Samsung Flash Memory 2,400+

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Part RoHS Manufacturer Memory IC Type Temperature Grade No. of Terminals Package Code Package Shape Package Body Material Surface Mount No. of Functions Technology Screening Level Terminal Form Parallel or Serial Operating Mode Sector Size (Words) Maximum Supply Current No. of Words Input/Output Type Nominal Supply Voltage / Vsup (V) Mixed Memory Type Toggle Bit Power Supplies (V) Memory Width Package Style (Meter) Package Equivalence Code Alternate Memory Width Sub-Category Minimum Data Retention Time Terminal Pitch Maximum Operating Temperature Reverse Pinout Output Characteristics Organization No. of Words Code Minimum Operating Temperature No. of Sectors/Size Command User Interface Terminal Finish Ready or Busy Terminal Position No. of Ports Write Protection JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Supply Voltage (Vsup) Maximum Seated Height Endurance Maximum Clock Frequency (fCLK) Width Qualification Maximum Write Cycle Time (tWC) Serial Bus Type Boot Block Memory Density Minimum Supply Voltage (Vsup) Additional Features Page Size (words) JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Type Maximum Standby Current Length Common Flash Interface Maximum Access Time Programming Voltage (V) Data Polling

K9K8G08U0A-PCB00

Samsung

FLASH

COMMERCIAL

48

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

128K

35 mA

1073741824 words

3.3

NO

3/3.3

8

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP48,.8,20

Flash Memories

.5 mm

70 Cel

1GX8

1G

0 Cel

8K

YES

TIN BISMUTH

YES

DUAL

R-PDSO-G48

3

3.6 V

1.2 mm

12 mm

Not Qualified

8589934592 bit

2.7 V

CONTAINS ADDITIONAL 256M BIT SPARE MEMORY

2K

e6

260

.0001 Amp

18.4 mm

20 ns

2.7

NO

K9F6408Q0C-BIB00

Samsung

FLASH

INDUSTRIAL

48

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

8388608 words

1.8

8

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.8 mm

85 Cel

8MX8

8M

-40 Cel

BOTTOM

R-PBGA-B48

1.95 V

1 mm

6 mm

Not Qualified

67108864 bit

1.7 V

CONTAINS ADDITIONAL 2M BIT SPARE MEMORY

8.5 mm

35 ns

1.8

K8C1315ETM-DC1ET

Samsung

FLASH

COMMERCIAL

167

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

PARALLEL

16K,64K

70 mA

33554432 words

1.8

YES

1.8

16

GRID ARRAY, FINE PITCH

BGA167,12X15,32

Flash Memories

.8 mm

70 Cel

32MX16

32M

0 Cel

4,511

YES

YES

BOTTOM

R-PBGA-B167

Not Qualified

TOP

536870912 bit

NOR TYPE

.00002 Amp

YES

110 ns

YES

K8D3216UTCTC0800

Samsung

FLASH

