Part | RoHS | Manufacturer | Memory IC Type | Temperature Grade | No. of Terminals | Package Code | Refresh Cycles | Package Shape | Package Body Material | Access Mode | Surface Mount | No. of Functions | Technology | Screening Level | Nominal Negative Supply Voltage | Terminal Form | Parallel or Serial | Operating Mode | Maximum Supply Current | No. of Words | Sequential Burst Length | Self Refresh | Input/Output Type | Nominal Supply Voltage / Vsup (V) | Mixed Memory Type | Power Supplies (V) | Memory Width | Package Style (Meter) | Package Equivalence Code | Alternate Memory Width | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Reverse Pinout | Output Characteristics | Organization | No. of Words Code | Minimum Standby Voltage | Minimum Operating Temperature | Terminal Finish | Terminal Position | No. of Ports | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Maximum Clock Frequency (fCLK) | Width | Qualification | Memory Density | Minimum Supply Voltage (Vsup) | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Maximum Standby Current | Interleaved Burst Length | Length | Maximum Access Time |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Micron Technology |
SYNCHRONOUS DRAM MODULE |
COMMERCIAL |
144 |
DIMM |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
NO LEAD |
1080 mA |
8388608 words |
COMMON |
3.3 |
3.3 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM144,32 |
DRAMs |
.8 mm |
65 Cel |
3-STATE |
8MX64 |
8M |
0 Cel |
MATTE TIN |
DUAL |
R-PDMA-N144 |
1 |
25.527 mm |
125 MHz |
Not Qualified |
536870912 bit |
e3 |
.008 Amp |
6 ns |
||||||||||||||||||||||
Micron Technology |
DDR DRAM MODULE |
COMMERCIAL |
240 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
DUAL BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
268435456 words |
YES |
1.5 |
8 |
MICROELECTRONIC ASSEMBLY |
1 mm |
70 Cel |
256MX8 |
256M |
0 Cel |
DUAL |
1 |
R-XDMA-N240 |
1.575 V |
18 mm |
4 mm |
Not Qualified |
2147483648 bit |
1.425 V |
SELF CONTAINED REFRESH; WD-MAX |
133.35 mm |
||||||||||||||||||||||||||
|
Micron Technology |
DDR DRAM MODULE |
OTHER |
240 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
DUAL BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
536870912 words |
YES |
1.8 |
72 |
MICROELECTRONIC ASSEMBLY |
85 Cel |
512MX72 |
512M |
0 Cel |
GOLD |
DUAL |
1 |
R-XDMA-N240 |
1.9 V |
Not Qualified |
38654705664 bit |
1.7 V |
AUTO/SELF REFRESH |
e4 |
.45 ns |
||||||||||||||||||||||||||
Micron Technology |
RAMBUS DRAM MODULE |
184 |
DIMM |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
NO LEAD |
33554432 words |
COMMON |
1.8/2.5,2.5 |
16 |
MICROELECTRONIC ASSEMBLY |
DIMM184,40 |
DRAMs |
1 mm |
3-STATE |
32MX16 |
32M |
DUAL |
R-PDMA-N184 |
1 |
356 MHz |
Not Qualified |
536870912 bit |
45 ns |
|||||||||||||||||||||||||||||||||
Micron Technology |
FAST PAGE DRAM |
COMMERCIAL |
28 |
TSOP2 |
2048 |
RECTANGULAR |
PLASTIC/EPOXY |
FAST PAGE |
YES |
