Samsung Flash Memory 2,400+

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Part RoHS Manufacturer Memory IC Type Temperature Grade No. of Terminals Package Code Package Shape Package Body Material Surface Mount No. of Functions Technology Screening Level Terminal Form Parallel or Serial Operating Mode Sector Size (Words) Maximum Supply Current No. of Words Input/Output Type Nominal Supply Voltage / Vsup (V) Mixed Memory Type Toggle Bit Power Supplies (V) Memory Width Package Style (Meter) Package Equivalence Code Alternate Memory Width Sub-Category Minimum Data Retention Time Terminal Pitch Maximum Operating Temperature Reverse Pinout Output Characteristics Organization No. of Words Code Minimum Operating Temperature No. of Sectors/Size Command User Interface Terminal Finish Ready or Busy Terminal Position No. of Ports Write Protection JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Supply Voltage (Vsup) Maximum Seated Height Endurance Maximum Clock Frequency (fCLK) Width Qualification Maximum Write Cycle Time (tWC) Serial Bus Type Boot Block Memory Density Minimum Supply Voltage (Vsup) Additional Features Page Size (words) JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Type Maximum Standby Current Length Common Flash Interface Maximum Access Time Programming Voltage (V) Data Polling

K8S2615EBE-DC7B0

Samsung

FLASH

COMMERCIAL

44

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

8388608 words

1.8

16

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.5 mm

70 Cel

8MX16

8M

0 Cel

BOTTOM

R-PBGA-B44

1.95 V

1 mm

Not Qualified

BOTTOM

134217728 bit

1.7 V

BOTTOM BOOT BLOCK, SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE

70 ns

1.8

K9K1208U0A-YCB0

Samsung

FLASH

COMMERCIAL

48

TSOP1

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

16K

25 mA

67108864 words

3.3

NO

3.3

8

SMALL OUTLINE, THIN PROFILE

TSSOP48,.8,20

Flash Memories

.5 mm

70 Cel

64MX8

64M

0 Cel

4K

YES

TIN LEAD

YES

DUAL

R-PDSO-G48

3.6 V

1.2 mm

12 mm

Not Qualified

536870912 bit

2.7 V

512

e0

.00005 Amp

18.4 mm

35 ns

2.7

NO

K8D6316UTM-TI08

Samsung

FLASH

INDUSTRIAL

48

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

PARALLEL

8K,64K

50 mA

4194304 words

YES

3/3.3

16

GRID ARRAY, FINE PITCH

BGA48,6X8,32

8

Flash Memories

.8 mm

85 Cel

4MX16

4M

-40 Cel

8,127

YES

YES

BOTTOM

R-PBGA-B48

Not Qualified

TOP

67108864 bit

NOR TYPE

.00003 Amp

YES

80 ns

YES

K8A5715EZC-FE1FT

Samsung

K8A6415ETB-DE7C0

Samsung

FLASH

OTHER

BGA

UNSPECIFIED

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

4194304 words

1.8

16

GRID ARRAY

85 Cel

4MX16

4M

-25 Cel

TIN SILVER COPPER

BOTTOM

X-PBGA-B

3

1.95 V

Not Qualified

67108864 bit

1.7 V

SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE

e1

260

80 ns

1.8

K8C1215EBM-DE1F0

Samsung

FLASH

OTHER

167

LFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

33554432 words

1.8

16

GRID ARRAY, LOW PROFILE, FINE PITCH

.8 mm

85 Cel

32MX16

32M

-25 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B167

2

1.95 V

1.4 mm

10.5 mm

Not Qualified

BOTTOM

536870912 bit

1.7 V

SYNCHRONOUS BURST MODE OPERATION IS ALSO POSSIBLE

e1

NOR TYPE

14 mm

110 ns

1.8

K8A6415EBC-HE7CT

Samsung

FLASH

OTHER

88

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

SYNCHRONOUS

4K,32K

70 mA

4194304 words

1.8

YES

1.8

16

GRID ARRAY, FINE PITCH

BGA88,8X12,32

Flash Memories

.8 mm

85 Cel

4MX16

4M

-25 Cel

8,127

YES

BOTTOM

R-PBGA-B88

8 mm

Not Qualified

BOTTOM

67108864 bit

8

NOR TYPE

.00005 Amp

11 mm

YES

70 ns

YES

K8S6815EBD-DC7E0

Samsung

FLASH

COMMERCIAL

44

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

4194304 words

1.8

16

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.5 mm

70 Cel

4MX16

4M

0 Cel

BOTTOM

R-PBGA-B44

1.95 V

1 mm

BOTTOM

67108864 bit

1.7 V

BOTTOM BOOT BLOCK, SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE

70 ns

1.8

K9K1G08Q0A-YCB0

Samsung

FLASH

COMMERCIAL

48

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

GULL WING

PARALLEL

16K

20 mA

134217728 words

1.8

NO

1.8

8

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP48,.8,20

Flash Memories

.5 mm

70 Cel

128MX8

128M

0 Cel

8K

YES

Tin/Lead (Sn/Pb)

