs

0.0015 %

Serial

Grid Array, Very Thin Profile, Fine Pitch

5 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B16

1

0.025 in (0.625 mm)

0.094 in (2.39 mm)

e1

30 s

260 °C (500 °F)

0 V

0.094 in (2.39 mm)

Binary

LTC2000AIY-16#PBF

Analog Devices

Digital to Analog converter

Industrial

Ball

170

LFBGA

Rectangular

Plastic/Epoxy

1 V

Yes

1

CMOS

16

0.0061 %

Serial, Parallel, Word

1.86 V

Grid Array, Low Profile, Fine Pitch

2.2 ns

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

R-PBGA-B170

3

0.067 in (1.69 mm)

0.354 in (9 mm)

e1

-1 V

0.591 in (15 mm)

2's Complement Binary

AD9739ABBCZ

Analog Devices

Digital to Analog converter

Industrial

Ball

160

LFBGA

Square

Plastic/Epoxy

1 V

Yes

1

CMOS

14

183 mA

Parallel, Word

3.3 V

1.8,3.3 V

Grid Array, Low Profile, Fine Pitch

BGA160,14X14,32

Other Converters

13 ns

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B160

3

0.055 in (1.4 mm)

0.472 in (12 mm)

No

e1

30 s

260 °C (500 °F)

-1 V

0.472 in (12 mm)

Offset Binary, 2's Complement Binary

EV12DS130AVZPY

Teledyne E2v (Uk)

Digital to Analog converter

Industrial

Ball

196

BGA

Square

Plastic/Epoxy

1.08 V

Yes

1

12

122 mA

0.0732 %

Parallel, Word

3.3 V

Grid Array

BGA196,14X14,40

0.039 in (1 mm)

110 °C (230 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B196

0.069 in (1.75 mm)

0.591 in (15 mm)

-1.08 V

0.591 in (15 mm)

Binary

DAC3482IZAYR

Texas Instruments

Digital to Analog converter

Industrial

Ball

196

LFBGA

Square

Plastic/Epoxy

.6 V

Yes

1250 MHz

1

16

450 mA

Serial

3.3 V

1.2,3.3 V

Grid Array, Low Profile, Fine Pitch

BGA196,14X14,32

Other Converters

10 ns

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B196

3

0.055 in (1.4 mm)

0.472 in (12 mm)

No

e1

30 s

260 °C (500 °F)

-.5 V

0.472 in (12 mm)

Offset Binary, 2's Complement Binary

AD9164BBCAZ

Analog Devices

Digital to Analog converter

Industrial

Ball

169

VFBGA

Square

Plastic/Epoxy

Yes

1

16

Serial

1.2 V

-1.2 V

Grid Array, Very Thin Profile, Fine Pitch

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B169

3

0.037 in (0.95 mm)

0.433 in (11 mm)

e1

0.433 in (11 mm)

2's Complement

AD5535BKBCZ

Analog Devices

Digital to Analog converter

Other

Ball

124

LBGA

Square

Plastic/Epoxy

224 V

Yes

1

CMOS

14

20 mA

Serial

5 V

Grid Array, Low Profile

BGA124,14X14,40

60 µs

0.039 in (1 mm)

85 °C (185 °F)

-10 °C (14 °F)

Tin Silver Copper

Bottom

S-PBGA-B124

3

0.067 in (1.7 mm)

0.591 in (15 mm)

e1

30 s

260 °C (500 °F)

1 V

0.591 in (15 mm)

Binary

AD9162BBCAZRL

Analog Devices

Digital to Analog converter

Industrial

Ball

169

VFBGA

Square

Plastic/Epoxy

Yes

1

16

Serial, Parallel, Word

1.2 V

-1.2 V

Grid Array, Very Thin Profile, Fine Pitch

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B169

3

0.037 in (0.95 mm)

0.433 in (11 mm)

e1

0.433 in (11 mm)

2's Complement

DAC60508ZYZFT

Texas Instruments

Digital to Analog converter

Automotive

Ball

16

VFBGA

Square

Plastic/Epoxy

11 V

Yes

1 MHz

1

12

5 µs

6 mA

0.0244 %

Serial

Grid Array, Very Thin Profile, Fine Pitch

5 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B16

1

0.025 in (0.625 mm)

