Ball Digital-to-Analog Converters 270

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Part RoHS Manufacturer Converter Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Maximum Analog Output Voltage No. of Analog In Channels Surface Mount Maximum Supply Voltage Maximum Analog Input Voltage Sample Rate No. of Functions Technology Screening Level No. of Bits Maximum Settling Time Maximum Supply Current Maximum Linearity Error (EL) Input Format Nominal Supply Voltage Output Bit Code Power Supplies (V) Nominal Negative Supply Voltage Package Style (Meter) Package Equivalence Code Sub-Category Nominal Settling Time (tstl) Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Minimum Analog Input Voltage Output Format Minimum Operating Temperature Terminal Finish Sample and Hold/Track and Hold Terminal Position JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Minimum Analog Output Voltage Length Input Bit Code

DAC34SH84IZAY

Texas Instruments

Digital to Analog converter

Industrial

Ball

196

LFBGA

Square

Plastic/Epoxy

.6 V

Yes

1500 MHz

1

16

165 mA

Parallel, Word

3.3 V

1.25,3.3 V

Grid Array, Low Profile, Fine Pitch

BGA196,14X14,32

Other Converters

10 ns

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B196

3

0.055 in (1.4 mm)

0.472 in (12 mm)

No

e1

30 s

260 °C (500 °F)

-.5 V

0.472 in (12 mm)

Binary

DAC38RF80IAAV

Texas Instruments

Digital to Analog converter

Industrial

Ball

144

FBGA

Square

Plastic/Epoxy

2.3 V

Yes

9000 MHz

1

14

1.76 A

Parallel, Word

1.8 V

-1.8 V

Grid Array, Fine Pitch

1 ns

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B144

3

0.076 in (1.94 mm)

0.394 in (10 mm)

e1

30 s

260 °C (500 °F)

1.3 V

0.394 in (10 mm)

Offset Binary, 2's Complement Binary

DAC38RF86IAAV

Texas Instruments

Digital to Analog converter

Industrial

Ball

144

FBGA

Square

Plastic/Epoxy

2.3 V

Yes

9000 MHz

1

14

1.758 A

Parallel, Word

1.8 V

-1.8 V

Grid Array, Fine Pitch

1 ns

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B144

3

0.076 in (1.94 mm)

0.394 in (10 mm)

e1

30 s

260 °C (500 °F)

1.3 V

0.394 in (10 mm)

Offset Binary, 2's Complement Binary

PDAC37J82IAAV

Texas Instruments

Digital to Analog converter

Industrial

Ball

144

HBGA

Square

Plastic/Epoxy

.6 V

Yes

1

16

Serial

3.3 V

Grid Array, Heat Sink/Slug

10 ns

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B144

0.076 in (1.94 mm)

0.394 in (10 mm)

-.5 V

0.394 in (10 mm)

Binary

DAC60508ZYZFR

Texas Instruments

Digital to Analog converter

Automotive

Ball

16

VFBGA

Square

Plastic/Epoxy

11 V

Yes

1 MHz

1

12

5 µs

6 mA

0.0244 %

Serial

Grid Array, Very Thin Profile, Fine Pitch

5 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B16

1

0.025 in (0.625 mm)

0.094 in (2.39 mm)

e1

30 s

260 °C (500 °F)

0 V

0.094 in (2.39 mm)

Binary

PDAC12DL3200ACF

Texas Instruments

Digital to Analog converter

Industrial

Ball

256

BGA

Square

Plastic/Epoxy

2.3 V

Yes

1

12

0.0244 %

Parallel, Word

1.8 V

-1.8 V

Grid Array

BGA256,16X16,39

0.039 in (1 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B256

0.13 in (3.31 mm)

0.669 in (17 mm)

1.3 V

0.669 in (17 mm)

2's Complement Binary

DAC80508ZCYZFR

Texas Instruments

Digital to Analog converter

Automotive

Ball

16

VFBGA

Square

Plastic/Epoxy

11 V

Yes

200 kHz

1

16

5 µs

0.0015 %

Serial

Grid Array, Very Thin Profile, Fine Pitch

5 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B16

1

0.025 in (0.625 mm)

0.094 in (2.39 mm)

e1

30 s

260 °C (500 °F)

0 V

0.094 in (2.39 mm)