YES

DUAL

R-PDSO-G48

Not Qualified

1073741824 bit

512

e0

.0001 Amp

30 ns

NO

K8S2815ETC-FE7ET

Samsung

FLASH

OTHER

44

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

PARALLEL

4K,32K

70 mA

8388608 words

1.8

YES

1.8

16

GRID ARRAY, FINE PITCH

BGA44,8X14,20

Flash Memories

.5 mm

85 Cel

8MX16

8M

-25 Cel

8, 255

YES

YES

BOTTOM

R-PBGA-B44

Not Qualified

TOP

134217728 bit

NOR TYPE

.00005 Amp

YES

70 ns

YES

K8D1716UBC-PC070

Samsung

FLASH

COMMERCIAL

48

TSOP1

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

8K,64K

50 mA

1048576 words

3

YES

3/3.3

16

SMALL OUTLINE, THIN PROFILE

TSSOP48,.8,20

8

Flash Memories

.5 mm

70 Cel

1MX16

1M

0 Cel

8,31

YES

TIN BISMUTH

YES

DUAL

R-PDSO-G48

3

3.6 V

1.2 mm

12 mm

Not Qualified

BOTTOM

16777216 bit

2.7 V

e6

NOR TYPE

.000018 Amp

18.4 mm

YES

70 ns

2.7

YES

K8C1215ETM-FE1D0

Samsung

FLASH

OTHER

167

LFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

16K,64K

70 mA

33554432 words

1.8

YES

1.8

16

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA167,12X15,32

Flash Memories

.8 mm

85 Cel

32MX16

32M

-25 Cel

4,511

YES

TIN LEAD

YES

BOTTOM

R-PBGA-B167

3

1.95 V

1.4 mm

10.5 mm

Not Qualified

TOP

536870912 bit

1.7 V

SYNCHRONOUS BURST MODE OPERATION IS ALSO POSSIBLE

e0

240

NOR TYPE

.00002 Amp

14 mm

YES

110 ns

1.8

YES

K8F5615ETM-SE1C0

Samsung

FLASH

OTHER

44

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

16K,64K

55 mA

16777216 words

1.8

YES

1.8

16

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA44,8X14,20

Flash Memories

.5 mm

85 Cel

16MX16

16M

-25 Cel

4,255

YES

TIN SILVER COPPER

YES

BOTTOM

R-PBGA-B44

2

1.95 V

1 mm

8 mm

Not Qualified

TOP

268435456 bit

1.7 V

SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE

e1

NOR TYPE

.00002 Amp

9 mm

YES

100 ns

1.8

YES

K9F4G08U0M-PCB0

Samsung

FLASH

COMMERCIAL

48

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

GULL WING

PARALLEL

128K

30 mA

536870912 words

NO

3/3.3

8

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP48,.8,20

Flash Memories

.5 mm

70 Cel

512MX8

512M

0 Cel

4K

YES

MATTE TIN

YES

DUAL

R-PDSO-G48

1

Not Qualified

4294967296 bit

2K

e3

.00005 Amp

25 ns

NO

K8A6315EBC-HC7B0

Samsung

FLASH

COMMERCIAL

88

TFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

4194304 words

1.8

16

GRID ARRAY, THIN PROFILE, FINE PITCH

.8 mm

70 Cel

4MX16

4M

0 Cel

BOTTOM

R-PBGA-B88

1.95 V

1.1 mm

8 mm

Not Qualified

BOTTOM

67108864 bit

1.7 V

BOTTOM BOOT BLOCK, SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE

11 mm

70 ns

1.8

K8A6415EBC-HC7E0

Samsung

FLASH

COMMERCIAL

88

TFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

4K,32K

70 mA

4194304 words

1.8

YES

1.8

16

GRID ARRAY, THIN PROFILE, FINE PITCH

BGA88,8X12,32

Flash Memories

.8 mm

70 Cel

4MX16

4M

0 Cel

8,127

YES

BOTTOM

R-PBGA-B88

3

1.95 V

1.1 mm

8 mm

Not Qualified

BOTTOM

67108864 bit

1.7 V

BOTTOM BOOT BLOCK, SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE

8

260

NOR TYPE

.00005 Amp

11 mm

YES

70 ns

1.8

YES

K9T1G08U0M-FIB0

Samsung

FLASH

INDUSTRIAL

48

