Part | RoHS | Manufacturer | Memory IC Type | Temperature Grade | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | Surface Mount | No. of Functions | Technology | Screening Level | Terminal Form | Parallel or Serial | Operating Mode | Sector Size (Words) | Maximum Supply Current | No. of Words | Input/Output Type | Nominal Supply Voltage / Vsup (V) | Toggle Bit | Power Supplies (V) | Memory Width | Package Style (Meter) | Package Equivalence Code | Alternate Memory Width | Sub-Category | Minimum Data Retention Time | Terminal Pitch | Maximum Operating Temperature | Reverse Pinout | Output Characteristics | Organization | No. of Words Code | Minimum Operating Temperature | No. of Sectors/Size | Command User Interface | Terminal Finish | I2C Control Byte | Ready or Busy | Terminal Position | No. of Ports | Write Protection | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Endurance | Maximum Clock Frequency (fCLK) | Width | Qualification | Maximum Write Cycle Time (tWC) | Serial Bus Type | Boot Block | Memory Density | Minimum Supply Voltage (Vsup) | Additional Features | Page Size (words) | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Type | Maximum Standby Current | Length | Common Flash Interface | Maximum Access Time | Programming Voltage (V) | Data Polling |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology |
EEPROM |
MILITARY |
32 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
CMOS |
MIL-STD-883 Class C |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
131072 words |
5 |
8 |
IN-LINE |
2.54 mm |
125 Cel |
128KX8 |
128K |
-55 Cel |
DUAL |
R-GDIP-T32 |
5.5 V |
5.72 mm |
15.24 mm |
10 ms |
1048576 bit |
4.5 V |
42.2 mm |
120 ns |
5 |
||||||||||||||||||||||||||||||||||||
|
Microchip Technology |
EEPROM |
INDUSTRIAL |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
AEC-Q100 |
THROUGH-HOLE |
SERIAL |
SYNCHRONOUS |
3 mA |
128 words |
2.5 |
2/5 |
8 |
IN-LINE |
DIP8,.3 |
EEPROMs |
200 |
2.54 mm |
85 Cel |
128X8 |
128 |
-40 Cel |
MATTE TIN |
1010XXXR |
DUAL |
1 |
HARDWARE |
R-PDIP-T8 |
5.5 V |
5.334 mm |
1000000 Write/Erase Cycles |
.4 MHz |
7.62 mm |
Not Qualified |
5 ms |
I2C |
1024 bit |
1.7 V |
1.7V TO 2.5V @ 0.1MHz |
e3 |
.000001 Amp |
9.271 mm |
2.5 |
||||||||||||||||||||
|
Microchip Technology |
EEPROM |
INDUSTRIAL |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
TS 16949 |
THROUGH-HOLE |
SERIAL |
SYNCHRONOUS |
3 mA |
512 words |
2.5 |
8 |
IN-LINE |
DIP8,.3 |
200 |
1.27 mm |
85 Cel |
OPEN-DRAIN |
512X8 |
512 |
-40 Cel |
MATTE TIN |
1010DDMR |
DUAL |
1 |
R-PDIP-T8 |
5.5 V |
5.334 mm |
1000000 Write/Erase Cycles |
1 MHz |
7.62 mm |
5 ms |
I2C |
4096 bit |
2.2 V |
1.7V TO 1.8V @ 0.1MHz AND 1.8V TO 2.2V @ 0.4MHz |
e3 |
.000001 Amp |
9.271 mm |
2.5 |
|||||||||||||||||||||||
|
Microchip Technology |
EEPROM |
INDUSTRIAL |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
TS 16949 |
THROUGH-HOLE |
SERIAL |
SYNCHRONOUS |
5 mA |
131072 words |
2.5 |
1.8/5 |
8 |
IN-LINE |
DIP8,.3 |
EEPROMs |
200 |
2.54 mm |
85 Cel |
OPEN-DRAIN |
128KX8 |
128K |