COMMERCIAL

48

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

2097152 words

3

16

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

8

.8 mm

70 Cel

2MX16

2M

0 Cel

BOTTOM

R-PBGA-B48

3.6 V

1 mm

6 mm

Not Qualified

TOP

33554432 bit

2.7 V

NOR TYPE

8.5 mm

80 ns

2.7

K8S5415EBB-DE1DT

Samsung

K9K2G08U0A-VIB0

Samsung

FLASH

INDUSTRIAL

48

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

GULL WING

PARALLEL

128K

30 mA

268435456 words

3.3

NO

3.3

8

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP48,.71,20

Flash Memories

.5 mm

85 Cel

256MX8

256M

-40 Cel

2K

YES

YES

DUAL

R-PDSO-G48

Not Qualified

2147483648 bit

2K

.0001 Amp

30 ns

NO

K8S1315ETC-DE1E0

Samsung

FLASH

OTHER

64

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

16K,64K

70 mA

33554432 words

1.8

YES

1.8

16

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA64,10X14,20

Flash Memories

.5 mm

85 Cel

32MX16

32M

-25 Cel

4,511

YES

YES

BOTTOM

R-PBGA-B64

1.95 V

1 mm

Not Qualified

TOP

536870912 bit

1.7 V

TOP BOOT BLOCK, SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE

NOT SPECIFIED

NOT SPECIFIED

NOR TYPE

.00003 Amp

YES

100 ns

1.8

YES

K8D1716UBC-YC09

Samsung

FLASH

COMMERCIAL

48

TSOP1

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

8K,64K

50 mA

1048576 words

3

YES

3/3.3

16

SMALL OUTLINE, THIN PROFILE

TSSOP48,.8,20

8

Flash Memories

.5 mm

70 Cel

1MX16

1M

0 Cel

8,31

YES

TIN LEAD

YES

DUAL

R-PDSO-G48

3.6 V

1.2 mm

12 mm

Not Qualified

BOTTOM

16777216 bit

2.7 V

e0

NOR TYPE

.000018 Amp

18.4 mm

YES

90 ns

3

YES

K8S5615ETC-FC1E0

Samsung

FLASH

COMMERCIAL

44

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

16777216 words

1.8

16

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.5 mm

70 Cel

16MX16

16M

0 Cel

BOTTOM

R-PBGA-B44

1.95 V

1 mm

Not Qualified

TOP

268435456 bit

1.7 V

TOP BOOT BLOCK, SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE

100 ns

1.8

K8C1015EBM-DC1D

Samsung

FLASH

COMMERCIAL

167

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

PARALLEL

16K,64K

70 mA

33554432 words

1.8

YES

1.8

16

GRID ARRAY, FINE PITCH

BGA167,12X15,32

Flash Memories

.8 mm

70 Cel

32MX16

32M

0 Cel

4,511

YES

YES

BOTTOM

R-PBGA-B167

Not Qualified

BOTTOM

536870912 bit

NOR TYPE

.00002 Amp

YES

110 ns

YES

K9HBG08U1M-ICB00

Samsung

FLASH

COMMERCIAL

52

LGA

PLASTIC/EPOXY

YES

CMOS

NO LEAD

PARALLEL

256K

35 mA

4294967296 words

NO

3/3.3

8

GRID ARRAY

LGA52(UNSPEC)

