Micron Technology Flash Memory 2,400+

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Part RoHS Manufacturer Memory IC Type Temperature Grade No. of Terminals Package Code Package Shape Package Body Material Surface Mount No. of Functions Technology Screening Level Terminal Form Parallel or Serial Operating Mode Sector Size (Words) Maximum Supply Current No. of Words Input/Output Type Nominal Supply Voltage / Vsup (V) Mixed Memory Type Toggle Bit Power Supplies (V) Memory Width Package Style (Meter) Package Equivalence Code Alternate Memory Width Sub-Category Minimum Data Retention Time Terminal Pitch Maximum Operating Temperature Reverse Pinout Output Characteristics Organization No. of Words Code Minimum Operating Temperature No. of Sectors/Size Command User Interface Terminal Finish Ready or Busy Terminal Position No. of Ports Write Protection JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Supply Voltage (Vsup) Maximum Seated Height Endurance Maximum Clock Frequency (fCLK) Width Qualification Maximum Write Cycle Time (tWC) Serial Bus Type Boot Block Memory Density Minimum Supply Voltage (Vsup) Additional Features Page Size (words) JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Type Maximum Standby Current Length Common Flash Interface Maximum Access Time Programming Voltage (V) Data Polling

MT25QU128ABA8E54-0SITTR

Micron Technology

FLASH

NOT SPECIFIED

NOT SPECIFIED

1.8

MT35XU512ABA1G12-0AAT

Micron Technology

FLASH

INDUSTRIAL

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

BALL

SERIAL

SYNCHRONOUS

536870912 words

1.8

1

GRID ARRAY, THIN PROFILE

1 mm

105 Cel

512MX1

512M

-40 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B24

2 V

1.2 mm

166 MHz

6 mm

536870912 bit

1.7 V

e1

30

260

8 mm

1.8

MTFC4GACAALT-4MIT

Micron Technology

FLASH

100

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

SYNCHRONOUS

4294967296 words

3.3

8

GRID ARRAY, THIN PROFILE

BGA100,10X17,40

1 mm

85 Cel

OPEN-DRAIN

4GX8

4G

-40 Cel

NO

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

R-PBGA-B100

3.6 V

1.2 mm

52 MHz

14 mm

34359738368 bit

2.7 V

e1

30

260

MLC NAND TYPE

18 mm

3.3

NO

MTFC64GAZAQHD-IT

Micron Technology

FLASH CARD

153

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

SYNCHRONOUS

68719476736 words

8

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA153,14X14,20

1

.5 mm

95 Cel

64GX8

64G

-40 Cel

BOTTOM

R-PBGA-B153

3.6 V

.9 mm

11.5 mm

549755813888 bit

2.7 V

NAND TYPE

13 mm

MT25QU256ABA8E12-0AUT

Micron Technology

FLASH

AUTOMOTIVE

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

BALL

SERIAL

SYNCHRONOUS

33554432 words

1.8

8

GRID ARRAY, THIN PROFILE

1

1 mm

125 Cel

32MX8

32M

-40 Cel

BOTTOM

R-PBGA-B24

2 V

1.2 mm

166 MHz

6 mm

268435456 bit

1.7 V

NOT SPECIFIED

NOT SPECIFIED

8 mm

1.8

MT29F128G08AKCABH2-10ITZ:A

Micron Technology

FLASH

INDUSTRIAL

100

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

PARALLEL

1M

50 mA

17179869184 words

NO

1.8,3/3.3

8

GRID ARRAY

BGA100,10X17,40

Flash Memories