1 |
CMOS |
GULL WING |
ASYNCHRONOUS |
2097152 words |
3 |
8 |
SMALL OUTLINE, THIN PROFILE |
1.27 mm |
70 Cel |
3-STATE |
2MX8 |
2M |
0 Cel |
TIN LEAD |
DUAL |
1 |
R-PDSO-G28 |
3.3 V |
1.2 mm |
10.16 mm |
Not Qualified |
16777216 bit |
2.7 V |
RAS ONLY; CAS BEFORE RAS; HIDDEN REFRESH |
e0 |
18.41 mm |
80 ns |
||||||||||||||||||||||
|
Micron Technology |
DDR DRAM MODULE |
COMMERCIAL |
200 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
SINGLE BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
33554432 words |
YES |
2.5 |
64 |
MICROELECTRONIC ASSEMBLY |
70 Cel |
32MX64 |
32M |
0 Cel |
GOLD |
DUAL |
1 |
R-XDMA-N200 |
2.7 V |
Not Qualified |
2147483648 bit |
2.3 V |
AUTO/SELF REFRESH |
e4 |
.75 ns |
||||||||||||||||||||||||||
Micron Technology |
FAST PAGE DRAM |
30 |
DIE |
RECTANGULAR |
UNSPECIFIED |
FAST PAGE |
YES |
1 |
CMOS |
NO LEAD |
ASYNCHRONOUS |
1048576 words |
3.3 |
4 |
UNCASED CHIP |
3-STATE |
1MX4 |
1M |
UPPER |
1 |
R-XUUC-N30 |
Not Qualified |
4194304 bit |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
|||||||||||||||||||||||||||||||||||
Micron Technology |
DDR DRAM MODULE |
INDUSTRIAL |
240 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
FOUR BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
1073741824 words |
YES |
1.5 |
72 |
MICROELECTRONIC ASSEMBLY |
85 Cel |
1GX72 |
1G |
-40 Cel |
DUAL |
1 |
R-XDMA-N240 |
1.575 V |
Not Qualified |
77309411328 bit |
1.425 V |
AUTO/SELF REFRESH |
||||||||||||||||||||||||||||||
|
Micron Technology |
DDR DRAM MODULE |
COMMERCIAL |
184 |
DIMM |
8192 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
NO LEAD |
3780 mA |
268435456 words |
COMMON |
2.5 |
2.5 |
72 |
MICROELECTRONIC ASSEMBLY |
DIMM184 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
256MX72 |
256M |
0 Cel |
DUAL |
R-PDMA-N184 |
166 MHz |
Not Qualified |
19327352832 bit |
.18 Amp |
|||||||||||||||||||||||||||
|
Micron Technology |
DDR DRAM MODULE |
COMMERCIAL |
184 |
DIMM |
8192 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
NO LEAD |
6300 mA |
134217728 words |
COMMON |
2.5 |
2.5 |
72 |
MICROELECTRONIC ASSEMBLY |
DIMM184 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
128MX72 |
128M |
0 Cel |
DUAL |
R-PDMA-N184 |
133 MHz |
Not Qualified |
9663676416 bit |
.09 Amp |
.75 ns |
||||||||||||||||||||||||||
Micron Technology |
FAST PAGE DRAM |
COMMERCIAL |
32 |
SOJ |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
FAST PAGE |
YES |
1 |
CMOS |
J BEND |
ASYNCHRONOUS |
70 mA |
2097152 words |
NO |
COMMON |
3 |
5 |
8 |
SMALL OUTLINE |
SOJ32,.44 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
2MX8 |
2M |
0 Cel |
TIN LEAD |
DUAL |
1 |
R-PDSO-J32 |
3.3 V |
3.68 mm |
10.21 mm |
Not Qualified |
16777216 bit |
2.7 V |
RAS ONLY; CAS BEFORE RAS; HIDDEN REFRESH |
e0 |
.0004 Amp |
20.98 mm |
70 ns |
|||||||||||||||
|
Micron Technology |
SYNCHRONOUS DRAM MODULE |
COMMERCIAL |
168 |
DIMM |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
