Micron Technology Flash Memory 2,400+

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Part RoHS Manufacturer Memory IC Type Temperature Grade No. of Terminals Package Code Package Shape Package Body Material Surface Mount No. of Functions Technology Screening Level Terminal Form Parallel or Serial Operating Mode Sector Size (Words) Maximum Supply Current No. of Words Input/Output Type Nominal Supply Voltage / Vsup (V) Mixed Memory Type Toggle Bit Power Supplies (V) Memory Width Package Style (Meter) Package Equivalence Code Alternate Memory Width Sub-Category Minimum Data Retention Time Terminal Pitch Maximum Operating Temperature Reverse Pinout Output Characteristics Organization No. of Words Code Minimum Operating Temperature No. of Sectors/Size Command User Interface Terminal Finish Ready or Busy Terminal Position No. of Ports Write Protection JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Supply Voltage (Vsup) Maximum Seated Height Endurance Maximum Clock Frequency (fCLK) Width Qualification Maximum Write Cycle Time (tWC) Serial Bus Type Boot Block Memory Density Minimum Supply Voltage (Vsup) Additional Features Page Size (words) JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Type Maximum Standby Current Length Common Flash Interface Maximum Access Time Programming Voltage (V) Data Polling

MQCF004A

Micron Technology

FLASH CARD

COMMERCIAL

50

UNSPECIFIED

UNSPECIFIED

NO

1

CMOS

UNSPECIFIED

4194304 words

3.3

8

MICROELECTRONIC ASSEMBLY

60 Cel

4MX8

4M

0 Cel

UNSPECIFIED

X-XXMA-X50

3.6 V

Not Qualified

33554432 bit

3 V

CAN ALSO BE OPERATED FROM 4.5 TO 5.5 VOLTS

NOR TYPE

3

MTFDDAA512MAM-1J22AC

Micron Technology

FLASH

CMOS

MLC NAND TYPE

3.3

RD48F4000P0XBQ0A

Micron Technology

FLASH

INDUSTRIAL

80

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

16K,64K

28 mA

16777216 words

3

NO

2.5/3.3

16

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA88,8X12,32

Flash Memories

.8 mm

85 Cel

16MX16

16M

-40 Cel

4,255

YES

BOTTOM

R-PBGA-B80

3.6 V

1 mm

8 mm

Not Qualified

BOTTOM

268435456 bit

2.3 V

SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE

4

30

235

NOR TYPE

.000195 Amp

11 mm

YES

85 ns

3

NO

M29W064FT7AN6E

Micron Technology

FLASH

INDUSTRIAL

48

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

GULL WING

PARALLEL

ASYNCHRONOUS

4194304 words

3

16

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

8

.5 mm

85 Cel

4MX16

4M

-40 Cel

DUAL

R-PDSO-G48

3.6 V

1.2 mm

12 mm

TOP

67108864 bit

2.7 V

NOR TYPE

18.4 mm

70 ns

3

MTFDDAK240MAV-1AH11AA

Micron Technology

FLASH

CMOS

MLC NAND TYPE

5

M29W256GL60N6F

Micron Technology

FLASH

INDUSTRIAL

56

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

GULL WING

PARALLEL

ASYNCHRONOUS

128K

15 mA

16777216 words

3

YES

3/3.3

16

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP56,.8,20

8

Flash Memories

.5 mm

85 Cel

16MX16

16M

-40 Cel

256

YES

YES

DUAL

R-PDSO-G56

3.6 V

1.2 mm

14 mm

Not Qualified

BOTTOM/TOP

268435456 bit

2.7 V

8/16

NOT SPECIFIED

NOT SPECIFIED

NOR TYPE

.0001 Amp

18.4 mm

YES

60 ns

3

YES

MTFDDAK240MAV-1AE1ZAB

Micron Technology

FLASH

CMOS

MLC NAND TYPE

5

MTFDJAL3T2MBS-2AN16ABY

Micron Technology

FLASH

3.3

MTFDDAK256MAZ-1AE12ACYY

