Part | RoHS | Manufacturer | Memory IC Type | Temperature Grade | No. of Terminals | Package Code | Refresh Cycles | Package Shape | Package Body Material | Access Mode | Surface Mount | No. of Functions | Technology | Screening Level | Nominal Negative Supply Voltage | Terminal Form | Parallel or Serial | Operating Mode | Maximum Supply Current | No. of Words | Sequential Burst Length | Self Refresh | Input/Output Type | Nominal Supply Voltage / Vsup (V) | Mixed Memory Type | Power Supplies (V) | Memory Width | Package Style (Meter) | Package Equivalence Code | Alternate Memory Width | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Reverse Pinout | Output Characteristics | Organization | No. of Words Code | Minimum Standby Voltage | Minimum Operating Temperature | Terminal Finish | Terminal Position | No. of Ports | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Maximum Clock Frequency (fCLK) | Width | Qualification | Memory Density | Minimum Supply Voltage (Vsup) | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Maximum Standby Current | Interleaved Burst Length | Length | Maximum Access Time |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Texas Instruments |
NIBBLE MODE DRAM |
INDUSTRIAL |
16 |
DIP |
256 |
RECTANGULAR |
PLASTIC/EPOXY |
NIBBLE |
NO |
1 |
NMOS |
THROUGH-HOLE |
ASYNCHRONOUS |
262144 words |
5 |
1 |
IN-LINE |
2.54 mm |
85 Cel |
3-STATE |
256KX1 |
256K |
-40 Cel |
DUAL |
1 |
R-PDIP-T16 |
5.5 V |
5.08 mm |
7.62 mm |
Not Qualified |
262144 bit |
4.5 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
19.305 mm |
120 ns |
||||||||||||||||||||||||
Texas Instruments |
FAST PAGE DRAM |
COMMERCIAL |
42 |
SOJ |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
FAST PAGE |
YES |
1 |
CMOS |
J BEND |
ASYNCHRONOUS |
1048576 words |
YES |
5 |
16 |
SMALL OUTLINE |
1.27 mm |
70 Cel |
1MX16 |
1M |
0 Cel |
DUAL |
1 |
R-PDSO-J42 |
5.5 V |
3.76 mm |
10.16 mm |
Not Qualified |
16777216 bit |
4.5 V |
RAS ONLY; CAS BEFORE RAS; HIDDEN; SELF REFRESH |
27.38 mm |
60 ns |
||||||||||||||||||||||||
Texas Instruments |
FAST PAGE DRAM |
COMMERCIAL |
24 |
SOJ |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
FAST PAGE |
YES |
1 |
CMOS |
J BEND |
ASYNCHRONOUS |
60 mA |
4194304 words |
NO |
COMMON |
3.3 |
3.3 |
4 |
SMALL OUTLINE |
SOJ24/26,.34 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
4MX4 |
4M |
0 Cel |
DUAL |
1 |
R-PDSO-J24 |
3.6 V |
3.76 mm |
7.62 mm |
Not Qualified |
16777216 bit |
3 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
NOT SPECIFIED |
NOT SPECIFIED |
.001 Amp |
17.145 mm |
70 ns |
|||||||||||||||
Texas Instruments |
SYNCHRONOUS DRAM |
COMMERCIAL |
54 |
TSOP2 |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
FOUR BANK PAGE BURST |
YES |
1 |
MOS |
GULL WING |
SYNCHRONOUS |
225 mA |
16777216 words |
1,2,4,8 |
YES |
COMMON |
3.3 |
3.3 |
4 |
SMALL OUTLINE, THIN PROFILE |
TSOP54,.46,32 |
DRAMs |
.8 mm |
70 Cel |
3-STATE |
16MX4 |
16M |
0 Cel |
DUAL |
1 |
R-PDSO-G54 |
3.6 V |
1.2 mm |
125 MHz |
10.16 mm |
