Part | RoHS | Manufacturer | Memory IC Type | Temperature Grade | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | Surface Mount | No. of Functions | Technology | Screening Level | Terminal Form | Parallel or Serial | Operating Mode | Sector Size (Words) | Maximum Supply Current | No. of Words | Input/Output Type | Nominal Supply Voltage / Vsup (V) | Toggle Bit | Power Supplies (V) | Memory Width | Package Style (Meter) | Package Equivalence Code | Alternate Memory Width | Sub-Category | Minimum Data Retention Time | Terminal Pitch | Maximum Operating Temperature | Reverse Pinout | Output Characteristics | Organization | No. of Words Code | Minimum Operating Temperature | No. of Sectors/Size | Command User Interface | Terminal Finish | I2C Control Byte | Ready or Busy | Terminal Position | No. of Ports | Write Protection | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Endurance | Maximum Clock Frequency (fCLK) | Width | Qualification | Maximum Write Cycle Time (tWC) | Serial Bus Type | Boot Block | Memory Density | Minimum Supply Voltage (Vsup) | Additional Features | Page Size (words) | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Type | Maximum Standby Current | Length | Common Flash Interface | Maximum Access Time | Programming Voltage (V) | Data Polling |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Microchip Technology |
EEPROM |
INDUSTRIAL |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
TS 16949 |
THROUGH-HOLE |
SERIAL |
SYNCHRONOUS |
2 mA |
256 words |
2.5 |
YES |
5 |
16 |
IN-LINE |
DIP8,.3 |
EEPROMs |
200 |
2.54 mm |
85 Cel |
NO |
TOTEM POLE |
256X16 |
256 |
-40 Cel |
MATTE TIN |
YES |
DUAL |
1 |
SOFTWARE |
R-PDIP-T8 |
5.5 V |
5.33 mm |
1000000 Write/Erase Cycles |
1 MHz |
7.62 mm |
Not Qualified |
2 ms |
MICROWIRE |
4096 bit |
1.8 V |
e3 |
.000001 Amp |
9.27 mm |
|||||||||||||||||||
|
Microchip Technology |
EEPROM |
INDUSTRIAL |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
TS 16949 |
THROUGH-HOLE |
SERIAL |
SYNCHRONOUS |
2 mA |
512 words |
2.5 |
YES |
3/5 |
8 |
IN-LINE |
DIP8,.3 |
EEPROMs |
200 |
2.54 mm |
85 Cel |
NO |
TOTEM POLE |
512X8 |
512 |
-40 Cel |
MATTE TIN |
YES |
DUAL |
1 |
SOFTWARE |
R-PDIP-T8 |
5.5 V |
5.33 mm |
1000000 Write/Erase Cycles |
1 MHz |
7.62 mm |
Not Qualified |
6 ms |
MICROWIRE |
4096 bit |
1.8 V |
1000000 ERASE/WRITE CYCLES MIN; DATA RETENTION > 200 YEARS |
e3 |
.000001 Amp |
9.27 mm |
||||||||||||||||||
|
Microchip Technology |
EEPROM |
INDUSTRIAL |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
TS 16949 |
THROUGH-HOLE |
SERIAL |
SYNCHRONOUS |
3 mA |
256 words |
3 |
3/5 |
16 |
IN-LINE |
DIP8,.3 |
8 |
EEPROMs |
200 |
2.54 mm |
85 Cel |
256X16 |
256 |
-40 Cel |
MATTE TIN |
DUAL |
1 |
SOFTWARE |
R-PDIP-T8 |
5.5 V |
5.334 mm |
1000000 Write/Erase Cycles |
2 MHz |
7.62 mm |
Not Qualified |
10 ms |
MICROWIRE |
4096 bit |
2.5 V |
e3 |
.0001 Amp |
9.271 mm |
3 |
|||||||||||||||||||||
Microchip Technology |
EEPROM |
INDUSTRIAL |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
SERIAL |
SYNCHRONOUS |
3 mA |
131072 words |
8 |
IN-LINE |
DIP8,.3 |
40 |
2.54 mm |
85 Cel |
