Micron Technology Flash Memory 2,400+

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Part RoHS Manufacturer Memory IC Type Temperature Grade No. of Terminals Package Code Package Shape Package Body Material Surface Mount No. of Functions Technology Screening Level Terminal Form Parallel or Serial Operating Mode Sector Size (Words) Maximum Supply Current No. of Words Input/Output Type Nominal Supply Voltage / Vsup (V) Mixed Memory Type Toggle Bit Power Supplies (V) Memory Width Package Style (Meter) Package Equivalence Code Alternate Memory Width Sub-Category Minimum Data Retention Time Terminal Pitch Maximum Operating Temperature Reverse Pinout Output Characteristics Organization No. of Words Code Minimum Operating Temperature No. of Sectors/Size Command User Interface Terminal Finish Ready or Busy Terminal Position No. of Ports Write Protection JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Supply Voltage (Vsup) Maximum Seated Height Endurance Maximum Clock Frequency (fCLK) Width Qualification Maximum Write Cycle Time (tWC) Serial Bus Type Boot Block Memory Density Minimum Supply Voltage (Vsup) Additional Features Page Size (words) JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Type Maximum Standby Current Length Common Flash Interface Maximum Access Time Programming Voltage (V) Data Polling

PC28F256P33TFE

Micron Technology

FLASH

INDUSTRIAL

64

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

SYNCHRONOUS

16K,64K

31 mA

16777216 words

3

NO

2.5/3.3

16

GRID ARRAY, THIN PROFILE

BGA64,8X8,40

Flash Memories

1 mm

85 Cel

16MX16

16M

-40 Cel

4,255

YES

TIN SILVER COPPER

BOTTOM

R-PBGA-B64

3.6 V

1.2 mm

10 mm

Not Qualified

TOP

268435456 bit

2.3 V

TOP BOOT BLOCK, SYNCHRONOUS BURST MODE OPERATION ALSO AVAILABLE

e1

NOR TYPE

.00021 Amp

13 mm

YES

95 ns

3

NO

MT25QU256ABA8E12-1SIT/TR

Micron Technology

FLASH

NOT SPECIFIED

NOT SPECIFIED

1.8

MTFC2GMDEA-0MWTATR

Micron Technology

FLASH

TIN SILVER COPPER NICKEL

30

260

3.3

MT25QU512ABB8E12-0AAT

Micron Technology

FLASH

INDUSTRIAL

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

BALL

SERIAL

SYNCHRONOUS

64094208 words

1.8

8

GRID ARRAY, THIN PROFILE

1

1 mm

105 Cel

64MX8

64M

-40 Cel

BOTTOM

R-PBGA-B24

2 V

1.2 mm

166 MHz

6 mm

512753664 bit

1.7 V

NOT SPECIFIED

NOT SPECIFIED

8 mm

1.8

MTFC32GAKAENA-4MIT

Micron Technology

FLASH CARD

INDUSTRIAL

100

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

SYNCHRONOUS

34359738368 words

8

GRID ARRAY, THIN PROFILE

1 mm

85 Cel

32GX8

32G

-40 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B100

3.6 V

1.2 mm

14 mm

274877906944 bit

2.7 V

e1

30

260

18 mm

2.7

MTFC32GAZAQHD-WT

Micron Technology

FLASH CARD

153

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

SYNCHRONOUS

34359738368 words

8

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA153,14X14,20

1

.5 mm

85 Cel

32GX8

32G

-25 Cel

BOTTOM

R-PBGA-B153

3.6 V

.9 mm

11.5 mm

274877906944 bit

2.7 V

NAND TYPE

13 mm

MT25QU01GBBB1EW9-0SIT

Micron Technology

FLASH

INDUSTRIAL

8

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

NO LEAD

SERIAL

SYNCHRONOUS

1073741824 words

1.8

1

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

1.27 mm

85 Cel

1GX1

1G

-40 Cel

DUAL

R-PDSO-N8

2 V

.8 mm

166 MHz

6 mm

1073741824 bit

1.7 V

8 mm

1.8

MT29F1G08ABADAWP:D

Micron Technology

FLASH

COMMERCIAL

48

TSOP1

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

128K

35 mA

134217728 words

3.3

NO

3.3

8

SMALL OUTLINE, THIN PROFILE

TSSOP48,.8,20

Flash Memories

.5 mm

70 Cel

128MX8

128M

0 Cel

1K

YES

Matte Tin (Sn)