Not Qualified |
67108864 bit |
3 V |
RAS ONLY/AUTO/SELF REFRESH |
NOT SPECIFIED |
NOT SPECIFIED |
.001 Amp |
1,2,4,8 |
22.22 mm |
6 ns |
||||||||||||
Texas Instruments |
VIDEO DRAM |
MILITARY |
28 |
ZIP |
RECTANGULAR |
UNSPECIFIED |
FAST PAGE |
NO |
1 |
CMOS |
MIL-STD-883 |
THROUGH-HOLE |
ASYNCHRONOUS |
262144 words |
5 |
4 |
IN-LINE |
1.27 mm |
125 Cel |
256KX4 |
256K |
-55 Cel |
ZIG-ZAG |
2 |
R-XZIP-T28 |
5.5 V |
13.08 mm |
2.92 mm |
Not Qualified |
1048576 bit |
4.5 V |
CAS BEFORE RAS/HIDDEN REFRESH |
36.83 mm |
100 ns |
|||||||||||||||||||||||||
Texas Instruments |
VIDEO DRAM |
MILITARY |
64 |
GDFP |
512 |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
FAST PAGE WITH EDO |
YES |
1 |
CMOS |
38535Q/M;38534H;883B |
FLAT |
ASYNCHRONOUS |
200 mA |
262144 words |
5 |
5 |
16 |
FLATPACK, GUARD RING |
TPAK64,1.6SQ,20 |
Other Memory ICs |
.5 mm |
125 Cel |
3-STATE |
256KX16 |
256K |
-55 Cel |
DUAL |
2 |
R-CDFP-F64 |
5.5 V |
3.81 mm |
10.985 mm |
Not Qualified |
4194304 bit |
4.5 V |
CAS BEFORE RAS/HIDDEN REFRESH |
NOT SPECIFIED |
NOT SPECIFIED |
.012 Amp |
18.985 mm |
80 ns |
||||||||||||||||
Texas Instruments |
DRAM MODULE |
COMMERCIAL |
22 |
256 |
RECTANGULAR |
UNSPECIFIED |
PAGE |
NO |
1 |
NMOS |
THROUGH-HOLE |
ASYNCHRONOUS |
65536 words |
SEPARATE |
5 |
4 |
MICROELECTRONIC ASSEMBLY |
SIP22,.2 |
DRAMs |
2.54 mm |
70 Cel |
3-STATE |
64KX4 |
64K |
0 Cel |
SINGLE |
1 |
R-XSMA-T22 |
5.5 V |
Not Qualified |
262144 bit |
4.5 V |
RAS ONLY REFRESH |
NOT SPECIFIED |
NOT SPECIFIED |
150 ns |
|||||||||||||||||||||||
Texas Instruments |
FAST PAGE DRAM |
MILITARY |
20 |
SOJ |
512 |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
FAST PAGE |
YES |
1 |
CMOS |
MIL-PRF-38535 |
J BEND |
SYNCHRONOUS |
60 mA |
262144 words |
COMMON |
5 |
5 |
4 |
SMALL OUTLINE |
SOJ20/26,.34 |
DRAMs |
1.27 mm |
125 Cel |
3-STATE |
256KX4 |
256K |
-55 Cel |
DUAL |
1 |
R-CDSO-J20 |
5.5 V |
3.48 mm |
8.382 mm |
Not Qualified |
1048576 bit |
4.5 V |
CAS BEFORE RAS REFRESH |
NOT SPECIFIED |
NOT SPECIFIED |
.003 Amp |
17.145 mm |
120 ns |
|||||||||||||||
Texas Instruments |
NIBBLE MODE DRAM |
INDUSTRIAL |
18 |
QCCJ |
256 |
RECTANGULAR |
PLASTIC/EPOXY |
NIBBLE |
YES |
1 |
NMOS |
J BEND |
ASYNCHRONOUS |
262144 words |
5 |
1 |
CHIP CARRIER |
1.27 mm |
85 Cel |
3-STATE |
256KX1 |
256K |
-40 Cel |
QUAD |
1 |
R-PQCC-J18 |
5.5 V |
3.53 mm |
7.366 mm |
Not Qualified |
262144 bit |
4.5 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
12.446 mm |
120 ns |
||||||||||||||||||||||||
Texas Instruments |
FAST PAGE DRAM |
COMMERCIAL |
24 |
SOJ |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
FAST PAGE |
YES |
1 |
CMOS |
J BEND |
ASYNCHRONOUS |
4194304 words |
YES |
3.3 |
4 |
SMALL OUTLINE |
1.27 mm |
70 Cel |
4MX4 |
4M |
0 Cel |
DUAL |
1 |
R-PDSO-J24 |
3.6 V |
3.76 mm |
7.57 mm |
Not Qualified |
16777216 bit |
3 V |
RAS ONLY; CAS BEFORE RAS; HIDDEN; SELF REFRESH |
17.145 mm |
100 ns |
||||||||||||||||||||||||
Texas Instruments |
FAST PAGE DRAM |
MILITARY |
20 |
DIP |
