Ball Digital-to-Analog Converters 270

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Part RoHS Manufacturer Converter Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Maximum Analog Output Voltage No. of Analog In Channels Surface Mount Maximum Supply Voltage Maximum Analog Input Voltage Sample Rate No. of Functions Technology Screening Level No. of Bits Maximum Settling Time Maximum Supply Current Maximum Linearity Error (EL) Input Format Nominal Supply Voltage Output Bit Code Power Supplies (V) Nominal Negative Supply Voltage Package Style (Meter) Package Equivalence Code Sub-Category Nominal Settling Time (tstl) Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Minimum Analog Input Voltage Output Format Minimum Operating Temperature Terminal Finish Sample and Hold/Track and Hold Terminal Position JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Minimum Analog Output Voltage Length Input Bit Code

AD9736BBCRL

Analog Devices

Digital to Analog converter

Industrial

Ball

160

LFBGA

Square

1 V

Yes

1

CMOS

14

0.0342 %

Serial

1.8 V

1.8,3.3 V

Grid Array, Low Profile, Fine Pitch

BGA160,14X14,32

Other Converters

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead Silver

Bottom

S-XBGA-B160

4

0.055 in (1.4 mm)

0.472 in (12 mm)

No

e0

240 °C (464 °F)

-1 V

0.472 in (12 mm)

Binary, 2's Complement Binary

AD9148BBCZ-1-RL7

Analog Devices

Digital to Analog converter

Industrial

Ball

196

LFBGA

Square

Plastic/Epoxy

1 V

Yes

1

16

Serial

3.3 V

Grid Array, Low Profile, Fine Pitch

20 ns

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B196

0.051 in (1.3 mm)

0.472 in (12 mm)

-1 V

0.472 in (12 mm)

Binary, 2's Complement Binary

AD9734BBCRL

Analog Devices

Digital to Analog converter

Industrial

Ball

160

LFBGA

Square

1 V

Yes

1

CMOS

10

0.0488 %

Serial

1.8 V

1.8,3.3 V

Grid Array, Low Profile, Fine Pitch

BGA160,14X14,32

Other Converters

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead Silver

Bottom

S-XBGA-B160

4

0.055 in (1.4 mm)

0.472 in (12 mm)

No

e0

240 °C (464 °F)

-1 V

0.472 in (12 mm)

Binary, 2's Complement Binary

AD5532ABC-1REEL

Analog Devices

Digital to Analog converter

Industrial

Ball

74

LBGA

Square

Plastic/Epoxy

14.5 V

Yes

1

14

0.39 %

Serial

10 V

Grid Array, Low Profile

22 µs

0.039 in (1 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B74

3

0.067 in (1.7 mm)

0.472 in (12 mm)

No

e0

240 °C (464 °F)

-14.5 V

0.472 in (12 mm)

Binary

AD5668BCBZ-3-RL7

Analog Devices

Digital to Analog converter

Industrial

Ball

16

VFBGA

Square

Plastic/Epoxy

5.5 V

Yes

1

CMOS

16

0.0244 %

Serial

3 V

Grid Array, Very Thin Profile, Fine Pitch

2.5 µs

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B16

1

0.026 in (0.65 mm)

0.103 in (2.605 mm)

e1

30 s

260 °C (500 °F)

0 V

0.103 in (2.605 mm)

Binary

AD5517ABC-3

Analog Devices

Digital to Analog converter

Industrial

Ball

74

LBGA

Square

Plastic/Epoxy

10 V

Yes

1

14

0.0488 %

Serial

5 V

Grid Array, Low Profile

0.039 in (1 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B74

0.067 in (1.7 mm)

0.472 in (12 mm)

No

e0

-10 V

0.472 in (12 mm)

Binary

AD5384BBC-3

Analog Devices

Digital to Analog converter

Industrial

Ball

100

LFBGA

Square

Plastic/Epoxy

3.6 V

Yes

1

CMOS

14

10 µs

0.0244 %

Serial

3 V

3/3.3,3/5 V

Grid Array, Low Profile, Fine Pitch

BGA100,12X12,32

Other Converters

8 µs

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead Silver

Bottom

S-PBGA-B100

3

0.055 in (1.4 mm)

