Micron Technology Flash Memory 2,400+

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Part RoHS Manufacturer Memory IC Type Temperature Grade No. of Terminals Package Code Package Shape Package Body Material Surface Mount No. of Functions Technology Screening Level Terminal Form Parallel or Serial Operating Mode Sector Size (Words) Maximum Supply Current No. of Words Input/Output Type Nominal Supply Voltage / Vsup (V) Mixed Memory Type Toggle Bit Power Supplies (V) Memory Width Package Style (Meter) Package Equivalence Code Alternate Memory Width Sub-Category Minimum Data Retention Time Terminal Pitch Maximum Operating Temperature Reverse Pinout Output Characteristics Organization No. of Words Code Minimum Operating Temperature No. of Sectors/Size Command User Interface Terminal Finish Ready or Busy Terminal Position No. of Ports Write Protection JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Supply Voltage (Vsup) Maximum Seated Height Endurance Maximum Clock Frequency (fCLK) Width Qualification Maximum Write Cycle Time (tWC) Serial Bus Type Boot Block Memory Density Minimum Supply Voltage (Vsup) Additional Features Page Size (words) JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Type Maximum Standby Current Length Common Flash Interface Maximum Access Time Programming Voltage (V) Data Polling

MTFC32GAPALBH-AAT

Micron Technology

FLASH CARD

INDUSTRIAL

153

TFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

SYNCHRONOUS

34359738368 words

8

GRID ARRAY, THIN PROFILE, FINE PITCH

.5 mm

105 Cel

32GX8

32G

-40 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B153

3.6 V

1.2 mm

11.5 mm

274877906944 bit

2.7 V

e1

30

260

13 mm

2.7

MTFC64GAPALBH-AAT

Micron Technology

FLASH CARD

INDUSTRIAL

153

TFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

SYNCHRONOUS

68719476736 words

8

GRID ARRAY, THIN PROFILE, FINE PITCH

.5 mm

105 Cel

64GX8

64G

-40 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B153

3.6 V

1.2 mm

11.5 mm

549755813888 bit

2.7 V

30

260

13 mm

2.7

M25P16-VMC6TG

Micron Technology

FLASH

INDUSTRIAL

8

VSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

NO LEAD

SERIAL

SYNCHRONOUS

15 mA

2097152 words

3

3/3.3

8

SMALL OUTLINE, VERY THIN PROFILE

SOLCC8,.12,32

Flash Memories

20

.8 mm

85 Cel

2MX8

2M

-40 Cel

DUAL

HARDWARE/SOFTWARE

R-PDSO-N8

3.6 V

.6 mm

100000 Write/Erase Cycles

75 MHz

3 mm

Not Qualified

SPI

16777216 bit

2.7 V

NOT SPECIFIED

NOT SPECIFIED

NOR TYPE

.00001 Amp

4 mm

2.7

MT25QU01GBBB8E12-0AAT

Micron Technology

FLASH

INDUSTRIAL

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

BALL

SERIAL

SYNCHRONOUS

128057344 words

1.8

8

GRID ARRAY, THIN PROFILE

1

1 mm

105 Cel

128MX8

128M

-40 Cel

BOTTOM

R-PBGA-B24

2 V

1.2 mm

166 MHz

6 mm

1024458752 bit

1.7 V

30

260

8 mm

1.8

PC28F128J3F75B

Micron Technology

FLASH

INDUSTRIAL

64

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

128K

80 mA

8388608 words

3

NO

3/3.3

16

GRID ARRAY, THIN PROFILE

BGA64,8X8,40

8

Flash Memories

1 mm

85 Cel

8MX16

8M

-40 Cel

128

YES

Tin/Silver/Copper (Sn/Ag/Cu)

