Part | RoHS | Manufacturer | Memory IC Type | Temperature Grade | No. of Terminals | Package Code | Package Shape | Package Body Material | Surface Mount | No. of Functions | Technology | Screening Level | Terminal Form | Parallel or Serial | Operating Mode | Sector Size (Words) | Maximum Supply Current | No. of Words | Input/Output Type | Nominal Supply Voltage / Vsup (V) | Mixed Memory Type | Toggle Bit | Power Supplies (V) | Memory Width | Package Style (Meter) | Package Equivalence Code | Alternate Memory Width | Sub-Category | Minimum Data Retention Time | Terminal Pitch | Maximum Operating Temperature | Reverse Pinout | Output Characteristics | Organization | No. of Words Code | Minimum Operating Temperature | No. of Sectors/Size | Command User Interface | Terminal Finish | Ready or Busy | Terminal Position | No. of Ports | Write Protection | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Endurance | Maximum Clock Frequency (fCLK) | Width | Qualification | Maximum Write Cycle Time (tWC) | Serial Bus Type | Boot Block | Memory Density | Minimum Supply Voltage (Vsup) | Additional Features | Page Size (words) | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Type | Maximum Standby Current | Length | Common Flash Interface | Maximum Access Time | Programming Voltage (V) | Data Polling |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Micron Technology |
FLASH |
INDUSTRIAL |
64 |
TBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
16K,64K |
31 mA |
16777216 words |
3 |
NO |
2.5/3.3 |
16 |
GRID ARRAY, THIN PROFILE |
BGA64,8X8,40 |
Flash Memories |
1 mm |
85 Cel |
16MX16 |
16M |
-40 Cel |
4,255 |
YES |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B64 |
3.6 V |
1.2 mm |
10 mm |
Not Qualified |
TOP |
268435456 bit |
2.3 V |
TOP BOOT BLOCK, SYNCHRONOUS BURST MODE OPERATION ALSO AVAILABLE |
e1 |
NOR TYPE |
.00021 Amp |
13 mm |
YES |
95 ns |
3 |
NO |
|||||||||||||||||||
|
Micron Technology |
FLASH |
NOT SPECIFIED |
NOT SPECIFIED |
1.8 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Micron Technology |
FLASH |
TIN SILVER COPPER NICKEL |
30 |
260 |
3.3 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Micron Technology |
FLASH |
INDUSTRIAL |
24 |
TBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
BALL |
SERIAL |
SYNCHRONOUS |
64094208 words |
1.8 |
8 |
GRID ARRAY, THIN PROFILE |
1 |
1 mm |
105 Cel |
64MX8 |
64M |
-40 Cel |
BOTTOM |
R-PBGA-B24 |
2 V |
1.2 mm |
166 MHz |
6 mm |
512753664 bit |
1.7 V |
NOT SPECIFIED |
NOT SPECIFIED |
8 mm |
1.8 |
||||||||||||||||||||||||||||||||
|
Micron Technology |
FLASH CARD |
INDUSTRIAL |
100 |
TBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
34359738368 words |
8 |
GRID ARRAY, THIN PROFILE |
1 mm |
85 Cel |
32GX8 |
32G |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B100 |
3.6 V |
1.2 mm |
14 mm |
274877906944 bit |
2.7 V |
e1 |
30 |
260 |
18 mm |
2.7 |
||||||||||||||||||||||||||||||||||
|
Micron Technology |
FLASH CARD |
153 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
34359738368 words |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA153,14X14,20 |
1 |
.5 mm |
85 Cel |
32GX8 |
32G |
-25 Cel |
BOTTOM |
R-PBGA-B153 |
3.6 V |
.9 mm |
11.5 mm |
