Samsung Flash Memory 2,400+

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Part RoHS Manufacturer Memory IC Type Temperature Grade No. of Terminals Package Code Package Shape Package Body Material Surface Mount No. of Functions Technology Screening Level Terminal Form Parallel or Serial Operating Mode Sector Size (Words) Maximum Supply Current No. of Words Input/Output Type Nominal Supply Voltage / Vsup (V) Mixed Memory Type Toggle Bit Power Supplies (V) Memory Width Package Style (Meter) Package Equivalence Code Alternate Memory Width Sub-Category Minimum Data Retention Time Terminal Pitch Maximum Operating Temperature Reverse Pinout Output Characteristics Organization No. of Words Code Minimum Operating Temperature No. of Sectors/Size Command User Interface Terminal Finish Ready or Busy Terminal Position No. of Ports Write Protection JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Supply Voltage (Vsup) Maximum Seated Height Endurance Maximum Clock Frequency (fCLK) Width Qualification Maximum Write Cycle Time (tWC) Serial Bus Type Boot Block Memory Density Minimum Supply Voltage (Vsup) Additional Features Page Size (words) JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Type Maximum Standby Current Length Common Flash Interface Maximum Access Time Programming Voltage (V) Data Polling

K8S1115ETC-SC1E0

Samsung

FLASH

COMMERCIAL

64

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

16K,64K

70 mA

33554432 words

1.8

YES

1.8

16

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA64,10X14,20

Flash Memories

.5 mm

70 Cel

32MX16

32M

0 Cel

4,511

YES

YES

BOTTOM

R-PBGA-B64

1.95 V

1 mm

Not Qualified

TOP

536870912 bit

1.7 V

TOP BOOT BLOCK, SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE

260

NOR TYPE

.00003 Amp

YES

100 ns

1.8

YES

K8F5615ETM-SE1E

Samsung

FLASH

OTHER

44

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

PARALLEL

16K,64K

55 mA

16777216 words

1.8

YES

1.8

16

GRID ARRAY, FINE PITCH

BGA44,8X14,20

Flash Memories

.5 mm

85 Cel

16MX16

16M

-25 Cel

4,255

YES

YES

BOTTOM

R-PBGA-B44

Not Qualified

TOP

268435456 bit

NOR TYPE

.00002 Amp

YES

100 ns

YES

KFG2G16Q2M-DEB6S

Samsung

FLASH

OTHER

63

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

PARALLEL

64K

40 mA

134217728 words

1.8

NO

1.8

16

GRID ARRAY, FINE PITCH

BGA63,10X12,32

Flash Memories

.8 mm

85 Cel

128MX16

128M

-30 Cel

2K

YES

MATTE TIN

YES

BOTTOM

R-PBGA-B63

1

Not Qualified

2147483648 bit

1K

e3

SLC NAND TYPE

.00005 Amp

76 ns

NO

K8C1215ETM-FE1C0

Samsung

FLASH

OTHER

167

LFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

16K,64K

70 mA

33554432 words

1.8

YES

1.8

16

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA167,12X15,32

Flash Memories

.8 mm

85 Cel

32MX16

32M

-25 Cel

4,511

YES

TIN LEAD

YES

BOTTOM

R-PBGA-B167

3

1.95 V

1.4 mm

10.5 mm

Not Qualified

TOP

536870912 bit

1.7 V

SYNCHRONOUS BURST MODE OPERATION IS ALSO POSSIBLE

e0

240

NOR TYPE

.00002 Amp

14 mm

YES

110 ns

1.8

YES

KFKAGH6Q4M-DEB6T

Samsung

FLASH

OTHER

63

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

PARALLEL

256K

35 mA

