Ball Digital-to-Analog Converters 270

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Part RoHS Manufacturer Converter Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Maximum Analog Output Voltage No. of Analog In Channels Surface Mount Maximum Supply Voltage Maximum Analog Input Voltage Sample Rate No. of Functions Technology Screening Level No. of Bits Maximum Settling Time Maximum Supply Current Maximum Linearity Error (EL) Input Format Nominal Supply Voltage Output Bit Code Power Supplies (V) Nominal Negative Supply Voltage Package Style (Meter) Package Equivalence Code Sub-Category Nominal Settling Time (tstl) Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Minimum Analog Input Voltage Output Format Minimum Operating Temperature Terminal Finish Sample and Hold/Track and Hold Terminal Position JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Minimum Analog Output Voltage Length Input Bit Code

AD5532BBCZ-1

Analog Devices

Digital to Analog converter

Industrial

Ball

74

LBGA

Square

Plastic/Epoxy

13 V

Yes

1

14

0.39 %

Serial

5 V

Grid Array, Low Profile

0.039 in (1 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B74

3

0.067 in (1.7 mm)

0.472 in (12 mm)

No

e1

30 s

260 °C (500 °F)

-13 V

0.472 in (12 mm)

Binary

AD5535ABC

Analog Devices

Digital to Analog converter

Other

Ball

124

LBGA

Square

215 V

Yes

1

14

Serial

5 V

3/5,5 V

-5 V

Grid Array, Low Profile

BGA124,14X14,40

Other Converters

10 µs

0.039 in (1 mm)

85 °C (185 °F)

-10 °C (14 °F)

Tin Lead

Bottom

S-XBGA-B124

3

0.067 in (1.7 mm)

0.591 in (15 mm)

No

e0

240 °C (464 °F)

2.5 V

0.591 in (15 mm)

Binary

AD5821ABCBZ-REEL

Analog Devices

Digital to Analog converter

Other

Ball

9

VFBGA

Rectangular

Plastic/Epoxy

5.5 V

Yes

1

CMOS

10

1 mA

0.3906 %

Serial

3 V

3/5 V

Grid Array, Very Thin Profile, Fine Pitch

BGA9,3X3,20

Other Converters

250 µs

0.02 in (0.5 mm)

85 °C (185 °F)

-30 °C (-22 °F)

Matte Tin

Bottom

R-PBGA-B9

1

0.026 in (0.65 mm)

0.06 in (1.515 mm)

No

e3

.48 V

0.067 in (1.69 mm)

Binary

AD9166BBPZRL

Analog Devices

Digital to Analog converter

Industrial

Ball

324

LFBGA

Square

Plastic/Epoxy

Yes

1

16

1.033 A

Parallel, Word

1.2 V

Grid Array, Low Profile, Fine Pitch

BGA324,18X18,32

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B324

0.062 in (1.57 mm)

0.591 in (15 mm)

0.591 in (15 mm)

2's Complement

AD5398ABCBZ-REEL

Analog Devices

Digital to Analog converter

Other

Ball

9

VFBGA

Rectangular

Plastic/Epoxy

5.5 V

Yes

1

CMOS

10

1 mA

0.3906 %

Serial

3 V

3/5 V

Grid Array, Very Thin Profile, Fine Pitch

BGA9,3X3,20

Other Converters

250 µs

0.02 in (0.5 mm)

85 °C (185 °F)

-30 °C (-22 °F)

Matte Tin

Bottom

R-PBGA-B9

1

0.026 in (0.65 mm)

0.06 in (1.515 mm)

No

e3

.48 V

0.067 in (1.69 mm)

Binary

LTC2000AIY-16

Analog Devices

Digital to Analog converter

Ball

170

LFBGA

Rectangular

Plastic/Epoxy

1 V

Yes

1

CMOS

16

870 mA

0.0061035 %

Serial, Parallel, Word

1.86 V

Grid Array, Low Profile, Fine Pitch

BGA170,10X17,32

2.2 ns

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Bottom

R-PBGA-B170

0.067 in (1.69 mm)

0.354 in (9 mm)

e0

-1 V

0.591 in (15 mm)

2's Complement Binary

AD9734BBCZRL

Analog Devices

Digital to Analog converter

Industrial

Ball

160

LFBGA

Square

1 V

Yes

1

CMOS

10

0.0488 %

Serial

1.8 V

1.8,3.3 V

Grid Array, Low Profile, Fine Pitch

BGA160,14X14,32

Other Converters

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-XBGA-B160

3

0.055 in (1.4 mm)