Binary

DAC39J84IAAVR

Texas Instruments

Digital to Analog converter

Industrial

Ball

144

FBGA

Square

Plastic/Epoxy

.6 V

Yes

2800 MHz

1

CMOS

16

Parallel, Word

3.3 V

Grid Array, Fine Pitch

10 ns

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B144

3

0.076 in (1.94 mm)

0.394 in (10 mm)

e1

30 s

260 °C (500 °F)

-.5 V

0.394 in (10 mm)

Offset Binary, 2's Complement Binary

DAC37J84IAAVR

Texas Instruments

Digital to Analog converter

Industrial

Ball

144

HBGA

Square

Plastic/Epoxy

.6 V

Yes

1600 MHz

1

CMOS

16

Parallel, Word

.9 V

Grid Array, Heat Sink/Slug

10 ns

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B144

3

0.076 in (1.94 mm)

0.394 in (10 mm)

e1

30 s

260 °C (500 °F)

-.5 V

0.394 in (10 mm)

Offset Binary, 2's Complement Binary

DAC38RF87IAAV

Texas Instruments

Digital to Analog converter

Industrial

Ball

144

FBGA

Square

Plastic/Epoxy

2.3 V

Yes

6200 MHz

1

14

1.758 A

Parallel, Word

1.8 V

-1.8 V

Grid Array, Fine Pitch

1 ns

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B144

3

0.076 in (1.94 mm)

0.394 in (10 mm)

e1

30 s

260 °C (500 °F)

1.3 V

0.394 in (10 mm)

Offset Binary, 2's Complement Binary

TLV5608IYE

Texas Instruments

Digital to Analog converter

Industrial

Ball

20

VFBGA

Rectangular

Plastic/Epoxy

2.9 V

Yes

1

CMOS

10

7 µs

21 mA

0.1953 %

Serial

3 V

3/5 V

Grid Array, Very Thin Profile, Fine Pitch

WAFER

Other Converters

3 µs

85 °C (185 °F)

-40 °C (-40 °F)

Bottom

R-PBGA-B20

0.028 in (0.715 mm)

0.075 in (1.91 mm)

No

0 V

0.123 in (3.118 mm)

Binary, 2's Complement Binary

DAC34H84IZAYR

Texas Instruments

Digital to Analog converter

Industrial

Ball

196

LFBGA

Square

Plastic/Epoxy

.6 V

Yes

1250 MHz

1

CMOS

16

820 mA

Serial

3.3 V

1.2,3.3 V

Grid Array, Low Profile, Fine Pitch

BGA196,14X14,32

Other Converters

10 ns

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B196

3

0.055 in (1.4 mm)

0.472 in (12 mm)

No

e1

30 s

260 °C (500 °F)

-.5 V

0.472 in (12 mm)

Offset Binary, 2's Complement Binary

TLV5610IYZR

Texas Instruments

Digital to Analog converter

Industrial

Ball

20

BGA

Rectangular

5.1 V

Yes

283 kHz

1

CMOS

12

7 µs

21 mA

0.1465 %

Serial

3 V

3/5 V

Grid Array

WAFER

Other Converters

3 µs

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

R-XBGA-B20

0.075 in (1.91 mm)

No

e1

0 V

0.123 in (3.118 mm)

Binary, 2's Complement Binary

DAC38RF97IAAVR

Texas Instruments

Digital to Analog converter

Industrial

Ball

144

FBGA

Square

Plastic/Epoxy

2.3 V

Yes

6200 MHz

1

14

1.758 A

Parallel, Word

1.8 V

-1.8 V

Grid Array, Fine Pitch

1 ns

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B144

3

0.076 in (1.94 mm)

0.394 in (10 mm)

e1

30 s

260 °C (500 °F)

1.3 V

0.394 in (10 mm)

Offset Binary, 2's Complement Binary

DAC3484IZAY

Texas Instruments

Digital to Analog converter

Industrial

Ball

196

LFBGA

Square

Plastic/Epoxy

.6 V

Yes

1250 MHz

1

16

650 mA

Serial

3.3 V

1.2,3.3 V

Grid Array, Low Profile, Fine Pitch

BGA196,14X14,32

Other Converters

10 ns

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B196

3

0.055 in (1.4 mm)

0.472 in (12 mm)

No

e1

30 s

260 °C (500 °F)

-.5 V

0.472 in (12 mm)