274877906944 bit |
2.7 V |
NAND TYPE |
13 mm |
|||||||||||||||||||||||||||||||||||||
|
Micron Technology |
FLASH |
INDUSTRIAL |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
1073741824 words |
1.8 |
1 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
1.27 mm |
85 Cel |
1GX1 |
1G |
-40 Cel |
DUAL |
R-PDSO-N8 |
2 V |
.8 mm |
166 MHz |
6 mm |
1073741824 bit |
1.7 V |
8 mm |
1.8 |
||||||||||||||||||||||||||||||||||||
|
Micron Technology |
FLASH |
COMMERCIAL |
48 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
128K |
35 mA |
134217728 words |
3.3 |
NO |
3.3 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSSOP48,.8,20 |
Flash Memories |
.5 mm |
70 Cel |
128MX8 |
128M |
0 Cel |
1K |
YES |
Matte Tin (Sn) |
YES |
DUAL |
R-PDSO-G48 |
3 |
3.6 V |
1.2 mm |
12 mm |
Not Qualified |
1073741824 bit |
2.7 V |
2K |
e3 |
30 |
260 |
SLC NAND TYPE |
.0001 Amp |
18.4 mm |
25 ns |
3.3 |
NO |
|||||||||||||||||
|
Micron Technology |
FLASH |
INDUSTRIAL |
PLASTIC/EPOXY |
1 |
CMOS |
ASYNCHRONOUS |
268435456 words |
8 |
85 Cel |
256MX8 |
256M |
-40 Cel |
MATTE TIN |
2147483648 bit |
e3 |
30 |
260 |
SLC NAND TYPE |
|||||||||||||||||||||||||||||||||||||||||||||||||
|
Micron Technology |
FLASH |
OTHER |
153 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
2147483648 words |
3.3 |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.5 mm |
85 Cel |
2GX8 |
2G |
-25 Cel |
TIN SILVER COPPER NICKEL |
BOTTOM |
R-PBGA-B153 |
3.6 V |
.8 mm |
52 MHz |
11.5 mm |
17179869184 bit |
2.7 V |
ALSO HAVING MMC CONTROLLER |
e2 |
30 |
260 |
13 mm |
3.3 |
|||||||||||||||||||||||||||||||
|
Micron Technology |
FLASH |
INDUSTRIAL |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
134217728 words |
1.8 |
1 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
1.27 mm |
85 Cel |
128MX1 |
128M |
-40 Cel |
DUAL |
R-PDSO-N8 |
2 V |
.8 mm |
166 MHz |
6 mm |
134217728 bit |
1.7 V |
30 |
260 |
NOR TYPE |
8 mm |
1.8 |
|||||||||||||||||||||||||||||||||
|
Micron Technology |
FLASH |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
20 mA |
33554432 words |
3 |
3/3.3 |
1 |
SMALL OUTLINE |
SOP8,.24 |
Flash Memories |
20 |
1.27 mm |
85 Cel |
3-STATE |
32MX1 |
32M |
-40 Cel |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G8 |
3.6 V |
1.75 mm |
100000 Write/Erase Cycles |
108 MHz |
3.9 mm |
Not Qualified |
SPI |
33554432 bit |
2.7 V |
NOT SPECIFIED |
NOT SPECIFIED |
NOR TYPE |
.0001 Amp |
4.9 mm |
3 |
||||||||||||||||||||||
|
Micron Technology |
FLASH |
INDUSTRIAL |
8 |
SOP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
67108864 words |
1.8 |
1 |
SMALL OUTLINE |
1.27 mm |
85 Cel |
64MX1 |
64M |
-40 Cel |
DUAL |
S-PDSO-G8 |
2 V |
2.16 mm |
108 MHz |
5.285 mm |
67108864 bit |
1.7 V |
NOT SPECIFIED |
NOT SPECIFIED |
5.285 mm |
1.8 |
||||||||||||||||||||||||||||||||||
|
Micron Technology |
FLASH |
INDUSTRIAL |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
268435456 words |
1.8 |
1 |
SMALL OUTLINE |
1.27 mm |
85 Cel |
256MX1 |
256M |
-40 Cel |
DUAL |
R-PDSO-G16 |
2 V |
2.65 mm |
166 MHz |
7.5 mm |
268435456 bit |
1.7 V |
30 |
260 |
10.3 mm |
1.8 |
||||||||||||||||||||||||||||||||||
|
Micron Technology |
FLASH CARD |
INDUSTRIAL |