-40 Cel |
MATTE TIN |
1010DDMR |
DUAL |
1 |
HARDWARE |
R-PDIP-T8 |
5.5 V |
5.334 mm |
1000000 Write/Erase Cycles |
.4 MHz |
7.62 mm |
Not Qualified |
5 ms |
I2C |
1048576 bit |
1.7 V |
e3 |
.000005 Amp |
9.271 mm |
2.5 |
||||||||||||||||||||
|
Microchip Technology |
EEPROM |
INDUSTRIAL |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
AEC-Q100 |
THROUGH-HOLE |
SERIAL |
SYNCHRONOUS |
3 mA |
16384 words |
2.5 |
2/5 |
8 |
IN-LINE |
DIP8,.3 |
EEPROMs |
200 |
2.54 mm |
85 Cel |
OPEN-DRAIN |
16KX8 |
16K |
-40 Cel |
MATTE TIN |
1010DDDR |
DUAL |
1 |
HARDWARE |
R-PDIP-T8 |
5.5 V |
5.334 mm |
1000000 Write/Erase Cycles |
1 MHz |
7.62 mm |
Not Qualified |
5 ms |
I2C |
131072 bit |
1.7 V |
e3 |
.000005 Amp |
9.271 mm |
2.5 |
||||||||||||||||||||
|
Microchip Technology |
EEPROM |
COMMERCIAL |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
TS 16949 |
THROUGH-HOLE |
SERIAL |
SYNCHRONOUS |
3 mA |
1024 words |
5 |
3/5 |
8 |
IN-LINE |
DIP8,.3 |
EEPROMs |
200 |
2.54 mm |
70 Cel |
OPEN-DRAIN |
1KX8 |
1K |
0 Cel |
MATTE TIN |
1010XMMR |
DUAL |
1 |
HARDWARE |
R-PDIP-T8 |
5.5 V |
4.32 mm |
1000000 Write/Erase Cycles |
.4 MHz |
7.62 mm |
Not Qualified |
5 ms |
I2C |
8192 bit |
2.5 V |
e3 |
9.46 mm |
5 |
|||||||||||||||||||||
|
Microchip Technology |
EEPROM |
COMMERCIAL |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
SERIAL |
SYNCHRONOUS |
3 mA |
128 words |
5 |
3/5 |
8 |
IN-LINE |
DIP8,.3 |
EEPROMs |
200 |
2.54 mm |
70 Cel |
OPEN-DRAIN |
128X8 |
128 |
0 Cel |
MATTE TIN |
1010XXXR |
DUAL |
1 |
R-PDIP-T8 |
5.5 V |
4.32 mm |
1000000 Write/Erase Cycles |
.4 MHz |
7.62 mm |
Not Qualified |
10 ms |
I2C |
1024 bit |
4.5 V |
e3 |
.0001 Amp |
9.46 mm |
5 |
||||||||||||||||||||||
|
Microchip Technology |
EEPROM |
AUTOMOTIVE |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
AEC-Q100 |
THROUGH-HOLE |
SERIAL |
SYNCHRONOUS |
6 mA |
32768 words |
2.5 |
2/5 |
8 |
IN-LINE |
DIP8,.3 |
EEPROMs |
200 |
2.54 mm |
125 Cel |
NO |
3-STATE |
32KX8 |
32K |
-40 Cel |
MATTE TIN |
DUAL |
1 |
HARDWARE/SOFTWARE |
R-PDIP-T8 |
5.5 V |
4.32 mm |
1000000 Write/Erase Cycles |
10 MHz |
7.62 mm |
Not Qualified |
5 ms |
SPI |
262144 bit |
1.8 V |
e3 |
.000001 Amp |
9.46 mm |
1.8 |
||||||||||||||||||||
|
Microchip Technology |
EEPROM |
INDUSTRIAL |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
AEC-Q100 |
THROUGH-HOLE |
SERIAL |
SYNCHRONOUS |
5 mA |
16384 words |
5 |
3/5 |
8 |
IN-LINE |
DIP8,.3 |
EEPROMs |
200 |
2.54 mm |
85 Cel |
16KX8 |
16K |
-40 Cel |
MATTE TIN |
DUAL |
1 |
HARDWARE/SOFTWARE |
R-PDIP-T8 |
5.5 V |
5.334 mm |
1000000 Write/Erase Cycles |
10 MHz |
7.62 mm |
Not Qualified |
5 ms |
SPI |
131072 bit |
2.5 V |
e3 |
.000001 Amp |
9.271 mm |
5 |
||||||||||||||||||||||
|
Microchip Technology |
EEPROM |
AUTOMOTIVE |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
AEC-Q100 |
THROUGH-HOLE |
SERIAL |
SYNCHRONOUS |
5 mA |
8192 words |
5 |
3/5 |
8 |
IN-LINE |
DIP8,.3 |
EEPROMs |
200 |
2.54 mm |
125 Cel |
8KX8 |
8K |
-40 Cel |
MATTE TIN |
DUAL |
1 |
HARDWARE/SOFTWARE |
R-PDIP-T8 |
5.5 V |
5.334 mm |