Offset Binary, 2's Complement Binary

DAC5670MGEM-V

Texas Instruments

Digital to Analog converter

Military

Ball

192

BGA

Ceramic, Metal-Sealed Cofired

3.1 V

Yes

1

38535V;38534K;883S

14

650 mA

0.0458 %

Parallel, Word

3.3 V

3.3 V

Grid Array

BGA192,14X14,50

Other Converters

3.5 ns

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Bottom

X-CBGA-B192

No

2.5 V

Binary

TLV320DAC23IGQE

Texas Instruments

Digital to Analog converter

Industrial

Ball

80

VFBGA

Square

Plastic/Epoxy

Yes

1

32

Serial

3.3 V

1.5/3.3,3.3 V

Grid Array, Very Thin Profile, Fine Pitch

BGA80,9X9,20

Other Converters

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B80

0.039 in (1 mm)

0.197 in (5 mm)

No

0.197 in (5 mm)

Binary

DAC38RF96IAAV

Texas Instruments

Digital to Analog converter

Industrial

Ball

144

FBGA

Square

Plastic/Epoxy

2.3 V

Yes

9000 MHz

1

14

1.758 A

Parallel, Word

1.8 V

-1.8 V

Grid Array, Fine Pitch

1 ns

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B144

3

0.076 in (1.94 mm)

0.394 in (10 mm)

e1

30 s

260 °C (500 °F)

1.3 V

0.394 in (10 mm)

Offset Binary, 2's Complement Binary

DAC34SH84IZAYR

Texas Instruments

Digital to Analog converter

Industrial

Ball

196

LFBGA

Square

Plastic/Epoxy

.6 V

Yes

1500 MHz

1

16

165 mA

Parallel, Word

3.3 V

1.25,3.3 V

Grid Array, Low Profile, Fine Pitch

BGA196,14X14,32

Other Converters

10 ns

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B196

3

0.055 in (1.4 mm)

0.472 in (12 mm)

No

e1

30 s

260 °C (500 °F)

-.5 V

0.472 in (12 mm)

Binary

DAC38RF84IAAVR

Texas Instruments

Digital to Analog converter

Industrial

Ball

144

FBGA

Square

Plastic/Epoxy

2.3 V

Yes

9000 MHz

1

14

1.758 A

Parallel, Word

1.8 V

-1.8 V

Grid Array, Fine Pitch

1 ns

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B144

3

0.076 in (1.94 mm)

0.394 in (10 mm)

e1

30 s

260 °C (500 °F)

1.3 V

0.394 in (10 mm)

Offset Binary, 2's Complement Binary

DAC60508MYZFR

Texas Instruments

Digital to Analog converter

Automotive

Ball

16

VFBGA

Square

Plastic/Epoxy

11 V

Yes

1 MHz

1

12

5 µs

6 mA

0.0244 %

Serial

Grid Array, Very Thin Profile, Fine Pitch

5 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B16

1

0.025 in (0.625 mm)

0.094 in (2.39 mm)

e1

30 s

260 °C (500 °F)

0 V

0.094 in (2.39 mm)

Binary

DAC37J82IAAVR

Texas Instruments

Digital to Analog converter

Industrial

Ball

144

HBGA

Square

Plastic/Epoxy

.6 V

Yes

1600 MHz

1

CMOS

16

Parallel, Word

.9 V

Grid Array, Heat Sink/Slug

10 ns

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B144

3

0.076 in (1.94 mm)

0.394 in (10 mm)

e1

30 s

260 °C (500 °F)

-.5 V

0.394 in (10 mm)

Offset Binary, 2's Complement Binary

PDAC38J82IAAV

Texas Instruments

Digital to Analog converter

Industrial

Ball

144

HBGA

Square

Plastic/Epoxy

.6 V

Yes

1

16

Serial

3.3 V

Grid Array, Heat Sink/Slug

10 ns

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B144

0.076 in (1.94 mm)

0.394 in (10 mm)

-.5 V

0.394 in (10 mm)

Binary

PDAC38RF82AAV

Texas Instruments

Digital to Analog converter

Industrial

Ball

144

FBGA

Square

Plastic/Epoxy

2.3 V

Yes

1

14

Parallel, Word

1.8 V

-1.8 V

Grid Array, Fine Pitch

1 ns

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B144

0.076 in (1.94 mm)

0.394 in (10 mm)

1.3 V

0.394 in (10 mm)

