Part | RoHS | Manufacturer | Memory IC Type | Temperature Grade | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | Surface Mount | No. of Functions | Technology | Screening Level | Terminal Form | Parallel or Serial | Operating Mode | Sector Size (Words) | Maximum Supply Current | No. of Words | Input/Output Type | Nominal Supply Voltage / Vsup (V) | Toggle Bit | Power Supplies (V) | Memory Width | Package Style (Meter) | Package Equivalence Code | Alternate Memory Width | Sub-Category | Minimum Data Retention Time | Terminal Pitch | Maximum Operating Temperature | Reverse Pinout | Output Characteristics | Organization | No. of Words Code | Minimum Operating Temperature | No. of Sectors/Size | Command User Interface | Terminal Finish | I2C Control Byte | Ready or Busy | Terminal Position | No. of Ports | Write Protection | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Endurance | Maximum Clock Frequency (fCLK) | Width | Qualification | Maximum Write Cycle Time (tWC) | Serial Bus Type | Boot Block | Memory Density | Minimum Supply Voltage (Vsup) | Additional Features | Page Size (words) | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Type | Maximum Standby Current | Length | Common Flash Interface | Maximum Access Time | Programming Voltage (V) | Data Polling |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Microchip Technology |
EEPROM |
INDUSTRIAL |
5 |
LSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
TS 16949 |
GULL WING |
SERIAL |
SYNCHRONOUS |
3 mA |
256 words |
5 |
1.8/5 |
8 |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
TSOP5/6,.11,37 |
EEPROMs |
200 |
.95 mm |
85 Cel |
OPEN-DRAIN |
256X8 |
256 |
-40 Cel |
MATTE TIN |
1010XXXR |
DUAL |
1 |
HARDWARE |
R-PDSO-G5 |
1 |
5.5 V |
1.45 mm |
1000000 Write/Erase Cycles |
.4 MHz |
1.55 mm |
Not Qualified |
5 ms |
I2C |
2048 bit |
2.5 V |
ALSO OPERATES AT 1.7V TO 2.5V @0.1MHZ |
e3 |
40 |
260 |
.000001 Amp |
2.9 mm |
5 |
||||||||||||||||
|
Microchip Technology |
EEPROM |
INDUSTRIAL |
5 |
LSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
GULL WING |
SERIAL |
SYNCHRONOUS |
3 mA |
2048 words |
5 |
2/5 |
8 |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
TSOP5/6,.11,37 |
EEPROMs |
200 |
.95 mm |
85 Cel |
2KX8 |
2K |
-40 Cel |
MATTE TIN |
1010MMMR |
DUAL |
1 |
HARDWARE |
R-PDSO-G5 |
1 |
5.5 V |
1.45 mm |
1000000 Write/Erase Cycles |
.4 MHz |
1.63 mm |
Not Qualified |
5 ms |
I2C |
16384 bit |
2.5 V |
e3 |
260 |
.000001 Amp |
2.95 mm |
5 |
|||||||||||||||||||
|
Microchip Technology |
EEPROM |
INDUSTRIAL |
5 |
LSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
GULL WING |
SERIAL |
SYNCHRONOUS |
3 mA |
8192 words |
4.5 |
3/5 |
8 |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
TSOP5/6,.11,37 |
EEPROMs |
200 |
.95 mm |
85 Cel |
OPEN-DRAIN |
8KX8 |
8K |
-40 Cel |
MATTE TIN |
1010DDDR |
DUAL |
1 |
HARDWARE |
R-PDSO-G5 |
1 |
5.5 V |
1.45 mm |
1000000 Write/Erase Cycles |
.4 MHz |
1.55 mm |
Not Qualified |
5 ms |
I2C |
65536 bit |
2.5 V |
e3 |
260 |
.000001 Amp |
2.9 mm |
4.5 |
||||||||||||||||||
|
Microchip Technology |
EEPROM |
INDUSTRIAL |
5 |
LSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
3 mA |
2048 words |
5 |
2/5 |
8 |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
TSOP5/6,.11,37 |
EEPROMs |
200 |
.95 mm |
85 Cel |
2KX8 |
2K |
-40 Cel |
MATTE TIN |
1010MMMR |
DUAL |
HARDWARE |
R-PDSO-G5 |
1 |
5.5 V |
1.45 mm |
1000000 Write/Erase Cycles |
.4 MHz |
1.63 mm |
Not Qualified |
5 ms |
I2C |
16384 bit |
2.5 V |
1 MILLION ERASE/WRITE CYCLES |
e3 |
260 |
.000001 Amp |
2.95 mm |
|||||||||||||||||||||
|