512 |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
FAST PAGE |
NO |
1 |
CMOS |
38535Q/M;38534H;883B |
THROUGH-HOLE |
SYNCHRONOUS |
75 mA |
1048576 words |
SEPARATE |
5 |
5 |
1 |
IN-LINE |
ZIP20,.1 |
DRAMs |
1.27 mm |
125 Cel |
3-STATE |
1MX1 |
1M |
-55 Cel |
DUAL |
1 |
R-CDIP-T20 |
5.5 V |
10.92 mm |
2.92 mm |
Not Qualified |
1048576 bit |
4.5 V |
CAS BEFORE RAS REFRESH |
NOT SPECIFIED |
NOT SPECIFIED |
.003 Amp |
26.67 mm |
80 ns |
|||||||||||||||
Texas Instruments |
PAGE MODE DRAM |
COMMERCIAL |
16 |
DIP |
256 |
RECTANGULAR |
CERAMIC |
NO |
MOS |
THROUGH-HOLE |
65536 words |
SEPARATE |
5 |
5 |
1 |
IN-LINE |
DIP16,.3 |
DRAMs |
2.54 mm |
70 Cel |
3-STATE |
64KX1 |
64K |
0 Cel |
DUAL |
R-XDIP-T16 |
Not Qualified |
65536 bit |
NOT SPECIFIED |
NOT SPECIFIED |
150 ns |
||||||||||||||||||||||||||||
Texas Instruments |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
FAST PAGE DRAM |
COMMERCIAL |
24 |
TSOP2-R |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
FAST PAGE |
YES |
1 |
CMOS |
GULL WING |
ASYNCHRONOUS |
4194304 words |
5 |
4 |
SMALL OUTLINE, THIN PROFILE |
1.27 mm |
70 Cel |
4MX4 |
4M |
0 Cel |
DUAL |
1 |
R-PDSO-G24 |
5.5 V |
1.2 mm |
10.16 mm |
Not Qualified |
16777216 bit |
4.5 V |
RAS ONLY; CAS BEFORE RAS; HIDDEN REFRESH |
18.41 mm |
60 ns |
|||||||||||||||||||||||||
Texas Instruments |
EDO DRAM MODULE |
COMMERCIAL |
144 |
DIMM |
8192 |
RECTANGULAR |
UNSPECIFIED |
FAST PAGE WITH EDO |
NO |
1 |
CMOS |
NO LEAD |
ASYNCHRONOUS |
524 mA |
8388608 words |
YES |
COMMON |
3.3 |
3.3 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM144,32 |
DRAMs |
.8 mm |
70 Cel |
3-STATE |
8MX64 |
8M |
0 Cel |
DUAL |
1 |
R-XDMA-N144 |
3.6 V |
Not Qualified |
536870912 bit |
3 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
.0012 Amp |
50 ns |
||||||||||||||||||||
Texas Instruments |
FAST PAGE DRAM |
COMMERCIAL |
24 |
SOJ |
2048 |
RECTANGULAR |
PLASTIC/EPOXY |
FAST PAGE |
YES |
1 |
CMOS |
J BEND |
ASYNCHRONOUS |
4194304 words |
5 |
4 |
SMALL OUTLINE |
1.27 mm |
70 Cel |
4MX4 |
4M |
0 Cel |
DUAL |
1 |
R-PDSO-J24 |
5.5 V |
3.76 mm |
10.16 mm |
Not Qualified |
16777216 bit |
4.5 V |
RAS ONLY; CAS BEFORE RAS; HIDDEN REFRESH |
18.415 mm |
60 ns |
|||||||||||||||||||||||||
Texas Instruments |
NIBBLE MODE DRAM |
COMMERCIAL |
18 |
QCCJ |
256 |
RECTANGULAR |
PLASTIC/EPOXY |
NIBBLE |
YES |
1 |
NMOS |
J BEND |
ASYNCHRONOUS |
262144 words |
SEPARATE |
5 |
5 |
1 |
CHIP CARRIER |
LDCC18,.33X.53 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
256KX1 |
256K |
0 Cel |
QUAD |
1 |
R-PQCC-J18 |
5.5 V |
3.53 mm |
7.366 mm |
Not Qualified |
262144 bit |
4.5 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
NOT SPECIFIED |
NOT SPECIFIED |
12.446 mm |
100 ns |
||||||||||||||||||
Texas Instruments |
FAST PAGE DRAM |
COMMERCIAL |
40 |
TSOP |
1024 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
120 mA |
262144 words |
NO |
COMMON |
5 |
5 |
16 |
SMALL OUTLINE, THIN PROFILE |
TSOP40/44,.46,32 |
DRAMs |
.8 mm |
70 Cel |
3-STATE |
256KX16 |
256K |
0 Cel |
DUAL |
