Samsung Flash Memory 2,400+

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Part RoHS Manufacturer Memory IC Type Temperature Grade No. of Terminals Package Code Package Shape Package Body Material Surface Mount No. of Functions Technology Screening Level Terminal Form Parallel or Serial Operating Mode Sector Size (Words) Maximum Supply Current No. of Words Input/Output Type Nominal Supply Voltage / Vsup (V) Mixed Memory Type Toggle Bit Power Supplies (V) Memory Width Package Style (Meter) Package Equivalence Code Alternate Memory Width Sub-Category Minimum Data Retention Time Terminal Pitch Maximum Operating Temperature Reverse Pinout Output Characteristics Organization No. of Words Code Minimum Operating Temperature No. of Sectors/Size Command User Interface Terminal Finish Ready or Busy Terminal Position No. of Ports Write Protection JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Supply Voltage (Vsup) Maximum Seated Height Endurance Maximum Clock Frequency (fCLK) Width Qualification Maximum Write Cycle Time (tWC) Serial Bus Type Boot Block Memory Density Minimum Supply Voltage (Vsup) Additional Features Page Size (words) JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Type Maximum Standby Current Length Common Flash Interface Maximum Access Time Programming Voltage (V) Data Polling

K8P2915UQB-DC4C0

Samsung

FLASH

COMMERCIAL

80

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

SYNCHRONOUS

4K,32K

55 mA

8388608 words

YES

3/3.3

16

GRID ARRAY

BGA80,8X12,32

Flash Memories

.8 mm

70 Cel

8MX16

8M

0 Cel

16,254

YES

YES

BOTTOM

R-PBGA-B80

3

3.6 V

Not Qualified

BOTTOM/TOP

134217728 bit

2.7 V

8

260

NOR TYPE

.00003 Amp

YES

65 ns

2.7

YES

K9W8G08U1M-YCB0T

Samsung

FLASH

COMMERCIAL

48

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

GULL WING

PARALLEL

128K

30 mA

1073741824 words

NO

3/3.3

8

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP48,.8,20

Flash Memories

.5 mm

70 Cel

1GX8

1G

0 Cel

8K

YES

YES

DUAL

R-PDSO-G48

1

Not Qualified

8589934592 bit

2K

.0001 Amp

NO

K8D1716UBC-FI09

Samsung

FLASH

INDUSTRIAL

48

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

8K,64K

50 mA

1048576 words

3

YES

3/3.3

16

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA48,6X8,32

8

Flash Memories

.8 mm

85 Cel

1MX16

1M

-40 Cel

8,31

YES

YES

BOTTOM

R-PBGA-B48

1

3.6 V

1 mm

6 mm

Not Qualified

BOTTOM

16777216 bit

2.7 V

NOR TYPE

.000018 Amp

8.5 mm

YES

90 ns

3

YES

K8C5515EBM-FC1C0

Samsung

FLASH

COMMERCIAL

167

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

PARALLEL

16K,64K

55 mA

16777216 words

1.8

YES

1.8

16

GRID ARRAY, FINE PITCH

BGA167,12X15,32

Flash Memories

.8 mm

70 Cel

16MX16

16M

0 Cel

4,255

YES

YES

BOTTOM

R-PBGA-B167

3

Not Qualified

BOTTOM

268435456 bit

240

NOR TYPE

.00002 Amp

YES

100 ns

YES

K8C5515EBM-FC1ET

Samsung

FLASH

COMMERCIAL

167

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

PARALLEL

16K,64K

55 mA

16777216 words