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

GULL WING

PARALLEL

16K

20 mA

134217728 words

3.3

NO

3.3

8

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP48,.71,20

Flash Memories

.5 mm

85 Cel

128MX8

128M

-40 Cel

8K

YES

YES

DUAL

R-PDSO-G48

Not Qualified

1073741824 bit

512

.00005 Amp

45 ns

NO

K8P6415UQB-PE4BT

Samsung

FLASH

OTHER

48

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

GULL WING

PARALLEL

4K,32K

55 mA

4194304 words

YES

3/3.3

16

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP48,.8,20

Flash Memories

.5 mm

85 Cel

4MX16

4M

-25 Cel

16,126

YES

YES

DUAL

R-PDSO-G48

3

Not Qualified

BOTTOM/TOP

67108864 bit

8

260

NOR TYPE

.00003 Amp

YES

60 ns

YES

K8P6415UQB-PE4B

Samsung

FLASH

OTHER

48

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

GULL WING

PARALLEL

4K,32K

55 mA

4194304 words

YES

3/3.3

16

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP48,.8,20

Flash Memories

.5 mm

85 Cel

4MX16

4M

-25 Cel

16,126

YES

YES

DUAL

R-PDSO-G48

3

Not Qualified

BOTTOM/TOP

67108864 bit

8

260

NOR TYPE

.00003 Amp

YES

60 ns

YES

K8C1115EBM-DE1ET

Samsung

FLASH

OTHER

167

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

PARALLEL

16K,64K

70 mA

33554432 words

1.8

YES

1.8

16

GRID ARRAY, FINE PITCH

BGA167,12X15,32

Flash Memories

.8 mm

85 Cel

32MX16

32M

-25 Cel

4,511

YES

YES

BOTTOM

R-PBGA-B167

Not Qualified

BOTTOM

536870912 bit

NOR TYPE

.00002 Amp

YES

110 ns

YES

K8S3215EBF-SC7C0

Samsung

FLASH

COMMERCIAL

44

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

SYNCHRONOUS

4K,32K

70 mA

2097152 words

1.8

YES

1.8

16

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA44,8X14,20

Flash Memories

.5 mm

70 Cel

3-STATE

2MX16

2M

0 Cel

8,63

YES

YES

BOTTOM

R-PBGA-B44

3

1.95 V

1 mm

100000 Write/Erase Cycles

5 mm

Not Qualified

BOTTOM

33554432 bit

1.7 V

260

NOR TYPE

.00005 Amp

7.5 mm

YES

70 ns

1.8

YES

K8C1015ETM-FE1D0

Samsung

FLASH

OTHER

167

LFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

16K,64K

70 mA

33554432 words

1.8

YES

1.8

16

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA167,12X15,32

Flash Memories

.8 mm

85 Cel

32MX16

32M

-25 Cel

4,511

YES

YES

BOTTOM

R-PBGA-B167

3

1.95 V

1.4 mm

10.5 mm

Not Qualified

TOP

536870912 bit

1.7 V

TOP BOOT BLOCK, SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE

240

NOR TYPE

.00002 Amp

14 mm

YES

110 ns

1.8

YES

K8P3215UQB-EE4A0

Samsung

FLASH

COMMERCIAL EXTENDED

64

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

4K,32K

55 mA

2097152 words

3

YES

3/3.3

16

GRID ARRAY, THIN PROFILE

BGA64,8X8,40

Flash Memories

1 mm

85 Cel

2MX16

2M

-25 Cel

16,62

YES

YES

BOTTOM

R-PBGA-B64

3

3.6 V

1.2 mm

11 mm

Not Qualified

BOTTOM/TOP

33554432 bit

2.7 V

8

260

NOR TYPE

.00003 Amp

13 mm

YES

55 ns

2.7

YES

K8S5415ETB-FE1D0

Samsung

K8A2815EBM-TC7B

Samsung

FLASH

COMMERCIAL

64

FBGA

SQUARE

PLASTIC/EPOXY

YES

CMOS

BALL

PARALLEL

4K,32K

55 mA

8388608 words

1.8

YES

1.8

16

GRID ARRAY, FINE PITCH

BGA64,8X8,32

Flash Memories

.8 mm

70 Cel

8MX16

8M

0 Cel

8, 255

YES

Tin/Lead (Sn/Pb)