1000000 Write/Erase Cycles |
10 MHz |
7.62 mm |
Not Qualified |
5 ms |
SPI |
65536 bit |
2.5 V |
e3 |
.000005 Amp |
9.271 mm |
5 |
||||||||||||||||||||||
|
Microchip Technology |
EEPROM |
INDUSTRIAL |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
TS 16949 |
THROUGH-HOLE |
SERIAL |
SYNCHRONOUS |
2 mA |
64 words |
2.5 |
2/5 |
16 |
IN-LINE |
DIP8,.3 |
8 |
EEPROMs |
200 |
2.54 mm |
85 Cel |
NO |
TOTEM POLE |
64X16 |
64 |
-40 Cel |
MATTE TIN |
YES |
DUAL |
1 |
SOFTWARE |
R-PDIP-T8 |
5.5 V |
5.334 mm |
1000000 Write/Erase Cycles |
3 MHz |
7.62 mm |
Not Qualified |
6 ms |
MICROWIRE |
1024 bit |
1.8 V |
e3 |
.000001 Amp |
9.27 mm |
|||||||||||||||||||
|
Microchip Technology |
EEPROM |
INDUSTRIAL |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
TS 16949 |
THROUGH-HOLE |
SERIAL |
SYNCHRONOUS |
2 mA |
256 words |
2.5 |
YES |
2/5 |
16 |
IN-LINE |
DIP8,.3 |
8 |
EEPROMs |
200 |
2.54 mm |
85 Cel |
NO |
TOTEM POLE |
256X16 |
256 |
-40 Cel |
MATTE TIN |
YES |
DUAL |
SOFTWARE |
R-PDIP-T8 |
5.5 V |
5.33 mm |
1000000 Write/Erase Cycles |
3 MHz |
7.62 mm |
Not Qualified |
6 ms |
MICROWIRE |
4096 bit |
1.8 V |
ALSO CONFIGURABLE AS 512 X 8 |
e3 |
.000001 Amp |
9.27 mm |
||||||||||||||||||
|
Microchip Technology |
EEPROM |
INDUSTRIAL |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
TS 16949 |
THROUGH-HOLE |
SERIAL |
SYNCHRONOUS |
2 mA |
64 words |
5 |
5 |
16 |
IN-LINE |
DIP8,.3 |
8 |
EEPROMs |
200 |
2.54 mm |
85 Cel |
NO |
TOTEM POLE |
64X16 |
64 |
-40 Cel |
MATTE TIN |
YES |
DUAL |
1 |
SOFTWARE |
R-PDIP-T8 |
5.5 V |
5.334 mm |
1000000 Write/Erase Cycles |
3 MHz |
7.62 mm |
Not Qualified |
6 ms |
MICROWIRE |
1024 bit |
4.5 V |
e3 |
.000001 Amp |
9.27 mm |
|||||||||||||||||||
|
Microchip Technology |
EEPROM |
COMMERCIAL |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
SERIAL |
SYNCHRONOUS |
1.5 mA |
256 words |
3 |
3/5 |
16 |
IN-LINE |
DIP8,.3 |
EEPROMs |
200 |
2.54 mm |
70 Cel |
256X16 |
256 |
0 Cel |
MATTE TIN |
DUAL |
1 |
HARDWARE/SOFTWARE |
R-PDIP-T8 |
6 V |
4.32 mm |
1000000 Write/Erase Cycles |
2 MHz |
7.62 mm |
Not Qualified |
6 ms |
MICROWIRE |
4096 bit |
2.5 V |
e3 |
.000001 Amp |
9.46 mm |
3 |
|||||||||||||||||||||||
|
Microchip Technology |
EEPROM |
INDUSTRIAL |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
TS 16949 |
THROUGH-HOLE |
SERIAL |
SYNCHRONOUS |
3 mA |
1024 words |
3 |
3/5 |
16 |
IN-LINE |
DIP8,.3 |
8 |
EEPROMs |
200 |
2.54 mm |
85 Cel |
1KX16 |
1K |
-40 Cel |
MATTE TIN |
DUAL |
1 |
R-PDIP-T8 |
5.5 V |
5.334 mm |
1000000 Write/Erase Cycles |
2 MHz |
7.62 mm |
Not Qualified |
10 ms |
MICROWIRE |
16384 bit |
2.5 V |
e3 |
.0001 Amp |
9.271 mm |
5 |
||||||||||||||||||||||
|
Microchip Technology |
EEPROM |
INDUSTRIAL |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
TS 16949 |
THROUGH-HOLE |
SERIAL |
SYNCHRONOUS |
3 mA |
512 words |
5 |
2/5 |
8 |
IN-LINE |
DIP8,.3 |
EEPROMs |
100 |
2.54 mm |
85 Cel |
OPEN-DRAIN |
512X8 |
512 |
-40 Cel |
MATTE TIN |
1010DDDR |
DUAL |
1 |
HARDWARE |
R-PDIP-T8 |
5.5 V |
5.334 mm |
1000000 Write/Erase Cycles |
1 MHz |
7.62 mm |