1.8

YES

1.8

16

GRID ARRAY, FINE PITCH

BGA167,12X15,32

Flash Memories

.8 mm

70 Cel

16MX16

16M

0 Cel

4,255

YES

YES

BOTTOM

R-PBGA-B167

3

Not Qualified

BOTTOM

268435456 bit

240

NOR TYPE

.00002 Amp

YES

100 ns

YES

K9K1208D0C-GCB0T

Samsung

FLASH

COMMERCIAL

63

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

PARALLEL

16K

20 mA

67108864 words

2.65

NO

2.65

8

GRID ARRAY, FINE PITCH

BGA63,10X12,32

Flash Memories

.8 mm

70 Cel

64MX8

64M

0 Cel

4K

YES

YES

BOTTOM

R-PBGA-B63

1

Not Qualified

536870912 bit

512

.00005 Amp

30 ns

NO

K9F2808U0C-PIB0T

Samsung

FLASH

INDUSTRIAL

48

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

GULL WING

PARALLEL

16K

20 mA

16777216 words

3.3

NO

3.3

8

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP48,.8,20

Flash Memories

.5 mm

85 Cel

16MX8

16M

-40 Cel

1K

YES

MATTE TIN

YES

DUAL

R-PDSO-G48

1

Not Qualified

134217728 bit

512

e3

SLC NAND TYPE

.00005 Amp

30 ns

NO

K9S6408V0M-SSB0

Samsung

FLASH CARD

COMMERCIAL

22

UNSPECIFIED

UNSPECIFIED

NO

1

CMOS

UNSPECIFIED

PARALLEL

ASYNCHRONOUS

8388608 words

3.3

8

MICROELECTRONIC ASSEMBLY

10

55 Cel

8MX8

8M

0 Cel

UNSPECIFIED

X-XXMA-X22

3.6 V

Not Qualified

67108864 bit

2.7 V

HARDWARE DATA PROTECTION; DATA RETENTION 10 YEARS

2.7

K8D6316UBM-PI090

Samsung

FLASH

INDUSTRIAL

48

TSOP1

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

8K,64K

50 mA

4194304 words

3

YES

3/3.3

16

SMALL OUTLINE, THIN PROFILE

TSSOP56,.8,20

8

Flash Memories

.5 mm

85 Cel

4MX16

4M

-40 Cel

8,127

YES

YES

DUAL

R-PDSO-G48

2

3.6 V

1.2 mm

12 mm

Not Qualified

BOTTOM

67108864 bit

2.7 V

NOR TYPE

.00003 Amp

18.4 mm

YES

90 ns

2.7

YES

K8D3216UTC-YI09T

Samsung

FLASH

INDUSTRIAL

48

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

GULL WING

PARALLEL

8K,64K

50 mA

2097152 words

YES

3/3.3

16

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP48,.8,20

8

Flash Memories

.5 mm

85 Cel

2MX16

2M

-40 Cel

8,63

YES

YES

DUAL

R-PDSO-G48

Not Qualified

TOP

33554432 bit

NOR TYPE

.000018 Amp

YES

90 ns

YES

KFM1G16Q2A-DEB80

Samsung

FLASH

OTHER

63

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

64K

45 mA

67108864 words

1.8

YES

1.8

16

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA63,10X12,32

Flash Memories

.8 mm

85 Cel

64MX16

64M

-30 Cel

1K

YES

TIN SILVER COPPER

YES

BOTTOM

R-PBGA-B63

3

1.95 V

1 mm

10 mm

Not Qualified

1073741824 bit

1.7 V

SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE

1K

e1

260

SLC NAND TYPE

.00005 Amp

13 mm

76 ns

1.8

NO

K8P1615UQB-PI4C000

Samsung

FLASH

INDUSTRIAL

48

TSOP1

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

1048576 words

3

16

SMALL OUTLINE, THIN PROFILE

.5 mm

85 Cel

1MX16

1M

-40 Cel

DUAL

R-PDSO-G48

3.6 V

1.2 mm

12 mm

Not Qualified

BOTTOM/TOP

16777216 bit

2.7 V

NOR TYPE

18.4 mm

65 ns

2.7

K8P2915UQB-DC4BT

Samsung

FLASH

COMMERCIAL

80

