Part | RoHS | Manufacturer | Memory IC Type | Temperature Grade | No. of Terminals | Package Code | Package Shape | Package Body Material | Surface Mount | No. of Functions | Technology | Screening Level | Terminal Form | Parallel or Serial | Operating Mode | Sector Size (Words) | Maximum Supply Current | No. of Words | Input/Output Type | Nominal Supply Voltage / Vsup (V) | Mixed Memory Type | Toggle Bit | Power Supplies (V) | Memory Width | Package Style (Meter) | Package Equivalence Code | Alternate Memory Width | Sub-Category | Minimum Data Retention Time | Terminal Pitch | Maximum Operating Temperature | Reverse Pinout | Output Characteristics | Organization | No. of Words Code | Minimum Operating Temperature | No. of Sectors/Size | Command User Interface | Terminal Finish | Ready or Busy | Terminal Position | No. of Ports | Write Protection | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Endurance | Maximum Clock Frequency (fCLK) | Width | Qualification | Maximum Write Cycle Time (tWC) | Serial Bus Type | Boot Block | Memory Density | Minimum Supply Voltage (Vsup) | Additional Features | Page Size (words) | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Type | Maximum Standby Current | Length | Common Flash Interface | Maximum Access Time | Programming Voltage (V) | Data Polling |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
STMicroelectronics |
FLASH |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
15 mA |
524288 words |
3 |
2.5/3.3 |
8 |
SMALL OUTLINE |
SOP8,.25 |
Flash Memories |
20 |
1.27 mm |
85 Cel |
512KX8 |
512K |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G8 |
1 |
3.6 V |
1.75 mm |
100000 Write/Erase Cycles |
50 MHz |
3.9 mm |
Not Qualified |
SPI |
4194304 bit |
2.7 V |
40 MHZ CLOCK FREQUENCY AVAILABLE UPON REQUEST |
e4 |
NOR TYPE |
.00001 Amp |
4.9 mm |
2.7 |
|||||||||||||||||||||
|
Micron Technology |
FLASH |
INDUSTRIAL |
64 |
TBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
16K,64K |
31 mA |
16777216 words |
1.8 |
NO |
1.8,1.8/3.3 |
16 |
GRID ARRAY, THIN PROFILE |
BGA64,8X8,40 |
Flash Memories |
1 mm |
85 Cel |
16MX16 |
16M |
-40 Cel |
4,255 |
YES |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B64 |
2 V |
1.2 mm |
10 mm |
Not Qualified |
BOTTOM |
268435456 bit |
1.7 V |
ASYNCHRONOUS READ MODE |
e1 |
30 |
260 |
NOR TYPE |
.00021 Amp |
13 mm |
YES |
100 ns |
1.8 |
NO |
|||||||||||||||||
|
Micron Technology |
FLASH |
INDUSTRIAL |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
GULL WING |
SERIAL |
SYNCHRONOUS |
536870912 words |
3 |
1 |
SMALL OUTLINE |
1.27 mm |
105 Cel |
512MX1 |
512M |
-40 Cel |
DUAL |
R-PDSO-G16 |
3.6 V |
2.65 mm |
133 MHz |
7.5 mm |
536870912 bit |
2.7 V |
30 |
260 |
NOR TYPE |
10.3 mm |
3 |
||||||||||||||||||||||||||||||||
|
Infineon Technologies |
FLASH |
INDUSTRIAL |
8 |
SOP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
50 mA |
16777216 words |
3 |
8 |
SMALL OUTLINE |
SOP8,.3 |
20 |
1.27 mm |
85 Cel |
3-STATE |
16MX8 |
16M |
-40 Cel |
MATTE TIN |
DUAL |
HARDWARE/SOFTWARE |
S-PDSO-G8 |
3 |
3.6 V |
2.16 mm |
100000 Write/Erase Cycles |
133 MHz |