YES

DUAL

R-PDSO-G48

3

3.6 V

1.2 mm

12 mm

Not Qualified

1073741824 bit

2.7 V

2K

e3

30

260

SLC NAND TYPE

.0001 Amp

18.4 mm

25 ns

3.3

NO

MT29F2G08ABAGAWP-IT:G

Micron Technology

FLASH

INDUSTRIAL

PLASTIC/EPOXY

1

CMOS

ASYNCHRONOUS

268435456 words

8

85 Cel

256MX8

256M

-40 Cel

MATTE TIN

2147483648 bit

e3

30

260

SLC NAND TYPE

MTFC2GMDEA-0MWTA

Micron Technology

FLASH

OTHER

153

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

SYNCHRONOUS

2147483648 words

3.3

8

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.5 mm

85 Cel

2GX8

2G

-25 Cel

TIN SILVER COPPER NICKEL

BOTTOM

R-PBGA-B153

3.6 V

.8 mm

52 MHz

11.5 mm

17179869184 bit

2.7 V

ALSO HAVING MMC CONTROLLER

e2

30

260

13 mm

3.3

MT25QU128ABA1EW9-0SIT

Micron Technology

FLASH

INDUSTRIAL

8

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

NO LEAD

SERIAL

SYNCHRONOUS

134217728 words

1.8

1

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

1.27 mm

85 Cel

128MX1

128M

-40 Cel

DUAL

R-PDSO-N8

2 V

.8 mm

166 MHz

6 mm

134217728 bit

1.7 V

30

260

NOR TYPE

8 mm

1.8

N25Q032A13ESC40G

Micron Technology

FLASH

INDUSTRIAL

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

20 mA

33554432 words

3

3/3.3

1

SMALL OUTLINE

SOP8,.24

Flash Memories

20

1.27 mm

85 Cel

3-STATE

32MX1

32M

-40 Cel

DUAL

HARDWARE/SOFTWARE

R-PDSO-G8

3.6 V

1.75 mm

100000 Write/Erase Cycles

108 MHz

3.9 mm

Not Qualified

SPI

33554432 bit

2.7 V

NOT SPECIFIED

NOT SPECIFIED

NOR TYPE

.0001 Amp

4.9 mm

3

N25Q064A11ESE40G

Micron Technology

FLASH

INDUSTRIAL

8

SOP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

67108864 words

1.8

1

SMALL OUTLINE

1.27 mm

85 Cel

64MX1

64M

-40 Cel

DUAL

S-PDSO-G8

2 V

2.16 mm

108 MHz

5.285 mm

67108864 bit

1.7 V

NOT SPECIFIED

NOT SPECIFIED

5.285 mm

1.8

MT25QU256ABA8ESF-0SIT

Micron Technology

FLASH

INDUSTRIAL

16

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

268435456 words

1.8

1

SMALL OUTLINE

1.27 mm

85 Cel

256MX1

256M

-40 Cel

DUAL

R-PDSO-G16

2 V

2.65 mm

166 MHz

7.5 mm

268435456 bit

1.7 V

30

260

10.3 mm

1.8

MTFC32GAZAQHD-AAT

Micron Technology

FLASH CARD

INDUSTRIAL

153

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

BALL

PARALLEL

SYNCHRONOUS

34359738368 words

1.8

8

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA153,14X14,20

.5 mm

105 Cel

32GX8

32G

-40 Cel

BOTTOM

R-PBGA-B153

1.95 V

.9 mm

200 MHz

11.5 mm

274877906944 bit

1.7 V

30

260

NAND TYPE

13 mm

1.8

JS28F128J3F75A

Micron Technology

FLASH

INDUSTRIAL

56

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

128K

80 mA

8388608 words

3

NO

3/3.3

16

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP56,.8,20

8

Flash Memories

.5 mm

85 Cel

8MX16

8M

-40 Cel

128

YES

MATTE TIN

YES

DUAL

R-PDSO-G56

3.6 V

1.2 mm

14 mm

Not Qualified

134217728 bit

2.7 V

4/8

e3

30

260

NOR TYPE

.00012 Amp

18.4 mm

YES

75 ns

2.7

NO

JS28F640J3F75A

Micron Technology

FLASH

INDUSTRIAL

56

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

128K

54 mA

4194304 words

3

NO

3/3.3

16

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP56,.8,20

8

Flash Memories

.5 mm

85 Cel

4MX16

4M

-40 Cel

64

YES

Matte Tin (Sn)

