Part | RoHS | Manufacturer | Memory IC Type | Temperature Grade | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | Surface Mount | No. of Functions | Technology | Screening Level | Terminal Form | Parallel or Serial | Operating Mode | Sector Size (Words) | Maximum Supply Current | No. of Words | Input/Output Type | Nominal Supply Voltage / Vsup (V) | Toggle Bit | Power Supplies (V) | Memory Width | Package Style (Meter) | Package Equivalence Code | Alternate Memory Width | Sub-Category | Minimum Data Retention Time | Terminal Pitch | Maximum Operating Temperature | Reverse Pinout | Output Characteristics | Organization | No. of Words Code | Minimum Operating Temperature | No. of Sectors/Size | Command User Interface | Terminal Finish | I2C Control Byte | Ready or Busy | Terminal Position | No. of Ports | Write Protection | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Endurance | Maximum Clock Frequency (fCLK) | Width | Qualification | Maximum Write Cycle Time (tWC) | Serial Bus Type | Boot Block | Memory Density | Minimum Supply Voltage (Vsup) | Additional Features | Page Size (words) | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Type | Maximum Standby Current | Length | Common Flash Interface | Maximum Access Time | Programming Voltage (V) | Data Polling |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Microchip Technology |
EEPROM |
INDUSTRIAL |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
TS 16949 |
THROUGH-HOLE |
SERIAL |
SYNCHRONOUS |
2 mA |
256 words |
2.5 |
YES |
3/5 |
16 |
IN-LINE |
DIP8,.3 |
EEPROMs |
200 |
2.54 mm |
85 Cel |
NO |
TOTEM POLE |
256X16 |
256 |
-40 Cel |
MATTE TIN |
YES |
DUAL |
1 |
SOFTWARE |
R-PDIP-T8 |
5.5 V |
5.33 mm |
1000000 Write/Erase Cycles |
1 MHz |
7.62 mm |
Not Qualified |
6 ms |
MICROWIRE |
4096 bit |
1.8 V |
1000000 ERASE/WRITE CYCLES MIN; DATA RETENTION > 200 YEARS |
e3 |
.000001 Amp |
9.27 mm |
||||||||||||||||||
Atmel |
EEPROM |
COMMERCIAL |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
15 mA |
32768 words |
3.3 |
YES |
3.3 |
8 |
IN-LINE |
DIP28,.6 |
EEPROMs |
2.54 mm |
70 Cel |
3-STATE |
32KX8 |
32K |
0 Cel |
NO |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDIP-T28 |
3.465 V |
5.59 mm |
10000 Write/Erase Cycles |
15.24 mm |
Not Qualified |
10 ms |
262144 bit |
3.135 V |
AUTOMATIC WRITE |
64 |
e0 |
.00002 Amp |
36.95 mm |
250 ns |
3 |
YES |
||||||||||||||||||||||
Microchip Technology |
EEPROM |
INDUSTRIAL |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
SERIAL |
SYNCHRONOUS |
3 mA |
256 words |
5 |
8 |
IN-LINE |
DIP8,.3 |
100 |
2.54 mm |
85 Cel |
256X8 |
256 |
-40 Cel |
1010DDDR |
DUAL |
HARDWARE |
R-PDIP-T8 |
5.5 V |
5.334 mm |
1000000 Write/Erase Cycles |
1 MHz |
7.62 mm |
5 ms |
I2C |
2048 bit |
4.5 V |
.000018 Amp |
9.271 mm |
5 |
|||||||||||||||||||||||||||||
|
Microchip Technology |
EEPROM |
INDUSTRIAL |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
SERIAL |
SYNCHRONOUS |
3 mA |
65536 words |
4.5 |
3/5 |
8 |
IN-LINE |
DIP8,.3 |
EEPROMs |
200 |
2.54 mm |
85 Cel |
64KX8 |
64K |
-40 Cel |
MATTE TIN |
1010DDDR |
DUAL |
HARDWARE |
R-PDIP-T8 |
5.5 V |
5.334 mm |
1000000 Write/Erase Cycles |
.4 MHz |
7.62 mm |
Not Qualified |
5 ms |
I2C |
524288 bit |
2.5 V |
e3 |
.000001 Amp |
9.271 mm |
||||||||||||||||||||||||
|
Atmel |
EEPROM |
INDUSTRIAL |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
SERIAL |
