Ball Digital-to-Analog Converters 270

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Part RoHS Manufacturer Converter Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Maximum Analog Output Voltage No. of Analog In Channels Surface Mount Maximum Supply Voltage Maximum Analog Input Voltage Sample Rate No. of Functions Technology Screening Level No. of Bits Maximum Settling Time Maximum Supply Current Maximum Linearity Error (EL) Input Format Nominal Supply Voltage Output Bit Code Power Supplies (V) Nominal Negative Supply Voltage Package Style (Meter) Package Equivalence Code Sub-Category Nominal Settling Time (tstl) Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Minimum Analog Input Voltage Output Format Minimum Operating Temperature Terminal Finish Sample and Hold/Track and Hold Terminal Position JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Minimum Analog Output Voltage Length Input Bit Code

MAX5112GWX+T

Analog Devices

Digital to Analog converter

Automotive

Ball

36

VFBGA

Square

Plastic/Epoxy

2.3 V

Yes

1

14

600 μA

0.0488 %

Serial

3 V

Grid Array, Very Thin Profile, Fine Pitch

BGA36,6X6,20

15 µs

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B36

1

0.027 in (0.69 mm)

0.121 in (3.065 mm)

e1

30 s

260 °C (500 °F)

0 V

0.121 in (3.065 mm)

Binary

MAX5715AWC+T

Analog Devices

Digital to Analog converter

Automotive

Ball

12

FBGA

Rectangular

Plastic/Epoxy

Yes

4

BICMOS

12

1.5 mA

0.024 %

3/5 V

Grid Array, Fine Pitch

BGA12,3X4,20

Other Converters

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Tin Silver Copper Nickel

Bottom

R-PBGA-B12

1

No

e2

30 s

260 °C (500 °F)

Offset Binary

MAX5855EXE+T

Analog Devices

Digital to Analog converter

Industrial

Ball

144

LFBGA

Square

Plastic/Epoxy

2.2 V

Yes

1

16

270 mA

Serial

1 V

Grid Array, Low Profile, Fine Pitch

bga144,12X12,32

20 ns

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B144

0.05 in (1.265 mm)

0.394 in (10 mm)

1.4 V

0.394 in (10 mm)

Offset Binary

MAX5113GWX+T

Analog Devices

Digital to Analog converter

Industrial

Ball

36

VFBGA

Square

Plastic/Epoxy

2.3 V

Yes

1

14

600 μA

0.0061 %

Serial

3 V

-5.2 V

Grid Array, Very Thin Profile, Fine Pitch

BGA36,6X6,20

15 µs

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B36

1

0.027 in (0.69 mm)

0.121 in (3.065 mm)

e1

30 s

260 °C (500 °F)

0 V

0.121 in (3.065 mm)

Binary

MAX5879EXF+

Analog Devices

Digital to Analog converter

Industrial

Ball

256

LBGA

Square

Plastic/Epoxy

Yes

1

14

Parallel, Word

3.3 V

Grid Array, Low Profile

26 ns

0.039 in (1 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B256

0.067 in (1.7 mm)

0.669 in (17 mm)

0.669 in (17 mm)

Offset Binary

MAX5832GWX+T

Analog Devices

Digital to Analog converter

Ball

36

VFBGA

Square

Plastic/Epoxy

3.3 V

Yes

1

BICMOS

14

600 μA

0.06103 %

Serial

3 V

-5.25 V

Grid Array, Very Thin Profile, Fine Pitch

BGA36,6X6,20

15 µs

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B36

0.027 in (0.69 mm)

0.121 in (3.065 mm)

-3.75 V

0.121 in (3.065 mm)

Binary

MAX5725AWP+T

Analog Devices

Digital to Analog converter

Automotive

Ball

20

FBGA

Rectangular

Plastic/Epoxy

Yes

8

BICMOS

12

2.5 mA

0.024 %

3/5 V

Grid Array, Fine Pitch

BGA20,4X5,20

Other Converters

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Tin Silver Copper Nickel

Bottom

R-PBGA-B20

1

No

e2

30 s

260 °C (500 °F)

