Part | RoHS | Manufacturer | Converter Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | Maximum Analog Output Voltage | No. of Analog In Channels | Surface Mount | Maximum Supply Voltage | Maximum Analog Input Voltage | Sample Rate | No. of Functions | Technology | Screening Level | No. of Bits | Maximum Settling Time | Maximum Supply Current | Maximum Linearity Error (EL) | Input Format | Nominal Supply Voltage | Output Bit Code | Power Supplies (V) | Nominal Negative Supply Voltage | Package Style (Meter) | Package Equivalence Code | Sub-Category | Nominal Settling Time (tstl) | Minimum Supply Voltage | Terminal Pitch | Maximum Operating Temperature | Minimum Analog Input Voltage | Output Format | Minimum Operating Temperature | Terminal Finish | Sample and Hold/Track and Hold | Terminal Position | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Minimum Analog Output Voltage | Length | Input Bit Code |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Analog Devices |
Digital to Analog converter |
Automotive |
Ball |
20 |
VFBGA |
Rectangular |
Plastic/Epoxy |
5.5 V |
Yes |
1 |
BICMOS |
12 |
2.5 mA |
0.0244 % |
Serial |
3 V |
3/5 V |
Grid Array, Very Thin Profile, Fine Pitch |
BGA20,4X5,20 |
Other Converters |
4.5 µs |
0.02 in (0.5 mm) |
125 °C (257 °F) |
-40 °C (-40 °F) |
Tin Silver Copper Nickel |
Bottom |
R-PBGA-B20 |
1 |
0.027 in (0.69 mm) |
0.089 in (2.255 mm) |
No |
e2 |
30 s |
260 °C (500 °F) |
0 V |
0.099 in (2.505 mm) |
Binary |
|||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Industrial |
Ball |
16 |
VFBGA |
Square |
Plastic/Epoxy |
5.5 V |
Yes |
1 |
CMOS |
16 |
0.0244 % |
Serial |
3 V |
Grid Array, Very Thin Profile, Fine Pitch |
2.5 µs |
0.02 in (0.5 mm) |
105 °C (221 °F) |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B16 |
1 |
0.026 in (0.65 mm) |
0.103 in (2.605 mm) |
e1 |
30 s |
260 °C (500 °F) |
0 V |
0.103 in (2.605 mm) |
Binary |
||||||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Industrial |
Ball |
196 |
LFBGA |
Square |
Plastic/Epoxy |
1 V |
Yes |
1 |
CMOS |
16 |
Serial |
3.3 V |
1.8,3.3 V |
Grid Array |
BGA196,14X14,32 |
Other Converters |
20 ns |
0.031 in (0.8 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B196 |
3 |
0.059 in (1.5 mm) |
0.472 in (12 mm) |
No |
e1 |
30 s |
260 °C (500 °F) |
-1 V |
0.472 in (12 mm) |
Binary, 2's Complement Binary |
|||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Industrial |
Ball |
144 |
HBGA |
Square |
Plastic/Epoxy |
Yes |
2 |
16 |
Serial |
1 V |
Grid Array, Heat Sink/Slug |
0.031 in (0.8 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B144 |
3 |
0.067 in (1.71 mm) |
0.394 in (10 mm) |
e1 |
30 s |
260 °C (500 °F) |
0.394 in (10 mm) |
Binary |
|||||||||||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Industrial |
Ball |
144 |
LFBGA |
Square |
Plastic/Epoxy |
Yes |
2 |
16 |
1.85 mA |
Serial |
1 V |
Grid Array, Low Profile, Fine Pitch |
BGA144,12X12,31 |