Not Qualified |
5 ms |
I2C |
4096 bit |
4.5 V |
ALSO OPERATES AT 1.8V TO 5.5V @ 0.4MHZ |
e3 |
.000018 Amp |
9.271 mm |
5 |
|||||||||||||||||||
Microchip Technology |
EEPROM |
MILITARY |
32 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
CMOS |
MIL-STD-883 Class C |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
80 mA |
131072 words |
5 |
YES |
8 |
IN-LINE |
DIP32,.6 |
10 |
2.54 mm |
125 Cel |
128KX8 |
128K |
-55 Cel |
NO |
DUAL |
HARDWARE/SOFTWARE |
R-GDIP-T32 |
5.5 V |
5.72 mm |
10000 Write/Erase Cycles |
15.24 mm |
10 ms |
1048576 bit |
4.5 V |
128 |
.0003 Amp |
42.2 mm |
150 ns |
5 |
YES |
||||||||||||||||||||||||||
Microchip Technology |
EEPROM |
MILITARY |
28 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
CMOS |
MIL-STD-883 Class C |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
32768 words |
5 |
8 |
IN-LINE |
2.54 mm |
125 Cel |
32KX8 |
32K |
-55 Cel |
TIN LEAD |
DUAL |
R-GDIP-T28 |
5.5 V |
5.72 mm |
15.24 mm |
10 ms |
262144 bit |
4.5 V |
e0 |
37.215 mm |
150 ns |
5 |
||||||||||||||||||||||||||||||||||
Microchip Technology |
EEPROM |
MILITARY |
28 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
CMOS |
MIL-STD-883 Class B |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
50 mA |
32768 words |
5 |
YES |
8 |
IN-LINE |
DIP28,.6 |
10 |
2.54 mm |
125 Cel |
32KX8 |
32K |
-55 Cel |
NO |
DUAL |
1 |
R-GDIP-T28 |
5.5 V |
5.72 mm |
10000 Write/Erase Cycles |
15.24 mm |
3 ms |
262144 bit |
4.5 V |
AUTOMATIC WRITE |
64 |
.0003 Amp |
37.215 mm |
150 ns |
5 |
YES |
|||||||||||||||||||||||||
|
Microchip Technology |
EEPROM |
MILITARY |
28 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
CMOS |
MIL-STD-883 Class B |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
80 mA |
32768 words |
5 |
YES |
8 |
IN-LINE |
DIP28,.6 |
10 |
2.54 mm |
125 Cel |
3-STATE |
32KX8 |
32K |
-55 Cel |
NO |
TIN LEAD |
DUAL |
R-GDIP-T28 |
1 |
5.5 V |
5.72 mm |
10000 Write/Erase Cycles |
15.24 mm |
Not Qualified |
10 ms |
262144 bit |
4.5 V |
AUTOMATIC WRITE |
64 |
e0 |
.0003 Amp |
37.215 mm |
90 ns |
5 |
YES |
||||||||||||||||||||
|
Microchip Technology |
EEPROM |
INDUSTRIAL |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
SERIAL |
SYNCHRONOUS |
2 mA |
64 words |
SEPARATE |
5 |
2/5 |
16 |
IN-LINE |
DIP8,.3 |
EEPROMs |
100 |
2.54 mm |
85 Cel |
NO |
3-STATE |
64X16 |
64 |
-40 Cel |
MATTE TIN |
DUAL |
1 |
HARDWARE |
R-PDIP-T8 |
5.5 V |
5.334 mm |
1000000 Write/Erase Cycles |
2 MHz |
7.62 mm |
Not Qualified |
5 ms |
3-WIRE |
1024 bit |
4.5 V |
ALSO OPERATES AT 1MHZ AT 2.7MIN AND AT 0.25MHZ AT 1.8MIN |
e3 |
.000015 Amp |
9.271 mm |
5 |
|||||||||||||||||||
|
Microchip Technology |
EEPROM |
INDUSTRIAL |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
SERIAL |
SYNCHRONOUS |
2 mA |
1024 words |
5 |
2/5 |
16 |
IN-LINE |
DIP8,.3 |
8 |
EEPROMs |
100 |
2.54 mm |
85 Cel |
1KX16 |
1K |
-40 Cel |
MATTE TIN |
DUAL |
1 |
R-PDIP-T8 |
5.5 V |
5.334 mm |
1000000 Write/Erase Cycles |
2 MHz |
7.62 mm |
Not Qualified |
10 ms |
3-WIRE |
16384 bit |
4.5 V |
2.7V TO 5.5V @ 1MHz AND 1.8V TO 5.5V @ 0.25MHz |