NO LEAD |
1840 mA |
8388608 words |
COMMON |
3.3 |
3.3 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM168 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
8MX64 |
8M |
0 Cel |
DUAL |
R-PDMA-N168 |
35.052 mm |
143 MHz |
Not Qualified |
536870912 bit |
.016 Amp |
5.4 ns |
|||||||||||||||||||||||||
|
Micron Technology |
COMMERCIAL |
240 |
DIMM |
8192 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
NO LEAD |
2250 mA |
33554432 words |
COMMON |
1.8 |
1.8 |
72 |
MICROELECTRONIC ASSEMBLY |
DIMM240,40 |
Other Memory ICs |
1 mm |
70 Cel |
3-STATE |
32MX72 |
32M |
0 Cel |
MATTE TIN |
DUAL |
R-PDMA-N240 |
1 |
333 MHz |
Not Qualified |
2415919104 bit |
e3 |
.045 Amp |
.45 ns |
||||||||||||||||||||||||
Micron Technology |
INDUSTRIAL |
200 |
DIMM |
8192 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
NO LEAD |
33554432 words |
COMMON |
2.5 |
2.5 |
72 |
MICROELECTRONIC ASSEMBLY |
DIMM200,24 |
Other Memory ICs |
.6 mm |
85 Cel |
3-STATE |
32MX72 |
32M |
-40 Cel |
DUAL |
R-PDMA-N200 |
133 MHz |
Not Qualified |
2415919104 bit |
.036 Amp |
.75 ns |
|||||||||||||||||||||||||||||
|
Micron Technology |
DDR DRAM MODULE |
OTHER |
240 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
DUAL BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
268435456 words |
YES |
1.8 |
72 |
MICROELECTRONIC ASSEMBLY |
85 Cel |
256MX72 |
256M |
0 Cel |
GOLD |
DUAL |
1 |
R-XDMA-N240 |
1.9 V |
Not Qualified |
19327352832 bit |
1.7 V |
AUTO/SELF REFRESH |
e4 |
|||||||||||||||||||||||||||
Micron Technology |
EDO DRAM |
COMMERCIAL |
24 |
SOJ |
2048 |
RECTANGULAR |
PLASTIC/EPOXY |
FAST PAGE WITH EDO |
YES |
1 |
CMOS |
J BEND |
ASYNCHRONOUS |
4194304 words |
5 |
4 |
SMALL OUTLINE |
1.27 mm |
70 Cel |
3-STATE |
4MX4 |
4M |
0 Cel |
DUAL |
1 |
R-PDSO-J24 |
5.5 V |
3.61 mm |
7.67 mm |
Not Qualified |
16777216 bit |
4.5 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
17.17 mm |
70 ns |
||||||||||||||||||||||||
|
Micron Technology |
DDR DRAM MODULE |
COMMERCIAL |
240 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
SINGLE BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
67108864 words |
YES |
1.8 |
72 |
MICROELECTRONIC ASSEMBLY |
70 Cel |
64MX72 |
64M |
0 Cel |
GOLD |
DUAL |
1 |
R-XDMA-N240 |
1.9 V |
2.7 mm |
30.175 mm |
Not Qualified |
4831838208 bit |
1.7 V |
AUTO/SELF REFRESH |
e4 |
133.35 mm |
.45 ns |
|||||||||||||||||||||||
|
Micron Technology |
DDR DRAM MODULE |
COMMERCIAL |
200 |
DIMM |
8192 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
NO LEAD |
3195 mA |
134217728 words |
COMMON |
2.5 |
2.5 |
72 |
MICROELECTRONIC ASSEMBLY |
DIMM200,24 |
DRAMs |
.6 mm |
70 Cel |
3-STATE |
128MX72 |
128M |
0 Cel |
DUAL |
R-PDMA-N200 |
133 MHz |
Not Qualified |
9663676416 bit |
.75 ns |
|||||||||||||||||||||||||||
Micron Technology |
DDR DRAM MODULE |
INDUSTRIAL |
204 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
SINGLE BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
