Part | RoHS | Manufacturer | Memory IC Type | Temperature Grade | No. of Terminals | Package Code | Package Shape | Package Body Material | Surface Mount | No. of Functions | Technology | Screening Level | Terminal Form | Parallel or Serial | Operating Mode | Sector Size (Words) | Maximum Supply Current | No. of Words | Input/Output Type | Nominal Supply Voltage / Vsup (V) | Mixed Memory Type | Toggle Bit | Power Supplies (V) | Memory Width | Package Style (Meter) | Package Equivalence Code | Alternate Memory Width | Sub-Category | Minimum Data Retention Time | Terminal Pitch | Maximum Operating Temperature | Reverse Pinout | Output Characteristics | Organization | No. of Words Code | Minimum Operating Temperature | No. of Sectors/Size | Command User Interface | Terminal Finish | Ready or Busy | Terminal Position | No. of Ports | Write Protection | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Endurance | Maximum Clock Frequency (fCLK) | Width | Qualification | Maximum Write Cycle Time (tWC) | Serial Bus Type | Boot Block | Memory Density | Minimum Supply Voltage (Vsup) | Additional Features | Page Size (words) | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Type | Maximum Standby Current | Length | Common Flash Interface | Maximum Access Time | Programming Voltage (V) | Data Polling |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Western Digital |
FLASH CARD |
OTHER |
8 |
DIE |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
2147483648 words |
8 |
UNCASED CHIP |
1.1 mm |
85 Cel |
NO |
2GX8 |
2G |
-25 Cel |
YES |
UPPER |
SOFTWARE |
R-XUUC-N8 |
3.6 V |
.95 mm |
50 MHz |
11 mm |
17179869184 bit |
2.7 V |
NAND TYPE |
15 mm |
NO |
2.7 |
NO |
||||||||||||||||||||||||||||||||
|
Western Digital |
FLASH CARD |
OTHER |
DIE |
UNSPECIFIED |
UNSPECIFIED |
YES |
1 |
CMOS |
NO LEAD |
ASYNCHRONOUS |
8589934592 words |
8 |
UNCASED CHIP |
85 Cel |
8GX8 |
8G |
-25 Cel |
UPPER |
X-XUUC-N |
3.6 V |
68719476736 bit |
2.7 V |
2.7 |
||||||||||||||||||||||||||||||||||||||||||||
|
Kingston Technology Company |
FLASH |
OTHER |
153 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.5 mm |
BOTTOM |
R-PBGA-B153 |
1 mm |
11.5 mm |
NOT SPECIFIED |
NOT SPECIFIED |
MLC NAND TYPE |
13 mm |
3.3 |
||||||||||||||||||||||||||||||||||||||||||||||
Flexxon Global |
FLASH CARD |
OTHER |
100 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100; TS 16949 |
BALL |
8589934592 words |
3.3 |
8 |
85 Cel |
8GX8 |
8G |
-25 Cel |
BOTTOM |
R-PBGA-B100 |
68719476736 bit |
MLC NAND TYPE |
|||||||||||||||||||||||||||||||||||||||||||||||
Flexxon Global |
FLASH CARD |
OTHER |
100 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100; TS 16949 |
BALL |
8589934592 words |
3.3 |
8 |
85 Cel |
8GX8 |
8G |
-25 Cel |
BOTTOM |
R-PBGA-B100 |
68719476736 bit |
SLC NAND TYPE |
|||||||||||||||||||||||||||||||||||||||||||||||
Flexxon Global |
FLASH CARD |
OTHER |
153 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100; TS 16949 |
