Micron Technology Flash Memory 2,400+

Reset All
Part RoHS Manufacturer Memory IC Type Temperature Grade No. of Terminals Package Code Package Shape Package Body Material Surface Mount No. of Functions Technology Screening Level Terminal Form Parallel or Serial Operating Mode Sector Size (Words) Maximum Supply Current No. of Words Input/Output Type Nominal Supply Voltage / Vsup (V) Mixed Memory Type Toggle Bit Power Supplies (V) Memory Width Package Style (Meter) Package Equivalence Code Alternate Memory Width Sub-Category Minimum Data Retention Time Terminal Pitch Maximum Operating Temperature Reverse Pinout Output Characteristics Organization No. of Words Code Minimum Operating Temperature No. of Sectors/Size Command User Interface Terminal Finish Ready or Busy Terminal Position No. of Ports Write Protection JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Supply Voltage (Vsup) Maximum Seated Height Endurance Maximum Clock Frequency (fCLK) Width Qualification Maximum Write Cycle Time (tWC) Serial Bus Type Boot Block Memory Density Minimum Supply Voltage (Vsup) Additional Features Page Size (words) JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Type Maximum Standby Current Length Common Flash Interface Maximum Access Time Programming Voltage (V) Data Polling

MT25QL512ABB8E12-0SIT

Micron Technology

FLASH

INDUSTRIAL

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

SERIAL

SYNCHRONOUS

536870912 words

3

1

GRID ARRAY, THIN PROFILE

1 mm

85 Cel

512MX1

512M

-40 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B24

3.6 V

1.2 mm

133 MHz

6 mm

536870912 bit

2.7 V

e1

30

260

NOR TYPE

8 mm

3

M25P128-VMF6TPB

Micron Technology

FLASH

INDUSTRIAL

16

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

20 mA

16777216 words

3

3/3.3

8

SMALL OUTLINE

SOP16,.4

Flash Memories

20

1.27 mm

85 Cel

16MX8

16M

-40 Cel

DUAL

HARDWARE/SOFTWARE

R-PDSO-G16

3.6 V

2.65 mm

10000 Write/Erase Cycles

50 MHz

7.5 mm

Not Qualified

SPI

134217728 bit

2.7 V

NOT SPECIFIED

NOT SPECIFIED

NOR TYPE

.0001 Amp

10.3 mm

2.7

PC28F128P33BF60A

Micron Technology

FLASH

INDUSTRIAL

64

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

SYNCHRONOUS

16K,64K

28 mA

8388608 words

3

NO

2.5/3.3

16

GRID ARRAY, THIN PROFILE

BGA64,8X8,40

Flash Memories

1 mm

85 Cel

8MX16

8M

-40 Cel

4,127

YES

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

R-PBGA-B64

3.6 V

1.2 mm

8 mm

Not Qualified

BOTTOM

134217728 bit

2.3 V

8

e1

30