YES

BOTTOM

S-PBGA-B64

Not Qualified

BOTTOM

134217728 bit

e0

NOR TYPE

.00005 Amp

YES

90 ns

YES

K9F2G08Q0M-YIB00

Samsung

FLASH

INDUSTRIAL

48

TSOP1

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

268435456 words

1.8

8

SMALL OUTLINE, THIN PROFILE

.5 mm

85 Cel

256MX8

256M

-40 Cel

DUAL

R-PDSO-G48

1.95 V

1.2 mm

12 mm

Not Qualified

2147483648 bit

1.7 V

CONTAINS ADDITIONAL 64M BIT NAND FLASH

SLC NAND TYPE

18.4 mm

30 ns

1.8

K9F6408Q0C-HCB00

Samsung

FLASH

COMMERCIAL

48

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

8388608 words

1.8

8

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.8 mm

70 Cel

8MX8

8M

0 Cel

BOTTOM

R-PBGA-B48

1.95 V

1 mm

6 mm

Not Qualified

67108864 bit

1.7 V

CONTAINS ADDITIONAL 2M BIT SPARE MEMORY

8.5 mm

35 ns

1.8

K8D3216UTC-YC09T

Samsung

FLASH

COMMERCIAL

48

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

GULL WING

PARALLEL

8K,64K

50 mA

2097152 words

YES

3/3.3

16

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP48,.8,20

8

Flash Memories

.5 mm

70 Cel

2MX16

2M

0 Cel

8,63

YES

YES

DUAL

R-PDSO-G48

Not Qualified

TOP

33554432 bit

NOR TYPE

.000018 Amp

YES

90 ns

YES

K8C1115EBM-DC1F0

Samsung

FLASH

COMMERCIAL

167

LFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

16K,64K

70 mA

33554432 words

1.8

YES

1.8

16

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA167,12X15,32

Flash Memories

.8 mm

70 Cel

32MX16

32M

0 Cel

4,511

YES

YES

BOTTOM

R-PBGA-B167

1.95 V

1.4 mm

10.5 mm

Not Qualified

BOTTOM

536870912 bit

1.7 V

BOTTOM BOOT BLOCK, SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE

NOT SPECIFIED

NOT SPECIFIED

NOR TYPE

.00002 Amp

14 mm

YES

110 ns

1.8

YES

K8C5515ETM-FE1F0

Samsung

FLASH

OTHER

167

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

PARALLEL

16K,64K

55 mA

16777216 words

1.8

YES

1.8

16

GRID ARRAY, FINE PITCH

BGA167,12X15,32

Flash Memories

.8 mm

85 Cel

16MX16

16M

-25 Cel

4,255

YES

YES

BOTTOM

R-PBGA-B167

3

Not Qualified

TOP

268435456 bit

240

NOR TYPE

.00002 Amp

YES

100 ns

YES

K8C5515EBM-DC1E0

Samsung

FLASH

COMMERCIAL

167

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

PARALLEL

16K,64K

55 mA

16777216 words

1.8

YES

1.8

16

GRID ARRAY, FINE PITCH

BGA167,12X15,32

Flash Memories

.8 mm

70 Cel

16MX16

16M

0 Cel

4,255

YES

YES

BOTTOM

R-PBGA-B167

Not Qualified

BOTTOM

268435456 bit

NOR TYPE

.00002 Amp

YES

100 ns

YES

K8A3215ETE-FC7B0

Samsung

3

240

K8S2715ETC-DC7E0

Samsung

FLASH

COMMERCIAL

44

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

SYNCHRONOUS

