FBGA DRAM 2,400+

Reset All
Part RoHS Manufacturer Memory IC Type Temperature Grade No. of Terminals Package Code Refresh Cycles Package Shape Package Body Material Access Mode Surface Mount No. of Functions Technology Screening Level Nominal Negative Supply Voltage Terminal Form Parallel or Serial Operating Mode Maximum Supply Current No. of Words Sequential Burst Length Self Refresh Input/Output Type Nominal Supply Voltage / Vsup (V) Mixed Memory Type Power Supplies (V) Memory Width Package Style (Meter) Package Equivalence Code Alternate Memory Width Sub-Category Terminal Pitch Maximum Operating Temperature Reverse Pinout Output Characteristics Organization No. of Words Code Minimum Standby Voltage Minimum Operating Temperature Terminal Finish Terminal Position No. of Ports JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Supply Voltage (Vsup) Maximum Seated Height Maximum Clock Frequency (fCLK) Width Qualification Memory Density Minimum Supply Voltage (Vsup) Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Maximum Standby Current Interleaved Burst Length Length Maximum Access Time

K4B8G1646Q-MCMAT

Samsung

DDR3 DRAM

OTHER

96

FBGA

8192

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

280 mA

8

COMMON

1.5

1.5

GRID ARRAY, FINE PITCH

BGA96,9X16,32

DRAMs

.8 mm

85 Cel

3-STATE

0 Cel

BOTTOM

R-PBGA-B96

933 MHz

Not Qualified

8589934592 bit

.03 Amp

8

.195 ns

K4V1G323PC-XGC3T

Samsung

DDR1 DRAM

OTHER

152

FBGA

8192

SQUARE

PLASTIC/EPOXY

YES

CMOS

BALL

150 mA

33554432 words

2,4,8,16

COMMON

1.8

1.8

32

GRID ARRAY, FINE PITCH

BGA152,21X21,25

DRAMs

.635 mm

85 Cel

3-STATE

32MX32

32M

-25 Cel

MATTE TIN

BOTTOM

S-PBGA-B152

1

133 MHz

Not Qualified

1073741824 bit

e3

.0006 Amp

2,4,8,16

6 ns

K4M511533E-PF75

Samsung

SYNCHRONOUS DRAM

OTHER

54

FBGA

8192

SQUARE

PLASTIC/EPOXY

YES

CMOS

BALL

190 mA

33554432 words

1,2,4,8,FP

COMMON

3

3

16

GRID ARRAY, FINE PITCH

BGA54,9X9,32

DRAMs

.8 mm

70 Cel

3-STATE

32MX16

32M

-25 Cel

BOTTOM

S-PBGA-B54

3

133 MHz

Not Qualified

536870912 bit

260

.0015 Amp

1,2,4,8

5.4 ns

K4T1G164QD-ZCD5T

Samsung

DDR2 DRAM

84

FBGA

8192

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

245 mA

67108864 words

4,8

COMMON

1.8

1.8

16

GRID ARRAY, FINE PITCH

BGA84,9X15,32

DRAMs

.8 mm

3-STATE

64MX16

64M

BOTTOM

R-PBGA-B84

3

267 MHz

Not Qualified

1073741824 bit

260

.015 Amp

4,8

.5 ns

K4M64163PK-RG75

Samsung

SYNCHRONOUS DRAM

OTHER

54

FBGA

4096

SQUARE

PLASTIC/EPOXY

YES

CMOS

BALL

50 mA

4194304 words

1,2,4,8,FP

COMMON

1.8

1.8

16

GRID ARRAY, FINE PITCH

BGA54,9X9,32

DRAMs

.8 mm

85 Cel

3-STATE

4MX16

4M

-25 Cel

BOTTOM

S-PBGA-B54

1

133 MHz

Not Qualified

67108864 bit

.0003 Amp

1,2,4,8

6 ns

K4S51153PF-YF1L

Samsung

SYNCHRONOUS DRAM

OTHER

54

FBGA

8192

SQUARE

PLASTIC/EPOXY

YES

CMOS

BALL

95 mA

33554432 words

1,2,4,8,FP

COMMON

1.8

1.8

16

GRID ARRAY, FINE PITCH

BGA54,9X9,32

DRAMs

.8 mm

70 Cel

3-STATE

32MX16

32M

-25 Cel

TIN LEAD

BOTTOM

S-PBGA-B54

111 MHz

Not Qualified

536870912 bit

e0

.0006 Amp

1,2,4,8

7 ns

K4M563233E-MC1L

Samsung

SYNCHRONOUS DRAM

OTHER

90

FBGA

4096

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

290 mA

8388608 words

1,2,4,8,FP

COMMON

3/3.3

32

GRID ARRAY, FINE PITCH

BGA90,9X15,32

DRAMs

.8 mm

70 Cel

8MX32

8M

-25 Cel

Tin/Lead (Sn/Pb)