5.28 mm |
SPI |
134217728 bit |
2.7 V |
e3 |
NOR TYPE |
.00006 Amp |
5.28 mm |
3 |
||||||||||||||||||||||||
|
Micron Technology |
FLASH |
INDUSTRIAL |
63 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
128K |
35 mA |
268435456 words |
3.3 |
NO |
3/3.3 |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA63,10X12,32 |
Flash Memories |
.8 mm |
85 Cel |
256MX8 |
256M |
-40 Cel |
2K |
YES |
Tin/Silver/Copper (Sn/Ag/Cu) |
YES |
BOTTOM |
R-PBGA-B63 |
3.6 V |
1 mm |
9 mm |
Not Qualified |
2147483648 bit |
2.7 V |
2K |
e1 |
30 |
260 |
SLC NAND TYPE |
.0001 Amp |
11 mm |
25 ns |
2.7 |
NO |
||||||||||||||||||
|
Infineon Technologies |
FLASH |
INDUSTRIAL |
48 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
8K,64K |
45 mA |
2097152 words |
3 |
YES |
3/3.3 |
16 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP48,.8,20 |
8 |
Flash Memories |
.5 mm |
85 Cel |
2MX16 |
2M |
-40 Cel |
8,63 |
YES |
Matte Tin (Sn) |
YES |
DUAL |
R-PDSO-G48 |
3 |
3.6 V |
1.2 mm |
12 mm |
Not Qualified |
TOP |
33554432 bit |
2.7 V |
TOP BOOT BLOCK |
e3 |
NOR TYPE |
.000005 Amp |
18.4 mm |
YES |
70 ns |
3 |
YES |
||||||||||||||||
|
Microchip Technology |
FLASH |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
GULL WING |
SERIAL |
SYNCHRONOUS |
25 mA |
16777216 words |
3 |
3/3.3 |
1 |
SMALL OUTLINE |
SOP8,.3 |
Flash Memories |
100 |
1.27 mm |
85 Cel |
3-STATE |
16MX1 |
16M |
-40 Cel |
MATTE TIN |
DUAL |
1 |
HARDWARE/SOFTWARE |
R-PDSO-G8 |
3 |
3.6 V |
2.03 mm |
100000 Write/Erase Cycles |
104 MHz |
5.25 mm |
Not Qualified |
SPI |
16777216 bit |
2.7 V |
e3 |
40 |
260 |
NOR TYPE |
.000025 Amp |
5.26 mm |
3 |
|||||||||||||||||
|
Integrated Silicon Solution |
FLASH |
INDUSTRIAL |
153 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
8589934592 words |
3.3 |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.5 mm |
85 Cel |
8GX8 |
8G |
-40 Cel |
BOTTOM |
R-PBGA-B153 |
3.6 V |
1 mm |
11.5 mm |
68719476736 bit |
2.7 V |
NOT SPECIFIED |
NOT SPECIFIED |
13 mm |
3.3 |
|||||||||||||||||||||||||||||||||||
|
Macronix |
FLASH |
INDUSTRIAL |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
33554432 words |
1.8 |
8 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
4 |
1.27 mm |
85 Cel |
32MX8 |
32M |
-40 Cel |
Tin (Sn) |
DUAL |
R-PDSO-N8 |
2 V |
.8 mm |
166 MHz |
6 mm |
268435456 bit |
1.65 V |
IT CAN ALSO BE CONFIGURED AS 128M X 2 AND 256M X 1 |
e3 |
8 mm |
1.8 |
||||||||||||||||||||||||||||||||
|
Micron Technology |
FLASH |
INDUSTRIAL |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
20 mA |
16777216 words |
3 |
3/3.3 |
8 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.20 |
Flash Memories |
20 |
1.27 mm |
85 Cel |
TOTEM POLE |
16MX8 |
16M |
-40 Cel |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-N8 |
3.6 V |
1 mm |
100000 Write/Erase Cycles |
108 MHz |
6 mm |
Not Qualified |
SPI |
134217728 bit |
2.7 V |
30 |
260 |
NOR TYPE |
.0001 Amp |
8 mm |
3 |
||||||||||||||||||||||
|
Micron Technology |
FLASH |
INDUSTRIAL |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
33554432 words |
1.8 |
8 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