0.031 in (0.8 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B144 |
3 |
0.067 in (1.71 mm) |
0.394 in (10 mm) |
e1 |
30 s |
260 °C (500 °F) |
0.394 in (10 mm) |
Binary |
|||||||||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Industrial |
Ball |
160 |
LFBGA |
Square |
Plastic/Epoxy |
1 V |
Yes |
1 |
CMOS |
14 |
238 mA |
Serial, Parallel, Word |
3.3 V |
1.8,3.3 V |
Grid Array, Low Profile, Fine Pitch |
BGA160,14X14,32 |
Other Converters |
0.031 in (0.8 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B160 |
3 |
0.055 in (1.4 mm) |
0.472 in (12 mm) |
No |
e1 |
260 °C (500 °F) |
-1 V |
0.472 in (12 mm) |
Binary |
||||||||||||||||||
|
Texas Instruments |
Digital to Analog converter |
Industrial |
Ball |
196 |
LFBGA |
Square |
Plastic/Epoxy |
.6 V |
Yes |
1250 MHz |
1 |
CMOS |
16 |
820 mA |
Serial |
3.3 V |
1.2,3.3 V |
Grid Array, Low Profile, Fine Pitch |
BGA196,14X14,32 |
Other Converters |
10 ns |
0.031 in (0.8 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B196 |
3 |
0.055 in (1.4 mm) |
0.472 in (12 mm) |
No |
e1 |
30 s |
260 °C (500 °F) |
-.5 V |
0.472 in (12 mm) |
Offset Binary, 2's Complement Binary |
|||||||||||||||
|
Texas Instruments |
Digital to Analog converter |
Automotive |
Ball |
16 |
VFBGA |
Square |
Plastic/Epoxy |
11 V |
Yes |
1 MHz |
1 |
14 |
5 µs |
6 mA |
0.0061 % |
Serial |
Grid Array, Very Thin Profile, Fine Pitch |
5 µs |
0.02 in (0.5 mm) |
125 °C (257 °F) |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B16 |
1 |
0.025 in (0.625 mm) |
0.094 in (2.39 mm) |
e1 |
30 s |
260 °C (500 °F) |
0 V |
0.094 in (2.39 mm) |
Binary |
|||||||||||||||||||
|
Texas Instruments |
Digital to Analog converter |
Automotive |
Ball |
16 |
VFBGA |
Square |
Plastic/Epoxy |
11 V |
Yes |
1 MHz |
1 |
14 |
5 µs |
6 mA |
0.0061 % |
Serial |
Grid Array, Very Thin Profile, Fine Pitch |
5 µs |
0.02 in (0.5 mm) |
125 °C (257 °F) |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B16 |
1 |
0.025 in (0.625 mm) |
0.094 in (2.39 mm) |
e1 |
30 s |
260 °C (500 °F) |
0 V |
0.094 in (2.39 mm) |
Binary |
|||||||||||||||||||
|
Texas Instruments |
Digital to Analog converter |
Automotive |
Ball |
16 |
VFBGA |
Square |
Plastic/Epoxy |
11 V |
Yes |
1 MHz |
1 |
14 |
5 µs |
6 mA |
0.0061 % |
Serial |
Grid Array, Very Thin Profile, Fine Pitch |
5 µs |
0.02 in (0.5 mm) |
125 °C (257 °F) |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B16 |
1 |
0.025 in (0.625 mm) |
0.094 in (2.39 mm) |
e1 |
30 s |
260 °C (500 °F) |
0 V |
0.094 in (2.39 mm) |
Binary |
|||||||||||||||||||
|
Texas Instruments |
Digital to Analog converter |
Automotive |
Ball |
16 |
VFBGA |
Square |
Plastic/Epoxy |
11 V |
Yes |
200 kHz |
1 |
16 |
5 µs |
0.0015 % |
Serial |
Grid Array, Very Thin Profile, Fine Pitch |
5 µs |
0.02 in (0.5 mm) |
125 °C (257 °F) |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B16 |
1 |
0.025 in (0.625 mm) |
0.094 in (2.39 mm) |
e1 |
30 s |
260 °C (500 °F) |
0 V |
0.094 in (2.39 mm) |