268435456 words |
YES |
1.5 |
64 |
MICROELECTRONIC ASSEMBLY |
.6 mm |
85 Cel |
256MX64 |
256M |
-40 Cel |
ZIG-ZAG |
1 |
R-XZMA-N204 |
1.575 V |
30.15 mm |
3.8 mm |
Not Qualified |
17179869184 bit |
1.425 V |
AUTO/SELF REFRESH; WD-MAX |
67.6 mm |
||||||||||||||||||||||||||
Micron Technology |
DDR DRAM MODULE |
COMMERCIAL |
184 |
DIMM |
8192 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
NO LEAD |
6300 mA |
67108864 words |
COMMON |
2.5 |
2.5 |
72 |
MICROELECTRONIC ASSEMBLY |
DIMM184 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
64MX72 |
64M |
0 Cel |
DUAL |
R-PDMA-N184 |
133 MHz |
Not Qualified |
4831838208 bit |
.072 Amp |
.75 ns |
|||||||||||||||||||||||||||
Micron Technology |
SYNCHRONOUS DRAM MODULE |
COMMERCIAL |
168 |
DIMM |
8192 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
NO LEAD |
13320 mA |
268435456 words |
COMMON |
3.3 |
3.3 |
72 |
MICROELECTRONIC ASSEMBLY |
DIMM168 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
256MX72 |
256M |
0 Cel |
DUAL |
R-PDMA-N168 |
133 MHz |
Not Qualified |
19327352832 bit |
.072 Amp |
5.4 ns |
|||||||||||||||||||||||||||
|
Micron Technology |
DDR DRAM MODULE |
COMMERCIAL |
200 |
DIMM |
8192 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
NO LEAD |
3360 mA |
134217728 words |
COMMON |
1.8 |
1.8 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM200,24 |
DRAMs |
.6 mm |
65 Cel |
3-STATE |
128MX64 |
128M |
0 Cel |
MATTE TIN |
DUAL |
R-PDMA-N200 |
1 |
333 MHz |
Not Qualified |
8589934592 bit |
e3 |
.08 Amp |
.45 ns |
|||||||||||||||||||||||
|
Micron Technology |
DDR DRAM MODULE |
COMMERCIAL |
184 |
DIMM |
8192 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
NO LEAD |
2560 mA |
67108864 words |
COMMON |
2.6 |
2.6 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM184 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
64MX64 |
64M |
0 Cel |
DUAL |
R-PDMA-N184 |
200 MHz |
Not Qualified |
4294967296 bit |
.064 Amp |
.7 ns |
||||||||||||||||||||||||||
Micron Technology |
LPDDR2 DRAM |
216 |
VFBGA |
SQUARE |
PLASTIC/EPOXY |
MULTI BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
402653184 words |
YES |
1.8 |
32 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.4 mm |
384MX32 |
384M |
BOTTOM |
1 |
S-PBGA-B216 |
1.95 V |
1 mm |
12 mm |
12884901888 bit |
1.7 V |
SELF REFRESH; IT ALSO REQUIRES 1.2V NOM |
12 mm |
||||||||||||||||||||||||||||||
Micron Technology |
DDR4 DRAM |
OTHER |
78 |
TFBGA |
8192 |
RECTANGULAR |
PLASTIC/EPOXY |
MULTI BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
2147483648 words |
4,8 |
YES |
COMMON |
1.2 |
8 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
BGA78,9X13,32 |
.8 mm |
95 Cel |
2GX8 |
2G |
0 Cel |
BOTTOM |
1 |
R-PBGA-B78 |
1.26 V |
1.2 mm |
1333 MHz |
10 mm |
17179869184 bit |
1.14 V |
4,8 |
11 mm |
||||||||||||||||||||||
|
Micron Technology |
DDR4 DRAM |
OTHER |
96 |
TFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