153 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
BALL |
PARALLEL |
SYNCHRONOUS |
34359738368 words |
1.8 |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA153,14X14,20 |
.5 mm |
105 Cel |
32GX8 |
32G |
-40 Cel |
BOTTOM |
R-PBGA-B153 |
1.95 V |
.9 mm |
200 MHz |
11.5 mm |
274877906944 bit |
1.7 V |
30 |
260 |
NAND TYPE |
13 mm |
1.8 |
|||||||||||||||||||||||||||||||
|
Micron Technology |
FLASH |
INDUSTRIAL |
56 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
128K |
80 mA |
8388608 words |
3 |
NO |
3/3.3 |
16 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP56,.8,20 |
8 |
Flash Memories |
.5 mm |
85 Cel |
8MX16 |
8M |
-40 Cel |
128 |
YES |
MATTE TIN |
YES |
DUAL |
R-PDSO-G56 |
3.6 V |
1.2 mm |
14 mm |
Not Qualified |
134217728 bit |
2.7 V |
4/8 |
e3 |
30 |
260 |
NOR TYPE |
.00012 Amp |
18.4 mm |
YES |
75 ns |
2.7 |
NO |
||||||||||||||||
|
Micron Technology |
FLASH |
INDUSTRIAL |
56 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
128K |
54 mA |
4194304 words |
3 |
NO |
3/3.3 |
16 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP56,.8,20 |
8 |
Flash Memories |
.5 mm |
85 Cel |
4MX16 |
4M |
-40 Cel |
64 |
YES |
Matte Tin (Sn) |
YES |
DUAL |
R-PDSO-G56 |
3.6 V |
1.2 mm |
14 mm |
Not Qualified |
67108864 bit |
2.7 V |
4/8 |
e3 |
30 |
260 |
NOR TYPE |
.00012 Amp |
18.4 mm |
YES |
75 ns |
2.7 |
NO |
||||||||||||||||
|
Micron Technology |
FLASH |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
GULL WING |
SERIAL |
SYNCHRONOUS |
15 mA |
8388608 words |
3/3.3 |
1 |
SMALL OUTLINE |
SOP8,.25 |
Flash Memories |
20 |
1.27 mm |
85 Cel |
8MX1 |
8M |
-40 Cel |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G8 |
3.6 V |
1.75 mm |
100000 Write/Erase Cycles |
75 MHz |
3.9 mm |
Not Qualified |
15 ms |
SPI |
8388608 bit |
2.7 V |
NOT SPECIFIED |
NOT SPECIFIED |
NOR TYPE |
.00001 Amp |
4.9 mm |
2.7 |
||||||||||||||||||||||
|
Micron Technology |
FLASH |
INDUSTRIAL |
63 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
128K |
35 mA |
536870912 words |
3.3 |
NO |
3/3.3 |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA63,10X12,32 |
Flash Memories |
.8 mm |
85 Cel |
512MX8 |
512M |
-40 Cel |
4K |
YES |
YES |
BOTTOM |
R-PBGA-B63 |
3.6 V |
1 mm |
9 mm |
Not Qualified |
4294967296 bit |
2.7 V |
2K |
30 |
260 |
SLC NAND TYPE |
.0001 Amp |
11 mm |
25 ns |
NO |
|||||||||||||||||||||
|
Micron Technology |
FLASH CARD |
INDUSTRIAL |
153 |
TFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
17179869184 words |
NO |
8 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
BGA153,14X14,20 |
.5 mm |
105 Cel |
16GX8 |
16G |
-40 Cel |
NO |
TIN SILVER COPPER |
YES |
BOTTOM |
HARDWARE |
R-PBGA-B153 |
3.6 V |
1.2 mm |
200 MHz |
11.5 mm |
137438953472 bit |
2.7 V |
e1 |
30 |
260 |
NAND TYPE |
13 mm |
2.7 |
NO |
||||||||||||||||||||||||||
|
Micron Technology |
FLASH |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
20 mA |
33554432 words |
3 |
3/3.3 |
1 |
SMALL OUTLINE |
SOP8,.25 |
Flash Memories |
20 |
1.27 mm |
85 Cel |
32MX1 |
32M |
-40 Cel |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G8 |
3.6 V |
1.75 mm |
100000 Write/Erase Cycles |
108 MHz |
3.9 mm |
Not Qualified |
SPI |
33554432 bit |
2.7 V |
30 |
260 |
NOR TYPE |
.0001 Amp |
