OTHER Flash Memory 2,400+

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Part RoHS Manufacturer Memory IC Type Temperature Grade No. of Terminals Package Code Package Shape Package Body Material Surface Mount No. of Functions Technology Screening Level Terminal Form Parallel or Serial Operating Mode Sector Size (Words) Maximum Supply Current No. of Words Input/Output Type Nominal Supply Voltage / Vsup (V) Mixed Memory Type Toggle Bit Power Supplies (V) Memory Width Package Style (Meter) Package Equivalence Code Alternate Memory Width Sub-Category Minimum Data Retention Time Terminal Pitch Maximum Operating Temperature Reverse Pinout Output Characteristics Organization No. of Words Code Minimum Operating Temperature No. of Sectors/Size Command User Interface Terminal Finish Ready or Busy Terminal Position No. of Ports Write Protection JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Supply Voltage (Vsup) Maximum Seated Height Endurance Maximum Clock Frequency (fCLK) Width Qualification Maximum Write Cycle Time (tWC) Serial Bus Type Boot Block Memory Density Minimum Supply Voltage (Vsup) Additional Features Page Size (words) JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Type Maximum Standby Current Length Common Flash Interface Maximum Access Time Programming Voltage (V) Data Polling

SDSDQ-2048

Western Digital

FLASH CARD

OTHER

8

DIE

RECTANGULAR

UNSPECIFIED

YES

1

CMOS

NO LEAD

SERIAL

SYNCHRONOUS

2147483648 words

8

UNCASED CHIP

1.1 mm

85 Cel

NO

2GX8

2G

-25 Cel

YES

UPPER

SOFTWARE

R-XUUC-N8

3.6 V

.95 mm

50 MHz

11 mm

17179869184 bit

2.7 V

NAND TYPE

15 mm

NO

2.7

NO

SDSDAF3-008G-I

Western Digital

FLASH CARD

OTHER

DIE

UNSPECIFIED

UNSPECIFIED

YES

1

CMOS

NO LEAD

ASYNCHRONOUS

8589934592 words

8

UNCASED CHIP

85 Cel

8GX8

8G

-25 Cel

UPPER

X-XUUC-N

3.6 V

68719476736 bit

2.7 V

2.7

EMMC16G-M525-X01U

Kingston Technology Company

FLASH

OTHER

153

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.5 mm

BOTTOM

R-PBGA-B153

1 mm

11.5 mm

NOT SPECIFIED

NOT SPECIFIED

MLC NAND TYPE

13 mm

3.3

FEMC008GTTE7-T13-16

Flexxon Global

FLASH CARD

OTHER

100

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100; TS 16949

BALL

8589934592 words

3.3

8

85 Cel

8GX8

8G

-25 Cel

BOTTOM

R-PBGA-B100

68719476736 bit

MLC NAND TYPE

FEMC008GTTE7-T13-17

Flexxon Global

FLASH CARD

OTHER

100

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100; TS 16949

BALL

8589934592 words

3.3

8

85 Cel

8GX8

8G

-25 Cel

BOTTOM

R-PBGA-B100

68719476736 bit

SLC NAND TYPE

FEMC016GTTE7-T14-16

Flexxon Global

FLASH CARD

OTHER

153

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100; TS 16949

BALL

17179869184 words

3.3

8

85 Cel

16GX8

16G

-25 Cel

BOTTOM

R-PBGA-B153

137438953472 bit

MLC NAND TYPE

SDCS2/32GB-2P1A

Kingston Technology Company

FLASH CARD

OTHER

DIE

RECTANGULAR

UNSPECIFIED

YES

1

CMOS

NO LEAD

34359738368 words

3.3

8

UNCASED CHIP

85 Cel

32GX8

32G

-25 Cel

UPPER

R-XUUC-N

274877906944 bit

NOR TYPE

3.3

SDCS2/32GB-3P1A

Kingston Technology Company

FLASH CARD