BALL |
17179869184 words |
3.3 |
8 |
85 Cel |
16GX8 |
16G |
-25 Cel |
BOTTOM |
R-PBGA-B153 |
137438953472 bit |
MLC NAND TYPE |
|||||||||||||||||||||||||||||||||||||||||||||||
|
Kingston Technology Company |
FLASH CARD |
OTHER |
DIE |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
CMOS |
NO LEAD |
34359738368 words |
3.3 |
8 |
UNCASED CHIP |
85 Cel |
32GX8 |
32G |
-25 Cel |
UPPER |
R-XUUC-N |
274877906944 bit |
NOR TYPE |
3.3 |
|||||||||||||||||||||||||||||||||||||||||||||
|
Kingston Technology Company |
FLASH CARD |
OTHER |
DIE |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
CMOS |
NO LEAD |
34359738368 words |
3.3 |
8 |
UNCASED CHIP |
85 Cel |
32GX8 |
32G |
-25 Cel |
UPPER |
R-XUUC-N |
274877906944 bit |
NOR TYPE |
3.3 |
|||||||||||||||||||||||||||||||||||||||||||||
|
Western Digital |
FLASH CARD |
OTHER |
153 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SERIAL |
SYNCHRONOUS |
34359738368 words |
3.3 |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA153,14X14,20 |
.5 mm |
85 Cel |
32GX8 |
32G |
-25 Cel |
BOTTOM |
R-PBGA-B153 |
3.6 V |
1 mm |
3000 Write/Erase Cycles |
11 mm |
274877906944 bit |
2.7 V |
MLC NAND TYPE |
13.5 mm |
|||||||||||||||||||||||||||||||||||
Western Digital |
FLASH CARD |
OTHER |
8 |
DIE |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
4294967296 words |
8 |
UNCASED CHIP |
1.1 mm |
85 Cel |
NO |
4GX8 |
4G |
-25 Cel |
YES |
UPPER |
SOFTWARE |
R-XUUC-N8 |
3.6 V |
.95 mm |
50 MHz |
11 mm |
34359738368 bit |
2.7 V |
NAND TYPE |
15 mm |
NO |
2.7 |
NO |
||||||||||||||||||||||||||||||||
|
Microchip Technology |
FLASH |
OTHER |
32 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
4K |
24 mA |
1048576 words |
3.3 |
YES |
3.3 |
8 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP32,.56,20 |
Flash Memories |
100 |
.5 mm |
85 Cel |
3-STATE |
1MX8 |
1M |
0 Cel |
256 |
YES |
MATTE TIN |
DUAL |
1 |
R-PDSO-G32 |
3 |
3.6 V |
1.2 mm |
100000 Write/Erase Cycles |
33 MHz |
8 mm |
Not Qualified |
TOP |
8388608 bit |
3 V |
e3 |
40 |
260 |
NOR TYPE |
.0001 Amp |
12.4 mm |
120 ns |
3.3 |
YES |
|||||||||||||
|
Transcend Information |
FLASH |
OTHER |
DIE |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
CMOS |
NO LEAD |
ASYNCHRONOUS |
2147483648 words |
8 |
UNCASED CHIP |
85 Cel |
2GX8 |
2G |
-25 Cel |
UPPER |
R-XUUC-N |
3.6 V |
17179869184 bit |
2.7 V |
NOT SPECIFIED |
NOT SPECIFIED |
NOR TYPE |
2.7 |
|||||||||||||||||||||||||||||||||||||||||
Transcend Information |
FLASH CARD |
OTHER |
8 |
DIE |
RECTANGULAR |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
34359738368 words |
8 |
UNCASED CHIP |
DIE OR CHIP |
85 Cel |
32GX8 |
32G |
-25 Cel |
SINGLE |
R-XUUC-N8 |
SPI |
274877906944 bit |
MLC NAND TYPE |
|||||||||||||||||||||||||||||||||||||||||||||
|
Micron Technology |
FLASH |
OTHER |
64 |
TBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
128K |
50 mA |
8388608 words |
1.8 |
NO |
1.8 |
16 |
GRID ARRAY, THIN PROFILE |
BGA64,8X8,40 |