1073741824 words

1.8

YES

1.8

16

GRID ARRAY, FINE PITCH

BGA63,10X12,32

Flash Memories

.8 mm

85 Cel

1GX16

1G

-30 Cel

4K

YES

YES

BOTTOM

R-PBGA-B63

Not Qualified

17179869184 bit

2K

MLC NAND TYPE

.0001 Amp

76 ns

NO

K8D3216UBCPI0800

Samsung

FLASH

INDUSTRIAL

48

TSOP1

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

2097152 words

3

16

SMALL OUTLINE, THIN PROFILE

8

.5 mm

85 Cel

2MX16

2M

-40 Cel

DUAL

R-PDSO-G48

3.6 V

1.2 mm

12 mm

Not Qualified

BOTTOM

33554432 bit

2.7 V

NOR TYPE

18.4 mm

80 ns

2.7

K8P3315UQB-DI4C0

Samsung

FLASH

INDUSTRIAL

48

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

PARALLEL

4K,32K

55 mA

2097152 words

YES

3/3.3

16

GRID ARRAY, FINE PITCH

BGA48,6X8,32

Flash Memories

.8 mm

85 Cel

2MX16

2M

-40 Cel

16,62

YES

YES

BOTTOM

R-PBGA-B48

Not Qualified

BOTTOM/TOP

33554432 bit

8

NOR TYPE

.00003 Amp

YES

65 ns

YES

K8A5715EZC-SC1ET

Samsung

K8A2815EBB-FE7B0

Samsung

3

240

K8S2615ETE-DC7B0

Samsung

FLASH

COMMERCIAL

44

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

8388608 words

1.8

16

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.5 mm

70 Cel

8MX16

8M

0 Cel

BOTTOM

R-PBGA-B44

1.95 V

1 mm

Not Qualified

TOP

134217728 bit

1.7 V

TOP BOOT BLOCK, SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE

260

70 ns

1.8

K8F5615ETM-FE1DT

Samsung

FLASH

OTHER

88

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

PARALLEL

16K,64K

55 mA

16777216 words

1.8

YES

1.8

16

GRID ARRAY, FINE PITCH

BGA88,8X12,32

Flash Memories

.8 mm

85 Cel

16MX16

16M

-25 Cel

4,255

YES

YES

BOTTOM

R-PBGA-B88

Not Qualified

TOP

268435456 bit

NOR TYPE

.00002 Amp

YES

100 ns

YES

K9K1208Q0C-HIB00

Samsung

FLASH

INDUSTRIAL

63

TFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

67108864 words

1.8

8

GRID ARRAY, THIN PROFILE, FINE PITCH

.8 mm

85 Cel

64MX8

64M

-40 Cel

BOTTOM

R-PBGA-B63

1.95 V

1.2 mm

9 mm

Not Qualified

536870912 bit

1.7 V

CONTAINS ADDITIONAL 16M BIT NAND FLASH

11 mm

30 ns

1.8

K8S1315EBC-DC1C0

Samsung

FLASH

COMMERCIAL

64

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

33554432 words

1.8

16

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.5 mm

70 Cel

32MX16

32M

0 Cel

BOTTOM

R-PBGA-B64

1.95 V

1 mm

BOTTOM

536870912 bit

1.7 V

BOTTOM BOOT BLOCK, SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE

NOR TYPE

100 ns

1.8

K8C1015ETM-DC1C0

Samsung

FLASH

COMMERCIAL

167

LFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

16K,64K

70 mA

33554432 words

1.8

YES

1.8

16

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA167,12X15,32

Flash Memories

.8 mm

70 Cel

32MX16

32M

0 Cel

4,511

YES

YES

BOTTOM

R-PBGA-B167

3

1.95 V

1.4 mm

10.5 mm

Not Qualified

TOP

536870912 bit

1.7 V

TOP BOOT BLOCK, SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE

260

NOR TYPE

.00002 Amp

14 mm

YES

110 ns

1.8

YES

K8S2815EBC-FC7E0

Samsung

FLASH

COMMERCIAL

44

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

SYNCHRONOUS/ASYNCHRONOUS

4K,32K

70 mA

8388608 words

1.8

YES

1.8

16

GRID ARRAY

BGA44,8X14,20