4.9 mm |
3 |
|||||||||||||||||||||||
|
Micron Technology |
FLASH |
INDUSTRIAL |
63 |
TFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
256K |
35 mA |
1073741824 words |
3.3 |
NO |
3/3.3 |
8 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
BGA63,10X12,32 |
Flash Memories |
.8 mm |
85 Cel |
1GX8 |
1G |
-40 Cel |
4K |
YES |
YES |
BOTTOM |
R-PBGA-B63 |
3.6 V |
1 mm |
9 mm |
Not Qualified |
8589934592 bit |
2.7 V |
4K |
SLC NAND TYPE |
.0001 Amp |
11 mm |
NO |
||||||||||||||||||||||||
|
Micron Technology |
FLASH CARD |
INDUSTRIAL |
100 |
TBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
34359738368 words |
NO |
8 |
GRID ARRAY, THIN PROFILE |
BGA100,10X15,40 |
1 mm |
85 Cel |
32GX8 |
32G |
-40 Cel |
NO |
TIN SILVER COPPER |
YES |
BOTTOM |
HARDWARE |
R-PBGA-B100 |
3.6 V |
1.2 mm |
200 MHz |
14 mm |
274877906944 bit |
2.7 V |
e1 |
30 |
260 |
NAND TYPE |
18 mm |
2.7 |
NO |
||||||||||||||||||||||||||
|
Micron Technology |
FLASH |
INDUSTRIAL |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
GULL WING |
SERIAL |
SYNCHRONOUS |
268435456 words |
3 |
1 |
SMALL OUTLINE |
1.27 mm |
105 Cel |
256MX1 |
256M |
-40 Cel |
DUAL |
R-PDSO-G16 |
3.6 V |
2.3 mm |
133 MHz |
7.5 mm |
268435456 bit |
2.7 V |
NOT SPECIFIED |
NOT SPECIFIED |
10.3 mm |
3 |
|||||||||||||||||||||||||||||||||
|
Micron Technology |
FLASH |
24 |
TBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SERIAL |
SYNCHRONOUS |
35 mA |
16777216 words |
3 |
8 |
GRID ARRAY, THIN PROFILE |
BGA24,5X5,40 |
20 |
1 mm |
85 Cel |
3-STATE |
16MX8 |
16M |
-40 Cel |
BOTTOM |
HARDWARE |
R-PBGA-B24 |
3.6 V |
1.2 mm |
100000 Write/Erase Cycles |
133 MHz |
6 mm |
SPI |
134217728 bit |
2.7 V |
NOR TYPE |
.00005 Amp |
8 mm |
3 |
||||||||||||||||||||||||||||
|
Micron Technology |
FLASH |
AUTOMOTIVE |
24 |
TBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
BALL |
SERIAL |
SYNCHRONOUS |
94 mA |
268435456 words |
1.8 |
8 |
GRID ARRAY, THIN PROFILE |
BGA24,5X5,40 |
1 |
1 mm |
125 Cel |
256MX8 |
256M |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
HARDWARE/SOFTWARE |
R-PBGA-B24 |
2 V |
1.2 mm |
100000 Write/Erase Cycles |
166 MHz |
6 mm |
SPI |
2147483648 bit |
1.7 V |
e1 |
30 |
260 |
NOR TYPE |
.00013 Amp |
8 mm |
1.8 |
|||||||||||||||||||||||
|
Micron Technology |
FLASH CARD |
INDUSTRIAL |
100 |
TBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
8589934592 words |
8 |
GRID ARRAY, THIN PROFILE |
1 mm |
105 Cel |
8GX8 |
8G |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B100 |
3.6 V |
1.2 mm |
14 mm |
68719476736 bit |
2.7 V |
e1 |
30 |
260 |
18 mm |
2.7 |
||||||||||||||||||||||||||||||||||
|
Micron Technology |
FLASH |
INDUSTRIAL |
8 |
VSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
1048576 words |
1.8 |
32 |
SMALL OUTLINE, VERY THIN PROFILE |
1.27 mm |
85 Cel |
1MX32 |
1M |
-40 Cel |
DUAL |
R-PDSO-N8 |
2 V |
1 mm |
108 MHz |
5 mm |
33554432 bit |
1.7 V |
30 |
260 |
6 mm |
1.8 |
||||||||||||||||||||||||||||||||||
|
Micron Technology |
FLASH |
30 |
260 |
1.8 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Micron Technology |
FLASH |
INDUSTRIAL |
48 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
512K |
50 mA |
2147483648 words |
3.3 |
YES |
8 |