Flash Memories

70 Cel

4GX8

4G

0 Cel

16K

YES

YES

BOTTOM

Not Qualified

34359738368 bit

2K

.0001 Amp

20 ns

NO

K8C5515ETM-DE1CT

Samsung

FLASH

OTHER

167

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

PARALLEL

16K,64K

55 mA

16777216 words

1.8

YES

1.8

16

GRID ARRAY, FINE PITCH

BGA167,12X15,32

Flash Memories

.8 mm

85 Cel

16MX16

16M

-25 Cel

4,255

YES

YES

BOTTOM

R-PBGA-B167

Not Qualified

TOP

268435456 bit

NOR TYPE

.00002 Amp

YES

100 ns

YES

K8D3216UTCDI0700

Samsung

FLASH

INDUSTRIAL

48

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

2097152 words

3

16

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

8

.8 mm

85 Cel

2MX16

2M

-40 Cel

BOTTOM

R-PBGA-B48

3.6 V

1 mm

6 mm

Not Qualified

TOP

33554432 bit

2.7 V

NOR TYPE

8.5 mm

70 ns

2.7

K8S5415ETB-FC1DT

Samsung

K9W4G16U1M-PIB0

Samsung

FLASH

INDUSTRIAL

48

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

GULL WING

PARALLEL

64K

30 mA

134217728 words

NO

3/3.3

16

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP48,.8,20

Flash Memories

.5 mm

85 Cel

128MX16

128M

-40 Cel

2K

YES

YES

DUAL

R-PDSO-G48

Not Qualified

2147483648 bit

1K

.0001 Amp

NO

KM28N800T-T12

Samsung

FLASH

COMMERCIAL

48

TSOP1

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

1048576 words

5

8

SMALL OUTLINE, THIN PROFILE

16

.5 mm

70 Cel

1MX8

1M

0 Cel

DUAL

R-PDSO-G48

5.5 V

1.2 mm

12 mm

Not Qualified

8388608 bit

4.5 V

NOR TYPE

18.4 mm

120 ns

5

KFM1G16Q2B-DEB8

Samsung

FLASH

COMMERCIAL EXTENDED

63

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

67108864 words

1.8

16

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.8 mm

85 Cel

64MX16

64M

-30 Cel

BOTTOM

R-PBGA-B63

3

1.95 V

1 mm

10 mm

Not Qualified

1073741824 bit

1.7 V

SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE

260

13 mm

76 ns

1.8

K8P1615UQB-PE4CT

Samsung

FLASH

OTHER

48

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

GULL WING

PARALLEL

4K,32K

55 mA

1048576 words

YES

3/3.3

16

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP48,.8,20

Flash Memories

.5 mm

85 Cel

1MX16

1M

-25 Cel

16,30

YES

YES

DUAL

R-PDSO-G48

Not Qualified

BOTTOM/TOP

16777216 bit

8

NOR TYPE

.00003 Amp

YES

65 ns

YES

K8A5615ETC-FC1DT

Samsung

K8S5415EZC-SC1F0

Samsung

FLASH

COMMERCIAL

44

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

55 mA

16777216 words

1.8

16

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.5 mm

70 Cel

16MX16

16M

0 Cel

BOTTOM

R-PBGA-B44

1.95 V

1 mm

6.2 mm

Not Qualified

BOTTOM/TOP

268435456 bit

1.7 V

SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE

NOR TYPE

7.7 mm

100 ns

1.8

K8F5615EBM-SC1D

Samsung

FLASH

COMMERCIAL

44

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

PARALLEL

16K,64K

55 mA

16777216 words

1.8

YES

1.8

16

GRID ARRAY, FINE PITCH

BGA44,8X14,20

Flash Memories

.5 mm

70 Cel

16MX16

16M

0 Cel

4,255

YES

YES

BOTTOM

R-PBGA-B44

Not Qualified

BOTTOM

268435456 bit

NOR TYPE

.00002 Amp

YES

100 ns

YES

K9KAG08U0M-PIB0T

Samsung

FLASH

INDUSTRIAL

48

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

GULL WING

PARALLEL

256K

35 mA

2147483648 words

3.3

NO

3.3

8

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP48,.8,20

Flash Memories

.5 mm

85 Cel

2GX8

2G

-40 Cel

8K

YES

YES

DUAL

R-PDSO-G48

3

Not Qualified

17179869184 bit

4K

260

.0001 Amp

20 ns

NO