SYNCHRONOUS |
3 mA |
8192 words |
3 |
3/5 |
8 |
IN-LINE |
DIP8,.3 |
EEPROMs |
100 |
2.54 mm |
85 Cel |
8KX8 |
8K |
-40 Cel |
MATTE TIN |
1010DDDR |
DUAL |
HARDWARE |
R-PDIP-T8 |
1 |
5.5 V |
5.334 mm |
1000000 Write/Erase Cycles |
.4 MHz |
7.62 mm |
Not Qualified |
20 ms |
I2C |
65536 bit |
2.7 V |
e3 |
260 |
.000002 Amp |
9.271 mm |
||||||||||||||||||||||
|
Microchip Technology |
EEPROM |
INDUSTRIAL |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
SERIAL |
SYNCHRONOUS |
3 mA |
8192 words |
2.5 |
2/5 |
8 |
IN-LINE |
DIP8,.3 |
EEPROMs |
200 |
2.54 mm |
85 Cel |
8KX8 |
8K |
-40 Cel |
MATTE TIN |
1010DDDR |
DUAL |
HARDWARE |
R-PDIP-T8 |
5.5 V |
5.334 mm |
1000000 Write/Erase Cycles |
.4 MHz |
7.62 mm |
Not Qualified |
5 ms |
I2C |
65536 bit |
1.7 V |
e3 |
.000001 Amp |
9.271 mm |
||||||||||||||||||||||||
|
Microchip Technology |
EEPROM |
INDUSTRIAL |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
SERIAL |
SYNCHRONOUS |
3 mA |
8192 words |
5 |
8 |
IN-LINE |
DIP8,.3 |
100 |
2.54 mm |
85 Cel |
8KX8 |
8K |
-40 Cel |
1010DDDR |
DUAL |
HARDWARE |
R-PDIP-T8 |
5.5 V |
5.334 mm |
1000000 Write/Erase Cycles |
1 MHz |
7.62 mm |
5 ms |
I2C |
65536 bit |
1.8 V |
IT ALSO OPERATES AT 0.4MHZ AT 1.8MIN SUPPLY |
32 |
.000006 Amp |
9.271 mm |
5 |
||||||||||||||||||||||||||
|
Microchip Technology |
EEPROM |
INDUSTRIAL |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
SERIAL |
SYNCHRONOUS |
3 mA |
4096 words |
2.5 |
2/5 |
8 |
IN-LINE |
DIP8,.3 |
EEPROMs |
200 |
2.54 mm |
85 Cel |
4KX8 |
4K |
-40 Cel |
MATTE TIN |
1010DDDR |
DUAL |
HARDWARE |
R-PDIP-T8 |
5.5 V |
5.33 mm |
1000000 Write/Erase Cycles |
.1 MHz |
7.62 mm |
Not Qualified |
5 ms |
I2C |
32768 bit |
1.7 V |
2-WIRE SERIAL INTERFACE; DATA RETENTION > 200 YEARS; 1000000 ERASE/WRITE CYCLES GUARANTEED |
e3 |
.000001 Amp |
9.27 mm |
|||||||||||||||||||||||
|
Microchip Technology |
EEPROM |
AUTOMOTIVE |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
AEC-Q100 |
THROUGH-HOLE |
SERIAL |
SYNCHRONOUS |
10 mA |
131072 words |
5 |
3/5 |
8 |
IN-LINE |
DIP8,.3 |
Flash Memories |
200 |
2.54 mm |
125 Cel |
128KX8 |
128K |
-40 Cel |
MATTE TIN |
DUAL |
1 |
HARDWARE/SOFTWARE |
R-PDIP-T8 |
5.5 V |
5.334 mm |
1000000 Write/Erase Cycles |
10 MHz |
7.62 mm |
Not Qualified |
6 ms |
SPI |
1048576 bit |
2.5 V |
200 YEARS OF DATA RETENTION; 1000000 ENDURANCE CYCLES/WORD |
e3 |
NOR TYPE |
.00002 Amp |
9.271 mm |
5 |
||||||||||||||||||||
Microchip Technology |
EEPROM |
MILITARY |
28 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
8192 words |
5 |
8 |
IN-LINE |
10 |
2.54 mm |
125 Cel |
8KX8 |
8K |
-55 Cel |
TIN LEAD |
DUAL |
R-GDIP-T28 |
5.5 V |
5.72 mm |
10000 Write/Erase Cycles |
15.24 mm |
Not Qualified |
65536 bit |
4.5 V |
AUTOMATIC WRITE; 10K ENDURANCE WRITE CYCLES; DATA RETENTION = 10 YEARS |
e0 |
37.25 mm |
350 ns |
5 |
||||||||||||||||||||||||||||||||
STMicroelectronics |
EEPROM |
INDUSTRIAL |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
SERIAL |
SYNCHRONOUS |
1 mA |
8192 words |
5 |
3/5 |
8 |
IN-LINE |
DIP8,.3 |
EEPROMs |
40 |
2.54 mm |
85 Cel |
OPEN-DRAIN |
8KX8 |
8K |
-40 Cel |
TIN LEAD |
1010DDDR |
DUAL |
HARDWARE |
R-PDIP-T8 |
5.5 V |
5.33 mm |
1000000 Write/Erase Cycles |
.4 MHz |
7.62 mm |
Not Qualified |
10 ms |
I2C |
65536 bit |
2.5 V |
e0 |
.000002 Amp |
9.27 mm |
||||||||||||||||||||||||
|
Microchip Technology |
EEPROM |