Flash Memories |
1 mm |
85 Cel |
8MX16 |
8M |
-30 Cel |
64 |
YES |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B64 |
2 V |
1.2 mm |
8 mm |
Not Qualified |
134217728 bit |
1.7 V |
e1 |
NOR TYPE |
.000115 Amp |
10 mm |
YES |
96 ns |
2.7 |
NO |
|||||||||||||||||||||
|
Microchip Technology |
FLASH |
OTHER |
32 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
4K |
24 mA |
1048576 words |
3.3 |
YES |
8 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP32,.56,20 |
100 |
.5 mm |
85 Cel |
3-STATE |
1MX8 |
1M |
0 Cel |
256 |
YES |
Matte Tin (Sn) - annealed |
DUAL |
1 |
R-PDSO-G32 |
3 |
3.6 V |
1.2 mm |
100000 Write/Erase Cycles |
33 MHz |
8 mm |
Not Qualified |
TOP |
8388608 bit |
3 V |
e3 |
40 |
260 |
NOR TYPE |
.0001 Amp |
12.4 mm |
120 ns |
3 |
YES |
|||||||||||||||
Samsung |
FLASH CARD |
OTHER |
153 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
8589934592 words |
1.8 |
8 |
85 Cel |
8GX8 |
8G |
-25 Cel |
BOTTOM |
R-PBGA-B153 |
68719476736 bit |
NAND TYPE |
1.8 |
|||||||||||||||||||||||||||||||||||||||||||||||
|
Cypress Semiconductor |
FLASH |
OTHER |
153 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
8589934592 words |
3 |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
4 |
.5 mm |
85 Cel |
8GX8 |
8G |
-25 Cel |
BOTTOM |
R-PBGA-B153 |
3.6 V |
1 mm |
11.5 mm |
68719476736 bit |
2.7 V |
MLC NAND TYPE |
13 mm |
3 |
|||||||||||||||||||||||||||||||||||
|
Cypress Semiconductor |
FLASH |
OTHER |
153 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
17179869184 words |
3 |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
4 |
.5 mm |
85 Cel |
16GX8 |
16G |
-25 Cel |
BOTTOM |
R-PBGA-B153 |
3.6 V |
1 mm |
11.5 mm |
137438953472 bit |
2.7 V |
MLC NAND TYPE |
13 mm |
3 |
|||||||||||||||||||||||||||||||||||
|
Cypress Semiconductor |
FLASH |
OTHER |
100 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
8589934592 words |
3 |
8 |
GRID ARRAY, LOW PROFILE |
4 |
1 mm |
85 Cel |
8GX8 |
8G |
-25 Cel |
BOTTOM |
R-PBGA-B100 |
3.6 V |
1.4 mm |
14 mm |
68719476736 bit |
2.7 V |
MLC NAND TYPE |
18 mm |
3 |
|||||||||||||||||||||||||||||||||||
|
Cypress Semiconductor |
FLASH |
OTHER |
100 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
8589934592 words |
3 |
8 |
GRID ARRAY, LOW PROFILE |
4 |
1 mm |
85 Cel |
8GX8 |
8G |
-25 Cel |
BOTTOM |
R-PBGA-B100 |
3.6 V |
1.4 mm |
14 mm |
68719476736 bit |
2.7 V |
18 mm |
3 |
||||||||||||||||||||||||||||||||||||
|
Cypress Semiconductor |
FLASH |
OTHER |
100 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
17179869184 words |
3 |
8 |
GRID ARRAY, LOW PROFILE |
4 |
1 mm |
85 Cel |
16GX8 |
16G |
-25 Cel |
BOTTOM |
R-PBGA-B100 |
3.6 V |
1.4 mm |
14 mm |
137438953472 bit |
2.7 V |
MLC NAND TYPE |
18 mm |
3 |
|||||||||||||||||||||||||||||||||||
|
Cypress Semiconductor |
FLASH |
OTHER |
100 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
17179869184 words |
3 |
8 |
GRID ARRAY, LOW PROFILE |
4 |
1 mm |
85 Cel |
16GX8 |
