Micron Technology Flash Memory 2,400+

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Part RoHS Manufacturer Memory IC Type Temperature Grade No. of Terminals Package Code Package Shape Package Body Material Surface Mount No. of Functions Technology Screening Level Terminal Form Parallel or Serial Operating Mode Sector Size (Words) Maximum Supply Current No. of Words Input/Output Type Nominal Supply Voltage / Vsup (V) Mixed Memory Type Toggle Bit Power Supplies (V) Memory Width Package Style (Meter) Package Equivalence Code Alternate Memory Width Sub-Category Minimum Data Retention Time Terminal Pitch Maximum Operating Temperature Reverse Pinout Output Characteristics Organization No. of Words Code Minimum Operating Temperature No. of Sectors/Size Command User Interface Terminal Finish Ready or Busy Terminal Position No. of Ports Write Protection JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Supply Voltage (Vsup) Maximum Seated Height Endurance Maximum Clock Frequency (fCLK) Width Qualification Maximum Write Cycle Time (tWC) Serial Bus Type Boot Block Memory Density Minimum Supply Voltage (Vsup) Additional Features Page Size (words) JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Type Maximum Standby Current Length Common Flash Interface Maximum Access Time Programming Voltage (V) Data Polling

M29F160FT5AN6E

Micron Technology

FLASH

INDUSTRIAL

48

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

AEC-Q100

GULL WING

PARALLEL

16K,8K,32K,64K

20 mA

1048576 words

5

YES

5

16

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP48,.8,20

8

Flash Memories

.5 mm

85 Cel

1MX16

1M

-40 Cel

1,2,1,31

YES

YES

DUAL

R-PDSO-G48

Not Qualified

TOP

16777216 bit

NOR TYPE

.00012 Amp

YES

55 ns

YES

M45PE10-VMP6TG

Micron Technology

FLASH

INDUSTRIAL

8

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

NO LEAD

SERIAL

SYNCHRONOUS

15 mA

131072 words

3

3/3.3

8

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

SOLCC8,.25

Flash Memories

20

1.27 mm

85 Cel

128KX8

128K

-40 Cel

DUAL

HARDWARE/SOFTWARE

R-PDSO-N8

3.6 V

1 mm

100000 Write/Erase Cycles

75 MHz

5 mm

Not Qualified

23 ms

SPI

1048576 bit

2.7 V

30

260

NOR TYPE

.00001 Amp

6 mm

2.7

M29F200FT55N3T

Micron Technology

FLASH

AUTOMOTIVE

48

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

AEC-Q100

GULL WING

PARALLEL

16K,8K,32K,64K

20 mA

131072 words

5

YES

5

16

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP48,.8,20

8

Flash Memories

.5 mm

125 Cel

128KX16

128K

-40 Cel

1,2,1,3

YES

YES

DUAL

R-PDSO-G48

Not Qualified

TOP

2097152 bit

NOR TYPE

.00012 Amp

YES

55 ns

YES

MTFDDAT128MAM-1J2

Micron Technology

FLASH

CMOS

MLC NAND TYPE

3.3

MTFDDAK960MAV-1AE12ACYY

Micron Technology

FLASH

COMMERCIAL

22

DIE

RECTANGULAR

UNSPECIFIED

YES

1

CMOS

NO LEAD

UNCASED CHIP

UPPER

R-XUUC-N22

7 mm

69.85 mm

MLC NAND TYPE

100.5 mm

3.3

MTFDDAK120MAV-1AE1ZAA

Micron Technology