Offset Binary, 2's Complement Binary

DAC38J82IAAVR

Texas Instruments

Digital to Analog converter

Industrial

Ball

144

HBGA

Square

Plastic/Epoxy

.6 V

Yes

2500 MHz

1

CMOS

16

Parallel, Word

.9 V

Grid Array, Heat Sink/Slug

10 ns

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B144

3

0.076 in (1.94 mm)

0.394 in (10 mm)

e1

30 s

260 °C (500 °F)

-.5 V

0.394 in (10 mm)

Offset Binary, 2's Complement Binary

DAC38RF90IAAV

Texas Instruments

Digital to Analog converter

Industrial

Ball

144

FBGA

Square

Plastic/Epoxy

2.3 V

Yes

9000 MHz

1

14

1.758 A

Parallel, Word

1.8 V

-1.8 V

Grid Array, Fine Pitch

1 ns

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B144

3

0.076 in (1.94 mm)

0.394 in (10 mm)

e1

30 s

260 °C (500 °F)

1.3 V

0.394 in (10 mm)

Offset Binary, 2's Complement Binary

DAC5670MGEM/EM

Texas Instruments

Digital to Analog converter

Military

Ball

192

BGA

Square

Ceramic, Metal-Sealed Cofired

4.1 V

Yes

2400 MHz

1

14

0.0458 %

3.3 V

Grid Array

3.5 ns

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Bottom

S-CBGA-B192

0.13 in (3.3 mm)

0.748 in (19 mm)

e0

2.5 V

0.748 in (19 mm)

Binary

DAC38RF90IAAVR

Texas Instruments

Digital to Analog converter

Industrial

Ball

144

FBGA

Square

Plastic/Epoxy

2.3 V

Yes

9000 MHz

1

14

1.758 A

Parallel, Word

1.8 V

-1.8 V

Grid Array, Fine Pitch

1 ns

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B144

3

0.076 in (1.94 mm)

0.394 in (10 mm)

e1

30 s

260 °C (500 °F)

1.3 V

0.394 in (10 mm)

Offset Binary, 2's Complement Binary

DAC60508MCYZFT

Texas Instruments

Digital to Analog converter

Automotive

Ball

16

VFBGA

Square

Plastic/Epoxy

11 V

Yes

1 MHz

1

12

5 µs

0.0244 %

Serial

Grid Array, Very Thin Profile, Fine Pitch

5 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B16

1

0.025 in (0.625 mm)

0.094 in (2.39 mm)

e1

30 s

260 °C (500 °F)

0 V

0.094 in (2.39 mm)

Binary

DAC60508MCYZFR

Texas Instruments

Digital to Analog converter

Automotive

Ball

16

VFBGA

Square

Plastic/Epoxy

11 V

Yes

1 MHz

1

12

5 µs

0.0244 %

Serial

Grid Array, Very Thin Profile, Fine Pitch

5 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B16

1

0.025 in (0.625 mm)

0.094 in (2.39 mm)

e1

30 s

260 °C (500 °F)

0 V

0.094 in (2.39 mm)

Binary

DAC80508MYZFR

Texas Instruments

Digital to Analog converter

Automotive

Ball

16

VFBGA

Square

Plastic/Epoxy

11 V

Yes

200 kHz

1

16

5 µs

0.0015 %

Serial

Grid Array, Very Thin Profile, Fine Pitch

5 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B16

1

0.025 in (0.625 mm)

0.094 in (2.39 mm)

e1

30 s

260 °C (500 °F)

0 V

0.094 in (2.39 mm)

Binary

DAC38RF93IAAVR

Texas Instruments

Digital to Analog converter

Industrial

Ball

144

FBGA

Square

Plastic/Epoxy

2.3 V

Yes

9000 MHz

1

14

1.758 A

Parallel, Word

1.8 V

-1.8 V

Grid Array, Fine Pitch

1 ns

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B144

3

0.076 in (1.94 mm)

0.394 in (10 mm)

e1

30 s

260 °C (500 °F)

1.3 V

0.394 in (10 mm)

Offset Binary, 2's Complement Binary

DAC38RF89IAAVR

Texas Instruments

Digital to Analog converter

Industrial

Ball

144

FBGA

Square

Plastic/Epoxy

2.3 V

Yes

8400 MHz

1

14

1.25 A

Parallel, Word

1.8 V

-1.8 V

Grid Array, Fine Pitch

1 ns

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B144

3

0.076 in (1.94 mm)