1.27 mm |
85 Cel |
32MX8 |
32M |
-40 Cel |
DUAL |
R-PDSO-N8 |
2 V |
.8 mm |
166 MHz |
6 mm |
268435456 bit |
1.7 V |
30 |
260 |
NOR TYPE |
8 mm |
1.8 |
|||||||||||||||||||||||||||||||||
|
Infineon Technologies |
FLASH |
INDUSTRIAL |
8 |
HVQCCN |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
50 mA |
16777216 words |
3 |
8 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.25 |
20 |
1.27 mm |
85 Cel |
3-STATE |
16MX8 |
16M |
-40 Cel |
MATTE TIN |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-N8 |
3 |
3.6 V |
.8 mm |
100000 Write/Erase Cycles |
133 MHz |
5 mm |
SPI |
134217728 bit |
2.7 V |
e3 |
NOR TYPE |
.00006 Amp |
6 mm |
3 |
||||||||||||||||||||||||
|
Integrated Silicon Solution |
FLASH |
INDUSTRIAL |
8 |
SOP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
30 mA |
16777216 words |
3 |
8 |
SMALL OUTLINE |
SOP8,.3 |
1 |
20 |
1.27 mm |
105 Cel |
3-STATE |
16MX8 |
16M |
-40 Cel |
DUAL |
HARDWARE/SOFTWARE |
S-PDSO-G8 |
3.6 V |
2.16 mm |
100000 Write/Erase Cycles |
166 MHz |
5.28 mm |
SPI |
134217728 bit |
2.3 V |
ALSO OPERATES WITH 133MHZ @ 2.3VMIN SUPPLY |
NOT SPECIFIED |
NOT SPECIFIED |
NOR TYPE |
.00007 Amp |
5.28 mm |
3 |
|||||||||||||||||||||||
|
Micron Technology |
FLASH |
INDUSTRIAL |
8 |
SOP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
134217728 words |
1.8 |
1 |
SMALL OUTLINE |
1.27 mm |
85 Cel |
128MX1 |
128M |
-40 Cel |
DUAL |
S-PDSO-G8 |
2 V |
2.16 mm |
166 MHz |
5.285 mm |
134217728 bit |
1.7 V |
30 |
260 |
5.285 mm |
1.8 |
||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
FLASH |
INDUSTRIAL |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
100 mA |
64094208 words |
3 |
3/3.3 |
8 |
SMALL OUTLINE |
SOP16,.4 |
4 |
Flash Memories |
20 |
1.27 mm |
85 Cel |
3-STATE |
64MX8 |
64M |
-40 Cel |
MATTE TIN |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G16 |
3 |
3.6 V |
2.65 mm |
100000 Write/Erase Cycles |
133 MHz |
7.5 mm |
Not Qualified |
SPI |
512753664 bit |
2.7 V |
e3 |
30 |
260 |
NOR TYPE |
.0003 Amp |
10.3 mm |
3 |
||||||||||||||||||
|
Microchip Technology |
FLASH |
INDUSTRIAL |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
25 mA |
67108864 words |
3 |
1 |
SMALL OUTLINE |
SOP16,.4 |
100 |
1.27 mm |
85 Cel |
3-STATE |
64MX1 |
64M |
-40 Cel |
MATTE TIN |
DUAL |
1 |
HARDWARE/SOFTWARE |
R-PDSO-G16 |
3.6 V |
2.65 mm |
100000 Write/Erase Cycles |
104 MHz |
7.5 mm |
SPI |
67108864 bit |
2.7 V |
e3 |
NOR TYPE |
.000045 Amp |
10.3 mm |
3 |
||||||||||||||||||||||||
|
Macronix |
FLASH |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
2097152 words |
3 |
4 |
SMALL OUTLINE |
2 |
1.27 mm |
85 Cel |
2MX4 |
2M |
-40 Cel |
DUAL |
R-PDSO-G8 |
3.6 V |
1.75 mm |
108 MHz |
3.9 mm |
8388608 bit |
2.3 V |
ALSO IT CAN BE CONFIGURED AS 8M X 1 BIT |
NOT SPECIFIED |
NOT SPECIFIED |
4.9 mm |
3 |
||||||||||||||||||||||||||||||||
|
Micron Technology |
FLASH |
INDUSTRIAL |
64 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
16777216 words |
3 |
16 |
GRID ARRAY, LOW PROFILE |
8 |
1 mm |
85 Cel |
16MX16 |
16M |
-40 Cel |
BOTTOM |
R-PBGA-B64 |
3.6 V |
1.4 mm |
11 mm |
268435456 bit |
2.7 V |
NOT SPECIFIED |