1 mm

85 Cel

16GX8

16G

-40 Cel

16K

YES

YES

BOTTOM

R-PBGA-B100

Not Qualified

137438953472 bit

8K

SLC NAND TYPE

.00001 Amp

20 ns

NO

MT29F8G01ADBFD12-AAT:F

Micron Technology

FLASH

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

BALL

SERIAL

SYNCHRONOUS

35 mA

1073741824 words

1.8

8

GRID ARRAY, THIN PROFILE

BGA24,5X5,40

2

10

1 mm

105 Cel

3-STATE

1GX8

1G

-40 Cel

BOTTOM

HARDWARE/SOFTWARE

R-PBGA-B24

1.95 V

1.2 mm

100000 Write/Erase Cycles

83 MHz

6 mm

SPI

8589934592 bit

1.7 V

CONFIGURABLE AS 8G X 1

SLC NAND TYPE

.00005 Amp

8 mm

1.8

MTFC64GAPALNA-AAT

Micron Technology

FLASH CARD

INDUSTRIAL

100

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

SYNCHRONOUS

68719476736 words

8

GRID ARRAY, THIN PROFILE

1 mm

105 Cel

64GX8

64G

-40 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B100

3.6 V

1.2 mm

14 mm

549755813888 bit

2.7 V

e1

30

260

18 mm

2.7

M25P64-VMF6TPBA

Micron Technology

FLASH

INDUSTRIAL

16

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

SYNCHRONOUS

20 mA

8388608 words

3/3.3

8

SMALL OUTLINE

SOP16,.4

Flash Memories

20

1.27 mm

85 Cel

8MX8

8M

-40 Cel

DUAL

HARDWARE/SOFTWARE

R-PDSO-G16

3.6 V

2.65 mm

100000 Write/Erase Cycles

75 MHz

7.5 mm

Not Qualified

SPI

67108864 bit

2.7 V

30

260

NOR TYPE

.0001 Amp

10.3 mm

2.7

MT29F16G08ABCCBH1-AAT:C

Micron Technology

FLASH

100

VBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

BALL

PARALLEL

ASYNCHRONOUS/SYNCHRONOUS

512K

50 mA

2147483648 words

3.3

NO

8

GRID ARRAY, VERY THIN PROFILE

BGA100,10X17,40

10

1 mm

105 Cel

3-STATE

2GX8

2G

-40 Cel

4K

YES

YES

BOTTOM

R-PBGA-B100

3.6 V

1 mm

80000 Write/Erase Cycles

12 mm

17179869184 bit

2.7 V

4K

SLC NAND TYPE

.00005 Amp

18 mm

20 ns

3.3

NO

MT29F1G01ABBFDWB-IT:FTR

Micron Technology

FLASH

8

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

NO LEAD

SERIAL

SYNCHRONOUS

35 mA

134217728 words

1.8

8

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

SOLCC8,.3

10

1.27 mm

85 Cel

3-STATE

128MX8

128M

-40 Cel

DUAL

HARDWARE/SOFTWARE

R-XDSO-N8

1.95 V

.65 mm

100000 Write/Erase Cycles

83 MHz

6 mm

SPI

1073741824 bit

1.7 V

SLC NAND TYPE

.00005 Amp

8 mm

1.8

MTFC2GMXEA-WT

Micron Technology

Embedded MMC

153

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

SYNCHRONOUS

70 mA

2147483648 words

1.8

8

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA153,14X14,20

.5 mm

85 Cel

OPEN-DRAIN

2GX8

2G

-25 Cel

BOTTOM

HARDWARE

R-PBGA-B153

1.95 V

.8 mm

52 MHz

11.5 mm

17179869184 bit

1.65 V

NAND TYPE

13 mm

1.8

MTFC4GLGDQ-AITA

Micron Technology

FLASH CARD

INDUSTRIAL

100

LBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

SYNCHRONOUS

4294967296 words

8

GRID ARRAY, LOW PROFILE

1 mm

85 Cel

4GX8

4G

-40 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B100

3.6 V

1.4 mm

14 mm

34359738368 bit

2.7 V

e1

30

260

MLC NAND TYPE

18 mm

2.7

PC28F512P33BFD

Micron Technology

FLASH

INDUSTRIAL

64

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