e3 |
.000015 Amp |
9.271 mm |
5 |
||||||||||||||||||||||
National Semiconductor |
EEPROM |
COMMERCIAL |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
NMOS |
THROUGH-HOLE |
SERIAL |
SYNCHRONOUS |
10 mA |
16 words |
5 |
5 |
16 |
IN-LINE |
DIP8,.3 |
EEPROMs |
10 |
2.54 mm |
70 Cel |
3-STATE |
16X16 |
16 |
0 Cel |
TIN LEAD |
DUAL |
SOFTWARE |
R-PDIP-T8 |
5.5 V |
5.08 mm |
40000 Write/Erase Cycles |
.25 MHz |
7.62 mm |
Not Qualified |
30 ms |
MICROWIRE |
256 bit |
4.5 V |
e0 |
.003 Amp |
9.817 mm |
|||||||||||||||||||||||||
Texas Instruments |
EEPROM |
COMMERCIAL |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
THROUGH-HOLE |
PARALLEL |
20 mA |
8192 words |
5 |
NO |
5 |
8 |
IN-LINE |
DIP28,.6 |
EEPROMs |
2.54 mm |
70 Cel |
8KX8 |
8K |
0 Cel |
NO |
YES |
DUAL |
R-PDIP-T28 |
Not Qualified |
65536 bit |
32 |
.003 Amp |
250 ns |
YES |
|||||||||||||||||||||||||||||||||||
Texas Instruments |
EEPROM |
COMMERCIAL |
28 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
CMOS |
THROUGH-HOLE |
PARALLEL |
20 mA |
8192 words |
5 |
NO |
5 |
8 |
IN-LINE |
DIP28,.6 |
EEPROMs |
2.54 mm |
70 Cel |
8KX8 |
8K |
0 Cel |
NO |
YES |
DUAL |
R-XDIP-T28 |
Not Qualified |
65536 bit |
32 |
.003 Amp |
350 ns |
YES |
|||||||||||||||||||||||||||||||||||
Texas Instruments |
EEPROM |
COMMERCIAL |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
THROUGH-HOLE |
PARALLEL |
20 mA |
8192 words |
5 |
NO |
5 |
8 |
IN-LINE |
DIP28,.6 |
EEPROMs |
2.54 mm |
70 Cel |
8KX8 |
8K |
0 Cel |
NO |
YES |
DUAL |
R-PDIP-T28 |
Not Qualified |
65536 bit |
32 |
.003 Amp |
350 ns |
YES |
|||||||||||||||||||||||||||||||||||
Texas Instruments |
EEPROM |
COMMERCIAL |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
20 mA |
8192 words |
5 |
NO |
5 |
8 |
IN-LINE |
DIP28,.6 |
EEPROMs |
2.54 mm |
70 Cel |
3-STATE |
8KX8 |
8K |
0 Cel |
NO |
YES |
DUAL |
R-PDIP-T28 |
5.5 V |
5.08 mm |
15.24 mm |
Not Qualified |
65536 bit |
4.5 V |
32 |
NOT SPECIFIED |
NOT SPECIFIED |
.003 Amp |
36.32 mm |
250 ns |
5 |
YES |
||||||||||||||||||||||||
Texas Instruments |
EEPROM |
COMMERCIAL |
28 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
CMOS |
THROUGH-HOLE |
PARALLEL |
20 mA |
8192 words |
5 |
NO |
5 |
8 |
IN-LINE |
DIP28,.6 |
EEPROMs |
2.54 mm |
70 Cel |
8KX8 |
8K |
0 Cel |
NO |
YES |
DUAL |
R-XDIP-T28 |
Not Qualified |
65536 bit |
32 |
.003 Amp |
250 ns |
YES |
|||||||||||||||||||||||||||||||||||
Texas Instruments |
EEPROM |
COMMERCIAL |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
20 mA |
8192 words |
5 |
NO |
5 |
8 |
IN-LINE |
DIP28,.6 |
EEPROMs |
2.54 mm |
70 Cel |
3-STATE |
8KX8 |
8K |
0 Cel |
NO |
YES |
DUAL |
R-PDIP-T28 |
5.5 V |
5.08 mm |
15.24 mm |
Not Qualified |
65536 bit |
4.5 V |
32 |
NOT SPECIFIED |
NOT SPECIFIED |
.003 Amp |
36.32 mm |
350 ns |
5 |
YES |
||||||||||||||||||||||||
Texas Instruments |
EEPROM CARD |
COMMERCIAL |
24 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
TTL |
THROUGH-HOLE |
1024 words |
5 |
5 |
8 |
IN-LINE |
DIP24,.6 |
OTP ROMs |
2.54 mm |
70 Cel |
1KX8 |
1K |