NOT SPECIFIED |
NOR TYPE |
13 mm |
70 ns |
3 |
||||||||||||||||||||||||||||||||
|
Macronix |
FLASH |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
20 mA |
2097152 words |
3.3 |
3/3.3 |
2 |
SMALL OUTLINE |
SOP8,.25 |
1 |
Flash Memories |
20 |
1.27 mm |
85 Cel |
2MX2 |
2M |
-40 Cel |
TIN |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G8 |
3.6 V |
1.75 mm |
100000 Write/Erase Cycles |
86 MHz |
3.9 mm |
Not Qualified |
SPI |
4194304 bit |
2.7 V |
e3 |
NOR TYPE |
.00001 Amp |
4.9 mm |
2.7 |
||||||||||||||||||||||
|
STMicroelectronics |
FLASH |
INDUSTRIAL |
48 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
16K |
20 mA |
16777216 words |
3 |
NO |
3/3.3 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSSOP48,.8,20 |
Flash Memories |
.5 mm |
85 Cel |
16MX8 |
16M |
-40 Cel |
1K |
YES |
TIN/TIN BISMUTH |
YES |
DUAL |
R-PDSO-G48 |
3.6 V |
1.2 mm |
12 mm |
Not Qualified |
134217728 bit |
2.7 V |
512 |
e3/e6 |
NOT SPECIFIED |
260 |
SLC NAND TYPE |
.00005 Amp |
18.4 mm |
12000 ns |
3 |
NO |
||||||||||||||||||
|
Integrated Silicon Solution |
FLASH |
INDUSTRIAL |
8 |
SOP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
134217728 words |
1.8 |
1 |
SMALL OUTLINE |
1.27 mm |
105 Cel |
128MX1 |
128M |
-40 Cel |
Matte Tin (Sn) |
DUAL |
S-PDSO-G8 |
1 |
1.95 V |
2.16 mm |
133 MHz |
5.28 mm |
134217728 bit |
1.65 V |
e3 |
10 |
260 |
5.28 mm |
1.8 |
|||||||||||||||||||||||||||||||
|
Microchip Technology |
FLASH |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
TS 16949 |
GULL WING |
SERIAL |
SYNCHRONOUS |
25 mA |
16777216 words |
1.8 |
1 |
SMALL OUTLINE |
SOP8,.23 |
100 |
1.27 mm |
85 Cel |
3-STATE |
16MX1 |
16M |
-40 Cel |
MATTE TIN |
DUAL |
1 |
HARDWARE/SOFTWARE |
R-PDSO-G8 |
3 |
1.95 V |
1.75 mm |
100000 Write/Erase Cycles |
104 MHz |
3.9 mm |
SPI |
16777216 bit |
1.65 V |
e3 |
40 |
260 |
NOR TYPE |
.000005 Amp |
4.9 mm |
1.8 |
||||||||||||||||||||
|
Renesas Electronics |
FLASH |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
20 mA |
2097152 words |
3 |
8 |
SMALL OUTLINE |
SOP8,.25 |
20 |
1.27 mm |
85 Cel |
3-STATE |
2MX8 |
2M |
-40 Cel |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G8 |
1 |
3.6 V |
1.75 mm |
100000 Write/Erase Cycles |
108 MHz |
3.9 mm |
SPI |
16777216 bit |
2.7 V |
NOR TYPE |
.00003 Amp |
4.925 mm |
3 |
||||||||||||||||||||||||||
|
Integrated Silicon Solution |
FLASH |
INDUSTRIAL |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
33554432 words |
3 |
8 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
1.27 mm |
105 Cel |
32MX8 |
32M |
-40 Cel |
DUAL |
R-PDSO-N8 |
3.6 V |
.85 mm |
133 MHz |
6 mm |
268435456 bit |
2.3 V |
NOT SPECIFIED |
NOT SPECIFIED |
8 mm |
3 |
||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
FLASH |
INDUSTRIAL |
8 |
HVQCCN |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
50 mA |
16777216 words |
3 |
8 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.25 |
20 |
1.27 mm |
85 Cel |
3-STATE |
16MX8 |
16M |
-40 Cel |
MATTE TIN |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-N8 |
3 |
3.6 V |
.8 mm |
100000 Write/Erase Cycles |
133 MHz |
5 mm |
SPI |