SMALL OUTLINE, THIN PROFILE |
TSSOP48,.8,20 |
10 |
.5 mm |
85 Cel |
2GX8 |
2G |
-40 Cel |
4K |
YES |
MATTE TIN |
YES |
DUAL |
R-PDSO-G48 |
3 |
3.6 V |
1.2 mm |
100000 Write/Erase Cycles |
12 mm |
17179869184 bit |
2.7 V |
4K |
e3 |
30 |
260 |
SLC NAND TYPE |
.00005 Amp |
18.4 mm |
3.3 |
NO |
|||||||||||||||||||
|
Micron Technology |
FLASH |
INDUSTRIAL |
24 |
TBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
BALL |
SERIAL |
SYNCHRONOUS |
85 mA |
268435456 words |
3 |
8 |
GRID ARRAY, THIN PROFILE |
BGA24,5X5,40 |
20 |
1 mm |
105 Cel |
3-STATE |
256MX8 |
256M |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
HARDWARE/SOFTWARE |
R-PBGA-B24 |
3.6 V |
1.2 mm |
100000 Write/Erase Cycles |
133 MHz |
6 mm |
SPI |
BOTTOM/TOP |
2147483648 bit |
2.7 V |
e1 |
30 |
260 |
NOR TYPE |
.00028 Amp |
8 mm |
3 |
|||||||||||||||||||||
|
Micron Technology |
FLASH |
INDUSTRIAL |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
20 mA |
134217728 words |
3 |
3/3.3 |
1 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.3 |
Flash Memories |
20 |
1.27 mm |
85 Cel |
128MX1 |
128M |
-40 Cel |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-N8 |
3.6 V |
1 mm |
100000 Write/Erase Cycles |
108 MHz |
6 mm |
Not Qualified |
SPI |
134217728 bit |
2.7 V |
30 |
260 |
NOR TYPE |
.0001 Amp |
8 mm |
3 |
|||||||||||||||||||||||
|
Micron Technology |
FLASH |
INDUSTRIAL |
24 |
TBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
BALL |
SERIAL |
SYNCHRONOUS |
33554432 words |
3 |
8 |
GRID ARRAY, THIN PROFILE |
1 mm |
105 Cel |
32MX8 |
32M |
-40 Cel |
BOTTOM |
R-PBGA-B24 |
3.6 V |
1.2 mm |
133 MHz |
6 mm |
268435456 bit |
2.7 V |
NOT SPECIFIED |
NOT SPECIFIED |
8 mm |
3 |
|||||||||||||||||||||||||||||||||
|
Micron Technology |
FLASH |
INDUSTRIAL |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
15 mA |
8388608 words |
3 |
3/3.3 |
1 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.25 |
Flash Memories |
20 |
1.27 mm |
85 Cel |
8MX1 |
8M |
-40 Cel |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-N8 |
3.6 V |
1 mm |
100000 Write/Erase Cycles |
75 MHz |
5 mm |
Not Qualified |
15 ms |
SPI |
8388608 bit |
2.7 V |
40 MHZ CLOCK FREQUENCY AVAILABLE UPON REQUEST |
30 |
260 |
NOR TYPE |
.0001 Amp |
6 mm |
2.7 |
|||||||||||||||||||||
|
Micron Technology |
FLASH |
COMMERCIAL |
48 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
128K |
35 mA |
268435456 words |
3.3 |
NO |
3/3.3 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSSOP48,.8,20 |
Flash Memories |
.5 mm |
70 Cel |
256MX8 |
256M |
0 Cel |
2K |
YES |
MATTE TIN |
YES |
DUAL |
R-PDSO-G48 |
3.6 V |
1.2 mm |
12 mm |
Not Qualified |
2147483648 bit |
2.7 V |
2K |
e3 |
30 |
260 |
SLC NAND TYPE |
.0001 Amp |
18.4 mm |
25 ns |
3.3 |
NO |
||||||||||||||||||
|
Micron Technology |
FLASH CARD |
INDUSTRIAL |
153 |
TFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
34359738368 words |
8 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
BGA153,14X14,20 |
.5 mm |
85 Cel |
3-STATE |
32GX8 |
32G |
-40 Cel |
Tin/Silver/Copper (Sn/Ag/Cu) |
BOTTOM |
R-PBGA-B153 |
3.6 V |
1.1 mm |
200 MHz |
11.5 mm |
274877906944 bit |
2.7 V |
e1 |
30 |
260 |
NAND TYPE |
13 mm |
2.7 |
||||||||||||||||||||||||||||||
|