SYNCHRONOUS

33554432 words

3

16

GRID ARRAY, THIN PROFILE

1 mm

85 Cel

32MX16

32M

-40 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B64

3.6 V

1.2 mm

8 mm

BOTTOM

536870912 bit

2.3 V

BOTTOM BOOT; IT ALSO OPERATES IN ASYNCHRONOUS MODE

e1

10 mm

95 ns

3

MT25QL02GCBB8E12-0AATTR

Micron Technology

FLASH

TIN SILVER COPPER

e1

30

260

3

MT25QL128ABA8E12-1SIT

Micron Technology

FLASH

INDUSTRIAL

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

SERIAL

SYNCHRONOUS

35 mA

3

8

GRID ARRAY, THIN PROFILE

BGA24,5X5,40

20

1 mm

85 Cel

16MX8

16M

-40 Cel

TIN SILVER COPPER

BOTTOM

HARDWARE/SOFTWARE

R-PBGA-B24

3.6 V

1.2 mm

100000 Write/Erase Cycles

133 MHz

6 mm

SPI

134217728 bit

2.7 V

e1

30

260

NOR TYPE

.00005 Amp

8 mm

3

MT29F1G08ABBEAH4-ITX:E

Micron Technology

FLASH

63

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

128K

20 mA

134217728 words

1.8

YES

8

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA63,10X12,32

.8 mm

85 Cel

3-STATE

128MX8

128M

-40 Cel

1K

NO

YES

BOTTOM

R-PBGA-B63

1.95 V

1 mm

100000 Write/Erase Cycles

9 mm

1073741824 bit

1.7 V

2K

SLC NAND TYPE

.00005 Amp

11 mm

1.8

YES

MTFDHBK1T0TDP-1AT12AIYY

Micron Technology

FLASH MODULE

INDUSTRIAL

RECTANGULAR

UNSPECIFIED

NO

1

CMOS

NO LEAD

ASYNCHRONOUS

1099511627776 words

8

MICROELECTRONIC ASSEMBLY

95 Cel

1TX8

1T

-40 Cel

SINGLE

R-XSMA-N

8796093022208 bit

TLC NAND TYPE

N25Q512A13GF840E

Micron Technology

FLASH

INDUSTRIAL

8

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

NO LEAD

SERIAL

SYNCHRONOUS

15 mA

536870912 words

3

1

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

SOLCC8,.3

20

1.27 mm

85 Cel

512MX1

512M

-40 Cel

DUAL

HARDWARE/SOFTWARE

R-PDSO-N8

3.6 V

1 mm

100000 Write/Erase Cycles

108 MHz

6 mm

SPI

536870912 bit

2.7 V

NOT SPECIFIED

NOT SPECIFIED

NOR TYPE

.0005 Amp

8 mm

3

MT25QU256ABA8E12-0AUTTR

Micron Technology

FLASH

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

BALL

SERIAL

SYNCHRONOUS

35 mA

33554432 words

1.8

8

GRID ARRAY, THIN PROFILE

BGA24,5X5,40

20

1 mm

125 Cel

32MX8

32M

-40 Cel

BOTTOM

HARDWARE/SOFTWARE

R-PBGA-B24

2 V

1.2 mm

100000 Write/Erase Cycles

166 MHz

6 mm

SPI

268435456 bit

1.7 V

NOT SPECIFIED

NOT SPECIFIED

NOR TYPE

.00018 Amp

8 mm

1.8

MT28EW512ABA1HPC-0AATTR

Micron Technology

FLASH

NOT SPECIFIED

NOT SPECIFIED

3

MTFC8GLDEA-1MWT

Micron Technology

FLASH CARD

OTHER

153

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

SYNCHRONOUS

8589934592 words

3.3

NO

8

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA153,14X14,20

.5 mm

85 Cel

8GX8

8G

-25 Cel

NO

TIN SILVER COPPER NICKEL

BOTTOM

R-PBGA-B153

3.6 V

.8 mm

52 MHz

11.5 mm

68719476736 bit

2.7 V

MLC NAND TYPE

13 mm

3.3

NO

M25P32-VMF6PBA

Micron Technology

FLASH

INDUSTRIAL

16

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

15 mA

4194304 words

3/3.3

8

SMALL OUTLINE

SOP16,.4

Flash Memories

20

1.27 mm

85 Cel

4MX8

4M

-40 Cel

MATTE TIN

DUAL

HARDWARE/SOFTWARE