260

NOR TYPE

.002 Amp

10 mm

YES

60 ns

3

NO

MT25QU512ABB1EW9-0SIT

Micron Technology

FLASH

INDUSTRIAL

8

SON

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

NO LEAD

SERIAL

SYNCHRONOUS

536870912 words

1.8

1

SMALL OUTLINE

85 Cel

512MX1

512M

-40 Cel

DUAL

R-PDSO-N8

2 V

166 MHz

536870912 bit

1.7 V

NOT SPECIFIED

NOT SPECIFIED

NOR TYPE

1.8

MT29F128G08AJAAAWP-ITZ:A

Micron Technology

FLASH

INDUSTRIAL

48

TSOP1

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

17179869184 words

3.3

8

SMALL OUTLINE, THIN PROFILE

.5 mm

85 Cel

16GX8

16G

-40 Cel

MATTE TIN

DUAL

R-PDSO-G48

3.6 V

1.2 mm

12 mm

137438953472 bit

2.7 V

e3

MLC NAND TYPE

18.4 mm

2.7

MT25QU512ABB8E12-0SIT/TR

Micron Technology

FLASH

INDUSTRIAL

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

SERIAL

SYNCHRONOUS

35 mA

67108864 words

1.8

8

GRID ARRAY, THIN PROFILE

BGA24,5X5,40

20

1 mm

85 Cel

3-STATE

64MX8

64M

-40 Cel

TIN SILVER COPPER

BOTTOM

HARDWARE/SOFTWARE

R-PBGA-B24

2 V

1.2 mm

100000 Write/Erase Cycles

166 MHz

6 mm

SPI

536870912 bit

1.7 V

e1

30

260

NOR TYPE

.0001 Amp

8 mm

1.8

MT25QL01GBBB8ESF-0AAT

Micron Technology

FLASH

INDUSTRIAL

16

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

GULL WING

SERIAL

SYNCHRONOUS

134217728 words

3

8

SMALL OUTLINE

1

1.27 mm

105 Cel

128MX8

128M

-40 Cel

DUAL

R-PDSO-G16

3.6 V

2.65 mm

133 MHz

7.5 mm

1073741824 bit

2.7 V

10.3 mm

3

MT25QU512ABB8E12-0SIT

Micron Technology

FLASH

INDUSTRIAL

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

SERIAL

SYNCHRONOUS

536870912 words

1.8

1

GRID ARRAY, THIN PROFILE

1 mm

85 Cel

512MX1

512M

-40 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B24

2 V

1.2 mm

166 MHz

6 mm

536870912 bit

1.7 V

e1

30

260

NOR TYPE

8 mm

1.8

N25Q128A13ESE40E

Micron Technology

FLASH

INDUSTRIAL

8

SOP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

20 mA

16777216 words

3

3/3.3

8

SMALL OUTLINE

SOP16,.41

Flash Memories

20

1.27 mm

85 Cel

TOTEM POLE

16MX8

16M

-40 Cel

DUAL

HARDWARE/SOFTWARE

S-PDSO-G8

3.6 V

2.16 mm

100000 Write/Erase Cycles

108 MHz

5.285 mm

Not Qualified

SPI

134217728 bit

2.7 V

NOT SPECIFIED

NOT SPECIFIED

NOR TYPE

.0001 Amp

5.285 mm

3

MT29F1G08ABADAWP-IT:DTR

Micron Technology

FLASH

INDUSTRIAL

48

TSOP1

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

134217728 words

3.3

8

SMALL OUTLINE, THIN PROFILE

.5 mm

85 Cel

128MX8

128M

-40 Cel

Tin (Sn)