0.472 in (12 mm)

No

e1

260 °C (500 °F)

-1 V

0.472 in (12 mm)

Binary, 2's Complement Binary

AD9164BBCZRL

Analog Devices

Digital to Analog converter

Industrial

Ball

165

VFBGA

Square

Plastic/Epoxy

Yes

1

16

Serial

1.2 V

-1.2 V

Grid Array, Very Thin Profile, Fine Pitch

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B165

3

0.034 in (0.86 mm)

0.315 in (8 mm)

e1

260 °C (500 °F)

0.315 in (8 mm)

2's Complement

LTC2000IY-11#PBF

Analog Devices

Digital to Analog converter

Industrial

Ball

170

LFBGA

Rectangular

Plastic/Epoxy

1 V

Yes

1

CMOS

11

790 mA

0.049 %

Serial, Parallel, Word

1.8 V

Grid Array, Low Profile, Fine Pitch

BGA170,11X17,32

2.2 ns

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Bottom

R-PBGA-B170

3

0.067 in (1.69 mm)

0.354 in (9 mm)

30 s

260 °C (500 °F)

-1 V

0.591 in (15 mm)

2's Complement Binary

AD5517ABC-2

Analog Devices

Digital to Analog converter

Industrial

Ball

74

LBGA

Square

Plastic/Epoxy

5 V

Yes

1

14

0.0488 %

Serial

5 V

Grid Array, Low Profile

0.039 in (1 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B74

0.067 in (1.7 mm)

0.472 in (12 mm)

No

e0

-5 V

0.472 in (12 mm)

Binary

AD9162BBCZRL

Analog Devices

Digital to Analog converter

Industrial

Ball

165

VFBGA

Square

Plastic/Epoxy

Yes

1

16

Serial, Parallel, Word

1.2 V

-1.2 V

Grid Array, Very Thin Profile, Fine Pitch

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B165

3

0.034 in (0.86 mm)

0.315 in (8 mm)

e1

0.315 in (8 mm)

2's Complement

AD9163BBCZ

Analog Devices

Digital to Analog converter

Industrial

Ball

169

VFBGA

Square

Plastic/Epoxy

Yes

1

CMOS

16

100 mA

0.004 %

Serial

2.5 V

Grid Array, Very Thin Profile, Fine Pitch

BGA169,13X13,32

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B169

3

0.037 in (0.95 mm)

0.433 in (11 mm)

e1

0.433 in (11 mm)

2's Complement

AD5371BBCZ-REEL

Analog Devices

Digital to Analog converter

Industrial

Ball

100

LFBGA

Square

Plastic/Epoxy

15.1 V

Yes

1

CMOS

14

30 µs

0.0061 %

Serial

15 V

3/5,±12/±16.5 V

-15 V

Grid Array, Low Profile, Fine Pitch

BGA100,12X12,32

Other Converters

20 µs

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B100

3

0.055 in (1.4 mm)

0.394 in (10 mm)

No

e1

260 °C (500 °F)

-15.1 V

0.394 in (10 mm)

Binary

AD9736BBCZ

Analog Devices

Digital to Analog converter

Industrial

Ball

160

LFBGA

Square

1 V

Yes

1

CMOS

14

0.0342 %

Serial

1.8 V

1.8,3.3 V

Grid Array, Low Profile, Fine Pitch

BGA160,14X14,32

Other Converters

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-XBGA-B160

3

0.055 in (1.4 mm)

0.472 in (12 mm)

No

e1

30 s

260 °C (500 °F)

-1 V

0.472 in (12 mm)

Binary, 2's Complement Binary

AD9175BBPZ

Analog Devices

Digital to Analog converter

Industrial

Ball

144

HBGA

Square

Plastic/Epoxy

Yes

1

16

Parallel, Word

1 V

Grid Array, Heat Sink/Slug

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B144

3

0.067 in (1.71 mm)

0.394 in (10 mm)

e1

260 °C (500 °F)

0.394 in (10 mm)

2's Complement Binary

AD9163BBCZRL

Analog Devices

Digital to Analog converter

Industrial

Ball

169

VFBGA

Square

Plastic/Epoxy

Yes

1

CMOS

16

100 mA

0.004 %

Serial

2.5 V

Grid Array, Very Thin Profile, Fine Pitch

BGA169,13X13,32

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B169

3

0.037 in (0.95 mm)