R-PDSO-G16

1

3.6 V

2.65 mm

100000 Write/Erase Cycles

75 MHz

7.5 mm

Not Qualified

SPI

33554432 bit

2.7 V

e3

NOR TYPE

.00001 Amp

10.3 mm

2.7

MT28EW128ABA1HPC-0SIT

Micron Technology

FLASH

INDUSTRIAL

64

LBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

8388608 words

3

16

GRID ARRAY, LOW PROFILE

8

1 mm

85 Cel

8MX16

8M

-40 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B64

3.6 V

1.4 mm

11 mm

134217728 bit

2.7 V

e1

30

260

13 mm

70 ns

3

MT29F16G08ABACAWP:C

Micron Technology

FLASH

COMMERCIAL

48

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

GULL WING

PARALLEL

512K

50 mA

2147483648 words

NO

3/3.3

8

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP48,.8,20

Flash Memories

.5 mm

70 Cel

2GX8

2G

0 Cel

4K

YES

YES

DUAL

R-PDSO-G48

Not Qualified

17179869184 bit

4K

SLC NAND TYPE

.00005 Amp

20 ns

NO

MT29F32G08ABCABH1-10Z:A

Micron Technology

FLASH

COMMERCIAL

100

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

PARALLEL

1M

50 mA

4294967296 words

NO

1.8,3/3.3

8

GRID ARRAY

BGA100,10X17,40

Flash Memories

1 mm

70 Cel

4GX8

4G

0 Cel

4K

YES

YES

BOTTOM

R-PBGA-B100

Not Qualified

34359738368 bit

8K

SLC NAND TYPE

.00001 Amp

20 ns

NO

MTFC64GAPALBH-AATTR

Micron Technology

FLASH CARD

TIN SILVER COPPER

30

260

2.7

MTFDHBL128TDP-1AT12AIYY

Micron Technology

FLASH MODULE

INDUSTRIAL

RECTANGULAR

UNSPECIFIED

YES

1

CMOS

BALL

ASYNCHRONOUS

137438953472 words

8

95 Cel

128GX8

128G

-40 Cel

BOTTOM

R-XBGA-B

1099511627776 bit

TLC NAND TYPE

N25Q256A11ESF40G

Micron Technology

FLASH

INDUSTRIAL

16

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

20 mA

268435456 words

1.8

1.8

1

SMALL OUTLINE

SOP16,.4

Flash Memories

20

1.27 mm

85 Cel

256MX1

256M

-40 Cel

DUAL

HARDWARE/SOFTWARE

R-PDSO-G16

2 V

2.5 mm

100000 Write/Erase Cycles

108 MHz

7.5 mm

Not Qualified

SPI

268435456 bit

1.7 V

SPI-COMPATIBLE SERIAL BUS INTERFACE

30

260

NOR TYPE

.00002 Amp

10.3 mm

1.8

M25P10-AVMN6TPYA

Micron Technology

FLASH

INDUSTRIAL

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

131072 words

3

8

SMALL OUTLINE

1.27 mm

85 Cel

128KX8

128K

-40 Cel

DUAL

R-PDSO-G8

3.6 V

1.75 mm

50 MHz

3.9 mm

1048576 bit

2.7 V

NOT SPECIFIED

NOT SPECIFIED

NOR TYPE

4.9 mm

2.7

M25P80-VMN6PBA

Micron Technology

FLASH

INDUSTRIAL

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

GULL WING

SERIAL

SYNCHRONOUS

15 mA

8388608 words

3/3.3

1

SMALL OUTLINE

SOP8,.25

Flash Memories

20

1.27 mm

85 Cel

8MX1

8M

-40 Cel

DUAL

HARDWARE/SOFTWARE

R-PDSO-G8

3.6 V

1.75 mm

100000 Write/Erase Cycles

75 MHz

3.9 mm

Not Qualified

15 ms

SPI

8388608 bit

2.7 V

NOT SPECIFIED

NOT SPECIFIED

NOR TYPE

.00001 Amp

4.9 mm

2.7

M25P80-VMW6TGBA

Micron Technology

FLASH

INDUSTRIAL

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

GULL WING

SERIAL

SYNCHRONOUS

15 mA

1048576 words

3/3.3

8

SMALL OUTLINE

SOP8,.3

Flash Memories

20

1.27 mm

85 Cel

1MX8

1M

-40 Cel

DUAL

HARDWARE/SOFTWARE

R-PDSO-G8

3.6 V

