Samsung Flash Memory 2,400+

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Part RoHS Manufacturer Memory IC Type Temperature Grade No. of Terminals Package Code Package Shape Package Body Material Surface Mount No. of Functions Technology Screening Level Terminal Form Parallel or Serial Operating Mode Sector Size (Words) Maximum Supply Current No. of Words Input/Output Type Nominal Supply Voltage / Vsup (V) Mixed Memory Type Toggle Bit Power Supplies (V) Memory Width Package Style (Meter) Package Equivalence Code Alternate Memory Width Sub-Category Minimum Data Retention Time Terminal Pitch Maximum Operating Temperature Reverse Pinout Output Characteristics Organization No. of Words Code Minimum Operating Temperature No. of Sectors/Size Command User Interface Terminal Finish Ready or Busy Terminal Position No. of Ports Write Protection JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Supply Voltage (Vsup) Maximum Seated Height Endurance Maximum Clock Frequency (fCLK) Width Qualification Maximum Write Cycle Time (tWC) Serial Bus Type Boot Block Memory Density Minimum Supply Voltage (Vsup) Additional Features Page Size (words) JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Type Maximum Standby Current Length Common Flash Interface Maximum Access Time Programming Voltage (V) Data Polling

K8C1215ETM-DC1C

Samsung

FLASH

COMMERCIAL

167

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

PARALLEL

16K,64K

70 mA

33554432 words

1.8

YES

1.8

16

GRID ARRAY, FINE PITCH

BGA167,12X15,32

Flash Memories

.8 mm

70 Cel

32MX16

32M

0 Cel

4,511

YES

YES

BOTTOM

R-PBGA-B167

Not Qualified

TOP

536870912 bit

NOR TYPE

.00002 Amp

YES

110 ns

YES

K9F4G08U0A-PCB0T

Samsung

FLASH

COMMERCIAL

48

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

GULL WING

PARALLEL

128K

30 mA

536870912 words

NO

3/3.3

8

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP48,.8,20

Flash Memories

.5 mm

70 Cel

512MX8

512M

0 Cel

4K

YES

YES

DUAL

R-PDSO-G48

3

Not Qualified

4294967296 bit

2K

260

.00005 Amp

25 ns

NO

K9LAG08U0M-PIB0T

Samsung

FLASH

INDUSTRIAL

48

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

GULL WING

PARALLEL

256K

35 mA

2147483648 words

NO

3/3.3

8

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP48,.8,20

Flash Memories

.5 mm

85 Cel

2GX8

2G

-40 Cel

8K

YES

YES

DUAL

R-PDSO-G48

Not Qualified

17179869184 bit

2K

.0001 Amp

20 ns

NO

K8F5715ETM-FC1E0

Samsung

FLASH

COMMERCIAL

88

TFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

16K,64K

55 mA

16777216 words

1.8

YES

1.8

16

GRID ARRAY, THIN PROFILE, FINE PITCH

BGA88,8X12,32

Flash Memories

.8 mm

70 Cel

16MX16

16M

0 Cel

4,255

YES

TIN LEAD

YES

BOTTOM

R-PBGA-B88

1.95 V

1.2 mm

8 mm

Not Qualified

TOP

268435456 bit

1.7 V

SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE

e0

NOR TYPE

.00002 Amp

11 mm

YES

100 ns

1.8

YES

K8C1315ETM-DC1FT

Samsung

FLASH

COMMERCIAL

167

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

PARALLEL

16K,64K

70 mA

33554432 words

1.8

YES

1.8

16

GRID ARRAY, FINE PITCH

BGA167,12X15,32

Flash Memories

.8 mm

70 Cel

32MX16

32M

0 Cel

4,511

YES

YES

BOTTOM

R-PBGA-B167

Not Qualified

TOP

536870912 bit

NOR TYPE

.00002 Amp

YES

110 ns

YES

K8D3216UBC-DC09T

Samsung

FLASH

COMMERCIAL

48

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

PARALLEL

8K,64K

50 mA

2097152 words

YES

3/3.3

16

GRID ARRAY, FINE PITCH

BGA48,6X8,32

8

Flash Memories

.8 mm

70 Cel

2MX16

2M

0 Cel

8,63

YES

YES

BOTTOM

R-PBGA-B48

Not Qualified

BOTTOM

33554432 bit

NOR TYPE

.000018 Amp

YES

90 ns

YES

K8C5515ETM-FC1FT

Samsung

FLASH

COMMERCIAL

167

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

PARALLEL

16K,64K

55 mA

16777216 words

1.8

YES

1.8

16

GRID ARRAY, FINE PITCH

BGA167,12X15,32

Flash Memories

.8 mm

70 Cel

16MX16

16M

0 Cel

4,255

YES

YES

BOTTOM

R-PBGA-B167

3

Not Qualified

TOP

268435456 bit

240

NOR TYPE

.00002 Amp

YES

100 ns

YES

K8A6415ETC-FE7ET

Samsung

FLASH

OTHER

88

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

SYNCHRONOUS

4K,32K

70 mA

4194304 words

1.8

YES

1.8

16

GRID ARRAY, FINE PITCH

BGA88,8X12,32

Flash Memories

.8 mm

85 Cel

4MX16

4M

-25 Cel

8,127

YES

BOTTOM

R-PBGA-B88

8 mm

Not Qualified

TOP

67108864 bit

8

NOR TYPE

.00005 Amp

11 mm

YES

70 ns

YES

K8S3215EBF-SE7E0

Samsung

FLASH

OTHER

44

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

SYNCHRONOUS

4K,32K

70 mA

2097152 words

1.8

YES

1.8

16

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA44,8X14,20

Flash Memories

.5 mm

85 Cel

3-STATE

2MX16

2M

-25 Cel

8,63

YES

YES

BOTTOM

R-PBGA-B44

1.95 V

1 mm

100000 Write/Erase Cycles

5 mm

Not Qualified

BOTTOM

33554432 bit

1.7 V

NOR TYPE

.00005 Amp

7.5 mm

YES

70 ns

1.8

YES

K8A3215EBE-FC7C0

Samsung

3

240

K9K1G08U0A-GCB0

Samsung

FLASH

COMMERCIAL

63

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

PARALLEL

16K

30 mA

134217728 words

3.3

NO

3.3

8

GRID ARRAY, FINE PITCH

BGA63,10X12,32

Flash Memories

.8 mm

70 Cel

128MX8

128M

0 Cel

8K

YES

Tin/Lead (Sn/Pb)