YES

DUAL

R-PDSO-G56

3.6 V

1.2 mm

14 mm

Not Qualified

67108864 bit

2.7 V

4/8

e3

30

260

NOR TYPE

.00012 Amp

18.4 mm

YES

75 ns

2.7

NO

M25P80-VMN6TPBA

Micron Technology

FLASH

INDUSTRIAL

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

GULL WING

SERIAL

SYNCHRONOUS

15 mA

8388608 words

3/3.3

1

SMALL OUTLINE

SOP8,.25

Flash Memories

20

1.27 mm

85 Cel

8MX1

8M

-40 Cel

DUAL

HARDWARE/SOFTWARE

R-PDSO-G8

3.6 V

1.75 mm

100000 Write/Erase Cycles

75 MHz

3.9 mm

Not Qualified

15 ms

SPI

8388608 bit

2.7 V

NOT SPECIFIED

NOT SPECIFIED

NOR TYPE

.00001 Amp

4.9 mm

2.7

MT29F4G08ABADAH4-IT:D

Micron Technology

FLASH

INDUSTRIAL

63

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

128K

35 mA

536870912 words

3.3

NO

3/3.3

8

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA63,10X12,32

Flash Memories

.8 mm

85 Cel

512MX8

512M

-40 Cel

4K

YES

YES

BOTTOM

R-PBGA-B63

3.6 V

1 mm

9 mm

Not Qualified

4294967296 bit

2.7 V

2K

30

260

SLC NAND TYPE

.0001 Amp

11 mm

25 ns

NO

MTFC16GAPALBH-AAT

Micron Technology

FLASH CARD

INDUSTRIAL

153

TFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

SYNCHRONOUS

17179869184 words

NO

8

GRID ARRAY, THIN PROFILE, FINE PITCH

BGA153,14X14,20

.5 mm

105 Cel

16GX8

16G

-40 Cel

NO

TIN SILVER COPPER

YES

BOTTOM

HARDWARE

R-PBGA-B153

3.6 V

1.2 mm

200 MHz

11.5 mm

137438953472 bit

2.7 V

e1

30

260

NAND TYPE

13 mm

2.7

NO

N25Q032A13ESC40F

Micron Technology

FLASH

INDUSTRIAL

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

20 mA

33554432 words

3

3/3.3

1

SMALL OUTLINE

SOP8,.25

Flash Memories

20

1.27 mm

85 Cel

32MX1

32M

-40 Cel

DUAL

HARDWARE/SOFTWARE

R-PDSO-G8

3.6 V

1.75 mm

100000 Write/Erase Cycles

108 MHz

3.9 mm

Not Qualified

SPI

33554432 bit

2.7 V

30

260

NOR TYPE

.0001 Amp

4.9 mm

3

MT29F8G08ABACAH4-IT:C

Micron Technology

FLASH

INDUSTRIAL

63

TFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

256K

35 mA

1073741824 words

3.3

NO

3/3.3

8

GRID ARRAY, THIN PROFILE, FINE PITCH

BGA63,10X12,32

Flash Memories

.8 mm

85 Cel

1GX8

1G

-40 Cel

4K

YES

YES

BOTTOM

R-PBGA-B63

3.6 V

1 mm

9 mm

Not Qualified

8589934592 bit

2.7 V

4K

SLC NAND TYPE

.0001 Amp

11 mm

NO

MTFC32GAPALNA-AIT

Micron Technology

FLASH CARD

INDUSTRIAL

100

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

SYNCHRONOUS

34359738368 words

NO

8

GRID ARRAY, THIN PROFILE

BGA100,10X15,40

1 mm

85 Cel

32GX8

32G

-40 Cel

NO

TIN SILVER COPPER

YES

BOTTOM

HARDWARE

R-PBGA-B100

3.6 V

1.2 mm

200 MHz

14 mm

274877906944 bit

2.7 V

e1

30

260

NAND TYPE

18 mm

2.7

NO

MT25QL256ABA8ESF-0AAT

Micron Technology

FLASH