0.394 in (10 mm)

No

e0

240 °C (464 °F)

0 V

0.394 in (10 mm)

Binary

AD5770RBCBZ-RL7

Analog Devices

Digital to Analog converter

Industrial

Ball

49

VFBGA

Square

Plastic/Epoxy

Yes

1

14

0.0397 %

Serial

Grid Array, Very Thin Profile, Fine Pitch

13 µs

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B49

1

0.026 in (0.66 mm)

0.159 in (4.04 mm)

260 °C (500 °F)

0.159 in (4.04 mm)

Binary

AD5532ABC-1

Analog Devices

Digital to Analog converter

Industrial

Ball

74

LBGA

Square

Plastic/Epoxy

14.5 V

Yes

1

14

0.39 %

Serial

10 V

Grid Array, Low Profile

22 µs

0.039 in (1 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B74

3

0.067 in (1.7 mm)

0.472 in (12 mm)

No

e0

240 °C (464 °F)

-14.5 V

0.472 in (12 mm)

Binary

AD9789BBC

Analog Devices

Digital to Analog converter

Industrial

Ball

164

LFBGA

Square

Plastic/Epoxy

1 V

Yes

1

CMOS

14

556 mA

Parallel, Word

3.3 V

1.5,1.8,3.3 V

Grid Array, Low Profile, Fine Pitch

BGA164,14X14,32

Other Converters

13 ns

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B164

1

0.051 in (1.3 mm)

0.472 in (12 mm)

No

-1 V

0.472 in (12 mm)

Binary, 2's Complement Binary

AD5592RBCBZ-1-RL7

Analog Devices

Digital to Analog Converter 12 bit

Ball

16

VFBGA

Square

Plastic/Epoxy

5 V

Yes

1

12

2.7 mA

0.0244 %

Serial

3 V

Grid Array, Very Thin Profile, Fine Pitch

BGA16,4X4,20

6 µs

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B16

1

0.025 in (0.64 mm)

0.077 in (1.96 mm)

e1

30 s

260 °C (500 °F)

0 V

0.077 in (1.96 mm)

Binary

AD5535ABCZ

Analog Devices

Digital to Analog converter

Other

Ball

124

LBGA

Square

215 V

Yes

1

14

Serial

5 V

3/5,5 V

-5 V

Grid Array, Low Profile

BGA124,14X14,40

Other Converters

10 µs

0.039 in (1 mm)

85 °C (185 °F)

-10 °C (14 °F)

Tin Silver Copper

Bottom

S-XBGA-B124

3

0.067 in (1.7 mm)

0.591 in (15 mm)

No

e1

260 °C (500 °F)

2.5 V

0.591 in (15 mm)

Binary

MAX5857EXE+T

Analog Devices

Digital to Analog converter

Industrial

Ball

144

LFBGA

Square

Plastic/Epoxy

2.2 V

Yes

1

16

270 mA

0.0045 %

Serial

1 V

Grid Array, Low Profile, Fine Pitch

bga144,12X12,32

20 ns

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B144

0.05 in (1.265 mm)

0.394 in (10 mm)

1.8 V

0.394 in (10 mm)

Binary, 2's Complement Binary

MAX5112GWX+T

Analog Devices

Digital to Analog converter

Automotive

Ball

36

VFBGA

Square

Plastic/Epoxy

2.3 V

Yes

1

14

600 μA

0.0488 %

Serial

3 V

Grid Array, Very Thin Profile, Fine Pitch

BGA36,6X6,20

15 µs

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B36

1

0.027 in (0.69 mm)

0.121 in (3.065 mm)

e1

30 s

260 °C (500 °F)

0 V

0.121 in (3.065 mm)

Binary

MAX5715AWC+T

Analog Devices

Digital to Analog converter

Automotive

Ball

12

FBGA

Rectangular

Plastic/Epoxy

Yes

4

BICMOS

12

1.5 mA

0.024 %

3/5 V

Grid Array, Fine Pitch

BGA12,3X4,20

Other Converters

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Tin Silver Copper Nickel

Bottom

R-PBGA-B12

1

No

e2

30 s

260 °C (500 °F)