134217728 bit |
2.7 V |
e3 |
NOR TYPE |
.00006 Amp |
6 mm |
3 |
||||||||||||||||||||||||
|
STMicroelectronics |
FLASH |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
15 mA |
2097152 words |
3 |
3/3.3 |
8 |
SMALL OUTLINE |
SOP8,.3 |
Flash Memories |
20 |
1.27 mm |
85 Cel |
2MX8 |
2M |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G8 |
1 |
3.6 V |
2.5 mm |
100000 Write/Erase Cycles |
75 MHz |
5.62 mm |
Not Qualified |
15 ms |
SPI |
16777216 bit |
2.7 V |
e4 |
NOR TYPE |
.00001 Amp |
5.3 mm |
2.7 |
|||||||||||||||||||||
|
Micron Technology |
FLASH |
INDUSTRIAL |
64 |
TBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
16K,64K |
31 mA |
16777216 words |
3 |
NO |
2.5/3.3 |
16 |
GRID ARRAY, THIN PROFILE |
BGA64,8X8,40 |
Flash Memories |
1 mm |
85 Cel |
16MX16 |
16M |
-40 Cel |
4,255 |
YES |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B64 |
3.6 V |
1.2 mm |
10 mm |
Not Qualified |
TOP |
268435456 bit |
2.3 V |
TOP BOOT BLOCK, SYNCHRONOUS BURST MODE OPERATION ALSO AVAILABLE |
e1 |
NOR TYPE |
.00021 Amp |
13 mm |
YES |
95 ns |
3 |
NO |
|||||||||||||||||||
|
Infineon Technologies |
FLASH |
INDUSTRIAL |
48 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
8388608 words |
3 |
8 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
.5 mm |
105 Cel |
8MX8 |
8M |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-G48 |
3 |
3.6 V |
1.2 mm |
14 mm |
67108864 bit |
2.7 V |
e3 |
18.4 mm |
80 ns |
3 |
|||||||||||||||||||||||||||||||||
|
Microchip Technology |
FLASH |
INDUSTRIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
4K |
35 mA |
131072 words |
5 |
YES |
5 |
8 |
CHIP CARRIER |
LDCC32,.5X.6 |
Flash Memories |
100 |
1.27 mm |
85 Cel |
3-STATE |
128KX8 |
128K |
-40 Cel |
32 |
YES |
MATTE TIN |
QUAD |
1 |
R-PQCC-J32 |
3 |
5.5 V |
3.556 mm |
100000 Write/Erase Cycles |
11.43 mm |
Not Qualified |
1048576 bit |
4.5 V |
e3 |
40 |
245 |
NOR TYPE |
.0001 Amp |
13.97 mm |
55 ns |
5 |
YES |
|||||||||||||||
|
Renesas Electronics |
FLASH |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
16 mA |
1048576 words |
3 |
8 |
SMALL OUTLINE |
SOP8,.25 |
20 |
1.27 mm |
85 Cel |
3-STATE |
1MX8 |
1M |
-40 Cel |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G8 |
3.6 V |
1.75 mm |
100000 Write/Erase Cycles |
108 MHz |
3.9 mm |
SPI |
8388608 bit |
2.5 V |
NOR TYPE |
.00003 Amp |
4.925 mm |
3 |
|||||||||||||||||||||||||||
|
Microchip Technology |
FLASH |
INDUSTRIAL |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
TS 16949 |
NO LEAD |
SERIAL |
SYNCHRONOUS |
25 mA |
16777216 words |
1.8 |
1 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.25 |
100 |
1.27 mm |
85 Cel |
3-STATE |
16MX1 |
16M |
-40 Cel |
MATTE TIN |
DUAL |
1 |
HARDWARE/SOFTWARE |
R-PDSO-N8 |
1.95 V |
.8 mm |
100000 Write/Erase Cycles |
104 MHz |
5 mm |
SPI |
16777216 bit |
1.65 V |
e3 |
NOR TYPE |
.000005 Amp |
6 mm |
1.8 |
|||||||||||||||||||||||
|
Renesas Electronics |
FLASH |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
18.5 mA |
4194304 words |
3 |
1 |
SMALL OUTLINE |
SOP8,.25 |
20 |
1.27 mm |
85 Cel |
3-STATE |
4MX1 |
4M |