R-PDSO-G40 |
Not Qualified |
4194304 bit |
NOT SPECIFIED |
NOT SPECIFIED |
.0002 Amp |
70 ns |
|||||||||||||||||||||||||
Texas Instruments |
PAGE MODE DRAM |
OTHER |
18 |
DIP |
256 |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
PAGE |
NO |
1 |
NMOS |
38535Q/M;38534H;883B |
THROUGH-HOLE |
ASYNCHRONOUS |
16384 words |
COMMON |
5 |
5 |
4 |
IN-LINE |
DIP18,.3 |
DRAMs |
2.54 mm |
100 Cel |
3-STATE |
16KX4 |
16K |
-55 Cel |
DUAL |
1 |
R-CDIP-T18 |
5.5 V |
5.08 mm |
7.62 mm |
Not Qualified |
65536 bit |
4.5 V |
RAS ONLY REFRESH |
NOT SPECIFIED |
NOT SPECIFIED |
22.606 mm |
120 ns |
|||||||||||||||||
Texas Instruments |
FAST PAGE DRAM MODULE |
COMMERCIAL |
72 |
1024 |
RECTANGULAR |
UNSPECIFIED |
FAST PAGE |
NO |
1 |
CMOS |
NO LEAD |
ASYNCHRONOUS |
2097152 words |
5 |
36 |
MICROELECTRONIC ASSEMBLY |
16 |
70 Cel |
3-STATE |
2MX36 |
2M |
0 Cel |
SINGLE |
1 |
R-XSMA-N72 |
5.5 V |
Not Qualified |
75497472 bit |
4.5 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
60 ns |
||||||||||||||||||||||||||||
Texas Instruments |
FAST PAGE DRAM |
MILITARY |
24 |
DIP |
RECTANGULAR |
UNSPECIFIED |
FAST PAGE |
NO |
1 |
CMOS |
MIL-STD-883 |
THROUGH-HOLE |
ASYNCHRONOUS |
4194304 words |
5 |
4 |
IN-LINE |
2.54 mm |
125 Cel |
4MX4 |
4M |
-55 Cel |
TIN LEAD |
ZIG-ZAG |
1 |
R-XZIP-T24 |
5.5 V |
13.08 mm |
2.92 mm |
Not Qualified |
16777216 bit |
4.5 V |
CAS BEFORE RAS REFRESH |
e0 |
31.75 mm |
80 ns |
|||||||||||||||||||||||
Texas Instruments |
EDO DRAM |
COMMERCIAL |
20 |
TSOP2 |
1024 |
RECTANGULAR |
PLASTIC/EPOXY |
FAST PAGE WITH EDO |
YES |
1 |
MOS |
GULL WING |
ASYNCHRONOUS |
90 mA |
1048576 words |
NO |
COMMON |
5 |
5 |
4 |
SMALL OUTLINE, THIN PROFILE |
TSSOP20/26,.36 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
1MX4 |
1M |
0 Cel |
DUAL |
1 |
R-PDSO-G20 |
5.5 V |
1.2 mm |
7.62 mm |
Not Qualified |
4194304 bit |
4.5 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
NOT SPECIFIED |
NOT SPECIFIED |
.001 Amp |
17.14 mm |
70 ns |
|||||||||||||||
Texas Instruments |
FAST PAGE DRAM |
MILITARY |
50 |
DFP |
4096 |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
FAST PAGE WITH EDO |
YES |
1 |
MOS |
38535Q/M;38534H;883B |
FLAT |
ASYNCHRONOUS |
70 mA |
1048576 words |
NO |
COMMON |
5 |
5 |
16 |
FLATPACK |
FL50,.67,32 |
DRAMs |
.8 mm |
125 Cel |
3-STATE |
1MX16 |
1M |
-55 Cel |
DUAL |
1 |
R-CDFP-F50 |
5.5 V |
3.55 mm |
16.5 mm |
Not Qualified |
16777216 bit |
4.5 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
NOT SPECIFIED |
NOT SPECIFIED |
.001 Amp |
21 mm |
80 ns |
||||||||||||||
Texas Instruments |
DRAM CARD |
COMMERCIAL |
60 |
1024 |
UNSPECIFIED |
UNSPECIFIED |
FAST PAGE |
NO |
1 |
CMOS |
UNSPECIFIED |
ASYNCHRONOUS |
1330 mA |
4194304 words |
COMMON |
5 |
5 |
16 |
MICROELECTRONIC ASSEMBLY |
CARD60 |
DRAMs |
55 Cel |
3-STATE |
4MX16 |
4M |
0 Cel |
UNSPECIFIED |
1 |
X-XXMA-X60 |
5.25 V |
Not Qualified |
67108864 bit |
4.75 V |
.033 Amp |
80 ns |
||||||||||||||||||||||||
Texas Instruments |
SYNCHRONOUS DRAM |
MILITARY |
50 |
DFP |
