TFBGA Latches & Flip-Flops 60

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Part	Manufacturer	Logic IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Maximum Frequency At Nominal Supply	Technology	No. of Bits	Packing Method	Nominal Supply Voltage / Vsup (V)	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Propagation Delay (tpd)	Maximum I (ol)	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Output Characteristics	Trigger Type	Minimum Operating Temperature	Terminal Finish	Terminal Position	Minimum fmax	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Supply Voltage (Vsup)	Maximum Seated Height	Width	Qualification	Output Polarity	Minimum Supply Voltage (Vsup)	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Family
74SSTUB32865AZJBR	Texas Instruments	D FLIP-FLOP	INDUSTRIAL	BALL	160	TFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	410000000 Hz	TTL	28	TR	1.8	1.8	GRID ARRAY, THIN PROFILE, FINE PITCH	BGA160,12X18,25	3 ns	12 Amp	Other Logic ICs	.65 mm	85 Cel	OPEN-DRAIN	POSITIVE EDGE	-40 Cel	TIN SILVER COPPER	BOTTOM	410 MHz	R-PBGA-B160	3	1.9 V	1.2 mm	9 mm	Not Qualified	TRUE	1.7 V	e1	30	260	13 mm	SSTU
74SSTUB32865ZJBR	Texas Instruments	D FLIP-FLOP	INDUSTRIAL	BALL	160	TFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		TTL	28		1.8	1.8	GRID ARRAY, THIN PROFILE, FINE PITCH	BGA160,12X18,25	3 ns		Other Logic ICs	.65 mm	85 Cel	OPEN-DRAIN	POSITIVE EDGE	-40 Cel	TIN SILVER COPPER	BOTTOM	410 MHz	R-PBGA-B160	3	1.9 V	1.2 mm	9 mm	Not Qualified	TRUE	1.7 V	e1	30	260	13 mm	SSTU
74SSTUB32868ZRHR	Texas Instruments	D FLIP-FLOP	INDUSTRIAL	BALL	176	TFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	410000000 Hz	TTL	28	TR	1.8	1.8	GRID ARRAY, THIN PROFILE, FINE PITCH	BGA176,8X22,25	3 ns	8 Amp	Other Logic ICs	.65 mm	85 Cel		POSITIVE EDGE	-40 Cel	TIN SILVER COPPER	BOTTOM	410 MHz	R-PBGA-B176	3	1.9 V	1.2 mm	6 mm	Not Qualified	TRUE	1.7 V	e1	30	260	15 mm	SSTU
74SSTUB32868AZRHR	Texas Instruments	D FLIP-FLOP	INDUSTRIAL	BALL	176	TFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	410000000 Hz	TTL	28	TR	1.8	1.8	GRID ARRAY, THIN PROFILE, FINE PITCH	BGA176,8X22,25	3 ns	12 Amp	Other Logic ICs	.65 mm	85 Cel	OPEN-DRAIN	POSITIVE EDGE	-40 Cel	TIN SILVER COPPER	BOTTOM	410 MHz	R-PBGA-B176	3	1.9 V	1.2 mm	6 mm	Not Qualified	TRUE	1.7 V	e1	30	260	15 mm	SSTU
SSTU32865ET,518	NXP Semiconductors	D FLIP-FLOP	COMMERCIAL	BALL	160	TFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			28		1.8		GRID ARRAY, THIN PROFILE, FINE PITCH		2.15 ns			.65 mm	70 Cel	OPEN-DRAIN	POSITIVE EDGE	0 Cel		BOTTOM	270 MHz	R-PBGA-B160		1.9 V	1.2 mm	9 mm	Not Qualified	TRUE	1.7 V				13 mm	SSTU