0.394 in (10 mm)

e1

30 s

260 °C (500 °F)

1.3 V

0.394 in (10 mm)

Offset Binary, 2's Complement Binary

TLV320DAC23IGQER

Texas Instruments

Digital to Analog converter

Industrial

Ball

80

VFBGA

Square

Plastic/Epoxy

Yes

1

32

Serial

3.3 V

1.5/3.3,3.3 V

Grid Array, Very Thin Profile, Fine Pitch

BGA80,9X9,20

Other Converters

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B80

0.039 in (1 mm)

0.197 in (5 mm)

No

0.197 in (5 mm)

Binary

TLV320DAC23GQE

Texas Instruments

Digital to Analog converter

Commercial

Ball

80

VFBGA

Square

Plastic/Epoxy

Yes

1

32

8 mA

Serial

3.3 V

1.5/3.3,3.3 V

Grid Array, Very Thin Profile, Fine Pitch

BGA80,9X9,20

Other Converters

0.02 in (0.5 mm)

70 °C (158 °F)

-10 °C (14 °F)

Tin Lead

Bottom

S-PBGA-B80

2A

0.039 in (1 mm)

0.197 in (5 mm)

No

e0

20 s

235 °C (455 °F)

0.197 in (5 mm)

Binary

TLV5610IYE

Texas Instruments

Digital to Analog converter

Industrial

Ball

20

VFBGA

Rectangular

Plastic/Epoxy

2.9 V

Yes

1

CMOS

12

7 µs

21 mA

0.1465 %

Serial

3 V

3/5 V

Grid Array, Very Thin Profile, Fine Pitch

WAFER

Other Converters

3 µs

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

R-PBGA-B20

0.028 in (0.715 mm)

0.075 in (1.91 mm)

No

e1

0 V

0.123 in (3.118 mm)

Binary, 2's Complement Binary

PDAC37J84IAAV

Texas Instruments

Digital to Analog converter

Industrial

Ball

144

HBGA

Square

Plastic/Epoxy

.6 V

Yes

1

16

Serial

3.3 V

Grid Array, Heat Sink/Slug

10 ns

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B144

0.076 in (1.94 mm)

0.394 in (10 mm)

-.5 V

0.394 in (10 mm)

Binary

DAC12DL3200ACF

Texas Instruments

Digital to Analog converter

Ball

256

Square

Plastic/Epoxy

2.3 V

Yes

1

12

40 mA

0.02197 %

Parallel, Word

1.8 V

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B256

3

e1

260 °C (500 °F)

1.3 V

2's Complement Binary

TLV5608IYER

Texas Instruments

Digital to Analog converter

Industrial

Ball

20

VFBGA

Rectangular

Plastic/Epoxy

2.9 V

Yes

1

CMOS

10

7 µs

21 mA

0.1953 %

Serial

3 V

3/5 V

Grid Array, Very Thin Profile, Fine Pitch

WAFER

Other Converters

3 µs

85 °C (185 °F)

-40 °C (-40 °F)

Bottom

R-PBGA-B20

0.028 in (0.715 mm)

0.075 in (1.91 mm)

No

0 V

0.123 in (3.118 mm)

Binary, 2's Complement Binary

DAC38RF87IAAVR

Texas Instruments

Digital to Analog converter

Industrial

Ball

144

FBGA

Square

Plastic/Epoxy

2.3 V

Yes

6200 MHz

1

14

1.758 A

Parallel, Word

1.8 V

-1.8 V

Grid Array, Fine Pitch

1 ns

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B144

3

0.076 in (1.94 mm)

0.394 in (10 mm)

e1

30 s

260 °C (500 °F)

1.3 V

0.394 in (10 mm)

Offset Binary, 2's Complement Binary

DAC5670IGDJ

Texas Instruments

Digital to Analog converter

Industrial

Ball

252

HBGA

Square

Plastic/Epoxy

4.1 V

Yes

1

14

650 mA

0.0458 %

Parallel, Word

3.3 V

3.3 V

Grid Array, Heat Sink/Slug

BGA252,16X16,40

Other Converters

3.5 ns

0.039 in (1 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B252

4

0.08 in (2.02 mm)

0.669 in (17 mm)

No

e0

30 s

260 °C (500 °F)

2.5 V

0.669 in (17 mm)