DUAL

R-PDSO-G48

3.6 V

1.2 mm

12 mm

1073741824 bit

2.7 V

e3

30

260

SLC NAND TYPE

18.4 mm

3.3

MT25QU128ABA8ESF-0SIT

Micron Technology

FLASH

INDUSTRIAL

16

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

134217728 words

1.8

1

SMALL OUTLINE

1.27 mm

85 Cel

128MX1

128M

-40 Cel

DUAL

R-PDSO-G16

2 V

2.65 mm

166 MHz

7.5 mm

134217728 bit

1.7 V

10.3 mm

1.8

MTFC16GAPALBH-ITTR

Micron Technology

FLASH CARD

INDUSTRIAL

153

TFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

SYNCHRONOUS

17179869184 words

8

GRID ARRAY, THIN PROFILE, FINE PITCH

BGA153,14X14,20

.5 mm

85 Cel

3-STATE

16GX8

16G

-40 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B153

3.6 V

1.2 mm

200 MHz

11.5 mm

137438953472 bit

2.7 V

30

260

NAND TYPE

13 mm

2.7

N25Q128A13ESE40F

Micron Technology

FLASH

INDUSTRIAL

8

SOP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

20 mA

16777216 words

3

3/3.3

8

SMALL OUTLINE

SOP8,.3

Flash Memories

20

1.27 mm

85 Cel

16MX8

16M

-40 Cel

DUAL

HARDWARE/SOFTWARE

S-PDSO-G8

3.6 V

2.16 mm

100000 Write/Erase Cycles

108 MHz

5.285 mm

Not Qualified

SPI

134217728 bit

2.7 V

30

260

NOR TYPE

.0001 Amp

5.285 mm

3

MT25QL256ABA8E12-1SITTR

Micron Technology

FLASH

TIN SILVER COPPER

e1

30

260

3

MT25QL128ABA8E12-0SIT

Micron Technology

FLASH

INDUSTRIAL

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

SERIAL

SYNCHRONOUS

35 mA

3

1

GRID ARRAY, THIN PROFILE

BGA24,5X5,40

20

1 mm

85 Cel

16MX8

16M

-40 Cel

BOTTOM

HARDWARE/SOFTWARE

R-PBGA-B24

3.6 V

1.2 mm

100000 Write/Erase Cycles

133 MHz

6 mm

SPI

134217728 bit

2.7 V

30

260

NOR TYPE

.00005 Amp

8 mm

3

MT29F1G08ABADAWP-IT:D

Micron Technology

FLASH

INDUSTRIAL

48

TSOP1

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

128K

35 mA

134217728 words

3.3

NO

3.3

8

SMALL OUTLINE, THIN PROFILE

TSSOP48,.8,20

Flash Memories

.5 mm

85 Cel

128MX8

128M

-40 Cel

1K

YES

TIN

YES

DUAL

R-PDSO-G48

3.6 V

1.2 mm

12 mm

Not Qualified

1073741824 bit

2.7 V

2K

e3

30

260

SLC NAND TYPE

.0001 Amp

18.4 mm

25 ns

3.3

NO

M25P40-VMN6PBA

Micron Technology

FLASH

INDUSTRIAL

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

GULL WING

SERIAL

15 mA

524288 words

2.5/3.3

8

SMALL OUTLINE

SOP8,.25

Flash Memories

20

1.27 mm

85 Cel

512KX8

512K

-40 Cel

DUAL

HARDWARE/SOFTWARE

R-PDSO-G8

100000 Write/Erase Cycles

50 MHz

Not Qualified

SPI

4194304 bit

30

260

NOR TYPE

.00001 Amp

2.7

MT29F4G08ABADAWP-IT:D

Micron Technology

FLASH

INDUSTRIAL

48

TSOP1

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

128K

35 mA

536870912 words

3.3

NO

3/3.3

8

SMALL OUTLINE, THIN PROFILE

TSSOP48,.8,20

Flash Memories

.5 mm

85 Cel

512MX8

512M

-40 Cel

4K

YES

MATTE TIN

YES

DUAL

R-PDSO-G48

3.6 V

1.2 mm

12 mm

Not Qualified

4294967296 bit

2.7 V

2K

e3

30

260

SLC NAND TYPE

.0001 Amp

18.4 mm

25 ns

3.3

NO

MTFC32GAZAQHD-IT

Micron Technology

FLASH CARD

153

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

SYNCHRONOUS

34359738368 words

8