2.5 mm

100000 Write/Erase Cycles

75 MHz

5.62 mm

Not Qualified

SPI

8388608 bit

2.7 V

LG-MAX

30

260

NOR TYPE

.00001 Amp

6.05 mm

2.7

MT25QU128ABA8ESF-0SITTR

Micron Technology

FLASH

INDUSTRIAL

16

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

35 mA

16777216 words

1.8

8

SMALL OUTLINE

SOP16,.4

20

1.27 mm

85 Cel

3-STATE

16MX8

16M

-40 Cel

DUAL

HARDWARE

R-PDSO-G16

2 V

2.65 mm

100000 Write/Erase Cycles

166 MHz

7.5 mm

SPI

134217728 bit

1.7 V

NOT SPECIFIED

NOT SPECIFIED

NOR TYPE

.00003 Amp

10.3 mm

1.8

MT25QU256ABA8E12-0AAT

Micron Technology

FLASH

INDUSTRIAL

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

BALL

SERIAL

SYNCHRONOUS

268435456 words

1.8

1

GRID ARRAY, THIN PROFILE

1 mm

105 Cel

256MX1

256M

-40 Cel

BOTTOM

R-PBGA-B24

2 V

1.2 mm

166 MHz

6 mm

268435456 bit

1.7 V

30

260

8 mm

1.8

MT28EW128ABA1LJS-0SIT

Micron Technology

FLASH

INDUSTRIAL

56

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

8388608 words

3

16

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

8

.5 mm

85 Cel

8MX16

8M

-40 Cel

MATTE TIN

DUAL

R-PDSO-G56

3.6 V

1.2 mm

14 mm

134217728 bit

2.7 V

e3

30

260

NOR TYPE

18.4 mm

70 ns

3

MT29F4G01ABBFD12-AAT:F

Micron Technology

FLASH

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

BALL

SERIAL

SYNCHRONOUS

35 mA

536870912 words

1.8

8

GRID ARRAY, THIN PROFILE

BGA24,5X5,40

2

10

1 mm

105 Cel

3-STATE

512MX8

512M

-40 Cel

BOTTOM

HARDWARE/SOFTWARE

R-PBGA-B24

1.95 V

1.2 mm

100000 Write/Erase Cycles

83 MHz

6 mm

SPI

4294967296 bit

1.7 V

CONFIGURABLE AS 4G X 1

SLC NAND TYPE

.00005 Amp

8 mm

1.8

MT29F4G08ABADAWP:D

Micron Technology

FLASH

COMMERCIAL

48

TSOP1

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

128K

35 mA

4294967296 words

3.3

NO

3/3.3

8

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP48,.8,20

Flash Memories

.5 mm

70 Cel

4GX8

4G

0 Cel

4K

YES

MATTE TIN

YES

DUAL

R-PDSO-G48

3.6 V

1.2 mm

12 mm

Not Qualified

34359738368 bit

2.7 V

2K

e3

30

260

SLC NAND TYPE

.0001 Amp

18.4 mm

25 ns

3.3

NO

MT35XU02GCBA1G12-0AAT

Micron Technology

FLASH

INDUSTRIAL

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

BALL

SERIAL

SYNCHRONOUS

2147483648 words

1.8

1

GRID ARRAY, THIN PROFILE

1 mm

105 Cel

2GX1

2G

-40 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B24

2 V

1.2 mm

166 MHz

6 mm

2147483648 bit

1.7 V

e1

30

260

8 mm

1.8

MTFC4GLMDQ-AITA

Micron Technology

FLASH CARD

INDUSTRIAL

100

LBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

SYNCHRONOUS

4294967296 words

8

GRID ARRAY, LOW PROFILE

BGA100,10X17,40

1 mm

85 Cel

4GX8

4G

-40 Cel

BOTTOM

R-PBGA-B100

3.6 V

1.703 mm

52 MHz

14 mm

34359738368 bit

2.7 V

NOT SPECIFIED

NOT SPECIFIED

MLC NAND TYPE

18 mm

N25Q128A11ESE40F

Micron Technology

FLASH

INDUSTRIAL

8

SOP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

20 mA

134217728 words

1.8

1.8

1

SMALL OUTLINE

SOP8,.3

Flash Memories

20

1.27 mm

85 Cel

128MX1

128M

-40 Cel

Matte Tin (Sn)