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

PARALLEL

4K,32K

55 mA

8388608 words

YES

3/3.3

16

GRID ARRAY, FINE PITCH

BGA80,8X12,32

Flash Memories

.8 mm

70 Cel

8MX16

8M

0 Cel

16,254

YES

YES

BOTTOM

R-PBGA-B80

Not Qualified

BOTTOM/TOP

134217728 bit

8

NOR TYPE

.00003 Amp

YES

60 ns

YES

K8F1315ETM-FE1E

Samsung

FLASH

OTHER

64

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

PARALLEL

16K,64K

55 mA

33554432 words

1.8

YES

1.8

16

GRID ARRAY, FINE PITCH

BGA64,10X14,20

Flash Memories

.5 mm

85 Cel

32MX16

32M

-25 Cel

4,511

YES

YES

BOTTOM

R-PBGA-B64

Not Qualified

TOP

536870912 bit

NOR TYPE

.00002 Amp

YES

110 ns

YES

K8S5515EZC-SC1E0

Samsung

FLASH

COMMERCIAL

44

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

55 mA

16777216 words

1.8

16

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.5 mm

70 Cel

16MX16

16M

0 Cel

BOTTOM

R-PBGA-B44

1.95 V

1 mm

6.2 mm

Not Qualified

BOTTOM/TOP

268435456 bit

1.7 V

SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE

NOR TYPE

7.7 mm

100 ns

1.8

K9F2808U0C-VCB0

Samsung

FLASH

COMMERCIAL

48

VSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

16K

20 mA

16777216 words

3.3

NO

3.3

8

SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

TSSOP48,.71,20

Flash Memories

.5 mm

70 Cel

16MX8

16M

0 Cel

1K

YES

TIN LEAD

YES

DUAL

R-PDSO-G48

3.6 V

.7 mm

12 mm

Not Qualified

134217728 bit

2.7 V

CONTAINS ADDITIONAL 4M BIT NAND FLASH

512

e0

SLC NAND TYPE

.00005 Amp

15.4 mm

30 ns

2.7

NO

K8S1315EBC-SE1F0

Samsung

FLASH

OTHER

64

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

16K,64K

70 mA

33554432 words

1.8

YES

1.8

16

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA64,10X14,20

Flash Memories

.5 mm

85 Cel

32MX16

32M

-25 Cel

4,511

YES

YES

BOTTOM

R-PBGA-B64

1.95 V

1 mm

Not Qualified

BOTTOM

536870912 bit

1.7 V

BOTTOM BOOT BLOCK, SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE

NOT SPECIFIED

NOT SPECIFIED

NOR TYPE

.00003 Amp

YES

100 ns

1.8

YES

K9F2808Q0B-DIB00

Samsung

FLASH

INDUSTRIAL

63

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

16777216 words

1.8

8

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.8 mm

85 Cel

16MX8

16M

-40 Cel

BOTTOM

R-PBGA-B63

1.95 V

1 mm

9 mm

Not Qualified

134217728 bit

1.7 V

CONTAINS ADDITIONAL 4M BIT SPARE MEMORY

SLC NAND TYPE

11 mm

45 ns

1.8

K8F1315ETM-FE1D0

Samsung

FLASH

OTHER

64

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

33554432 words

1.8

16

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.5 mm

85 Cel

32MX16

32M

-25 Cel

TIN LEAD

BOTTOM

R-PBGA-B64

1.95 V

1 mm

9 mm

Not Qualified

TOP

536870912 bit

1.7 V

SYNCHRONOUS BURST MODE OPERATION IS ALSO POSSIBLE

e0

NOR TYPE

11 mm

110 ns

1.8

K8P6415UQB-EE4C

Samsung

FLASH

OTHER

64

BGA

SQUARE

PLASTIC/EPOXY

YES

CMOS

BALL

PARALLEL

4K,32K

55 mA

4194304 words

YES

3/3.3

16

GRID ARRAY

BGA64,8X8,40

Flash Memories

1 mm

85 Cel

4MX16

4M