BOTTOM

R-PBGA-B90

105 MHz

Not Qualified

268435456 bit

e0

.0012 Amp

1,2,4,8

7 ns

K4T1G084QF-BIF7T

Samsung

DDR2 DRAM

60

FBGA

8192

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

160 mA

134217728 words

4,8

COMMON

1.8

1.8

8

GRID ARRAY, FINE PITCH

BGA60,9X11,32

DRAMs

.8 mm

3-STATE

128MX8

128M

BOTTOM

R-PBGA-B60

400 MHz

Not Qualified

1073741824 bit

260

4,8

.4 ns

K4M56323LG-FG75T

Samsung

SYNCHRONOUS DRAM

OTHER

90

FBGA

4096

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

160 mA

8388608 words

1,2,4,8,FP

COMMON

2.5

2.5

32

GRID ARRAY, FINE PITCH

BGA90,9X15,32

DRAMs

.8 mm

85 Cel

8MX32

8M

-25 Cel

BOTTOM

R-PBGA-B90

1

133 MHz

Not Qualified

268435456 bit

.001 Amp

1,2,4,8

5.4 ns

K4T51083QG-HCF8

Samsung

CACHE DRAM MODULE

OTHER

60

FBGA

8192

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

210 mA

67108864 words

4,8

COMMON

1.8

1.8

8

GRID ARRAY, FINE PITCH

BGA60,9X11,32

DRAMs

.8 mm

95 Cel

3-STATE

64MX8

64M

0 Cel

MATTE TIN

BOTTOM

R-PBGA-B60

1

533 MHz

Not Qualified

536870912 bit

e3

260

.008 Amp

4,8

.35 ns

K4S56163LF-ZF1L

Samsung

SYNCHRONOUS DRAM

OTHER

54

FBGA

8192

SQUARE

PLASTIC/EPOXY

YES

CMOS

BALL

150 mA

16777216 words

1,2,4,8,FP

COMMON

1.8/2.5,2.5

16

GRID ARRAY, FINE PITCH

BGA54,9X9,32

DRAMs

.8 mm

70 Cel

3-STATE

16MX16

16M

-25 Cel

BOTTOM

S-PBGA-B54

105 MHz

Not Qualified

268435456 bit

.0005 Amp

1,2,4,8

7 ns

K4M28323LH-FN60T

Samsung

SYNCHRONOUS DRAM

OTHER

90

FBGA

4096

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

140 mA

4194304 words

1,2,4,8,FP

COMMON

2.5

2.5

32

GRID ARRAY, FINE PITCH

BGA90,9X15,32

DRAMs

.8 mm

85 Cel

3-STATE

4MX32

4M

-25 Cel

BOTTOM

R-PBGA-B90

166 MHz

Not Qualified

134217728 bit

.0005 Amp

1,2,4,8

5.4 ns

K4M563233G-FF75T

Samsung

SYNCHRONOUS DRAM

OTHER

90

FBGA

4096

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

160 mA

8388608 words

1,2,4,8,FP

COMMON

3/3.3

32

GRID ARRAY, FINE PITCH

BGA90,9X15,32

DRAMs

.8 mm

70 Cel

8MX32

8M

-25 Cel

BOTTOM

R-PBGA-B90

1

133 MHz

Not Qualified

268435456 bit

.001 Amp

1,2,4,8

5.4 ns

K4T51083QB-GCCC

Samsung

DDR2 DRAM

OTHER

60

FBGA

8192

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