YES

BOTTOM

R-PBGA-B64

3.6 V

1.2 mm

10 mm

Not Qualified

134217728 bit

2.7 V

4/8

e1

30

260

NOR TYPE

.00012 Amp

13 mm

YES

75 ns

2.7

NO

M29W256GL70N6E

Micron Technology

FLASH

INDUSTRIAL

56

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

128K

15 mA

16777216 words

3

YES

3/3.3

16

SMALL OUTLINE

TSSOP56,.8,20

8

Flash Memories

.5 mm

85 Cel

16MX16

16M

-40 Cel

256

YES

MATTE TIN

YES

DUAL

R-PDSO-G56

3.6 V

1.2 mm

14 mm

Not Qualified

.00007 ms

268435456 bit

2.7 V

8/16

e3

NOR TYPE

.0001 Amp

20 mm

YES

70 ns

3

YES

MT25QU01GBBB8E12-0AATTR

Micron Technology

FLASH

30

260

1.8

N25Q128A13B1240E

Micron Technology

FLASH

INDUSTRIAL

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

SERIAL

SYNCHRONOUS

20 mA

16777216 words

3

3/3.3

8

GRID ARRAY, THIN PROFILE

BGA24,5X5,40

Flash Memories

20

1 mm

85 Cel

16MX8

16M

-40 Cel

TIN SILVER COPPER

BOTTOM

HARDWARE/SOFTWARE

R-PBGA-B24

3.6 V

1.2 mm

100000 Write/Erase Cycles

108 MHz

6 mm

Not Qualified

SPI

BOTTOM

134217728 bit

2.7 V

e1

NOR TYPE

.0001 Amp

8 mm

3

MT25QL02GCBB8E12-0AUT

Micron Technology

FLASH

AUTOMOTIVE

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

BALL

SERIAL

SYNCHRONOUS

85 mA

268435456 words

3

8

GRID ARRAY, THIN PROFILE

BGA24,5X5,40

20

1 mm

125 Cel

3-STATE

256MX8

256M

-40 Cel

BOTTOM

HARDWARE/SOFTWARE

R-PBGA-B24

3.6 V

1.2 mm

100000 Write/Erase Cycles

133 MHz

6 mm

SPI

BOTTOM/TOP

2147483648 bit

2.7 V

NOR TYPE

.0005 Amp

8 mm

3

MT29F1G01ABBFDWB-IT:F

Micron Technology

FLASH

8

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

NO LEAD

SERIAL

SYNCHRONOUS

35 mA

134217728 words

1.8

8

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

SOLCC8,.3

10

1.27 mm

85 Cel

3-STATE

128MX8

128M

-40 Cel

DUAL

HARDWARE/SOFTWARE

R-XDSO-N8

1.95 V

.65 mm

100000 Write/Erase Cycles

83 MHz

6 mm

SPI

1073741824 bit

1.7 V

SLC NAND TYPE

.00005 Amp

8 mm

1.8

MTFC32GAZAQDW-AATTR

Micron Technology

FLASH CARD

100

LBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

BALL

PARALLEL

SYNCHRONOUS

34359738368 words

3.3

8

GRID ARRAY, LOW PROFILE

BGA100,10X17,40

1 mm

105 Cel

32GX8

32G

-40 Cel

BOTTOM

R-PBGA-B100

3.6 V

1.5 mm

200 MHz

14 mm

274877906944 bit

2.7 V

NAND TYPE

18 mm

3.3

M25P20-VMN6TPB

Micron Technology

FLASH

INDUSTRIAL

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

15 mA

262144 words

2.7

3/3.3

8

SMALL OUTLINE

SOP8,.25

Flash Memories

20

1.27 mm

85 Cel

256KX8

256K

-40 Cel

DUAL

HARDWARE/SOFTWARE

R-PDSO-G8

3.6 V

1.75 mm