-25 Cel

16,126

YES

YES

BOTTOM

S-PBGA-B64

3

Not Qualified

BOTTOM/TOP

67108864 bit

8

260

NOR TYPE

.00003 Amp

YES

65 ns

YES

K8F5715EBM-DE1F

Samsung

FLASH

OTHER

88

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

PARALLEL

16K,64K

55 mA

16777216 words

1.8

YES

1.8

16

GRID ARRAY, FINE PITCH

BGA88,8X12,32

Flash Memories

.8 mm

85 Cel

16MX16

16M

-25 Cel

4,255

YES

YES

BOTTOM

R-PBGA-B88

Not Qualified

BOTTOM

268435456 bit

NOR TYPE

.00002 Amp

YES

100 ns

YES

K8A6415EBC-FC7D

Samsung

FLASH

COMMERCIAL

88

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

SYNCHRONOUS

4K,32K

70 mA

4194304 words

1.8

YES

1.8

16

GRID ARRAY, FINE PITCH

BGA88,8X12,32

Flash Memories

.8 mm

70 Cel

4MX16

4M

0 Cel

8,127

YES

BOTTOM

R-PBGA-B88

8 mm

Not Qualified

BOTTOM

67108864 bit

8

NOR TYPE

.00005 Amp

11 mm

YES

70 ns

YES

K8S5515ETC-SC1D0

Samsung

FLASH

COMMERCIAL

44

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

16777216 words

1.8

16

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.5 mm

70 Cel

16MX16

16M

0 Cel

BOTTOM

R-PBGA-B44

1.95 V

1 mm

Not Qualified

TOP

268435456 bit

1.7 V

TOP BOOT BLOCK, SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE

NOR TYPE

100 ns

1.8

K9F3208U0B-TIB0

Samsung

FLASH

INDUSTRIAL

40

TSOP2

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

4194304 words

3.3

8

SMALL OUTLINE, THIN PROFILE

.8 mm

85 Cel

4MX8

4M

-40 Cel

DUAL

R-PDSO-G40

3.6 V

1.2 mm

10.16 mm

Not Qualified

33554432 bit

2.7 V

18.41 mm

35 ns

2.7

K8S2815EBC-DC7CT

Samsung

FLASH

COMMERCIAL

44

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

PARALLEL

4K,32K

70 mA

8388608 words

1.8

YES

1.8

16

GRID ARRAY, FINE PITCH

BGA44,8X14,20

Flash Memories

.5 mm

70 Cel

8MX16

8M

0 Cel

8, 255

YES

YES

BOTTOM

R-PBGA-B44

Not Qualified

BOTTOM

134217728 bit

NOR TYPE

.00005 Amp

YES

70 ns

YES

K9K1G16U0A-JCB0

Samsung

FLASH

COMMERCIAL

63

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

PARALLEL

8K

30 mA

67108864 words

3.3

NO

3.3

16

GRID ARRAY, FINE PITCH

BGA63,10X12,32

Flash Memories

.8 mm

70 Cel

64MX16

64M

0 Cel

8K

YES

YES

BOTTOM

R-PBGA-B63

Not Qualified

1073741824 bit

256

.0001 Amp

30 ns

NO

K8S5715EZB-FE1ET

Samsung

K8S5715EBC-SE1C0

Samsung

FLASH

OTHER

44

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

55 mA

16777216 words

1.8

16

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.5 mm

85 Cel

16MX16

16M

-25 Cel

BOTTOM

R-PBGA-B44

1.95 V

1 mm

6.2 mm

Not Qualified

BOTTOM

268435456 bit

1.7 V

BOTTOM BOOT BLOCK, SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE

NOR TYPE

7.7 mm

100 ns

1.8

K8C5415EBM-FC1D0

Samsung

FLASH

COMMERCIAL

167

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

PARALLEL

16K,64K

55 mA

16777216 words

1.8

YES

1.8

16

GRID ARRAY, FINE PITCH

BGA167,12X15,32

Flash Memories

.8 mm

70 Cel

16MX16

16M

0 Cel

4,255

YES

YES

BOTTOM

R-PBGA-B167

3

Not Qualified