SSTUB32868ET/S-T	NXP Semiconductors	D FLIP-FLOP	COMMERCIAL EXTENDED	BALL	176	TFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			28		1.8		GRID ARRAY, THIN PROFILE, FINE PITCH		3 ns			.65 mm	85 Cel		POSITIVE EDGE	0 Cel		BOTTOM	450 MHz	R-PBGA-B176		2 V	1.15 mm	6 mm	Not Qualified	TRUE	1.7 V				15 mm	32868
SSTUM32868ET/S	NXP Semiconductors	D FLIP-FLOP	COMMERCIAL EXTENDED	BALL	176	TFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS	28		1.8	1.8	GRID ARRAY, THIN PROFILE, FINE PITCH	BGA176,8X22,25	1.5 ns		Other Logic ICs	.65 mm	85 Cel	OPEN-DRAIN	POSITIVE EDGE	0 Cel		BOTTOM	450 MHz	R-PBGA-B176	2	2 V	1.15 mm	6 mm	Not Qualified	COMPLEMENTARY	1.7 V				15 mm	32868
SSTU32865ET,551	NXP Semiconductors	D FLIP-FLOP	COMMERCIAL	BALL	160	TFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			28		1.8		GRID ARRAY, THIN PROFILE, FINE PITCH		2.15 ns			.65 mm	70 Cel	OPEN-DRAIN	POSITIVE EDGE	0 Cel		BOTTOM	270 MHz	R-PBGA-B160		1.9 V	1.2 mm	9 mm	Not Qualified	TRUE	1.7 V				13 mm	SSTU
SSTUG32868ET/S	NXP Semiconductors	D FLIP-FLOP	COMMERCIAL EXTENDED	BALL	176	TFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS	28		1.8		GRID ARRAY, THIN PROFILE, FINE PITCH		1.5 ns			.65 mm	85 Cel	OPEN-DRAIN	POSITIVE EDGE	0 Cel		BOTTOM	450 MHz	R-PBGA-B176	2	2 V	1.15 mm	6 mm	Not Qualified	COMPLEMENTARY	1.7 V		40	260	15 mm	32868
SSTUG32868ET/S,518	NXP Semiconductors	D FLIP-FLOP	OTHER	BALL	176	TFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS	28		1.8		GRID ARRAY, THIN PROFILE, FINE PITCH		1.5 ns			.65 mm	85 Cel	OPEN-DRAIN	POSITIVE EDGE	0 Cel		BOTTOM	450 MHz	R-PBGA-B176	2	2 V	1.15 mm	6 mm	Not Qualified	COMPLEMENTARY	1.7 V				15 mm	32868
SSTUB32865ET/G	NXP Semiconductors	D FLIP-FLOP	COMMERCIAL	BALL	160	TFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS	28		1.8	1.8	GRID ARRAY, THIN PROFILE, FINE PITCH	BGA160,12X18,25	1.5 ns		Other Logic ICs	.65 mm	70 Cel	OPEN-DRAIN	POSITIVE EDGE	0 Cel		BOTTOM	450 MHz	R-PBGA-B160	2	2 V	1.15 mm	9 mm	Not Qualified	COMPLEMENTARY	1.7 V				13 mm	32865
SSTUG32865ET/S,518	NXP Semiconductors	D FLIP-FLOP	OTHER	BALL	160	TFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			28		1.8		GRID ARRAY, THIN PROFILE, FINE PITCH		1.4 ns			.65 mm	85 Cel	OPEN-DRAIN	POSITIVE EDGE	0 Cel		BOTTOM	550 MHz	R-PBGA-B160	2	2 V	1.15 mm	9 mm	Not Qualified	TRUE	1.7 V				13 mm	SSTU
SSTUM32868ET/G	NXP Semiconductors	D FLIP-FLOP	COMMERCIAL	BALL	176	TFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS	28		1.8	1.8	GRID ARRAY, THIN PROFILE, FINE PITCH	BGA176,8X22,25	1.5 ns		Other Logic ICs	.65 mm	70 Cel	OPEN-DRAIN	POSITIVE EDGE	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	450 MHz	R-PBGA-B176		2 V	1.15 mm	6 mm	Not Qualified	COMPLEMENTARY	1.7 V	e1			15 mm	32868