OPEN-DRAIN |
128KX8 |
128K |
-40 Cel |
1010DDMR |
DUAL |
HARDWARE/SOFTWARE |
R-PDIP-T8 |
5 V |
5.33 mm |
1000000 Write/Erase Cycles |
1 MHz |
7.62 mm |
5 ms |
I2C |
1048576 bit |
2.5 V |
IT ALSO OPERATES AT 0.4MHZ AT 1.8MIN SUPPLY |
256 |
.000006 Amp |
9.27 mm |
||||||||||||||||||||||||||||
|
Microchip Technology |
EEPROM |
INDUSTRIAL |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
SERIAL |
SYNCHRONOUS |
1 mA |
2048 words |
1.8/3.3 |
8 |
IN-LINE |
DIP8,.3 |
EEPROMs |
100 |
2.54 mm |
85 Cel |
OPEN-DRAIN |
2KX8 |
2K |
-40 Cel |
MATTE TIN |
1010MMMR |
DUAL |
1 |
HARDWARE |
R-PDIP-T8 |
3.6 V |
5.33 mm |
1000000 Write/Erase Cycles |
1 MHz |
7.62 mm |
Not Qualified |
5 ms |
I2C |
16384 bit |
2.5 V |
ALSO OPERATES 1.7V AT 100 KHZ STD MODE AND 400 KHZ @ FAST MODE |
e3 |
.0000008 Amp |
9.271 mm |
||||||||||||||||||||||
Microchip Technology |
EEPROM |
INDUSTRIAL |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
SERIAL |
SYNCHRONOUS |
3 mA |
65536 words |
3.6 |
8 |
IN-LINE |
DIP8,.3 |
40 |
2.54 mm |
85 Cel |
64KX8 |
64K |
-40 Cel |
1010DDDR |
DUAL |
HARDWARE/SOFTWARE |
R-PDIP-T8 |
5.5 V |
5.334 mm |
1000000 Write/Erase Cycles |
1 MHz |
7.62 mm |
5 ms |
I2C |
524288 bit |
2.5 V |
128 |
.000006 Amp |
9.271 mm |
3.6 |
||||||||||||||||||||||||||||
Microchip Technology |
EEPROM |
24 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
45 mA |
2048 words |
5 |
8 |
IN-LINE |
DIP24,.6 |
10 |
2.54 mm |
85 Cel |
2KX8 |
2K |
-40 Cel |
NO |
DUAL |
R-PDIP-T24 |
5.5 V |
5.59 mm |
10000 Write/Erase Cycles |
15.24 mm |
1 ms |
16384 bit |
4.5 V |
.0001 Amp |
31.9 mm |
150 ns |
5 |
YES |
|||||||||||||||||||||||||||||||
Atmel |
EEPROM |
INDUSTRIAL |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
MIL-STD-883 |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
50 mA |
32768 words |
5 |
YES |
5 |
8 |
IN-LINE |
DIP28,.6 |
EEPROMs |
2.54 mm |
85 Cel |
3-STATE |
32KX8 |
32K |
-40 Cel |
NO |
TIN LEAD |
DUAL |
R-PDIP-T28 |
1 |
5.5 V |
4.826 mm |
10000 Write/Erase Cycles |
15.24 mm |
Not Qualified |
3 ms |
262144 bit |
4.5 V |
AUTOMATIC WRITE |
64 |
e0 |
.0002 Amp |
37.0205 mm |
250 ns |
5 |
YES |
||||||||||||||||||||
Atmel |
EEPROM |
COMMERCIAL |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
MIL-STD-883 |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
80 mA |
32768 words |
5 |
YES |
5 |
8 |
IN-LINE |
DIP28,.6 |
EEPROMs |
2.54 mm |
70 Cel |
3-STATE |
32KX8 |
32K |
0 Cel |
NO |
TIN LEAD |
DUAL |
R-PDIP-T28 |
1 |
5.5 V |
4.826 mm |
10000 Write/Erase Cycles |
15.24 mm |
Not Qualified |
10 ms |
262144 bit |
4.5 V |
AUTOMATIC WRITE |
64 |
e0 |
.0003 Amp |
37.0205 mm |
90 ns |
5 |
YES |
||||||||||||||||||||
|
Onsemi |
EEPROM |
INDUSTRIAL |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
SERIAL |
SYNCHRONOUS |
3 mA |
131072 words |
3.3 |
3/5 |
8 |
IN-LINE |
DIP8,.3 |
EEPROMs |
100 |
2.54 mm |
85 Cel |
128KX8 |
128K |
-40 Cel |
NICKEL PALLADIUM GOLD |
1010DDMR |
DUAL |
HARDWARE |
R-PDIP-T8 |
5.5 V |
5.33 mm |
1000000 Write/Erase Cycles |
.4 MHz |
7.62 mm |
Not Qualified |
5 ms |
SPI |
1048576 bit |
1.8 V |
e4 |
.000002 Amp |
9.27 mm |
||||||||||||||||||||||||