Offset Binary

MAX5868EXE+

Analog Devices

Digital to Analog converter

Industrial

Ball

144

LFBGA

Square

Plastic/Epoxy

2.2 V

Yes

1

CMOS

16

280 mA

Parallel, Word

1 V

Grid Array, Low Profile, Fine Pitch

BGA144,12X12,31

41 ns

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B144

3

0.059 in (1.5 mm)

0.394 in (10 mm)

e1

30 s

260 °C (500 °F)

1.4 V

0.394 in (10 mm)

Offset Binary, 2's Complement Binary

MAX19693EXW+D

Analog Devices

Digital to Analog converter

Industrial

Ball

169

LFBGA

Square

Plastic/Epoxy

Yes

1

12

Parallel, Word

1.8 V

Grid Array, Low Profile, Fine Pitch

4.5 ns

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B169

3

0.059 in (1.5 mm)

0.433 in (11 mm)

0.433 in (11 mm)

Offset Binary

MAX5725AWP+

Analog Devices

Digital to Analog converter

Automotive

Ball

20

FBGA

Rectangular

Plastic/Epoxy

Yes

8

BICMOS

12

2.5 mA

0.024 %

3/5 V

Grid Array, Fine Pitch

BGA20,4X5,20

Other Converters

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Tin Silver Copper Nickel

Bottom

R-PBGA-B20

1

No

e2

30 s

260 °C (500 °F)

Offset Binary

MAX5869EXE+

Analog Devices

Digital to Analog converter

Industrial

Ball

144

LFBGA

Square

Plastic/Epoxy

2.2 V

Yes

1

16

345 mA

Serial

1 V

Grid Array, Low Profile, Fine Pitch

bga144,12X12,32

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B144

0.05 in (1.265 mm)

0.394 in (10 mm)

30 s

260 °C (500 °F)

1.4 V

0.394 in (10 mm)

Offset Binary

MAX5815AWC+T

Analog Devices

Digital to Analog converter

Automotive

Ball

12

FBGA

Rectangular

Plastic/Epoxy

Yes

1

BICMOS

12

1.4 mA

0.024 %

3/5 V

Grid Array, Fine Pitch

BGA12,3X4,20

Other Converters

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Tin Silver Copper Nickel

Bottom

R-PBGA-B12

1

No

e2

30 s

260 °C (500 °F)

Binary

MAX19692EXW-D

Analog Devices

Digital to Analog converter

Industrial

Ball

169

LFBGA

Square

Plastic/Epoxy

Yes

1

12

Parallel, Word

1.8 V

Grid Array, Low Profile, Fine Pitch

4.5 ns

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B169

3

0.059 in (1.5 mm)

0.433 in (11 mm)

0.433 in (11 mm)

Offset Binary

MAX5113GWX+

Analog Devices

Digital to Analog converter

Industrial

Ball

36

VFBGA

Square

Plastic/Epoxy

2.3 V

Yes

1

14

600 μA

0.0061 %

Serial

3 V

-5.2 V

Grid Array, Very Thin Profile, Fine Pitch

BGA36,6X6,20

15 µs

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B36

1

0.027 in (0.69 mm)

0.121 in (3.065 mm)

e1

30 s

260 °C (500 °F)

0 V

0.121 in (3.065 mm)

Binary

MAX5824AWP+T

Analog Devices

Digital to Analog converter

Ball

20

VFBGA

Rectangular

Plastic/Epoxy

5.5 V

Yes

1

BICMOS

10

2.5 mA

0.0488 %

Serial

3 V

Grid Array, Very Thin Profile, Fine Pitch

BGA20,4X5,20

4.5 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Bottom

R-PBGA-B20

1

0.027 in (0.69 mm)

0.099 in (2.505 mm)

0 V

0.1 in (2.55 mm)