SSTUB32868ET/G	NXP Semiconductors	D FLIP-FLOP	COMMERCIAL	BALL	176	TFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			28		1.8	1.8	GRID ARRAY, THIN PROFILE, FINE PITCH	BGA176,8X22,25	3 ns		Other Logic ICs	.65 mm	70 Cel		POSITIVE EDGE	0 Cel		BOTTOM	450 MHz	R-PBGA-B176		2 V	1.15 mm	6 mm	Not Qualified	TRUE	1.7 V				15 mm	32868
SSTU32865ET/G,518	NXP Semiconductors	D FLIP-FLOP	COMMERCIAL	BALL	160	TFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			28		1.8		GRID ARRAY, THIN PROFILE, FINE PITCH		2.15 ns			.65 mm	70 Cel	OPEN-DRAIN	POSITIVE EDGE	0 Cel		BOTTOM	270 MHz	R-PBGA-B160	2	1.9 V	1.2 mm	9 mm	Not Qualified	TRUE	1.7 V				13 mm	SSTU
SSTUA32S865ET,551	NXP Semiconductors	D FLIP-FLOP	COMMERCIAL	BALL	160	TFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			28		1.8		GRID ARRAY, THIN PROFILE, FINE PITCH		1.8 ns			.65 mm	70 Cel	OPEN-DRAIN	POSITIVE EDGE	0 Cel		BOTTOM	450 MHz	R-PBGA-B160		2 V	1.2 mm	9 mm	Not Qualified	TRUE	1.7 V				13 mm	SSTU
SSTU32865ET/G	NXP Semiconductors	D FLIP-FLOP	COMMERCIAL	BALL	160	TFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS	28		1.8	1.8	GRID ARRAY, THIN PROFILE, FINE PITCH	BGA160,12X18,25	2.15 ns		Other Logic ICs	.65 mm	70 Cel	OPEN-DRAIN	POSITIVE EDGE	0 Cel		BOTTOM	270 MHz	R-PBGA-B160	2	1.9 V	1.2 mm	9 mm	Not Qualified	TRUE	1.7 V				13 mm	SSTU
SSTUA32S865ET/G	NXP Semiconductors	D FLIP-FLOP	COMMERCIAL	BALL	160	TFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS	28		1.8	1.8	GRID ARRAY, THIN PROFILE, FINE PITCH	BGA160,12X18,25	1.8 ns		Other Logic ICs	.65 mm	70 Cel	OPEN-DRAIN	POSITIVE EDGE	0 Cel		BOTTOM	450 MHz	R-PBGA-B160	2	2 V	1.2 mm	9 mm	Not Qualified	TRUE	1.7 V				13 mm	SSTU
SSTUM32865ET/S	NXP Semiconductors	D FLIP-FLOP	OTHER	BALL	160	TFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			28		1.8	1.8	GRID ARRAY, THIN PROFILE, FINE PITCH	BGA160,12X18,25	1.4 ns		Other Logic ICs	.65 mm	85 Cel	OPEN-DRAIN	POSITIVE EDGE	0 Cel		BOTTOM	450 MHz	R-PBGA-B160	2	2 V	1.15 mm	9 mm	Not Qualified	TRUE	1.7 V				13 mm	SSTU
SSTUA32S865ET,557	NXP Semiconductors	D FLIP-FLOP	COMMERCIAL	BALL	160	TFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS	28		1.8	1.8	GRID ARRAY, THIN PROFILE, FINE PITCH	BGA160,12X18,25	1.8 ns		Other Logic ICs	.65 mm	70 Cel	OPEN-DRAIN	POSITIVE EDGE	0 Cel	TIN LEAD	BOTTOM	450 MHz	R-PBGA-B160		2 V	1.2 mm	9 mm	Not Qualified	TRUE	1.7 V	e0			13 mm	SSTU
SSTUB32868ET/G,518	NXP Semiconductors	D FLIP-FLOP	COMMERCIAL	BALL	176	TFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			28		1.8		GRID ARRAY, THIN PROFILE, FINE PITCH		3 ns			.65 mm	70 Cel		POSITIVE EDGE	0 Cel		BOTTOM	450 MHz	R-PBGA-B176		2 V	1.15 mm	6 mm	Not Qualified	TRUE	1.7 V				15 mm	32868
SSTU32865ET,557	NXP Semiconductors	D FLIP-FLOP	COMMERCIAL	BALL	160	TFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS	28		1.8	1.8	GRID ARRAY, THIN PROFILE, FINE PITCH	BGA160,12X18,25	2.15 ns		Other Logic ICs	.65 mm	70 Cel	OPEN-DRAIN	POSITIVE EDGE	0 Cel	TIN LEAD	BOTTOM	270 MHz	R-PBGA-B160	2	1.9 V	1.2 mm	9 mm	Not Qualified	TRUE	1.7 V	e0			13 mm	SSTU