-40 Cel |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G8 |
3.6 V |
1.75 mm |
100000 Write/Erase Cycles |
108 MHz |
3.9 mm |
SPI |
4194304 bit |
2.7 V |
NOR TYPE |
.00003 Amp |
4.925 mm |
3 |
|||||||||||||||||||||||||||
|
Cypress Semiconductor |
FLASH |
INDUSTRIAL |
48 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
128K |
30 mA |
134217728 words |
3.3 |
NO |
3/3.3 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSSOP48,.8,20 |
Flash Memories |
.5 mm |
85 Cel |
128MX8 |
128M |
-40 Cel |
1K |
YES |
MATTE TIN |
YES |
DUAL |
R-PDSO-G48 |
3 |
3.6 V |
1.2 mm |
12 mm |
Not Qualified |
1073741824 bit |
2.7 V |
2K |
e3 |
30 |
260 |
SLC NAND TYPE |
.00005 Amp |
18.4 mm |
25 ns |
3 |
NO |
|||||||||||||||||
|
Intel |
CONFIGURATION MEMORY |
INDUSTRIAL |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
20 mA |
16777216 words |
3.3 |
3.3 |
8 |
SMALL OUTLINE |
Flash Memories |
85 Cel |
3-STATE |
16MX8 |
16M |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G16 |
3 |
3.6 V |
100000 Write/Erase Cycles |
40 MHz |
Not Qualified |
134217728 bit |
2.7 V |
e4 |
20 |
260 |
.0001 Amp |
|||||||||||||||||||||||||||||
|
Infineon Technologies |
FLASH |
INDUSTRIAL |
48 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
16K,8K,32K,64K |
12 mA |
524288 words |
3 |
YES |
3,3.3 |
16 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP48,.8,20 |
8 |
Flash Memories |
.5 mm |
85 Cel |
512KX16 |
512K |
-40 Cel |
1,2,1,15 |
YES |
MATTE TIN |
YES |
DUAL |
R-PDSO-G48 |
3 |
3.6 V |
1.2 mm |
12 mm |
Not Qualified |
BOTTOM |
8388608 bit |
2.7 V |
BOTTOM BOOT BLOCK |
e3 |
40 |
260 |
NOR TYPE |
.000005 Amp |
18.4 mm |
YES |
70 ns |
3 |
YES |
||||||||||||||
|
Infineon Technologies |
FLASH |
INDUSTRIAL |
48 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
8K,64K |
50 mA |
4194304 words |
3 |
YES |
3/3.3 |
16 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP48,.8,20 |
8 |
Flash Memories |
.5 mm |
85 Cel |
4MX16 |
4M |
-40 Cel |
8,127 |
YES |
MATTE TIN |
YES |
DUAL |
R-PDSO-G48 |
3 |
3.6 V |
1.2 mm |
12 mm |
Not Qualified |
BOTTOM |
67108864 bit |
2.7 V |
8/16 |
e3 |
40 |
260 |
NOR TYPE |
.000005 Amp |
18.4 mm |
YES |
90 ns |
3 |
YES |
||||||||||||||
|
Infineon Technologies |
FLASH |
INDUSTRIAL |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
100 mA |
16777216 words |
3 |
3/3.3 |
8 |
SMALL OUTLINE |
SOP16,.4 |
2 |
Flash Memories |
20 |
1.27 mm |
85 Cel |
16MX8 |
16M |
-40 Cel |
MATTE TIN |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G16 |
3 |
3.6 V |
2.65 mm |
100000 Write/Erase Cycles |
133 MHz |
7.5 mm |
Not Qualified |
500 ms |
SPI |
BOTTOM |
134217728 bit |
2.7 V |
ALSO CONFIGURABLE AS 128M X 1 |
e3 |
30 |
260 |
NOR TYPE |
.0001 Amp |
10.3 mm |
3 |
||||||||||||||||
|
Microchip Technology |
FLASH |
INDUSTRIAL |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
TS 16949 |
NO LEAD |
SERIAL |
SYNCHRONOUS |
30 mA |
16777216 words |
3/3.3 |
1 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.25 |
Flash Memories |
100 |
1.27 mm |
85 Cel |
3-STATE |
16MX1 |
16M |
-40 Cel |
DUAL |
1 |
SOFTWARE |
R-PDSO-N8 |
3.6 V |
.8 mm |
100000 Write/Erase Cycles |
50 MHz |
5 mm |