Binary |
||||||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Industrial |
Ball |
164 |
LFBGA |
Square |
Plastic/Epoxy |
1 V |
Yes |
1 |
CMOS |
14 |
556 mA |
Parallel, Word |
3.3 V |
1.5,1.8,3.3 V |
Grid Array, Low Profile, Fine Pitch |
BGA164,14X14,32 |
Other Converters |
13 ns |
0.031 in (0.8 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B164 |
3 |
0.051 in (1.3 mm) |
0.472 in (12 mm) |
No |
e1 |
30 s |
260 °C (500 °F) |
-1 V |
0.472 in (12 mm) |
Binary, 2's Complement Binary |
||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Ball |
28 |
VFBGA |
Rectangular |
Yes |
1 |
24 |
Serial |
1.8 V |
Grid Array, Very Thin Profile, Fine Pitch |
BGA28,4X7,16 |
0.016 in (0.4 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Bottom |
R-XBGA-B28 |
0.022 in (0.57 mm) |
0.069 in (1.757 mm) |
0.116 in (2.957 mm) |
Binary |
|||||||||||||||||||||||||||||||
|
Texas Instruments |
Digital to Analog converter |
Industrial |
Ball |
144 |
FBGA |
Square |
Plastic/Epoxy |
2.3 V |
Yes |
9000 MHz |
1 |
14 |
1.758 A |
Parallel, Word |
1.8 V |
-1.8 V |
Grid Array, Fine Pitch |
1 ns |
0.031 in (0.8 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B144 |
3 |
0.076 in (1.94 mm) |
0.394 in (10 mm) |
e1 |
30 s |
260 °C (500 °F) |
1.3 V |
0.394 in (10 mm) |
Offset Binary, 2's Complement Binary |
|||||||||||||||||||
|
Texas Instruments |
Digital to Analog converter |
Industrial |
Ball |
144 |
FBGA |
Square |
Plastic/Epoxy |
.6 V |
Yes |
2800 MHz |
1 |
CMOS |
16 |
Parallel, Word |
3.3 V |
Grid Array, Fine Pitch |
10 ns |
0.031 in (0.8 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B144 |
3 |
0.076 in (1.94 mm) |
0.394 in (10 mm) |
e1 |
30 s |
260 °C (500 °F) |
-.5 V |
0.394 in (10 mm) |
Offset Binary, 2's Complement Binary |
||||||||||||||||||||
Analog Devices |
Digital to Analog converter |
Industrial |
Ball |
74 |
LBGA |
Square |
Plastic/Epoxy |
2.5 V |
Yes |
1 |
BICMOS |
14 |
32 µs |
0.0122 % |
Serial |
5 V |
±4.75/±13.2,3/5,5 V |
Grid Array, Low Profile |
BGA74,11X11,40 |
Other Converters |
0.039 in (1 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin Lead |
Bottom |
S-PBGA-B74 |
3 |
0.067 in (1.7 mm) |
0.472 in (12 mm) |
No |
e0 |
240 °C (464 °F) |
-2.5 V |
0.472 in (12 mm) |
Binary |
||||||||||||||||||
|
Texas Instruments |
Digital to Analog converter |
Industrial |
Ball |
144 |
FBGA |
Square |
Plastic/Epoxy |
2.3 V |
Yes |
9000 MHz |
1 |
14 |
1.758 A |
Parallel, Word |
1.8 V |
-1.8 V |
Grid Array, Fine Pitch |
1 ns |
0.031 in (0.8 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B144 |
3 |
0.076 in (1.94 mm) |
0.394 in (10 mm) |
e1 |
30 s |
260 °C (500 °F) |
1.3 V |
0.394 in (10 mm) |
Offset Binary, 2's Complement Binary |
|||||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Industrial |
Ball |
108 |
BGA |
Square |
Plastic/Epoxy |
14.5 V |
Yes |
1 |
CMOS |
14 |
30 µs |
0.0183 % |
Serial, Parallel, Word |
12 V |
3/5,±12/±15 V |
-12 V |
Grid Array |
BGA108,12X12,40 |