INDUSTRIAL |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
AEC-Q100 |
THROUGH-HOLE |
SERIAL |
SYNCHRONOUS |
3 mA |
8192 words |
4.5 |
2/5 |
8 |
IN-LINE |
DIP8,.3 |
EEPROMs |
200 |
2.54 mm |
85 Cel |
OPEN-DRAIN |
8KX8 |
8K |
-40 Cel |
MATTE TIN |
1010DDDR |
DUAL |
1 |
HARDWARE |
R-PDIP-T8 |
5.5 V |
5.334 mm |
1000000 Write/Erase Cycles |
1 MHz |
7.62 mm |
Not Qualified |
5 ms |
I2C |
65536 bit |
2.5 V |
ALSO OPERATES AT 1.7V TO 2.5V @ 0.4MHZ |
e3 |
.000001 Amp |
9.271 mm |
4.5 |
|||||||||||||||||||
|
Microchip Technology |
EEPROM |
AUTOMOTIVE |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
SERIAL |
SYNCHRONOUS |
5 mA |
65536 words |
4.5 |
3/5 |
8 |
IN-LINE |
DIP8,.3 |
EEPROMs |
200 |
2.54 mm |
125 Cel |
64KX8 |
64K |
-40 Cel |
MATTE TIN |
1010DDDR |
DUAL |
HARDWARE |
R-PDIP-T8 |
5.5 V |
5.334 mm |
1000000 Write/Erase Cycles |
.4 MHz |
7.62 mm |
Not Qualified |
5 ms |
I2C |
524288 bit |
2.5 V |
e3 |
.000005 Amp |
9.271 mm |
||||||||||||||||||||||||
|
Microchip Technology |
EEPROM |
INDUSTRIAL |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
SERIAL |
SYNCHRONOUS |
2 mA |
64 words |
5 |
2/5 |
16 |
IN-LINE |
DIP8,.3 |
8 |
EEPROMs |
100 |
2.54 mm |
85 Cel |
64X16 |
64 |
-40 Cel |
MATTE TIN |
DUAL |
1 |
R-PDIP-T8 |
5.5 V |
5.33 mm |
1000000 Write/Erase Cycles |
2 MHz |
7.62 mm |
Not Qualified |
5 ms |
3-WIRE |
1024 bit |
4.5 V |
2.7V TO 5.5V @ 1MHz AND 1.8V TO 5.5V @ 0.25MHz |
e3 |
.000015 Amp |
9.271 mm |
5 |
||||||||||||||||||||||
|
Microchip Technology |
EEPROM |
INDUSTRIAL |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
AEC-Q100 |
THROUGH-HOLE |
SERIAL |
SYNCHRONOUS |
5 mA |
131072 words |
2.5 |
2/5 |
8 |
IN-LINE |
DIP8,.3 |
EEPROMs |
200 |
2.54 mm |
85 Cel |
OPEN-DRAIN |
128KX8 |
128K |
-40 Cel |
MATTE TIN |
1010MDDR |
DUAL |
1 |
HARDWARE |
R-PDIP-T8 |
5.5 V |
5.334 mm |
1000000 Write/Erase Cycles |
.4 MHz |
7.62 mm |
Not Qualified |
5 ms |
I2C |
1048576 bit |
1.7 V |
e3 |
.000005 Amp |
9.271 mm |
2.5 |
||||||||||||||||||||
Atmel |
EEPROM |
INDUSTRIAL |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
MIL-STD-883 |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
50 mA |
32768 words |
5 |
YES |
5 |
8 |
IN-LINE |
DIP28,.6 |
EEPROMs |
2.54 mm |
85 Cel |
3-STATE |
32KX8 |
32K |
-40 Cel |
NO |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDIP-T28 |
5.5 V |
4.826 mm |
10000 Write/Erase Cycles |
15.24 mm |
Not Qualified |
10 ms |
262144 bit |
4.5 V |
AUTOMATIC WRITE |
64 |
e0 |
30 |
240 |
.0002 Amp |
37.0205 mm |
150 ns |
5 |
YES |
|||||||||||||||||||
|
Microchip Technology |
EEPROM |
INDUSTRIAL |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
SERIAL |
SYNCHRONOUS |
3 mA |
2048 words |
5 |
2/5 |
8 |
IN-LINE |
DIP8,.3 |
EEPROMs |
200 |
2.54 mm |
85 Cel |
2KX8 |
2K |
-40 Cel |
MATTE TIN |
1010MMMR |
DUAL |
HARDWARE |
R-PDIP-T8 |
5.5 V |
4.32 mm |
1000000 Write/Erase Cycles |
.4 MHz |
7.62 mm |
Not Qualified |
5 ms |
I2C |
16384 bit |
2.5 V |
1000K ERASE/WRITE CYCLES; CAN BE ORGANIZED AS 8 BLOCKS OF 256 BYTES; DATA RETENTION >200 YEARS |
e3 |
.000001 Amp |
9.46 mm |
|||||||||||||||||||||||
|
Microchip Technology |
EEPROM |
INDUSTRIAL |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
AEC-Q100 |
THROUGH-HOLE |
SERIAL |
SYNCHRONOUS |
10 mA |
65536 words |
5 |
2.5/5 |
8 |
IN-LINE |
DIP8,.3 |
EEPROMs |
200 |
2.54 mm |
85 Cel |
64KX8 |
64K |
-40 Cel |
MATTE TIN |
DUAL |
1 |
HARDWARE/SOFTWARE |
R-PDIP-T8 |