FLASH

CMOS

MLC NAND TYPE

5

MTFDDAT256MAM

Micron Technology

FLASH

CMOS

MLC NAND TYPE

3.3

M29DW256G70N1F

Micron Technology

FLASH

COMMERCIAL

56

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

GULL WING

PARALLEL

32K,128K

10 mA

16777216 words

YES

3/3.3

16

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP56,.8,20

Flash Memories

.5 mm

70 Cel

16MX16

16M

0 Cel

8,126

YES

YES

DUAL

R-PDSO-G56

Not Qualified

BOTTOM/TOP

268435456 bit

NOR TYPE

.0001 Amp

YES

70 ns

YES

MTFDDAC064MAM-1K12AC

Micron Technology

FLASH

CMOS

MLC NAND TYPE

5

MTFDDAT240MAV-2AH12ZZYY

Micron Technology

FLASH MODULE

52

SMA

RECTANGULAR

UNSPECIFIED

NO

1

CMOS

NO LEAD

SERIAL

ASYNCHRONOUS

257698037760 words

3.3

8

MICROELECTRONIC ASSEMBLY

70 Cel

240GX8

240G

0 Cel

SINGLE

R-XSMA-N52

3.46 V

3.75 mm

29.85 mm

2061584302080 bit

3.14 V

MLC NAND TYPE

50.8 mm

3.3

M29F800FB5AN6E

Micron Technology

FLASH

INDUSTRIAL

48

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

AEC-Q100

GULL WING

PARALLEL

16K,8K,32K,64K

20 mA

524288 words

5

YES

5

16

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP48,.8,20

8

Flash Memories

.5 mm

85 Cel

512KX16

512K

-40 Cel

1,2,1,15

YES

YES

DUAL

R-PDSO-G48

Not Qualified

BOTTOM

8388608 bit

NOR TYPE

.00012 Amp

YES

55 ns

YES

MTFDDAT120MAV-2AE11AAYY

Micron Technology

FLASH

CMOS

MLC NAND TYPE

3.3

M29W640GH90ZS3F

Micron Technology

FLASH

AUTOMOTIVE

64

LBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

4194304 words

3

16

GRID ARRAY, LOW PROFILE

8

1 mm

125 Cel

4MX16

4M

-40 Cel

BOTTOM

R-PBGA-B64

3.6 V

1.4 mm

11 mm

Not Qualified

BOTTOM

67108864 bit

2.7 V

BOTTOM BOOT BLOCK

NOR TYPE

13 mm

90 ns

3

M29W640GB6ANA3F

Micron Technology

FLASH

3

MTFDDAA050MAR-1K12

Micron Technology

FLASH

CMOS

MLC NAND TYPE

3.3

RD48F5000M0YTC0

Micron Technology

FLASH

OTHER

107

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

PARALLEL

128K

50 mA

33554432 words

1.8

NO

1.8

16

GRID ARRAY, FINE PITCH

BGA107,9X12,32

Flash Memories

.8 mm

85 Cel

32MX16

32M

-30 Cel

256

NO

BOTTOM

R-PBGA-B107

Not Qualified

TOP

536870912 bit

16

NOR TYPE

.00003 Amp

YES

96 ns

NO

M29W640GL6AZS6F

Micron Technology

FLASH

INDUSTRIAL

64

LBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

4194304 words

3

16

GRID ARRAY, LOW PROFILE

8

1 mm

85 Cel

4MX16

4M

-40 Cel

BOTTOM

R-PBGA-B64

3.6 V

1.4 mm

11 mm

67108864 bit

2.7 V

NOR TYPE

13 mm

60 ns

3

MTFDDAA128MAM-1J21AC

Micron Technology

FLASH

CMOS

MLC NAND TYPE

3.3

M29F200FT5AM6T2

Micron Technology

FLASH

INDUSTRIAL

44

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

GULL WING

PARALLEL

ASYNCHRONOUS

16K,8K,32K,64K

30 mA

131072 words

5

YES

5

16

SMALL OUTLINE

SOP44,.63

8

Flash Memories

1.27 mm

85 Cel

128KX16

128K

-40 Cel

1,2,1,3

YES

YES

DUAL

R-PDSO-G44

5.5 V

3 mm

12.6 mm

Not Qualified

TOP

2097152 bit