Microchip Technology |
EEPROM |
AUTOMOTIVE |
5 |
LSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
GULL WING |
SERIAL |
SYNCHRONOUS |
3 mA |
2048 words |
5 |
3/5 |
8 |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
TSOP5/6,.11,37 |
EEPROMs |
200 |
.95 mm |
125 Cel |
2KX8 |
2K |
-40 Cel |
MATTE TIN |
1010MMMR |
DUAL |
1 |
HARDWARE |
R-PDSO-G5 |
1 |
5.5 V |
1.45 mm |
1000000 Write/Erase Cycles |
.4 MHz |
1.63 mm |
Not Qualified |
5 ms |
I2C |
16384 bit |
2.5 V |
e3 |
260 |
.000005 Amp |
2.95 mm |
5 |
|||||||||||||||||||
|
Microchip Technology |
EEPROM |
INDUSTRIAL |
5 |
LSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
GULL WING |
SERIAL |
SYNCHRONOUS |
3 mA |
2048 words |
2.5 |
2/5 |
8 |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
TSOP5/6,.11,37 |
EEPROMs |
200 |
.95 mm |
85 Cel |
2KX8 |
2K |
-40 Cel |
MATTE TIN |
1010MMMR |
DUAL |
1 |
HARDWARE |
R-PDSO-G5 |
1 |
5.5 V |
1.45 mm |
1000000 Write/Erase Cycles |
.4 MHz |
1.63 mm |
Not Qualified |
5 ms |
I2C |
16384 bit |
1.7 V |
1.7V TO 2.5V @ 0.1MHz |
e3 |
260 |
.000001 Amp |
2.95 mm |
2.5 |
||||||||||||||||||
|
Onsemi |
EEPROM |
INDUSTRIAL |
5 |
VSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
2 mA |
2048 words |
3.3 |
1.8/5 |
1 |
SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH |
TSOP5/6,.11,37 |
EEPROMs |
100 |
.95 mm |
85 Cel |
2KX1 |
2K |
-40 Cel |
NICKEL PALLADIUM GOLD |
1010000R |
DUAL |
HARDWARE |
R-PDSO-G5 |
1 |
5.5 V |
1 mm |
1000000 Write/Erase Cycles |
.4 MHz |
1.6 mm |
Not Qualified |
5 ms |
I2C |
2048 bit |
1.7 V |
e4 |
30 |
260 |
.000001 Amp |
2.9 mm |
|||||||||||||||||||||
|
Microchip Technology |
EEPROM |
INDUSTRIAL |
5 |
LSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
GULL WING |
SERIAL |
SYNCHRONOUS |
3 mA |
8192 words |
4.5 |
2/5 |
8 |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
TSOP5/6,.11,37 |
EEPROMs |
200 |
.95 mm |
85 Cel |
OPEN-DRAIN |
8KX8 |
8K |
-40 Cel |
Matte Tin (Sn) - annealed |
1010DDDR |
DUAL |
1 |
HARDWARE |
R-PDSO-G5 |
1 |
5.5 V |
1.45 mm |
1000000 Write/Erase Cycles |
.4 MHz |
1.55 mm |
Not Qualified |
5 ms |
I2C |
65536 bit |
2.5 V |
e3 |
40 |
260 |
.000001 Amp |
2.9 mm |
4.5 |
|||||||||||||||||
|
Microchip Technology |
EEPROM |
INDUSTRIAL |
5 |
LSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
3 mA |
4096 words |
4.5 |
3/5 |
8 |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
TSOP5/6,.11,37 |
EEPROMs |
200 |
.95 mm |
85 Cel |
OPEN-DRAIN |
4KX8 |
4K |
-40 Cel |
MATTE TIN |
1010000R |
DUAL |
HARDWARE |
R-PDSO-G5 |
1 |
5.5 V |
1.45 mm |
1000000 Write/Erase Cycles |
.4 MHz |
1.55 mm |
Not Qualified |
5 ms |
I2C |
32768 bit |
2.5 V |
e3 |
260 |
.000001 Amp |
2.9 mm |
4.5 |
||||||||||||||||||||
|
Microchip Technology |
EEPROM |
INDUSTRIAL |
5 |
LSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
TS 16949 |
GULL WING |
SERIAL |
SYNCHRONOUS |
3 mA |
256 words |
5 |
8 |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
TSOP5/6,.11,37 |
200 |
.95 mm |
85 Cel |
OPEN-DRAIN |
256X8 |
256 |
-40 Cel |
MATTE TIN |
1010DDDR |
DUAL |
1 |
R-PDSO-G5 |
1 |
5.5 V |
1.45 mm |
1000000 Write/Erase Cycles |
.4 MHz |
1.55 mm |
5 ms |
I2C |
2048 bit |
2.5 V |
1.7V TO 2.5V @ 0.1MHz |
e3 |
40 |
260 |
.000001 Amp |
2.9 mm |
5 |
||||||||||||||||||||
|
Microchip Technology |
EEPROM |
INDUSTRIAL |
5 |
LSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
GULL WING |
SERIAL |
SYNCHRONOUS |
3 mA |
128 words |
5 |
3/5 |
8 |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
TSOP5/6,.11,37 |
EEPROMs |
200 |
.95 mm |
85 Cel |
128X8 |
128 |
-40 Cel |
MATTE TIN |
1010XXXR |
DUAL |
1 |
HARDWARE |
R-PDSO-G5 |