K8D3216UBCLC0800

Samsung

FLASH

COMMERCIAL

48

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

2097152 words

3

16

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

8

.8 mm

70 Cel

2MX16

2M

0 Cel

BOTTOM

R-PBGA-B48

3.6 V

1 mm

6 mm

Not Qualified

BOTTOM

33554432 bit

2.7 V

NOR TYPE

8.5 mm

80 ns

2.7

K8S5615EZB-FC1D0

Samsung

K8S5615EZB-FE1C0

Samsung

K8P6415UQB-DE4CT

Samsung

FLASH

OTHER

48

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

PARALLEL

4K,32K

55 mA

4194304 words

YES

3/3.3

16

GRID ARRAY, FINE PITCH

BGA48,6X8,32

Flash Memories

.8 mm

85 Cel

4MX16

4M

-25 Cel

16,126

YES

YES

BOTTOM

R-PBGA-B48

3

Not Qualified

BOTTOM/TOP

67108864 bit

8

260

NOR TYPE

.00003 Amp

YES

65 ns

YES

K8A6415ETC-DC7BT

Samsung

FLASH

COMMERCIAL

88

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

SYNCHRONOUS

4K,32K

70 mA

4194304 words

1.8

YES

1.8

16

GRID ARRAY, FINE PITCH

BGA88,8X12,32

Flash Memories

.8 mm

70 Cel

4MX16

4M

0 Cel

8,127

YES

BOTTOM

R-PBGA-B88

8 mm

Not Qualified

TOP

67108864 bit

8

NOR TYPE

.00005 Amp

11 mm

YES

70 ns

YES

K8S3215ETF-SC7C

Samsung

FLASH

COMMERCIAL

44

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

SYNCHRONOUS

4K,32K

70 mA

2097152 words

1.8

YES

1.8

16

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA44,8X14,20

Flash Memories

.5 mm

70 Cel

3-STATE

2MX16

2M

0 Cel

8,63

YES

YES

BOTTOM

R-PBGA-B44

3

1.95 V

1 mm

100000 Write/Erase Cycles

5 mm

Not Qualified

TOP

33554432 bit

1.7 V

260

NOR TYPE

.00005 Amp

7.5 mm

YES

70 ns

1.8

YES

K8S2815EBB-FE7B

Samsung

FLASH

OTHER

44

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

PARALLEL

4K,32K

70 mA

8388608 words

1.8

YES

1.8

16

GRID ARRAY, FINE PITCH

BGA44,8X14,20

Flash Memories

.5 mm

85 Cel

8MX16

8M

-25 Cel

8, 255

YES

YES

BOTTOM

R-PBGA-B44

Not Qualified

BOTTOM

134217728 bit

NOR TYPE

.00005 Amp

YES

90 ns

YES

K8A5615EZC-FC1D0

Samsung

K8Q2815UQB-PE4DT

Samsung

FLASH

OTHER

56

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

GULL WING

PARALLEL

4K,32K

55 mA

8388608 words

YES

3/3.3

16

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP56,.8,20

Flash Memories

.5 mm

85 Cel

8MX16

8M

-25 Cel

32,252

YES

YES

DUAL

R-PDSO-G56

3

Not Qualified

BOTTOM/TOP

134217728 bit

8

260

NOR TYPE

.00006 Amp

YES

70 ns

YES

K9K1208Q0C-HIB0T00

Samsung

FLASH

INDUSTRIAL

63

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

PARALLEL

16K

20 mA

67108864 words

1.8

NO

1.8

8

GRID ARRAY, FINE PITCH

BGA63,10X12,32

Flash Memories

.8 mm

85 Cel

64MX8

64M

-40 Cel

4K

YES

MATTE TIN

YES

BOTTOM

R-PBGA-B63

1

Not Qualified

536870912 bit

512

e3

.00005 Amp

55 ns

NO

KFG5616U1M-DIB00

Samsung

FLASH

INDUSTRIAL

63

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

16777216 words

3.3

16

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.8 mm

85 Cel

16MX16

16M

-40 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B63

3

3.6 V

1 mm

9.5 mm

Not Qualified

268435456 bit

2.7 V

SYNCHRONOUS BURST OPERATION IS POSSIBLE

e1

260

12 mm

76 ns

2.7

K8S3215ETF-FC7C0

Samsung

FLASH

COMMERCIAL

44

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

SYNCHRONOUS

4K,32K

70 mA

2097152 words

1.8

YES

1.8

16

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA44,8X14,20

Flash Memories

.5 mm

70 Cel

3-STATE

2MX16

2M

0 Cel

8,63

YES

YES

BOTTOM

R-PBGA-B44