Micron Technology

FLASH MODULE

COMMERCIAL

22

RECTANGULAR

UNSPECIFIED

NO

1

CMOS

UNSPECIFIED

SERIAL

ASYNCHRONOUS

274877906944 words

5

8

MICROELECTRONIC ASSEMBLY

70 Cel

256GX8

256G

0 Cel

SINGLE

R-XSMA-X22

5.5 V

7 mm

69.85 mm

2199023255552 bit

4.5 V

MLC NAND TYPE

100.5 mm

5

M29W256GH70ZA1E

Micron Technology

FLASH

COMMERCIAL

64

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

128K

15 mA

16777216 words

3

YES

3/3.3

16

GRID ARRAY, THIN PROFILE

BGA64,8X8,40

8

Flash Memories

1 mm

70 Cel

16MX16

16M

0 Cel

256

YES

YES

BOTTOM

R-PBGA-B64

3.6 V

1.2 mm

10 mm

Not Qualified

BOTTOM/TOP

268435456 bit

2.7 V

8/16

NOT SPECIFIED

NOT SPECIFIED

NOR TYPE

.0001 Amp

13 mm

YES

70 ns

3

YES

M29W160ET70ZS6

Micron Technology

FLASH

INDUSTRIAL

64

LBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

16K,8K,32K,64K

20 mA

1048576 words

3

YES

3/3.3

16

GRID ARRAY, LOW PROFILE

BGA64,8X8,40

8

Flash Memories

1 mm

85 Cel

1MX16

1M

-40 Cel

1,2,1,31

YES

TIN LEAD SILVER

YES

BOTTOM

R-PBGA-B64

3.6 V

1.4 mm

11 mm

Not Qualified

TOP

16777216 bit

2.7 V

TOP BOOT BLOCK

e0

NOR TYPE

.0001 Amp

13 mm

YES

70 ns

3

YES

MTFDDAT128MAY-1AH12ZYY

Micron Technology

FLASH MODULE

INDUSTRIAL

52

DIMM

RECTANGULAR

UNSPECIFIED

NO

1

CMOS

NO LEAD

SERIAL

ASYNCHRONOUS

137438953472 words

3.3

8

MICROELECTRONIC ASSEMBLY

85 Cel

3-STATE

128GX8

128G

-40 Cel

DUAL

R-XDMA-N52

3.46 V

3.75 mm

29.85 mm

1099511627776 bit

3.14 V

MLC NAND TYPE

50.8 mm

3.3

PH28F128W30TD70

Micron Technology

FLASH

INDUSTRIAL

60

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

PARALLEL

4K,32K

22 mA

8388608 words

NO

1.8,3

16

GRID ARRAY, FINE PITCH

BGA60,9X10,30

Flash Memories

.75 mm

85 Cel

8MX16

8M

-40 Cel

8, 255

YES

BOTTOM

R-PBGA-B60

Not Qualified

TOP

134217728 bit

4

NOR TYPE

.00007 Amp

YES

70 ns

NO

MTFDDAT240MAV-1AE11ABYY

Micron Technology

FLASH

COMMERCIAL

52

DIE

RECTANGULAR

UNSPECIFIED

YES

1

CMOS

NO LEAD

UNCASED CHIP

UPPER

R-XUUC-N52

3.7 mm

29.85 mm

MLC NAND TYPE

50.8 mm

3.3

M29W400DB45N3E

Micron Technology

FLASH

3

RC48F4400P0VB00A

Micron Technology

FLASH

INDUSTRIAL

64

BGA

SQUARE

PLASTIC/EPOXY

YES

CMOS

BALL

PARALLEL

16K,64K

51 mA

33554432 words

NO

1.8,1.8/3.3

16

GRID ARRAY

BGA64,8X8,40

Flash Memories

1 mm

85 Cel

32MX16

32M

-40 Cel

8, 510

YES

BOTTOM

S-PBGA-B64

Not Qualified

BOTTOM

536870912 bit

4

NOR TYPE

.000005 Amp

YES

85 ns

NO

MTFDDAT256MAZ-1AE12ZYY

Micron Technology

FLASH MODULE

COMMERCIAL

52

DIMM

RECTANGULAR

UNSPECIFIED

NO

1

CMOS

NO LEAD

SERIAL

ASYNCHRONOUS

274877906944 words

3.3

8

MICROELECTRONIC ASSEMBLY

70 Cel

256GX8

256G

0 Cel

DUAL

R-XDMA-N52

3.46 V

3.75 mm

29.85 mm

2199023255552 bit

3.14 V

MLC NAND TYPE

50.8 mm

3.3

M29W640GL6AZA6E

Micron Technology

FLASH

INDUSTRIAL

48

TFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

4194304 words

3

16

GRID ARRAY, THIN PROFILE, FINE PITCH

8

.8 mm

85 Cel

4MX16

4M

-40 Cel

BOTTOM

R-PBGA-B48

3.6 V

1.2 mm

6 mm

67108864 bit

2.7 V

NOR TYPE

8 mm

60 ns

3

M29W800FB7AN6ST

Micron Technology

FLASH

INDUSTRIAL

48

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

524288 words

3.3

16