67108864 words

4,8

COMMON

1.8

1.8

8

GRID ARRAY, FINE PITCH

BGA60,9X11,32

DRAMs

.8 mm

95 Cel

3-STATE

64MX8

64M

0 Cel

TIN LEAD

BOTTOM

R-PBGA-B60

3

200 MHz

Not Qualified

536870912 bit

e0

240

.008 Amp

4,8

.6 ns

K4M64163LK-BG1HT

Samsung

SYNCHRONOUS DRAM

OTHER

54

FBGA

4096

SQUARE

PLASTIC/EPOXY

YES

CMOS

BALL

110 mA

4194304 words

1,2,4,8,FP

COMMON

2.5

2.5

16

GRID ARRAY, FINE PITCH

BGA54,9X9,32

DRAMs

.8 mm

85 Cel

3-STATE

4MX16

4M

-25 Cel

BOTTOM

S-PBGA-B54

111 MHz

Not Qualified

67108864 bit

.0005 Amp

1,2,4,8

7 ns

K4S56163LF-ZL75

Samsung

SYNCHRONOUS DRAM

OTHER

54

FBGA

8192

SQUARE

PLASTIC/EPOXY

YES

CMOS

BALL

165 mA

16777216 words

1,2,4,8,FP

COMMON

1.8/2.5,2.5

16

GRID ARRAY, FINE PITCH

BGA54,9X9,32

DRAMs

.8 mm

70 Cel

3-STATE

16MX16

16M

-25 Cel

BOTTOM

S-PBGA-B54

133 MHz

Not Qualified

268435456 bit

.0005 Amp

1,2,4,8

5.4 ns

K4M641633K-BL1LT

Samsung

SYNCHRONOUS DRAM

OTHER

54

FBGA

4096

SQUARE

PLASTIC/EPOXY

YES

CMOS

BALL

100 mA

4194304 words

1,2,4,8,FP

COMMON

3/3.3

16

GRID ARRAY, FINE PITCH

BGA54,9X9,32

DRAMs

.8 mm

70 Cel

3-STATE

4MX16

4M

-25 Cel

MATTE TIN

BOTTOM

S-PBGA-B54

1

111 MHz

Not Qualified

67108864 bit

e3

.0005 Amp

1,2,4,8

7 ns

K4M51323PC-SF1L

Samsung

SYNCHRONOUS DRAM

OTHER

90

FBGA

8192

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

150 mA

16777216 words

1,2,4,8,FP

COMMON

1.8

1.8

32

GRID ARRAY, FINE PITCH

BGA90,9X15,32

DRAMs

.8 mm

70 Cel

3-STATE

16MX32

16M

-25 Cel

BOTTOM

R-PBGA-B90

1

111 MHz

Not Qualified

536870912 bit

.0003 Amp

1,2,4,8

7 ns

K4S511533F-YF1H

Samsung

SYNCHRONOUS DRAM

OTHER

54

FBGA

8192

SQUARE

PLASTIC/EPOXY

YES

CMOS

BALL

150 mA

33554432 words

1,2,4,8,FP

COMMON

3/3.3

16

GRID ARRAY, FINE PITCH

BGA54,9X9,32

DRAMs

.8 mm

70 Cel

3-STATE

32MX16

32M

-25 Cel

Tin/Lead (Sn/Pb)

BOTTOM

S-PBGA-B54

111 MHz

Not Qualified

536870912 bit

e0

.001 Amp

1,2,4,8

7 ns

K4M281633F-RF1H

Samsung

SYNCHRONOUS DRAM

OTHER

54

FBGA

4096

SQUARE

PLASTIC/EPOXY

YES

CMOS

BALL

170 mA

8388608 words

1,2,4,8,FP

COMMON

3/3.3

16

GRID ARRAY, FINE PITCH

BGA54,9X9,32

DRAMs

.8 mm

70 Cel

3-STATE

8MX16

8M

-25 Cel

Tin/Lead (Sn/Pb)