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA153,14X14,20

1

.5 mm

95 Cel

32GX8

32G

-40 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B153

3.6 V

.9 mm

11.5 mm

274877906944 bit

2.7 V

e1

30

260

NAND TYPE

13 mm

MT25QL128ABA8ESF-0AAT

Micron Technology

FLASH

AUTOMOTIVE

16

SOP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

GULL WING

SERIAL

SYNCHRONOUS

35 mA

3

8

SMALL OUTLINE

SOP8,.3

20

1.27 mm

105 Cel

16MX8

16M

-40 Cel

DUAL

HARDWARE/SOFTWARE

R-PDSO-G16

3.6 V

2.16 mm

100000 Write/Erase Cycles

133 MHz

5.29 mm

SPI

134217728 bit

2.7 V

NOR TYPE

.00008 Amp

5.29 mm

3

MT29F8G08ABACAWP-IT:CTR

Micron Technology

FLASH

INDUSTRIAL

48

TSOP1

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

128K

35 mA

1073741824 words

3.3

NO

8

SMALL OUTLINE, THIN PROFILE

TSSOP48,.8,20

10

.5 mm

85 Cel

1GX8

1G

-40 Cel

8K

YES

YES

DUAL

R-PDSO-G48

3.6 V

1.2 mm

100000 Write/Erase Cycles

12 mm

8589934592 bit

2.7 V

2K

NOT SPECIFIED

NOT SPECIFIED

SLC NAND TYPE

.0001 Amp

18.4 mm

3.3

NO

MT25QL01GBBB8E12-0SIT

Micron Technology

FLASH

INDUSTRIAL

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

SERIAL

SYNCHRONOUS

1073741824 words

3

1

GRID ARRAY, THIN PROFILE

1 mm

85 Cel

1GX1

1G

-40 Cel

BOTTOM

R-PBGA-B24

3.6 V

1.2 mm

133 MHz

6 mm

1073741824 bit

2.7 V

NOR TYPE

8 mm

3

M25P128-VME6GB

Micron Technology

FLASH

INDUSTRIAL

8

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

NO LEAD

SERIAL

SYNCHRONOUS

20 mA

16777216 words

3

3/3.3

8

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

SOLCC8,.3

Flash Memories

20

1.27 mm

85 Cel

16MX8

16M

-40 Cel

DUAL

HARDWARE/SOFTWARE

R-PDSO-N8

3.6 V

1 mm

10000 Write/Erase Cycles

50 MHz

6 mm

Not Qualified

SPI

134217728 bit

2.7 V

30

260

NOR TYPE

.0001 Amp

8 mm

2.7

MT25QU02GCBB8E12-0AAT

Micron Technology

FLASH

INDUSTRIAL

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

BALL

SERIAL

SYNCHRONOUS

268435456 words

1.8

8

GRID ARRAY, THIN PROFILE

1 mm

105 Cel

256MX8

256M

-40 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B24

3

2 V

1.2 mm

166 MHz

6 mm

2147483648 bit

1.7 V

e1

30

260

8 mm

1.8

MTFC8GAMALBH-AAT

Micron Technology

FLASH CARD

INDUSTRIAL

153

TFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

SYNCHRONOUS

8589934592 words

8

GRID ARRAY, THIN PROFILE, FINE PITCH

.5 mm

105 Cel

8GX8

8G

-40 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B153

3.6 V

1.2 mm

11.5 mm

68719476736 bit

2.7 V

e1

30

260

NAND TYPE

13 mm

2.7

MT29F16G08ABACAWP-AAT:C

Micron Technology

FLASH

48

TSOP1

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

GULL WING

PARALLEL

ASYNCHRONOUS

512K

50 mA

2147483648 words

3.3

NO

8

SMALL OUTLINE, THIN PROFILE

TSSOP48,.8,20

10

.5 mm

105 Cel

3-STATE

2GX8

2G

-40 Cel

4K

YES

YES

DUAL

R-PDSO-G48

3.6 V

1.2 mm

80000 Write/Erase Cycles

12 mm

17179869184 bit

2.7 V

4K

SLC NAND TYPE

.00005 Amp

18.4 mm

20 ns

3.3

NO

MT29F2G01ABAGDWB-IT:GTR

Micron Technology

FLASH

30

260

SLC NAND TYPE

3.3

MT25QU256ABA8E12-1SIT

Micron Technology