0.433 in (11 mm)

e1

0.433 in (11 mm)

2's Complement

AD9175BBPZRL

Analog Devices

Digital to Analog converter

Industrial

Ball

144

HBGA

Square

Plastic/Epoxy

Yes

1

16

Parallel, Word

1 V

Grid Array, Heat Sink/Slug

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B144

3

0.067 in (1.71 mm)

0.394 in (10 mm)

e1

260 °C (500 °F)

0.394 in (10 mm)

2's Complement Binary

AD9734BBC

Analog Devices

Digital to Analog converter

Industrial

Ball

160

LFBGA

Square

1 V

Yes

1

CMOS

10

0.0488 %

Serial

1.8 V

1.8,3.3 V

Grid Array, Low Profile, Fine Pitch

BGA160,14X14,32

Other Converters

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead Silver

Bottom

S-XBGA-B160

4

0.055 in (1.4 mm)

0.472 in (12 mm)

No

e0

240 °C (464 °F)

-1 V

0.472 in (12 mm)

Binary, 2's Complement Binary

AD9176BBPZRL

Analog Devices

Digital to Analog converter

Industrial

Ball

144

HBGA

Square

Plastic/Epoxy

Yes

1

16

Parallel, Word

1 V

Grid Array, Heat Sink/Slug

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B144

3

0.067 in (1.71 mm)

0.394 in (10 mm)

e1

30 s

260 °C (500 °F)

0.394 in (10 mm)

2's Complement

AD9735BBC

Analog Devices

Digital to Analog converter

Industrial

Ball

160

LFBGA

Square

1 V

Yes

1

CMOS

12

0.0366 %

Serial

1.8 V

1.8,3.3 V

Grid Array, Low Profile, Fine Pitch

BGA160,14X14,32

Other Converters

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead Silver

Bottom

S-XBGA-B160

4

0.055 in (1.4 mm)

0.472 in (12 mm)

No

e0

240 °C (464 °F)

-1 V

0.472 in (12 mm)

Binary, 2's Complement Binary

LTC2000AIY-11#PBF

Analog Devices

Digital to Analog converter

Industrial

Ball

170

LFBGA

Rectangular

Plastic/Epoxy

1 V

Yes

1

CMOS

11

0.0488 %

Serial, Parallel, Word

1.86 V

Grid Array, Low Profile, Fine Pitch

2.2 ns

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

R-PBGA-B170

3

0.067 in (1.69 mm)

0.354 in (9 mm)

e1

-1 V

0.591 in (15 mm)

2's Complement Binary

AD9164BBCA

Analog Devices

Digital to Analog converter

Industrial

Ball

169

VFBGA

Square

Plastic/Epoxy

Yes

1

16

Serial

1.2 V

-1.2 V

Grid Array, Very Thin Profile, Fine Pitch

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B169

3

0.037 in (0.95 mm)

0.433 in (11 mm)

e0

225 °C (437 °F)

0.433 in (11 mm)

2's Complement

LTC2000IY-14#PBF

Analog Devices

Digital to Analog converter

Industrial

Ball

170

LFBGA

Rectangular

Plastic/Epoxy

1 V

Yes

1

CMOS

14

790 mA

0.012 %

Serial, Parallel, Word

1.8 V

Grid Array, Low Profile, Fine Pitch

BGA170,11X17,32

2.2 ns

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Bottom

R-PBGA-B170

3

0.067 in (1.69 mm)

0.354 in (9 mm)

30 s

260 °C (500 °F)

-1 V

0.591 in (15 mm)

2's Complement Binary

AD9736BBC

Analog Devices

Digital to Analog converter

Industrial

Ball

160

LFBGA

Square

1 V

Yes

1

CMOS

14

0.0342 %

Serial

1.8 V

1.8,3.3 V

Grid Array, Low Profile, Fine Pitch

BGA160,14X14,32

Other Converters

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead Silver

Bottom

S-XBGA-B160

4

0.055 in (1.4 mm)

0.472 in (12 mm)

No

e0

240 °C (464 °F)

-1 V

0.472 in (12 mm)