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

8

.5 mm

85 Cel

512KX16

512K

-40 Cel

DUAL

R-PDSO-G48

3.6 V

1.2 mm

12 mm

BOTTOM

8388608 bit

2.7 V

BOTTOM BOOT BLOCK

NOR TYPE

18.4 mm

70 ns

3

M29F800FB5AN6F2

Micron Technology

FLASH

INDUSTRIAL

48

TSOP1

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

GULL WING

PARALLEL

ASYNCHRONOUS

16K,8K,32K,64K

30 mA

524288 words

5

YES

5

16

SMALL OUTLINE, THIN PROFILE

TSSOP48,.8,20

8

Flash Memories

.5 mm

85 Cel

512KX16

512K

-40 Cel

1,2,1,15

YES

MATTE TIN

YES

DUAL

R-PDSO-G48

5.5 V

1.2 mm

12 mm

Not Qualified

BOTTOM

8388608 bit

4.5 V

BOTTOM BOOT BLOCK

e3

NOR TYPE

.00012 Amp

18.4 mm

YES

55 ns

5

YES

M29W640GL7AZF3F

Micron Technology

FLASH

3

M29W128GL70N3F

Micron Technology

FLASH

AUTOMOTIVE

56

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

128K

20 mA

8192 words

3

YES

3/3.3

16

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP56,.8,20

8

Flash Memories

.5 mm

125 Cel

8KX16

8K

-40 Cel

128

YES

MATTE TIN

YES

DUAL

R-PDSO-G56

3.6 V

1.2 mm

14 mm

Not Qualified

131072 bit

2.7 V

8/16

e3

NOR TYPE

.0001 Amp

18.4 mm

YES

70 ns

3

YES

MTFDDAA512MAM-1J11AC

Micron Technology

FLASH

CMOS

MLC NAND TYPE

3.3

MTFDDAA200MAR-1J1AC

Micron Technology

FLASH

CMOS

MLC NAND TYPE

3.3

MTFDDAK128MAZ-1AE12ABHA

Micron Technology

FLASH MODULE

COMMERCIAL

22

RECTANGULAR

UNSPECIFIED

NO

1

CMOS

UNSPECIFIED

SERIAL

ASYNCHRONOUS

137438953472 words

5

8

MICROELECTRONIC ASSEMBLY

70 Cel

128GX8

128G

0 Cel

SINGLE

R-XSMA-X22

5.5 V

7 mm

69.85 mm

1099511627776 bit

4.5 V

MLC NAND TYPE

100.5 mm

5

MTFDDAT256MAM-1J12AC

Micron Technology

FLASH

CMOS

MLC NAND TYPE

3.3

MTFDDAK960MAV-1AE11ZZHA

Micron Technology

FLASH MODULE

COMMERCIAL

22

SMA

RECTANGULAR

UNSPECIFIED

NO

1

CMOS

NO LEAD

SERIAL

ASYNCHRONOUS

1030792151040 words

5

8

MICROELECTRONIC ASSEMBLY

70 Cel

3-STATE

960GX8

960G

0 Cel

SINGLE

R-XSMA-N22

5.5 V

7 mm

69.85 mm

8246337208320 bit

4.5 V

MLC NAND TYPE

100.45 mm

5

M29W400DB55N3F

Micron Technology

FLASH

AUTOMOTIVE

48

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

GULL WING

PARALLEL

ASYNCHRONOUS

16K,8K,32K,64K

20 mA

262144 words

3.3

YES

3/3.3

16

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP48,.8,20

8

Flash Memories

.5 mm

125 Cel

256KX16

256K

-40 Cel

1,2,1,7

YES

MATTE TIN

YES

DUAL

R-PDSO-G48

3.6 V

1.2 mm

12 mm

Not Qualified

BOTTOM

4194304 bit

2.7 V

e3

NOR TYPE

.0001 Amp

18.4 mm

55 ns

3

YES

M29W640GL60NA3F

Micron Technology

FLASH

AUTOMOTIVE

48

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

4194304 words

3

16

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

8

.5 mm

125 Cel

4MX16

4M

-40 Cel

DUAL

R-PDSO-G48

3.6 V

1.2 mm

12 mm

Not Qualified

TOP

67108864 bit

2.7 V

TOP BOOT BLOCK

NOR TYPE

18.4 mm

60 ns

3

RD48F3000P0XBQ0

Micron Technology

FLASH

INDUSTRIAL

80

TFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

16K,64K

28 mA

8388608 words

3

NO

2.5/3.3

16

GRID ARRAY, THIN PROFILE, FINE PITCH

BGA64,10X12,32

Flash Memories

.8 mm

85 Cel

8MX16

8M

-40 Cel

4,127

YES

BOTTOM

R-PBGA-B80

3.6 V

1.2 mm

8 mm

Not Qualified

BOTTOM

134217728 bit

2.3 V

SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE; BOTTOM BOOT

4

NOT SPECIFIED

NOT SPECIFIED

NOR TYPE

.000155 Amp

10 mm

YES

85 ns

3

NO

M29W320EB70ZS6F

Micron Technology

FLASH

INDUSTRIAL

64

LBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

8K,64K

20 mA

2097152 words

3

YES

3/3.3

16

GRID ARRAY, LOW PROFILE

BGA64,8X8,40

8

Flash Memories

1 mm

85 Cel

2MX16

2M

-40 Cel

8,63

YES

YES

BOTTOM

R-PBGA-B64

3.6 V

1.4 mm

11 mm

Not Qualified

BOTTOM

33554432 bit

2.7 V

NOT SPECIFIED

NOT SPECIFIED

NOR TYPE

.0001 Amp

13 mm

YES

70 ns

3

YES

M29W800FT90ZA6T

Micron Technology

FLASH

INDUSTRIAL

48

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

PARALLEL

16K,8K,32K,64K

20 mA

524288 words

YES

3/3.3

16

GRID ARRAY, FINE PITCH

BGA48,6X8,32

8

Flash Memories

.8 mm

85 Cel

512KX16

512K

-40 Cel

1,2,1,15

YES

YES

BOTTOM

R-PBGA-B48

Not Qualified

TOP

8388608 bit

NOR TYPE

.0001 Amp

YES

90 ns

YES

M29W160EB70ZS6T

Micron Technology

FLASH

INDUSTRIAL

64

LBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

1048576 words

3

16

GRID ARRAY, LOW PROFILE

8

1 mm

85 Cel

1MX16

1M

-40 Cel

BOTTOM

R-PBGA-B64

3.6 V

1.4 mm

11 mm

BOTTOM

16777216 bit

2.7 V

NOR TYPE

13 mm

70 ns

3

MTFDDAV120MAV-1AE11ABHA

Micron Technology

FLASH MODULE

COMMERCIAL

22

SMA

RECTANGULAR

UNSPECIFIED

NO

1

CMOS

NO LEAD

SERIAL

ASYNCHRONOUS

128849018880 words

5

8

MICROELECTRONIC ASSEMBLY

70 Cel

3-STATE

120GX8

120G

0 Cel

SINGLE

R-XSMA-N22

5.5 V

7 mm

69.85 mm

1030792151040 bit

4.5 V

MLC NAND TYPE

100.45 mm

5

M29W160FT80NSF

Micron Technology

FLASH

AUTOMOTIVE

48

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

GULL WING

PARALLEL

16K,8K,32K,64K

20 mA

1048576 words

YES

3/3.3

16

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP48,.8,20

8

Flash Memories

.5 mm

125 Cel

1MX16

1M

-40 Cel

1,2,1,31

YES

YES

DUAL

R-PDSO-G48

Not Qualified

TOP

16777216 bit

NOR TYPE

.0001 Amp

YES

80 ns

YES

MTFDDAT256MAR-1J1AB

Micron Technology

FLASH

CMOS

MLC NAND TYPE

3.3

M29W640GL90ZA3F

Micron Technology

FLASH

AUTOMOTIVE

48

TFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

4194304 words

3

16

GRID ARRAY, THIN PROFILE, FINE PITCH

8

.8 mm

125 Cel

4MX16

4M

-40 Cel

BOTTOM

R-PBGA-B48

3.6 V

1.2 mm

6 mm

Not Qualified

TOP

67108864 bit

2.7 V

TOP BOOT BLOCK

NOR TYPE

8 mm

90 ns

3

MTFDDAK240MAV-2AE11AB

Micron Technology

FLASH

CMOS

MLC NAND TYPE

5

MTFDDAK960MAV-1AH11ABYY

Micron Technology

FLASH

CMOS

MLC NAND TYPE

5

MTFDDAV480MAV-1AE11AAHA

Micron Technology

FLASH MODULE

COMMERCIAL

22

SMA

RECTANGULAR

UNSPECIFIED

NO

1

CMOS

NO LEAD

SERIAL

ASYNCHRONOUS

515396075520 words

5

8

MICROELECTRONIC ASSEMBLY

70 Cel

3-STATE

480GX8

480G

0 Cel

SINGLE

R-XSMA-N22

5.5 V

7 mm

69.85 mm

4123168604160 bit

4.5 V

MLC NAND TYPE

100.45 mm

5

M29W400FT70N3T

Micron Technology

FLASH

AUTOMOTIVE

48

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

AEC-Q100

GULL WING

PARALLEL

16K,8K,32K,64K

20 mA

262144 words

3.3

YES

3.3

16

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP48,.8,20

8

Flash Memories

.5 mm

125 Cel

256KX16

256K

-40 Cel

1,2,1,7

YES

YES

DUAL

R-PDSO-G48

Not Qualified

TOP