|
NXP Semiconductors |
EEPROM |
INDUSTRIAL |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
SERIAL |
SYNCHRONOUS |
2 mA |
256 words |
3.3 |
3/5 |
8 |
IN-LINE |
DIP8,.3 |
EEPROMs |
10 |
2.54 mm |
85 Cel |
OPEN-DRAIN |
256X8 |
256 |
-40 Cel |
NICKEL PALLADIUM GOLD |
1010DDDR |
DUAL |
R-PDIP-T8 |
6 V |
4.2 mm |
100000 Write/Erase Cycles |
.1 MHz |
7.62 mm |
Not Qualified |
10 ms |
I2C |
2048 bit |
2.5 V |
DATA RETENTION > 10 YEARS; WIRE I2C INTERFACE |
e4 |
.0000035 Amp |
9.5 mm |
|||||||||||||||||||||||
|
NXP Semiconductors |
EEPROM |
INDUSTRIAL |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
SERIAL |
SYNCHRONOUS |
2 mA |
256 words |
3.3 |
3/5 |
8 |
IN-LINE |
DIP8,.3 |
EEPROMs |
10 |
2.54 mm |
85 Cel |
256X8 |
256 |
-40 Cel |
NICKEL PALLADIUM GOLD |
1010DDDR |
DUAL |
R-PDIP-T8 |
6 V |
4.2 mm |
1000000 Write/Erase Cycles |
.1 MHz |
7.62 mm |
Not Qualified |
10 ms |
I2C |
2048 bit |
2.5 V |
e4 |
.0000035 Amp |
9.5 mm |
|||||||||||||||||||||||||
|
Winbond Electronics |
EEPROM |
COMMERCIAL |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
65536 words |
5 |
8 |
IN-LINE |
2.54 mm |
70 Cel |
64KX8 |
64K |
0 Cel |
DUAL |
R-PDIP-T28 |
5.25 V |
5.33 mm |
15.24 mm |
Not Qualified |
524288 bit |
4.75 V |
NOT SPECIFIED |
NOT SPECIFIED |
37.08 mm |
45 ns |
12 |
||||||||||||||||||||||||||||||||||
Intersil |
EEPROM |
MILITARY |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
SERIAL |
SYNCHRONOUS |
2048 words |
3.3 |
8 |
IN-LINE |
2.54 mm |
125 Cel |
2KX8 |
2K |
-55 Cel |
DUAL |
R-PDIP-T8 |
5.5 V |
5.33 mm |
.1 MHz |
7.62 mm |
Not Qualified |
10 ms |
I2C |
16384 bit |
3 V |
9.585 mm |
||||||||||||||||||||||||||||||||||||
Intersil |
EEPROM |
MILITARY |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
MIL-STD-883 |
THROUGH-HOLE |
SERIAL |
SYNCHRONOUS |
2048 words |
3.3 |
8 |
IN-LINE |
2.54 mm |
125 Cel |
2KX8 |
2K |
-55 Cel |
DUAL |
R-PDIP-T8 |
5.5 V |
5.33 mm |
.1 MHz |
7.62 mm |
Not Qualified |
10 ms |
I2C |
16384 bit |
2.7 V |
9.585 mm |
|||||||||||||||||||||||||||||||||||
Intersil |
EEPROM |
MILITARY |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
MIL-STD-883 |
THROUGH-HOLE |
SERIAL |
SYNCHRONOUS |
2048 words |
5 |
8 |
IN-LINE |
2.54 mm |
125 Cel |
2KX8 |
2K |
-55 Cel |
DUAL |
R-PDIP-T8 |
5.5 V |
5.33 mm |
.1 MHz |
7.62 mm |
Not Qualified |
10 ms |
I2C |
16384 bit |
3.5 V |
9.585 mm |
|||||||||||||||||||||||||||||||||||
|
Xilinx |
CONFIGURATION MEMORY |
COMMERCIAL |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
SERIAL |
SYNCHRONOUS |
10 mA |
36288 words |
COMMON |
5 |
5 |
1 |
IN-LINE |
DIP8,.3 |
OTP ROMs |
2.54 mm |
70 Cel |
3-STATE |
36288X1 |
36288 |
0 Cel |
Matte Tin (Sn) |
DUAL |
R-PDIP-T8 |
1 |
5.25 V |
4.5974 mm |
10 MHz |
7.62 mm |
Not Qualified |
36288 bit |
4.75 V |
USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS |
e3 |
30 |
250 |
.00005 Amp |
9.3599 mm |
||||||||||||||||||||||||
|
Microchip Technology |
EEPROM |
COMMERCIAL |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
TS 16949 |
THROUGH-HOLE |
SERIAL |
SYNCHRONOUS |
2 mA |
16 words |
4.5 |
3/5 |
8 |
IN-LINE |
DIP8,.3 |
EEPROMs |
200 |
2.54 mm |