0 Cel |
DUAL |
R-PDIP-T24 |
Not Qualified |
8192 bit |
NOT SPECIFIED |
NOT SPECIFIED |
70 ns |
2.7 |
||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
EEPROM CARD |
COMMERCIAL |
24 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
TTL |
THROUGH-HOLE |
1024 words |
5 |
5 |
8 |
IN-LINE |
DIP24,.6 |
OTP ROMs |
2.54 mm |
70 Cel |
1KX8 |
1K |
0 Cel |
DUAL |
R-XDIP-T24 |
Not Qualified |
8192 bit |
NOT SPECIFIED |
NOT SPECIFIED |
70 ns |
2.7 |
||||||||||||||||||||||||||||||||||||||||
|
Onsemi |
EEPROM |
INDUSTRIAL |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
SERIAL |
SYNCHRONOUS |
128 words |
5 |
16 |
IN-LINE |
8 |
2.54 mm |
105 Cel |
128X16 |
128 |
-40 Cel |
MATTE TIN |
DUAL |
R-PDIP-T8 |
5.5 V |
5.33 mm |
.25 MHz |
7.62 mm |
Not Qualified |
MICROWIRE |
2048 bit |
1.8 V |
e3 |
9.27 mm |
|||||||||||||||||||||||||||||||||
|
Onsemi |
EEPROM CARD |
AUTOMOTIVE |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
SERIAL |
SYNCHRONOUS |
3 mA |
128 words |
5 |
2/5 |
16 |
IN-LINE |
DIP8,.3 |
8 |
EEPROMs |
100 |
2.54 mm |
125 Cel |
128X16 |
128 |
-40 Cel |
MATTE TIN |
DUAL |
SOFTWARE |
R-PDIP-T8 |
1 |
5.5 V |
5.33 mm |
1000000 Write/Erase Cycles |
1 MHz |
7.62 mm |
Not Qualified |
MICROWIRE |
2048 bit |
4.5 V |
IT ALSO OPERATES AT 0.25MHZ AT 1.8MIN |
e3 |
.00001 Amp |
9.27 mm |
2.7 |
||||||||||||||||||||||
|
Onsemi |
EEPROM |
INDUSTRIAL |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
THROUGH-HOLE |
SERIAL |
3 mA |
256 words |
2/5 |
16 |
IN-LINE |
DIP8,.3 |
8 |
EEPROMs |
100 |
2.54 mm |
85 Cel |
256X16 |
256 |
-40 Cel |
DUAL |
SOFTWARE |
R-PDIP-T8 |
1000000 Write/Erase Cycles |
Not Qualified |
MICROWIRE |
4096 bit |
.00001 Amp |
||||||||||||||||||||||||||||||||||||
Onsemi |
EEPROM |
AUTOMOTIVE |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
SERIAL |
SYNCHRONOUS |
512 words |
5 |
16 |
IN-LINE |
8 |
2.54 mm |
125 Cel |
512X16 |
512 |
-40 Cel |
TIN LEAD |
DUAL |
R-PDIP-T8 |
5.5 V |
4.57 mm |
1 MHz |
7.62 mm |
Not Qualified |
MICROWIRE |
8192 bit |
1.8 V |
e0 |
9.59 mm |
||||||||||||||||||||||||||||||||||
Onsemi |
EEPROM |
INDUSTRIAL |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
SERIAL |
SYNCHRONOUS |
256 words |
8 |
IN-LINE |
16 |
2.54 mm |
85 Cel |
256X8 |
256 |
-40 Cel |
TIN LEAD |
DUAL |
R-PDIP-T8 |
6 V |
4.57 mm |
.5 MHz |
7.62 mm |
Not Qualified |
10 ms |
MICROWIRE |
2048 bit |
2.7 V |
MICROWIRE BUS SERIAL INTERFACE; AUTOMATIC WRITE |
e0 |
9.27 mm |
|||||||||||||||||||||||||||||||||
|
Onsemi |
EEPROM |
AUTOMOTIVE |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
SERIAL |
SYNCHRONOUS |
256 words |
5 |
16 |
IN-LINE |
8 |
100 |
2.54 mm |
125 Cel |
256X16 |
256 |
-40 Cel |
MATTE TIN |
DUAL |
R-PDIP-T8 |
5.5 V |
5.33 mm |
.5 MHz |
7.62 mm |
Not Qualified |
MICROWIRE |
4096 bit |
2.5 V |
100 YEAR DATA RETENTION |
e3 |
9.27 mm |
|||||||||||||||||||||||||||||||
|
Onsemi |
EEPROM |
AUTOMOTIVE |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
SERIAL |
SYNCHRONOUS |
3 mA |
512 words |
5 |
NO |
2/5 |
16 |
IN-LINE |
DIP8,.3 |
8 |
EEPROMs |
100 |
2.54 mm |