Not Qualified |
SPI |
16777216 bit |
2.7 V |
NOR TYPE |
.00002 Amp |
6 mm |
||||||||||||||||||||||||
|
Cypress Semiconductor |
FLASH |
INDUSTRIAL |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
26 mA |
16777216 words |
3 |
3/3.3 |
8 |
SMALL OUTLINE |
SOP16,.4 |
Flash Memories |
20 |
1.27 mm |
85 Cel |
16MX8 |
16M |
-40 Cel |
Matte Tin (Sn) |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G16 |
3 |
3.6 V |
2.65 mm |
100000 Write/Erase Cycles |
104 MHz |
7.5 mm |
Not Qualified |
SPI |
134217728 bit |
2.7 V |
e3 |
40 |
260 |
NOR TYPE |
.00002 Amp |
10.3 mm |
3 |
||||||||||||||||||||
|
Renesas Electronics |
FLASH |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
16 mA |
1048576 words |
3 |
1.8/3.3 |
8 |
SMALL OUTLINE |
SOP8,.3 |
Flash Memories |
20 |
1.27 mm |
85 Cel |
3-STATE |
1MX8 |
1M |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G8 |
1 |
3.6 V |
2.16 mm |
100000 Write/Erase Cycles |
133 MHz |
5.24 mm |
Not Qualified |
SPI |
8388608 bit |
2.3 V |
IT ALSO OPERATES WITH 1.7V MIN WITH 85 MHZ FREQUENCY;256K-BIT EXTRA FLASH AVAILABLE |
e4 |
NOR TYPE |
.00004 Amp |
5.29 mm |
3 |
||||||||||||||||||||
|
Microchip Technology |
FLASH |
INDUSTRIAL |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
25 mA |
67108864 words |
3 |
1 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.3 |
100 |
1.27 mm |
85 Cel |
3-STATE |
64MX1 |
64M |
-40 Cel |
MATTE TIN |
DUAL |
1 |
HARDWARE/SOFTWARE |
R-PDSO-N8 |
3.6 V |
.8 mm |
100000 Write/Erase Cycles |
104 MHz |
6 mm |
SPI |
67108864 bit |
2.7 V |
e3 |
NOR TYPE |
.000045 Amp |
8 mm |
3 |
||||||||||||||||||||||||
|
Microchip Technology |
FLASH |
INDUSTRIAL |
32 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
4K |
30 mA |
262144 words |
3 |
YES |
3/3.3 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSSOP32,.56,20 |
Flash Memories |
100 |
.5 mm |
85 Cel |
3-STATE |
256KX8 |
256K |
-40 Cel |
64 |
YES |
Matte Tin (Sn) |
DUAL |
1 |
R-PDSO-G32 |
3 |
3.6 V |
1.2 mm |
100000 Write/Erase Cycles |
8 mm |
Not Qualified |
2097152 bit |
2.7 V |
e3 |
40 |
260 |
NOR TYPE |
.000015 Amp |
12.4 mm |
70 ns |
3 |
YES |
|||||||||||||||
|
Macronix |
FLASH |
INDUSTRIAL |
48 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
268435456 words |
3 |
8 |
SMALL OUTLINE, THIN PROFILE |
.5 mm |
85 Cel |
256MX8 |
256M |
-40 Cel |
TIN |
DUAL |
R-PDSO-G48 |
3.6 V |
1.2 mm |
12 mm |
2147483648 bit |
2.7 V |
e3 |
SLC NAND TYPE |
18.4 mm |
3 |
||||||||||||||||||||||||||||||||||
|
Atmel |
FLASH |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
16 mA |
4194304 words |
3/3.3 |
8 |
SMALL OUTLINE |
SOP8,.3 |
Flash Memories |
20 |
1.27 mm |
85 Cel |
4MX8 |
4M |
-40 Cel |
MATTE TIN |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G8 |
2 |
3.6 V |
2.16 mm |
100000 Write/Erase Cycles |
70 MHz |
5.24 mm |
Not Qualified |
SPI |
33554432 bit |
2.7 V |
e3 |
NOR TYPE |
.000025 Amp |
5.29 mm |
2.7 |
|||||||||||||||||||||||
|
Atmel |
FLASH |
INDUSTRIAL |
28 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
25 mA |
67108864 words |
3 |
3/3.3 |
1 |
SMALL OUTLINE, THIN PROFILE |
TSSOP28,.53,22 |
Flash Memories |
20 |