BOTTOM

S-PBGA-B54

105 MHz

Not Qualified

134217728 bit

e0

.0005 Amp

1,2,4,8

7 ns

K4M64163LK-BL75T

Samsung

SYNCHRONOUS DRAM

OTHER

54

FBGA

4096

SQUARE

PLASTIC/EPOXY

YES

CMOS

BALL

115 mA

4194304 words

1,2,4,8,FP

COMMON

2.5

2.5

16

GRID ARRAY, FINE PITCH

BGA54,9X9,32

DRAMs

.8 mm

70 Cel

3-STATE

4MX16

4M

-25 Cel

BOTTOM

S-PBGA-B54

133 MHz

Not Qualified

67108864 bit

.0005 Amp

1,2,4,8

5.4 ns

K4M56163LG-RL1HT

Samsung

SYNCHRONOUS DRAM

OTHER

54

FBGA

8192

SQUARE

PLASTIC/EPOXY

YES

CMOS

BALL

110 mA

16777216 words

1,2,4,8,FP

COMMON

2.5

2.5

16

GRID ARRAY, FINE PITCH

BGA54,9X9,32

DRAMs

.8 mm

70 Cel

3-STATE

16MX16

16M

-25 Cel

BOTTOM

S-PBGA-B54

1

111 MHz

Not Qualified

268435456 bit

.001 Amp

1,2,4,8

7 ns

K4M641633K-RN75

Samsung

SYNCHRONOUS DRAM

OTHER

54

FBGA

4096

SQUARE

PLASTIC/EPOXY

YES

CMOS

BALL

115 mA

4194304 words

1,2,4,8,FP

COMMON

3/3.3

16

GRID ARRAY, FINE PITCH

BGA54,9X9,32

DRAMs

.8 mm

85 Cel

3-STATE

4MX16

4M

-25 Cel

BOTTOM

S-PBGA-B54

1

133 MHz

Not Qualified

67108864 bit

.0005 Amp

1,2,4,8

5.4 ns

K4S64163LH-BN75

Samsung

SYNCHRONOUS DRAM

OTHER

54

FBGA

4096

SQUARE

PLASTIC/EPOXY

YES

CMOS

BALL

115 mA

4194304 words

1,2,4,8,FP

COMMON

1.8/2.5,2.5

16

GRID ARRAY, FINE PITCH

BGA54,9X9,32

DRAMs

.8 mm

85 Cel

3-STATE

4MX16

4M

-25 Cel

BOTTOM

S-PBGA-B54

133 MHz

Not Qualified

67108864 bit

.0005 Amp

1,2,4,8

5.4 ns

K4S56323LF-HE75

Samsung

SYNCHRONOUS DRAM

OTHER

90

FBGA

4096

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

180 mA

8388608 words

1,2,4,8,FP

COMMON

2.5

2.5

32

GRID ARRAY, FINE PITCH

BGA90,9X15,32

DRAMs

.8 mm

85 Cel

8MX32

8M

-25 Cel

BOTTOM

R-PBGA-B90

133 MHz

Not Qualified

268435456 bit

.0005 Amp

1,2,4,8

6 ns

K4B2G1646E-BIH90

Samsung

DDR3 DRAM

INDUSTRIAL

96

FBGA

8192

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

158 mA

134217728 words

8

COMMON

1.5

1.5

16

GRID ARRAY, FINE PITCH

BGA96,9X16,32

DRAMs

.8 mm

95 Cel

3-STATE

128MX16

128M

-40 Cel

BOTTOM

R-PBGA-B96

667 MHz

Not Qualified

2147483648 bit

.01 Amp

8

.255 ns

K4T51163QI-HLF7T

Samsung

DDR2 DRAM

OTHER

84

FBGA

8192

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

200 mA

33554432 words

4,8

COMMON

1.8

1.8

16

GRID ARRAY, FINE PITCH

BGA84,9X15,32

DRAMs

.8 mm

95 Cel

3-STATE

32MX16

32M

0 Cel

MATTE TIN

BOTTOM

R-PBGA-B84

1

400 MHz

Not Qualified

536870912 bit

e3

.008 Amp

4,8

.4 ns

K4X51163PC-FGC3

Samsung

DDR1 DRAM

OTHER

60

FBGA

8192

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

150 mA

33554432 words

2,4,8,16

COMMON

1.8

1.8

16

GRID ARRAY, FINE PITCH

BGA60,9X10,32

DRAMs

.8 mm

85 Cel

3-STATE

32MX16

32M

-25 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B60

3

133 MHz

Not Qualified

536870912 bit