100000 Write/Erase Cycles

50 MHz

3.9 mm

Not Qualified

SPI

2097152 bit

2.3 V

40 MHZ CLOCK FREQUENCY AVAILABLE UPON REQUEST

30

260

NOR TYPE

.000005 Amp

4.9 mm

2.7

MT25QU01GBBB8ESF-0AAT

Micron Technology

FLASH

INDUSTRIAL

16

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

GULL WING

SERIAL

SYNCHRONOUS

128057344 words

1.8

8

SMALL OUTLINE

1

1.27 mm

105 Cel

128MX8

128M

-40 Cel

DUAL

R-PDSO-G16

2 V

2.65 mm

166 MHz

7.5 mm

1024458752 bit

1.7 V

30

260

10.3 mm

1.8

MT25QL512ABB8E12-0AUTTR

Micron Technology

FLASH

NOT SPECIFIED

NOT SPECIFIED

3

MT25QU01GBBB8E12-0AUTTR

Micron Technology

FLASH

TIN SILVER COPPER

e1

30

260

1.8

MT25QU128ABB8ESF-0AUT

Micron Technology

FLASH

AUTOMOTIVE

16

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

GULL WING

SERIAL

SYNCHRONOUS

35 mA

16777216 words

1.8

8

SMALL OUTLINE

SOP16,.4

1

1.27 mm

125 Cel

16MX8

16M

-40 Cel

DUAL

HARDWARE/SOFTWARE

R-PDSO-G16

2 V

2.65 mm

166 MHz

7.5 mm

SPI

134217728 bit

1.7 V

NOT SPECIFIED

NOT SPECIFIED

NOR TYPE

.0002 Amp

10.3 mm

1.8

N25Q256A83ESF40G

Micron Technology

FLASH

INDUSTRIAL

16

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

268435456 words

3

1

SMALL OUTLINE

1.27 mm

85 Cel

256MX1

256M

-40 Cel

DUAL

R-PDSO-G16

3.6 V

2.65 mm

108 MHz

7.5 mm

268435456 bit

2.7 V

30

260

NOR TYPE

10.3 mm

3

PC28F256P33BFE

Micron Technology

FLASH

INDUSTRIAL

64

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

SYNCHRONOUS

16K,64K

31 mA

16777216 words

3

NO

2.5/3.3

16

GRID ARRAY, THIN PROFILE

BGA64,8X8,40

Flash Memories

1 mm

85 Cel

16MX16

16M

-40 Cel

4,255

YES

TIN SILVER COPPER

BOTTOM

R-PBGA-B64

3.6 V

1.2 mm

10 mm

Not Qualified

BOTTOM

268435456 bit

2.3 V

BOTTOM BOOT BLOCK, SYNCHRONOUS BURST MODE OPERATION ALSO AVAILABLE

e1

NOR TYPE

.00021 Amp

13 mm

YES

95 ns

3

NO

MT25QL128ABA8ESF-0AATTR

Micron Technology

FLASH

NOT SPECIFIED

NOT SPECIFIED

3

MT25QL512ABB8E12-0AUT

Micron Technology

FLASH

AUTOMOTIVE

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

BALL

SERIAL

SYNCHRONOUS

67108864 words

3

8

GRID ARRAY, THIN PROFILE

1 mm

125 Cel

64MX8

64M

-40 Cel

BOTTOM

R-PBGA-B24

3.6 V

1.2 mm

133 MHz

6 mm

536870912 bit

2.7 V

NOT SPECIFIED

NOT SPECIFIED

8 mm

3

MT29F16G08ABACAWP-IT:C

Micron Technology

FLASH

INDUSTRIAL

48

TSOP1

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

512K

50 mA

2147483648 words

3.3

NO

3/3.3

8

SMALL OUTLINE, THIN PROFILE

TSSOP48,.8,20

Flash Memories

.5 mm

85 Cel

2GX8

2G

-40 Cel

4K

YES

Matte Tin (Sn)