4096 |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
DUAL BANK PAGE BURST |
YES |
1 |
CMOS |
38535Q/M;38534H;883B |
FLAT |
SYNCHRONOUS |
150 mA |
1048576 words |
1,2,4,8,FP |
COMMON |
3.3 |
3.3 |
16 |
FLATPACK |
FL50,.67,32 |
DRAMs |
.8 mm |
125 Cel |
3-STATE |
1MX16 |
1M |
-55 Cel |
DUAL |
1 |
R-CDFP-F50 |
3.465 V |
3.55 mm |
50 MHz |
16.5 mm |
Not Qualified |
16777216 bit |
3.135 V |
AUTO REFRESH |
NOT SPECIFIED |
NOT SPECIFIED |
.002 Amp |
1,2,4,8 |
21 mm |
10 ns |
||||||||||||
Texas Instruments |
VIDEO DRAM |
COMMERCIAL |
28 |
SOJ |
512 |
RECTANGULAR |
PLASTIC/EPOXY |
FAST PAGE |
YES |
1 |
CMOS |
J BEND |
ASYNCHRONOUS |
262144 words |
5 |
4 |
SMALL OUTLINE |
1.27 mm |
70 Cel |
3-STATE |
256KX4 |
256K |
0 Cel |
DUAL |
2 |
R-PDSO-J28 |
5.25 V |
3.76 mm |
10.16 mm |
Not Qualified |
1048576 bit |
4.75 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH; 512 X 4 SAM PORT |
18.415 mm |
100 ns |
||||||||||||||||||||||||
Texas Instruments |
PAGE MODE DRAM |
OTHER |
18 |
QCCN |
256 |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
PAGE |
YES |
1 |
NMOS |
38535Q/M;38534H;883B |
NO LEAD |
ASYNCHRONOUS |
16384 words |
COMMON |
5 |
5 |
4 |
CHIP CARRIER |
LCC18,.3X.43 |
DRAMs |
1.27 mm |
100 Cel |
3-STATE |
16KX4 |
16K |
-55 Cel |
QUAD |
1 |
R-CQCC-N18 |
5.5 V |
1.85 mm |
7.366 mm |
Not Qualified |
65536 bit |
4.5 V |
RAS ONLY REFRESH |
NOT SPECIFIED |
NOT SPECIFIED |
10.795 mm |
150 ns |
|||||||||||||||||
Texas Instruments |
VIDEO DRAM |
INDUSTRIAL |
20 |
DIP |
256 |
RECTANGULAR |
PLASTIC/EPOXY |
PAGE |
NO |
1 |
NMOS |
THROUGH-HOLE |
ASYNCHRONOUS |
65536 words |
5 |
1 |
IN-LINE |
2.54 mm |
85 Cel |
3-STATE |
64KX1 |
64K |
-40 Cel |
DUAL |
2 |
R-PDIP-T20 |
5.5 V |
5.08 mm |
7.62 mm |
Not Qualified |
65536 bit |
4.5 V |
RAS ONLY REFRESH; 256 X 1 SAM PORT |
24.325 mm |
200 ns |
||||||||||||||||||||||||
Texas Instruments |
FAST PAGE DRAM |
COMMERCIAL |
18 |
DIP |
512 |
RECTANGULAR |
PLASTIC/EPOXY |
FAST PAGE |
NO |
1 |
CMOS |
THROUGH-HOLE |
ASYNCHRONOUS |
1048576 words |
5 |
1 |
IN-LINE |
2.54 mm |
70 Cel |
3-STATE |
1MX1 |
1M |
0 Cel |
DUAL |
1 |
R-PDIP-T18 |
5.5 V |
5.08 mm |
7.62 mm |
Not Qualified |
1048576 bit |
4.5 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
22.48 mm |
120 ns |
||||||||||||||||||||||||
Texas Instruments |
FAST PAGE DRAM MODULE |
COMMERCIAL |
72 |
2048 |
RECTANGULAR |
UNSPECIFIED |
FAST PAGE |
NO |
1 |
CMOS |
NO LEAD |
ASYNCHRONOUS |
8388608 words |
5 |
40 |
MICROELECTRONIC ASSEMBLY |
70 Cel |
8MX40 |
8M |
0 Cel |
SINGLE |
1 |
R-XSMA-N72 |
5.5 V |
Not Qualified |
335544320 bit |
4.5 V |
RAS ONLY; CAS BEFORE RAS; HIDDEN REFRESH |
70 ns |
||||||||||||||||||||||||||||||
Texas Instruments |
FAST PAGE DRAM |
COMMERCIAL |
44 |
TSOP2 |
1024 |
RECTANGULAR |
PLASTIC/EPOXY |
FAST PAGE |
YES |
1 |
CMOS |
GULL WING |
ASYNCHRONOUS |
1048576 words |
YES |
3.3 |
16 |
SMALL OUTLINE, THIN PROFILE |
.8 mm |
70 Cel |
1MX16 |
1M |
0 Cel |
DUAL |
1 |
R-PDSO-G44 |
3.6 V |
1.2 mm |
10.16 mm |
Not Qualified |
16777216 bit |
3 V |