OTHER

DIE

RECTANGULAR

UNSPECIFIED

YES

1

CMOS

NO LEAD

34359738368 words

3.3

8

UNCASED CHIP

85 Cel

32GX8

32G

-25 Cel

UPPER

R-XUUC-N

274877906944 bit

NOR TYPE

3.3

SDINBDG4-32G-I2

Western Digital

FLASH CARD

OTHER

153

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

SERIAL

SYNCHRONOUS

34359738368 words

3.3

8

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA153,14X14,20

.5 mm

85 Cel

32GX8

32G

-25 Cel

BOTTOM

R-PBGA-B153

3.6 V

1 mm

3000 Write/Erase Cycles

11 mm

274877906944 bit

2.7 V

MLC NAND TYPE

13.5 mm

SDSDQ-4096

Western Digital

FLASH CARD

OTHER

8

DIE

RECTANGULAR

UNSPECIFIED

YES

1

CMOS

NO LEAD

SERIAL

SYNCHRONOUS

4294967296 words

8

UNCASED CHIP

1.1 mm

85 Cel

NO

4GX8

4G

-25 Cel

YES

UPPER

SOFTWARE

R-XUUC-N8

3.6 V

.95 mm

50 MHz

11 mm

34359738368 bit

2.7 V

NAND TYPE

15 mm

NO

2.7

NO

SST49LF008A-33-4C-WHE

Microchip Technology

FLASH

OTHER

32

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

SYNCHRONOUS

4K

24 mA

1048576 words

3.3

YES

3.3

8

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP32,.56,20

Flash Memories

100

.5 mm

85 Cel

3-STATE

1MX8

1M

0 Cel

256

YES

MATTE TIN

DUAL

1

R-PDSO-G32

3

3.6 V

1.2 mm

100000 Write/Erase Cycles

33 MHz

8 mm

Not Qualified

TOP

8388608 bit

3 V

e3

40

260

NOR TYPE

.0001 Amp

12.4 mm

120 ns

3.3

YES

TS2GUSDC

Transcend Information

FLASH

OTHER

DIE

RECTANGULAR

UNSPECIFIED

YES

1

CMOS

NO LEAD

ASYNCHRONOUS

2147483648 words

8

UNCASED CHIP

85 Cel

2GX8

2G

-25 Cel

UPPER

R-XUUC-N

3.6 V

17179869184 bit

2.7 V

NOT SPECIFIED

NOT SPECIFIED

NOR TYPE

2.7

TS32GUSDHC10U1

Transcend Information

FLASH CARD

OTHER

8

DIE

RECTANGULAR

1

CMOS

NO LEAD

SERIAL

SYNCHRONOUS

34359738368 words

8

UNCASED CHIP

DIE OR CHIP

85 Cel

32GX8

32G

-25 Cel

SINGLE

R-XUUC-N8

SPI

274877906944 bit

MLC NAND TYPE

PC28F128G18FE

Micron Technology

FLASH

OTHER

64

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

SYNCHRONOUS

128K

50 mA

8388608 words

1.8

NO

1.8

16

GRID ARRAY, THIN PROFILE

BGA64,8X8,40

Flash Memories

1 mm

85 Cel

8MX16

8M

-30 Cel

64

YES

TIN SILVER COPPER

BOTTOM

R-PBGA-B64

2 V

1.2 mm

8 mm

Not Qualified

134217728 bit

1.7 V

e1

NOR TYPE

.000115 Amp

10 mm

YES

96 ns

2.7

NO

SST49LF080A-33-4C-WHE

Microchip Technology

FLASH

OTHER

32

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

SYNCHRONOUS

4K

24 mA

1048576 words

3.3

YES

8

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP32,.56,20

100

.5 mm

85 Cel

3-STATE

1MX8

1M

0 Cel

256

YES

Matte Tin (Sn) - annealed

DUAL

1

R-PDSO-G32

3

3.6 V

1.2 mm

100000 Write/Erase Cycles

33 MHz

8 mm

Not Qualified

TOP

8388608 bit

3 V

e3

40

260

NOR TYPE

.0001 Amp

12.4 mm

120 ns

3

YES

KLM8G1GEME-B041

Samsung

FLASH CARD

OTHER

153

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

8589934592 words

1.8

8

85 Cel

8GX8

8G

-25 Cel

BOTTOM

R-PBGA-B153

68719476736 bit

NAND TYPE

1.8

S40410081B1B1W000

Cypress Semiconductor

FLASH

OTHER

153