e1

260

.0003 Amp

2,4,8,16

6 ns

K4T51083QC-ZLF7T

Samsung

DDR2 DRAM

OTHER

60

FBGA

8192

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

67108864 words

4,8

COMMON

1.8

1.8

8

GRID ARRAY, FINE PITCH

BGA60,9X11,32

DRAMs

.8 mm

95 Cel

3-STATE

64MX8

64M

0 Cel

BOTTOM

R-PBGA-B60

3

400 MHz

Not Qualified

536870912 bit

260

4,8

.4 ns

K4S513233F-MC1L

Samsung

SYNCHRONOUS DRAM

OTHER

90

FBGA

8192

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

240 mA

16777216 words

1,2,4,8,FP

COMMON

3/3.3

32

GRID ARRAY, FINE PITCH

BGA90,9X15,32

DRAMs

.8 mm

70 Cel

3-STATE

16MX32

16M

-25 Cel

Tin/Lead (Sn/Pb)

BOTTOM

R-PBGA-B90

111 MHz

Not Qualified

536870912 bit

e0

.001 Amp

1,2,4,8

7 ns

K4T51083QC-ZLD5T

Samsung

DDR2 DRAM

OTHER

60

FBGA

8192

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

180 mA

67108864 words

4,8

COMMON

1.8

1.8

8

GRID ARRAY, FINE PITCH

BGA60,9X11,32

DRAMs

.8 mm

95 Cel

3-STATE

64MX8

64M

0 Cel

BOTTOM

R-PBGA-B60

3

267 MHz

Not Qualified

536870912 bit

260

.0045 Amp

4,8

.5 ns

K4M51323PC-SC90

Samsung

SYNCHRONOUS DRAM

OTHER

90

FBGA

8192

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

150 mA

16777216 words

1,2,4,8,FP

COMMON

1.8

1.8

32

GRID ARRAY, FINE PITCH

BGA90,9X15,32

DRAMs

.8 mm

70 Cel

3-STATE

16MX32

16M

-25 Cel

BOTTOM

R-PBGA-B90

1

111 MHz

Not Qualified

536870912 bit

.0003 Amp

1,2,4,8

7 ns

K4M51323PC-DE90T

Samsung

SYNCHRONOUS DRAM

OTHER

90

FBGA

8192

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

150 mA

16777216 words

1,2,4,8,FP

COMMON

1.8

1.8

32

GRID ARRAY, FINE PITCH

BGA90,9X15,32

DRAMs

.8 mm

85 Cel

3-STATE

16MX32

16M

-25 Cel

MATTE TIN

BOTTOM

R-PBGA-B90

1

111 MHz

Not Qualified

536870912 bit

e3

.0003 Amp

1,2,4,8

7 ns

K4S64323LH-HG75

Samsung

SYNCHRONOUS DRAM

OTHER

90

FBGA

4096

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

115 mA

2097152 words

1,2,4,8,FP

COMMON

1.8/2.5,2.5

32

GRID ARRAY, FINE PITCH

BGA90,9X15,32

DRAMs

.8 mm

85 Cel

3-STATE

2MX32

2M

-25 Cel

BOTTOM

R-PBGA-B90

133 MHz

Not Qualified

67108864 bit

.0005 Amp

1,2,4,8

6 ns

K4J52324QH-HC14T

Samsung

CACHE DRAM MODULE

OTHER

136

FBGA

8192

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

750 mA

16777216 words

4,8

COMMON

1.8

1.8

32

GRID ARRAY, FINE PITCH

BGA136,12X17,32

DRAMs

.8 mm

85 Cel

3-STATE

16MX32

16M

0 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B136

3

700 MHz

Not Qualified

536870912 bit

e1

260

.07 Amp

4,8

.26 ns

K4S56163LF-XC1H

Samsung

SYNCHRONOUS DRAM

OTHER

54

FBGA

8192

SQUARE

PLASTIC/EPOXY

YES

CMOS

BALL

155 mA

16777216 words

1,2,4,8,FP

COMMON

1.8/2.5,2.5

16

GRID ARRAY, FINE PITCH

BGA54,9X9,32

DRAMs

.8 mm

70 Cel

3-STATE

16MX16

16M

-25 Cel

Tin/Lead (Sn/Pb)