0.094 in (2.39 mm)

e1

30 s

260 °C (500 °F)

0 V

0.094 in (2.39 mm)

Binary

AK4377AECB

Asahi Kasei Microdevices

Digital to Analog converter

Industrial

Ball

36

VFBGA

Rectangular

Plastic/Epoxy

Yes

1

32

30 mA

Serial

1.8 V

Grid Array, Very Thin Profile, Fine Pitch

BGA36,6X6,16

0.016 in (0.4 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Bottom

R-PBGA-B36

0.022 in (0.565 mm)

0.101 in (2.56 mm)

0.108 in (2.74 mm)

Binary

DAC3482IZAY

Texas Instruments

Digital to Analog converter

Industrial

Ball

196

LFBGA

Square

Plastic/Epoxy

.6 V

Yes

1250 MHz

1

16

450 mA

Serial

3.3 V

1.2,3.3 V

Grid Array, Low Profile, Fine Pitch

BGA196,14X14,32

Other Converters

10 ns

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B196

3

0.055 in (1.4 mm)

0.472 in (12 mm)

No

e1

30 s

260 °C (500 °F)

-.5 V

0.472 in (12 mm)

Offset Binary, 2's Complement Binary

AD5398ABCBZ-REEL7

Analog Devices

Digital to Analog converter

Other

Ball

9

VFBGA

Rectangular

Plastic/Epoxy

5.5 V

Yes

1

CMOS

10

1 mA

0.3906 %

Serial

3 V

3/5 V

Grid Array, Very Thin Profile, Fine Pitch

BGA9,3X3,20

Other Converters

250 µs

0.02 in (0.5 mm)

85 °C (185 °F)

-30 °C (-22 °F)

Tin Silver Copper

Bottom

R-PBGA-B9

1

0.026 in (0.65 mm)

0.06 in (1.515 mm)

No

e1

260 °C (500 °F)

.48 V

0.067 in (1.69 mm)

Binary

AD9176BBPZ

Analog Devices

Digital to Analog converter

Industrial

Ball

144

HBGA

Square

Plastic/Epoxy

Yes

1

16

Parallel, Word

1 V

Grid Array, Heat Sink/Slug

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B144

3

0.067 in (1.71 mm)

0.394 in (10 mm)

e1

30 s

260 °C (500 °F)

0.394 in (10 mm)

2's Complement

DAC60096IZEB

Texas Instruments

Digital to Analog converter

Industrial

Ball

196

LBGA

Square

Plastic/Epoxy

10.5 V

Yes

15 kHz

1

12

65 µs

0.0244 %

Serial

12 V

-12 V

Grid Array, Low Profile

65 µs

0.039 in (1 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B196

3

0.058 in (1.48 mm)

0.591 in (15 mm)

e1

30 s

260 °C (500 °F)

-10.5 V

0.591 in (15 mm)

2's Complement Binary

DAC70508ZYZFR

Texas Instruments

Digital to Analog converter

Automotive

Ball

16

VFBGA

Square

Plastic/Epoxy

11 V

Yes

1 MHz

1

14

5 µs

6 mA

0.0061 %

Serial

Grid Array, Very Thin Profile, Fine Pitch

5 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B16

1

0.025 in (0.625 mm)

0.094 in (2.39 mm)

e1

30 s

260 °C (500 °F)

0 V

0.094 in (2.39 mm)

Binary

AD9164BBCAZRL

Analog Devices

Digital to Analog converter

Industrial

Ball

169

VFBGA

Square

Plastic/Epoxy

Yes

1

16

Serial

1.2 V

-1.2 V

Grid Array, Very Thin Profile, Fine Pitch

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B169

3

0.037 in (0.95 mm)

0.433 in (11 mm)

e1

260 °C (500 °F)

0.433 in (11 mm)

2's Complement

AD5535BKBC

Analog Devices

Digital to Analog converter

Other

Ball

124

LBGA

Square

Plastic/Epoxy

224 V

Yes

1

CMOS

14

20 mA

Serial

5 V

Grid Array, Low Profile

BGA124,14X14,40

60 µs

0.039 in (1 mm)

85 °C (185 °F)

-10 °C (14 °F)

Bottom

S-PBGA-B124

0.067 in (1.7 mm)