1 |
5.5 V |
1.45 mm |
1000000 Write/Erase Cycles |
.4 MHz |
1.63 mm |
Not Qualified |
5 ms |
I2C |
1024 bit |
2.5 V |
e3 |
260 |
.000001 Amp |
2.95 mm |
5 |
|||||||||||||||||||
|
Microchip Technology |
EEPROM |
INDUSTRIAL |
5 |
LSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
GULL WING |
SERIAL |
SYNCHRONOUS |
3 mA |
128 words |
2.5 |
2/5 |
8 |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
TSOP5/6,.11,37 |
EEPROMs |
200 |
.95 mm |
85 Cel |
128X8 |
128 |
-40 Cel |
MATTE TIN |
1010XXXR |
DUAL |
1 |
HARDWARE |
R-PDSO-G5 |
1 |
5.5 V |
1.45 mm |
1000000 Write/Erase Cycles |
.4 MHz |
1.63 mm |
Not Qualified |
5 ms |
I2C |
1024 bit |
1.7 V |
1.7V TO 2.5V @ 0.1MHz |
e3 |
260 |
.000001 Amp |
2.95 mm |
2.5 |
||||||||||||||||||
|
Microchip Technology |
EEPROM |
AUTOMOTIVE |
5 |
LSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
GULL WING |
SERIAL |
SYNCHRONOUS |
3 mA |
8192 words |
4.5 |
3/5 |
8 |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
TSOP5/6,.11,37 |
EEPROMs |
200 |
.95 mm |
125 Cel |
OPEN-DRAIN |
8KX8 |
8K |
-40 Cel |
Matte Tin (Sn) - annealed |
1010DDDR |
DUAL |
1 |
HARDWARE |
R-PDSO-G5 |
1 |
5.5 V |
1.45 mm |
1000000 Write/Erase Cycles |
.4 MHz |
1.55 mm |
Not Qualified |
5 ms |
I2C |
65536 bit |
2.5 V |
e3 |
40 |
260 |
.000005 Amp |
2.9 mm |
4.5 |
|||||||||||||||||
|
Microchip Technology |
EEPROM |
INDUSTRIAL |
5 |
LSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
GULL WING |
SERIAL |
SYNCHRONOUS |
3 mA |
256 words |
2.5 |
2/5 |
8 |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
TSOP5/6,.11,37 |
EEPROMs |
200 |
.95 mm |
85 Cel |
OPEN-DRAIN |
256X8 |
256 |
-40 Cel |
MATTE TIN |
1010XXXR |
DUAL |
1 |
HARDWARE |
R-PDSO-G5 |
1 |
5.5 V |
1.45 mm |
1000000 Write/Erase Cycles |
.4 MHz |
1.55 mm |
Not Qualified |
5 ms |
I2C |
2048 bit |
1.7 V |
1.7V TO 2.5V @ 0.1MHz |
e3 |
260 |
.000001 Amp |
2.9 mm |
2.5 |
|||||||||||||||||
|
Onsemi |
EEPROM |
INDUSTRIAL |
5 |
VSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
2048 words |
3.3 |
8 |
SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH |
.95 mm |
85 Cel |
2KX8 |
2K |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G5 |
1 |
5.5 V |
1 mm |
.4 MHz |
2.8 mm |
Not Qualified |
5 ms |
I2C |
16384 bit |
1.7 V |
e4 |
30 |
260 |
2.9 mm |
||||||||||||||||||||||||||||||
|
Microchip Technology |
EEPROM |
INDUSTRIAL |
5 |
LSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
GULL WING |
SERIAL |
SYNCHRONOUS |
3 mA |
128 words |
2.5 |
8 |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
TSOP5/6,.11,37 |
200 |
.95 mm |
85 Cel |
128X8 |
128 |
-40 Cel |
Matte Tin (Sn) |
1010XXXR |
DUAL |
1 |
HARDWARE |
R-PDSO-G5 |
5.5 V |
1.45 mm |
1000000 Write/Erase Cycles |
.4 MHz |
1.63 mm |
5 ms |
I2C |
1024 bit |
1.7 V |
1.7V TO 2.5V @ 0.1MHz |
e3 |
.000001 Amp |
2.95 mm |
2.5 |
|||||||||||||||||||||||
|
Microchip Technology |
EEPROM |
AUTOMOTIVE |
5 |
LSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
3 mA |
2048 words |
5 |
3/5 |
8 |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
TSOP5/6,.11,37 |
EEPROMs |
200 |
.95 mm |
125 Cel |
2KX8 |
2K |
-40 Cel |
MATTE TIN |
1010MMMR |
DUAL |
HARDWARE |
R-PDSO-G5 |
1 |
5.5 V |
1.45 mm |
1000000 Write/Erase Cycles |
.4 MHz |
1.63 mm |
Not Qualified |
5 ms |
I2C |
16384 bit |
2.5 V |
1 MILLION ERASE/WRITE CYCLES |
e3 |
260 |
.000005 Amp |
2.95 mm |
|||||||||||||||||||||
|
Microchip Technology |
EEPROM |
INDUSTRIAL |
5 |
LSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
3 mA |
128 words |
5 |
2/5 |
8 |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
TSOP5/6,.11,37 |
EEPROMs |
200 |