Binary

MAX5855EXE+

Analog Devices

Digital to Analog converter

Industrial

Ball

144

LFBGA

Square

Plastic/Epoxy

2.2 V

Yes

1

16

270 mA

Serial

1 V

Grid Array, Low Profile, Fine Pitch

bga144,12X12,32

20 ns

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B144

0.05 in (1.265 mm)

0.394 in (10 mm)

1.4 V

0.394 in (10 mm)

Offset Binary

MAX19693EXW-D

Analog Devices

Digital to Analog converter

Industrial

Ball

169

LFBGA

Square

Plastic/Epoxy

Yes

1

12

Parallel, Word

1.8 V

Grid Array, Low Profile, Fine Pitch

4.5 ns

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B169

3

0.059 in (1.5 mm)

0.433 in (11 mm)

e0

20 s

240 °C (464 °F)

0.433 in (11 mm)

Offset Binary

MAX5823AWP+

Analog Devices

Digital to Analog converter

Automotive

Ball

20

VFBGA

Rectangular

Plastic/Epoxy

5.5 V

Yes

1

BICMOS

8

2.5 mA

0.09765 %

Serial

3 V

Grid Array, Very Thin Profile, Fine Pitch

BGA20,4X5,20

2.2 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Tin Silver Copper Nickel

Bottom

R-PBGA-B20

1

0.027 in (0.69 mm)

0.089 in (2.255 mm)

e2

30 s

260 °C (500 °F)

0 V

0.099 in (2.505 mm)

Binary

MAX5857EXE+

Analog Devices

Digital to Analog converter

Industrial

Ball

144

LFBGA

Square

Plastic/Epoxy

2.2 V

Yes

1

16

270 mA

0.0045 %

Serial

1 V

Grid Array, Low Profile, Fine Pitch

bga144,12X12,32

20 ns

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B144

0.05 in (1.265 mm)

0.394 in (10 mm)

1.8 V

0.394 in (10 mm)

Binary, 2's Complement Binary

MAX5825AWP+

Analog Devices

Digital to Analog converter

Automotive

Ball

20

FBGA

Rectangular

Plastic/Epoxy

Yes

8

BICMOS

12

2.5 mA

0.024 %

3/5 V

Grid Array, Fine Pitch

BGA20,4X5,20

Other Converters

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Tin Silver Copper Nickel

Bottom

R-PBGA-B20

1

No

e2

30 s

260 °C (500 °F)

Binary

MAX5871EXE+T

Analog Devices

Digital to Analog converter

Ball

144

LFBGA

Square

Plastic/Epoxy

2.2 V

Yes

1

16

345 mA

0.004577 %

Serial

1 V

Grid Array, Low Profile, Fine Pitch

bga144,12X12,32

20 ns

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B144

0.05 in (1.265 mm)

0.394 in (10 mm)

1.4 V

0.394 in (10 mm)

Offset Binary

MAX5823AWP+T

Analog Devices

Digital to Analog converter

Automotive

Ball

20

VFBGA

Rectangular

Plastic/Epoxy

5.5 V

Yes

1

BICMOS

8

2.5 mA

0.09765 %

Serial

3 V

Grid Array, Very Thin Profile, Fine Pitch

BGA20,4X5,20

2.2 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Tin Silver Copper Nickel

Bottom

R-PBGA-B20

1

0.027 in (0.69 mm)

0.089 in (2.255 mm)

e2

30 s

260 °C (500 °F)

0 V

0.099 in (2.505 mm)

Binary

MAX5882EXF+D

Analog Devices

Digital to Analog converter

Industrial

Ball

256

LBGA

Square

Plastic/Epoxy

Yes

1

14

360 mA

Parallel, Word

3.3 V

Grid Array, Low Profile

BGA256,16X16,39

1 ns

0.039 in (1 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B256

0.067 in (1.7 mm)

0.669 in (17 mm)

0.669 in (17 mm)