MULTI BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
268435456 words |
YES |
1.2 |
16 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
.8 mm |
85 Cel |
256MX16 |
256M |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
1 |
R-PBGA-B96 |
1.26 V |
1.2 mm |
7.5 mm |
4294967296 bit |
1.14 V |
AUTO/SELF REFRESH |
e1 |
13.5 mm |
||||||||||||||||||||||||
Micron Technology |
EDO DRAM MODULE |
COMMERCIAL |
168 |
DIMM |
1024 |
RECTANGULAR |
UNSPECIFIED |
FAST PAGE WITH EDO |
NO |
1 |
CMOS |
NO LEAD |
ASYNCHRONOUS |
620 mA |
1048576 words |
NO |
COMMON |
3.3 |
3.3 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM168 |
32 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
1MX64 |
1M |
0 Cel |
DUAL |
1 |
R-XDMA-N168 |
1 |
3.6 V |
25.654 mm |
Not Qualified |
67108864 bit |
3 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
.002 Amp |
70 ns |
|||||||||||||||||
Micron Technology |
FAST PAGE DRAM MODULE |
COMMERCIAL |
168 |
DIMM |
4096 |
RECTANGULAR |
UNSPECIFIED |
FAST PAGE |
NO |
1 |
CMOS |
NO LEAD |
ASYNCHRONOUS |
875 mA |
4194304 words |
COMMON |
3.3 |
3.3 |
72 |
MICROELECTRONIC ASSEMBLY |
DIMM168 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
4MX72 |
4M |
0 Cel |
DUAL |
1 |
R-XDMA-N168 |
1 |
3.6 V |
Not Qualified |
301989888 bit |
3 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
.0025 Amp |
50 ns |
||||||||||||||||||||
Micron Technology |
SYNCHRONOUS DRAM MODULE |
COMMERCIAL |
168 |
RECTANGULAR |
UNSPECIFIED |
DUAL BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
67108864 words |
YES |
3.3 |
72 |
MICROELECTRONIC ASSEMBLY |
70 Cel |
64MX72 |
64M |
0 Cel |
DUAL |
1 |
R-XDMA-N168 |
3.6 V |
Not Qualified |
4831838208 bit |
3 V |
AUTO/SELF REFRESH |
6 ns |
||||||||||||||||||||||||||||||
|
Micron Technology |
DDR DRAM MODULE |
OTHER |
240 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
DUAL BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
134217728 words |
YES |
1.8 |
72 |
MICROELECTRONIC ASSEMBLY |
85 Cel |
128MX72 |
128M |
0 Cel |
GOLD |
DUAL |
1 |
R-XDMA-N240 |
1.9 V |
Not Qualified |
9663676416 bit |
1.7 V |
AUTO/SELF REFRESH |
e4 |
.6 ns |
||||||||||||||||||||||||||
|
Micron Technology |
DDR DRAM MODULE |
INDUSTRIAL |
240 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
SINGLE BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
134217728 words |
YES |
1.8 |
72 |
MICROELECTRONIC ASSEMBLY |
85 Cel |
128MX72 |
128M |
-40 Cel |
GOLD |
DUAL |
1 |
R-XDMA-N240 |
1.9 V |
2.7 mm |
30.175 mm |
Not Qualified |
9663676416 bit |
1.7 V |
AUTO/SELF REFRESH |
e4 |
133.35 mm |
||||||||||||||||||||||||
Micron Technology |
EDO DRAM |
COMMERCIAL |
28 |
SOJ |
2048 |
RECTANGULAR |
PLASTIC/EPOXY |
FAST PAGE WITH EDO |
YES |
1 |
CMOS |
J BEND |
ASYNCHRONOUS |
2097152 words |
3.3 |
8 |
SMALL OUTLINE |
1.27 mm |
70 Cel |
3-STATE |
2MX8 |
2M |
0 Cel |
DUAL |
1 |
R-PDSO-J28 |
3.47 V |
3.68 mm |
10.21 mm |
Not Qualified |
16777216 bit |
3.13 V |