.55 mm |
85 Cel |
64MX1 |
64M |
-40 Cel |
Matte Tin (Sn) |
DUAL |
HARDWARE |
R-PDSO-G28 |
3 |
3.6 V |
1.2 mm |
100000 Write/Erase Cycles |
66 MHz |
8 mm |
Not Qualified |
SPI |
67108864 bit |
2.7 V |
ORGANIZED AS 8192 PAGES OF 1056 BYTES EACH |
e3 |
40 |
260 |
NOR TYPE |
.000015 Amp |
11.8 mm |
2.7 |
|||||||||||||||||||
|
Onsemi |
FLASH |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
15 mA |
262144 words |
2.5 |
2.5/3.3 |
8 |
SMALL OUTLINE |
SOP8,.25 |
Flash Memories |
20 |
1.27 mm |
85 Cel |
256KX8 |
256K |
-40 Cel |
MATTE TIN |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G8 |
3 |
3.6 V |
1.75 mm |
100000 Write/Erase Cycles |
30 MHz |
3.9 mm |
Not Qualified |
15 ms |
SPI |
2097152 bit |
2.3 V |
e3 |
30 |
260 |
NOR TYPE |
.00001 Amp |
4.9 mm |
2.7 |
|||||||||||||||||||
|
Micron Technology |
FLASH |
INDUSTRIAL |
24 |
TBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
BALL |
SERIAL |
SYNCHRONOUS |
64094208 words |
1.8 |
8 |
GRID ARRAY, THIN PROFILE |
1 |
1 mm |
105 Cel |
64MX8 |
64M |
-40 Cel |
BOTTOM |
R-PBGA-B24 |
2 V |
1.2 mm |
166 MHz |
6 mm |
512753664 bit |
1.7 V |
NOT SPECIFIED |
NOT SPECIFIED |
8 mm |
1.8 |
||||||||||||||||||||||||||||||||
|
Macronix |
FLASH |
INDUSTRIAL |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
16777216 words |
3 |
8 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
4 |
1.27 mm |
85 Cel |
16MX8 |
16M |
-40 Cel |
TIN |
DUAL |
R-PDSO-N8 |
3.6 V |
.8 mm |
133 MHz |
5 mm |
134217728 bit |
2.7 V |
ALSO IT CAN BE CONFIGURED AS 64M X 2 AND 128M X 1 |
e3 |
6 mm |
3 |
Flash memory is a type of non-volatile computer memory that is commonly used in digital devices such as USB drives, solid-state drives, and digital cameras. It is a type of EEPROM (Electrically Erasable Programmable Read-Only Memory) that allows data to be erased and reprogrammed in blocks instead of one byte at a time. Flash memory uses a floating gate transistor to store data, which allows it to retain information even when the power is turned off.
Flash memory is widely used in digital devices because of its high capacity, small size, and fast access times. It is also more durable than other types of memory, such as hard disk drives, because it has no moving parts. This makes it ideal for use in portable devices that may be subject to physical shock or vibration.
There are two types of flash memory: NOR flash and NAND flash. NOR flash is faster than NAND flash, but it has lower density and higher cost per bit. NOR flash is typically used for code storage, such as firmware or boot code, because it provides faster access times. NAND flash has higher density and lower cost per bit, which makes it ideal for data storage applications.
Flash memory has a limited lifespan, as it can only be erased and reprogrammed a limited number of times. This is because the process of erasing and reprogramming the memory causes wear and tear on the floating gate transistor. However, modern flash memory devices have a sophisticated wear-leveling algorithm that distributes writes evenly across the memory, which extends the lifespan of the device.