5.5 V |
5.334 mm |
1000000 Write/Erase Cycles |
20 MHz |
7.62 mm |
Not Qualified |
5 ms |
SPI |
524288 bit |
4.5 V |
2.5V TO 5.5V @ 0.1MHz |
e3 |
260 |
.000001 Amp |
9.271 mm |
5 |
||||||||||||||||||||
|
STMicroelectronics |
EEPROM |
INDUSTRIAL |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
SERIAL |
SYNCHRONOUS |
2 mA |
1024 words |
5 |
3/5 |
8 |
IN-LINE |
DIP8,.3 |
EEPROMs |
40 |
2.54 mm |
85 Cel |
1KX8 |
1K |
-40 Cel |
Matte Tin (Sn) - annealed |
1010DMMR |
DUAL |
HARDWARE |
R-PDIP-T8 |
5.5 V |
5.33 mm |
1000000 Write/Erase Cycles |
.4 MHz |
7.62 mm |
Not Qualified |
5 ms |
I2C |
8192 bit |
2.5 V |
e3 |
NOT SPECIFIED |
NOT SPECIFIED |
.000001 Amp |
9.27 mm |
||||||||||||||||||||||
|
Microchip Technology |
EEPROM |
INDUSTRIAL |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
TS 16949 |
THROUGH-HOLE |
SERIAL |
SYNCHRONOUS |
2 mA |
256 words |
2.5 |
YES |
5 |
16 |
IN-LINE |
DIP8,.3 |
8 |
EEPROMs |
200 |
2.54 mm |
85 Cel |
NO |
TOTEM POLE |
256X16 |
256 |
-40 Cel |
MATTE TIN |
YES |
DUAL |
SOFTWARE |
R-PDIP-T8 |
5.5 V |
5.33 mm |
1000000 Write/Erase Cycles |
3 MHz |
7.62 mm |
Not Qualified |
2 ms |
MICROWIRE |
4096 bit |
1.8 V |
ALSO CONFIGURABLE AS 512 X 8 |
e3 |
.000001 Amp |
9.27 mm |
||||||||||||||||||
|
STMicroelectronics |
EEPROM |
INDUSTRIAL |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
SERIAL |
SYNCHRONOUS |
2 mA |
512 words |
5 |
3/5 |
8 |
IN-LINE |
DIP8,.3 |
EEPROMs |
40 |
2.54 mm |
85 Cel |
512X8 |
512 |
-40 Cel |
Matte Tin (Sn) - annealed |
1010DDMR |
DUAL |
HARDWARE |
R-PDIP-T8 |
5.5 V |
5.33 mm |
1000000 Write/Erase Cycles |
.4 MHz |
7.62 mm |
Not Qualified |
5 ms |
I2C |
4096 bit |
2.5 V |
e3 |
NOT SPECIFIED |
NOT SPECIFIED |
.000001 Amp |
9.27 mm |
||||||||||||||||||||||
Xicor |
EEPROM |
COMMERCIAL |
24 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
NMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
140 mA |
2048 words |
5 |
NO |
5 |
8 |
IN-LINE |
DIP24,.6 |
EEPROMs |
100 |
2.54 mm |
70 Cel |
3-STATE |
2KX8 |
2K |
0 Cel |
NO |
TIN LEAD |
DUAL |
R-PDIP-T24 |
5.5 V |
4.82 mm |
15.24 mm |
Not Qualified |
16384 bit |
4.5 V |
16 BYTE PAGE WRITE; OVER 100 YEARS DATA RETENTION |
16 |
e0 |
.07 Amp |
31.56 mm |
250 ns |
5 |
YES |
|||||||||||||||||||||||
|
Microchip Technology |
EEPROM |
COMMERCIAL |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
TS 16949 |
THROUGH-HOLE |
SERIAL |
SYNCHRONOUS |
3 mA |
8192 words |
5 |
3/5 |
8 |
IN-LINE |
DIP8,.3 |
EEPROMs |
200 |
2.54 mm |
70 Cel |
OPEN-DRAIN |
8KX8 |
8K |
0 Cel |
MATTE TIN |
1010DDDR |
DUAL |
1 |
R-PDIP-T8 |
6 V |
4.32 mm |
1000000 Write/Erase Cycles |
.1 MHz |
7.62 mm |
Not Qualified |
5 ms |
I2C |
65536 bit |
2.5 V |
e3 |
.000005 Amp |
9.46 mm |
5 |
|||||||||||||||||||||
|
Microchip Technology |
EEPROM |
INDUSTRIAL |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
TS 16949 |
THROUGH-HOLE |
SERIAL |
SYNCHRONOUS |
2 mA |
64 words |
3 |
3/5 |
16 |
IN-LINE |
DIP8,.3 |
EEPROMs |
200 |
2.54 mm |
85 Cel |
NO |
TOTEM POLE |
64X16 |
64 |
-40 Cel |
MATTE TIN |
YES |
DUAL |
1 |
SOFTWARE |
R-PDIP-T8 |
5.5 V |
5.334 mm |
1000000 Write/Erase Cycles |
2 MHz |
7.62 mm |
Not Qualified |
6 ms |
MICROWIRE |
1024 bit |
2.5 V |
1000000 ERASE/WRITE CYCLES MIN; DATA RETENTION > 200 YEARS |
e3 |
.000001 Amp |
9.27 mm |
|||||||||||||||||||
|
Microchip Technology |
EEPROM |
INDUSTRIAL |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