1

1.95 V

1 mm

100000 Write/Erase Cycles

5 mm

Not Qualified

TOP

33554432 bit

1.7 V

NOR TYPE

.00005 Amp

7.5 mm

YES

70 ns

1.8

YES

K9WAG08U1E-SCB0

Samsung

FLASH

INDUSTRIAL

48

TSOP1

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

2147483648 words

3.3

8

SMALL OUTLINE, THIN PROFILE

.5 mm

85 Cel

2GX8

2G

-40 Cel

DUAL

R-PDSO-G48

3.6 V

1.2 mm

12 mm

17179869184 bit

2.7 V

SLC NAND TYPE

18.4 mm

2.7

K8A6315EBC-SE7D0

Samsung

FLASH

OTHER

88

TFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

4194304 words

1.8

16

GRID ARRAY, THIN PROFILE, FINE PITCH

.8 mm

85 Cel

4MX16

4M

-25 Cel

BOTTOM

R-PBGA-B88

1.95 V

1.1 mm

8 mm

Not Qualified

BOTTOM

67108864 bit

1.7 V

BOTTOM BOOT BLOCK, SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE

11 mm

70 ns

1.8

K8P3315UQB-DE4DT

Samsung

FLASH

OTHER

48

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

PARALLEL

4K,32K

55 mA

2097152 words

YES

3/3.3

16

GRID ARRAY, FINE PITCH

BGA48,6X8,32

Flash Memories

.8 mm

85 Cel

2MX16

2M

-25 Cel

16,62

YES

YES

BOTTOM

R-PBGA-B48

Not Qualified

BOTTOM/TOP

33554432 bit

8

NOR TYPE

.00003 Amp

YES

70 ns

YES

K8P1615UQB-PI4B0

Samsung

FLASH

INDUSTRIAL

48

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

GULL WING

PARALLEL

4K,32K

55 mA

1048576 words

YES

3/3.3

16

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP48,.8,20

Flash Memories

.5 mm

85 Cel

1MX16

1M

-40 Cel

16,30

YES

YES

DUAL

R-PDSO-G48

Not Qualified

BOTTOM/TOP

16777216 bit

8

NOR TYPE

.00003 Amp

YES

60 ns

YES

K9WAG08U1B-PIB00

Samsung

FLASH

INDUSTRIAL

48

TSOP1

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

128K

35 mA

2147483648 words

3.3

NO

3/3.3

8

SMALL OUTLINE, THIN PROFILE

TSSOP48,.8,20

Flash Memories

.5 mm

85 Cel

2GX8

2G

-40 Cel

16K

YES

YES

DUAL

R-PDSO-G48

3.6 V

1.2 mm

12 mm

Not Qualified

17179869184 bit

2.7 V

2K

NOT SPECIFIED

NOT SPECIFIED

.0002 Amp

18.4 mm

25 ns

2.7

NO

K8D6316UTM-YI090

Samsung

FLASH

INDUSTRIAL

48

TSOP1

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

8K,64K

50 mA

4194304 words

3

YES

3/3.3

16

SMALL OUTLINE, THIN PROFILE

TSSOP48,.8,20

8

Flash Memories

.5 mm

85 Cel

4MX16

4M

-40 Cel

8,127

YES

TIN LEAD

YES

DUAL

R-PDSO-G48

3.6 V

1.2 mm

12 mm

Not Qualified

TOP

67108864 bit

2.7 V

e0

NOR TYPE

.00003 Amp

18.4 mm

YES

90 ns

2.7

YES

K9K8G08U0E-SIB00

Samsung

FLASH

INDUSTRIAL

48

TSOP1

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

1073741824 words

3.3

8

SMALL OUTLINE, THIN PROFILE

.5 mm

85 Cel

1GX8

1G

-40 Cel

DUAL

R-PDSO-G48

3.6 V

1.2 mm

12 mm

8589934592 bit

2.7 V

SLC NAND TYPE

18.4 mm

2.7

K8D6316UTMFC0700

Samsung

FLASH

COMMERCIAL

48

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

4194304 words

3

16

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

8

.8 mm

70 Cel

4MX16

4M

0 Cel

TIN LEAD

BOTTOM

R-PBGA-B48

3.6 V

1 mm

6 mm

Not Qualified

TOP

67108864 bit

2.7 V

e0

NOR TYPE

9 mm

70 ns

2.7

K8A6415EBC-HC7D0

Samsung

FLASH

COMMERCIAL

88

TFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

4K,32K

70 mA

4194304 words

1.8

YES

1.8

16

GRID ARRAY, THIN PROFILE, FINE PITCH

BGA88,8X12,32

Flash Memories

.8 mm

70 Cel

4MX16

4M

0 Cel

8,127

YES

BOTTOM

R-PBGA-B88

3

1.95 V

1.1 mm

8 mm

Not Qualified

BOTTOM

67108864 bit

1.7 V

BOTTOM BOOT BLOCK, SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE

8

260

NOR TYPE

.00005 Amp

11 mm

YES

70 ns

1.8

YES

KM29V040T

Samsung

FLASH

COMMERCIAL

40

TSOP2

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

4K

10 mA

524288 words

3.3

NO

3.3

8

SMALL OUTLINE, THIN PROFILE

TSOP40/44,.46,32

Flash Memories

.8 mm

70 Cel

3-STATE

512KX8

512K

0 Cel

128

YES

Tin/Lead (Sn/Pb)

YES

DUAL

R-PDSO-G40

3.6 V

1.2 mm

10.16 mm

Not Qualified

4194304 bit

3 V

32

e0

.00005 Amp

18.41 mm

50 ns

3

NO

K8S2815ETE-SC7D0

Samsung

FLASH

COMMERCIAL

44

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

8388608 words

1.8

16

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.5 mm

70 Cel

8MX16

8M

0 Cel

BOTTOM

R-PBGA-B44

1.95 V

1 mm

Not Qualified

TOP

134217728 bit

1.7 V

TOP BOOT BLOCK, SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE

70 ns

1.8

K9F2816U0C-BIB0

Samsung

FLASH

INDUSTRIAL

48

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

8388608 words

3.3

16

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.8 mm

85 Cel

8MX16

8M

-40 Cel

BOTTOM

R-PBGA-B48

3.6 V

1 mm

6 mm

Not Qualified

134217728 bit

2.7 V

CONTAINS ADDITIONAL 4M BIT NAND FLASH

SLC NAND TYPE

8.5 mm

30 ns

2.7

K8S1115EZC-FC1D0

Samsung

FLASH

COMMERCIAL

64

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

33554432 words

1.8

16

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.5 mm

70 Cel

32MX16

32M

0 Cel

BOTTOM

R-PBGA-B64

1.95 V

1 mm

536870912 bit

1.7 V

SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE

NOR TYPE

100 ns

1.8

K9F2G08U0C-BCB00

Samsung

FLASH

COMMERCIAL

63

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

PARALLEL

128K

35 mA

268435456 words

3.3

NO

3.3

8

GRID ARRAY, FINE PITCH

BGA63,10X12,32

Flash Memories

.8 mm

70 Cel

256MX8

256M

0 Cel

2K

YES

YES

BOTTOM

R-PBGA-B63

Not Qualified

2147483648 bit

2K

SLC NAND TYPE

.00008 Amp

25 ns

NO

Flash Memory

Flash memory is a type of non-volatile computer memory that is commonly used in digital devices such as USB drives, solid-state drives, and digital cameras. It is a type of EEPROM (Electrically Erasable Programmable Read-Only Memory) that allows data to be erased and reprogrammed in blocks instead of one byte at a time. Flash memory uses a floating gate transistor to store data, which allows it to retain information even when the power is turned off.

Flash memory is widely used in digital devices because of its high capacity, small size, and fast access times. It is also more durable than other types of memory, such as hard disk drives, because it has no moving parts. This makes it ideal for use in portable devices that may be subject to physical shock or vibration.

There are two types of flash memory: NOR flash and NAND flash. NOR flash is faster than NAND flash, but it has lower density and higher cost per bit. NOR flash is typically used for code storage, such as firmware or boot code, because it provides faster access times. NAND flash has higher density and lower cost per bit, which makes it ideal for data storage applications.

Flash memory has a limited lifespan, as it can only be erased and reprogrammed a limited number of times. This is because the process of erasing and reprogramming the memory causes wear and tear on the floating gate transistor. However, modern flash memory devices have a sophisticated wear-leveling algorithm that distributes writes evenly across the memory, which extends the lifespan of the device.