INDUSTRIAL

16

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

GULL WING

SERIAL

SYNCHRONOUS

268435456 words

3

1

SMALL OUTLINE

1.27 mm

105 Cel

256MX1

256M

-40 Cel

DUAL

R-PDSO-G16

3.6 V

2.3 mm

133 MHz

7.5 mm

268435456 bit

2.7 V

NOT SPECIFIED

NOT SPECIFIED

10.3 mm

3

MT25QL128ABA8E12-0SITTR

Micron Technology

FLASH

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

SERIAL

SYNCHRONOUS

35 mA

16777216 words

3

8

GRID ARRAY, THIN PROFILE

BGA24,5X5,40

20

1 mm

85 Cel

3-STATE

16MX8

16M

-40 Cel

BOTTOM

HARDWARE

R-PBGA-B24

3.6 V

1.2 mm

100000 Write/Erase Cycles

133 MHz

6 mm

SPI

134217728 bit

2.7 V

NOR TYPE

.00005 Amp

8 mm

3

MT25QU02GCBB8E12-0AUT

Micron Technology

FLASH

AUTOMOTIVE

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

BALL

SERIAL

SYNCHRONOUS

94 mA

268435456 words

1.8

8

GRID ARRAY, THIN PROFILE

BGA24,5X5,40

1

1 mm

125 Cel

256MX8

256M

-40 Cel

TIN SILVER COPPER

BOTTOM

HARDWARE/SOFTWARE

R-PBGA-B24

2 V

1.2 mm

100000 Write/Erase Cycles

166 MHz

6 mm

SPI

2147483648 bit

1.7 V

e1

30

260

NOR TYPE

.00013 Amp

8 mm

1.8

MTFC8GAMALNA-AAT

Micron Technology

FLASH CARD

INDUSTRIAL

100

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

SYNCHRONOUS

8589934592 words

8

GRID ARRAY, THIN PROFILE

1 mm

105 Cel

8GX8

8G

-40 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B100

3.6 V

1.2 mm

14 mm

68719476736 bit

2.7 V

e1

30

260

18 mm

2.7

N25Q032A11EF640E

Micron Technology

FLASH

INDUSTRIAL

8

VSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

NO LEAD

SERIAL

SYNCHRONOUS

1048576 words

1.8

32

SMALL OUTLINE, VERY THIN PROFILE

1.27 mm

85 Cel

1MX32

1M

-40 Cel

DUAL

R-PDSO-N8

2 V

1 mm

108 MHz

5 mm

33554432 bit

1.7 V

30

260

6 mm

1.8

MT25QU02GCBB8E12-0AATTR

Micron Technology

FLASH

30

260

1.8

MT29F16G08ABABAWP-AIT:B

Micron Technology

FLASH

INDUSTRIAL

48

TSOP1

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

512K

50 mA

2147483648 words

3.3

YES

8

SMALL OUTLINE, THIN PROFILE

TSSOP48,.8,20

10

.5 mm

85 Cel

2GX8

2G

-40 Cel

4K

YES

MATTE TIN

YES

DUAL

R-PDSO-G48

3

3.6 V

1.2 mm

100000 Write/Erase Cycles

12 mm

17179869184 bit

2.7 V

4K

e3

30

260

SLC NAND TYPE

.00005 Amp

18.4 mm

3.3

NO

MT25QL02GCBB8E12-0AAT

Micron Technology

FLASH

INDUSTRIAL

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

BALL

SERIAL

SYNCHRONOUS

85 mA

268435456 words

3

8

GRID ARRAY, THIN PROFILE

BGA24,5X5,40

20

1 mm

105 Cel

3-STATE

256MX8

256M

-40 Cel

TIN SILVER COPPER

BOTTOM

HARDWARE/SOFTWARE

R-PBGA-B24

3.6 V

1.2 mm

100000 Write/Erase Cycles

133 MHz

6 mm

SPI

BOTTOM/TOP

2147483648 bit

2.7 V

e1

30

260

NOR TYPE