4.5 V

NOR TYPE

.00012 Amp

28.5 mm

YES

55 ns

5

YES

M29W128GSH70N6E

Micron Technology

FLASH

INDUSTRIAL

56

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

GULL WING

PARALLEL

128K

20 mA

8388608 words

YES

3/3.3

16

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP56,.8,20

8

Flash Memories

.5 mm

85 Cel

8MX16

8M

-40 Cel

128

YES

YES

DUAL

R-PDSO-G56

Not Qualified

134217728 bit

8/16

NOR TYPE

.0001 Amp

YES

70 ns

YES

MTFDDAK200MAR-1K1AB

Micron Technology

FLASH

CMOS

MLC NAND TYPE

5

M29W256GH70N6E

Micron Technology

FLASH

INDUSTRIAL

56

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

128K

15 mA

16777216 words

3

YES

3/3.3

16

SMALL OUTLINE

TSSOP56,.8,20

8

Flash Memories

.5 mm

85 Cel

16MX16

16M

-40 Cel

256

YES

MATTE TIN

YES

DUAL

R-PDSO-G56

3.6 V

1.2 mm

14 mm

Not Qualified

.00007 ms

BOTTOM/TOP

268435456 bit

2.7 V

8/16

e3

NOR TYPE

.0001 Amp

20 mm

YES

70 ns

3

YES

MTFDDAT480MAV-2AE1ZAA

Micron Technology

FLASH

CMOS

MLC NAND TYPE

3.3

M29W320EB70ZS6

Micron Technology

FLASH

INDUSTRIAL

64

LBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

8K,64K

20 mA

2097152 words

3

YES

3/3.3

16

GRID ARRAY, LOW PROFILE

BGA64,8X8,40

8

Flash Memories

1 mm

85 Cel

2MX16

2M

-40 Cel

8,63

YES

YES

BOTTOM

R-PBGA-B64

3.6 V

1.4 mm

11 mm

Not Qualified

BOTTOM

33554432 bit

2.7 V

NOR TYPE

.0001 Amp

13 mm

YES

70 ns

3

YES

MTFDDAA512MAM-1K22

Micron Technology

FLASH

CMOS

MLC NAND TYPE

3.3

M29W400FT7AZA6F

Micron Technology

FLASH

INDUSTRIAL

48

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

PARALLEL

16K,8K,32K,64K

20 mA

262144 words

YES

3/3.3

16

GRID ARRAY, FINE PITCH

BGA48,6X8,32

8

Flash Memories

.8 mm

85 Cel

256KX16

256K

-40 Cel

1,2,1,7

YES

YES

BOTTOM

R-PBGA-B48

Not Qualified

TOP

4194304 bit

NOR TYPE

.0001 Amp

YES

70 ns

YES

MTFDDAT256MAM-1J1AA

Micron Technology

FLASH

CMOS

MLC NAND TYPE

3.3

MTFDJAL3T2MBS-2AN16ABYY

Micron Technology

FLASH

SLC NAND TYPE

3.3

MTFDHBE800TDG-1AW4ZABYY

Micron Technology

FLASH MODULE

XMA

RECTANGULAR

UNSPECIFIED

YES

1

CMOS

NO LEAD

ASYNCHRONOUS

858993459200 words

8

MICROELECTRONIC ASSEMBLY

70 Cel

800GX8

800G

0 Cel

UNSPECIFIED

R-XXMA-N

6871947673600 bit

TLC NAND TYPE

M29W320DB80ZE3F

Micron Technology

FLASH

AUTOMOTIVE

48

TFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

2097152 words

3

16

GRID ARRAY, THIN PROFILE, FINE PITCH

8

.8 mm

125 Cel

2MX16

2M

-40 Cel

BOTTOM

R-PBGA-B48

3.6 V

1.2 mm

6 mm

33554432 bit

2.7 V

8 mm

80 ns

3

MTFDDAA128MAM-1K11AA

Micron Technology

FLASH

CMOS

MLC NAND TYPE

3.3

M29DW323DB7AN6F

Micron Technology

FLASH

INDUSTRIAL

48

TSOP1

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

2097152 words

3

16

SMALL OUTLINE, THIN PROFILE

8

.5 mm

85 Cel

2MX16

2M

-40 Cel

DUAL

R-PDSO-G48

3.6 V

1.2 mm

12 mm

33554432 bit

2.7 V

18.4 mm

70 ns

3

MTFDDAK050MAR-1K1