0.591 in (15 mm)

No

1 V

0.591 in (15 mm)

Binary

AD5766BCBZ-RL7

Analog Devices

Digital to Analog converter

Industrial

Ball

49

VFBGA

Square

Plastic/Epoxy

10 V

Yes

1

16

0.0244 %

Serial

Grid Array, Very Thin Profile, Fine Pitch

16 µs

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B49

1

0.026 in (0.65 mm)

0.156 in (3.96 mm)

e1

-10 V

0.156 in (3.96 mm)

Binary

AD9789BBCZ

Analog Devices

Digital to Analog converter

Industrial

Ball

164

LFBGA

Square

Plastic/Epoxy

1 V

Yes

1

CMOS

14

556 mA

Parallel, Word

3.3 V

1.5,1.8,3.3 V

Grid Array, Low Profile, Fine Pitch

BGA164,14X14,32

Other Converters

13 ns

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B164

3

0.051 in (1.3 mm)

0.472 in (12 mm)

No

e1

30 s

260 °C (500 °F)

-1 V

0.472 in (12 mm)

Binary, 2's Complement Binary

AD5821BCBZ-REEL7

Analog Devices

Digital to Analog converter

Industrial

Ball

9

VFBGA

Rectangular

Plastic/Epoxy

5.5 V

Yes

1

CMOS

10

4 mA

0.3906 %

Serial

3.6 V

3/5 V

Grid Array, Very Thin Profile, Fine Pitch

BGA9,3X3,20

Other Converters

250 µs

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

R-PBGA-B9

1

0.026 in (0.65 mm)

0.06 in (1.515 mm)

No

e1

260 °C (500 °F)

.6 V

0.067 in (1.69 mm)

Binary

AD5398BCBZ-REEL7

Analog Devices

Digital to Analog converter

Industrial

Ball

9

VFBGA

Rectangular

5.5 V

Yes

1

CMOS

10

4 mA

0.3906 %

Serial

5 V

3/5 V

Grid Array, Very Thin Profile, Fine Pitch

BGA9,3X3,20

Other Converters

250 µs

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

R-XBGA-B9

1

0.026 in (0.65 mm)

0.06 in (1.515 mm)

No

e1

260 °C (500 °F)

.6 V

0.067 in (1.69 mm)

Binary

AD9789BBCRL

Analog Devices

Digital to Analog converter

Industrial

Ball

164

LFBGA

Square

Plastic/Epoxy

1 V

Yes

1

CMOS

14

556 mA

Parallel, Word

3.3 V

1.5,1.8,3.3 V

Grid Array, Low Profile, Fine Pitch

BGA164,14X14,32

Other Converters

13 ns

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B164

1

0.051 in (1.3 mm)

0.472 in (12 mm)

No

-1 V

0.472 in (12 mm)

Binary, 2's Complement Binary

DAC60508ZCYZFR

Texas Instruments

Digital to Analog converter

Automotive

Ball

16

VFBGA

Square

Plastic/Epoxy

11 V

Yes

1 MHz

1

12

5 µs

0.0244 %

Serial

Grid Array, Very Thin Profile, Fine Pitch

5 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B16

1

0.025 in (0.625 mm)

0.094 in (2.39 mm)

e1

30 s

260 °C (500 °F)

0 V

0.094 in (2.39 mm)

Binary

AD5378ABCZ

Analog Devices

Digital to Analog converter

Industrial

Ball

108

BGA

Square

Plastic/Epoxy

5 V

Yes

1

Bipolar

14

30 µs

0.0183 %

Serial, Parallel, Word

5 V

3/5,±12/±15 V

Grid Array

BGA108,12X12,40

Other Converters

20 µs

0.039 in (1 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B108

3

0.073 in (1.85 mm)

0.512 in (13 mm)

No

e1

30 s

260 °C (500 °F)

-3.5 V

0.512 in (13 mm)

Binary

AD5821ABCBZ-REEL7

Analog Devices

Digital to Analog converter

Other

Ball

9

VFBGA

Rectangular

Plastic/Epoxy

5.5 V

Yes

1

CMOS

10

1 mA

0.3906 %

Serial

3 V

3/5 V

Grid Array, Very Thin Profile, Fine Pitch

BGA9,3X3,20

Other Converters

250 µs

0.02 in (0.5 mm)