TS 16949 |
THROUGH-HOLE |
SERIAL |
SYNCHRONOUS |
2 mA |
64 words |
3 |
3/5 |
16 |
IN-LINE |
DIP8,.3 |
8 |
EEPROMs |
200 |
2.54 mm |
85 Cel |
NO |
TOTEM POLE |
64X16 |
64 |
-40 Cel |
MATTE TIN |
YES |
DUAL |
1 |
SOFTWARE |
R-PDIP-T8 |
5.5 V |
5.334 mm |
1000000 Write/Erase Cycles |
3 MHz |
7.62 mm |
Not Qualified |
6 ms |
MICROWIRE |
1024 bit |
2.5 V |
e3 |
260 |
.000001 Amp |
9.27 mm |
||||||||||||||||||
Microchip Technology |
EEPROM |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
THROUGH-HOLE |
SERIAL |
SYNCHRONOUS |
3 mA |
16384 words |
3 |
8 |
IN-LINE |
DIP8,.3 |
40 |
.4 mm |
85 Cel |
16KX8 |
16K |
-40 Cel |
DUAL |
HARDWARE/SOFTWARE |
R-PDIP-T8 |
3.6 V |
.4 mm |
1000000 Write/Erase Cycles |
1 MHz |
1.8 mm |
5 ms |
I2C |
131072 bit |
1.8 V |
.000006 Amp |
2.2 mm |
3 |
|||||||||||||||||||||||||||||||
|
Microchip Technology |
EEPROM |
INDUSTRIAL |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
TS 16949 |
THROUGH-HOLE |
SERIAL |
SYNCHRONOUS |
3 mA |
512 words |
3 |
8 |
IN-LINE |
DIP8,.3 |
100 |
2.54 mm |
85 Cel |
OPEN-DRAIN |
512X8 |
512 |
-40 Cel |
MATTE TIN |
1010DDDR |
DUAL |
1 |
HARDWARE |
R-PDIP-T8 |
5.5 V |
5.334 mm |
1000000 Write/Erase Cycles |
1 MHz |
7.62 mm |
5 ms |
I2C |
4096 bit |
2.5 V |
ALSO OPERATES AT 1.7V TO 2.5V @0.4MHZ |
e3 |
.000006 Amp |
9.271 mm |
3 |
||||||||||||||||||||||
Atmel |
EEPROM |
COMMERCIAL |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
MIL-STD-883 |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
50 mA |
32768 words |
5 |
YES |
5 |
8 |
IN-LINE |
DIP28,.6 |
EEPROMs |
10 |
2.54 mm |
70 Cel |
3-STATE |
32KX8 |
32K |
0 Cel |
NO |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDIP-T28 |
1 |
5.5 V |
4.826 mm |
10000 Write/Erase Cycles |
15.24 mm |
Not Qualified |
10 ms |
262144 bit |
4.5 V |
AUTOMATIC WRITE |
64 |
e0 |
30 |
225 |
.0002 Amp |
37.0205 mm |
150 ns |
5 |
YES |
|||||||||||||||||
|
Microchip Technology |
EEPROM |
INDUSTRIAL |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
TS 16949 |
THROUGH-HOLE |
SERIAL |
SYNCHRONOUS |
3 mA |
256 words |
2.5 |
2/5 |
8 |
IN-LINE |
DIP8,.3 |
EEPROMs |
200 |
2.54 mm |
85 Cel |
OPEN-DRAIN |
256X8 |
256 |
-40 Cel |
MATTE TIN |
1010DDDR |
DUAL |
1 |
HARDWARE |
R-PDIP-T8 |
5.5 V |
5.334 mm |
1000000 Write/Erase Cycles |
.4 MHz |
7.62 mm |
Not Qualified |
5 ms |
I2C |
2048 bit |
1.7 V |
e3 |
.000001 Amp |
9.271 mm |
2.5 |
||||||||||||||||||||
Microchip Technology |
EEPROM |
MILITARY |
28 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
CMOS |
MIL-STD-883 Class B |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
50 mA |
32768 words |
5 |
YES |
8 |
IN-LINE |
DIP28,.6 |
10 |
2.54 mm |
125 Cel |
32KX8 |
32K |
-55 Cel |
NO |
DUAL |
1 |
R-GDIP-T28 |
5.5 V |
5.72 mm |
10000 Write/Erase Cycles |
15.24 mm |
3 ms |
262144 bit |
4.5 V |
64 |
NOT SPECIFIED |
NOT SPECIFIED |
.0003 Amp |
37.215 mm |
150 ns |
5 |
YES |
||||||||||||||||||||||||
|
Microchip Technology |
EEPROM |
INDUSTRIAL |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
SERIAL |
SYNCHRONOUS |
2 mA |
1024 words |
5 |
3/5 |
16 |
IN-LINE |
DIP8,.3 |
8 |
EEPROMs |
100 |
2.54 mm |
85 Cel |
1KX16 |
1K |
-40 Cel |
MATTE TIN |
DUAL |
1 |
SOFTWARE |
R-PDIP-T8 |
5.5 V |
5.334 mm |
1000000 Write/Erase Cycles |
2 MHz |
7.62 mm |
Not Qualified |
10 ms |
MICROWIRE |
16384 bit |
2.7 V |
OPERATES AT 1 MHz AT MIN 2.7V |
e3 |
.00001 Amp |
9.271 mm |