RAS ONLY/CAS BEFORE RAS REFRESH |
18.44 mm |
70 ns |
||||||||||||||||||||||||
Micron Technology |
FAST PAGE DRAM |
COMMERCIAL |
20 |
TSOP2 |
1024 |
RECTANGULAR |
PLASTIC/EPOXY |
FAST PAGE |
YES |
1 |
CMOS |
GULL WING |
ASYNCHRONOUS |
80 mA |
1048576 words |
NO |
COMMON |
3.3 |
3.3 |
4 |
SMALL OUTLINE, THIN PROFILE |
TSSOP20/26,.36 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
1MX4 |
1M |
0 Cel |
TIN LEAD |
DUAL |
1 |
R-PDSO-G20 |
3.6 V |
1.2 mm |
7.62 mm |
Not Qualified |
4194304 bit |
3 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
e0 |
.0005 Amp |
17.14 mm |
60 ns |
|||||||||||||||
Micron Technology |
FAST PAGE DRAM |
COMMERCIAL |
20 |
TSOP2 |
1024 |
RECTANGULAR |
PLASTIC/EPOXY |
FAST PAGE |
YES |
1 |
CMOS |
GULL WING |
ASYNCHRONOUS |
90 mA |
4194304 words |
NO |
SEPARATE |
5 |
5 |
1 |
SMALL OUTLINE, THIN PROFILE |
TSSOP20/26,.36 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
4MX1 |
4M |
0 Cel |
TIN LEAD |
DUAL |
1 |
R-PDSO-G20 |
5.5 V |
1.2 mm |
7.62 mm |
Not Qualified |
4194304 bit |
4.5 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
e0 |
.001 Amp |
17.14 mm |
80 ns |
|||||||||||||||
|
Micron Technology |
DDR3 DRAM |
78 |
TFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
MULTI BANK PAGE BURST |
YES |
1 |
CMOS |
BALL |
SYNCHRONOUS |
270 mA |
134217728 words |
8 |
YES |
COMMON |
1.5 |
8 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
BGA78,9X13,32 |
.8 mm |
95 Cel |
3-STATE |
128MX8 |
128M |
0 Cel |
BOTTOM |
1 |
R-PBGA-B78 |
1.575 V |
1.17 mm |
533 MHz |
8 mm |
1073741824 bit |
1.425 V |
AUTO/SELF REFRESH |
.06 Amp |
8 |
11.5 mm |
20 ns |
||||||||||||||||||
Micron Technology |
FAST PAGE DRAM |
30 |
DIE |
RECTANGULAR |
UNSPECIFIED |
FAST PAGE |
YES |
1 |
CMOS |
NO LEAD |
ASYNCHRONOUS |
1048576 words |
3.3 |
4 |
UNCASED CHIP |
3-STATE |
1MX4 |
1M |
UPPER |
1 |
R-XUUC-N30 |
Not Qualified |
4194304 bit |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
|||||||||||||||||||||||||||||||||||
Micron Technology |
DDR DRAM MODULE |
INDUSTRIAL |
184 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
DUAL BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
134217728 words |
YES |
2.5 |
72 |
MICROELECTRONIC ASSEMBLY |
85 Cel |
128MX72 |
128M |
-40 Cel |
DUAL |
1 |
R-XDMA-N184 |
2.7 V |
Not Qualified |
9663676416 bit |
2.3 V |
AUTO/SELF REFRESH |
30 |
235 |
.75 ns |
|||||||||||||||||||||||||||
Micron Technology |
DDR DRAM MODULE |
INDUSTRIAL |
200 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
SINGLE BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
67108864 words |
YES |
1.8 |
72 |
MICROELECTRONIC ASSEMBLY |
85 Cel |
64MX72 |
64M |
-40 Cel |
GOLD |
ZIG-ZAG |
1 |
R-XZMA-N200 |
1.9 V |
30.15 mm |
Not Qualified |
4831838208 bit |
1.7 V |
AUTO/SELF REFRESH |
e4 |
67.6 mm |
||||||||||||||||||||||||||
|
Micron Technology |
DDR DRAM MODULE |
COMMERCIAL |
204 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
DUAL BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