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

SYNCHRONOUS

8589934592 words

3

8

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

4

.5 mm

85 Cel

8GX8

8G

-25 Cel

BOTTOM

R-PBGA-B153

3.6 V

1 mm

11.5 mm

68719476736 bit

2.7 V

MLC NAND TYPE

13 mm

3

S40410161B1B1W010

Cypress Semiconductor

FLASH

OTHER

153

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

SYNCHRONOUS

17179869184 words

3

8

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

4

.5 mm

85 Cel

16GX8

16G

-25 Cel

BOTTOM

R-PBGA-B153

3.6 V

1 mm

11.5 mm

137438953472 bit

2.7 V

MLC NAND TYPE

13 mm

3

S40410081B1B2W000

Cypress Semiconductor

FLASH

OTHER

100

LBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

SYNCHRONOUS

8589934592 words

3

8

GRID ARRAY, LOW PROFILE

4

1 mm

85 Cel

8GX8

8G

-25 Cel

BOTTOM

R-PBGA-B100

3.6 V

1.4 mm

14 mm

68719476736 bit

2.7 V

MLC NAND TYPE

18 mm

3

S40410081B1B2W003

Cypress Semiconductor

FLASH

OTHER

100

LBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

SYNCHRONOUS

8589934592 words

3

8

GRID ARRAY, LOW PROFILE

4

1 mm

85 Cel

8GX8

8G

-25 Cel

BOTTOM

R-PBGA-B100

3.6 V

1.4 mm

14 mm

68719476736 bit

2.7 V

18 mm

3

S40410161B1B2W010

Cypress Semiconductor

FLASH

OTHER

100

LBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

SYNCHRONOUS

17179869184 words

3

8

GRID ARRAY, LOW PROFILE

4

1 mm

85 Cel

16GX8

16G

-25 Cel

BOTTOM

R-PBGA-B100

3.6 V

1.4 mm

14 mm

137438953472 bit

2.7 V

MLC NAND TYPE

18 mm

3

S40410161B1B2W013

Cypress Semiconductor

FLASH

OTHER

100

LBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

SYNCHRONOUS

17179869184 words

3

8

GRID ARRAY, LOW PROFILE

4

1 mm

85 Cel

16GX8

16G

-25 Cel

BOTTOM

R-PBGA-B100

3.6 V

1.4 mm

14 mm

137438953472 bit

2.7 V

NOT SPECIFIED

NOT SPECIFIED

18 mm

3

THGBF7G8K4LBATR

Toshiba

FLASH

OTHER

153

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

34359738368 words

8

GRID ARRAY

85 Cel

32GX8

32G

-25 Cel

BOTTOM

R-PBGA-B153

3.6 V

274877906944 bit

2.7 V

MLC NAND TYPE

2.7

MTFC16GJDEC-2MWT

Micron Technology

FLASH CARD

OTHER

169

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

SYNCHRONOUS

17179869184 words

3.3

NO

8

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA169,14X28,20

.5 mm

85 Cel

16GX8

16G

-25 Cel

NO

TIN SILVER COPPER

BOTTOM

R-PBGA-B169

3.6 V

.8 mm

52 MHz

14 mm

137438953472 bit

2.7 V

MLC NAND TYPE

18 mm

3.3

NO

SDCS2/64GBSP

Kingston Technology Company

FLASH CARD

OTHER

DIE

RECTANGULAR

UNSPECIFIED

YES

1

CMOS

NO LEAD

68719476736 words

3.3

8

UNCASED CHIP

85 Cel

64GX8

64G

-25 Cel

UPPER

R-XUUC-N

2.1 mm

24 mm

549755813888 bit

NOR TYPE

32 mm

3.3

SFSD4096N1BW1MT-E-DF-111-STD

Swissbit Ag

FLASH CARD

OTHER

8

DIE

RECTANGULAR

UNSPECIFIED

YES

1

CMOS

NO LEAD

SERIAL

SYNCHRONOUS

4294967296 words

3.3

8

UNCASED CHIP

85 Cel

4GX8

4G

-25 Cel

UPPER

R-XUUC-N8

3.6 V

1 mm

50 MHz

11 mm

34359738368 bit

2.7 V

NOT SPECIFIED

NOT SPECIFIED

15 mm

3.3

KLMCG4JETD-B0410

Samsung

FLASH

OTHER

153

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