YES

DUAL

R-PDSO-G48

3.6 V

1.2 mm

12 mm

Not Qualified

17179869184 bit

2.7 V

4K

e3

30

260

SLC NAND TYPE

.00005 Amp

18.4 mm

30 ns

2.7

NO

MT29F2G08ABAGAH4-IT:G

Micron Technology

FLASH

NOT SPECIFIED

NOT SPECIFIED

SLC NAND TYPE

3.3

MT29F2G08ABBEAH4-IT:E

Micron Technology

FLASH

INDUSTRIAL

63

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

128K

20 mA

268435456 words

1.8

NO

1.8

8

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA63,10X12,32

Flash Memories

.8 mm

85 Cel

256MX8

256M

-40 Cel

2K

YES

TIN SILVER COPPER

YES

BOTTOM

R-PBGA-B63

1.95 V

1 mm

9 mm

Not Qualified

2147483648 bit

1.7 V

2K

e1

SLC NAND TYPE

.00005 Amp

11 mm

25 ns

1.8

NO

PC28F256M29EWHD

Micron Technology

FLASH

INDUSTRIAL

64

LBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

128K

31 mA

16777216 words

3

YES

3/3.3

16

GRID ARRAY, LOW PROFILE

BGA64,8X8,40

8

Flash Memories

1 mm

85 Cel

16MX16

16M

-40 Cel

256

YES

TIN SILVER COPPER

YES

BOTTOM

R-PBGA-B64

3.6 V

1.4 mm

11 mm

Not Qualified

268435456 bit

2.7 V

16/32

e1

NOR TYPE

.00021 Amp

13 mm

YES

100 ns

3

YES

TE28F128J3D75A

Micron Technology

FLASH

INDUSTRIAL

56

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

GULL WING

PARALLEL

128K

80 mA

8388608 words

NO

3/3.3

16

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP56,.8,20

8

Flash Memories

.5 mm

85 Cel

8MX16

8M

-40 Cel

128

YES

YES

DUAL

R-PDSO-G56

Not Qualified

134217728 bit

4/8

30

235

NOR TYPE

.00012 Amp

YES

75 ns

NO

MTFC32GAZAQHD-AIT

Micron Technology

FLASH CARD

INDUSTRIAL

153

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

BALL

PARALLEL

SYNCHRONOUS

34359738368 words

1.8

8

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA153,14X14,20

.5 mm

85 Cel

32GX8

32G

-40 Cel

BOTTOM

R-PBGA-B153

1.95 V

.9 mm

200 MHz

11.5 mm

274877906944 bit

1.7 V

NAND TYPE

13 mm

1.8

N25Q032A13ESE40F

Micron Technology

FLASH

INDUSTRIAL

8

SOP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

20 mA

33554432 words

3

3/3.3

1

SMALL OUTLINE

SOP8,.3

Flash Memories

20

1.27 mm

85 Cel

32MX1

32M

-40 Cel

DUAL

HARDWARE/SOFTWARE

S-PDSO-G8

3.6 V

2.16 mm

100000 Write/Erase Cycles

108 MHz

5.285 mm

Not Qualified

SPI

33554432 bit

2.7 V

30

260

NOR TYPE

.0001 Amp

5.285 mm

2.7

N25Q512A13GSF40G

Micron Technology

FLASH

INDUSTRIAL

16

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

15 mA

536870912 words

3

1

SMALL OUTLINE

SOP16,.4

20

1.27 mm

85 Cel

512MX1

512M

-40 Cel

DUAL

HARDWARE/SOFTWARE

R-PDSO-G16

3.6 V

2.65 mm

100000 Write/Erase Cycles

108 MHz

7.5 mm

SPI

536870912 bit

2.7 V

NOT SPECIFIED

NOT SPECIFIED

NOR TYPE

.0005 Amp

10.3 mm

3

M25P16-VMF6PBA

Micron Technology

FLASH

INDUSTRIAL

16

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

15 mA

2097152 words

3

3/3.3

8

SMALL OUTLINE

SOP16,.4

Flash Memories

20

1.27 mm

85 Cel

2MX8

2M