SSTUH32865ET/G,551	NXP Semiconductors	D FLIP-FLOP	COMMERCIAL	BALL	160	TFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS	28		1.8		GRID ARRAY, THIN PROFILE, FINE PITCH		1.8 ns			.65 mm	70 Cel	OPEN-DRAIN	POSITIVE EDGE	0 Cel		BOTTOM	450 MHz	R-PBGA-B160	2	1.9 V	1.2 mm	9 mm	Not Qualified	COMPLEMENTARY	1.7 V				13 mm	SSTU
SSTUM32865ET/S,518	NXP Semiconductors	D FLIP-FLOP	OTHER	BALL	160	TFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			28		1.8		GRID ARRAY, THIN PROFILE, FINE PITCH		1.4 ns			.65 mm	85 Cel	OPEN-DRAIN	POSITIVE EDGE	0 Cel		BOTTOM	450 MHz	R-PBGA-B160	2	2 V	1.15 mm	9 mm	Not Qualified	TRUE	1.7 V				13 mm	SSTU
SSTUB32868ET/S,518	NXP Semiconductors	D FLIP-FLOP	COMMERCIAL EXTENDED	BALL	176	TFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			28		1.8	1.8	GRID ARRAY, THIN PROFILE, FINE PITCH	BGA176,8X22,25	3 ns		Other Logic ICs	.65 mm	85 Cel		POSITIVE EDGE	0 Cel		BOTTOM	450 MHz	R-PBGA-B176	2	2 V	1.15 mm	6 mm	Not Qualified	TRUE	1.7 V				15 mm	32868
SSTUG32865ET/G,518	NXP Semiconductors	D FLIP-FLOP	COMMERCIAL	BALL	160	TFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			28		1.8		GRID ARRAY, THIN PROFILE, FINE PITCH		1.4 ns			.65 mm	70 Cel	OPEN-DRAIN	POSITIVE EDGE	0 Cel		BOTTOM	550 MHz	R-PBGA-B160	2	2 V	1.15 mm	9 mm	Not Qualified	TRUE	1.7 V				13 mm	SSTU
SSTUM32865ET/G	NXP Semiconductors	D FLIP-FLOP	COMMERCIAL	BALL	160	TFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			28		1.8	1.8	GRID ARRAY, THIN PROFILE, FINE PITCH	BGA160,12X18,25	1.4 ns		Other Logic ICs	.65 mm	70 Cel	OPEN-DRAIN	POSITIVE EDGE	0 Cel		BOTTOM	450 MHz	R-PBGA-B160	2	2 V	1.15 mm	9 mm	Not Qualified	TRUE	1.7 V				13 mm	SSTU
SSTUB32865ET/S	NXP Semiconductors	D FLIP-FLOP	COMMERCIAL EXTENDED	BALL	160	TFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS	28		1.8	1.8	GRID ARRAY, THIN PROFILE, FINE PITCH	BGA160,12X18,25	1.5 ns		Other Logic ICs	.65 mm	85 Cel	OPEN-DRAIN	POSITIVE EDGE	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	450 MHz	R-PBGA-B160		2 V	1.15 mm	9 mm	Not Qualified	COMPLEMENTARY	1.7 V	e1			13 mm	32865
SSTUM32868ET,518	NXP Semiconductors	D FLIP-FLOP	COMMERCIAL	BALL	176	TFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS	28		1.8		GRID ARRAY, THIN PROFILE, FINE PITCH		1.5 ns			.65 mm	70 Cel	OPEN-DRAIN	POSITIVE EDGE	0 Cel	TIN SILVER COPPER	BOTTOM	450 MHz	R-PBGA-B176		2 V	1.15 mm	6 mm	Not Qualified	COMPLEMENTARY	1.7 V	e1			15 mm	32868
SSTUH32865ET,518	NXP Semiconductors	D FLIP-FLOP	COMMERCIAL	BALL	160	TFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS	28		1.8		GRID ARRAY, THIN PROFILE, FINE PITCH		1.8 ns			.65 mm	70 Cel	OPEN-DRAIN	POSITIVE EDGE	0 Cel		BOTTOM	450 MHz	R-PBGA-B160		1.9 V	1.2 mm	9 mm	Not Qualified	COMPLEMENTARY	1.7 V				13 mm	SSTU