16G |
-25 Cel |
BOTTOM |
R-PBGA-B100 |
3.6 V |
1.4 mm |
14 mm |
137438953472 bit |
2.7 V |
NOT SPECIFIED |
NOT SPECIFIED |
18 mm |
3 |
||||||||||||||||||||||||||||||||||
Toshiba |
FLASH |
OTHER |
153 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
34359738368 words |
8 |
GRID ARRAY |
85 Cel |
32GX8 |
32G |
-25 Cel |
BOTTOM |
R-PBGA-B153 |
3.6 V |
274877906944 bit |
2.7 V |
MLC NAND TYPE |
2.7 |
||||||||||||||||||||||||||||||||||||||||||
|
Micron Technology |
FLASH CARD |
OTHER |
169 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
17179869184 words |
3.3 |
NO |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA169,14X28,20 |
.5 mm |
85 Cel |
16GX8 |
16G |
-25 Cel |
NO |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B169 |
3.6 V |
.8 mm |
52 MHz |
14 mm |
137438953472 bit |
2.7 V |
MLC NAND TYPE |
18 mm |
3.3 |
NO |
||||||||||||||||||||||||||||||
Kingston Technology Company |
FLASH CARD |
OTHER |
DIE |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
CMOS |
NO LEAD |
68719476736 words |
3.3 |
8 |
UNCASED CHIP |
85 Cel |
64GX8 |
64G |
-25 Cel |
UPPER |
R-XUUC-N |
2.1 mm |
24 mm |
549755813888 bit |
NOR TYPE |
32 mm |
3.3 |
|||||||||||||||||||||||||||||||||||||||||||
|
Swissbit Ag |
FLASH CARD |
OTHER |
8 |
DIE |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
4294967296 words |
3.3 |
8 |
UNCASED CHIP |
85 Cel |
4GX8 |
4G |
-25 Cel |
UPPER |
R-XUUC-N8 |
3.6 V |
1 mm |
50 MHz |
11 mm |
34359738368 bit |
2.7 V |
NOT SPECIFIED |
NOT SPECIFIED |
15 mm |
3.3 |
|||||||||||||||||||||||||||||||||||
Samsung |
FLASH |
OTHER |
153 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
68719476736 words |
1.8 |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.5 mm |
85 Cel |
64GX8 |
64G |
-25 Cel |
BOTTOM |
R-PBGA-B153 |
1.95 V |
1 mm |
200 MHz |
11.5 mm |
549755813888 bit |
1.7 V |
ALSO OPERATES @ 3V SUP NOM |
MLC NAND TYPE |
13 mm |
1.8 |
|||||||||||||||||||||||||||||||||||
|
Micron Technology |
FLASH CARD |
OTHER |
153 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
4294967296 words |
3.3 |
NO |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA153,14X14,20 |
.5 mm |
85 Cel |
4GX8 |
4G |
-25 Cel |
NO |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B153 |
3.6 V |
.8 mm |
52 MHz |
11.5 mm |
34359738368 bit |
2.7 V |
MLC NAND TYPE |
13 mm |
3.3 |
NO |
||||||||||||||||||||||||||||||
|
Micron Technology |
FLASH CARD |
OTHER |
153 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
4294967296 words |
3.3 |
NO |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA153,14X14,20 |
.5 mm |
85 Cel |
4GX8 |
4G |
-25 Cel |
NO |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B153 |
3.6 V |
.8 mm |
52 MHz |
11.5 mm |
34359738368 bit |
2.7 V |
e1 |
MLC NAND TYPE |
13 mm |
3.3 |
NO |
|||||||||||||||||||||||||||||
|
Microchip Technology |
FLASH |
OTHER |
1085 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
115 Cel |
0 Cel |
BOTTOM |
R-PBGA-B1085 |
NAND TYPE |