Offset Binary

MAX5855EXE+T

Analog Devices

Digital to Analog converter

Industrial

Ball

144

LFBGA

Square

Plastic/Epoxy

2.2 V

Yes

1

16

270 mA

Serial

1 V

Grid Array, Low Profile, Fine Pitch

bga144,12X12,32

20 ns

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B144

0.05 in (1.265 mm)

0.394 in (10 mm)

1.4 V

0.394 in (10 mm)

Offset Binary

MAX5113GWX+T

Analog Devices

Digital to Analog converter

Industrial

Ball

36

VFBGA

Square

Plastic/Epoxy

2.3 V

Yes

1

14

600 μA

0.0061 %

Serial

3 V

-5.2 V

Grid Array, Very Thin Profile, Fine Pitch

BGA36,6X6,20

15 µs

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B36

1

0.027 in (0.69 mm)

0.121 in (3.065 mm)

e1

30 s

260 °C (500 °F)

0 V

0.121 in (3.065 mm)

Binary

MAX5879EXF+

Analog Devices

Digital to Analog converter

Industrial

Ball

256

LBGA

Square

Plastic/Epoxy

Yes

1

14

Parallel, Word

3.3 V

Grid Array, Low Profile

26 ns

0.039 in (1 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B256

0.067 in (1.7 mm)

0.669 in (17 mm)

0.669 in (17 mm)

Offset Binary

MAX5832GWX+T

Analog Devices

Digital to Analog converter

Ball

36

VFBGA

Square

Plastic/Epoxy

3.3 V

Yes

1

BICMOS

14

600 μA

0.06103 %

Serial

3 V

-5.25 V

Grid Array, Very Thin Profile, Fine Pitch

BGA36,6X6,20

15 µs

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B36

0.027 in (0.69 mm)

0.121 in (3.065 mm)

-3.75 V

0.121 in (3.065 mm)

Binary

MAX5725AWP+T

Analog Devices

Digital to Analog converter

Automotive

Ball

20

FBGA

Rectangular

Plastic/Epoxy

Yes

8

BICMOS

12

2.5 mA

0.024 %

3/5 V

Grid Array, Fine Pitch

BGA20,4X5,20

Other Converters

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Tin Silver Copper Nickel

Bottom

R-PBGA-B20

1

No

e2

30 s

260 °C (500 °F)

Offset Binary

MAX5868EXE+

Analog Devices

Digital to Analog converter

Industrial

Ball

144

LFBGA

Square

Plastic/Epoxy

2.2 V

Yes

1

CMOS

16

280 mA

Parallel, Word

1 V

Grid Array, Low Profile, Fine Pitch

BGA144,12X12,31

41 ns

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B144

3

0.059 in (1.5 mm)

0.394 in (10 mm)

e1

30 s

260 °C (500 °F)

1.4 V

0.394 in (10 mm)

Offset Binary, 2's Complement Binary

MAX19693EXW+D

Analog Devices

Digital to Analog converter

Industrial

Ball

169

LFBGA

Square

Plastic/Epoxy

Yes

1

12

Parallel, Word

1.8 V

Grid Array, Low Profile, Fine Pitch

4.5 ns

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B169

3

0.059 in (1.5 mm)

0.433 in (11 mm)

0.433 in (11 mm)

Offset Binary

MAX5725AWP+

Analog Devices

Digital to Analog converter

Automotive

Ball

20

FBGA

Rectangular

Plastic/Epoxy

Yes

8

BICMOS

12

2.5 mA

0.024 %

3/5 V

Grid Array, Fine Pitch

BGA20,4X5,20

Other Converters

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Tin Silver Copper Nickel

Bottom

R-PBGA-B20

1

No

e2

30 s

260 °C (500 °F)

Offset Binary

MAX5869EXE+

Analog Devices

Digital to Analog converter

Industrial

Ball

144

LFBGA

Square

Plastic/Epoxy

2.2 V

Yes

1

16

345 mA

Serial

1 V

Grid Array, Low Profile, Fine Pitch

bga144,12X12,32

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B144

0.05 in (1.265 mm)

0.394 in (10 mm)

30 s

260 °C (500 °F)

1.4 V

0.394 in (10 mm)