Flash Memories

.5 mm

70 Cel

8MX16

8M

0 Cel

8, 255

YES

YES

BOTTOM

R-PBGA-B44

1

1.95 V

Not Qualified

BOTTOM

134217728 bit

1.7 V

NOR TYPE

.00005 Amp

YES

70 ns

1.8

YES

K8S2615ETC-SE7E0

Samsung

FLASH

OTHER

44

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

SYNCHRONOUS

70 mA

8388608 words

1.8

YES

16

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

85 Cel

3-STATE

8MX16

8M

-25 Cel

NO

YES

BOTTOM

HARDWARE

R-PBGA-B44

1.95 V

100000 Write/Erase Cycles

108 MHz

TOP

134217728 bit

1.7 V

NOR TYPE

.00005 Amp

YES

70 ns

1.8

YES

K8P2815UQC-QI4C0

Samsung

FLASH

INDUSTRIAL

56

TSOP1

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

4K,32K

55 mA

8388608 words

3

YES

3/3.3

16

SMALL OUTLINE, THIN PROFILE

TSSOP56,.8,20

Flash Memories

.5 mm

85 Cel

8MX16

8M

-40 Cel

16,254

YES

YES

DUAL

R-PDSO-G56

3.6 V

1.2 mm

14 mm

Not Qualified

BOTTOM/TOP

134217728 bit

2.7 V

BOTTOM BOOT BLOCK, TOP BOOT BLOCK

8

260

NOR TYPE

.00003 Amp

18.4 mm

YES

65 ns

3

YES

K8A6315EBC-HE7B0

Samsung

FLASH

OTHER

88

TFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

4194304 words

1.8

16

GRID ARRAY, THIN PROFILE, FINE PITCH

.8 mm

85 Cel

4MX16

4M

-25 Cel

BOTTOM

R-PBGA-B88

1.95 V

1.1 mm

8 mm

Not Qualified

BOTTOM

67108864 bit

1.7 V

BOTTOM BOOT BLOCK, SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE

11 mm

70 ns

1.8

K8F5715ETM-DE1DT

Samsung

FLASH

OTHER

88

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

PARALLEL

16K,64K

55 mA

16777216 words

1.8

YES

1.8

16

GRID ARRAY, FINE PITCH

BGA88,8X12,32

Flash Memories

.8 mm

85 Cel

16MX16

16M

-25 Cel

4,255

YES

YES

BOTTOM

R-PBGA-B88

Not Qualified

TOP

268435456 bit

NOR TYPE

.00002 Amp

YES

100 ns

YES

K8A6415EBC-SC7B

Samsung

FLASH

COMMERCIAL

88

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

SYNCHRONOUS

4K,32K

70 mA

4194304 words

1.8

YES

1.8

16

GRID ARRAY, FINE PITCH

BGA88,8X12,32

Flash Memories

.8 mm

70 Cel

4MX16

4M

0 Cel

8,127

YES

BOTTOM

R-PBGA-B88

8 mm

Not Qualified

BOTTOM

67108864 bit

8

NOR TYPE

.00005 Amp

11 mm

YES

70 ns

YES

K8S5715ETB-FC1F0

Samsung

K9K1208U0C-JIB00

Samsung

FLASH

INDUSTRIAL

63

TFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

16K

40 mA

67108864 words

3.3

NO

3.3

8

GRID ARRAY, THIN PROFILE, FINE PITCH

BGA63,10X12,32

Flash Memories

.8 mm

85 Cel

64MX8

64M

-40 Cel

4K

YES

YES

BOTTOM

R-PBGA-B63

3

3.6 V

1.2 mm

9 mm

Not Qualified

536870912 bit

2.7 V

512

260

.00005 Amp

11 mm

30 ns

2.7

NO

KM28N800T-T7

Samsung

FLASH

COMMERCIAL

48

TSOP1

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

1048576 words

5

8

SMALL OUTLINE, THIN PROFILE

16

.5 mm

70 Cel

1MX8

1M

0 Cel

DUAL

R-PDSO-G48

5.5 V

1.2 mm

12 mm

Not Qualified

8388608 bit

4.5 V

NOR TYPE

18.4 mm

70 ns

5

KFG2816Q1M-DEB000

Samsung

FLASH

OTHER

67

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

8388608 words

1.8

16

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.8 mm

85 Cel

8MX16

8M

-30 Cel

BOTTOM

R-PBGA-B67

1.95 V

1 mm

7 mm

Not Qualified

134217728 bit

1.7 V