SSTUA32S865ET/G,55	NXP Semiconductors	D FLIP-FLOP	COMMERCIAL	BALL	160	TFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS	28		1.8	1.8	GRID ARRAY, THIN PROFILE, FINE PITCH	BGA160,12X18,25	1.8 ns		Other Logic ICs	.65 mm	70 Cel	OPEN-DRAIN	POSITIVE EDGE	0 Cel		BOTTOM	450 MHz	R-PBGA-B160	2	2 V	1.2 mm	9 mm	Not Qualified	TRUE	1.7 V				13 mm	SSTU
SSTUA32S865ET/G,51	NXP Semiconductors	D FLIP-FLOP	COMMERCIAL	BALL	160	TFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			28		1.8		GRID ARRAY, THIN PROFILE, FINE PITCH		1.8 ns			.65 mm	70 Cel	OPEN-DRAIN	POSITIVE EDGE	0 Cel		BOTTOM	450 MHz	R-PBGA-B160	2	2 V	1.2 mm	9 mm	Not Qualified	TRUE	1.7 V				13 mm	SSTU
SSTUH32865ET/G	NXP Semiconductors	D FLIP-FLOP	COMMERCIAL	BALL	160	TFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS	28		1.8	1.8	GRID ARRAY, THIN PROFILE, FINE PITCH	BGA160,12X18,25	1.8 ns		Other Logic ICs	.65 mm	70 Cel	OPEN-DRAIN	POSITIVE EDGE	0 Cel		BOTTOM	450 MHz	R-PBGA-B160	2	1.9 V	1.2 mm	9 mm	Not Qualified	COMPLEMENTARY	1.7 V				13 mm	SSTU
SSTU32865ET/G,557	NXP Semiconductors	D FLIP-FLOP	COMMERCIAL	BALL	160	TFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS	28		1.8	1.8	GRID ARRAY, THIN PROFILE, FINE PITCH	BGA160,12X18,25	2.15 ns		Other Logic ICs	.65 mm	70 Cel	OPEN-DRAIN	POSITIVE EDGE	0 Cel		BOTTOM	270 MHz	R-PBGA-B160	2	1.9 V	1.2 mm	9 mm	Not Qualified	TRUE	1.7 V				13 mm	SSTU
SSTU32865ET	NXP Semiconductors	D FLIP-FLOP	COMMERCIAL	BALL	160	TFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS	28		1.8	1.8	GRID ARRAY, THIN PROFILE, FINE PITCH	BGA160,12X18,25	2.15 ns		Other Logic ICs	.65 mm	70 Cel	OPEN-DRAIN	POSITIVE EDGE	0 Cel	TIN LEAD	BOTTOM	270 MHz	R-PBGA-B160		1.9 V	1.2 mm	9 mm	Not Qualified	TRUE	1.7 V	e0			13 mm	SSTU
SSTUG32868ET/G	NXP Semiconductors	D FLIP-FLOP	COMMERCIAL	BALL	176	TFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS	28		1.8		GRID ARRAY, THIN PROFILE, FINE PITCH		1.5 ns			.65 mm	70 Cel	OPEN-DRAIN	POSITIVE EDGE	0 Cel		BOTTOM	450 MHz	R-PBGA-B176	2	2 V	1.15 mm	6 mm	Not Qualified	COMPLEMENTARY	1.7 V		40	260	15 mm	32868
SSTUM32868ET/S,518	NXP Semiconductors	D FLIP-FLOP	OTHER	BALL	176	TFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS	28		1.8		GRID ARRAY, THIN PROFILE, FINE PITCH		1.5 ns			.65 mm	85 Cel	OPEN-DRAIN	POSITIVE EDGE	0 Cel		BOTTOM	450 MHz	R-PBGA-B176	2	2 V	1.15 mm	6 mm	Not Qualified	COMPLEMENTARY	1.7 V				15 mm	32868
SSTUH32865ET/G,518	NXP Semiconductors	D FLIP-FLOP	COMMERCIAL	BALL	160	TFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS	28		1.8		GRID ARRAY, THIN PROFILE, FINE PITCH		1.8 ns			.65 mm	70 Cel	OPEN-DRAIN	POSITIVE EDGE	0 Cel		BOTTOM	450 MHz	R-PBGA-B160	2	1.9 V	1.2 mm	9 mm	Not Qualified	COMPLEMENTARY	1.7 V				13 mm	SSTU