Binary, 2's Complement Binary

LTC2000IY-16

Analog Devices

Digital to Analog converter

Industrial

Ball

170

LFBGA

Rectangular

Plastic/Epoxy

1 V

Yes

1

CMOS

16

790 μA

0.0061035156 %

Serial

1.8 V

Grid Array, Low Profile, Fine Pitch

BGA170,10X17,32

2.2 ns

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin/Lead

Bottom

R-PBGA-B170

0.067 in (1.69 mm)

0.354 in (9 mm)

e0

-1 V

0.591 in (15 mm)

2's Complement Binary

AD5669RBCBZ-1-RL7

Analog Devices

Digital to Analog converter

Industrial

Ball

16

VFBGA

Square

Plastic/Epoxy

5.5 V

Yes

1

CMOS

16

7 µs

2.5 mA

0.0244 %

Serial

3 V

3/5 V

Grid Array, Very Thin Profile, Fine Pitch

BGA16,4X4,20

Other Converters

2.5 µs

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B16

1

0.026 in (0.65 mm)

0.103 in (2.605 mm)

No

e1

30 s

260 °C (500 °F)

0 V

0.103 in (2.605 mm)

Binary

AD9173BBPZRL

Analog Devices

Digital to Analog Converter 16 bit

Ball

144

HBGA

Square

Plastic/Epoxy

Yes

1

16

0.01068 %

Serial

1 V

Grid Array, Heat Sink/Slug

bga144,12X12,32

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B144

0.067 in (1.71 mm)

0.394 in (10 mm)

0.394 in (10 mm)

2's Complement

AD5517ABC-1

Analog Devices

Digital to Analog converter

Industrial

Ball

74

LBGA

Square

Plastic/Epoxy

2.5 V

Yes

1

14

0.0488 %

Serial

5 V

Grid Array, Low Profile

0.039 in (1 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B74

0.067 in (1.7 mm)

0.472 in (12 mm)

No

e0

-2.5 V

0.472 in (12 mm)

Binary

AD5516ABC-2

Analog Devices

Digital to Analog converter

Industrial

Ball

74

LBGA

Square

Plastic/Epoxy

5 V

Yes

1

BICMOS

14

32 µs

0.0122 %

Serial

5 V

±4.75/±13.2,3/5,5 V

Grid Array, Low Profile

BGA74,11X11,40

Other Converters

0.039 in (1 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B74

3

0.067 in (1.7 mm)

0.472 in (12 mm)

No

e0

240 °C (464 °F)

-5 V

0.472 in (12 mm)

Binary

AD5384BBCZ-5REEL7

Analog Devices

Digital to Analog converter

Industrial

Ball

100

LFBGA

Square

Plastic/Epoxy

5.5 V

Yes

1

14

8 µs

475 μA

0.02441 %

Serial

5 V

Grid Array, Low Profile, Fine Pitch

BGA100,12X12,32

3 µs

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B100

0.055 in (1.4 mm)

0.394 in (10 mm)

0 V

0.394 in (10 mm)

Binary

AD5532ABC-5REEL

Analog Devices

Digital to Analog converter

Industrial

Ball

74

LBGA

Square

Plastic/Epoxy

14.5 V

Yes

1

14

0.39 %

Serial

10 V

Grid Array, Low Profile

22 µs

0.039 in (1 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B74

3

0.067 in (1.7 mm)

0.472 in (12 mm)

No

e0

240 °C (464 °F)

-14.5 V

0.472 in (12 mm)

Binary

AD9177BBPZ

Analog Devices

Digital to Analog converter

Ball

324

HFBGA

Square

Plastic/Epoxy

Yes

4

16

301 mA

0.012207 %

Serial

2 V

Grid Array, Heat Sink/Slug, Fine Pitch

BGA324,18X18,32

0.031 in (0.8 mm)

120 °C (248 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B324

3

0.068 in (1.72 mm)

0.591 in (15 mm)

30 s

260 °C (500 °F)

0.591 in (15 mm)

Binary

LTC2000ACY-11#PBF

Analog Devices

Digital to Analog converter

Commercial

Ball

170

LFBGA

Rectangular

Plastic/Epoxy

1 V

Yes

1

CMOS

11

0.0488 %

Serial, Parallel, Word

1.86 V

Grid Array, Low Profile, Fine Pitch

2.2 ns

0.031 in (0.8 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Silver Copper

Bottom

R-PBGA-B170

3

0.067 in (1.69 mm)