SYNCHRONOUS BURST OPERATION IS POSSIBLE

9 mm

76 ns

1.8

K8F5715EBM-SC1FT

Samsung

FLASH

COMMERCIAL

44

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

PARALLEL

16K,64K

55 mA

16777216 words

1.8

YES

1.8

16

GRID ARRAY, FINE PITCH

BGA44,8X14,20

Flash Memories

.5 mm

70 Cel

16MX16

16M

0 Cel

4,255

YES

YES

BOTTOM

R-PBGA-B44

Not Qualified

BOTTOM

268435456 bit

NOR TYPE

.00002 Amp

YES

100 ns

YES

K8F5615ETM-DC1D

Samsung

FLASH

COMMERCIAL

88

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

PARALLEL

16K,64K

55 mA

16777216 words

1.8

YES

1.8

16

GRID ARRAY, FINE PITCH

BGA88,8X12,32

Flash Memories

.8 mm

70 Cel

16MX16

16M

0 Cel

4,255

YES

YES

BOTTOM

R-PBGA-B88

Not Qualified

TOP

268435456 bit

NOR TYPE

.00002 Amp

YES

100 ns

YES

K9K2G08U0A-PIB0

Samsung

FLASH

INDUSTRIAL

48

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

GULL WING

PARALLEL

128K

30 mA

268435456 words

3.3

NO

3.3

8

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP48,.8,20

Flash Memories

.5 mm

85 Cel

256MX8

256M

-40 Cel

2K

YES

YES

DUAL

R-PDSO-G48

Not Qualified

2147483648 bit

2K

.0001 Amp

30 ns

NO

K8S3215EBE-DC7BT

Samsung

FLASH

COMMERCIAL

44

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

PARALLEL

4K,32K

70 mA

2097152 words

1.8

YES

1.8

16

GRID ARRAY, FINE PITCH

BGA44,8X14,20

Flash Memories

.5 mm

70 Cel

2MX16

2M

0 Cel

8,63

YES

YES

BOTTOM

R-PBGA-B44

Not Qualified

BOTTOM

33554432 bit

NOR TYPE

.00005 Amp

YES

90 ns

YES

K8S5515EBC-FC1F0

Samsung

FLASH

COMMERCIAL

44

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

55 mA

16777216 words

1.8

16

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.5 mm

70 Cel

16MX16

16M

0 Cel

BOTTOM

R-PBGA-B44

1.95 V

1 mm

6.2 mm

Not Qualified

BOTTOM

268435456 bit

1.7 V

BOTTOM BOOT BLOCK, SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE

NOR TYPE

7.7 mm

100 ns

1.8

K8P3315UQB-EC4D0

Samsung

FLASH

COMMERCIAL

64

BGA

SQUARE

PLASTIC/EPOXY

YES

CMOS

BALL

PARALLEL

4K,32K

55 mA

2097152 words

YES

3/3.3

16

GRID ARRAY

BGA64,8X8,40

Flash Memories

1 mm

70 Cel

2MX16

2M

0 Cel

16,62

YES

YES

BOTTOM

S-PBGA-B64

Not Qualified

BOTTOM/TOP

33554432 bit

8

NOR TYPE

.00003 Amp

YES

70 ns

YES

SMFV032

Samsung

FLASH CARD

COMMERCIAL

22

UNSPECIFIED

UNSPECIFIED

NO

1

CMOS

UNSPECIFIED

PARALLEL

ASYNCHRONOUS

33554432 words

3.3

8

MICROELECTRONIC ASSEMBLY

10

55 Cel

32MX8

32M

0 Cel

UNSPECIFIED

X-XXMA-X22

3.6 V

Not Qualified

268435456 bit

2.7 V

HARDWARE DATA PROTECTION; DATA RETENTION 10 YEARS; 1M PROGRAM/ERASE CYCLES

35 ns

3

K8S5615EZC-DE1F0

Samsung

FLASH

OTHER

44

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

55 mA

16777216 words

1.8

16

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.5 mm

85 Cel

16MX16

16M

-25 Cel

BOTTOM

R-PBGA-B44

1.95 V

1 mm

6.2 mm

Not Qualified

BOTTOM/TOP

268435456 bit

1.7 V

SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE

NOR TYPE

7.7 mm

100 ns

1.8

K8A6215ETC-FC7E0

Samsung

FLASH

COMMERCIAL

88

TFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

4194304 words

1.8

16