-40 Cel

DUAL

HARDWARE/SOFTWARE

R-PDSO-G16

3.6 V

2.3 mm

100000 Write/Erase Cycles

75 MHz

7.5 mm

Not Qualified

SPI

16777216 bit

2.7 V

30

260

NOR TYPE

.00001 Amp

10.3 mm

2.7

MT29F16G08ADBCAH4:C

Micron Technology

FLASH

COMMERCIAL

63

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

PARALLEL

256K

20 mA

2147483648 words

1.8

NO

1.8

8

GRID ARRAY, FINE PITCH

BGA63,10X12,32

Flash Memories

.8 mm

70 Cel

2GX8

2G

0 Cel

8K

YES

YES

BOTTOM

R-PBGA-B63

Not Qualified

17179869184 bit

4K

SLC NAND TYPE

.00005 Amp

30 ns

1.8

NO

MTFC16GAPALNA-AAT

Micron Technology

FLASH CARD

INDUSTRIAL

100

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

SYNCHRONOUS

17179869184 words

8

GRID ARRAY, THIN PROFILE

1 mm

105 Cel

16GX8

16G

-40 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B100

3.6 V

1.2 mm

14 mm

137438953472 bit

2.7 V

e1

30

260

18 mm

2.7

MT25QU256ABA8ESF-0SITTR

Micron Technology

FLASH

16

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

35 mA

33554432 words

1.8

8

SMALL OUTLINE

SOP16,.4

20

1.27 mm

85 Cel

32MX8

32M

-40 Cel

DUAL

HARDWARE/SOFTWARE

R-PDSO-G16

2 V

2.65 mm

100000 Write/Erase Cycles

166 MHz

7.5 mm

SPI

268435456 bit

1.7 V

30

260

NOR TYPE

.000075 Amp

10.3 mm

1.8

MT29F128G08AJAAAWP-IT:A

Micron Technology

FLASH

INDUSTRIAL

48

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

GULL WING

PARALLEL

1M

50 mA

17179869184 words

NO

3/3.3

8

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP48,.8,20

Flash Memories

.5 mm

85 Cel

16GX8

16G

-40 Cel

16K

YES

YES

DUAL

R-PDSO-G48

Not Qualified

137438953472 bit

8K

SLC NAND TYPE

.00001 Amp

20 ns

NO

MT29F2G01ABAGD12-AAT:G

Micron Technology

FLASH

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

SERIAL

SYNCHRONOUS

35 mA

268435456 words

3.3

8

GRID ARRAY, THIN PROFILE

BGA24,5X5,40

10

1 mm

105 Cel

256MX8

256M

-40 Cel

BOTTOM

HARDWARE/SOFTWARE

R-PBGA-B24

3.6 V

1.2 mm

100000 Write/Erase Cycles

133 MHz

6 mm

SPI

2147483648 bit

2.7 V

SLC NAND TYPE

.00005 Amp

8 mm

3.3

MT29F4G08ABBDAHC-IT:D

Micron Technology

FLASH

INDUSTRIAL

63

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

128K

20 mA

536870912 words

1.8

NO

1.8

8

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA63,10X12,32

Flash Memories

.8 mm

85 Cel

512MX8

512M

-40 Cel

4K

YES

TIN SILVER COPPER

YES

BOTTOM

R-PBGA-B63

1.95 V

1 mm

10.5 mm

Not Qualified

4294967296 bit

1.7 V

2K

e1

30

260

SLC NAND TYPE

.00005 Amp

13 mm

25 ns

1.8

NO

MTSD032AHC6MS-1WTCS

Micron Technology

FLASH CARD

8

DIE

RECTANGULAR

UNSPECIFIED

YES

1

CMOS

NO LEAD

SERIAL

SYNCHRONOUS

34359738368 words

3.3

8

UNCASED CHIP

85 Cel

32GX8

32G

-25 Cel

UPPER

R-XUUC-N8

3.6 V

1.1 mm

208 MHz

11 mm

SPI

274877906944 bit

2.7 V

TLC NAND TYPE

15 mm

3.3

N25Q128A13ESF40F

Micron Technology

FLASH

INDUSTRIAL

16

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