.00028 Amp

8 mm

3

N25Q128A13EF840F

Micron Technology

FLASH

INDUSTRIAL

8

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

NO LEAD

SERIAL

SYNCHRONOUS

20 mA

134217728 words

3

3/3.3

1

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

SOLCC8,.3

Flash Memories

20

1.27 mm

85 Cel

128MX1

128M

-40 Cel

DUAL

HARDWARE/SOFTWARE

R-PDSO-N8

3.6 V

1 mm

100000 Write/Erase Cycles

108 MHz

6 mm

Not Qualified

SPI

134217728 bit

2.7 V

30

260

NOR TYPE

.0001 Amp

8 mm

3

MT25QL256ABA8E12-0AAT

Micron Technology

FLASH

INDUSTRIAL

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

BALL

SERIAL

SYNCHRONOUS

33554432 words

3

8

GRID ARRAY, THIN PROFILE

1 mm

105 Cel

32MX8

32M

-40 Cel

BOTTOM

R-PBGA-B24

3.6 V

1.2 mm

133 MHz

6 mm

268435456 bit

2.7 V

NOT SPECIFIED

NOT SPECIFIED

8 mm

3

M25P80-VMP6G

Micron Technology

FLASH

INDUSTRIAL

8

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

NO LEAD

SERIAL

SYNCHRONOUS

15 mA

8388608 words

3

3/3.3

1

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

SOLCC8,.25

Flash Memories

20

1.27 mm

85 Cel

8MX1

8M

-40 Cel

DUAL

HARDWARE/SOFTWARE

R-PDSO-N8

3.6 V

1 mm

100000 Write/Erase Cycles

75 MHz

5 mm

Not Qualified

15 ms

SPI

8388608 bit

2.7 V

40 MHZ CLOCK FREQUENCY AVAILABLE UPON REQUEST

30

260

NOR TYPE

.0001 Amp

6 mm

2.7

MT29F2G08ABAEAWP:E

Micron Technology

FLASH

COMMERCIAL

48

TSOP1

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

128K

35 mA

268435456 words

3.3

NO

3/3.3

8

SMALL OUTLINE, THIN PROFILE

TSSOP48,.8,20

Flash Memories

.5 mm

70 Cel

256MX8

256M

0 Cel

2K

YES

MATTE TIN

YES

DUAL

R-PDSO-G48

3.6 V

1.2 mm

12 mm

Not Qualified

2147483648 bit

2.7 V

2K

e3

30

260

SLC NAND TYPE

.0001 Amp

18.4 mm

25 ns

3.3

NO

MTFC32GAPALBH-IT

Micron Technology

FLASH CARD

INDUSTRIAL

153

TFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

SYNCHRONOUS

34359738368 words

8

GRID ARRAY, THIN PROFILE, FINE PITCH

BGA153,14X14,20

.5 mm

85 Cel

3-STATE

32GX8

32G

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

R-PBGA-B153

3.6 V

1.1 mm

200 MHz

11.5 mm

274877906944 bit

2.7 V

e1

30

260

NAND TYPE

13 mm

2.7

MTFC8GAMALBH-AITTR

Micron Technology

FLASH CARD

153

TFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q104

BALL

PARALLEL

SYNCHRONOUS

8589934592 words

NO

8

GRID ARRAY, THIN PROFILE, FINE PITCH

BGA153,14X14,20

4

5

.5 mm

85 Cel

OPEN-DRAIN

8GX8

8G

-40 Cel

NO

TIN SILVER COPPER

YES

BOTTOM

R-PBGA-B153

3.6 V

1.2 mm

200 MHz

11.5 mm

68719476736 bit

2.7 V

e1

30

260

NAND TYPE

13 mm

2.7

NO

MT25QU128ABB8E12-0AUT

Micron Technology

FLASH

AUTOMOTIVE