SYNCHRONOUS

68719476736 words

1.8

8

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.5 mm

85 Cel

64GX8

64G

-25 Cel

BOTTOM

R-PBGA-B153

1.95 V

1 mm

200 MHz

11.5 mm

549755813888 bit

1.7 V

ALSO OPERATES @ 3V SUP NOM

MLC NAND TYPE

13 mm

1.8

MTFC4GLDEA-0MWT

Micron Technology

FLASH CARD

OTHER

153

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

SYNCHRONOUS

4294967296 words

3.3

NO

8

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA153,14X14,20

.5 mm

85 Cel

4GX8

4G

-25 Cel

NO

TIN SILVER COPPER

BOTTOM

R-PBGA-B153

3.6 V

.8 mm

52 MHz

11.5 mm

34359738368 bit

2.7 V

MLC NAND TYPE

13 mm

3.3

NO

MTFC4GLDEA-0MWTTR

Micron Technology

FLASH CARD

OTHER

153

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

SYNCHRONOUS

4294967296 words

3.3

NO

8

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA153,14X14,20

.5 mm

85 Cel

4GX8

4G

-25 Cel

NO

TIN SILVER COPPER

BOTTOM

R-PBGA-B153

3.6 V

.8 mm

52 MHz

11.5 mm

34359738368 bit

2.7 V

e1

MLC NAND TYPE

13 mm

3.3

NO

PM8607B1-F3EI

Microchip Technology

FLASH

OTHER

1085

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

115 Cel

0 Cel

BOTTOM

R-PBGA-B1085

NAND TYPE

SFSD4096N2BM1TO-E-GE-2A1-STD

Swissbit Ag

FLASH CARD

OTHER

8

DIE

RECTANGULAR

UNSPECIFIED

YES

1

CMOS

NO LEAD

SERIAL

SYNCHRONOUS

4294967296 words

3.3

8

UNCASED CHIP

85 Cel

4GX8

4G

-25 Cel

UPPER

R-XUUC-N8

3.6 V

1.1 mm

100 MHz

11 mm

34359738368 bit

2.7 V

NOT SPECIFIED

NOT SPECIFIED

MLC NAND TYPE

15 mm

3.3

SST49LF016C-33-4C-WHE

Microchip Technology

FLASH

OTHER

32

TSOP1

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

SYNCHRONOUS

16K,8K,32K,64K

18 mA

2097152 words

3.3

NO

3.3

8

SMALL OUTLINE, THIN PROFILE

TSSOP32,.56,20

Flash Memories

.5 mm

85 Cel

2MX8

2M

0 Cel

1,2,1,31

YES

MATTE TIN

YES

DUAL

R-PDSO-G32

3

3.6 V

1.2 mm

33 MHz

8 mm

Not Qualified

TOP

16777216 bit

3 V

e3

NOR TYPE

.0001 Amp

12.4 mm

11 ns

3

NO

TS4GUSDC10

Transcend Information

FLASH CARD

OTHER

DIE

RECTANGULAR

UNSPECIFIED

YES

1

CMOS

NO LEAD

UNCASED CHIP

UPPER

R-XUUC-N

2.7

TS4GUSDC4

Transcend Information

FLASH

OTHER

DIE

RECTANGULAR

UNSPECIFIED

YES

1

CMOS

NO LEAD

ASYNCHRONOUS

4294967296 words

8

UNCASED CHIP

85 Cel

4GX8

4G

-25 Cel

UPPER

R-XUUC-N

3.6 V

34359738368 bit

2.7 V

NOT SPECIFIED

NOT SPECIFIED

NOR TYPE

2.7

DA28F640J5-150

Intel

FLASH

OTHER

56

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

128K

80 mA

4194304 words

5

NO

3/3.3,5

16

SMALL OUTLINE, SHRINK PITCH

SOP56,.6,32

8

Flash Memories

.8 mm

85 Cel

3-STATE

4MX16

4M

-20 Cel

64

YES

YES

DUAL

R-PDSO-G56

5.5 V

1.9 mm

13.3 mm

Not Qualified

67108864 bit

4.5 V

NOR TYPE

.000125 Amp

23.7 mm

YES

150 ns

5

NO

S29WS128P0PBFW000

Cypress Semiconductor

FLASH

OTHER

84

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

16K,64K

80 mA

8388608 words

1.8

YES

1.8

16

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA84,10X12,32

Flash Memories

.8 mm

85 Cel

8MX16

8M

-25 Cel