Other Converters |
20 µs |
0.039 in (1 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B108 |
3 |
0.073 in (1.85 mm) |
0.512 in (13 mm) |
No |
e1 |
30 s |
260 °C (500 °F) |
-1 V |
0.512 in (13 mm) |
Binary |
||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Industrial |
Ball |
169 |
VFBGA |
Square |
Plastic/Epoxy |
Yes |
1 |
11 |
Serial, Parallel, Word |
1.2 V |
-1.2 V |
Grid Array, Very Thin Profile, Fine Pitch |
0.031 in (0.8 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B169 |
3 |
0.037 in (0.95 mm) |
0.433 in (11 mm) |
e1 |
0.433 in (11 mm) |
2's Complement |
||||||||||||||||||||||||||
Texas Instruments |
Digital to Analog converter |
Military |
Ball |
192 |
BGA |
Ceramic, Metal-Sealed Cofired |
3.1 V |
Yes |
2400 MHz |
1 |
38535V;38534K;883S |
14 |
650 mA |
0.0458 % |
Parallel, Word |
3.3 V |
3.3 V |
Grid Array |
BGA192,14X14,50 |
Other Converters |
3.5 ns |
0.05 in (1.27 mm) |
125 °C (257 °F) |
-55 °C (-67 °F) |
Tin Lead |
Bottom |
X-CBGA-B192 |
0.13 in (3.3 mm) |
0.748 in (19 mm) |
Yes |
e0 |
2.5 V |
0.748 in (19 mm) |
Binary |
|||||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Industrial |
Ball |
16 |
VFBGA |
Square |
Plastic/Epoxy |
5.5 V |
Yes |
1 |
CMOS |
16 |
7 µs |
2.25 mA |
0.0244 % |
Serial |
5 V |
3/5 V |
Grid Array, Very Thin Profile, Fine Pitch |
BGA16,4X4,20 |
Other Converters |
2.5 µs |
0.02 in (0.5 mm) |
105 °C (221 °F) |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B16 |
1 |
0.026 in (0.65 mm) |
0.103 in (2.605 mm) |
No |
e1 |
30 s |
260 °C (500 °F) |
0 V |
0.103 in (2.605 mm) |
Binary |
||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Industrial |
Ball |
165 |
VFBGA |
Square |
Plastic/Epoxy |
Yes |
1 |
16 |
Serial, Parallel, Word |
1.2 V |
-1.2 V |
Grid Array, Very Thin Profile, Fine Pitch |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B165 |
3 |
0.034 in (0.86 mm) |
0.315 in (8 mm) |
e1 |
0.315 in (8 mm) |
2's Complement |
||||||||||||||||||||||||||
|
Texas Instruments |
Digital to Analog converter |
Industrial |
Ball |
144 |
FBGA |
Square |
Plastic/Epoxy |
2.3 V |
Yes |
8400 MHz |
1 |
14 |
1.25 A |
Parallel, Word |
1.8 V |
-1.8 V |
Grid Array, Fine Pitch |
1 ns |
0.031 in (0.8 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B144 |
3 |
0.076 in (1.94 mm) |
0.394 in (10 mm) |
e1 |
30 s |
260 °C (500 °F) |
1.3 V |
0.394 in (10 mm) |
Offset Binary, 2's Complement Binary |
|||||||||||||||||||
|
Texas Instruments |
Digital to Analog converter |
Industrial |
Ball |
144 |
HBGA |
Square |
Plastic/Epoxy |
.6 V |
Yes |
2800 MHz |
1 |
CMOS |
16 |
Serial |
.9 V |
Grid Array, Heat Sink/Slug |
10 ns |
0.031 in (0.8 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B144 |
3 |
0.076 in (1.94 mm) |
0.394 in (10 mm) |
e1 |
30 s |
260 °C (500 °F) |
-.5 V |
0.394 in (10 mm) |
Offset Binary, 2's Complement Binary |
||||||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Industrial |
Ball |
170 |
LFBGA |
Rectangular |