BOTTOM

S-PBGA-B54

105 MHz

Not Qualified

268435456 bit

e0

.0005 Amp

1,2,4,8

7 ns

K4S51323PF-EF75

Samsung

SYNCHRONOUS DRAM

OTHER

90

FBGA

8192

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

170 mA

16777216 words

1,2,4,8,FP

COMMON

1.8

1.8

32

GRID ARRAY, FINE PITCH

BGA90,9X15,32

DRAMs

.8 mm

70 Cel

3-STATE

16MX32

16M

-25 Cel

BOTTOM

R-PBGA-B90

133 MHz

Not Qualified

536870912 bit

.0006 Amp

1,2,4,8

6 ns

K4M28163LH-BF75T

Samsung

SYNCHRONOUS DRAM

OTHER

54

FBGA

4096

SQUARE

PLASTIC/EPOXY

YES

CMOS

BALL

130 mA

8388608 words

1,2,4,8,FP

COMMON

2.5

2.5

16

GRID ARRAY, FINE PITCH

BGA54,9X9,32

DRAMs

.8 mm

70 Cel

3-STATE

8MX16

8M

-25 Cel

MATTE TIN

BOTTOM

S-PBGA-B54

1

133 MHz

Not Qualified

134217728 bit

e3

.0005 Amp

1,2,4,8

5.4 ns

K4M281633H-BL75T

Samsung

SYNCHRONOUS DRAM

OTHER

54

FBGA

4096

SQUARE

PLASTIC/EPOXY

YES

CMOS

BALL

70 mA

8388608 words

1,2,4,8,FP

COMMON

3/3.3

16

GRID ARRAY, FINE PITCH

BGA54,9X9,32

DRAMs

.8 mm

70 Cel

3-STATE

8MX16

8M

-25 Cel

MATTE TIN

BOTTOM

S-PBGA-B54

1

133 MHz

Not Qualified

134217728 bit

e3

.0005 Amp

1,2,4,8

5.4 ns

K4S64323LH-FC1L

Samsung

SYNCHRONOUS DRAM

OTHER

90

FBGA

4096

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

100 mA

2097152 words

1,2,4,8,FP

COMMON

1.8/2.5,2.5

32

GRID ARRAY, FINE PITCH

BGA90,9X15,32

DRAMs

.8 mm

70 Cel

3-STATE

2MX32

2M

-25 Cel

Tin/Lead (Sn/Pb)