Offset Binary

MAX5815AWC+T

Analog Devices

Digital to Analog converter

Automotive

Ball

12

FBGA

Rectangular

Plastic/Epoxy

Yes

1

BICMOS

12

1.4 mA

0.024 %

3/5 V

Grid Array, Fine Pitch

BGA12,3X4,20

Other Converters

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Tin Silver Copper Nickel

Bottom

R-PBGA-B12

1

No

e2

30 s

260 °C (500 °F)

Binary

MAX19692EXW-D

Analog Devices

Digital to Analog converter

Industrial

Ball

169

LFBGA

Square

Plastic/Epoxy

Yes

1

12

Parallel, Word

1.8 V

Grid Array, Low Profile, Fine Pitch

4.5 ns

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B169

3

0.059 in (1.5 mm)

0.433 in (11 mm)

0.433 in (11 mm)

Offset Binary

MAX5113GWX+

Analog Devices

Digital to Analog converter

Industrial

Ball

36

VFBGA

Square

Plastic/Epoxy

2.3 V

Yes

1

14

600 μA

0.0061 %

Serial

3 V

-5.2 V

Grid Array, Very Thin Profile, Fine Pitch

BGA36,6X6,20

15 µs

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B36

1

0.027 in (0.69 mm)

0.121 in (3.065 mm)

e1

30 s

260 °C (500 °F)

0 V

0.121 in (3.065 mm)

Binary

MAX5824AWP+T

Analog Devices

Digital to Analog converter

Ball

20

VFBGA

Rectangular

Plastic/Epoxy

5.5 V

Yes

1

BICMOS

10

2.5 mA

0.0488 %

Serial

3 V

Grid Array, Very Thin Profile, Fine Pitch

BGA20,4X5,20

4.5 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Bottom

R-PBGA-B20

1

0.027 in (0.69 mm)

0.099 in (2.505 mm)

0 V

0.1 in (2.55 mm)

Binary

MAX5855EXE+

Analog Devices

Digital to Analog converter

Industrial

Ball

144

LFBGA

Square

Plastic/Epoxy

2.2 V

Yes

1

16

270 mA

Serial

1 V

Grid Array, Low Profile, Fine Pitch

bga144,12X12,32

20 ns

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B144

0.05 in (1.265 mm)

0.394 in (10 mm)

1.4 V

0.394 in (10 mm)

Offset Binary

MAX19693EXW-D

Analog Devices

Digital to Analog converter

Industrial

Ball

169

LFBGA

Square

Plastic/Epoxy

Yes

1

12

Parallel, Word

1.8 V

Grid Array, Low Profile, Fine Pitch

4.5 ns

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B169

3

0.059 in (1.5 mm)

0.433 in (11 mm)

e0

20 s

240 °C (464 °F)

0.433 in (11 mm)

Offset Binary

MAX5823AWP+

Analog Devices

Digital to Analog converter

Automotive

Ball

20

VFBGA

Rectangular

Plastic/Epoxy

5.5 V

Yes

1

BICMOS

8

2.5 mA

0.09765 %

Serial

3 V

Grid Array, Very Thin Profile, Fine Pitch

BGA20,4X5,20

2.2 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Tin Silver Copper Nickel

Bottom

R-PBGA-B20

1

0.027 in (0.69 mm)

0.089 in (2.255 mm)

e2

30 s

260 °C (500 °F)

0 V

0.099 in (2.505 mm)

Binary

MAX5857EXE+

Analog Devices

Digital to Analog converter

Industrial

Ball

144

LFBGA

Square

Plastic/Epoxy

2.2 V

Yes

1

16

270 mA

0.0045 %

Serial

1 V

Grid Array, Low Profile, Fine Pitch

bga144,12X12,32

20 ns

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B144

0.05 in (1.265 mm)

0.394 in (10 mm)

1.8 V

0.394 in (10 mm)

Binary, 2's Complement Binary

MAX5825AWP+

Analog Devices

Digital to Analog converter

Automotive

Ball

20

FBGA

Rectangular

Plastic/Epoxy

Yes

8

BICMOS

12

2.5 mA

0.024 %

3/5 V

Grid Array, Fine Pitch

BGA20,4X5,20

Other Converters

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Tin Silver Copper Nickel

Bottom

R-PBGA-B20

1

No

e2

30 s

260 °C (500 °F)