RAS ONLY; CAS BEFORE RAS; HIDDEN; SELF REFRESH |
20.95 mm |
80 ns |
||||||||||||||||||||||||
Texas Instruments |
SYNCHRONOUS DRAM MODULE |
COMMERCIAL |
168 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
DUAL BANK PAGE BURST |
NO |
1 |
MOS |
NO LEAD |
SYNCHRONOUS |
2097152 words |
3.3 |
72 |
MICROELECTRONIC ASSEMBLY |
70 Cel |
2MX72 |
2M |
0 Cel |
DUAL |
1 |
R-XDMA-N168 |
3.6 V |
Not Qualified |
150994944 bit |
3 V |
8 ns |
|||||||||||||||||||||||||||||||
Texas Instruments |
FAST PAGE DRAM |
COMMERCIAL |
20 |
ZIP |
1024 |
RECTANGULAR |
PLASTIC/EPOXY |
FAST PAGE |
NO |
1 |
CMOS |
THROUGH-HOLE |
ASYNCHRONOUS |
1048576 words |
3.3 |
4 |
IN-LINE |
1.27 mm |
70 Cel |
1MX4 |
1M |
0 Cel |
ZIG-ZAG |
1 |
R-PZIP-T20 |
3.6 V |
10.16 mm |
2.8 mm |
Not Qualified |
4194304 bit |
3 V |
RAS ONLY; CAS BEFORE RAS; HIDDEN REFRESH |
100 ns |
||||||||||||||||||||||||||
Texas Instruments |
VIDEO DRAM |
MILITARY |
64 |
DFP |
RECTANGULAR |
UNSPECIFIED |
FAST PAGE WITH EDO |
YES |
1 |
CMOS |
FLAT |
ASYNCHRONOUS |
262144 words |
5 |
16 |
FLATPACK |
.5 mm |
125 Cel |
256KX16 |
256K |
-55 Cel |
TIN LEAD |
DUAL |
2 |
R-XDFP-F64 |
5.5 V |
3.81 mm |
10.985 mm |
Not Qualified |
4194304 bit |
4.5 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH; 256 X 16 SAM PORT |
e0 |
18.985 mm |
75 ns |
||||||||||||||||||||||||
Texas Instruments |
FAST PAGE DRAM |
COMMERCIAL |
28 |
SOJ |
1024 |
RECTANGULAR |
PLASTIC/EPOXY |
FAST PAGE |
YES |
1 |
CMOS |
J BEND |
ASYNCHRONOUS |
90 mA |
524288 words |
YES |
COMMON |
5 |
5 |
8 |
SMALL OUTLINE |
SOJ28,.44 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
512KX8 |
512K |
0 Cel |
DUAL |
1 |
R-PDSO-J28 |
5.5 V |
3.76 mm |
10.16 mm |
Not Qualified |
4194304 bit |
4.5 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN/SELF REFRESH |
NOT SPECIFIED |
NOT SPECIFIED |
.0002 Amp |
18.415 mm |
100 ns |
|||||||||||||||
Texas Instruments |
EDO DRAM |
COMMERCIAL |
44 |
TSOP2 |
1024 |
RECTANGULAR |
PLASTIC/EPOXY |
FAST PAGE WITH EDO |
YES |
1 |
CMOS |
GULL WING |
ASYNCHRONOUS |
170 mA |
1048576 words |
YES |
COMMON |
3.3 |
3.3 |
16 |
SMALL OUTLINE, THIN PROFILE |
TSOP44/50,.46,32 |
DRAMs |
.8 mm |
70 Cel |
3-STATE |
1MX16 |
1M |
0 Cel |
DUAL |
1 |
R-PDSO-G44 |
3.6 V |
1.2 mm |
10.16 mm |
Not Qualified |
16777216 bit |
3 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN/SELF REFRESH |
NOT SPECIFIED |
NOT SPECIFIED |
.0002 Amp |
20.95 mm |
80 ns |
|||||||||||||||
Texas Instruments |
VIDEO DRAM |
MILITARY |
28 |
DIP |
RECTANGULAR |
UNSPECIFIED |
FAST PAGE |
NO |
1 |
CMOS |
THROUGH-HOLE |
ASYNCHRONOUS |
262144 words |
5 |
4 |
IN-LINE |
125 Cel |
256KX4 |
256K |
-55 Cel |
TIN LEAD |
DUAL |
2 |
R-XDIP-T28 |
5.5 V |
Not Qualified |
1048576 bit |
4.5 V |
CAS BEFORE RAS/HIDDEN REFRESH |
e0 |
120 ns |
||||||||||||||||||||||||||||
Texas Instruments |
SYNCHRONOUS DRAM MODULE |
COMMERCIAL |
168 |
RECTANGULAR |
UNSPECIFIED |
FOUR BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
8388608 words |
YES |
3.3 |
64 |
MICROELECTRONIC ASSEMBLY |
70 Cel |
8MX64 |
8M |
0 Cel |