.95 mm |
85 Cel |
NO |
128X8 |
128 |
-40 Cel |
MATTE TIN |
1010XXXR |
DUAL |
HARDWARE |
R-PDSO-G5 |
1 |
5.5 V |
1.45 mm |
1000000 Write/Erase Cycles |
.1 MHz |
1.63 mm |
Not Qualified |
5 ms |
I2C |
1024 bit |
1.7 V |
e3 |
260 |
.000001 Amp |
2.95 mm |
|||||||||||||||||||||
|
Microchip Technology |
EEPROM |
INDUSTRIAL |
5 |
LSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
GULL WING |
SERIAL |
SYNCHRONOUS |
3 mA |
256 words |
5 |
3/5 |
8 |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
TSOP5/6,.11,37 |
EEPROMs |
200 |
.95 mm |
85 Cel |
OPEN-DRAIN |
256X8 |
256 |
-40 Cel |
MATTE TIN |
1010XXXR |
DUAL |
1 |
HARDWARE |
R-PDSO-G5 |
1 |
5.5 V |
1.45 mm |
1000000 Write/Erase Cycles |
.4 MHz |
1.55 mm |
Not Qualified |
5 ms |
I2C |
2048 bit |
2.5 V |
e3 |
260 |
.000001 Amp |
2.9 mm |
5 |
||||||||||||||||||
|
Microchip Technology |
EEPROM |
INDUSTRIAL |
5 |
LSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
3 mA |
2048 words |
2.5 |
2/5 |
8 |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
TSOP5/6,.11,37 |
EEPROMs |
200 |
.95 mm |
85 Cel |
2KX8 |
2K |
-40 Cel |
MATTE TIN |
1010MMMR |
DUAL |
HARDWARE |
R-PDSO-G5 |
1 |
5.5 V |
1.45 mm |
1000000 Write/Erase Cycles |
.1 MHz |
1.63 mm |
Not Qualified |
5 ms |
I2C |
16384 bit |
1.7 V |
1 MILLION ERASE/WRITE CYCLES |
e3 |
260 |
.000001 Amp |
2.95 mm |
|||||||||||||||||||||
|
Microchip Technology |
EEPROM |
AUTOMOTIVE |
5 |
LSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
GULL WING |
SERIAL |
SYNCHRONOUS |
3 mA |
2048 words |
5 |
8 |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
TSOP5/6,.11,37 |
200 |
.95 mm |
125 Cel |
2KX8 |
2K |
-40 Cel |
1010MMMR |
DUAL |
1 |
HARDWARE |
R-PDSO-G5 |
5.5 V |
1.45 mm |
1000000 Write/Erase Cycles |
.4 MHz |
1.63 mm |
5 ms |
I2C |
16384 bit |
2.5 V |
.000005 Amp |
2.95 mm |
5 |
||||||||||||||||||||||||||
|
Microchip Technology |
EEPROM |
5 |
LSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
GULL WING |
SERIAL |
SYNCHRONOUS |
3 mA |
512 words |
5 |
3/5 |
8 |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
TSOP5/6,.11,37 |
EEPROMs |
200 |
.95 mm |
85 Cel |
OPEN-DRAIN |
512X8 |
512 |
-40 Cel |
MATTE TIN |
1010XXMR |
DUAL |
1 |
HARDWARE |
R-PDSO-G5 |
1 |
5.5 V |
1.45 mm |
1000000 Write/Erase Cycles |
.4 MHz |
1.63 mm |
Not Qualified |
5 ms |
I2C |
4096 bit |
2.5 V |
e3 |
260 |
.000001 Amp |
2.95 mm |
5 |
|||||||||||||||||||
|
Microchip Technology |
EEPROM |
AUTOMOTIVE |
5 |
LSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
TS 16949 |
GULL WING |
SERIAL |
SYNCHRONOUS |
3 mA |
256 words |
5 |
1.8/5 |
8 |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
TSOP5/6,.11,37 |
EEPROMs |
200 |
.95 mm |
125 Cel |
OPEN-DRAIN |
256X8 |
256 |
-40 Cel |
MATTE TIN |
1010DDDR |
DUAL |
1 |
R-PDSO-G5 |
1 |
5.5 V |
1.45 mm |
1000000 Write/Erase Cycles |
.4 MHz |
1.55 mm |
Not Qualified |
5 ms |
I2C |
2048 bit |
2.5 V |
1.7V TO 2.5V @ 0.1MHz |
e3 |
260 |
.000005 Amp |
2.9 mm |
5 |
||||||||||||||||||
|
Microchip Technology |
EEPROM |
INDUSTRIAL |
5 |
LSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
3 mA |
256 words |
2.5 |
2/5 |
8 |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
TSOP5/6,.11,37 |
EEPROMs |
200 |
.95 mm |
85 Cel |
256X8 |
256 |
-40 Cel |
MATTE TIN |
1010XXXR |
DUAL |
HARDWARE |
R-PDSO-G5 |
1 |
5.5 V |
1.45 mm |
1000000 Write/Erase Cycles |
.1 MHz |
1.55 mm |
Not Qualified |
5 ms |
I2C |
2048 bit |
1.7 V |
e3 |
260 |
.000001 Amp |
2.9 mm |
||||||||||||||||||||||
|
Microchip Technology |
EEPROM |
INDUSTRIAL |
5 |
LSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
GULL WING |
SERIAL |