SSTUH32865ET	NXP Semiconductors	D FLIP-FLOP	COMMERCIAL	BALL	160	TFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS	28		1.8	1.8	GRID ARRAY, THIN PROFILE, FINE PITCH	BGA160,12X18,25	1.8 ns		Other Logic ICs	.65 mm	70 Cel	OPEN-DRAIN	POSITIVE EDGE	0 Cel	TIN LEAD	BOTTOM	450 MHz	R-PBGA-B160		1.9 V	1.2 mm	9 mm	Not Qualified	COMPLEMENTARY	1.7 V	e0			13 mm	SSTU
SSTUG32868ET/G,518	NXP Semiconductors	D FLIP-FLOP	COMMERCIAL	BALL	176	TFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS	28		1.8		GRID ARRAY, THIN PROFILE, FINE PITCH		1.5 ns			.65 mm	70 Cel	OPEN-DRAIN	POSITIVE EDGE	0 Cel		BOTTOM	450 MHz	R-PBGA-B176	2	2 V	1.15 mm	6 mm	Not Qualified	COMPLEMENTARY	1.7 V				15 mm	32868
SSTUB32868ET/S	NXP Semiconductors	D FLIP-FLOP	OTHER	BALL	176	TFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			28		1.8	1.8	GRID ARRAY, THIN PROFILE, FINE PITCH	BGA176,8X22,25	3 ns		Other Logic ICs	.65 mm	85 Cel		POSITIVE EDGE	0 Cel		BOTTOM	450 MHz	R-PBGA-B176	2	2 V	1.15 mm	6 mm	Not Qualified	TRUE	1.7 V				15 mm	32868
SSTUM32865ET/G,518	NXP Semiconductors	D FLIP-FLOP	COMMERCIAL	BALL	160	TFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			28		1.8		GRID ARRAY, THIN PROFILE, FINE PITCH		1.4 ns			.65 mm	70 Cel	OPEN-DRAIN	POSITIVE EDGE	0 Cel		BOTTOM	450 MHz	R-PBGA-B160	2	2 V	1.15 mm	9 mm	Not Qualified	TRUE	1.7 V				13 mm	SSTU
SSTUG32865ET/G	NXP Semiconductors	D FLIP-FLOP	COMMERCIAL	BALL	160	TFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			28		1.8		GRID ARRAY, THIN PROFILE, FINE PITCH		1.4 ns			.65 mm	70 Cel	OPEN-DRAIN	POSITIVE EDGE	0 Cel		BOTTOM	550 MHz	R-PBGA-B160	2	2 V	1.15 mm	9 mm	Not Qualified	TRUE	1.7 V		40	260	13 mm	SSTU
SSTUH32865ET,557	NXP Semiconductors	D FLIP-FLOP	COMMERCIAL	BALL	160	TFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS	28		1.8	1.8	GRID ARRAY, THIN PROFILE, FINE PITCH	BGA160,12X18,25	1.8 ns		Other Logic ICs	.65 mm	70 Cel	OPEN-DRAIN	POSITIVE EDGE	0 Cel	TIN LEAD	BOTTOM	450 MHz	R-PBGA-B160	2	1.9 V	1.2 mm	9 mm	Not Qualified	COMPLEMENTARY	1.7 V	e0			13 mm	SSTU
SSTUA32S865ET,518	NXP Semiconductors	D FLIP-FLOP	COMMERCIAL	BALL	160	TFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			28		1.8		GRID ARRAY, THIN PROFILE, FINE PITCH		1.8 ns			.65 mm	70 Cel	OPEN-DRAIN	POSITIVE EDGE	0 Cel		BOTTOM	450 MHz	R-PBGA-B160		2 V	1.2 mm	9 mm	Not Qualified	TRUE	1.7 V				13 mm	SSTU
SSTU32865ET/G,551	NXP Semiconductors	D FLIP-FLOP	COMMERCIAL	BALL	160	TFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			28		1.8		GRID ARRAY, THIN PROFILE, FINE PITCH		2.15 ns			.65 mm	70 Cel	OPEN-DRAIN	POSITIVE EDGE	0 Cel		BOTTOM	270 MHz	R-PBGA-B160	2	1.9 V	1.2 mm	9 mm	Not Qualified	TRUE	1.7 V				13 mm	SSTU