20 mA

16777216 words

3

3/3.3

8

SMALL OUTLINE

SOP16,.4

Flash Memories

20

1.27 mm

85 Cel

16MX8

16M

-40 Cel

DUAL

HARDWARE/SOFTWARE

R-PDSO-G16

3.6 V

2.65 mm

100000 Write/Erase Cycles

108 MHz

7.5 mm

Not Qualified

SPI

134217728 bit

2.7 V

30

260

NOR TYPE

.0001 Amp

10.3 mm

3

M29W160ET70N3E

Micron Technology

FLASH

AUTOMOTIVE

48

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

16K,8K,32K,64K

10 mA

1048576 words

3

YES

3/3.3

16

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP48,.8,20

8

Flash Memories

.5 mm

125 Cel

1MX16

1M

-40 Cel

1,2,1,31

YES

MATTE TIN

YES

DUAL

R-PDSO-G48

3.6 V

1.2 mm

12 mm

Not Qualified

TOP

16777216 bit

2.7 V

TOP BOOT BLOCK

e3

NOR TYPE

.0001 Amp

18.4 mm

YES

70 ns

3

YES

MT25QL01GBBB8E12-0AAT

Micron Technology

FLASH

INDUSTRIAL

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

BALL

SERIAL

SYNCHRONOUS

1073741824 words

3

1

GRID ARRAY, THIN PROFILE

1 mm

105 Cel

1GX1

1G

-40 Cel

BOTTOM

R-PBGA-B24

3.6 V

1.2 mm

133 MHz

6 mm

1073741824 bit

2.7 V

NOT SPECIFIED

NOT SPECIFIED

8 mm

3

MT28EW512ABA1HJS-0SIT

Micron Technology

FLASH

INDUSTRIAL

56

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

33554432 words

3

16

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

8

.5 mm

85 Cel

32MX16

32M

-40 Cel

DUAL

R-PDSO-G56

3.6 V

1.2 mm

14 mm

536870912 bit

2.7 V

30

260

NOR TYPE

18.4 mm

95 ns

3

MT29F128G08CFAAAWPITZ:A

Micron Technology

FLASH

INDUSTRIAL

48

TSOP1

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

17179869184 words

3.3

8

SMALL OUTLINE, THIN PROFILE

.5 mm

85 Cel

16GX8

16G

-40 Cel

MATTE TIN

DUAL

R-PDSO-G48

3.6 V

1.2 mm

12 mm

137438953472 bit

2.7 V

e3

MLC NAND TYPE

18.4 mm

2.7

MT29F16G08ABACAWP-Z:C

Micron Technology

FLASH

COMMERCIAL

48

TSOP1

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

SYNCHRONOUS

512K

50 mA

2147483648 words

3.3

NO

3/3.3

8

SMALL OUTLINE, THIN PROFILE

TSSOP48,.8,20

Flash Memories

.5 mm

70 Cel

2GX8

2G

0 Cel

4K

YES

YES

DUAL

R-PDSO-G48

3.6 V

1.2 mm

12 mm

Not Qualified

17179869184 bit

2.7 V

4K

SLC NAND TYPE

.00005 Amp

18.4 mm

20 ns

2.7

NO

MT29F32G08ABCABH1-10ITZ:A

Micron Technology

FLASH

INDUSTRIAL

100

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

PARALLEL

1M

50 mA

4294967296 words

NO

1.8,3/3.3

8

GRID ARRAY

BGA100,10X17,40

Flash Memories

1 mm

85 Cel

4GX8

4G

-40 Cel

4K

YES

YES

BOTTOM

R-PBGA-B100

Not Qualified

34359738368 bit

8K

SLC NAND TYPE

.00001 Amp

20 ns

NO

MTFC4GACAANA-4MIT

Micron Technology

FLASH CARD

INDUSTRIAL

100

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

SYNCHRONOUS

4294967296 words

3.3

8

GRID ARRAY, THIN PROFILE

BGA100,10X17,40

1 mm

85 Cel

OPEN-DRAIN

4GX8

4G

-40 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B100

3.6 V

1.2 mm

52 MHz

14 mm

34359738368 bit

2.7 V

30

260

MLC NAND TYPE

18 mm

3.3