536870912 words |
YES |
1.5 |
64 |
MICROELECTRONIC ASSEMBLY |
70 Cel |
512MX64 |
512M |
0 Cel |
GOLD |
DUAL |
1 |
R-XDMA-N204 |
1.575 V |
3.8 mm |
30 mm |
Not Qualified |
34359738368 bit |
1.425 V |
AUTO/SELF REFRESH |
e4 |
67.6 mm |
||||||||||||||||||||||||
Micron Technology |
DDR DRAM MODULE |
COMMERCIAL |
200 |
DIMM |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
NO LEAD |
2925 mA |
16777216 words |
COMMON |
2.5 |
2.5 |
72 |
MICROELECTRONIC ASSEMBLY |
DIMM200,24 |
DRAMs |
.6 mm |
70 Cel |
3-STATE |
16MX72 |
16M |
0 Cel |
DUAL |
R-PDMA-N200 |
133 MHz |
Not Qualified |
1207959552 bit |
.75 ns |
||||||||||||||||||||||||||||
Micron Technology |
FAST PAGE DRAM |
COMMERCIAL |
32 |
TSOP2 |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
FAST PAGE |
YES |
1 |
CMOS |
GULL WING |
ASYNCHRONOUS |
100 mA |
2097152 words |
NO |
COMMON |
5 |
5 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSOP32,.46 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
2MX8 |
2M |
0 Cel |
TIN LEAD |
DUAL |
1 |
R-PDSO-G32 |
5.5 V |
1.2 mm |
10.16 mm |
Not Qualified |
16777216 bit |
4.5 V |
RAS ONLY; CAS BEFORE RAS; HIDDEN REFRESH |
e0 |
.001 Amp |
20.96 mm |
70 ns |
|||||||||||||||
Micron Technology |
RAMBUS DRAM MODULE |
COMMERCIAL |
184 |
RECTANGULAR |
UNSPECIFIED |
BLOCK ORIENTED PROTOCOL |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
50331648 words |
YES |
2.5 |
18 |
MICROELECTRONIC ASSEMBLY |
70 Cel |
48MX18 |
48M |
0 Cel |
DUAL |
1 |
R-XDMA-N184 |
2.63 V |
Not Qualified |
905969664 bit |
2.37 V |
SELF CONTAINED REFRESH |
|||||||||||||||||||||||||||||||
Micron Technology |
FAST PAGE DRAM MODULE |
COMMERCIAL |
72 |
SIMM |
1024 |
RECTANGULAR |
UNSPECIFIED |
FAST PAGE |
NO |
1 |
CMOS |
NO LEAD |
ASYNCHRONOUS |
310 mA |
1048576 words |
NO |
COMMON |
5 |
5 |
32 |
MICROELECTRONIC ASSEMBLY |
SSIM72 |
16 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
1MX32 |
1M |
0 Cel |
SINGLE |
1 |
R-XSMA-N72 |
1 |
5.5 V |
20.574 mm |
Not Qualified |
33554432 bit |
4.5 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
.011 Amp |
70 ns |
|||||||||||||||||
Micron Technology |
FAST PAGE DRAM MODULE |
COMMERCIAL |
72 |
DIMM |
1024 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
NO LEAD |
340 mA |
1048576 words |
NO |
COMMON |
3.3 |
3.3 |
32 |
MICROELECTRONIC ASSEMBLY |
DIMM72 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
1MX32 |
1M |
0 Cel |
DUAL |
R-PDMA-N72 |
25.654 mm |
Not Qualified |
33554432 bit |
.0003 Amp |
60 ns |
||||||||||||||||||||||||||
Micron Technology |
FAST PAGE DRAM |
COMMERCIAL |
28 |
SOJ |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
FAST PAGE |
YES |
1 |
CMOS |
J BEND |
ASYNCHRONOUS |
2097152 words |
YES |
3 |
8 |
SMALL OUTLINE |
1.27 mm |
70 Cel |
3-STATE |
2MX8 |
2M |
0 Cel |
TIN LEAD |
DUAL |
1 |
R-PDSO-J28 |
3.3 V |
3.68 mm |
10.21 mm |
Not Qualified |
16777216 bit |
2.7 V |
RAS ONLY; CAS BEFORE RAS; HIDDEN; BATTERY BACKUP; SELF REFRESH |