125 Cel |
NO |
512X16 |
512 |
-40 Cel |
NO |
YES |
DUAL |
1 |
SOFTWARE |
R-PDIP-T8 |
5.5 V |
5.33 mm |
1000000 Write/Erase Cycles |
1 MHz |
6.35 mm |
Not Qualified |
1 ms |
MICROWIRE |
8192 bit |
1.8 V |
NOT SPECIFIED |
NOT SPECIFIED |
.00001 Amp |
9.27 mm |
YES |
||||||||||||||||||
Onsemi |
EEPROM |
COMMERCIAL |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
SERIAL |
SYNCHRONOUS |
2 mA |
64 words |
5 |
2/5 |
16 |
IN-LINE |
DIP8,.3 |
8 |
EEPROMs |
100 |
2.54 mm |
70 Cel |
64X16 |
64 |
0 Cel |
TIN LEAD |
DUAL |
SOFTWARE |
R-PDIP-T8 |
6 V |
4.57 mm |
1000000 Write/Erase Cycles |
.25 MHz |
7.62 mm |
Not Qualified |
MICROWIRE |
1024 bit |
1.8 V |
e0 |
.00001 Amp |
9.59 mm |
||||||||||||||||||||||||||
|
Onsemi |
EEPROM |
INDUSTRIAL |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
SERIAL |
SYNCHRONOUS |
3 mA |
128 words |
5 |
2/5 |
16 |
IN-LINE |
DIP8,.3 |
8 |
EEPROMs |
100 |
2.54 mm |
85 Cel |
128X16 |
128 |
-40 Cel |
DUAL |
SOFTWARE |
R-PDIP-T8 |
5.5 V |
1000000 Write/Erase Cycles |
1 MHz |
7.62 mm |
Not Qualified |
10 ms |
MICROWIRE |
2048 bit |
4.5 V |
Also operates at 1.8V and 2.5V |
.00001 Amp |
9.2 mm |
||||||||||||||||||||||||||
Onsemi |
EEPROM |
COMMERCIAL |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
SERIAL |
SYNCHRONOUS |
256 words |
5 |
16 |
IN-LINE |
8 |
100 |
2.54 mm |
70 Cel |
256X16 |
256 |
0 Cel |
TIN LEAD |
DUAL |
R-PDIP-T8 |
6 V |
4.57 mm |
.5 MHz |
7.62 mm |
Not Qualified |
MICROWIRE |
4096 bit |
2.5 V |
1000000 PROGRAM/ERASE CYCLES; 100 YEAR DATA RETENTION |
e0 |
9.36 mm |
||||||||||||||||||||||||||||||||
Onsemi |
EEPROM |
AUTOMOTIVE |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
SERIAL |
SYNCHRONOUS |
1024 words |
5 |
16 |
IN-LINE |
8 |
2.54 mm |
125 Cel |
1KX16 |
1K |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDIP-T8 |
5.5 V |
4.57 mm |
1 MHz |
7.62 mm |
Not Qualified |
MICROWIRE |
16384 bit |
2.5 V |
e4 |
40 |
260 |
9.59 mm |
||||||||||||||||||||||||||||||||
Onsemi |
EEPROM |
INDUSTRIAL |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
SERIAL |
SYNCHRONOUS |
512 words |
8 |
IN-LINE |
16 |
2.54 mm |
85 Cel |
512X8 |
512 |
-40 Cel |
TIN LEAD |
DUAL |
R-PDIP-T8 |
6 V |
4.57 mm |
.5 MHz |
7.62 mm |
Not Qualified |
10 ms |
MICROWIRE |
4096 bit |
2.5 V |
MICROWIRE BUS SERIAL INTERFACE; AUTOMATIC WRITE |
e0 |
9.36 mm |
|||||||||||||||||||||||||||||||||
|
Onsemi |
EEPROM |
INDUSTRIAL |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
SERIAL |
SYNCHRONOUS |
3 mA |
256 words |
5 |
3/5 |
16 |
IN-LINE |
DIP8,.3 |
8 |
EEPROMs |
100 |
2.54 mm |
85 Cel |
256X16 |
256 |
-40 Cel |
MATTE TIN |
DUAL |
SOFTWARE |
R-PDIP-T8 |
5.5 V |
5.33 mm |
1000000 Write/Erase Cycles |
.25 MHz |
7.62 mm |
Not Qualified |
MICROWIRE |
4096 bit |
1.8 V |
1000000 PROGRAM/ERASE CYCLES; 100 YEAR DATA RETENTION |
e3 |
.00001 Amp |
9.27 mm |
||||||||||||||||||||||||
|
Onsemi |
EEPROM |
INDUSTRIAL |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
THROUGH-HOLE |
SERIAL |
3 mA |
1024 words |
2/5 |
16 |
IN-LINE |
DIP8,.3 |
8 |
EEPROMs |
100 |
2.54 mm |
85 Cel |