8,126

YES

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

YES

BOTTOM

R-PBGA-B84

3

1.95 V

1 mm

8 mm

Not Qualified

BOTTOM/TOP

134217728 bit

1.7 V

SYNCHRONOUS BURST MODE OPERATION POSSIBLE

8

e1

40

260

NOR TYPE

.000005 Amp

11.6 mm

YES

80 ns

1.8

YES

THGBMAG6A2JBAIR

Toshiba

FLASH CARD

OTHER

153

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

8589934592 words

8

85 Cel

8GX8

8G

-25 Cel

BOTTOM

R-PBGA-B153

3.6 V

68719476736 bit

2.7 V

NAND TYPE

2.7

DA28F640J5A-150

Intel

FLASH

OTHER

56

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

128K

80 mA

4194304 words

5

NO

3/3.3,5

16

SMALL OUTLINE, SHRINK PITCH

SOP56,.6,32

8

Flash Memories

.8 mm

85 Cel

4MX16

4M

-20 Cel

64

YES

TIN LEAD

YES

DUAL

R-PDSO-G56

5.5 V

1.9 mm

13.3 mm

Not Qualified

67108864 bit

4.5 V

e0

NOR TYPE

.000125 Amp

23.7 mm

YES

150 ns

5

NO

KLM8G2FE3B-B001

Samsung

FLASH CARD

OTHER

153

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

SYNCHRONOUS

8589934592 words

3.3

8

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.5 mm

85 Cel

8GX8

8G

-25 Cel

BOTTOM

R-PBGA-B153

3.6 V

1 mm

52 MHz

11.5 mm

68719476736 bit

2.7 V

1.8V NOMINAL SUPPLY IS ALSO AVAILABLE

13 mm

3.3

S29PL064J70BFW120

Cypress Semiconductor

FLASH

OTHER

48

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

4K,32K

70 mA

4194304 words

3

YES

3/3.3

16

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA48,6X8,32

Flash Memories

.8 mm

85 Cel

4MX16

4M

-25 Cel

16,126

YES

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

YES

BOTTOM

R-PBGA-B48

3

3.6 V

1 mm

6.15 mm

Not Qualified

BOTTOM/TOP

67108864 bit

2.7 V

TOP AND BOTTOM BOOT BLOCK

8

e1

40

260

NOR TYPE

.000005 Amp

8.15 mm

YES

70 ns

3

YES

THGBM5G8A4JBAIR

Toshiba

FLASH CARD

OTHER

153

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

34359738368 words

8

85 Cel

32GX8

32G

-25 Cel

BOTTOM

R-PBGA-B153

3.6 V

274877906944 bit

2.7 V

NAND TYPE

2.7

DA28F320J5-120

Intel

FLASH

OTHER

56

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

128K

80 mA

2097152 words

5

NO

3/3.3,5

16

SMALL OUTLINE, SHRINK PITCH

SOP56,.6,32

8

Flash Memories

.8 mm

85 Cel

3-STATE

2MX16

2M

-20 Cel

32

YES

TIN LEAD

YES

DUAL

R-PDSO-G56

5.5 V

1.9 mm

13.3 mm

Not Qualified

33554432 bit

4.5 V

CONFIGURABLE AS 2M X 16; BLOCK ERASE

16/32

e0

NOR TYPE

.000125 Amp

23.7 mm

YES

120 ns

5

NO

KLM4G1FE3B-B001

Samsung

FLASH CARD

OTHER

153

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

SYNCHRONOUS

4294967296 words

3.3

8

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.5 mm

85 Cel

4GX8

4G

-25 Cel

BOTTOM

R-PBGA-B153

3.6 V

1 mm

52 MHz

11.5 mm

34359738368 bit

2.7 V

1.8V NOMINAL SUPPLY IS ALSO AVAILABLE

13 mm

3.3

KLMBG8FE3B-A001

Samsung

FLASH CARD

OTHER

169

TFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

SYNCHRONOUS

34359738368 words

3.3

8

GRID ARRAY, THIN PROFILE, FINE PITCH

.5 mm

85 Cel

32GX8

32G

-25 Cel

BOTTOM

R-PBGA-B169

3.6 V

1.2 mm

52 MHz

12 mm

274877906944 bit