FLASH

INDUSTRIAL

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

SERIAL

SYNCHRONOUS

268435456 words

1.8

1

GRID ARRAY, THIN PROFILE

1 mm

85 Cel

256MX1

256M

-40 Cel

BOTTOM

R-PBGA-B24

2 V

1.2 mm

166 MHz

6 mm

268435456 bit

1.7 V

NOT SPECIFIED

NOT SPECIFIED

8 mm

1.8

MT29F1G08ABADAWP-ITX:D

Micron Technology

FLASH

INDUSTRIAL

48

TSOP1

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

128K

35 mA

134217728 words

3.3

NO

3.3

8

SMALL OUTLINE, THIN PROFILE

TSSOP48,.8,20

Flash Memories

.5 mm

85 Cel

128MX8

128M

-40 Cel

1K

YES

TIN

YES

DUAL

R-PDSO-G48

3.6 V

1.2 mm

12 mm

Not Qualified

1073741824 bit

2.7 V

2K

e3

30

260

SLC NAND TYPE

.0001 Amp

18.4 mm

25 ns

3.3

NO

NAND512W3A2SN6E

Micron Technology

FLASH

INDUSTRIAL

48

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

67108864 words

3

8

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

.5 mm

85 Cel

64MX8

64M

-40 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

DUAL

R-PDSO-G48

3

3.6 V

1.2 mm

12 mm

Not Qualified

536870912 bit

2.7 V

e4

30

260

SLC NAND TYPE

18.4 mm

3

MT29F1G08ABADAWP-ITX:DTR

Micron Technology

FLASH

INDUSTRIAL

48

TSOP1

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

134217728 words

3.3

8

SMALL OUTLINE, THIN PROFILE

.5 mm

85 Cel

128MX8

128M

-40 Cel

MATTE TIN

DUAL

R-PDSO-G48

3.6 V

1.2 mm

12 mm

1073741824 bit

2.7 V

e3

SLC NAND TYPE

18.4 mm

3.3

N25Q256A13ESF40G

Micron Technology

FLASH

INDUSTRIAL

16

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

20 mA

268435456 words

3

3/3.3

1

SMALL OUTLINE

SOP16,.4

Flash Memories

20

1.27 mm

85 Cel

256MX1

256M

-40 Cel

DUAL

HARDWARE/SOFTWARE

R-PDSO-G16

3.6 V

2.65 mm

100000 Write/Erase Cycles

108 MHz

7.5 mm

Not Qualified

8 ms

SPI

268435456 bit

2.7 V

30

260

NOR TYPE

.0001 Amp

10.3 mm

3

MT25QL02GCBB8E12-0SITTR

Micron Technology

FLASH

INDUSTRIAL

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

SERIAL

SYNCHRONOUS

94 mA

268435456 words

3

8

GRID ARRAY, THIN PROFILE

BGA24,5X5,40

20

1 mm

85 Cel

3-STATE

256MX8

256M

-40 Cel

BOTTOM

HARDWARE/SOFTWARE

R-PBGA-B24

3.6 V

1.2 mm

100000 Write/Erase Cycles

133 MHz

6 mm

SPI

BOTTOM/TOP

2147483648 bit

2.7 V

NOR TYPE

.00013 Amp

8 mm

3

MTFC8GAKAJCN-1MWT

Micron Technology

FLASH CARD

OTHER

153

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

SYNCHRONOUS

8589934592 words

3.3

NO

8

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA153,14X14,20

.5 mm

85 Cel

OPEN-DRAIN

8GX8

8G

-25 Cel

NO

BOTTOM

R-PBGA-B153

3.6 V

1 mm

11.5 mm

68719476736 bit

2.7 V

ALSO AVAILABE WITH TAPE AND REEL

NOT SPECIFIED

NOT SPECIFIED

MLC NAND TYPE

13 mm

NO

N25Q256A13EF840E

Micron Technology

FLASH

INDUSTRIAL

8

HSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

NO LEAD

SERIAL

SYNCHRONOUS

20 mA

268435456 words

1

SMALL OUTLINE, HEAT SINK/SLUG

SOLCC8,.3

20

1.27 mm

85 Cel

256MX1

256M

-40 Cel

DUAL

HARDWARE/SOFTWARE

R-PDSO-N8

3.6 V

1 mm

108 MHz

6 mm

Not Qualified

SPI

268435456 bit

2.7 V

30

260