Binary

MAX5871EXE+T

Analog Devices

Digital to Analog converter

Ball

144

LFBGA

Square

Plastic/Epoxy

2.2 V

Yes

1

16

345 mA

0.004577 %

Serial

1 V

Grid Array, Low Profile, Fine Pitch

bga144,12X12,32

20 ns

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B144

0.05 in (1.265 mm)

0.394 in (10 mm)

1.4 V

0.394 in (10 mm)

Offset Binary

MAX5823AWP+T

Analog Devices

Digital to Analog converter

Automotive

Ball

20

VFBGA

Rectangular

Plastic/Epoxy

5.5 V

Yes

1

BICMOS

8

2.5 mA

0.09765 %

Serial

3 V

Grid Array, Very Thin Profile, Fine Pitch

BGA20,4X5,20

2.2 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Tin Silver Copper Nickel

Bottom

R-PBGA-B20

1

0.027 in (0.69 mm)

0.089 in (2.255 mm)

e2

30 s

260 °C (500 °F)

0 V

0.099 in (2.505 mm)

Binary

MAX5882EXF+D

Analog Devices

Digital to Analog converter

Industrial

Ball

256

LBGA

Square

Plastic/Epoxy

Yes

1

14

360 mA

Parallel, Word

3.3 V

Grid Array, Low Profile

BGA256,16X16,39

1 ns

0.039 in (1 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B256

0.067 in (1.7 mm)

0.669 in (17 mm)

0.669 in (17 mm)

Offset Binary

MAX19692EXW+D

Analog Devices

Digital to Analog converter

Ball

169

LFBGA

Square

Plastic/Epoxy

Yes

1

BICMOS

12

117 mA

0.031738 %

Parallel, Word

3.3 V

Grid Array, Low Profile, Fine Pitch

BGA169,13X13,32

4.5 ns

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B169

0.059 in (1.5 mm)

0.433 in (11 mm)

30 s

260 °C (500 °F)

0.433 in (11 mm)

Offset Binary

MAX5871EXE+

Analog Devices

Digital to Analog converter

Industrial

Ball

144

LFBGA

Square

Plastic/Epoxy

2.2 V

Yes

1

16

345 mA

Serial

1 V

Grid Array, Low Profile, Fine Pitch

bga144,12X12,32

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B144

0.05 in (1.265 mm)

0.394 in (10 mm)

1.4 V

0.394 in (10 mm)

Offset Binary

MAX5715AWC+

Analog Devices

Digital to Analog converter

Automotive

Ball

12

FBGA

Rectangular

Plastic/Epoxy

Yes

4

BICMOS

12

1.5 mA

0.024 %

3/5 V

Grid Array, Fine Pitch

BGA12,3X4,20

Other Converters

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Tin Silver Copper Nickel

Bottom

R-PBGA-B12

1

No

e2

30 s

260 °C (500 °F)

Offset Binary

AD5379ABC

Analog Devices

Digital to Analog converter

Industrial

Ball

108

BGA

Square

Plastic/Epoxy

14.5 V

Yes

1

CMOS

14

30 µs

0.0183 %

Serial, Parallel, Word

12 V

3/5,11.4/16.5 V

-12 V

Grid Array

BGA108,12X12,40

Other Converters

20 µs

0.039 in (1 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B108

3

0.073 in (1.85 mm)

0.512 in (13 mm)

No

e0

240 °C (464 °F)

-1 V

0.512 in (13 mm)

Binary

AD9162BBCARL

Analog Devices

Digital to Analog converter

Industrial

Ball

169

VFBGA

Square

Plastic/Epoxy

Yes

1

16

Serial, Parallel, Word

1.2 V

-1.2 V

Grid Array, Very Thin Profile, Fine Pitch

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B169

3

0.037 in (0.95 mm)

0.433 in (11 mm)

e0

20 s

225 °C (437 °F)

0.433 in (11 mm)

2's Complement

AD5516ABCZ-2

Analog Devices

Digital to Analog converter

Industrial

Ball

74

LBGA

Square

Plastic/Epoxy

5 V

Yes

1

14

0.0122 %

Serial

5 V

Grid Array, Low Profile

0.039 in (1 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B74

3

0.067 in (1.7 mm)