GRID ARRAY, THIN PROFILE, FINE PITCH

.8 mm

70 Cel

4MX16

4M

0 Cel

BOTTOM

R-PBGA-B88

1.95 V

1.1 mm

8 mm

Not Qualified

TOP

67108864 bit

1.7 V

TOP BOOT BLOCK, SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE

11 mm

70 ns

1.8

K8S5415ETB-SC1CT

Samsung

K8P3315UQB-PC4D0

Samsung

FLASH

COMMERCIAL

48

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

GULL WING

PARALLEL

4K,32K

55 mA

2097152 words

YES

3/3.3

16

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP48,.8,20

Flash Memories

.5 mm

70 Cel

2MX16

2M

0 Cel

16,62

YES

YES

DUAL

R-PDSO-G48

Not Qualified

BOTTOM/TOP

33554432 bit

8

NOR TYPE

.00003 Amp

YES

70 ns

YES

K9K2G08Q0M-PIB00

Samsung

FLASH

INDUSTRIAL

48

TSOP1

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

268435456 words

1.8

8

SMALL OUTLINE, THIN PROFILE

.5 mm

85 Cel

256MX8

256M

-40 Cel

DUAL

R-PDSO-G48

1.95 V

1.2 mm

12 mm

Not Qualified

2147483648 bit

1.7 V

CONTAINS ADDITIONAL 64M BIT NAND FLASH

NOT SPECIFIED

260

SLC NAND TYPE

18.4 mm

30 ns

1.8

K8S2815ETC-FC7BT

Samsung

FLASH

COMMERCIAL

44

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

PARALLEL

4K,32K

70 mA

8388608 words

1.8

YES

1.8

16

GRID ARRAY, FINE PITCH

BGA44,8X14,20

Flash Memories

.5 mm

70 Cel

8MX16

8M

0 Cel

8, 255

YES

YES

BOTTOM

R-PBGA-B44

Not Qualified

TOP

134217728 bit

NOR TYPE

.00005 Amp

YES

70 ns

YES

K8F5615EBM-DC1FT

Samsung

FLASH

COMMERCIAL

88

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

PARALLEL

16K,64K

55 mA

16777216 words

1.8

YES

1.8

16

GRID ARRAY, FINE PITCH

BGA88,8X12,32

Flash Memories

.8 mm

70 Cel

16MX16

16M

0 Cel

4,255

YES

YES

BOTTOM

R-PBGA-B88

Not Qualified

BOTTOM

268435456 bit

NOR TYPE

.00002 Amp

YES

100 ns

YES

K8F5715ETM-SC1C

Samsung

FLASH

COMMERCIAL

44

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

PARALLEL

16K,64K

55 mA

16777216 words

1.8

YES

1.8

16

GRID ARRAY, FINE PITCH

BGA44,8X14,20

Flash Memories

.5 mm

70 Cel

16MX16

16M

0 Cel

4,255

YES

YES

BOTTOM

R-PBGA-B44

Not Qualified

TOP

268435456 bit

NOR TYPE

.00002 Amp

YES

100 ns

YES

K8A6215ETC-FC7D0

Samsung

FLASH

COMMERCIAL

88

TFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

4194304 words

1.8

16

GRID ARRAY, THIN PROFILE, FINE PITCH

.8 mm

70 Cel

4MX16

4M

0 Cel

BOTTOM

R-PBGA-B88

1.95 V

1.1 mm

8 mm

Not Qualified

TOP

67108864 bit

1.7 V

TOP BOOT BLOCK, SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE

11 mm

70 ns

1.8

K8D6316UTM-TC080

Samsung

FLASH

COMMERCIAL

48

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

8K,64K

50 mA

4194304 words

3

YES

3/3.3

16

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA48,6X8,32

8

Flash Memories

.8 mm

70 Cel

4MX16

4M

0 Cel

8,127

YES

TIN LEAD

YES

BOTTOM

R-PBGA-B48

3.6 V

1 mm

6 mm

Not Qualified

TOP

67108864 bit

2.7 V

e0

NOR TYPE

.00003 Amp

9 mm

YES

80 ns

2.7

YES

MZ5PA064HMCD-01000

Samsung

FLASH MODULE

1

CMOS

68719476736 words

8

MICROELECTRONIC ASSEMBLY

64GX8

64G

549755813888 bit

MLC NAND TYPE

K9QCG08U5A-9IB0

Samsung

FLASH

INDUSTRIAL

56

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