BOTTOM

268435456 bit

240

NOR TYPE

.00002 Amp

YES

100 ns

YES

KFG1216Q2B-SEB8

Samsung

FLASH

OTHER

67

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

PARALLEL

64K

40 mA

33554432 words

1.8

NO

1.8

16

GRID ARRAY, FINE PITCH

BGA67,8X10,32

Flash Memories

.8 mm

85 Cel

32MX16

32M

-30 Cel

512

YES

TIN SILVER COPPER

YES

BOTTOM

R-PBGA-B67

3

Not Qualified

536870912 bit

1K

e1

260

SLC NAND TYPE

.00005 Amp

9 ns

NO

K8P6415UQB-EI4D

Samsung

FLASH

OTHER

64

BGA

SQUARE

PLASTIC/EPOXY

YES

CMOS

BALL

PARALLEL

4K,32K

55 mA

4194304 words

YES

3/3.3

16

GRID ARRAY

BGA64,8X8,40

Flash Memories

1 mm

85 Cel

4MX16

4M

-25 Cel

16,126

YES

YES

BOTTOM

S-PBGA-B64

3

Not Qualified

BOTTOM/TOP

67108864 bit

8

260

NOR TYPE

.00003 Amp

YES

70 ns

YES

K8A6215ETC-SE7E0

Samsung

FLASH

OTHER

88

TFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

4194304 words

1.8

16

GRID ARRAY, THIN PROFILE, FINE PITCH

.8 mm

85 Cel

4MX16

4M

-25 Cel

BOTTOM

R-PBGA-B88

1.95 V

1.1 mm

8 mm

Not Qualified

TOP

67108864 bit

1.7 V

TOP BOOT BLOCK, SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE

11 mm

70 ns

1.8

K8C5715ETM-DE1D

Samsung

FLASH

OTHER

167

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

PARALLEL

16K,64K

55 mA

16777216 words

1.8

YES

1.8

16

GRID ARRAY, FINE PITCH

BGA167,12X15,32

Flash Memories

.8 mm

85 Cel

16MX16

16M

-25 Cel

4,255

YES

YES

BOTTOM

R-PBGA-B167

Not Qualified

TOP

268435456 bit

NOR TYPE

.00002 Amp

YES

100 ns

YES

K8S3215EBF-DC7E0

Samsung

FLASH

COMMERCIAL

44

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

SYNCHRONOUS

4K,32K

70 mA

2097152 words

1.8

YES

1.8

16

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA44,8X14,20

Flash Memories

.5 mm

70 Cel

3-STATE

2MX16

2M

0 Cel

8,63

YES

YES

BOTTOM

R-PBGA-B44

1.95 V

1 mm

100000 Write/Erase Cycles

5 mm

Not Qualified

BOTTOM

33554432 bit

1.7 V

NOR TYPE

.00005 Amp

7.5 mm

YES

70 ns

1.8

YES

K8P3315UQB-PE4DT

Samsung

FLASH

OTHER

48

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

GULL WING

PARALLEL

4K,32K

55 mA

2097152 words

YES

3/3.3

16

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP48,.8,20

Flash Memories

.5 mm

85 Cel

2MX16

2M

-25 Cel

16,62

YES

YES

DUAL

R-PDSO-G48

Not Qualified

BOTTOM/TOP

33554432 bit

8

NOR TYPE

.00003 Amp

YES

70 ns

YES

K9K1G08R0B-GIB00

Samsung

FLASH

INDUSTRIAL

63

TFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

16K

20 mA

134217728 words

1.8

NO

1.8

8

GRID ARRAY, THIN PROFILE, FINE PITCH

BGA63,10X12,32

Flash Memories

.8 mm

85 Cel

128MX8

128M

-40 Cel

8K

YES

YES

BOTTOM

R-PBGA-B63

1.95 V

1.2 mm

8.5 mm

Not Qualified

1073741824 bit

1.65 V

512

SLC NAND TYPE

.0001 Amp

13.5 mm

40 ns

1.8

NO

K8S6615ETD-DE7E0

Samsung

FLASH

OTHER

44

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

4194304 words

1.8

16

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.5 mm

85 Cel

4MX16

4M

-25 Cel