0.472 in (12 mm)

No

e1

260 °C (500 °F)

-5 V

0.472 in (12 mm)

Binary

AD5664RBCBZ-3-RL7

Analog Devices

Digital to Analog converter

Industrial

Ball

12

VFBGA

Rectangular

Plastic/Epoxy

Yes

1

CMOS

12

0.0244 %

Serial

3 V

Grid Array, Very Thin Profile, Fine Pitch

4 µs

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

R-PBGA-B12

1

0.026 in (0.65 mm)

0.066 in (1.665 mm)

e1

30 s

260 °C (500 °F)

0.088 in (2.245 mm)

Binary

AD5532ABCZ-1

Analog Devices

Digital to Analog converter

Industrial

Ball

74

LBGA

Square

Plastic/Epoxy

14.5 V

Yes

1

14

0.39 %

Serial

10 V

Grid Array, Low Profile

22 µs

0.039 in (1 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B74

3

0.067 in (1.7 mm)

0.472 in (12 mm)

No

e1

30 s

260 °C (500 °F)

-14.5 V

0.472 in (12 mm)

Binary

AD5532ABC-3REEL

Analog Devices

Digital to Analog converter

Industrial

Ball

74

LBGA

Square

Plastic/Epoxy

14.5 V

Yes

1

14

0.39 %

Serial

10 V

Grid Array, Low Profile

22 µs

0.039 in (1 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B74

3

0.067 in (1.7 mm)

0.472 in (12 mm)

No

e0

240 °C (464 °F)

-14.5 V

0.472 in (12 mm)

Binary

AD9739BBC

Analog Devices

Digital to Analog converter

Industrial

Ball

160

LFBGA

Square

Plastic/Epoxy

1 V

Yes

1

CMOS

14

238 mA

Serial, Parallel, Word

3.3 V

1.8,3.3 V

Grid Array, Low Profile, Fine Pitch

BGA160,14X14,32

Other Converters

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead Silver

Bottom

S-PBGA-B160

3

0.055 in (1.4 mm)

0.472 in (12 mm)

No

e0

240 °C (464 °F)

-1 V

0.472 in (12 mm)

Binary

AD5532ABCZ-2

Analog Devices

Digital to Analog converter

Industrial

Ball

74

LBGA

Square

Plastic/Epoxy

14.5 V

Yes

1

14

0.39 %

Serial

10 V

Grid Array, Low Profile

30 µs

0.039 in (1 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B74

3

0.067 in (1.7 mm)

0.472 in (12 mm)

No

e1

30 s

260 °C (500 °F)

-14.5 V

0.472 in (12 mm)

Binary

AD9739BBCRL

Analog Devices

Digital to Analog converter

Industrial

Ball

160

LFBGA

Square

Plastic/Epoxy

1 V

Yes

1

CMOS

14

238 mA

Serial, Parallel, Word

3.3 V

1.8,3.3 V

Grid Array, Low Profile, Fine Pitch

BGA160,14X14,32

Other Converters

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead Silver

Bottom

S-PBGA-B160

3

0.055 in (1.4 mm)

0.472 in (12 mm)

No

e0

240 °C (464 °F)

-1 V

0.472 in (12 mm)

Binary

Digital-to-Analog Converters

Digital-to-analog converters (DACs) are electronic devices that convert digital signals into analog signals with a specific voltage or current output. They play a critical role in many electronic systems, converting digital data into analog signals that can be used to control actuators, motors, and other devices.

DACs work by sampling the digital signal at regular intervals and converting each sample into an analog signal with a specific voltage or current output. The accuracy and resolution of the DAC determine the quality of the analog signal, with higher resolution and accuracy leading to a more precise output signal.

DACs can be classified based on their architecture and their application. The most common types of DACs are binary-weighted DACs, R-2R ladder DACs, and sigma-delta DACs. Each type has its advantages and limitations, depending on the application and the required performance.

DACs are used in a wide range of applications, from audio equipment and video systems, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of digital data into analog signals, allowing the control and manipulation of physical systems based on digital signals.