5 |
|||||||||||||||||||||
|
Microchip Technology |
EEPROM |
INDUSTRIAL |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
TS 16949 |
THROUGH-HOLE |
SERIAL |
SYNCHRONOUS |
2 mA |
128 words |
5 |
YES |
3/5 |
16 |
IN-LINE |
DIP8,.3 |
8 |
EEPROMs |
200 |
2.54 mm |
85 Cel |
NO |
TOTEM POLE |
128X16 |
128 |
-40 Cel |
MATTE TIN |
YES |
DUAL |
1 |
SOFTWARE |
R-PDIP-T8 |
5.5 V |
5.334 mm |
1000000 Write/Erase Cycles |
2 MHz |
7.62 mm |
Not Qualified |
6 ms |
MICROWIRE |
2048 bit |
2.5 V |
e3 |
.000001 Amp |
9.271 mm |
||||||||||||||||||
|
Microchip Technology |
EEPROM |
INDUSTRIAL |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
SERIAL |
SYNCHRONOUS |
10 mA |
1048576 words |
3.3 |
3.3/5 |
1 |
IN-LINE |
DIP8,.3 |
EEPROMs |
90 |
2.54 mm |
85 Cel |
1MX1 |
1M |
-40 Cel |
MATTE TIN |
DUAL |
HARDWARE |
R-PDIP-T8 |
3.6 V |
5.334 mm |
100000 Write/Erase Cycles |
10 MHz |
7.62 mm |
Not Qualified |
1048576 bit |
3 V |
IT CAN OPERATES ON 4.75-5.25 RANGE SUPPLY VOLTAGE ALSO |
e3 |
.0002 Amp |
9.271 mm |
||||||||||||||||||||||||||
|
Microchip Technology |
EEPROM |
INDUSTRIAL |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
SERIAL |
SYNCHRONOUS |
10 mA |
1048576 words |
3.3 |
3.3/5 |
1 |
IN-LINE |
DIP8,.3 |
EEPROMs |
2.54 mm |
85 Cel |
1MX1 |
1M |
-40 Cel |
MATTE TIN |
DUAL |
HARDWARE |
R-PDIP-T8 |
3.6 V |
5.334 mm |
15 MHz |
7.62 mm |
Not Qualified |
1048576 bit |
3 V |
ALSO OPERATES AT 5V SUPPLY |
e3 |
9.271 mm |
|||||||||||||||||||||||||||||
|
Microchip Technology |
EEPROM |
INDUSTRIAL |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
TS 16949 |
THROUGH-HOLE |
SERIAL |
SYNCHRONOUS |
5 mA |
131072 words |
2.5 |
2/5 |
8 |
IN-LINE |
DIP8,.3 |
EEPROMs |
200 |
2.54 mm |
85 Cel |
128KX8 |
128K |
-40 Cel |
MATTE TIN |
1010DDMR |
DUAL |
1 |
HARDWARE |
R-PDIP-T8 |
5.5 V |
5.334 mm |
1000000 Write/Erase Cycles |
1 MHz |
7.62 mm |
Not Qualified |
5 ms |
I2C |
1048576 bit |
1.8 V |
e3 |
.000005 Amp |
9.271 mm |
2.5 |
|||||||||||||||||||||
|
Microchip Technology |
EEPROM |
INDUSTRIAL |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
TS 16949 |
THROUGH-HOLE |
SERIAL |
SYNCHRONOUS |
2 mA |
64 words |
5 |
5 |
16 |
IN-LINE |
DIP8,.3 |
EEPROMs |
200 |
2.54 mm |
85 Cel |
NO |
TOTEM POLE |
64X16 |
64 |
-40 Cel |
MATTE TIN |
YES |
DUAL |
1 |
SOFTWARE |
R-PDIP-T8 |
5.5 V |
5.334 mm |
1000000 Write/Erase Cycles |
3 MHz |
7.62 mm |
Not Qualified |
6 ms |
MICROWIRE |
1024 bit |
4.5 V |
1000000 ERASE/WRITE CYCLES; DATA RETENTION > 200 YEARS |
e3 |
.000001 Amp |
9.27 mm |
|||||||||||||||||||
|
Microchip Technology |
EEPROM |
COMMERCIAL |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
SERIAL |
SYNCHRONOUS |
1.5 mA |
64 words |
5 |
5 |
16 |
IN-LINE |
DIP8,.3 |
EEPROMs |
200 |
2.54 mm |
70 Cel |
64X16 |
64 |
0 Cel |
MATTE TIN |
DUAL |
1 |
HARDWARE/SOFTWARE |
R-PDIP-T8 |
5.5 V |
5.334 mm |
1000000 Write/Erase Cycles |
2 MHz |
7.62 mm |
Not Qualified |
2 ms |
MICROWIRE |
1024 bit |
4.5 V |
e3 |
.000001 Amp |
9.271 mm |
5 |
|||||||||||||||||||||||
|
Microchip Technology |
EEPROM |
INDUSTRIAL |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
TS 16949 |
THROUGH-HOLE |
SERIAL |
SYNCHRONOUS |
1 mA |
128 words |
3 |
1.8/3.3 |
8 |
IN-LINE |
DIP8,.3 |
EEPROMs |
100 |
2.54 mm |
85 Cel |
OPEN-DRAIN |
128X8 |
128 |
-40 Cel |
MATTE TIN |
1010DDDR |
DUAL |
1 |
HARDWARE |
R-PDIP-T8 |
3.6 V |
5.334 mm |
1000000 Write/Erase Cycles |