70 Cel |
OPEN-DRAIN |
16X8 |
16 |
0 Cel |
MATTE TIN |
1010XXXR |
DUAL |
1 |
R-PDIP-T8 |
5.5 V |
4.32 mm |
1000000 Write/Erase Cycles |
.4 MHz |
7.62 mm |
Not Qualified |
4 ms |
I2C |
128 bit |
2.5 V |
e3 |
.000001 Amp |
9.46 mm |
4.5 |
|||||||||||||||||||||
Microchip Technology |
EEPROM |
INDUSTRIAL |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
AEC-Q100 |
THROUGH-HOLE |
SERIAL |
SYNCHRONOUS |
3 mA |
16384 words |
5 |
8 |
IN-LINE |
DIP8,.3 |
200 |
2.54 mm |
85 Cel |
NO |
OPEN-DRAIN |
16KX8 |
16K |
-40 Cel |
1010DDDR |
DUAL |
1 |
HARDWARE |
R-PDIP-T8 |
5.5 V |
5.334 mm |
1000000 Write/Erase Cycles |
.4 MHz |
7.62 mm |
5 ms |
I2C |
131072 bit |
2.5 V |
.000001 Amp |
9.271 mm |
2.5 |
|||||||||||||||||||||||||
|
Microchip Technology |
EEPROM |
INDUSTRIAL |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
AEC-Q100 |
THROUGH-HOLE |
SERIAL |
SYNCHRONOUS |
10 mA |
1048576 words |
5 |
8 |
IN-LINE |
DIP8,.3 |
200 |
2.54 mm |
85 Cel |
3-STATE |
1MX1 |
1M |
-40 Cel |
Matte Tin (Sn) |
DUAL |
1 |
HARDWARE/SOFTWARE |
R-PDIP-T8 |
5.5 V |
5.334 mm |
1000000 Write/Erase Cycles |
20 MHz |
7.62 mm |
Not Qualified |
6 ms |
SPI |
8388608 bit |
4.5 V |
OPERTAES WITH 2.5VMIN @ 10MHZ |
e3 |
.000012 Amp |
9.271 mm |
5 |
||||||||||||||||||||||
|
Microchip Technology |
EEPROM |
INDUSTRIAL |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
TS 16949 |
THROUGH-HOLE |
SERIAL |
SYNCHRONOUS |
2 mA |
512 words |
2.5 |
YES |
5 |
8 |
IN-LINE |
DIP8,.3 |
EEPROMs |
200 |
2.54 mm |
85 Cel |
NO |
TOTEM POLE |
512X8 |
512 |
-40 Cel |
MATTE TIN |
YES |
DUAL |
1 |
SOFTWARE |
R-PDIP-T8 |
5.5 V |
5.33 mm |
1000000 Write/Erase Cycles |
1 MHz |
7.62 mm |
Not Qualified |
2 ms |
MICROWIRE |
4096 bit |
1.8 V |
e3 |
.000001 Amp |
9.27 mm |
|||||||||||||||||||
|
Microchip Technology |
EEPROM |
INDUSTRIAL |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
TS 16949 |
THROUGH-HOLE |
SERIAL |
SYNCHRONOUS |
2 mA |
128 words |
3 |
3/5 |
8 |
IN-LINE |
DIP8,.3 |
EEPROMs |
200 |
2.54 mm |
85 Cel |
NO |
TOTEM POLE |
128X8 |
128 |
-40 Cel |
MATTE TIN |
YES |
DUAL |
1 |
SOFTWARE |
R-PDIP-T8 |
5.5 V |
5.334 mm |
1000000 Write/Erase Cycles |
2 MHz |
7.62 mm |
Not Qualified |
6 ms |
MICROWIRE |
1024 bit |
2.5 V |
1000000 ERASE/WRITE CYCLES MIN; DATA RETENTION > 200 YEARS |
e3 |
.000001 Amp |
9.27 mm |
|||||||||||||||||||
|
Microchip Technology |
EEPROM |
INDUSTRIAL |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
SERIAL |
SYNCHRONOUS |
3 mA |
128 words |
2.5 |
8 |
IN-LINE |
DIP8,.3 |
100 |
2.54 mm |
85 Cel |
OPEN-DRAIN |
128X8 |
128 |
-40 Cel |
MATTE TIN |
1010DDDR |
DUAL |
1 |
HARDWARE |
R-PDIP-T8 |
5.5 V |
5.334 mm |
1000000 Write/Erase Cycles |
1 MHz |
7.62 mm |
5 ms |
I2C |
1024 bit |
1.7 V |
e3 |
.000006 Amp |
9.271 mm |
2.5 |
||||||||||||||||||||||||
Microchip Technology |
EEPROM |
INDUSTRIAL |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
SERIAL |
SYNCHRONOUS |
3 mA |
1024 words |
2.5 |
2/5 |
8 |
IN-LINE |
DIP8,.3 |
EEPROMs |
100 |
2.54 mm |
85 Cel |
1KX8 |
1K |
-40 Cel |
MATTE TIN |
1010DMMR |
DUAL |
HARDWARE |
R-PDIP-T8 |
1 |
5.5 V |
5.33 mm |
1000000 Write/Erase Cycles |