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

BALL

SERIAL

SYNCHRONOUS

16777216 words

1.8

8

GRID ARRAY, THIN PROFILE

1

1 mm

125 Cel

16MX8

16M

-40 Cel

BOTTOM

R-PBGA-B24

2 V

1.2 mm

166 MHz

6 mm

134217728 bit

1.7 V

NOT SPECIFIED

NOT SPECIFIED

8 mm

1.8

MT29F4G08ABADAWP-IT:DTR

Micron Technology

FLASH

INDUSTRIAL

48

TSOP1

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

536870912 words

3.3

8

SMALL OUTLINE, THIN PROFILE

.5 mm

85 Cel

512MX8

512M

-40 Cel

MATTE TIN

DUAL

R-PDSO-G48

3.6 V

1.2 mm

12 mm

4294967296 bit

2.7 V

e3

30

260

SLC NAND TYPE

18.4 mm

3.3

MTFC8GAKAJCN-1MWTTR

Micron Technology

FLASH CARD

COMMERCIAL EXTENDED

153

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

SYNCHRONOUS

8589934592 words

8

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA153,14X14,20

.5 mm

85 Cel

OPEN-DRAIN

8GX8

8G

-25 Cel

BOTTOM

R-PBGA-B153

3.6 V

1 mm

52 MHz

11.5 mm

68719476736 bit

2.7 V

30

260

MLC NAND TYPE

13 mm

MT29F2G08ABAEAH4-IT:ETR

Micron Technology

FLASH

INDUSTRIAL

63

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

268435456 words

3.3

8

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.8 mm

85 Cel

256MX8

256M

-40 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B63

3.6 V

1 mm

9 mm

2147483648 bit

2.7 V

e1

30

260

SLC NAND TYPE

11 mm

2.7

MT25QU512ABB8ESF-0AAT

Micron Technology

FLASH

INDUSTRIAL

16

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

GULL WING

SERIAL

SYNCHRONOUS

536870912 words

1.8

1

SMALL OUTLINE

1.27 mm

105 Cel

512MX1

512M

-40 Cel

DUAL

R-PDSO-G16

2 V

2.65 mm

166 MHz

7.5 mm

536870912 bit

1.7 V

NOT SPECIFIED

NOT SPECIFIED

NOR TYPE

10.3 mm

1.8

MT29F8G08ABBCAH4-IT:C

Micron Technology

FLASH

INDUSTRIAL

63

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

PARALLEL

256K

20 mA

1073741824 words

1.8

NO

1.8

8

GRID ARRAY, FINE PITCH

BGA63,10X12,32

Flash Memories

.8 mm

85 Cel

1GX8

1G

-40 Cel

4K

YES

YES

BOTTOM

R-PBGA-B63

Not Qualified

8589934592 bit

4K

SLC NAND TYPE

.00005 Amp

30 ns

1.8

NO

MTFC32GAPALNA-AAT

Micron Technology

FLASH CARD

INDUSTRIAL

100

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

SYNCHRONOUS

34359738368 words

NO

8

GRID ARRAY, THIN PROFILE

BGA100,10X15,40

1 mm

105 Cel

32GX8

32G

-40 Cel

NO

TIN SILVER COPPER

YES

BOTTOM

HARDWARE

R-PBGA-B100

3.6 V

1.2 mm

200 MHz

14 mm

274877906944 bit

2.7 V

e1

30

260

NAND TYPE

18 mm

2.7

NO

MTFC32GJDDQ-4MIT

Micron Technology

FLASH CARD

INDUSTRIAL

100

LBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

GRID ARRAY, LOW PROFILE

1 mm

TIN SILVER COPPER

BOTTOM

R-PBGA-B100

1.4 mm

14 mm

e1

MLC NAND TYPE

18 mm

3.3