0.354 in (9 mm)

e1

-1 V

0.591 in (15 mm)

2's Complement Binary

AD5516ABCZ-3

Analog Devices

Digital to Analog converter

Industrial

Ball

74

LBGA

Square

Plastic/Epoxy

10 V

Yes

1

14

0.0122 %

Serial

5 V

Grid Array, Low Profile

0.039 in (1 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B74

3

0.067 in (1.7 mm)

0.472 in (12 mm)

No

e1

30 s

260 °C (500 °F)

-10 V

0.472 in (12 mm)

Binary

AD9736BBCZRL

Analog Devices

Digital to Analog converter

Industrial

Ball

160

LFBGA

Square

1 V

Yes

1

CMOS

14

0.0342 %

Serial

1.8 V

1.8,3.3 V

Grid Array, Low Profile, Fine Pitch

BGA160,14X14,32

Other Converters

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-XBGA-B160

3

0.055 in (1.4 mm)

0.472 in (12 mm)

No

e1

30 s

260 °C (500 °F)

-1 V

0.472 in (12 mm)

Binary, 2's Complement Binary

AD5384BBC-5REEL7

Analog Devices

Digital to Analog converter

Industrial

Ball

100

LFBGA

Square

Plastic/Epoxy

3.6 V

Yes

1

CMOS

14

10 µs

0.0244 %

Serial

3 V

3/5,5 V

Grid Array, Low Profile, Fine Pitch

BGA100,12X12,32

Other Converters

8 µs

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead Silver

Bottom

S-PBGA-B100

3

0.055 in (1.4 mm)

0.394 in (10 mm)

No

e0

240 °C (464 °F)

0 V

0.394 in (10 mm)

Binary

AD5592RBCBZ-RL7

Analog Devices

Digital to Analog Converter 12 bit

Ball

16

VFBGA

Square

Plastic/Epoxy

5 V

Yes

1

12

2.7 mA

0.0244 %

Serial

3 V

Grid Array, Very Thin Profile, Fine Pitch

BGA16,4X4,20

6 µs

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B16

1

0.025 in (0.64 mm)

0.077 in (1.96 mm)

e1

30 s

260 °C (500 °F)

0 V

0.077 in (1.96 mm)

Binary

AD9735BBCRL

Analog Devices

Digital to Analog converter

Industrial

Ball

160

LFBGA

Square

1 V

Yes

1

CMOS

12

0.0366 %

Serial

1.8 V

1.8,3.3 V

Grid Array, Low Profile, Fine Pitch

BGA160,14X14,32

Other Converters

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead Silver

Bottom

S-XBGA-B160

4

0.055 in (1.4 mm)

0.472 in (12 mm)

No

e0

240 °C (464 °F)

-1 V

0.472 in (12 mm)

Binary, 2's Complement Binary

AD9161BBCZRL

Analog Devices

Digital to Analog converter

Industrial

Ball

169

VFBGA

Square

Plastic/Epoxy

Yes

1

11

Serial, Parallel, Word

1.2 V

-1.2 V

Grid Array, Very Thin Profile, Fine Pitch

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B169

3

0.037 in (0.95 mm)

0.433 in (11 mm)

e1

0.433 in (11 mm)

2's Complement

AD5628BCBZ-1-RL7

Analog Devices

Digital to Analog converter

Industrial

Ball

16

VFBGA

Square

Plastic/Epoxy

5.5 V

Yes

1

CMOS

12

7 µs

2.25 mA

0.0244 %

Serial

5 V

3/5 V

Grid Array, Very Thin Profile, Fine Pitch

BGA16,4X4,20

Other Converters

2.5 µs

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B16

1

0.026 in (0.65 mm)

0.103 in (2.605 mm)

No

e1

30 s

260 °C (500 °F)

0 V

0.103 in (2.605 mm)

Binary

AD5668BCBZ-1-500R7

Analog Devices

Digital to Analog converter

Industrial

Ball

16

VFBGA

Square

Plastic/Epoxy

3.6 V

Yes

1

CMOS

16

0.0244 %

Serial

3 V

Grid Array, Very Thin Profile, Fine Pitch

2.5 µs

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B16

1

0.026 in (0.65 mm)

0.103 in (2.605 mm)

e1

30 s

260 °C (500 °F)

0 V

0.103 in (2.605 mm)