1KX16 |
1K |
-40 Cel |
DUAL |
HARDWARE/SOFTWARE |
R-PDIP-T8 |
1000000 Write/Erase Cycles |
Not Qualified |
MICROWIRE |
16384 bit |
.00001 Amp |
||||||||||||||||||||||||||||||||||||
Onsemi |
EEPROM |
INDUSTRIAL |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
SERIAL |
SYNCHRONOUS |
128 words |
5 |
16 |
IN-LINE |
8 |
2.54 mm |
105 Cel |
128X16 |
128 |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDIP-T8 |
5.5 V |
5.33 mm |
.25 MHz |
7.62 mm |
Not Qualified |
MICROWIRE |
2048 bit |
1.8 V |
e4 |
9.59 mm |
||||||||||||||||||||||||||||||||||
Onsemi |
EEPROM |
COMMERCIAL |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
SERIAL |
SYNCHRONOUS |
512 words |
8 |
IN-LINE |
16 |
2.54 mm |
70 Cel |
512X8 |
512 |
0 Cel |
TIN LEAD |
DUAL |
R-PDIP-T8 |
6 V |
4.57 mm |
.5 MHz |
7.62 mm |
Not Qualified |
10 ms |
MICROWIRE |
4096 bit |
2.5 V |
MICROWIRE BUS SERIAL INTERFACE; AUTOMATIC WRITE |
e0 |
9.36 mm |
|||||||||||||||||||||||||||||||||
Onsemi |
EEPROM |
INDUSTRIAL |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
SERIAL |
SYNCHRONOUS |
128 words |
5 |
16 |
IN-LINE |
2.54 mm |
85 Cel |
128X16 |
128 |
-40 Cel |
TIN LEAD |
DUAL |
R-PDIP-T8 |
6 V |
4.57 mm |
.25 MHz |
7.62 mm |
Not Qualified |
10 ms |
MICROWIRE |
2048 bit |
1.8 V |
MICROWIRE BUS SERIAL INTERFACE; AUTOMATIC WRITE |
e0 |
9.36 mm |
EEPROM, or Electrically Erasable Programmable Read-Only Memory, is a type of non-volatile computer memory that can store and retrieve data even when the power is turned off. EEPROM is commonly used in digital devices, such as computers, mobile phones, and digital cameras, to store configuration data, firmware, and other important information.
EEPROM works by storing data in a grid of memory cells that can be individually programmed and erased using electrical signals. Each memory cell consists of a transistor and a floating gate. The floating gate can hold an electric charge, which determines the state of the memory cell. To write data to the EEPROM, an electrical signal is applied to the transistor, which charges or discharges the floating gate. To read data from the EEPROM, an electrical signal is applied to the transistor, which determines the state of the floating gate.
One of the advantages of EEPROM is that it is non-volatile, which means that it can store data even when the power is turned off. This makes it ideal for storing critical data, such as system settings and firmware, that must be retained even in the absence of power.
EEPROM can also be reprogrammed and erased many times, which makes it a versatile and flexible memory technology. EEPROM can be programmed and erased in blocks or individually, depending on the specific requirements of the application.
One of the disadvantages of EEPROM is that it is slower than other types of computer memory, such as RAM or cache memory. EEPROM access times are measured in microseconds, which is much slower than access times for other types of memory. This makes EEPROM less suitable for applications that require high-speed data access.