BOTTOM

R-PBGA-B44

1.95 V

1 mm

Not Qualified

TOP

67108864 bit

1.7 V

TOP BOOT BLOCK, SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE

70 ns

1.8

K8C1215EBM-FE1D0

Samsung

FLASH

OTHER

167

LFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

16K,64K

70 mA

33554432 words

1.8

YES

1.8

16

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA167,12X15,32

Flash Memories

.8 mm

85 Cel

32MX16

32M

-25 Cel

4,511

YES

TIN LEAD

YES

BOTTOM

R-PBGA-B167

3

1.95 V

1.4 mm

10.5 mm

Not Qualified

BOTTOM

536870912 bit

1.7 V

SYNCHRONOUS BURST MODE OPERATION IS ALSO POSSIBLE

e0

240

NOR TYPE

.00002 Amp

14 mm

YES

110 ns

1.8

YES

K8C5615EBM-FC1F

Samsung

FLASH

COMMERCIAL

167

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

PARALLEL

16K,64K

55 mA

16777216 words

1.8

YES

1.8

16

GRID ARRAY, FINE PITCH

BGA167,12X15,32

Flash Memories

.8 mm

70 Cel

16MX16

16M

0 Cel

4,255

YES

YES

BOTTOM

R-PBGA-B167

Not Qualified

BOTTOM

268435456 bit

NOR TYPE

.00002 Amp

YES

100 ns

YES

K8C5415EBM-DC1CT

Samsung

FLASH

COMMERCIAL

167

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

PARALLEL

16K,64K

55 mA

16777216 words

1.8

YES

1.8

16

GRID ARRAY, FINE PITCH

BGA167,12X15,32

Flash Memories

.8 mm

70 Cel

16MX16

16M

0 Cel

4,255

YES

YES

BOTTOM

R-PBGA-B167

Not Qualified

BOTTOM

268435456 bit

NOR TYPE

.00002 Amp

YES

100 ns

YES

K8S3215ETF-FC7D

Samsung

FLASH

COMMERCIAL

44

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

SYNCHRONOUS

4K,32K

70 mA

2097152 words

1.8

YES

1.8

16

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA44,8X14,20

Flash Memories

.5 mm

70 Cel

3-STATE

2MX16

2M

0 Cel

8,63

YES

YES

BOTTOM

R-PBGA-B44

1.95 V

1 mm

100000 Write/Erase Cycles

5 mm

Not Qualified

TOP

33554432 bit

1.7 V

NOR TYPE

.00005 Amp

7.5 mm

YES

70 ns

1.8

YES

K9K2G16Q0M-PIB0

Samsung

FLASH

INDUSTRIAL

48

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

GULL WING

PARALLEL

64K

20 mA

134217728 words

1.8

NO

1.8

16

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP48,.8,20

Flash Memories

.5 mm

85 Cel

128MX16

128M

-40 Cel

2K

YES

YES

DUAL

R-PDSO-G48

Not Qualified

2147483648 bit

1K

.0001 Amp

60 ns

NO

K8S1115ETC-DC1C0

Samsung

FLASH

COMMERCIAL

64

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

33554432 words

1.8

16

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.5 mm

70 Cel

32MX16

32M

0 Cel

BOTTOM

R-PBGA-B64

1.95 V

1 mm

Not Qualified

TOP

536870912 bit

1.7 V

TOP BOOT BLOCK, SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE

NOR TYPE

100 ns

1.8

K8P6415UQB-EI4C

Samsung

FLASH

OTHER

64

BGA

SQUARE

PLASTIC/EPOXY

YES

CMOS

BALL

PARALLEL

4K,32K

55 mA

4194304 words

YES

3/3.3

16

GRID ARRAY

BGA64,8X8,40

Flash Memories

1 mm

85 Cel

4MX16

4M

-25 Cel

16,126

YES

YES

BOTTOM

S-PBGA-B64

3

Not Qualified

BOTTOM/TOP

67108864 bit

8

260

NOR TYPE

.00003 Amp

YES

65 ns

YES

K8C5515ETM-FE1C0

Samsung