4194304 bit

NOR TYPE

.0001 Amp

YES

70 ns

YES

M29W640GL60NA3E

Micron Technology

FLASH

AUTOMOTIVE

48

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

4194304 words

3

16

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

8

.5 mm

125 Cel

4MX16

4M

-40 Cel

DUAL

R-PDSO-G48

3.6 V

1.2 mm

12 mm

Not Qualified

TOP

67108864 bit

2.7 V

TOP BOOT BLOCK

NOR TYPE

18.4 mm

60 ns

3

MTFDDAA128MAM-1K2

Micron Technology

FLASH

CMOS

MLC NAND TYPE

3.3

M29W800FB7AN6SF

Micron Technology

FLASH

INDUSTRIAL

48

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

524288 words

3.3

16

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

8

.5 mm

85 Cel

512KX16

512K

-40 Cel

DUAL

R-PDSO-G48

3.6 V

1.2 mm

12 mm

BOTTOM

8388608 bit

2.7 V

BOTTOM BOOT BLOCK

NOR TYPE

18.4 mm

70 ns

3

M29W800FB55N6T

Micron Technology

FLASH

INDUSTRIAL

48

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

GULL WING

PARALLEL

16K,8K,32K,64K

20 mA

524288 words

3.3

YES

3.3

16

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP48,.8,20

8

Flash Memories

.5 mm

85 Cel

512KX16

512K

-40 Cel

1,2,1,15

YES

YES

DUAL

R-PDSO-G48

Not Qualified

BOTTOM

8388608 bit

NOR TYPE

.0001 Amp

YES

55 ns

YES

MTFDDAT512MAY-1AE12ZHA

Micron Technology

FLASH MODULE

COMMERCIAL

52

DIMM

RECTANGULAR

UNSPECIFIED

NO

1

CMOS

NO LEAD

SERIAL

ASYNCHRONOUS

549755813888 words

3.3

8

MICROELECTRONIC ASSEMBLY

70 Cel

512GX8

512G

0 Cel

DUAL

R-XDMA-N52

3.46 V

3.75 mm

29.85 mm

4398046511104 bit

3.14 V

MLC NAND TYPE

50.8 mm

3.3

MTFDDAA128MAM-1J22AC

Micron Technology

FLASH

CMOS

MLC NAND TYPE

3.3

MTFDDAK240MAV-1AE12AB

Micron Technology

FLASH

CMOS

MLC NAND TYPE

5

Flash Memory

Flash memory is a type of non-volatile computer memory that is commonly used in digital devices such as USB drives, solid-state drives, and digital cameras. It is a type of EEPROM (Electrically Erasable Programmable Read-Only Memory) that allows data to be erased and reprogrammed in blocks instead of one byte at a time. Flash memory uses a floating gate transistor to store data, which allows it to retain information even when the power is turned off.

Flash memory is widely used in digital devices because of its high capacity, small size, and fast access times. It is also more durable than other types of memory, such as hard disk drives, because it has no moving parts. This makes it ideal for use in portable devices that may be subject to physical shock or vibration.

There are two types of flash memory: NOR flash and NAND flash. NOR flash is faster than NAND flash, but it has lower density and higher cost per bit. NOR flash is typically used for code storage, such as firmware or boot code, because it provides faster access times. NAND flash has higher density and lower cost per bit, which makes it ideal for data storage applications.

Flash memory has a limited lifespan, as it can only be erased and reprogrammed a limited number of times. This is because the process of erasing and reprogramming the memory causes wear and tear on the floating gate transistor. However, modern flash memory devices have a sophisticated wear-leveling algorithm that distributes writes evenly across the memory, which extends the lifespan of the device.