YES

BOTTOM

R-PBGA-B63

Not Qualified

1073741824 bit

512

e0

.0001 Amp

30 ns

NO

K8A6415ETC-DE7D0

Samsung

FLASH

OTHER

88

TFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

4K,32K

70 mA

4194304 words

1.8

YES

1.8

16

GRID ARRAY, THIN PROFILE, FINE PITCH

BGA88,8X12,32

Flash Memories

.8 mm

85 Cel

4MX16

4M

-25 Cel

8,127

YES

BOTTOM

R-PBGA-B88

3

1.95 V

1.1 mm

8 mm

Not Qualified

TOP

67108864 bit

1.7 V

TOP BOOT BLOCK, SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE

8

260

NOR TYPE

.00005 Amp

11 mm

YES

70 ns

1.8

YES

K9K2G08U0M-FIB00

Samsung

FLASH

INDUSTRIAL

48

VSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

268435456 words

3.3

8

SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

.5 mm

85 Cel

256MX8

256M

-40 Cel

TIN BISMUTH

DUAL

R-PDSO-G48

3

3.6 V

.7 mm

12 mm

Not Qualified

2147483648 bit

2.7 V

CONTAINS ADDITIONAL 64M BIT NAND FLASH

e6

SLC NAND TYPE

15.4 mm

30 ns

2.7

K8A5615ETC-DC1DT

Samsung

K8D1716UBC-PC080

Samsung

FLASH

COMMERCIAL

48

TSOP1

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

8K,64K

50 mA

1048576 words

3

YES

3/3.3

16

SMALL OUTLINE, THIN PROFILE

TSSOP48,.8,20

8

Flash Memories

.5 mm

70 Cel

1MX16

1M

0 Cel

8,31

YES

YES

DUAL

R-PDSO-G48

3

3.6 V

1.2 mm

12 mm

Not Qualified

BOTTOM

16777216 bit

2.7 V

NOR TYPE

.000018 Amp

18.4 mm

YES

80 ns

2.7

YES

K8A6215EBC-SE7E0

Samsung

FLASH

OTHER

88

TFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

4194304 words

1.8

16

GRID ARRAY, THIN PROFILE, FINE PITCH

.8 mm

85 Cel

4MX16

4M

-25 Cel

BOTTOM

R-PBGA-B88

1.95 V

1.1 mm

8 mm

Not Qualified

BOTTOM

67108864 bit

1.7 V

BOTTOM BOOT BLOCK, SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE

11 mm

70 ns

1.8

K9WAG08U1E-SCB00

Samsung

FLASH

COMMERCIAL

48

TSOP1

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

2147483648 words

3.3

8

SMALL OUTLINE, THIN PROFILE

.5 mm

70 Cel

2GX8

2G

0 Cel

DUAL

R-PDSO-G48

3.6 V

1.2 mm

12 mm

17179869184 bit

2.7 V

SLC NAND TYPE

18.4 mm

2.7

K8S2615EBE-SE7DT

Samsung

K8S5515EBC-SC1C0

Samsung

FLASH

COMMERCIAL

44

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

55 mA

16777216 words

1.8

16

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.5 mm

70 Cel

16MX16

16M

0 Cel

BOTTOM

R-PBGA-B44

1.95 V

1 mm

6.2 mm

Not Qualified

BOTTOM

268435456 bit

1.7 V

BOTTOM BOOT BLOCK, SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE

NOR TYPE

7.7 mm

100 ns

1.8

K8D6316UTMTI0900

Samsung

FLASH

INDUSTRIAL

48

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

4194304 words

3

16

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

8

.8 mm

85 Cel

4MX16

4M

-40 Cel

TIN LEAD

BOTTOM

R-PBGA-B48

3.6 V

1 mm

6 mm

Not Qualified

TOP

67108864 bit

2.7 V

e0

NOR TYPE

9 mm

90 ns

2.7

K8A6215EBC-HC7C0

Samsung

FLASH

COMMERCIAL

88

TFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