SYNCHRONOUS |
3 mA |
256 words |
2.5 |
8 |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
TSOP5/6,.11,37 |
200 |
.95 mm |
85 Cel |
OPEN-DRAIN |
256X8 |
256 |
-40 Cel |
1010XXXR |
DUAL |
1 |
HARDWARE |
R-PDSO-G5 |
5.5 V |
1.45 mm |
1000000 Write/Erase Cycles |
.4 MHz |
1.63 mm |
5 ms |
I2C |
2048 bit |
1.7 V |
1.7V TO 2.5V @ 0.1MHz |
.000001 Amp |
2.95 mm |
2.5 |
||||||||||||||||||||||||
|
Microchip Technology |
EEPROM |
AUTOMOTIVE |
5 |
LSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
TS 16949 |
GULL WING |
SERIAL |
SYNCHRONOUS |
3 mA |
256 words |
5 |
1.8/5 |
8 |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
TSOP5/6,.11,37 |
EEPROMs |
200 |
.95 mm |
125 Cel |
OPEN-DRAIN |
256X8 |
256 |
-40 Cel |
MATTE TIN |
10100DDR |
DUAL |
1 |
HARDWARE |
R-PDSO-G5 |
5.5 V |
1.45 mm |
1000000 Write/Erase Cycles |
.4 MHz |
1.55 mm |
Not Qualified |
5 ms |
I2C |
2048 bit |
2.5 V |
ALSO OPERATES AT 1.7V TO 2.5V @0.1MHZ |
e3 |
.000005 Amp |
2.9 mm |
5 |
|||||||||||||||||||
|
Microchip Technology |
EEPROM |
INDUSTRIAL |
5 |
LSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
TS 16949 |
GULL WING |
SERIAL |
SYNCHRONOUS |
3 mA |
256 words |
5 |
8 |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
TSOP5/6,.11,37 |
200 |
.95 mm |
85 Cel |
OPEN-DRAIN |
256X8 |
256 |
-40 Cel |
MATTE TIN |
1010DDDR |
DUAL |
1 |
R-PDSO-G5 |
1 |
5.5 V |
1.45 mm |
1000000 Write/Erase Cycles |
.4 MHz |
1.63 mm |
5 ms |
I2C |
2048 bit |
2.5 V |
1.7V TO 2.5V @ 0.1MHz |
e3 |
40 |
260 |
.000001 Amp |
2.95 mm |
5 |
||||||||||||||||||||
|
Microchip Technology |
EEPROM |
INDUSTRIAL |
5 |
LSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
TS 16949 |
GULL WING |
SERIAL |
SYNCHRONOUS |
3 mA |
8192 words |
5 |
3/5 |
8 |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
TSOP5/6,.11,37 |
EEPROMs |
200 |
.95 mm |
85 Cel |
OPEN-DRAIN |
8KX8 |
8K |
-40 Cel |
Matte Tin (Sn) - annealed |
1010DDDR |
DUAL |
1 |
HARDWARE |
R-PDSO-G5 |
1 |
5.5 V |
1.45 mm |
1000000 Write/Erase Cycles |
.4 MHz |
1.55 mm |
Not Qualified |
5 ms |
I2C |
65536 bit |
2.5 V |
e3 |
40 |
260 |
.000001 Amp |
2.9 mm |
5 |
|||||||||||||||||
|
Microchip Technology |
EEPROM |
INDUSTRIAL |
5 |
VSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
3 mA |
2048 words |
5 |
1.8/5 |
8 |
SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH |
TSOP5/6,.11,37 |
EEPROMs |
100 |
.95 mm |
85 Cel |
NO |
3-STATE |
2048X8 |
2048 |
-40 Cel |
MATTE TIN |
1010XXXR |
DUAL |
1 |
HARDWARE |
R-PDSO-G5 |
5.5 V |
1 mm |
1000000 Write/Erase Cycles |
1 MHz |
1.6 mm |
Not Qualified |
5 ms |
I2C |
16384 bit |
1.7 V |
e3 |
30 |
260 |
.000001 Amp |
2.9 mm |
5 |
||||||||||||||||||
|
Microchip Technology |
EEPROM |
INDUSTRIAL |
5 |
VSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
3 mA |
256 words |
2.5 |
1.8/5 |
8 |
SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH |
TSOP5/6,.11,37 |
EEPROMs |
100 |
.95 mm |
85 Cel |
OPEN-DRAIN |
256X8 |
256 |
-40 Cel |
MATTE TIN |
1010DDDR |
DUAL |
1 |
HARDWARE/SOFTWARE |
R-PDSO-G5 |
5.5 V |
1 mm |
1000000 Write/Erase Cycles |
1 MHz |
1.6 mm |
Not Qualified |
5 ms |
I2C |
2048 bit |
1.7 V |
e3 |
.000006 Amp |
2.9 mm |
2.5 |
|||||||||||||||||||||
|
Microchip Technology |
EEPROM |
INDUSTRIAL |
5 |
LSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
3 mA |
128 words |
5 |
3/5 |
8 |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
TSOP5/6,.11,37 |
EEPROMs |
200 |
.95 mm |
85 Cel |
NO |
128X8 |
128 |
-40 Cel |
MATTE TIN |
1010XXXR |
DUAL |
HARDWARE |
R-PDSO-G5 |
1 |
5.5 V |
1.45 mm |
1000000 Write/Erase Cycles |
.4 MHz |
1.63 mm |
Not Qualified |
5 ms |
I2C |