1 MHz |
7.62 mm |
Not Qualified |
5 ms |
I2C |
1024 bit |
2.5 V |
ALSO OPERATES AT 1.7V TO 3.6V @0.4MHZ |
e3 |
.0000008 Amp |
9.271 mm |
3 |
|||||||||||||||||||
|
STMicroelectronics |
EEPROM |
INDUSTRIAL |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
SERIAL |
SYNCHRONOUS |
2 mA |
128 words |
5 |
3/5 |
8 |
IN-LINE |
DIP8,.3 |
EEPROMs |
40 |
2.54 mm |
85 Cel |
128X8 |
128 |
-40 Cel |
MATTE TIN |
1010DDDR |
DUAL |
HARDWARE |
R-PDIP-T8 |
5.5 V |
5.33 mm |
1000000 Write/Erase Cycles |
.4 MHz |
7.62 mm |
Not Qualified |
5 ms |
I2C |
1024 bit |
2.5 V |
e3 |
.000001 Amp |
9.27 mm |
||||||||||||||||||||||||
|
Microchip Technology |
EEPROM |
INDUSTRIAL |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
TS 16949 |
THROUGH-HOLE |
SERIAL |
SYNCHRONOUS |
2 mA |
128 words |
5 |
YES |
5 |
16 |
IN-LINE |
DIP8,.3 |
8 |
EEPROMs |
200 |
2.54 mm |
85 Cel |
NO |
TOTEM POLE |
128X16 |
128 |
-40 Cel |
MATTE TIN |
YES |
DUAL |
1 |
SOFTWARE |
R-PDIP-T8 |
5.5 V |
5.334 mm |
1000000 Write/Erase Cycles |
3 MHz |
7.62 mm |
Not Qualified |
2 ms |
MICROWIRE |
2048 bit |
4.5 V |
e3 |
.000001 Amp |
9.271 mm |
||||||||||||||||||
|
Microchip Technology |
EEPROM |
INDUSTRIAL |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
SERIAL |
SYNCHRONOUS |
3 mA |
256 words |
3 |
3/5 |
8 |
IN-LINE |
DIP8,.3 |
EEPROMs |
100 |
2.54 mm |
85 Cel |
256X8 |
256 |
-40 Cel |
MATTE TIN |
1010DDDR |
DUAL |
HARDWARE |
R-PDIP-T8 |
5.5 V |
5.334 mm |
1000000 Write/Erase Cycles |
.4 MHz |
7.62 mm |
Not Qualified |
5 ms |
I2C |
2048 bit |
2.7 V |
DATA RETENTION 100 YEARS; 1 MILLION ENDURANCE WRITE CYCLES |
e3 |
250 |
.000004 Amp |
9.271 mm |
||||||||||||||||||||||
|
Microchip Technology |
EEPROM |
INDUSTRIAL |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
SERIAL |
SYNCHRONOUS |
3 mA |
256 words |
5 |
3/5 |
8 |
IN-LINE |
DIP8,.3 |
EEPROMs |
200 |
2.54 mm |
85 Cel |
256X8 |
256 |
-40 Cel |
MATTE TIN |
1010XXXR |
DUAL |
HARDWARE |
R-PDIP-T8 |
5.5 V |
5.334 mm |
1000000 Write/Erase Cycles |
.4 MHz |
7.62 mm |
Not Qualified |
5 ms |
I2C |
2048 bit |
2.5 V |
e3 |
.000001 Amp |
9.27 mm |
||||||||||||||||||||||||
|
Microchip Technology |
EEPROM |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
AEC-Q100 |
THROUGH-HOLE |
SERIAL |
SYNCHRONOUS |
3 mA |
512 words |
5 |
3/5 |
8 |
IN-LINE |
DIP8,.3 |
EEPROMs |
200 |
2.54 mm |
85 Cel |
OPEN-DRAIN |
512X8 |
512 |
-40 Cel |
MATTE TIN |
1010XXMR |
DUAL |
1 |
HARDWARE |
R-PDIP-T8 |
5.5 V |
5.334 mm |
1000000 Write/Erase Cycles |
.4 MHz |
7.62 mm |
Not Qualified |
5 ms |
I2C |
4096 bit |
2.5 V |
e3 |
.000001 Amp |
9.271 mm |
5 |
|||||||||||||||||||||
|
Microchip Technology |
EEPROM |
INDUSTRIAL |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
TS 16949 |
THROUGH-HOLE |
SERIAL |
SYNCHRONOUS |
3 mA |
128 words |
3 |
3/5 |
16 |
IN-LINE |
DIP8,.3 |
8 |
EEPROMs |
200 |
2.54 mm |
85 Cel |
128X16 |
128 |
-40 Cel |
MATTE TIN |
DUAL |
1 |
SOFTWARE |
R-PDIP-T8 |
5.5 V |
5.334 mm |
1000000 Write/Erase Cycles |
2 MHz |
7.62 mm |
Not Qualified |
10 ms |
MICROWIRE |
2048 bit |
2.5 V |
e3 |
.0001 Amp |
9.271 mm |
3 |
|||||||||||||||||||||
|
Microchip Technology |
EEPROM |
INDUSTRIAL |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
AEC-Q100 |
THROUGH-HOLE |
SERIAL |
SYNCHRONOUS |
3 mA |
128 words |
2.5 |
8 |
IN-LINE |
DIP8,.3 |
200 |
2.54 mm |
85 Cel |
128X8 |
128 |
-40 Cel |
1010XXXR |
DUAL |
1 |
HARDWARE |
R-PDIP-T8 |