Micron Technology |
FLASH CARD |
153 |
TFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q104 |
BALL |
PARALLEL |
SYNCHRONOUS |
8589934592 words |
NO |
8 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
BGA153,14X14,20 |
4 |
5 |
.5 mm |
85 Cel |
OPEN-DRAIN |
8GX8 |
8G |
-40 Cel |
NO |
TIN SILVER COPPER |
YES |
BOTTOM |
R-PBGA-B153 |
3.6 V |
1.2 mm |
200 MHz |
11.5 mm |
68719476736 bit |
2.7 V |
e1 |
30 |
260 |
NAND TYPE |
13 mm |
2.7 |
NO |
||||||||||||||||||||||||
|
Micron Technology |
FLASH |
AUTOMOTIVE |
24 |
TBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
BALL |
SERIAL |
SYNCHRONOUS |
16777216 words |
1.8 |
8 |
GRID ARRAY, THIN PROFILE |
1 |
1 mm |
125 Cel |
16MX8 |
16M |
-40 Cel |
BOTTOM |
R-PBGA-B24 |
2 V |
1.2 mm |
166 MHz |
6 mm |
134217728 bit |
1.7 V |
NOT SPECIFIED |
NOT SPECIFIED |
8 mm |
1.8 |
||||||||||||||||||||||||||||||||
|
Micron Technology |
FLASH |
INDUSTRIAL |
48 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
536870912 words |
3.3 |
8 |
SMALL OUTLINE, THIN PROFILE |
.5 mm |
85 Cel |
512MX8 |
512M |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-G48 |
3.6 V |
1.2 mm |
12 mm |
4294967296 bit |
2.7 V |
e3 |
30 |
260 |
SLC NAND TYPE |
18.4 mm |
3.3 |
||||||||||||||||||||||||||||||||
|
Micron Technology |
FLASH CARD |
COMMERCIAL EXTENDED |
153 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
8589934592 words |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA153,14X14,20 |
.5 mm |
85 Cel |
OPEN-DRAIN |
8GX8 |
8G |
-25 Cel |
BOTTOM |
R-PBGA-B153 |
3.6 V |
1 mm |
52 MHz |
11.5 mm |
68719476736 bit |
2.7 V |
30 |
260 |
MLC NAND TYPE |
13 mm |
|||||||||||||||||||||||||||||||||
|
Micron Technology |
FLASH |
INDUSTRIAL |
63 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
268435456 words |
3.3 |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.8 mm |
85 Cel |
256MX8 |
256M |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B63 |
3.6 V |
1 mm |
9 mm |
2147483648 bit |
2.7 V |
e1 |
30 |
260 |
SLC NAND TYPE |
11 mm |
2.7 |
||||||||||||||||||||||||||||||||
|
Micron Technology |
FLASH |
INDUSTRIAL |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
GULL WING |
SERIAL |
SYNCHRONOUS |
536870912 words |
1.8 |
1 |
SMALL OUTLINE |
1.27 mm |
105 Cel |
512MX1 |
512M |
-40 Cel |
DUAL |
R-PDSO-G16 |
2 V |
2.65 mm |
166 MHz |
7.5 mm |
536870912 bit |
1.7 V |
NOT SPECIFIED |
NOT SPECIFIED |
NOR TYPE |
10.3 mm |
1.8 |
||||||||||||||||||||||||||||||||
|
Micron Technology |
FLASH |
INDUSTRIAL |
63 |
FBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
PARALLEL |
256K |
20 mA |
1073741824 words |
1.8 |
NO |
1.8 |
8 |
GRID ARRAY, FINE PITCH |
BGA63,10X12,32 |
Flash Memories |
.8 mm |
85 Cel |
1GX8 |
1G |
-40 Cel |
4K |
YES |
YES |
BOTTOM |
R-PBGA-B63 |
Not Qualified |
8589934592 bit |
4K |
SLC NAND TYPE |
.00005 Amp |
30 ns |
1.8 |
NO |
|||||||||||||||||||||||||||||
|
Micron Technology |
FLASH CARD |
INDUSTRIAL |
100 |
TBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
34359738368 words |
NO |
8 |
GRID ARRAY, THIN PROFILE |
BGA100,10X15,40 |
1 mm |
105 Cel |
32GX8 |
32G |
-40 Cel |
NO |
TIN SILVER COPPER |
YES |
BOTTOM |
HARDWARE |
R-PBGA-B100 |
3.6 V |
1.2 mm |
200 MHz |
14 mm |