70 mA

8388608 words

1.8

YES

16

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

70 Cel

3-STATE

8MX16

8M

0 Cel

NO

YES

BOTTOM

HARDWARE

R-PBGA-B44

1.95 V

100000 Write/Erase Cycles

108 MHz

TOP

134217728 bit

1.7 V

NOR TYPE

.00005 Amp

YES

70 ns

1.8

YES

K8S2815EBC-SC7E0

Samsung

FLASH

COMMERCIAL

44

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

SYNCHRONOUS/ASYNCHRONOUS

4K,32K

70 mA

8388608 words

1.8

YES

1.8

16

GRID ARRAY

BGA44,8X14,20

Flash Memories

.5 mm

70 Cel

8MX16

8M

0 Cel

8, 255

YES

YES

BOTTOM

R-PBGA-B44

3

1.95 V

Not Qualified

BOTTOM

134217728 bit

1.7 V

260

NOR TYPE

.00005 Amp

YES

70 ns

1.8

YES

K8A3215ETE-DC7B

Samsung

FLASH

COMMERCIAL

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

SYNCHRONOUS

2097152 words

1.8

16

GRID ARRAY

70 Cel

2MX16

2M

0 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B

3

1.95 V

Not Qualified

33554432 bit

1.7 V

e1

260

90 ns

1.8

K8D3216UTC-TI090

Samsung

FLASH

INDUSTRIAL

48

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

8K,64K

50 mA

2097152 words

3

YES

3/3.3

16

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA48,6X8,32

8

Flash Memories

.8 mm

85 Cel

2MX16

2M

-40 Cel

8,63

YES

YES

BOTTOM

R-PBGA-B48

3.6 V

1 mm

6 mm

Not Qualified

TOP

33554432 bit

2.7 V

30

240

NOR TYPE

.000018 Amp

8.5 mm

YES

90 ns

2.7

YES

K9WAG08U1F-SCB00

Samsung

FLASH

COMMERCIAL

48

TSOP1

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

2147483648 words

3.3

8

SMALL OUTLINE, THIN PROFILE

.5 mm

70 Cel

2GX8

2G

0 Cel

DUAL

R-PDSO-G48

3.6 V

1.2 mm

12 mm

17179869184 bit

2.7 V

SLC NAND TYPE

18.4 mm

2.7

K8A3215ETE-FE7C

Samsung

FLASH

COMMERCIAL EXTENDED

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

SYNCHRONOUS

2097152 words

1.8

16

GRID ARRAY

85 Cel

2MX16

2M

-25 Cel

TIN LEAD

BOTTOM

R-PBGA-B

3

1.95 V

Not Qualified

33554432 bit

1.7 V

e0

240

80 ns

1.8

KFM1216Q2M-DCB00

Samsung

FLASH

COMMERCIAL

48

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

33554432 words

1.8

16

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.5 mm

70 Cel

32MX16

32M

0 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B48

2

1.95 V

1 mm

9.5 mm

Not Qualified

536870912 bit

1.7 V

SYNCHRONOUS BURST OPERATION IS POSSIBLE

e1

12 mm

76 ns

1.8

K8D3216UBC-TC08

Samsung

FLASH

COMMERCIAL

48

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

PARALLEL

8K,64K

50 mA

2097152 words

YES

3/3.3

16

GRID ARRAY, FINE PITCH

BGA48,6X8,32

8

Flash Memories

.8 mm

70 Cel

2MX16

2M

0 Cel

8,63

YES

Tin/Lead (Sn/Pb)