Micron Technology

FLASH

CMOS

MLC NAND TYPE

5

M29W640GB60NB3E

Micron Technology

FLASH

AUTOMOTIVE

56

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

4194304 words

3

16

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

8

.5 mm

125 Cel

4MX16

4M

-40 Cel

DUAL

R-PDSO-G56

3.6 V

1.2 mm

14 mm

Not Qualified

BOTTOM

67108864 bit

2.7 V

BOTTOM BOOT BLOCK

NOR TYPE

18.4 mm

60 ns

3

MTFDHBE7T6TDF-1AW1ZABYY

Micron Technology

FLASH MODULE

XMA

RECTANGULAR

UNSPECIFIED

YES

1

CMOS

NO LEAD

ASYNCHRONOUS

8444249301319 words

8

MICROELECTRONIC ASSEMBLY

70 Cel

7.68TX8

7.68T

0 Cel

UNSPECIFIED

R-XXMA-N

67553994410557 bit

TLC NAND TYPE

MTFDDAV240MAV-1AE12AAYY

Micron Technology

FLASH MODULE

COMMERCIAL

22

SMA

RECTANGULAR

UNSPECIFIED

NO

1

CMOS

NO LEAD

SERIAL

ASYNCHRONOUS

257698037760 words

5

8

MICROELECTRONIC ASSEMBLY

70 Cel

3-STATE

240GX8

240G

0 Cel

SINGLE

R-XSMA-N22

5.5 V

7 mm

69.85 mm

2061584302080 bit

4.5 V

MLC NAND TYPE

100.45 mm

5

M45PE40-VMP6TP

Micron Technology

FLASH

INDUSTRIAL

8

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

NO LEAD

SERIAL

SYNCHRONOUS

15 mA

262144 words

3

3/3.3

8

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

SOLCC8,.25

Flash Memories

20

1.27 mm

85 Cel

256KX8

256K

-40 Cel

DUAL

HARDWARE/SOFTWARE

R-PDSO-N8

3.6 V

1 mm

100000 Write/Erase Cycles

75 MHz

5 mm

Not Qualified

SPI

2097152 bit

2.7 V

NOT SPECIFIED

NOT SPECIFIED

NOR TYPE

.00001 Amp

6 mm

2.7

MTFDDAT120MAV-1AE12AAHA

Micron Technology

FLASH MODULE

COMMERCIAL

22

SMA

RECTANGULAR

UNSPECIFIED

NO

1

CMOS

NO LEAD

SERIAL

ASYNCHRONOUS

128849018880 words

5

8

MICROELECTRONIC ASSEMBLY

70 Cel

3-STATE

120GX8

120G

0 Cel

SINGLE

R-XSMA-N22

5.5 V

7 mm

69.85 mm

1030792151040 bit

4.5 V

MLC NAND TYPE

100.45 mm

5

MTCF004A-XXX

Micron Technology

FLASH CARD

COMMERCIAL

50

UNSPECIFIED

UNSPECIFIED

NO

1

CMOS

UNSPECIFIED

PARALLEL

ASYNCHRONOUS

2097152 words

3.3

16

MICROELECTRONIC ASSEMBLY

60 Cel

2MX16

2M

0 Cel

UNSPECIFIED

X-XXMA-X50

3.465 V

Not Qualified

33554432 bit

3.135 V

CAN ALSO OPERATE WITH 5V SUPPLY

NOR TYPE

3.3

RD48F3000W0YUQ0

Micron Technology

FLASH

INDUSTRIAL

88

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

PARALLEL

4K,32K

40 mA

8388608 words

1.8

NO

1.8

16

GRID ARRAY, FINE PITCH

BGA88,8X12,32

Flash Memories

.8 mm

85 Cel

8MX16

8M

-40 Cel

8, 255

YES

BOTTOM

R-PBGA-B88

Not Qualified

TOP

134217728 bit

4

NOR TYPE

.000005 Amp

YES

60 ns

NO

MTFDDAK240MAV-2AH1ZAC

Micron Technology

FLASH

CMOS

MLC NAND TYPE

5

MTFDDAT128MAR-1J11AA

Micron Technology

FLASH

CMOS

MLC NAND TYPE

3.3

M29W800FB7AN3SE

Micron Technology

FLASH

AUTOMOTIVE

48

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

524288 words

3.3

16

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

8

.5 mm

125 Cel

512KX16

512K

-40 Cel

DUAL

R-PDSO-G48

3.6 V

1.2 mm

12 mm

BOTTOM