SSTUH32865ET/G,557	NXP Semiconductors	D FLIP-FLOP	COMMERCIAL	BALL	160	TFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS	28		1.8	1.8	GRID ARRAY, THIN PROFILE, FINE PITCH	BGA160,12X18,25	1.8 ns		Other Logic ICs	.65 mm	70 Cel	OPEN-DRAIN	POSITIVE EDGE	0 Cel		BOTTOM	450 MHz	R-PBGA-B160	2	1.9 V	1.2 mm	9 mm	Not Qualified	COMPLEMENTARY	1.7 V				13 mm	SSTU
SSTUG32865ET/S	NXP Semiconductors	D FLIP-FLOP	OTHER	BALL	160	TFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1			28		1.8		GRID ARRAY, THIN PROFILE, FINE PITCH		1.4 ns			.65 mm	85 Cel	OPEN-DRAIN	POSITIVE EDGE	0 Cel		BOTTOM	550 MHz	R-PBGA-B160	2	2 V	1.15 mm	9 mm	Not Qualified	TRUE	1.7 V		40	260	13 mm	SSTU

Latches & Flip-Flops

Latches and flip-flops are two types of electronic circuits used in digital systems to store and manipulate digital data. They are both sequential logic circuits, meaning that they can store information and use that information to make decisions based on the previous state.

A latch is a type of digital circuit that can hold or "latch" a signal in its current state. It is a simple memory element that can store a single bit of information. A latch can be transparent or opaque, depending on its behavior when the clock signal is active. A transparent latch passes the input signal through to the output when the clock signal is active, while an opaque latch holds the input signal at the output when the clock signal is active.

Flip-flops are similar to latches but are more sophisticated and have additional control inputs. A flip-flop is a digital circuit that can store one bit of information and change its state based on the clock signal and input signals. Flip-flops can be edge-triggered or level-triggered, depending on how they respond to the clock signal. Edge-triggered flip-flops change their state at the rising or falling edge of the clock signal, while level-triggered flip-flops change their state continuously as long as the clock signal is active.

Flip-flops are classified into various types based on their behavior and the number of inputs. Some of the commonly used flip-flops include D flip-flops, JK flip-flops, T flip-flops, and SR flip-flops. D flip-flops have a single data input and a clock input and can store one bit of information. JK flip-flops have two inputs, J and K, and can store one bit of information. T flip-flops have a single input and can toggle between two states based on the clock signal. SR flip-flops have two inputs, S and R, and can store one bit of information.

Latches and flip-flops are used in various applications, including digital signal processing, memory systems, and control circuits. They are essential components of digital systems and can be found in many electronic devices, such as computers, mobile phones, and digital cameras.