Plastic/Epoxy |
1 V |
Yes |
1 |
CMOS |
16 |
790 mA |
0.0061 % |
Serial, Parallel, Word |
1.8 V |
Grid Array, Low Profile, Fine Pitch |
BGA170,11X17,32 |
2.2 ns |
0.031 in (0.8 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Bottom |
R-PBGA-B170 |
3 |
0.067 in (1.69 mm) |
0.354 in (9 mm) |
30 s |
260 °C (500 °F) |
-1 V |
0.591 in (15 mm) |
2's Complement Binary |
||||||||||||||||||||
|
Texas Instruments |
Digital to Analog converter |
Automotive |
Ball |
16 |
VFBGA |
Square |
Plastic/Epoxy |
11 V |
Yes |
200 kHz |
1 |
16 |
5 µs |
0.0015 % |
Serial |
Grid Array, Very Thin Profile, Fine Pitch |
5 µs |
0.02 in (0.5 mm) |
125 °C (257 °F) |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B16 |
1 |
0.025 in (0.625 mm) |
0.094 in (2.39 mm) |
e1 |
30 s |
260 °C (500 °F) |
0 V |
0.094 in (2.39 mm) |
Binary |
||||||||||||||||||||
Texas Instruments |
Digital to Analog converter |
Ball |
256 |
Square |
Plastic/Epoxy |
2.3 V |
Yes |
1 |
12 |
800 mA |
0.02197 % |
Serial |
1 V |
BGA256(UNSPEC) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin Lead |
Bottom |
S-PBGA-B256 |
3 |
e0 |
220 °C (428 °F) |
1.3 V |
2's Complement Binary |
|||||||||||||||||||||||||||||
|
Texas Instruments |
Digital to Analog converter |
Automotive |
Ball |
16 |
VFBGA |
Square |
Plastic/Epoxy |
11 V |
Yes |
1 MHz |
1 |
12 |
5 µs |
6 mA |
0.0244 % |
Serial |
Grid Array, Very Thin Profile, Fine Pitch |
5 µs |
0.02 in (0.5 mm) |
125 °C (257 °F) |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B16 |
1 |
0.025 in (0.625 mm) |
0.094 in (2.39 mm) |
e1 |
30 s |
260 °C (500 °F) |
0 V |
0.094 in (2.39 mm) |
Binary |
|||||||||||||||||||
|
Texas Instruments |
Digital to Analog converter |
Ball |
16 |
VFBGA |
Square |
Plastic/Epoxy |
5.5 V |
Yes |
250 kHz |
1 |
10 |
0.12207 % |
Serial |
2.7 V |
Grid Array, Very Thin Profile, Fine Pitch |
BGA16,4X4,16 |
20 µs |
0.016 in (0.4 mm) |
125 °C (257 °F) |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B16 |
1 |
0.016 in (0.4 mm) |
0.068 in (1.7175 mm) |
e1 |
260 °C (500 °F) |
0 V |
0.068 in (1.7175 mm) |
Binary |
|||||||||||||||||||||
Texas Instruments |
Digital to Analog converter |
Ball |
256 |
BGA |
Square |
Plastic/Epoxy |
2.39 V |
Yes |
1 |
16 |
0.01373 % |
Serial |
1.8 V |
-1.8 V |
Grid Array |
BGA256,16X16,39 |
1.8 ns |
0.039 in (1 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Bottom |
S-PBGA-B256 |
0.109 in (2.78 mm) |
0.677 in (17.2 mm) |
1.21 V |
0.677 in (17.2 mm) |
Offset Binary, 2's Complement Binary |
||||||||||||||||||||||||||
|
Texas Instruments |
Digital to Analog converter |
Industrial |
Ball |
144 |
HBGA |
Square |
Plastic/Epoxy |
.6 V |
Yes |
2500 MHz |
1 |
CMOS |
16 |
Parallel, Word |
.9 V |
Grid Array, Heat Sink/Slug |
10 ns |
0.031 in (0.8 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B144 |
3 |
0.076 in (1.94 mm) |
0.394 in (10 mm) |
e1 |
30 s |
260 °C (500 °F) |
-.5 V |
0.394 in (10 mm) |
Offset Binary, 2's Complement Binary |