Offset Binary

MAX19692EXW+D

Analog Devices

Digital to Analog converter

Ball

169

LFBGA

Square

Plastic/Epoxy

Yes

1

BICMOS

12

117 mA

0.031738 %

Parallel, Word

3.3 V

Grid Array, Low Profile, Fine Pitch

BGA169,13X13,32

4.5 ns

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B169

0.059 in (1.5 mm)

0.433 in (11 mm)

30 s

260 °C (500 °F)

0.433 in (11 mm)

Offset Binary

MAX5871EXE+

Analog Devices

Digital to Analog converter

Industrial

Ball

144

LFBGA

Square

Plastic/Epoxy

2.2 V

Yes

1

16

345 mA

Serial

1 V

Grid Array, Low Profile, Fine Pitch

bga144,12X12,32

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B144

0.05 in (1.265 mm)

0.394 in (10 mm)

1.4 V

0.394 in (10 mm)

Offset Binary

MAX5715AWC+

Analog Devices

Digital to Analog converter

Automotive

Ball

12

FBGA

Rectangular

Plastic/Epoxy

Yes

4

BICMOS

12

1.5 mA

0.024 %

3/5 V

Grid Array, Fine Pitch

BGA12,3X4,20

Other Converters

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Tin Silver Copper Nickel

Bottom

R-PBGA-B12

1

No

e2

30 s

260 °C (500 °F)

Offset Binary

STW5094ADT/LF

STMicroelectronics

Digital to Analog converter

Industrial

Ball

36

TFBGA

Square

Plastic/Epoxy

Yes

1

18

Serial

3 V

Grid Array, Thin Profile, Fine Pitch

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B36

0.047 in (1.2 mm)

0.236 in (6 mm)

No

e1

260 °C (500 °F)

0.236 in (6 mm)

Binary Coded Decimal

STW5094AD/LF

STMicroelectronics

Digital to Analog converter

Industrial

Ball

36

TFBGA

Square

Plastic/Epoxy

Yes

1

18

Serial

3 V

Grid Array, Thin Profile, Fine Pitch

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B36

0.047 in (1.2 mm)

0.236 in (6 mm)

No

e1

260 °C (500 °F)

0.236 in (6 mm)

Binary Coded Decimal

STW5094

STMicroelectronics

Digital to Analog converter

Other

Ball

36

TFBGA

Square

Plastic/Epoxy

Yes

1

18

Serial

3 V

Grid Array, Thin Profile, Fine Pitch

0.031 in (0.8 mm)

85 °C (185 °F)

-30 °C (-22 °F)

Tin Silver Copper

Bottom

S-PBGA-B36

0.047 in (1.2 mm)

0.236 in (6 mm)

No

e1

0.236 in (6 mm)

Binary

MAX5112GWX+TG074

Maxim Integrated

Digital to Analog converter

Ball

36

VFBGA

Square

Plastic/Epoxy

3.2 V

Yes

1

BIMOS

14

600 μA

0.0488 %

Serial

3 V

Grid Array, Very Thin Profile, Fine Pitch

BGA36,6X6,20

15 µs

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B36

1

0.027 in (0.69 mm)

0.121 in (3.065 mm)

e1

30 s

260 °C (500 °F)

0 V

0.121 in (3.065 mm)

Binary

Digital-to-Analog Converters

Digital-to-analog converters (DACs) are electronic devices that convert digital signals into analog signals with a specific voltage or current output. They play a critical role in many electronic systems, converting digital data into analog signals that can be used to control actuators, motors, and other devices.

DACs work by sampling the digital signal at regular intervals and converting each sample into an analog signal with a specific voltage or current output. The accuracy and resolution of the DAC determine the quality of the analog signal, with higher resolution and accuracy leading to a more precise output signal.

DACs can be classified based on their architecture and their application. The most common types of DACs are binary-weighted DACs, R-2R ladder DACs, and sigma-delta DACs. Each type has its advantages and limitations, depending on the application and the required performance.

DACs are used in a wide range of applications, from audio equipment and video systems, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of digital data into analog signals, allowing the control and manipulation of physical systems based on digital signals.