Binary

AD9735BBCZRL

Analog Devices

Digital to Analog converter

Industrial

Ball

160

LFBGA

Square

1 V

Yes

1

CMOS

12

0.0366 %

Serial

1.8 V

1.8,3.3 V

Grid Array, Low Profile, Fine Pitch

BGA160,14X14,32

Other Converters

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-XBGA-B160

3

0.055 in (1.4 mm)

0.472 in (12 mm)

No

e1

30 s

260 °C (500 °F)

-1 V

0.472 in (12 mm)

Binary, 2's Complement Binary

AD5770RBCBZ-RL7

Analog Devices

Digital to Analog converter

Industrial

Ball

49

VFBGA

Square

Plastic/Epoxy

Yes

1

14

0.0397 %

Serial

Grid Array, Very Thin Profile, Fine Pitch

13 µs

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B49

1

0.026 in (0.66 mm)

0.159 in (4.04 mm)

260 °C (500 °F)

0.159 in (4.04 mm)

Binary

AD5532ABC-1

Analog Devices

Digital to Analog converter

Industrial

Ball

74

LBGA

Square

Plastic/Epoxy

14.5 V

Yes

1

14

0.39 %

Serial

10 V

Grid Array, Low Profile

22 µs

0.039 in (1 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B74

3

0.067 in (1.7 mm)

0.472 in (12 mm)

No

e0

240 °C (464 °F)

-14.5 V

0.472 in (12 mm)

Binary

AD9789BBC

Analog Devices

Digital to Analog converter

Industrial

Ball

164

LFBGA

Square

Plastic/Epoxy

1 V

Yes

1

CMOS

14

556 mA

Parallel, Word

3.3 V

1.5,1.8,3.3 V

Grid Array, Low Profile, Fine Pitch

BGA164,14X14,32

Other Converters

13 ns

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B164

1

0.051 in (1.3 mm)

0.472 in (12 mm)

No

-1 V

0.472 in (12 mm)

Binary, 2's Complement Binary

AD5592RBCBZ-1-RL7

Analog Devices

Digital to Analog Converter 12 bit

Ball

16

VFBGA

Square

Plastic/Epoxy

5 V

Yes

1

12

2.7 mA

0.0244 %

Serial

3 V

Grid Array, Very Thin Profile, Fine Pitch

BGA16,4X4,20

6 µs

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B16

1

0.025 in (0.64 mm)

0.077 in (1.96 mm)

e1

30 s

260 °C (500 °F)

0 V

0.077 in (1.96 mm)

Binary

AD5535ABCZ

Analog Devices

Digital to Analog converter

Other

Ball

124

LBGA

Square

215 V

Yes

1

14

Serial

5 V

3/5,5 V

-5 V

Grid Array, Low Profile

BGA124,14X14,40

Other Converters

10 µs

0.039 in (1 mm)

85 °C (185 °F)

-10 °C (14 °F)

Tin Silver Copper

Bottom

S-XBGA-B124

3

0.067 in (1.7 mm)

0.591 in (15 mm)

No

e1

260 °C (500 °F)

2.5 V

0.591 in (15 mm)

Binary

MAX5857EXE+T

Analog Devices

Digital to Analog converter

Industrial

Ball

144

LFBGA

Square

Plastic/Epoxy

2.2 V

Yes

1

16

270 mA

0.0045 %

Serial

1 V

Grid Array, Low Profile, Fine Pitch

bga144,12X12,32

20 ns

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B144

0.05 in (1.265 mm)

0.394 in (10 mm)

1.8 V

0.394 in (10 mm)

Binary, 2's Complement Binary

Digital-to-Analog Converters

Digital-to-analog converters (DACs) are electronic devices that convert digital signals into analog signals with a specific voltage or current output. They play a critical role in many electronic systems, converting digital data into analog signals that can be used to control actuators, motors, and other devices.

DACs work by sampling the digital signal at regular intervals and converting each sample into an analog signal with a specific voltage or current output. The accuracy and resolution of the DAC determine the quality of the analog signal, with higher resolution and accuracy leading to a more precise output signal.

DACs can be classified based on their architecture and their application. The most common types of DACs are binary-weighted DACs, R-2R ladder DACs, and sigma-delta DACs. Each type has its advantages and limitations, depending on the application and the required performance.

DACs are used in a wide range of applications, from audio equipment and video systems, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of digital data into analog signals, allowing the control and manipulation of physical systems based on digital signals.