YES

BOTTOM

R-PBGA-B48

Not Qualified

BOTTOM

33554432 bit

e0

NOR TYPE

.000018 Amp

YES

80 ns

YES

K8D3216UBCDI0800

Samsung

FLASH

INDUSTRIAL

48

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

2097152 words

3

16

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

8

.8 mm

85 Cel

2MX16

2M

-40 Cel

BOTTOM

R-PBGA-B48

3.6 V

1 mm

6 mm

Not Qualified

BOTTOM

33554432 bit

2.7 V

NOR TYPE

8.5 mm

80 ns

2.7

K8C5715EBM-FE1D0

Samsung

FLASH

OTHER

167

LFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

16K,64K

55 mA

16777216 words

1.8

YES

1.8

16

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA167,12X15,32

Flash Memories

.8 mm

85 Cel

16MX16

16M

-25 Cel

4,255

YES

TIN LEAD

YES

BOTTOM

R-PBGA-B167

1.95 V

1.4 mm

10.5 mm

Not Qualified

BOTTOM

268435456 bit

1.7 V

SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE

e0

NOR TYPE

.00002 Amp

14 mm

YES

100 ns

1.8

YES

K8S5415EBC-DC1D0

Samsung

FLASH

COMMERCIAL

44

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

55 mA

16777216 words

1.8

16

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.5 mm

70 Cel

16MX16

16M

0 Cel

BOTTOM

R-PBGA-B44

1.95 V

1 mm

6.2 mm

Not Qualified

BOTTOM

268435456 bit

1.7 V

BOTTOM BOOT BLOCK, SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE

NOR TYPE

7.7 mm

100 ns

1.8

KM29N16000ATS

Samsung

FLASH

COMMERCIAL

40

TSOP2

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

4K

50 mA

2097152 words

5

NO

5

8

SMALL OUTLINE, THIN PROFILE

TSOP40/44,.46,32

Flash Memories

10

.8 mm

70 Cel

3-STATE

2MX8

2M

0 Cel

512

YES

TIN LEAD

YES

DUAL

R-PDSO-G40

5.5 V

1.2 mm

10.16 mm

Not Qualified

16777216 bit

4.5 V

HARDWARE DATA PROTECTION; 1M PROGRAM/ERASE CYCLES; DATA RETENTION 10 YEARS; BLOCK ERASE

256

e0

SLC NAND TYPE

.0001 Amp

18.41 mm

45 ns

5

NO

K8A6415EBC-DC7E

Samsung

FLASH

COMMERCIAL

88

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

SYNCHRONOUS

4K,32K

70 mA

4194304 words

1.8

YES

1.8

16

GRID ARRAY, FINE PITCH

BGA88,8X12,32

Flash Memories

.8 mm

70 Cel

4MX16

4M

0 Cel

8,127

YES

BOTTOM

R-PBGA-B88

8 mm

Not Qualified

BOTTOM

67108864 bit

8

NOR TYPE

.00005 Amp

11 mm

YES

70 ns

YES

K8S3215EBF-DE7D0

Samsung

FLASH

OTHER

44

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

SYNCHRONOUS

4K,32K

70 mA

2097152 words

1.8

YES

1.8

16

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA44,8X14,20

Flash Memories

.5 mm

85 Cel

3-STATE

2MX16

2M

-25 Cel

8,63

YES

YES

BOTTOM

R-PBGA-B44

1.95 V

1 mm

100000 Write/Erase Cycles

5 mm

Not Qualified

BOTTOM

33554432 bit

1.7 V

NOR TYPE

.00005 Amp

7.5 mm

YES

70 ns

1.8

YES

KM29N32000T

Samsung

FLASH

COMMERCIAL

40

TSOP2

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

8K

40 mA

4194304 words

5

NO

5

8

SMALL OUTLINE, THIN PROFILE

TSOP40/44,.46,32

Flash Memories

10

.8 mm

70 Cel

3-STATE

4MX8

4M

0 Cel

512

YES

TIN LEAD

YES

DUAL

R-PDSO-G40

5.5 V

1.2 mm

10.16 mm

Not Qualified

33554432 bit

4.5 V

HARDWARE DATA PROTECTION; 1M PROGRAM/ERASE CYCLES; DATA RETENTION 10 YEARS; BLOCK ERASE

512

e0

.0001 Amp

18.41 mm

35 ns

5

NO

K8F5715EBM-SC1F0

Samsung

FLASH

COMMERCIAL

44

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

16K,64K

55 mA

16777216 words

1.8

YES

1.8

16

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA44,8X14,20

Flash Memories

.5 mm

70 Cel

16MX16

16M

0 Cel

4,255

YES

TIN SILVER COPPER

YES

BOTTOM

R-PBGA-B44

2

1.95 V

1 mm

8 mm

Not Qualified

BOTTOM

268435456 bit

1.7 V

SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE

e1

NOR TYPE

.00002 Amp

9 mm

YES

100 ns

1.8

YES

Flash Memory

Flash memory is a type of non-volatile computer memory that is commonly used in digital devices such as USB drives, solid-state drives, and digital cameras. It is a type of EEPROM (Electrically Erasable Programmable Read-Only Memory) that allows data to be erased and reprogrammed in blocks instead of one byte at a time. Flash memory uses a floating gate transistor to store data, which allows it to retain information even when the power is turned off.

Flash memory is widely used in digital devices because of its high capacity, small size, and fast access times. It is also more durable than other types of memory, such as hard disk drives, because it has no moving parts. This makes it ideal for use in portable devices that may be subject to physical shock or vibration.

There are two types of flash memory: NOR flash and NAND flash. NOR flash is faster than NAND flash, but it has lower density and higher cost per bit. NOR flash is typically used for code storage, such as firmware or boot code, because it provides faster access times. NAND flash has higher density and lower cost per bit, which makes it ideal for data storage applications.

Flash memory has a limited lifespan, as it can only be erased and reprogrammed a limited number of times. This is because the process of erasing and reprogramming the memory causes wear and tear on the floating gate transistor. However, modern flash memory devices have a sophisticated wear-leveling algorithm that distributes writes evenly across the memory, which extends the lifespan of the device.