||||||||||||||||||||
|
Texas Instruments |
Digital to Analog converter |
Industrial |
Ball |
144 |
HBGA |
Square |
Plastic/Epoxy |
.6 V |
Yes |
1600 MHz |
1 |
CMOS |
16 |
Parallel, Word |
.9 V |
Grid Array, Heat Sink/Slug |
10 ns |
0.031 in (0.8 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B144 |
3 |
0.076 in (1.94 mm) |
0.394 in (10 mm) |
e1 |
30 s |
260 °C (500 °F) |
-.5 V |
0.394 in (10 mm) |
Offset Binary, 2's Complement Binary |
||||||||||||||||||||
|
Texas Instruments |
Digital to Analog converter |
Industrial |
Ball |
196 |
LFBGA |
Square |
Plastic/Epoxy |
.6 V |
Yes |
1250 MHz |
1 |
16 |
650 mA |
Serial |
3.3 V |
1.2,3.3 V |
Grid Array, Low Profile, Fine Pitch |
BGA196,14X14,32 |
Other Converters |
10 ns |
0.031 in (0.8 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B196 |
3 |
0.055 in (1.4 mm) |
0.472 in (12 mm) |
No |
e1 |
30 s |
260 °C (500 °F) |
-.5 V |
0.472 in (12 mm) |
Offset Binary, 2's Complement Binary |
||||||||||||||||
Texas Instruments |
Digital to Analog converter |
Industrial |
Ball |
196 |
LFBGA |
Square |
Plastic/Epoxy |
Yes |
1 |
16 |
820 mA |
Serial |
3.3 V |
1.2,3.3 V |
Grid Array, Low Profile, Fine Pitch |
BGA196,14X14,32 |
Other Converters |
10 ns |
0.031 in (0.8 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Bottom |
S-PBGA-B196 |
0.055 in (1.4 mm) |
0.472 in (12 mm) |
No |
0.472 in (12 mm) |
Offset Binary, 2's Complement Binary |
|||||||||||||||||||||||||
|
Texas Instruments |
Digital to Analog converter |
Industrial |
Ball |
144 |
HBGA |
Square |
Plastic/Epoxy |
.6 V |
Yes |
2800 MHz |
1 |
CMOS |
16 |
Serial |
.9 V |
Grid Array, Heat Sink/Slug |
10 ns |
0.031 in (0.8 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B144 |
3 |
0.076 in (1.94 mm) |
0.394 in (10 mm) |
e1 |
30 s |
260 °C (500 °F) |
-.5 V |
0.394 in (10 mm) |
Offset Binary, 2's Complement Binary |
||||||||||||||||||||
|
Texas Instruments |
Digital to Analog converter |
Industrial |
Ball |
144 |
FBGA |
Square |
Plastic/Epoxy |
2.3 V |
Yes |
9000 MHz |
1 |
14 |
1.758 A |
Parallel, Word |
1.8 V |
-1.8 V |
Grid Array, Fine Pitch |
1 ns |
0.031 in (0.8 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B144 |
3 |
0.076 in (1.94 mm) |
0.394 in (10 mm) |
e1 |
30 s |
260 °C (500 °F) |
1.3 V |
0.394 in (10 mm) |
Offset Binary, 2's Complement Binary |
|||||||||||||||||||
|
Texas Instruments |
Digital to Analog converter |
Industrial |
Ball |
144 |
HBGA |
Square |
Plastic/Epoxy |
.6 V |
Yes |
1600 MHz |
1 |
CMOS |
16 |
Parallel, Word |
.9 V |
Grid Array, Heat Sink/Slug |
10 ns |
0.031 in (0.8 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B144 |
3 |
0.076 in (1.94 mm) |
0.394 in (10 mm) |
e1 |
30 s |
260 °C (500 °F) |
-.5 V |
0.394 in (10 mm) |
Offset Binary, 2's Complement Binary |
||||||||||||||||||||
Texas Instruments |
Digital to Analog converter |
Industrial |
Ball |
20 |
VFBGA |
Rectangular |
Plastic/Epoxy |
2.9 V |
Yes |
1 |
CMOS |
12 |
7 µs |