2.7 V

1.8V NOMINAL SUPPLY IS ALSO AVAILABLE

16 mm

3.3

LH28F160BJD-TTL80

Sharp Corporation

FLASH

OTHER

42

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

CMOS

THROUGH-HOLE

PARALLEL

4K,32K

60 mA

1048576 words

3.3

NO

3.3

16

IN-LINE

DIP42,.6

Flash Memories

2.54 mm

85 Cel

1MX16

1M

0 Cel

8,31

YES

DUAL

R-PDIP-T42

Not Qualified

TOP

16777216 bit

NOR TYPE

.00003 Amp

80 ns

NO

S29GL512P10FFCR10

Cypress Semiconductor

FLASH

OTHER

64

LBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

128K

110 mA

536870912 words

3.3

YES

3.3

1

GRID ARRAY, LOW PROFILE

BGA64,8X8,40

8

Flash Memories

1 mm

85 Cel

512MX1

512M

0 Cel

512

YES

TIN SILVER COPPER

YES

BOTTOM

R-PBGA-B64

3

3.6 V

1.4 mm

11 mm

Not Qualified

536870912 bit

3 V

8/16

e1

30

260

NOR TYPE

.000005 Amp

13 mm

YES

100 ns

3

YES

THGBMAG5A1JBAIR

Toshiba

FLASH CARD

OTHER

153

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

4294967296 words

8

85 Cel

4GX8

4G

-25 Cel

BOTTOM

R-PBGA-B153

3.6 V

34359738368 bit

2.7 V

NAND TYPE

2.7

SST49LF008A-33-4C-EIE

Microchip Technology

FLASH

OTHER

40

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

SYNCHRONOUS

4K

24 mA

1048576 words

3.3

YES

3.3

8

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP40,.8,20

Flash Memories

.5 mm

85 Cel

1MX8

1M

0 Cel

256

YES

Matte Tin (Sn) - annealed

DUAL

R-PDSO-G40

3

3.6 V

1.2 mm

10 mm

Not Qualified

TOP

8388608 bit

3 V

e3

40

260

NOR TYPE

.0001 Amp

18.4 mm

120 ns

3

YES

Flash Memory

Flash memory is a type of non-volatile computer memory that is commonly used in digital devices such as USB drives, solid-state drives, and digital cameras. It is a type of EEPROM (Electrically Erasable Programmable Read-Only Memory) that allows data to be erased and reprogrammed in blocks instead of one byte at a time. Flash memory uses a floating gate transistor to store data, which allows it to retain information even when the power is turned off.

Flash memory is widely used in digital devices because of its high capacity, small size, and fast access times. It is also more durable than other types of memory, such as hard disk drives, because it has no moving parts. This makes it ideal for use in portable devices that may be subject to physical shock or vibration.

There are two types of flash memory: NOR flash and NAND flash. NOR flash is faster than NAND flash, but it has lower density and higher cost per bit. NOR flash is typically used for code storage, such as firmware or boot code, because it provides faster access times. NAND flash has higher density and lower cost per bit, which makes it ideal for data storage applications.

Flash memory has a limited lifespan, as it can only be erased and reprogrammed a limited number of times. This is because the process of erasing and reprogramming the memory causes wear and tear on the floating gate transistor. However, modern flash memory devices have a sophisticated wear-leveling algorithm that distributes writes evenly across the memory, which extends the lifespan of the device.