N25Q064A13ESFA0F

Micron Technology

FLASH

AUTOMOTIVE

16

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

20 mA

8388608 words

3

3/3.3

8

SMALL OUTLINE

SOP16,.4

Flash Memories

20

1.27 mm

125 Cel

8MX8

8M

-40 Cel

DUAL

HARDWARE/SOFTWARE

R-PDSO-G16

3.6 V

2.65 mm

100000 Write/Erase Cycles

108 MHz

7.5 mm

Not Qualified

SPI

67108864 bit

2.7 V

NOT SPECIFIED

NOT SPECIFIED

NOR TYPE

.0001 Amp

10.3 mm

3

JS28F320J3F75A

Micron Technology

FLASH

INDUSTRIAL

56

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

128K

80 mA

2097152 words

3

NO

3/3.3

16

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP56,.8,20

8

Flash Memories

.5 mm

85 Cel

2MX16

2M

-40 Cel

32

YES

Matte Tin (Sn)

YES

DUAL

R-PDSO-G56

3.6 V

1.2 mm

14 mm

Not Qualified

33554432 bit

2.7 V

4/8

e3

30

260

NOR TYPE

.00012 Amp

18.4 mm

YES

75 ns

2.7

NO

MT25QL128ABB1ESE-0AUT

Micron Technology

FLASH

AUTOMOTIVE

8

SOP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

GULL WING

SERIAL

SYNCHRONOUS

35 mA

16777216 words

3

8

SMALL OUTLINE

SOP8,.3

1

1.27 mm

125 Cel

16MX8

16M

-40 Cel

DUAL

HARDWARE/SOFTWARE

S-PDSO-G8

3.6 V

2.16 mm

100000 Write/Erase Cycles

133 MHz

5.285 mm

SPI

134217728 bit

2.7 V

NOT SPECIFIED

NOT SPECIFIED

NOR TYPE

.0002 Amp

5.285 mm

3

MT25QU01GBBB1EW9-0SITTR

Micron Technology

FLASH

NOT SPECIFIED

NOT SPECIFIED

1.8

Flash Memory

Flash memory is a type of non-volatile computer memory that is commonly used in digital devices such as USB drives, solid-state drives, and digital cameras. It is a type of EEPROM (Electrically Erasable Programmable Read-Only Memory) that allows data to be erased and reprogrammed in blocks instead of one byte at a time. Flash memory uses a floating gate transistor to store data, which allows it to retain information even when the power is turned off.

Flash memory is widely used in digital devices because of its high capacity, small size, and fast access times. It is also more durable than other types of memory, such as hard disk drives, because it has no moving parts. This makes it ideal for use in portable devices that may be subject to physical shock or vibration.

There are two types of flash memory: NOR flash and NAND flash. NOR flash is faster than NAND flash, but it has lower density and higher cost per bit. NOR flash is typically used for code storage, such as firmware or boot code, because it provides faster access times. NAND flash has higher density and lower cost per bit, which makes it ideal for data storage applications.

Flash memory has a limited lifespan, as it can only be erased and reprogrammed a limited number of times. This is because the process of erasing and reprogramming the memory causes wear and tear on the floating gate transistor. However, modern flash memory devices have a sophisticated wear-leveling algorithm that distributes writes evenly across the memory, which extends the lifespan of the device.