BOTTOM

R-PBGA-B90

105 MHz

Not Qualified

67108864 bit

e0

.0005 Amp

1,2,4,8

7 ns

K4T1G084QD-ZLE6T

Samsung

DDR2 DRAM

60

FBGA

8192

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

240 mA

134217728 words

4,8

COMMON

1.8

1.8

8

GRID ARRAY, FINE PITCH

BGA60,9X11,32

DRAMs

.8 mm

3-STATE

128MX8

128M

BOTTOM

R-PBGA-B60

3

333 MHz

Not Qualified

1073741824 bit

260

4,8

.45 ns

K4T51163QQ-BCF8T

Samsung

DDR2 DRAM

OTHER

84

FBGA

8192

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

150 mA

33554432 words

4,8

COMMON

1.8

1.8

16

GRID ARRAY, FINE PITCH

BGA84,9X15,32

DRAMs

.8 mm

95 Cel

3-STATE

32MX16

32M

0 Cel

BOTTOM

R-PBGA-B84

533 MHz

Not Qualified

536870912 bit

.008 Amp

4,8

.35 ns

K4M28163PH-RC75

Samsung

SYNCHRONOUS DRAM

OTHER

54

FBGA

4096

SQUARE

PLASTIC/EPOXY

YES

CMOS

BALL

90 mA

8388608 words

1,2,4,8,FP

COMMON

1.8

1.8

16

GRID ARRAY, FINE PITCH

BGA54,9X9,32

DRAMs

.8 mm

70 Cel

3-STATE

8MX16

8M

-25 Cel

BOTTOM

S-PBGA-B54

1

133 MHz

Not Qualified

134217728 bit

.00001 Amp

1,2,4,8

6 ns

K4X51323PE-7EC3T

Samsung

DDR1 DRAM

OTHER

90

FBGA

8192

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

120 mA

16777216 words

2,4,8,16

COMMON

1.8

1.8

32

GRID ARRAY, FINE PITCH

BGA90,9X15,32

DRAMs

.8 mm

85 Cel

3-STATE

16MX32

16M

-25 Cel

BOTTOM

R-PBGA-B90

133 MHz

Not Qualified

536870912 bit

.0003 Amp

2,4,8,16

6 ns

K4M51163LC-RG1HT

Samsung

SYNCHRONOUS DRAM

OTHER

54

FBGA

8192

SQUARE

PLASTIC/EPOXY

YES

CMOS

BALL

180 mA

33554432 words

1,2,4,8,FP

COMMON

2.5

2.5

16

GRID ARRAY, FINE PITCH

BGA54,9X9,32

DRAMs

.8 mm

85 Cel

3-STATE

32MX16

32M

-25 Cel

BOTTOM

S-PBGA-B54

111 MHz

Not Qualified

536870912 bit

.001 Amp

1,2,4,8

7 ns

K4S563233F-FL60

Samsung

SYNCHRONOUS DRAM

OTHER

90

FBGA

4096

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

200 mA

8388608 words

1,2,4,8,FP

COMMON

3/3.3

32

GRID ARRAY, FINE PITCH

BGA90,9X15,32

DRAMs

.8 mm

70 Cel

8MX32

8M

-25 Cel

Tin/Lead (Sn/Pb)

BOTTOM

R-PBGA-B90

166 MHz

Not Qualified

268435456 bit

e0

.0005 Amp

1,2,4,8

5.4 ns

K4T51043QI-HCF7

Samsung

DDR2 DRAM

OTHER

60

FBGA

8192

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

124 mA

134217728 words

4,8

COMMON

1.8

1.8

4

GRID ARRAY, FINE PITCH

BGA60,9X11,32

DRAMs

.8 mm

95 Cel

3-STATE

128MX4

128M

0 Cel

MATTE TIN

BOTTOM

R-PBGA-B60

1

400 MHz

Not Qualified

536870912 bit

e3

260

.008 Amp

4,8

.4 ns

K4M281633F-RC75

Samsung

SYNCHRONOUS DRAM

OTHER

54

FBGA

4096

SQUARE

PLASTIC/EPOXY

YES

CMOS

BALL

170 mA

8388608 words

1,2,4,8,FP

COMMON

3/3.3

16

GRID ARRAY, FINE PITCH

BGA54,9X9,32

DRAMs

.8 mm

70 Cel

3-STATE

8MX16

8M

-25 Cel

Tin/Lead (Sn/Pb)

BOTTOM

S-PBGA-B54

133 MHz

Not Qualified

134217728 bit

e0

.0005 Amp

1,2,4,8

5.4 ns

DRAM

DRAM, or Dynamic Random Access Memory, is a type of volatile computer memory that stores data in a digital format. It is commonly used in personal computers, laptops, mobile devices, and other digital devices.

DRAM stores digital data as a charge on a capacitor. Each capacitor in DRAM represents one bit of data, and the state of the capacitor is refreshed periodically to maintain its charge. The refreshing process is necessary because the charge on the capacitor leaks over time, leading to data loss. The refreshing process is managed by a control circuitry that is integrated into the DRAM module.

DRAM is an important component of modern computer systems because it provides fast access to data for the processor. DRAM access times are measured in nanoseconds, which is much faster than access times for secondary storage devices like hard drives or solid-state drives. DRAM is also cheaper and more energy-efficient than other types of computer memory.

There are different types of DRAM, including SDRAM (Synchronous DRAM), DDR SDRAM (Double Data Rate Synchronous DRAM), and GDDR SDRAM (Graphics Double Data Rate Synchronous DRAM). These different types of DRAM have different characteristics, such as speed, capacity, and power consumption, and are used in different types of computer systems.

One of the disadvantages of DRAM is that it is volatile, which means that it loses data when the power is turned off. To prevent data loss, DRAM is typically used in conjunction with non-volatile storage devices like hard drives or solid-state drives, which can store data even when the power is turned off.