DUAL

HARDWARE/SOFTWARE

S-PDSO-G8

2 V

2.16 mm

100000 Write/Erase Cycles

108 MHz

5.285 mm

Not Qualified

SPI

134217728 bit

1.7 V

e3

30

260

NOR TYPE

.00001 Amp

5.285 mm

3

N25Q256A13EF840F

Micron Technology

FLASH

INDUSTRIAL

8

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

NO LEAD

SERIAL

SYNCHRONOUS

20 mA

33554432 words

3

3/3.3

8

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

SOLCC8,.3

Flash Memories

20

1.27 mm

85 Cel

32MX8

32M

-40 Cel

DUAL

HARDWARE/SOFTWARE

R-PDSO-N8

3.6 V

1 mm

100000 Write/Erase Cycles

108 MHz

6 mm

Not Qualified

SPI

268435456 bit

2.7 V

SPI-COMPATIBLE SERIAL BUS INTERFACE

30

260

NOR TYPE

.0001 Amp

8 mm

3

PF48F4400P0VBQEE

Micron Technology

FLASH

INDUSTRIAL

88

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

PARALLEL

16K,64K

31 mA

33554432 words

NO

1.8,1.8/3.3

16

GRID ARRAY, FINE PITCH

BGA88,8X12,32

Flash Memories

.8 mm

85 Cel

32MX16

32M

-40 Cel

8, 510

YES

BOTTOM

R-PBGA-B88

Not Qualified

BOTTOM/TOP

536870912 bit

NOR TYPE

.00042 Amp

YES

100 ns

NO

PF48F4400P0VBQEF

Micron Technology

FLASH

INDUSTRIAL

88

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

PARALLEL

16K,64K

31 mA

33554432 words

NO

1.8,1.8/3.3

16

GRID ARRAY, FINE PITCH

BGA88,8X12,32

Flash Memories

.8 mm

85 Cel

32MX16

32M

-40 Cel

8, 510

YES

TIN SILVER COPPER

BOTTOM

R-PBGA-B88

Not Qualified

BOTTOM/TOP

536870912 bit

e1

NOR TYPE

.00042 Amp

YES

100 ns

1.8

NO

PF48F4400P0VBQEK

Micron Technology

FLASH

INDUSTRIAL

88

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

PARALLEL

16K,64K

31 mA

33554432 words

NO

1.8,1.8/3.3

16

GRID ARRAY, FINE PITCH

BGA88,8X12,32

Flash Memories

.8 mm

85 Cel

32MX16

32M

-40 Cel

8, 510

YES

TIN SILVER COPPER

BOTTOM

R-PBGA-B88

Not Qualified

BOTTOM/TOP

536870912 bit

e1

NOR TYPE

.00042 Amp

YES

100 ns

1.8

NO

M25P16-VMC6G

Micron Technology

FLASH

INDUSTRIAL

8

VSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

NO LEAD

SERIAL

SYNCHRONOUS

15 mA

2097152 words

3

3/3.3

8

SMALL OUTLINE, VERY THIN PROFILE

SOLCC8,.12,32

Flash Memories

20

.8 mm

85 Cel

2MX8

2M

-40 Cel

DUAL

HARDWARE/SOFTWARE

R-PDSO-N8

3.6 V

.6 mm

100000 Write/Erase Cycles

75 MHz

3 mm

Not Qualified

SPI

16777216 bit

2.7 V

30

260

NOR TYPE

.00001 Amp

4 mm

3

M29F200FT5AN6E2

Micron Technology

FLASH

INDUSTRIAL

48

TSOP1

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

GULL WING

PARALLEL

ASYNCHRONOUS

16K,8K,32K,64K

30 mA

131072 words

5

YES

5

16

SMALL OUTLINE, THIN PROFILE