e0 |
18.44 mm |
80 ns |
|||||||||||||||||||||
|
Micron Technology |
DDR DRAM MODULE |
COMMERCIAL |
200 |
DIMM |
8192 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
NO LEAD |
134217728 words |
COMMON |
2.5 |
2.5 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM200,24 |
DRAMs |
.6 mm |
70 Cel |
3-STATE |
128MX64 |
128M |
0 Cel |
DUAL |
R-PDMA-N200 |
133 MHz |
Not Qualified |
8589934592 bit |
.75 ns |
||||||||||||||||||||||||||||
Micron Technology |
FAST PAGE DRAM |
COMMERCIAL |
32 |
TSOP2 |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
FAST PAGE |
YES |
1 |
CMOS |
GULL WING |
ASYNCHRONOUS |
2097152 words |
3 |
8 |
SMALL OUTLINE, THIN PROFILE |
1.27 mm |
70 Cel |
3-STATE |
2MX8 |
2M |
0 Cel |
TIN LEAD |
DUAL |
1 |
R-PDSO-G32 |
3.3 V |
1.2 mm |
10.16 mm |
Not Qualified |
16777216 bit |
2.7 V |
RAS ONLY; CAS BEFORE RAS; HIDDEN REFRESH |
e0 |
20.96 mm |
80 ns |
||||||||||||||||||||||
Micron Technology |
DRAM CARD |
COMMERCIAL |
88 |
2048 |
UNSPECIFIED |
UNSPECIFIED |
FAST PAGE |
NO |
1 |
CMOS |
UNSPECIFIED |
ASYNCHRONOUS |
4194304 words |
5 |
36 |
MICROELECTRONIC ASSEMBLY |
18 |
55 Cel |
4MX36 |
4M |
0 Cel |
UNSPECIFIED |
1 |
X-XXMA-X88 |
5.25 V |
Not Qualified |
150994944 bit |
4.75 V |
RAS ONLY; CAS BEFORE RAS; HIDDEN; BATTERY BACKUP REFRESH |
60 ns |
DRAM, or Dynamic Random Access Memory, is a type of volatile computer memory that stores data in a digital format. It is commonly used in personal computers, laptops, mobile devices, and other digital devices.
DRAM stores digital data as a charge on a capacitor. Each capacitor in DRAM represents one bit of data, and the state of the capacitor is refreshed periodically to maintain its charge. The refreshing process is necessary because the charge on the capacitor leaks over time, leading to data loss. The refreshing process is managed by a control circuitry that is integrated into the DRAM module.
DRAM is an important component of modern computer systems because it provides fast access to data for the processor. DRAM access times are measured in nanoseconds, which is much faster than access times for secondary storage devices like hard drives or solid-state drives. DRAM is also cheaper and more energy-efficient than other types of computer memory.
There are different types of DRAM, including SDRAM (Synchronous DRAM), DDR SDRAM (Double Data Rate Synchronous DRAM), and GDDR SDRAM (Graphics Double Data Rate Synchronous DRAM). These different types of DRAM have different characteristics, such as speed, capacity, and power consumption, and are used in different types of computer systems.
One of the disadvantages of DRAM is that it is volatile, which means that it loses data when the power is turned off. To prevent data loss, DRAM is typically used in conjunction with non-volatile storage devices like hard drives or solid-state drives, which can store data even when the power is turned off.