85 °C (185 °F)

-30 °C (-22 °F)

Matte Tin

Bottom

R-PBGA-B9

1

0.026 in (0.65 mm)

0.06 in (1.515 mm)

No

e3

.48 V

0.067 in (1.69 mm)

Binary

DAC38J84IAAV

Texas Instruments

Digital to Analog converter

Industrial

Ball

144

HBGA

Square

Plastic/Epoxy

.6 V

Yes

2500 MHz

1

CMOS

16

Parallel, Word

.9 V

Grid Array, Heat Sink/Slug

10 ns

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B144

3

0.076 in (1.94 mm)

0.394 in (10 mm)

e1

30 s

260 °C (500 °F)

-.5 V

0.394 in (10 mm)

Offset Binary, 2's Complement Binary

DAC38J84IAAVR

Texas Instruments

Digital to Analog converter

Industrial

Ball

144

HBGA

Square

Plastic/Epoxy

.6 V

Yes

2500 MHz

1

CMOS

16

Parallel, Word

.9 V

Grid Array, Heat Sink/Slug

10 ns

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B144

3

0.076 in (1.94 mm)

0.394 in (10 mm)

e1

30 s

260 °C (500 °F)

-.5 V

0.394 in (10 mm)

Offset Binary, 2's Complement Binary

LTC2000ACY-14#PBF

Analog Devices

Digital to Analog converter

Commercial

Ball

170

LFBGA

Rectangular

Plastic/Epoxy

1 V

Yes

1

CMOS

14

0.0122 %

Serial, Parallel, Word

1.86 V

Grid Array, Low Profile, Fine Pitch

2.2 ns

0.031 in (0.8 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Silver Copper

Bottom

R-PBGA-B170

3

0.067 in (1.69 mm)

0.354 in (9 mm)

e1

-1 V

0.591 in (15 mm)

2's Complement Binary

LTC2000AIY-14#PBF

Analog Devices

Digital to Analog converter

Industrial

Ball

170

LFBGA

Rectangular

Plastic/Epoxy

1 V

Yes

1

CMOS

14

0.0122 %

Serial, Parallel, Word

1.86 V

Grid Array, Low Profile, Fine Pitch

2.2 ns

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

R-PBGA-B170

3

0.067 in (1.69 mm)

0.354 in (9 mm)

e1

-1 V

0.591 in (15 mm)

2's Complement Binary

PDAC38J84IAAV

Texas Instruments

Digital to Analog converter

Industrial

Ball

144

HBGA

Square

Plastic/Epoxy

.6 V

Yes

1

16

Serial

3.3 V

Grid Array, Heat Sink/Slug

10 ns

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B144

0.076 in (1.94 mm)

0.394 in (10 mm)

-.5 V

0.394 in (10 mm)

Binary

AD5767BCBZ-RL7

Analog Devices

Digital to Analog converter

Industrial

Ball

49

VFBGA

Square

Plastic/Epoxy

Yes

1

12

0.0244 %

Serial

Grid Array, Very Thin Profile, Fine Pitch

10 µs

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B49

1

0.026 in (0.65 mm)

0.156 in (3.96 mm)

e1

0.156 in (3.96 mm)

Binary

AD5821BCBZ-REEL

Analog Devices

Digital to Analog converter

Industrial

Ball

9

VFBGA

Rectangular

Plastic/Epoxy

5.5 V

Yes

1

CMOS

10

4 mA

0.3906 %

Serial

3.6 V

3/5 V

Grid Array, Very Thin Profile, Fine Pitch

BGA9,3X3,20

Other Converters

250 µs

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

R-PBGA-B9

1

0.026 in (0.65 mm)

0.06 in (1.515 mm)

No

e1

260 °C (500 °F)

.6 V

0.067 in (1.69 mm)

Binary

AD9739ABBCZRL

Analog Devices

Digital to Analog converter

Industrial

Ball

160

LFBGA

Square

Plastic/Epoxy

1 V

Yes

1

CMOS

14

183 mA

Parallel, Word

3.3 V

1.8,3.3 V

Grid Array, Low Profile, Fine Pitch

BGA160,14X14,32

Other Converters

13 ns

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B160

3

0.055 in (1.4 mm)