TSSOP48,.8,20

8

Flash Memories

.5 mm

85 Cel

128KX16

128K

-40 Cel

1,2,1,3

YES

MATTE TIN

YES

DUAL

R-PDSO-G48

5.5 V

1.2 mm

12 mm

Not Qualified

TOP

2097152 bit

4.5 V

TOP BOOT BLOCK

e3

NOR TYPE

.00012 Amp

18.4 mm

YES

55 ns

5

YES

MT25QL256ABA8E12-0AUT

Micron Technology

FLASH

AUTOMOTIVE

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

BALL

SERIAL

SYNCHRONOUS

33554432 words

3

8

GRID ARRAY, THIN PROFILE

1

1 mm

125 Cel

32MX8

32M

-40 Cel

BOTTOM

R-PBGA-B24

3.6 V

1.2 mm

133 MHz

6 mm

268435456 bit

2.7 V

NOT SPECIFIED

NOT SPECIFIED

8 mm

3

MT25QU128ABB1ESE-0AUT

Micron Technology

FLASH

AUTOMOTIVE

8

SOP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

GULL WING

SERIAL

SYNCHRONOUS

35 mA

16777216 words

1.8

8

SMALL OUTLINE

SOP8,.3

1

1.27 mm

125 Cel

16MX8

16M

-40 Cel

DUAL

HARDWARE/SOFTWARE

S-PDSO-G8

2 V

2.16 mm

166 MHz

5.285 mm

SPI

134217728 bit

1.7 V

NOT SPECIFIED

NOT SPECIFIED

NOR TYPE

.0002 Amp

5.285 mm

1.8

Flash Memory

Flash memory is a type of non-volatile computer memory that is commonly used in digital devices such as USB drives, solid-state drives, and digital cameras. It is a type of EEPROM (Electrically Erasable Programmable Read-Only Memory) that allows data to be erased and reprogrammed in blocks instead of one byte at a time. Flash memory uses a floating gate transistor to store data, which allows it to retain information even when the power is turned off.

Flash memory is widely used in digital devices because of its high capacity, small size, and fast access times. It is also more durable than other types of memory, such as hard disk drives, because it has no moving parts. This makes it ideal for use in portable devices that may be subject to physical shock or vibration.

There are two types of flash memory: NOR flash and NAND flash. NOR flash is faster than NAND flash, but it has lower density and higher cost per bit. NOR flash is typically used for code storage, such as firmware or boot code, because it provides faster access times. NAND flash has higher density and lower cost per bit, which makes it ideal for data storage applications.

Flash memory has a limited lifespan, as it can only be erased and reprogrammed a limited number of times. This is because the process of erasing and reprogramming the memory causes wear and tear on the floating gate transistor. However, modern flash memory devices have a sophisticated wear-leveling algorithm that distributes writes evenly across the memory, which extends the lifespan of the device.