NOR TYPE

.00025 Amp

8 mm

MTFC64GAPALBH-IT

Micron Technology

FLASH CARD

INDUSTRIAL

153

TFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

SYNCHRONOUS

68719476736 words

8

GRID ARRAY, THIN PROFILE, FINE PITCH

BGA153,14X14,20

.5 mm

85 Cel

3-STATE

64GX8

64G

-40 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B153

3.6 V

1.1 mm

200 MHz

11.5 mm

549755813888 bit

2.7 V

e1

30

260

NAND TYPE

13 mm

2.7

MT29F128G08AJAAAWP-ITZ:ATR

Micron Technology

FLASH

MATTE TIN

e3

MLC NAND TYPE

2.7

MT25QU128ABA8E12-0SIT

Micron Technology

FLASH

INDUSTRIAL

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

SERIAL

SYNCHRONOUS

134217728 words

1.8

1

GRID ARRAY, THIN PROFILE

1 mm

85 Cel

128MX1

128M

-40 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B24

2 V

1.2 mm

166 MHz

6 mm

134217728 bit

1.7 V

e1

30

260

NOR TYPE

8 mm

1.8

MT25QL01GBBB1EW9-0SIT

Micron Technology

FLASH

INDUSTRIAL

8

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

NO LEAD

SERIAL

SYNCHRONOUS

1073741824 words

3

1

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

1.27 mm

85 Cel

1GX1

1G

-40 Cel

DUAL

R-PDSO-N8

3.6 V

.8 mm

133 MHz

6 mm

1073741824 bit

2.7 V

NOT SPECIFIED

NOT SPECIFIED

8 mm

3

MT25QU128ABA1EW7-0SIT

Micron Technology

FLASH

INDUSTRIAL

8

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

NO LEAD

SERIAL

SYNCHRONOUS

134217728 words

1.8

1

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

1.27 mm

85 Cel

128MX1

128M

-40 Cel

DUAL

R-PDSO-N8

2 V

.8 mm

166 MHz

5 mm

134217728 bit

1.7 V

6 mm

1.8

MTFC16GAPALBH-AATTR

Micron Technology

FLASH CARD

153

TFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

SYNCHRONOUS

17179869184 words

8

GRID ARRAY, THIN PROFILE, FINE PITCH

BGA153,14X14,20

.5 mm

105 Cel

16GX8

16G

-40 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B153

3.6 V

1.2 mm

200 MHz

11.5 mm

137438953472 bit

2.7 V

e1

30

260

NAND TYPE

13 mm

PC28F256P30BFE

Micron Technology

FLASH

INDUSTRIAL

64

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

SYNCHRONOUS

16K,64K

31 mA

16777216 words

1.8

NO

1.8,1.8/3.3

16

GRID ARRAY, THIN PROFILE

BGA64,8X8,40

Flash Memories

1 mm

85 Cel

16MX16

16M

-40 Cel

4,255

YES

TIN SILVER COPPER

BOTTOM

R-PBGA-B64

2 V

1.2 mm

10 mm

Not Qualified

BOTTOM

268435456 bit

1.7 V

ASYNCHRONOUS READ MODE

e1

30

260

NOR TYPE

.00021 Amp

13 mm

YES

100 ns

1.8

NO

MT25QL512ABB8ESF-0AAT

Micron Technology

FLASH

INDUSTRIAL

16

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

GULL WING

SERIAL

SYNCHRONOUS

536870912 words

3

1

SMALL OUTLINE

1.27 mm

105 Cel

512MX1

512M

-40 Cel

DUAL

R-PDSO-G16

3.6 V

2.65 mm

133 MHz

7.5 mm

536870912 bit

2.7 V

30

260

NOR TYPE

10.3 mm

3

MT29F2G08ABAEAH4-IT:E

Micron Technology

FLASH

INDUSTRIAL

63

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

128K

35 mA

268435456 words

3.3

NO

3/3.3

8

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA63,10X12,32

Flash Memories

.8 mm

85 Cel

256MX8

256M

-40 Cel

2K

YES

Tin/Silver/Copper (Sn/Ag/Cu)