FLASH

OTHER

167

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

PARALLEL

16K,64K

55 mA

16777216 words

1.8

YES

1.8

16

GRID ARRAY, FINE PITCH

BGA167,12X15,32

Flash Memories

.8 mm

85 Cel

16MX16

16M

-25 Cel

4,255

YES

YES

BOTTOM

R-PBGA-B167

3

Not Qualified

TOP

268435456 bit

240

NOR TYPE

.00002 Amp

YES

100 ns

YES

K8P2815UQB-DI4DT

Samsung

FLASH

INDUSTRIAL

80

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

PARALLEL

4K,32K

55 mA

8388608 words

YES

3/3.3

16

GRID ARRAY, FINE PITCH

BGA80,8X12,32

Flash Memories

.8 mm

85 Cel

8MX16

8M

-40 Cel

16,254

YES

YES

BOTTOM

R-PBGA-B80

3

Not Qualified

BOTTOM/TOP

134217728 bit

8

260

NOR TYPE

.00003 Amp

YES

70 ns

YES

K8A6315ETC-SC7C0

Samsung

FLASH

COMMERCIAL

88

TFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

4194304 words

1.8

16

GRID ARRAY, THIN PROFILE, FINE PITCH

.8 mm

70 Cel

4MX16

4M

0 Cel

BOTTOM

R-PBGA-B88

1.95 V

1.1 mm

8 mm

Not Qualified

TOP

67108864 bit

1.7 V

TOP BOOT BLOCK, SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE

11 mm

70 ns

1.8

K8S6815ETD-SC7D0

Samsung

FLASH

COMMERCIAL

44

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

4194304 words

1.8

16

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.5 mm

70 Cel

4MX16

4M

0 Cel

BOTTOM

R-PBGA-B44

1.95 V

1 mm

TOP

67108864 bit

1.7 V

TOP BOOT BLOCK, SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE

70 ns

1.8

Flash Memory

Flash memory is a type of non-volatile computer memory that is commonly used in digital devices such as USB drives, solid-state drives, and digital cameras. It is a type of EEPROM (Electrically Erasable Programmable Read-Only Memory) that allows data to be erased and reprogrammed in blocks instead of one byte at a time. Flash memory uses a floating gate transistor to store data, which allows it to retain information even when the power is turned off.

Flash memory is widely used in digital devices because of its high capacity, small size, and fast access times. It is also more durable than other types of memory, such as hard disk drives, because it has no moving parts. This makes it ideal for use in portable devices that may be subject to physical shock or vibration.

There are two types of flash memory: NOR flash and NAND flash. NOR flash is faster than NAND flash, but it has lower density and higher cost per bit. NOR flash is typically used for code storage, such as firmware or boot code, because it provides faster access times. NAND flash has higher density and lower cost per bit, which makes it ideal for data storage applications.

Flash memory has a limited lifespan, as it can only be erased and reprogrammed a limited number of times. This is because the process of erasing and reprogramming the memory causes wear and tear on the floating gate transistor. However, modern flash memory devices have a sophisticated wear-leveling algorithm that distributes writes evenly across the memory, which extends the lifespan of the device.