GULL WING

PARALLEL

256K

30 mA

8589934592 words

3.3

NO

3.3

8

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP56,.63,20

Flash Memories

.5 mm

85 Cel

8GX8

8G

-40 Cel

32K

YES

YES

DUAL

R-PDSO-G56

Not Qualified

65536 bit

4K

.0001 Amp

20 ns

NO

K8A3215EBE-DC7C0

Samsung

K9K1G08U0A-VCB0

Samsung

FLASH

COMMERCIAL

48

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

GULL WING

PARALLEL

16K

30 mA

134217728 words

3.3

NO

3.3

8

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP48,.71,20

Flash Memories

.5 mm

70 Cel

128MX8

128M

0 Cel

8K

YES

Tin/Lead (Sn/Pb)

YES

DUAL

R-PDSO-G48

Not Qualified

1073741824 bit

512

e0

.00005 Amp

30 ns

NO

K9S2808V0A-SSB0

Samsung

FLASH CARD

COMMERCIAL

22

UNSPECIFIED

UNSPECIFIED

NO

1

CMOS

UNSPECIFIED

PARALLEL

ASYNCHRONOUS

16777216 words

3.3

8

MICROELECTRONIC ASSEMBLY

55 Cel

16MX8

16M

0 Cel

UNSPECIFIED

X-XXMA-X22

3.6 V

Not Qualified

134217728 bit

2.7 V

35 ns

2.7

MZ-M6E1T0BW

Samsung

FLASH MODULE

COMMERCIAL

RECTANGULAR

UNSPECIFIED

YES

1

CMOS

NO LEAD

ASYNCHRONOUS

1099511627776 words

8

MICROELECTRONIC ASSEMBLY

70 Cel

1TX8

1T

0 Cel

UNSPECIFIED

R-XXMA-N

8796093022208 bit

MLC NAND TYPE

K8S6615EBD-HE7E0

Samsung

FLASH

OTHER

44

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

4194304 words

1.8

16

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.5 mm

85 Cel

4MX16

4M

-25 Cel

BOTTOM

R-PBGA-B44

1.95 V

1 mm

BOTTOM

67108864 bit

1.7 V

BOTTOM BOOT BLOCK, SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE

70 ns

1.8

Flash Memory

Flash memory is a type of non-volatile computer memory that is commonly used in digital devices such as USB drives, solid-state drives, and digital cameras. It is a type of EEPROM (Electrically Erasable Programmable Read-Only Memory) that allows data to be erased and reprogrammed in blocks instead of one byte at a time. Flash memory uses a floating gate transistor to store data, which allows it to retain information even when the power is turned off.

Flash memory is widely used in digital devices because of its high capacity, small size, and fast access times. It is also more durable than other types of memory, such as hard disk drives, because it has no moving parts. This makes it ideal for use in portable devices that may be subject to physical shock or vibration.

There are two types of flash memory: NOR flash and NAND flash. NOR flash is faster than NAND flash, but it has lower density and higher cost per bit. NOR flash is typically used for code storage, such as firmware or boot code, because it provides faster access times. NAND flash has higher density and lower cost per bit, which makes it ideal for data storage applications.

Flash memory has a limited lifespan, as it can only be erased and reprogrammed a limited number of times. This is because the process of erasing and reprogramming the memory causes wear and tear on the floating gate transistor. However, modern flash memory devices have a sophisticated wear-leveling algorithm that distributes writes evenly across the memory, which extends the lifespan of the device.