274877906944 bit |
2.7 V |
e1 |
30 |
260 |
NAND TYPE |
18 mm |
2.7 |
NO |
||||||||||||||||||||||||||
|
Micron Technology |
FLASH CARD |
INDUSTRIAL |
100 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
GRID ARRAY, LOW PROFILE |
1 mm |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B100 |
1.4 mm |
14 mm |
e1 |
MLC NAND TYPE |
18 mm |
3.3 |
||||||||||||||||||||||||||||||||||||||||||||||
|
Micron Technology |
FLASH |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
GULL WING |
SERIAL |
SYNCHRONOUS |
15 mA |
8388608 words |
3/3.3 |
1 |
SMALL OUTLINE |
SOP8,.25 |
Flash Memories |
20 |
1.27 mm |
85 Cel |
8MX1 |
8M |
-40 Cel |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G8 |
3.6 V |
1.75 mm |
100000 Write/Erase Cycles |
75 MHz |
3.9 mm |
Not Qualified |
15 ms |
SPI |
8388608 bit |
2.7 V |
30 |
260 |
NOR TYPE |
.0001 Amp |
4.9 mm |
2.7 |
||||||||||||||||||||||
|
Micron Technology |
FLASH |
INDUSTRIAL |
24 |
TBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
BALL |
SERIAL |
SYNCHRONOUS |
67108864 words |
3 |
8 |
GRID ARRAY, THIN PROFILE |
1 mm |
105 Cel |
64MX8 |
64M |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B24 |
3.6 V |
1.2 mm |
133 MHz |
6 mm |
536870912 bit |
2.7 V |
e1 |
NOR TYPE |
8 mm |
3 |
||||||||||||||||||||||||||||||||
|
Micron Technology |
FLASH CARD |
INDUSTRIAL |
153 |
TFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
8589934592 words |
8 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
.5 mm |
85 Cel |
8GX8 |
8G |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B153 |
3.6 V |
1.2 mm |
11.5 mm |
68719476736 bit |
2.7 V |
e1 |
30 |
260 |
NAND TYPE |
13 mm |
2.7 |
Flash memory is a type of non-volatile computer memory that is commonly used in digital devices such as USB drives, solid-state drives, and digital cameras. It is a type of EEPROM (Electrically Erasable Programmable Read-Only Memory) that allows data to be erased and reprogrammed in blocks instead of one byte at a time. Flash memory uses a floating gate transistor to store data, which allows it to retain information even when the power is turned off.
Flash memory is widely used in digital devices because of its high capacity, small size, and fast access times. It is also more durable than other types of memory, such as hard disk drives, because it has no moving parts. This makes it ideal for use in portable devices that may be subject to physical shock or vibration.
There are two types of flash memory: NOR flash and NAND flash. NOR flash is faster than NAND flash, but it has lower density and higher cost per bit. NOR flash is typically used for code storage, such as firmware or boot code, because it provides faster access times. NAND flash has higher density and lower cost per bit, which makes it ideal for data storage applications.
Flash memory has a limited lifespan, as it can only be erased and reprogrammed a limited number of times. This is because the process of erasing and reprogramming the memory causes wear and tear on the floating gate transistor. However, modern flash memory devices have a sophisticated wear-leveling algorithm that distributes writes evenly across the memory, which extends the lifespan of the device.