.4 MHz |
7.62 mm |
Not Qualified |
5 ms |
I2C |
8192 bit |
1.8 V |
e3 |
.000003 Amp |
9.27 mm |
||||||||||||||||||||||||
Microchip Technology |
EEPROM |
24 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
45 mA |
2048 words |
5 |
8 |
IN-LINE |
DIP24,.6 |
10 |
2.54 mm |
85 Cel |
2KX8 |
2K |
-40 Cel |
NO |
DUAL |
R-PDIP-T24 |
5.5 V |
5.59 mm |
100000 Write/Erase Cycles |
15.24 mm |
.2 ms |
16384 bit |
4.5 V |
.0001 Amp |
31.9 mm |
150 ns |
5 |
YES |
|||||||||||||||||||||||||||||||
Atmel |
EEPROM |
COMMERCIAL |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
MIL-STD-883 |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
50 mA |
32768 words |
5 |
YES |
5 |
8 |
IN-LINE |
DIP28,.6 |
EEPROMs |
2.54 mm |
70 Cel |
3-STATE |
32KX8 |
32K |
0 Cel |
NO |
TIN LEAD |
DUAL |
R-PDIP-T28 |
1 |
5.5 V |
4.826 mm |
10000 Write/Erase Cycles |
15.24 mm |
Not Qualified |
10 ms |
262144 bit |
4.5 V |
AUTOMATIC WRITE |
64 |
e0 |
.0002 Amp |
37.0205 mm |
200 ns |
5 |
YES |
||||||||||||||||||||
Atmel |
EEPROM |
INDUSTRIAL |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
MIL-STD-883 |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
50 mA |
32768 words |
5 |
YES |
5 |
8 |
IN-LINE |
DIP28,.6 |
EEPROMs |
2.54 mm |
85 Cel |
3-STATE |
32KX8 |
32K |
-40 Cel |
NO |
TIN LEAD |
DUAL |
R-PDIP-T28 |
1 |
5.5 V |
4.826 mm |
10000 Write/Erase Cycles |
15.24 mm |
Not Qualified |
3 ms |
262144 bit |
4.5 V |
AUTOMATIC WRITE |
64 |
e0 |
.0002 Amp |
37.0205 mm |
150 ns |
5 |
YES |
||||||||||||||||||||
Atmel |
EEPROM |
COMMERCIAL |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
MIL-STD-883 |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
80 mA |
32768 words |
5 |
YES |
5 |
8 |
IN-LINE |
DIP28,.6 |
EEPROMs |
2.54 mm |
70 Cel |
3-STATE |
32KX8 |
32K |
0 Cel |
NO |
TIN LEAD |
DUAL |
R-PDIP-T28 |
1 |
5.5 V |
4.826 mm |
10000 Write/Erase Cycles |
15.24 mm |
Not Qualified |
10 ms |
262144 bit |
4.5 V |
AUTOMATIC WRITE |
64 |
e0 |
.0003 Amp |
37.0205 mm |
120 ns |
5 |
YES |
||||||||||||||||||||
|
Microchip Technology |
EEPROM |
MILITARY |
28 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
CMOS |
MIL-STD-883 Class B |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
80 mA |
32768 words |
5 |
YES |
8 |
IN-LINE |
DIP28,.6 |
10 |
2.54 mm |
125 Cel |
3-STATE |
32KX8 |
32K |
-55 Cel |
NO |
TIN LEAD |
DUAL |
1 |
HARDWARE/SOFTWARE |
R-GDIP-T28 |
1 |
5.5 V |
5.72 mm |
15.24 mm |
Not Qualified |
3 ms |
262144 bit |
4.5 V |
AUTOMATIC WRITE |
64 |
e0 |
.0003 Amp |
37.215 mm |
90 ns |
5 |
YES |
|||||||||||||||||||
|
Microchip Technology |
EEPROM |
INDUSTRIAL |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
SERIAL |
SYNCHRONOUS |
2 mA |
256 words |
5 |
3/5 |
16 |
IN-LINE |
DIP8,.3 |
8 |
EEPROMs |
100 |
2.54 mm |
85 Cel |
256X16 |
256 |
-40 Cel |
MATTE TIN |
DUAL |
SOFTWARE |
R-PDIP-T8 |
1 |
5.5 V |
5.334 mm |
1000000 Write/Erase Cycles |
1 MHz |
7.62 mm |
Not Qualified |
10 ms |
MICROWIRE |
4096 bit |
2.7 V |
IT CAN ALSO CONFIGURABLE AS 256 X 8 |
e3 |
260 |
.00001 Amp |
9.271 mm |
|||||||||||||||||||||
|
Onsemi |
EEPROM |
INDUSTRIAL |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