DUAL |
1 |
R-XDMA-N168 |
3.6 V |
Not Qualified |
536870912 bit |
3 V |
AUTO/SELF REFRESH |
7 ns |
||||||||||||||||||||||||||||||
Texas Instruments |
FAST PAGE DRAM |
MILITARY |
24 |
SON |
4096 |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
FAST PAGE |
YES |
1 |
CMOS |
38535Q/M;38534H;883B |
NO LEAD |
SYNCHRONOUS |
70 mA |
4194304 words |
NO |
COMMON |
5 |
5 |
4 |
SMALL OUTLINE |
SOLCC24/28,.45 |
DRAMs |
1.27 mm |
125 Cel |
3-STATE |
4MX4 |
4M |
-55 Cel |
DUAL |
1 |
R-CDSO-N24 |
5.5 V |
3.18 mm |
11.43 mm |
Not Qualified |
16777216 bit |
4.5 V |
CAS BEFORE RAS REFRESH |
NOT SPECIFIED |
NOT SPECIFIED |
.001 Amp |
19.685 mm |
80 ns |
||||||||||||||
Texas Instruments |
FAST PAGE DRAM |
MILITARY |
20 |
SOJ |
512 |
RECTANGULAR |
UNSPECIFIED |
FAST PAGE |
YES |
1 |
CMOS |
MIL-STD-883 |
J BEND |
ASYNCHRONOUS |
60 mA |
262144 words |
COMMON |
5 |
5 |
4 |
SMALL OUTLINE |
SOJ20/26,.34 |
DRAMs |
1.27 mm |
125 Cel |
3-STATE |
256KX4 |
256K |
-55 Cel |
DUAL |
1 |
R-XDSO-J20 |
5.5 V |
2.54 mm |
8.385 mm |
Not Qualified |
1048576 bit |
4.5 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
NOT SPECIFIED |
NOT SPECIFIED |
.004 Amp |
17.145 mm |
120 ns |
|||||||||||||||
Texas Instruments |
EDO DRAM |
COMMERCIAL |
32 |
TSOP2 |
8192 |
RECTANGULAR |
PLASTIC/EPOXY |
FAST PAGE WITH EDO |
YES |
1 |
MOS |
GULL WING |
ASYNCHRONOUS |
110 mA |
16777216 words |
YES |
COMMON |
3.3 |
3.3 |
4 |
SMALL OUTLINE, THIN PROFILE |
TSOP32,.46 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
16MX4 |
16M |
0 Cel |
DUAL |
1 |
R-PDSO-G32 |
3.6 V |
1.2 mm |
10.16 mm |
Not Qualified |
67108864 bit |
3 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN/SELF REFRESH |
NOT SPECIFIED |
NOT SPECIFIED |
.00015 Amp |
20.95 mm |
60 ns |
|||||||||||||||
Texas Instruments |
FAST PAGE DRAM MODULE |
COMMERCIAL |
30 |
SIMM |
1024 |
RECTANGULAR |
UNSPECIFIED |
FAST PAGE |
NO |
1 |
CMOS |
NO LEAD |
ASYNCHRONOUS |
195 mA |
1048576 words |
COMMON |
5 |
5 |
9 |
MICROELECTRONIC ASSEMBLY |
SIM30 |
DRAMs |
2.54 mm |
70 Cel |
3-STATE |
1MX9 |
1M |
0 Cel |
SINGLE |
1 |
R-XSMA-N30 |
5.5 V |
20.4978 mm |
Not Qualified |
9437184 bit |
4.5 V |
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
.003 Amp |
100 ns |
||||||||||||||||||||
Texas Instruments |
SYNCHRONOUS DRAM MODULE |
COMMERCIAL |
168 |
DIMM |
4096 |
RECTANGULAR |
UNSPECIFIED |
DUAL BANK PAGE BURST |
NO |
1 |
CMOS |
NO LEAD |
SYNCHRONOUS |
150 mA |
4194304 words |
COMMON |
3.3 |
3.3 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM168 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
4MX64 |
4M |
0 Cel |
DUAL |
1 |
R-XDMA-N168 |
3.6 V |
125 MHz |
Not Qualified |
268435456 bit |
3 V |
.001 Amp |
6 ns |
|||||||||||||||||||||
Texas Instruments |
FAST PAGE DRAM |
COMMERCIAL |
24 |
TSOP2-R |
2048 |
RECTANGULAR |
PLASTIC/EPOXY |
FAST PAGE |
YES |
1 |
CMOS |
GULL WING |
ASYNCHRONOUS |
4194304 words |
3.3 |
4 |
SMALL OUTLINE, THIN PROFILE |
1.27 mm |
70 Cel |
4MX4 |
4M |
0 Cel |
DUAL |
1 |
R-PDSO-G24 |
3.6 V |
1.2 mm |
7.62 mm |