Complementary Binary

TLV5610IYZT

Texas Instruments

Digital to Analog converter

Industrial

Ball

20

BGA

Rectangular

5.1 V

Yes

1

CMOS

12

7 µs

21 mA

0.1465 %

Serial

3 V

3/5 V

Grid Array

WAFER

Other Converters

3 µs

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

R-XBGA-B20

0.075 in (1.91 mm)

No

e1

0 V

0.123 in (3.118 mm)

Binary, 2's Complement Binary

PDAC38RF89AAV

Texas Instruments

Digital to Analog converter

Industrial

Ball

144

FBGA

Square

Plastic/Epoxy

2.3 V

Yes

1

14

Parallel, Word

1.8 V

-1.8 V

Grid Array, Fine Pitch

1 ns

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B144

0.076 in (1.94 mm)

0.394 in (10 mm)

1.3 V

0.394 in (10 mm)

Offset Binary, 2's Complement Binary

TLV320DAC23GQER

Texas Instruments

Digital to Analog converter

Commercial

Ball

80

VFBGA

Square

Plastic/Epoxy

Yes

1

32

Serial

3.3 V

1.5/3.3,3.3 V

Grid Array, Very Thin Profile, Fine Pitch

BGA80,9X9,20

Other Converters

0.02 in (0.5 mm)

70 °C (158 °F)

-10 °C (14 °F)

Bottom

S-PBGA-B80

0.039 in (1 mm)

0.197 in (5 mm)

No

0.197 in (5 mm)

Binary

DAC38RF84IAAV

Texas Instruments

Digital to Analog converter

Industrial

Ball

144

FBGA

Square

Plastic/Epoxy

2.3 V

Yes

9000 MHz

1

14

1.758 A

Parallel, Word

1.8 V

-1.8 V

Grid Array, Fine Pitch

1 ns

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B144

3

0.076 in (1.94 mm)

0.394 in (10 mm)

e1

30 s

260 °C (500 °F)

1.3 V

0.394 in (10 mm)

Offset Binary, 2's Complement Binary

DAC38RF83IAAV

Texas Instruments

Digital to Analog converter

Industrial

Ball

144

FBGA

Square

Plastic/Epoxy

2.3 V

Yes

9000 MHz

1

14

1.758 A

Parallel, Word

1.8 V

-1.8 V

Grid Array, Fine Pitch

1 ns

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B144

3

0.076 in (1.94 mm)

0.394 in (10 mm)

e1

30 s

260 °C (500 °F)

1.3 V

0.394 in (10 mm)

Offset Binary, 2's Complement Binary

AD5379ABC

Analog Devices

Digital to Analog converter

Industrial

Ball

108

BGA

Square

Plastic/Epoxy

14.5 V

Yes

1

CMOS

14

30 µs

0.0183 %

Serial, Parallel, Word

12 V

3/5,11.4/16.5 V

-12 V

Grid Array

BGA108,12X12,40

Other Converters

20 µs

0.039 in (1 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B108

3

0.073 in (1.85 mm)

0.512 in (13 mm)

No

e0

240 °C (464 °F)

-1 V

0.512 in (13 mm)

Binary

AD9162BBCARL

Analog Devices

Digital to Analog converter

Industrial

Ball

169

VFBGA

Square

Plastic/Epoxy

Yes

1

16

Serial, Parallel, Word

1.2 V

-1.2 V

Grid Array, Very Thin Profile, Fine Pitch

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B169

3

0.037 in (0.95 mm)

0.433 in (11 mm)

e0

20 s

225 °C (437 °F)

0.433 in (11 mm)

2's Complement

Digital-to-Analog Converters

Digital-to-analog converters (DACs) are electronic devices that convert digital signals into analog signals with a specific voltage or current output. They play a critical role in many electronic systems, converting digital data into analog signals that can be used to control actuators, motors, and other devices.

DACs work by sampling the digital signal at regular intervals and converting each sample into an analog signal with a specific voltage or current output. The accuracy and resolution of the DAC determine the quality of the analog signal, with higher resolution and accuracy leading to a more precise output signal.

DACs can be classified based on their architecture and their application. The most common types of DACs are binary-weighted DACs, R-2R ladder DACs, and sigma-delta DACs. Each type has its advantages and limitations, depending on the application and the required performance.

DACs are used in a wide range of applications, from audio equipment and video systems, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of digital data into analog signals, allowing the control and manipulation of physical systems based on digital signals.