21 mA |
0.1465 % |
Serial |
3 V |
3/5 V |
Grid Array, Very Thin Profile, Fine Pitch |
WAFER |
Other Converters |
3 µs |
85 °C (185 °F) |
-40 °C (-40 °F) |
Bottom |
R-PBGA-B20 |
0.028 in (0.715 mm) |
0.075 in (1.91 mm) |
No |
0 V |
0.123 in (3.118 mm) |
Binary, 2's Complement Binary |
|||||||||||||||||||||
|
Texas Instruments |
Digital to Analog converter |
Industrial |
Ball |
144 |
FBGA |
Square |
Plastic/Epoxy |
2.3 V |
Yes |
9000 MHz |
1 |
14 |
1.758 A |
Parallel, Word |
1.8 V |
-1.8 V |
Grid Array, Fine Pitch |
1 ns |
0.031 in (0.8 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B144 |
3 |
0.076 in (1.94 mm) |
0.394 in (10 mm) |
e1 |
30 s |
260 °C (500 °F) |
1.3 V |
0.394 in (10 mm) |
Offset Binary, 2's Complement Binary |
|||||||||||||||||||
|
Texas Instruments |
Digital to Analog converter |
Industrial |
Ball |
144 |
FBGA |
Square |
Plastic/Epoxy |
2.3 V |
Yes |
9000 MHz |
1 |
14 |
1.76 A |
Parallel, Word |
1.8 V |
-1.8 V |
Grid Array, Fine Pitch |
1 ns |
0.031 in (0.8 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B144 |
3 |
0.076 in (1.94 mm) |
0.394 in (10 mm) |
e1 |
30 s |
260 °C (500 °F) |
1.3 V |
0.394 in (10 mm) |
Offset Binary, 2's Complement Binary |
|||||||||||||||||||
|
Texas Instruments |
Digital to Analog converter |
Industrial |
Ball |
20 |
BGA |
Rectangular |
5.1 V |
Yes |
1 |
CMOS |
12 |
7 µs |
21 mA |
0.1465 % |
Serial |
3 V |
3/5 V |
Grid Array |
WAFER |
Other Converters |
3 µs |
85 °C (185 °F) |
-40 °C (-40 °F) |
Bottom |
R-XBGA-B20 |
0.075 in (1.91 mm) |
No |
0 V |
0.123 in (3.118 mm) |
Binary, 2's Complement Binary |
||||||||||||||||||||||
|
Texas Instruments |
Digital to Analog converter |
Automotive |
Ball |
16 |
VFBGA |
Square |
Plastic/Epoxy |
11 V |
Yes |
200 kHz |
1 |
16 |
5 µs |
0.0015 % |
Serial |
Grid Array, Very Thin Profile, Fine Pitch |
5 µs |
0.02 in (0.5 mm) |
125 °C (257 °F) |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B16 |
1 |
0.025 in (0.625 mm) |
0.094 in (2.39 mm) |
e1 |
30 s |
260 °C (500 °F) |
0 V |
0.094 in (2.39 mm) |
Binary |
||||||||||||||||||||
|
Texas Instruments |
Digital to Analog converter |
Industrial |
Ball |
144 |
FBGA |
Square |
Plastic/Epoxy |
2.3 V |
Yes |
9000 MHz |
1 |
14 |
1.758 A |
Parallel, Word |
1.8 V |
-1.8 V |
Grid Array, Fine Pitch |
1 ns |
0.031 in (0.8 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B144 |
3 |
0.076 in (1.94 mm) |
0.394 in (10 mm) |
e1 |
30 s |
260 °C (500 °F) |
1.3 V |
0.394 in (10 mm) |
Offset Binary, 2's Complement Binary |
|||||||||||||||||||
|
Texas Instruments |
Digital to Analog converter |
Industrial |
Ball |
144 |
FBGA |
Square |
Plastic/Epoxy |
2.3 V |
Yes |
9000 MHz |
1 |
14 |
1.25 A |
Parallel, Word |
1.8 V |
-1.8 V |
Grid Array, Fine Pitch |
1 ns |
0.031 in (0.8 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B144 |
3 |
0.076 in (1.94 mm) |
0.394 in (10 mm) |
e1 |
30 s |
260 °C (500 °F) |
1.3 V |
0.394 in (10 mm) |
Offset Binary, 2's Complement Binary |