|||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Swissbit Ag |
FLASH CARD |
OTHER |
8 |
DIE |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
4294967296 words |
3.3 |
8 |
UNCASED CHIP |
85 Cel |
4GX8 |
4G |
-25 Cel |
UPPER |
R-XUUC-N8 |
3.6 V |
1.1 mm |
100 MHz |
11 mm |
34359738368 bit |
2.7 V |
NOT SPECIFIED |
NOT SPECIFIED |
MLC NAND TYPE |
15 mm |
3.3 |
||||||||||||||||||||||||||||||||||
|
Microchip Technology |
FLASH |
OTHER |
32 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
16K,8K,32K,64K |
18 mA |
2097152 words |
3.3 |
NO |
3.3 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSSOP32,.56,20 |
Flash Memories |
.5 mm |
85 Cel |
2MX8 |
2M |
0 Cel |
1,2,1,31 |
YES |
MATTE TIN |
YES |
DUAL |
R-PDSO-G32 |
3 |
3.6 V |
1.2 mm |
33 MHz |
8 mm |
Not Qualified |
TOP |
16777216 bit |
3 V |
e3 |
NOR TYPE |
.0001 Amp |
12.4 mm |
11 ns |
3 |
NO |
||||||||||||||||||
Transcend Information |
FLASH CARD |
OTHER |
DIE |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
CMOS |
NO LEAD |
UNCASED CHIP |
UPPER |
R-XUUC-N |
2.7 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Transcend Information |
FLASH |
OTHER |
DIE |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
CMOS |
NO LEAD |
ASYNCHRONOUS |
4294967296 words |
8 |
UNCASED CHIP |
85 Cel |
4GX8 |
4G |
-25 Cel |
UPPER |
R-XUUC-N |
3.6 V |
34359738368 bit |
2.7 V |
NOT SPECIFIED |
NOT SPECIFIED |
NOR TYPE |
2.7 |
|||||||||||||||||||||||||||||||||||||||||
Intel |
FLASH |
OTHER |
56 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
128K |
80 mA |
4194304 words |
5 |
NO |
3/3.3,5 |
16 |
SMALL OUTLINE, SHRINK PITCH |
SOP56,.6,32 |
8 |
Flash Memories |
.8 mm |
85 Cel |
3-STATE |
4MX16 |
4M |
-20 Cel |
64 |
YES |
YES |
DUAL |
R-PDSO-G56 |
5.5 V |
1.9 mm |
13.3 mm |
Not Qualified |
67108864 bit |
4.5 V |
NOR TYPE |
.000125 Amp |
23.7 mm |
YES |
150 ns |
5 |
NO |
|||||||||||||||||||||
|
Cypress Semiconductor |
FLASH |
OTHER |
84 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
16K,64K |
80 mA |
8388608 words |
1.8 |
YES |
1.8 |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA84,10X12,32 |
Flash Memories |
.8 mm |
85 Cel |
8MX16 |
8M |
-25 Cel |
8,126 |
YES |
Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) |
YES |
BOTTOM |
R-PBGA-B84 |
3 |
1.95 V |
1 mm |
8 mm |
Not Qualified |
BOTTOM/TOP |
134217728 bit |
1.7 V |
SYNCHRONOUS BURST MODE OPERATION POSSIBLE |
8 |
e1 |
40 |
260 |
NOR TYPE |
.000005 Amp |
11.6 mm |
YES |
80 ns |
1.8 |
YES |
||||||||||||||
Toshiba |
FLASH CARD |
OTHER |
153 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
8589934592 words |
8 |
85 Cel |
8GX8 |
8G |
-25 Cel |
BOTTOM |
R-PBGA-B153 |
3.6 V |
68719476736 bit |
2.7 V |
NAND TYPE |
2.7 |
||||||||||||||||||||||||||||||||||||||||||||||
Intel |
FLASH |
OTHER |
56 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
128K |
80 mA |
4194304 words |
5 |
NO |
3/3.3,5 |
16 |
SMALL OUTLINE, SHRINK PITCH |
SOP56,.6,32 |
8 |
Flash Memories |