SERIAL |
SYNCHRONOUS |
2.5 mA |
65536 words |
3.3 |
2/5 |
8 |
IN-LINE |
DIP8,.3 |
EEPROMs |
100 |
2.54 mm |
85 Cel |
NO |
64KX8 |
64K |
-40 Cel |
NICKEL PALLADIUM GOLD |
1010DDDR |
DUAL |
1 |
HARDWARE |
R-PDIP-T8 |
5.5 V |
5.33 mm |
1000000 Write/Erase Cycles |
.4 MHz |
7.62 mm |
Not Qualified |
5 ms |
I2C |
524288 bit |
1.8 V |
e4 |
.000002 Amp |
9.27 mm |
||||||||||||||||||||||
|
Onsemi |
EEPROM |
INDUSTRIAL |
24 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
35 mA |
2048 words |
5 |
5 |
8 |
IN-LINE |
DIP24,.6 |
EEPROMs |
100 |
2.54 mm |
85 Cel |
2KX8 |
2K |
-40 Cel |
NO |
Tin (Sn) |
DUAL |
R-PDIP-T24 |
5.5 V |
6.35 mm |
100000 Write/Erase Cycles |
15.24 mm |
Not Qualified |
5 ms |
16384 bit |
4.5 V |
e3 |
.0001 Amp |
31.875 mm |
120 ns |
5 |
YES |
||||||||||||||||||||||||
Holtek Semiconductor |
EEPROM |
COMMERCIAL |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
THROUGH-HOLE |
SERIAL |
5 mA |
8192 words |
2.5/5 |
8 |
IN-LINE |
DIP8,.3 |
EEPROMs |
40 |
2.54 mm |
70 Cel |
8KX8 |
8K |
0 Cel |
1010DDDR |
DUAL |
HARDWARE |
R-PDIP-T8 |
1000000 Write/Erase Cycles |
Not Qualified |
I2C |
65536 bit |
.000004 Amp |
|||||||||||||||||||||||||||||||||||||
STMicroelectronics |
EEPROM |
INDUSTRIAL |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
SERIAL |
SYNCHRONOUS |
2 mA |
1024 words |
5 |
5 |
8 |
IN-LINE |
DIP8,.3 |
EEPROMs |
40 |
2.54 mm |
85 Cel |
OPEN-DRAIN |
1KX8 |
1K |
-40 Cel |
TIN LEAD |
1010DMMR |
DUAL |
HARDWARE |
R-PDIP-T8 |
5.5 V |
5.33 mm |
1000000 Write/Erase Cycles |
.4 MHz |
7.62 mm |
Not Qualified |
5 ms |
I2C |
8192 bit |
4.5 V |
e0 |
.000001 Amp |
9.27 mm |
||||||||||||||||||||||||
|
STMicroelectronics |
EEPROM |
INDUSTRIAL |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
SERIAL |
SYNCHRONOUS |
1.5 mA |
64 words |
5 |
3/5 |
16 |
IN-LINE |
DIP8,.3 |
8 |
EEPROMs |
40 |
2.54 mm |
85 Cel |
64X16 |
64 |
-40 Cel |
MATTE TIN |
DUAL |
SOFTWARE |
R-PDIP-T8 |
5.5 V |
5.33 mm |
1000000 Write/Erase Cycles |
2 MHz |
7.62 mm |
Not Qualified |
5 ms |
MICROWIRE |
1024 bit |
2.5 V |
e3 |
.00001 Amp |
9.27 mm |
||||||||||||||||||||||||
|
STMicroelectronics |
EEPROM |
INDUSTRIAL |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
SERIAL |
SYNCHRONOUS |
1.5 mA |
1024 words |
5 |
3/5 |
16 |
IN-LINE |
DIP8,.3 |
8 |
EEPROMs |
40 |
2.54 mm |
85 Cel |
1KX16 |
1K |
-40 Cel |
MATTE TIN |
DUAL |
SOFTWARE |
R-PDIP-T8 |
5.5 V |
5.33 mm |
1000000 Write/Erase Cycles |
2 MHz |
7.62 mm |
Not Qualified |
5 ms |
MICROWIRE |
16384 bit |
2.5 V |
e3 |
.00001 Amp |
9.27 mm |
||||||||||||||||||||||||
National Semiconductor |
EEPROM |
INDUSTRIAL |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
SERIAL |
SYNCHRONOUS |
3 mA |
64 words |
5 |
5 |
16 |
IN-LINE |
DIP8,.3 |
EEPROMs |
10 |
2.54 mm |
85 Cel |
3-STATE |
64X16 |
64 |
-40 Cel |
TIN LEAD |
DUAL |
SOFTWARE |
R-PDIP-T8 |
5.5 V |
5.08 mm |
40000 Write/Erase Cycles |
.5 MHz |
7.62 mm |
Not Qualified |
10 ms |
MICROWIRE |
1024 bit |
4.5 V |
e0 |
.0001 Amp |
9.817 mm |
|||||||||||||||||||||||||
Intersil |
EEPROM |
MILITARY |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