|||||||||||||||||||
Texas Instruments |
Digital to Analog converter |
Industrial |
Ball |
196 |
LFBGA |
Square |
Plastic/Epoxy |
.6 V |
Yes |
1 |
16 |
Parallel, Word |
3.3 V |
Grid Array, Low Profile, Fine Pitch |
10 ns |
0.031 in (0.8 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Bottom |
S-PBGA-B196 |
0.055 in (1.4 mm) |
0.472 in (12 mm) |
-.5 V |
0.472 in (12 mm) |
Binary |
||||||||||||||||||||||||||||
|
Texas Instruments |
Digital to Analog converter |
Industrial |
Ball |
144 |
FBGA |
Square |
Plastic/Epoxy |
2.3 V |
Yes |
9000 MHz |
1 |
14 |
1.25 A |
Parallel, Word |
1.8 V |
-1.8 V |
Grid Array, Fine Pitch |
1 ns |
0.031 in (0.8 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B144 |
3 |
0.076 in (1.94 mm) |
0.394 in (10 mm) |
e1 |
30 s |
260 °C (500 °F) |
1.3 V |
0.394 in (10 mm) |
Offset Binary, 2's Complement Binary |
|||||||||||||||||||
|
Texas Instruments |
Digital to Analog converter |
Industrial |
Ball |
144 |
FBGA |
Square |
Plastic/Epoxy |
2.3 V |
Yes |
6200 MHz |
1 |
14 |
1.758 A |
Parallel, Word |
1.8 V |
-1.8 V |
Grid Array, Fine Pitch |
1 ns |
0.031 in (0.8 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B144 |
3 |
0.076 in (1.94 mm) |
0.394 in (10 mm) |
e1 |
30 s |
260 °C (500 °F) |
1.3 V |
0.394 in (10 mm) |
Offset Binary, 2's Complement Binary |
|||||||||||||||||||
|
Texas Instruments |
Digital to Analog converter |
Industrial |
Ball |
144 |
FBGA |
Square |
Plastic/Epoxy |
2.3 V |
Yes |
9000 MHz |
1 |
14 |
1.758 A |
Parallel, Word |
1.8 V |
-1.8 V |
Grid Array, Fine Pitch |
1 ns |
0.031 in (0.8 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B144 |
3 |
0.076 in (1.94 mm) |
0.394 in (10 mm) |
e1 |
30 s |
260 °C (500 °F) |
1.3 V |
0.394 in (10 mm) |
Offset Binary, 2's Complement Binary |
Digital-to-analog converters (DACs) are electronic devices that convert digital signals into analog signals with a specific voltage or current output. They play a critical role in many electronic systems, converting digital data into analog signals that can be used to control actuators, motors, and other devices.
DACs work by sampling the digital signal at regular intervals and converting each sample into an analog signal with a specific voltage or current output. The accuracy and resolution of the DAC determine the quality of the analog signal, with higher resolution and accuracy leading to a more precise output signal.
DACs can be classified based on their architecture and their application. The most common types of DACs are binary-weighted DACs, R-2R ladder DACs, and sigma-delta DACs. Each type has its advantages and limitations, depending on the application and the required performance.
DACs are used in a wide range of applications, from audio equipment and video systems, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of digital data into analog signals, allowing the control and manipulation of physical systems based on digital signals.