Not Qualified |
16777216 bit |
3 V |
RAS ONLY; CAS BEFORE RAS; HIDDEN REFRESH |
17.14 mm |
60 ns |
|||||||||||||||||||||||||
Texas Instruments |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
FAST PAGE DRAM |
COMMERCIAL |
32 |
TSOP2 |
4096 |
RECTANGULAR |
PLASTIC/EPOXY |
FAST PAGE |
YES |
1 |
CMOS |
GULL WING |
ASYNCHRONOUS |
2097152 words |
YES |
5 |
8 |
SMALL OUTLINE, THIN PROFILE |
1.27 mm |
70 Cel |
2MX8 |
2M |
0 Cel |
DUAL |
1 |
R-PDSO-G32 |
5.5 V |
1.2 mm |
10.16 mm |
Not Qualified |
16777216 bit |
4.5 V |
RAS ONLY; CAS BEFORE RAS; HIDDEN; SELF REFRESH |
20.95 mm |
70 ns |
||||||||||||||||||||||||
Texas Instruments |
EDO DRAM MODULE |
COMMERCIAL |
168 |
DIMM |
2048 |
RECTANGULAR |
UNSPECIFIED |
SINGLE BANK PAGE BURST |
NO |
1 |
MOS |
NO LEAD |
ASYNCHRONOUS |
816 mA |
2097152 words |
COMMON |
3.3 |
3.3 |
72 |
MICROELECTRONIC ASSEMBLY |
DIMM168 |
DRAMs |
1.27 mm |
70 Cel |
3-STATE |
2MX72 |
2M |
0 Cel |
DUAL |
1 |
R-XDMA-N168 |
3.6 V |
Not Qualified |
150994944 bit |
3 V |
CAS BEFORE RAS REFRESH |
.009 Amp |
15 ns |
|||||||||||||||||||||
Texas Instruments |
PAGE MODE DRAM |
COMMERCIAL |
16 |
DIP |
256 |
RECTANGULAR |
CERAMIC |
NO |
MOS |
THROUGH-HOLE |
262144 words |
SEPARATE |
5 |
5 |
1 |
IN-LINE |
DIP16,.3 |
DRAMs |
2.54 mm |
70 Cel |
3-STATE |
256KX1 |
256K |
0 Cel |
DUAL |
R-XDIP-T16 |
Not Qualified |
262144 bit |
NOT SPECIFIED |
NOT SPECIFIED |
100 ns |
DRAM, or Dynamic Random Access Memory, is a type of volatile computer memory that stores data in a digital format. It is commonly used in personal computers, laptops, mobile devices, and other digital devices.
DRAM stores digital data as a charge on a capacitor. Each capacitor in DRAM represents one bit of data, and the state of the capacitor is refreshed periodically to maintain its charge. The refreshing process is necessary because the charge on the capacitor leaks over time, leading to data loss. The refreshing process is managed by a control circuitry that is integrated into the DRAM module.
DRAM is an important component of modern computer systems because it provides fast access to data for the processor. DRAM access times are measured in nanoseconds, which is much faster than access times for secondary storage devices like hard drives or solid-state drives. DRAM is also cheaper and more energy-efficient than other types of computer memory.
There are different types of DRAM, including SDRAM (Synchronous DRAM), DDR SDRAM (Double Data Rate Synchronous DRAM), and GDDR SDRAM (Graphics Double Data Rate Synchronous DRAM). These different types of DRAM have different characteristics, such as speed, capacity, and power consumption, and are used in different types of computer systems.
One of the disadvantages of DRAM is that it is volatile, which means that it loses data when the power is turned off. To prevent data loss, DRAM is typically used in conjunction with non-volatile storage devices like hard drives or solid-state drives, which can store data even when the power is turned off.