1024 bit |
2.5 V |
e3 |
260 |
.000005 Amp |
2.95 mm |
|||||||||||||||||||||
|
Microchip Technology |
EEPROM |
INDUSTRIAL |
5 |
LSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
TS 16949 |
GULL WING |
SERIAL |
SYNCHRONOUS |
3 mA |
256 words |
5 |
8 |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
TSOP5/6,.11,37 |
200 |
.95 mm |
85 Cel |
OPEN-DRAIN |
256X8 |
256 |
-40 Cel |
MATTE TIN |
1010XXXR |
DUAL |
1 |
HARDWARE |
R-PDSO-G5 |
5.5 V |
1.45 mm |
1000000 Write/Erase Cycles |
.4 MHz |
1.55 mm |
5 ms |
I2C |
2048 bit |
2.5 V |
ALSO OPERATES AT 1.7V TO 2.5V @0.1MHZ |
e3 |
.000001 Amp |
2.9 mm |
5 |
||||||||||||||||||||||
|
Microchip Technology |
EEPROM |
INDUSTRIAL |
5 |
LSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
GULL WING |
SERIAL |
SYNCHRONOUS |
3 mA |
1024 words |
5 |
8 |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
TSOP5/6,.11,37 |
200 |
.95 mm |
85 Cel |
OPEN-DRAIN |
1KX8 |
1K |
-40 Cel |
MATTE TIN |
1010XMMR |
DUAL |
1 |
HARDWARE |
R-PDSO-G5 |
1 |
5.5 V |
1.45 mm |
1000000 Write/Erase Cycles |
.4 MHz |
1.55 mm |
Not Qualified |
5 ms |
I2C |
8192 bit |
2.5 V |
e3 |
260 |
.000001 Amp |
2.9 mm |
5 |
||||||||||||||||||||
Microchip Technology |
EEPROM |
INDUSTRIAL |
5 |
LSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
TS 16949 |
GULL WING |
SERIAL |
SYNCHRONOUS |
3 mA |
128 words |
5 |
8 |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
TSOP5/6,.11,37 |
200 |
.95 mm |
85 Cel |
NO |
OPEN-DRAIN |
128X8 |
128 |
-40 Cel |
1010XXXR |
DUAL |
1 |
HARDWARE |
R-PDSO-G5 |
5.5 V |
1.45 mm |
1000000 Write/Erase Cycles |
.4 MHz |
1.55 mm |
5 ms |
I2C |
1024 bit |
2.5 V |
1000000 ERASE/WRITE CYCLES, HARDWARE WRITE PROTECT, DATA RETENTION > 200 YEARS |
.000005 Amp |
2.95 mm |
5 |
||||||||||||||||||||||||
|
Onsemi |
EEPROM |
INDUSTRIAL |
5 |
VSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
1 mA |
128 words |
2/5 |
8 |
SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH |
TSOP5/6,.11,37 |
EEPROMs |
100 |
.95 mm |
85 Cel |
128X8 |
128 |
-40 Cel |
NICKEL PALLADIUM GOLD |
1010000R |
DUAL |
HARDWARE |
R-PDSO-G5 |
1 |
5.5 V |
1 mm |
1000000 Write/Erase Cycles |
.4 MHz |
1.6 mm |
Not Qualified |
5 ms |
I2C |
1024 bit |
1.7 V |
e4 |
30 |
260 |
.000001 Amp |
2.9 mm |
||||||||||||||||||||||
|
Microchip Technology |
EEPROM |
INDUSTRIAL |
5 |
LSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
3 mA |
256 words |
5 |
3/5 |
8 |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
TSOP5/6,.11,37 |
EEPROMs |
200 |
.95 mm |
85 Cel |
256X8 |
256 |
-40 Cel |
MATTE TIN |
1010XXXR |
DUAL |
HARDWARE |
R-PDSO-G5 |
1 |
5.5 V |
1.45 mm |
1000000 Write/Erase Cycles |
.4 MHz |
1.55 mm |
Not Qualified |
5 ms |
I2C |
2048 bit |
2.5 V |
e3 |
260 |
.000001 Amp |
2.9 mm |
||||||||||||||||||||||
|
Microchip Technology |
EEPROM |
AUTOMOTIVE |
5 |
LSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
3 mA |
256 words |
5 |
3/5 |
8 |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
TSOP5/6,.11,37 |
EEPROMs |
200 |
.95 mm |
125 Cel |
256X8 |
256 |
-40 Cel |
MATTE TIN |
1010XXXR |
DUAL |
HARDWARE |
R-PDSO-G5 |
1 |
5.5 V |
1.45 mm |
1000000 Write/Erase Cycles |
.4 MHz |
1.55 mm |
Not Qualified |
5 ms |
I2C |
2048 bit |
2.5 V |
e3 |
260 |
.000005 Amp |
2.9 mm |
||||||||||||||||||||||
|
Microchip Technology |
EEPROM |
INDUSTRIAL |
5 |
LSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
3 mA |
512 words |
5 |
3/5 |
8 |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
TSOP5/6,.11,37 |
EEPROMs |
200 |
.95 mm |
85 Cel |
NO |
512X8 |
512 |
-40 Cel |
MATTE TIN |
1010XXMR |
DUAL |
HARDWARE |
R-PDSO-G5 |
1 |