SERIAL |
SYNCHRONOUS |
2048 words |
5 |
8 |
IN-LINE |
2.54 mm |
125 Cel |
2KX8 |
2K |
-55 Cel |
DUAL |
R-PDIP-T8 |
5.5 V |
5.33 mm |
.1 MHz |
7.62 mm |
Not Qualified |
10 ms |
I2C |
16384 bit |
4.5 V |
9.585 mm |
||||||||||||||||||||||||||||||||||||
Intersil |
EEPROM |
MILITARY |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
SERIAL |
SYNCHRONOUS |
2048 words |
3.3 |
8 |
IN-LINE |
2.54 mm |
125 Cel |
2KX8 |
2K |
-55 Cel |
DUAL |
R-PDIP-T8 |
5.5 V |
5.33 mm |
.1 MHz |
7.62 mm |
Not Qualified |
10 ms |
I2C |
16384 bit |
2.7 V |
9.585 mm |
||||||||||||||||||||||||||||||||||||
Intersil |
EEPROM |
MILITARY |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
SERIAL |
SYNCHRONOUS |
2048 words |
5 |
8 |
IN-LINE |
2.54 mm |
125 Cel |
2KX8 |
2K |
-55 Cel |
DUAL |
R-PDIP-T8 |
5.5 V |
5.33 mm |
.1 MHz |
7.62 mm |
Not Qualified |
10 ms |
I2C |
16384 bit |
3.5 V |
9.585 mm |
||||||||||||||||||||||||||||||||||||
Intersil |
EEPROM |
MILITARY |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
MIL-STD-883 |
THROUGH-HOLE |
SERIAL |
SYNCHRONOUS |
2048 words |
5 |
8 |
IN-LINE |
2.54 mm |
125 Cel |
2KX8 |
2K |
-55 Cel |
DUAL |
R-PDIP-T8 |
5.5 V |
5.33 mm |
.1 MHz |
7.62 mm |
Not Qualified |
10 ms |
I2C |
16384 bit |
4.5 V |
9.585 mm |
|||||||||||||||||||||||||||||||||||
Intersil |
EEPROM |
MILITARY |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
MIL-STD-883 |
THROUGH-HOLE |
SERIAL |
SYNCHRONOUS |
2048 words |
3.3 |
8 |
IN-LINE |
2.54 mm |
125 Cel |
2KX8 |
2K |
-55 Cel |
DUAL |
R-PDIP-T8 |
5.5 V |
5.33 mm |
.1 MHz |
7.62 mm |
Not Qualified |
10 ms |
I2C |
16384 bit |
3 V |
9.585 mm |
|||||||||||||||||||||||||||||||||||
Xicor |
EEPROM |
COMMERCIAL |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
SERIAL |
SYNCHRONOUS |
3 mA |
256 words |
5 |
5 |
8 |
IN-LINE |
DIP8,.3 |
EEPROMs |
100 |
2.54 mm |
70 Cel |
3-STATE |
256X8 |
256 |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
HARDWARE/SOFTWARE |
R-PDIP-T8 |
5.5 V |
4.32 mm |
100000 Write/Erase Cycles |
1 MHz |
7.62 mm |
Not Qualified |
10 ms |
SPI |
2048 bit |
4.5 V |
100K ENDURANCE CYCLES; DATA RETENTION = 100 YEARS |
e0 |
.00015 Amp |
10.03 mm |
||||||||||||||||||||||||
|
Microchip Technology |
EEPROM |
AUTOMOTIVE |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
AEC-Q100 |
THROUGH-HOLE |
SERIAL |
SYNCHRONOUS |
3 mA |
8192 words |
4.5 |
8 |
IN-LINE |
DIP8,.3 |
200 |
2.54 mm |
125 Cel |
OPEN-DRAIN |
8KX8 |
8K |
-40 Cel |
MATTE TIN |
1010DDDR |
1 |
HARDWARE |
R-PDIP-T8 |
5.5 V |
5.334 mm |
1000000 Write/Erase Cycles |
.4 MHz |
7.62 mm |
5 ms |
I2C |
65536 bit |
2.5 V |
e3 |
.000005 Amp |
9.271 mm |
4.5 |
||||||||||||||||||||||||
|
Microchip Technology |
EEPROM |
COMMERCIAL |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
TS 16949 |
THROUGH-HOLE |
SERIAL |
SYNCHRONOUS |
3 mA |
8192 words |
5 |
2/5 |
8 |
IN-LINE |
DIP8,.3 |
EEPROMs |
200 |
2.54 mm |
70 Cel |
OPEN-DRAIN |
8KX8 |
8K |
0 Cel |
MATTE TIN |
1010DDDR |
DUAL |
1 |
R-PDIP-T8 |
6 V |
4.32 mm |
1000000 Write/Erase Cycles |
.1 MHz |
7.62 mm |
Not Qualified |
5 ms |
I2C |
65536 bit |
1.8 V |
e3 |
.000005 Amp |
9.46 mm |
5 |