.8 mm |
85 Cel |
4MX16 |
4M |
-20 Cel |
64 |
YES |
TIN LEAD |
YES |
DUAL |
R-PDSO-G56 |
5.5 V |
1.9 mm |
13.3 mm |
Not Qualified |
67108864 bit |
4.5 V |
e0 |
NOR TYPE |
.000125 Amp |
23.7 mm |
YES |
150 ns |
5 |
NO |
||||||||||||||||||||
Samsung |
FLASH CARD |
OTHER |
153 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
8589934592 words |
3.3 |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.5 mm |
85 Cel |
8GX8 |
8G |
-25 Cel |
BOTTOM |
R-PBGA-B153 |
3.6 V |
1 mm |
52 MHz |
11.5 mm |
68719476736 bit |
2.7 V |
1.8V NOMINAL SUPPLY IS ALSO AVAILABLE |
13 mm |
3.3 |
||||||||||||||||||||||||||||||||||||
|
Cypress Semiconductor |
FLASH |
OTHER |
48 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
4K,32K |
70 mA |
4194304 words |
3 |
YES |
3/3.3 |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA48,6X8,32 |
Flash Memories |
.8 mm |
85 Cel |
4MX16 |
4M |
-25 Cel |
16,126 |
YES |
Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) |
YES |
BOTTOM |
R-PBGA-B48 |
3 |
3.6 V |
1 mm |
6.15 mm |
Not Qualified |
BOTTOM/TOP |
67108864 bit |
2.7 V |
TOP AND BOTTOM BOOT BLOCK |
8 |
e1 |
40 |
260 |
NOR TYPE |
.000005 Amp |
8.15 mm |
YES |
70 ns |
3 |
YES |
||||||||||||||
Toshiba |
FLASH CARD |
OTHER |
153 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
34359738368 words |
8 |
85 Cel |
32GX8 |
32G |
-25 Cel |
BOTTOM |
R-PBGA-B153 |
3.6 V |
274877906944 bit |
2.7 V |
NAND TYPE |
2.7 |
||||||||||||||||||||||||||||||||||||||||||||||
Intel |
FLASH |
OTHER |
56 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
128K |
80 mA |
2097152 words |
5 |
NO |
3/3.3,5 |
16 |
SMALL OUTLINE, SHRINK PITCH |
SOP56,.6,32 |
8 |
Flash Memories |
.8 mm |
85 Cel |
3-STATE |
2MX16 |
2M |
-20 Cel |
32 |
YES |
TIN LEAD |
YES |
DUAL |
R-PDSO-G56 |
5.5 V |
1.9 mm |
13.3 mm |
Not Qualified |
33554432 bit |
4.5 V |
CONFIGURABLE AS 2M X 16; BLOCK ERASE |
16/32 |
e0 |
NOR TYPE |
.000125 Amp |
23.7 mm |
YES |
120 ns |
5 |
NO |
|||||||||||||||||
Samsung |
FLASH CARD |
OTHER |
153 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
4294967296 words |
3.3 |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.5 mm |
85 Cel |
4GX8 |
4G |
-25 Cel |
BOTTOM |
R-PBGA-B153 |
3.6 V |
1 mm |
52 MHz |
11.5 mm |
34359738368 bit |
2.7 V |
1.8V NOMINAL SUPPLY IS ALSO AVAILABLE |
13 mm |
3.3 |
||||||||||||||||||||||||||||||||||||
Samsung |
FLASH CARD |
OTHER |
169 |
TFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
34359738368 words |
3.3 |
8 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
.5 mm |
85 Cel |
32GX8 |
32G |
-25 Cel |
BOTTOM |
R-PBGA-B169 |
3.6 V |
1.2 mm |
52 MHz |
12 mm |
274877906944 bit |
2.7 V |
1.8V NOMINAL SUPPLY IS ALSO AVAILABLE |
16 mm |
3.3 |
||||||||||||||||||||||||||||||||||||
Sharp Corporation |
FLASH |
OTHER |
42 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
THROUGH-HOLE |
PARALLEL |
4K,32K |
60 mA |
1048576 words |
3.3 |
NO |
3.3 |
16 |
IN-LINE |
DIP42,.6 |
Flash Memories |