5.5 V |
1.45 mm |
1000000 Write/Erase Cycles |
.4 MHz |
1.55 mm |
Not Qualified |
5 ms |
I2C |
4096 bit |
2.5 V |
e3 |
260 |
.000005 Amp |
2.9 mm |
|||||||||||||||||||||
|
Microchip Technology |
EEPROM |
INDUSTRIAL |
5 |
LSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
TS 16949 |
GULL WING |
SERIAL |
SYNCHRONOUS |
1 mA |
16384 words |
1.8 |
8 |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
TSOP5/6,.11,37 |
200 |
.95 mm |
85 Cel |
OPEN-DRAIN |
16KX8 |
16K |
-40 Cel |
MATTE TIN |
1010DDDR |
DUAL |
1 |
SOFTWARE |
R-PDSO-G5 |
5.5 V |
1.45 mm |
1000000 Write/Erase Cycles |
1 MHz |
1.63 mm |
5 ms |
I2C |
131072 bit |
1.6 V |
e3 |
.000001 Amp |
2.95 mm |
1.8 |
|||||||||||||||||||||||
|
Microchip Technology |
EEPROM |
AUTOMOTIVE |
5 |
LSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
GULL WING |
SERIAL |
SYNCHRONOUS |
3 mA |
2048 words |
2.5 |
2/5 |
8 |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
TSOP5/6,.11,37 |
EEPROMs |
200 |
.95 mm |
125 Cel |
2KX8 |
2K |
-40 Cel |
MATTE TIN |
1010MMMR |
DUAL |
1 |
HARDWARE |
R-PDSO-G5 |
1 |
5.5 V |
1.45 mm |
1000000 Write/Erase Cycles |
.4 MHz |
1.63 mm |
Not Qualified |
5 ms |
I2C |
16384 bit |
1.7 V |
1.7V TO 2.5V @ 0.1MHz |
e3 |
260 |
.000005 Amp |
2.95 mm |
2.5 |
||||||||||||||||||
|
Microchip Technology |
EEPROM |
INDUSTRIAL |
5 |
LSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
GULL WING |
SERIAL |
SYNCHRONOUS |
3 mA |
1024 words |
2.5 |
8 |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
TSOP5/6,.11,37 |
200 |
.95 mm |
85 Cel |
OPEN-DRAIN |
1KX8 |
1K |
-40 Cel |
MATTE TIN |
1010XMMR |
DUAL |
1 |
HARDWARE |
R-PDSO-G5 |
1 |
5.5 V |
1.45 mm |
1000000 Write/Erase Cycles |
.4 MHz |
1.55 mm |
Not Qualified |
5 ms |
I2C |
8192 bit |
1.7 V |
1.7V TO 2.5V @ 0.1MHz |
e3 |
260 |
.000001 Amp |
2.9 mm |
2.5 |
|||||||||||||||||||
|
Microchip Technology |
EEPROM |
INDUSTRIAL |
5 |
LSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
3 mA |
4096 words |
2.5 |
2/5 |
8 |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
TSOP5/6,.11,37 |
EEPROMs |
200 |
.95 mm |
85 Cel |
4KX8 |
4K |
-40 Cel |
Matte Tin (Sn) - annealed |
1010000R |
DUAL |
HARDWARE |
R-PDSO-G5 |
1 |
5.5 V |
1.45 mm |
1000000 Write/Erase Cycles |
.1 MHz |
1.55 mm |
Not Qualified |
5 ms |
I2C |
32768 bit |
1.7 V |
2-WIRE SERIAL INTERFACE; DATA RETENTION > 200 YEARS; 1000000 ERASE/WRITE CYCLES GUARANTEED |
e3 |
40 |
260 |
.000001 Amp |
2.9 mm |
||||||||||||||||||||
|
Microchip Technology |
EEPROM |
AUTOMOTIVE |
5 |
LSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
3 mA |
128 words |
5 |
3/5 |
8 |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
TSOP5/6,.11,37 |
EEPROMs |
200 |
.95 mm |
125 Cel |
NO |
128X8 |
128 |
-40 Cel |
MATTE TIN |
1010XXXR |
DUAL |
HARDWARE |
R-PDSO-G5 |
1 |
5.5 V |
1.45 mm |
1000000 Write/Erase Cycles |
.4 MHz |
1.63 mm |
Not Qualified |
5 ms |
I2C |
1024 bit |
2.5 V |
e3 |
260 |
.000005 Amp |
2.95 mm |
|||||||||||||||||||||
|
Onsemi |
EEPROM |
INDUSTRIAL |
5 |
VSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
1 mA |
256 words |
2/5 |
8 |
SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH |
TSOP5/6,.11,37 |
EEPROMs |
100 |
.95 mm |
85 Cel |
256X8 |
256 |
-40 Cel |
NICKEL PALLADIUM GOLD |
1010000R |
DUAL |
HARDWARE |
R-PDSO-G5 |
1 |
5.5 V |
1 mm |
1000000 Write/Erase Cycles |
.4 MHz |
1.6 mm |
Not Qualified |
5 ms |
I2C |
2048 bit |
1.7 V |
e4 |
30 |
260 |
.000001 Amp |
2.9 mm |
||||||||||||||||||||||
|
Microchip Technology |
EEPROM |
INDUSTRIAL |
5 |
LSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
3 mA |
1024 words |
2.5 |
2/5 |