YES

BOTTOM

R-PBGA-B63

3.6 V

1 mm

9 mm

Not Qualified

2147483648 bit

2.7 V

2K

e1

30

260

SLC NAND TYPE

.0001 Amp

11 mm

25 ns

2.7

NO

N25Q128A13EF840E

Micron Technology

FLASH

INDUSTRIAL

8

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

NO LEAD

SERIAL

SYNCHRONOUS

20 mA

16777216 words

3

3/3.3

8

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

SOLCC8,.20

Flash Memories

20

1.27 mm

85 Cel

TOTEM POLE

16MX8

16M

-40 Cel

DUAL

HARDWARE/SOFTWARE

R-PDSO-N8

3.6 V

1 mm

100000 Write/Erase Cycles

108 MHz

6 mm

Not Qualified

SPI

134217728 bit

2.7 V

30

260

NOR TYPE

.0001 Amp

8 mm

3

MT25QU256ABA1EW9-0SIT

Micron Technology

FLASH

INDUSTRIAL

8

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

NO LEAD

SERIAL

SYNCHRONOUS

33554432 words

1.8

8

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

1.27 mm

85 Cel

32MX8

32M

-40 Cel

DUAL

R-PDSO-N8

2 V

.8 mm

166 MHz

6 mm

268435456 bit

1.7 V

30

260

NOR TYPE

8 mm

1.8

MT25QU128ABA1ESE-0SITTR

Micron Technology

FLASH

INDUSTRIAL

8

SOP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

134217728 words

1.8

1

SMALL OUTLINE

1.27 mm

85 Cel

128MX1

128M

-40 Cel

DUAL

S-PDSO-G8

2 V

2.16 mm

166 MHz

5.285 mm

134217728 bit

1.7 V

30

260

5.285 mm

1.8

MT28EW256ABA1HPC-0SIT

Micron Technology

FLASH

INDUSTRIAL

64

LBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

16777216 words

3

16

GRID ARRAY, LOW PROFILE

8

1 mm

85 Cel

16MX16

16M

-40 Cel

BOTTOM

R-PBGA-B64

3.6 V

1.4 mm

11 mm

268435456 bit

2.7 V

NOT SPECIFIED

NOT SPECIFIED

NOR TYPE

13 mm

70 ns

3

Flash Memory

Flash memory is a type of non-volatile computer memory that is commonly used in digital devices such as USB drives, solid-state drives, and digital cameras. It is a type of EEPROM (Electrically Erasable Programmable Read-Only Memory) that allows data to be erased and reprogrammed in blocks instead of one byte at a time. Flash memory uses a floating gate transistor to store data, which allows it to retain information even when the power is turned off.

Flash memory is widely used in digital devices because of its high capacity, small size, and fast access times. It is also more durable than other types of memory, such as hard disk drives, because it has no moving parts. This makes it ideal for use in portable devices that may be subject to physical shock or vibration.

There are two types of flash memory: NOR flash and NAND flash. NOR flash is faster than NAND flash, but it has lower density and higher cost per bit. NOR flash is typically used for code storage, such as firmware or boot code, because it provides faster access times. NAND flash has higher density and lower cost per bit, which makes it ideal for data storage applications.

Flash memory has a limited lifespan, as it can only be erased and reprogrammed a limited number of times. This is because the process of erasing and reprogramming the memory causes wear and tear on the floating gate transistor. However, modern flash memory devices have a sophisticated wear-leveling algorithm that distributes writes evenly across the memory, which extends the lifespan of the device.