8388608 bit

2.7 V

BOTTOM BOOT BLOCK

NOR TYPE

18.4 mm

70 ns

3

MTFDDAK960MAV-1AE11ACYY

Micron Technology

FLASH

COMMERCIAL

22

DIE

RECTANGULAR

UNSPECIFIED

YES

1

CMOS

NO LEAD

UNCASED CHIP

UPPER

R-XUUC-N22

7 mm

69.85 mm

MLC NAND TYPE

100.5 mm

3.3

M29W400FT7AZA6E

Micron Technology

FLASH

INDUSTRIAL

48

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

PARALLEL

16K,8K,32K,64K

20 mA

262144 words

YES

3/3.3

16

GRID ARRAY, FINE PITCH

BGA48,6X8,32

8

Flash Memories

.8 mm

85 Cel

256KX16

256K

-40 Cel

1,2,1,7

YES

YES

BOTTOM

R-PBGA-B48

Not Qualified

TOP

4194304 bit

NOR TYPE

.0001 Amp

YES

70 ns

YES

RD48F4000L0YBQ0

Micron Technology

FLASH

OTHER

88

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

PARALLEL

16K,64K

16777216 words

1.8

NO

1.8

16

GRID ARRAY, FINE PITCH

BGA88,8X12,32

Flash Memories

.8 mm

85 Cel

16MX16

16M

-25 Cel

4,255

YES

BOTTOM

R-PBGA-B88

Not Qualified

BOTTOM

268435456 bit

4

NOR TYPE

YES

85 ns

NO

MTFDDAA050MAR-1K12AA

Micron Technology

FLASH

CMOS

MLC NAND TYPE

3.3

MTFDDAT256MAY-1AH12ABHA

Micron Technology

FLASH MODULE

COMMERCIAL

52

DIMM

RECTANGULAR

UNSPECIFIED

NO

1

CMOS

NO LEAD

SERIAL

ASYNCHRONOUS

274877906944 words

3.3

8

MICROELECTRONIC ASSEMBLY

70 Cel

256GX8

256G

0 Cel

DUAL

R-XDMA-N52

3.46 V

3.75 mm

29.85 mm

2199023255552 bit

3.14 V

MLC NAND TYPE

50.8 mm

3.3

Flash Memory

Flash memory is a type of non-volatile computer memory that is commonly used in digital devices such as USB drives, solid-state drives, and digital cameras. It is a type of EEPROM (Electrically Erasable Programmable Read-Only Memory) that allows data to be erased and reprogrammed in blocks instead of one byte at a time. Flash memory uses a floating gate transistor to store data, which allows it to retain information even when the power is turned off.

Flash memory is widely used in digital devices because of its high capacity, small size, and fast access times. It is also more durable than other types of memory, such as hard disk drives, because it has no moving parts. This makes it ideal for use in portable devices that may be subject to physical shock or vibration.

There are two types of flash memory: NOR flash and NAND flash. NOR flash is faster than NAND flash, but it has lower density and higher cost per bit. NOR flash is typically used for code storage, such as firmware or boot code, because it provides faster access times. NAND flash has higher density and lower cost per bit, which makes it ideal for data storage applications.

Flash memory has a limited lifespan, as it can only be erased and reprogrammed a limited number of times. This is because the process of erasing and reprogramming the memory causes wear and tear on the floating gate transistor. However, modern flash memory devices have a sophisticated wear-leveling algorithm that distributes writes evenly across the memory, which extends the lifespan of the device.