|||||||||||||||||||||
|
Microchip Technology |
EEPROM |
AUTOMOTIVE |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
AEC-Q100 |
THROUGH-HOLE |
SERIAL |
SYNCHRONOUS |
3 mA |
1024 words |
5 |
8 |
IN-LINE |
DIP8,.3 |
200 |
2.54 mm |
125 Cel |
OPEN-DRAIN |
1KX8 |
1K |
-40 Cel |
MATTE TIN |
1010XMMR |
DUAL |
1 |
HARDWARE |
R-PDIP-T8 |
5.5 V |
5.334 mm |
1000000 Write/Erase Cycles |
.4 MHz |
7.62 mm |
Not Qualified |
5 ms |
I2C |
8192 bit |
2.5 V |
e3 |
.000005 Amp |
9.271 mm |
5 |
||||||||||||||||||||||
|
Atmel |
EEPROM |
INDUSTRIAL |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
MIL-STD-883 |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
80 mA |
32768 words |
5 |
YES |
5 |
8 |
IN-LINE |
DIP28,.6 |
EEPROMs |
2.54 mm |
85 Cel |
3-STATE |
32KX8 |
32K |
-40 Cel |
NO |
MATTE TIN |
DUAL |
R-PDIP-T28 |
1 |
5.5 V |
4.826 mm |
10000 Write/Erase Cycles |
15.24 mm |
Not Qualified |
10 ms |
262144 bit |
4.5 V |
AUTOMATIC WRITE |
64 |
e3 |
.0003 Amp |
37.0205 mm |
120 ns |
5 |
YES |
|||||||||||||||||||
|
Onsemi |
EEPROM |
INDUSTRIAL |
24 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
35 mA |
2048 words |
5 |
5 |
8 |
IN-LINE |
DIP24,.6 |
EEPROMs |
100 |
2.54 mm |
85 Cel |
2KX8 |
2K |
-40 Cel |
NO |
TIN |
DUAL |
R-PDIP-T24 |
5.5 V |
6.35 mm |
10000 Write/Erase Cycles |
15.24 mm |
Not Qualified |
10 ms |
16384 bit |
4.5 V |
e3 |
.0001 Amp |
31.875 mm |
200 ns |
5 |
YES |
EEPROM, or Electrically Erasable Programmable Read-Only Memory, is a type of non-volatile computer memory that can store and retrieve data even when the power is turned off. EEPROM is commonly used in digital devices, such as computers, mobile phones, and digital cameras, to store configuration data, firmware, and other important information.
EEPROM works by storing data in a grid of memory cells that can be individually programmed and erased using electrical signals. Each memory cell consists of a transistor and a floating gate. The floating gate can hold an electric charge, which determines the state of the memory cell. To write data to the EEPROM, an electrical signal is applied to the transistor, which charges or discharges the floating gate. To read data from the EEPROM, an electrical signal is applied to the transistor, which determines the state of the floating gate.
One of the advantages of EEPROM is that it is non-volatile, which means that it can store data even when the power is turned off. This makes it ideal for storing critical data, such as system settings and firmware, that must be retained even in the absence of power.
EEPROM can also be reprogrammed and erased many times, which makes it a versatile and flexible memory technology. EEPROM can be programmed and erased in blocks or individually, depending on the specific requirements of the application.
One of the disadvantages of EEPROM is that it is slower than other types of computer memory, such as RAM or cache memory. EEPROM access times are measured in microseconds, which is much slower than access times for other types of memory. This makes EEPROM less suitable for applications that require high-speed data access.