8 |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
TSOP5/6,.11,37 |
EEPROMs |
200 |
.95 mm |
85 Cel |
1KX8 |
1K |
-40 Cel |
MATTE TIN |
1010XMMR |
DUAL |
HARDWARE |
R-PDSO-G5 |
1 |
5.5 V |
1.45 mm |
1000000 Write/Erase Cycles |
.1 MHz |
1.55 mm |
Not Qualified |
5 ms |
I2C |
8192 bit |
1.7 V |
e3 |
260 |
.000001 Amp |
2.95 mm |
||||||||||||||||||||||
|
Microchip Technology |
EEPROM |
INDUSTRIAL |
5 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
GULL WING |
SERIAL |
SYNCHRONOUS |
3 mA |
256 words |
2.5 |
2/5 |
8 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP5/6,.08 |
EEPROMs |
200 |
.65 mm |
85 Cel |
OPEN-DRAIN |
256X8 |
256 |
-40 Cel |
Matte Tin (Sn) - annealed |
1010XXXR |
DUAL |
1 |
HARDWARE |
R-PDSO-G5 |
1 |
5.5 V |
1.1 mm |
1000000 Write/Erase Cycles |
.4 MHz |
1.25 mm |
Not Qualified |
5 ms |
I2C |
2048 bit |
1.7 V |
1.7V TO 2.5V @ 0.1MHz |
e3 |
40 |
260 |
.000001 Amp |
2 mm |
2.5 |
||||||||||||||||
|
STMicroelectronics |
EEPROM |
INDUSTRIAL |
5 |
VBCC |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
CMOS |
BUTT |
SERIAL |
SYNCHRONOUS |
8192 words |
8 |
CHIP CARRIER, VERY THIN PROFILE |
85 Cel |
8KX8 |
8K |
-40 Cel |
BOTTOM |
R-XBCC-B5 |
1 |
5.5 V |
.6 mm |
1 MHz |
1.4 mm |
5 ms |
I2C |
65536 bit |
1.7 V |
1.7 mm |
|||||||||||||||||||||||||||||||||||||
|
Microchip Technology |
EEPROM |
INDUSTRIAL |
5 |
VSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
TS 16949 |
GULL WING |
SERIAL |
SYNCHRONOUS |
1 mA |
256 words |
3 |
1.8/3.3 |
8 |
SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH |
TSOP5/6,.11,37 |
EEPROMs |
100 |
.95 mm |
85 Cel |
OPEN-DRAIN |
256X8 |
256 |
-40 Cel |
MATTE TIN |
1010DDDR |
DUAL |
1 |
HARDWARE |
R-PDSO-G5 |
3.6 V |
1 mm |
1000000 Write/Erase Cycles |
1 MHz |
1.6 mm |
Not Qualified |
5 ms |
I2C |
2048 bit |
2.5 V |
ALSO OPERATES AT 1.7V TO 3.6V @0.4MHZ |
e3 |
.0000008 Amp |
2.9 mm |
3 |
EEPROM, or Electrically Erasable Programmable Read-Only Memory, is a type of non-volatile computer memory that can store and retrieve data even when the power is turned off. EEPROM is commonly used in digital devices, such as computers, mobile phones, and digital cameras, to store configuration data, firmware, and other important information.
EEPROM works by storing data in a grid of memory cells that can be individually programmed and erased using electrical signals. Each memory cell consists of a transistor and a floating gate. The floating gate can hold an electric charge, which determines the state of the memory cell. To write data to the EEPROM, an electrical signal is applied to the transistor, which charges or discharges the floating gate. To read data from the EEPROM, an electrical signal is applied to the transistor, which determines the state of the floating gate.
One of the advantages of EEPROM is that it is non-volatile, which means that it can store data even when the power is turned off. This makes it ideal for storing critical data, such as system settings and firmware, that must be retained even in the absence of power.
EEPROM can also be reprogrammed and erased many times, which makes it a versatile and flexible memory technology. EEPROM can be programmed and erased in blocks or individually, depending on the specific requirements of the application.
One of the disadvantages of EEPROM is that it is slower than other types of computer memory, such as RAM or cache memory. EEPROM access times are measured in microseconds, which is much slower than access times for other types of memory. This makes EEPROM less suitable for applications that require high-speed data access.