M25P80-VMN3TPB

Micron Technology

FLASH

INDUSTRIAL

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

GULL WING

SERIAL

SYNCHRONOUS

15 mA

8388608 words

3/3.3

1

SMALL OUTLINE

SOP8,.25

Flash Memories

20

1.27 mm

85 Cel

8MX1

8M

-40 Cel

DUAL

HARDWARE/SOFTWARE

R-PDSO-G8

3.6 V

1.75 mm

100000 Write/Erase Cycles

75 MHz

3.9 mm

Not Qualified

15 ms

SPI

8388608 bit

2.7 V

30

260

NOR TYPE

.0001 Amp

4.9 mm

2.7

MT25QL512ABB8E12-0AAT

Micron Technology

FLASH

INDUSTRIAL

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

BALL

SERIAL

SYNCHRONOUS

67108864 words

3

8

GRID ARRAY, THIN PROFILE

1 mm

105 Cel

64MX8

64M

-40 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B24

3.6 V

1.2 mm

133 MHz

6 mm

536870912 bit

2.7 V

e1

NOR TYPE

8 mm

3

MTFC8GAMALBH-AIT

Micron Technology

FLASH CARD

INDUSTRIAL

153

TFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

SYNCHRONOUS

8589934592 words

8

GRID ARRAY, THIN PROFILE, FINE PITCH

.5 mm

85 Cel

8GX8

8G

-40 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B153

3.6 V

1.2 mm

11.5 mm

68719476736 bit

2.7 V

e1

30

260

NAND TYPE

13 mm

2.7

Flash Memory

Flash memory is a type of non-volatile computer memory that is commonly used in digital devices such as USB drives, solid-state drives, and digital cameras. It is a type of EEPROM (Electrically Erasable Programmable Read-Only Memory) that allows data to be erased and reprogrammed in blocks instead of one byte at a time. Flash memory uses a floating gate transistor to store data, which allows it to retain information even when the power is turned off.

Flash memory is widely used in digital devices because of its high capacity, small size, and fast access times. It is also more durable than other types of memory, such as hard disk drives, because it has no moving parts. This makes it ideal for use in portable devices that may be subject to physical shock or vibration.

There are two types of flash memory: NOR flash and NAND flash. NOR flash is faster than NAND flash, but it has lower density and higher cost per bit. NOR flash is typically used for code storage, such as firmware or boot code, because it provides faster access times. NAND flash has higher density and lower cost per bit, which makes it ideal for data storage applications.

Flash memory has a limited lifespan, as it can only be erased and reprogrammed a limited number of times. This is because the process of erasing and reprogramming the memory causes wear and tear on the floating gate transistor. However, modern flash memory devices have a sophisticated wear-leveling algorithm that distributes writes evenly across the memory, which extends the lifespan of the device.