2.54 mm |
85 Cel |
1MX16 |
1M |
0 Cel |
8,31 |
YES |
DUAL |
R-PDIP-T42 |
Not Qualified |
TOP |
16777216 bit |
NOR TYPE |
.00003 Amp |
80 ns |
NO |
||||||||||||||||||||||||||||||||
|
Cypress Semiconductor |
FLASH |
OTHER |
64 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
128K |
110 mA |
536870912 words |
3.3 |
YES |
3.3 |
1 |
GRID ARRAY, LOW PROFILE |
BGA64,8X8,40 |
8 |
Flash Memories |
1 mm |
85 Cel |
512MX1 |
512M |
0 Cel |
512 |
YES |
TIN SILVER COPPER |
YES |
BOTTOM |
R-PBGA-B64 |
3 |
3.6 V |
1.4 mm |
11 mm |
Not Qualified |
536870912 bit |
3 V |
8/16 |
e1 |
30 |
260 |
NOR TYPE |
.000005 Amp |
13 mm |
YES |
100 ns |
3 |
YES |
|||||||||||||||
Toshiba |
FLASH CARD |
OTHER |
153 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
4294967296 words |
8 |
85 Cel |
4GX8 |
4G |
-25 Cel |
BOTTOM |
R-PBGA-B153 |
3.6 V |
34359738368 bit |
2.7 V |
NAND TYPE |
2.7 |
||||||||||||||||||||||||||||||||||||||||||||||
|
Microchip Technology |
FLASH |
OTHER |
40 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
4K |
24 mA |
1048576 words |
3.3 |
YES |
3.3 |
8 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP40,.8,20 |
Flash Memories |
.5 mm |
85 Cel |
1MX8 |
1M |
0 Cel |
256 |
YES |
Matte Tin (Sn) - annealed |
DUAL |
R-PDSO-G40 |
3 |
3.6 V |
1.2 mm |
10 mm |
Not Qualified |
TOP |
8388608 bit |
3 V |
e3 |
40 |
260 |
NOR TYPE |
.0001 Amp |
18.4 mm |
120 ns |
3 |
YES |
Flash memory is a type of non-volatile computer memory that is commonly used in digital devices such as USB drives, solid-state drives, and digital cameras. It is a type of EEPROM (Electrically Erasable Programmable Read-Only Memory) that allows data to be erased and reprogrammed in blocks instead of one byte at a time. Flash memory uses a floating gate transistor to store data, which allows it to retain information even when the power is turned off.
Flash memory is widely used in digital devices because of its high capacity, small size, and fast access times. It is also more durable than other types of memory, such as hard disk drives, because it has no moving parts. This makes it ideal for use in portable devices that may be subject to physical shock or vibration.
There are two types of flash memory: NOR flash and NAND flash. NOR flash is faster than NAND flash, but it has lower density and higher cost per bit. NOR flash is typically used for code storage, such as firmware or boot code, because it provides faster access times. NAND flash has higher density and lower cost per bit, which makes it ideal for data storage applications.
Flash memory has a limited lifespan, as it can only be erased and reprogrammed a limited number of times. This is because the process of erasing and reprogramming the memory causes wear and tear on the floating gate transistor. However, modern flash memory devices have a sophisticated wear-leveling algorithm that distributes writes evenly across the memory, which extends the lifespan of the device.