5.5 V |
5.334 mm |
1000000 Write/Erase Cycles |
1 MHz |
7.62 mm |
5 ms |
I2C |
1024 bit |
1.7 V |
.000001 Amp |
9.271 mm |
2.5 |
||||||||||||||||||||||||||
Microchip Technology |
EEPROM |
INDUSTRIAL |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
SERIAL |
SYNCHRONOUS |
3 mA |
131072 words |
8 |
IN-LINE |
DIP8,.3 |
40 |
2.54 mm |
85 Cel |
OPEN-DRAIN |
128KX8 |
128K |
-40 Cel |
1010DDMR |
DUAL |
HARDWARE/SOFTWARE |
R-PDIP-T8 |
5 V |
5.33 mm |
1000000 Write/Erase Cycles |
1 MHz |
7.62 mm |
5 ms |
I2C |
1048576 bit |
2.5 V |
IT ALSO OPERATES AT 0.4MHZ AT 1.8MIN SUPPLY |
256 |
.000006 Amp |
9.27 mm |
||||||||||||||||||||||||||||
|
Microchip Technology |
EEPROM |
INDUSTRIAL |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
TS 16949 |
THROUGH-HOLE |
SERIAL |
SYNCHRONOUS |
3 mA |
2048 words |
3 |
8 |
IN-LINE |
DIP8,.3 |
100 |
2.54 mm |
85 Cel |
OPEN-DRAIN |
2KX8 |
2K |
-40 Cel |
MATTE TIN |
1010DDDR |
DUAL |
1 |
HARDWARE |
R-PDIP-T8 |
5.5 V |
5.334 mm |
1000000 Write/Erase Cycles |
1 MHz |
7.62 mm |
5 ms |
I2C |
16384 bit |
2.5 V |
ALSO OPERATES AT 0.4MHZ AT 1.7-5.5 SUPPLY VOLTAGE |
e3 |
.000006 Amp |
9.271 mm |
3 |
||||||||||||||||||||||
|
Microchip Technology |
EEPROM |
MILITARY |
28 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
CMOS |
MIL-STD-883 Class C |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
50 mA |
32768 words |
5 |
8 |
IN-LINE |
DIP28,.6 |
10 |
2.54 mm |
125 Cel |
32KX8 |
32K |
-55 Cel |
NO |
DUAL |
HARDWARE/SOFTWARE |
R-GDIP-T28 |
5.5 V |
5.72 mm |
10000 Write/Erase Cycles |
15.24 mm |
10 ms |
262144 bit |
4.5 V |
NOT SPECIFIED |
NOT SPECIFIED |
.0003 Amp |
37.215 mm |
200 ns |
5 |
YES |
EEPROM, or Electrically Erasable Programmable Read-Only Memory, is a type of non-volatile computer memory that can store and retrieve data even when the power is turned off. EEPROM is commonly used in digital devices, such as computers, mobile phones, and digital cameras, to store configuration data, firmware, and other important information.
EEPROM works by storing data in a grid of memory cells that can be individually programmed and erased using electrical signals. Each memory cell consists of a transistor and a floating gate. The floating gate can hold an electric charge, which determines the state of the memory cell. To write data to the EEPROM, an electrical signal is applied to the transistor, which charges or discharges the floating gate. To read data from the EEPROM, an electrical signal is applied to the transistor, which determines the state of the floating gate.
One of the advantages of EEPROM is that it is non-volatile, which means that it can store data even when the power is turned off. This makes it ideal for storing critical data, such as system settings and firmware, that must be retained even in the absence of power.
EEPROM can also be reprogrammed and erased many times, which makes it a versatile and flexible memory technology. EEPROM can be programmed and erased in blocks or individually, depending on the specific requirements of the application.
One of the disadvantages of EEPROM is that it is slower than other types of computer memory, such as RAM or cache memory. EEPROM access times are measured in microseconds, which is much slower than access times for other types of memory. This makes EEPROM less suitable for applications that require high-speed data access.