0.472 in (12 mm)

No

e1

30 s

260 °C (500 °F)

-1 V

0.472 in (12 mm)

Offset Binary, 2's Complement Binary

AD5371BBCZ

Analog Devices

Digital to Analog converter

Industrial

Ball

100

LFBGA

Square

Plastic/Epoxy

15.1 V

Yes

1

CMOS

14

30 µs

0.0061 %

Serial

15 V

3/5,±12/±16.5 V

-15 V

Grid Array, Low Profile, Fine Pitch

BGA100,12X12,32

Other Converters

20 µs

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B100

3

0.055 in (1.4 mm)

0.394 in (10 mm)

No

e1

30 s

260 °C (500 °F)

-15.1 V

0.394 in (10 mm)

Binary

AD9148BBPZ

Analog Devices

Digital to Analog converter

Industrial

Ball

196

LFBGA

Square

Plastic/Epoxy

1 V

Yes

1

CMOS

16

Serial

3.3 V

1.8,3.3 V

Grid Array

BGA196,14X14,32

Other Converters

20 ns

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B196

3

0.059 in (1.5 mm)

0.472 in (12 mm)

No

30 s

260 °C (500 °F)

-1 V

0.472 in (12 mm)

Binary, 2's Complement Binary

AD9173BBPZ

Analog Devices

Digital to Analog Converter 16 bit

Ball

144

HBGA

Square

Plastic/Epoxy

Yes

1

16

0.01068 %

Serial

1 V

Grid Array, Heat Sink/Slug

bga144,12X12,32

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B144

0.067 in (1.71 mm)

0.394 in (10 mm)

0.394 in (10 mm)

2's Complement

DAC60508ZCYZFT

Texas Instruments

Digital to Analog converter

Automotive

Ball

16

VFBGA

Square

Plastic/Epoxy

11 V

Yes

1 MHz

1

12

5 µs

0.0244 %

Serial

Grid Array, Very Thin Profile, Fine Pitch

5 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B16

1

0.025 in (0.625 mm)

0.094 in (2.39 mm)

e1

30 s

260 °C (500 °F)

0 V

0.094 in (2.39 mm)

Binary

AD9129BBC

Analog Devices

Digital to Analog converter

Industrial

Ball

160

LFBGA

Square

Plastic/Epoxy

2.5 V

Yes

1

CMOS

14

327 mA

Parallel, Word

1.8 V

1.8 V

-1.5 V

Grid Array, Low Profile, Fine Pitch

BGA160,14X14,32

Other Converters

13 ns

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead Silver

Bottom

S-PBGA-B160

3

0.055 in (1.4 mm)

0.472 in (12 mm)

No

e0

20 s

240 °C (464 °F)

1.5 V

0.472 in (12 mm)

Binary

AD9129BBCRL

Analog Devices

Digital to Analog converter

Industrial

Ball

160

LFBGA

Square

Plastic/Epoxy

2.5 V

Yes

1

CMOS

14

327 mA

Parallel, Word

1.8 V

1.8 V

-1.5 V

Grid Array, Low Profile, Fine Pitch

BGA160,14X14,32

Other Converters

13 ns

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead Silver

Bottom

S-PBGA-B160

3

0.055 in (1.4 mm)

0.472 in (12 mm)

No

e0

20 s

240 °C (464 °F)

1.5 V

0.472 in (12 mm)

Binary

Digital-to-Analog Converters

Digital-to-analog converters (DACs) are electronic devices that convert digital signals into analog signals with a specific voltage or current output. They play a critical role in many electronic systems, converting digital data into analog signals that can be used to control actuators, motors, and other devices.

DACs work by sampling the digital signal at regular intervals and converting each sample into an analog signal with a specific voltage or current output. The accuracy and resolution of the DAC determine the quality of the analog signal, with higher resolution and accuracy leading to a more precise output signal.

DACs can be classified based on their architecture and their application. The most common types of DACs are binary-weighted DACs, R-2R ladder DACs, and sigma-delta DACs. Each type has its advantages and limitations, depending on the application and the required performance.

DACs are used in a wide range of applications, from audio equipment and video systems, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of digital data into analog signals, allowing the control and manipulation of physical systems based on digital signals.