4194304 words

1.8

16

GRID ARRAY, THIN PROFILE, FINE PITCH

.8 mm

70 Cel

4MX16

4M

0 Cel

BOTTOM

R-PBGA-B88

1.95 V

1.1 mm

8 mm

Not Qualified

BOTTOM

67108864 bit

1.7 V

BOTTOM BOOT BLOCK, SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE

11 mm

70 ns

1.8

KFG1G16Q2M-DEB50

Samsung

FLASH

OTHER

63

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

64K

20 mA

67108864 words

1.8

NO

1.8

16

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA63,10X12,32

Flash Memories

.8 mm

85 Cel

64MX16

64M

-30 Cel

1K

YES

TIN SILVER COPPER

YES

BOTTOM

R-PBGA-B63

3

1.95 V

1 mm

10 mm

Not Qualified

1073741824 bit

1.7 V

SYNCHRONOUS BURST OPERATION IS POSSIBLE

1K

e1

260

.00005 Amp

13 mm

76 ns

1.8

NO

K8S2615EBE-SC7BT

Samsung

K8Q2815UQB-PE4C0

Samsung

FLASH

COMMERCIAL EXTENDED

56

TSOP1

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

4K,32K

55 mA

8388608 words

3

YES

3/3.3

16

SMALL OUTLINE, THIN PROFILE

TSSOP56,.8,20

Flash Memories

.5 mm

85 Cel

8MX16

8M

-25 Cel

32,252

YES

YES

DUAL

R-PDSO-G56

3

3.6 V

1.2 mm

14 mm

Not Qualified

BOTTOM/TOP

134217728 bit

2.7 V

8

260

NOR TYPE

.00006 Amp

YES

65 ns

2.7

YES

KFG2816D1M-DEB000

Samsung

FLASH

OTHER

67

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

8388608 words

2.65

16

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.8 mm

85 Cel

8MX16

8M

-30 Cel

BOTTOM

R-PBGA-B67

2.9 V

1 mm

7 mm

Not Qualified

134217728 bit

2.4 V

SYNCHRONOUS BURST OPERATION IS POSSIBLE

9 mm

76 ns

2.7

K8D1716UTC-PC09T

Samsung

FLASH

COMMERCIAL

48

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

GULL WING

PARALLEL

8K,64K

50 mA

1048576 words

YES

3/3.3

16

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP48,.8,20

8

Flash Memories

.5 mm

70 Cel

1MX16

1M

0 Cel

8,31

YES

TIN SILVER COPPER

YES

DUAL

R-PDSO-G48

3

Not Qualified

TOP

16777216 bit

e1

NOR TYPE

.000018 Amp

YES

90 ns

YES

K8S5415EZB-SE1D0

Samsung

KFM1G16Q2C-AEB8

Samsung

FLASH

OTHER

63

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

SYNCHRONOUS

67108864 words

1.8

16

GRID ARRAY

.8 mm

85 Cel

64MX16

64M

-30 Cel

BOTTOM

R-PBGA-B63

3

1.95 V

1 mm

10 mm

Not Qualified

BOTTOM

1073741824 bit

1.7 V

BOTTOM BOOT BLOCK

260

13 mm

76 ns

1.8

K8F1215EBM-FE1E0

Samsung

FLASH

OTHER

64

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

33554432 words

1.8

16

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.5 mm

85 Cel

32MX16

32M

-25 Cel

TIN LEAD

BOTTOM

R-PBGA-B64

1.95 V

1 mm

9 mm

Not Qualified

BOTTOM

536870912 bit

1.7 V

SYNCHRONOUS BURST MODE OPERATION IS ALSO POSSIBLE

e0

NOR TYPE

11 mm

110 ns

1.8

K8S5415ETC-SE1C0

Samsung

FLASH

OTHER

44

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

55 mA

16777216 words

1.8

16

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.5 mm

85 Cel

16MX16

16M

-25 Cel

BOTTOM

R-PBGA-B44

1.95 V

1 mm

6.2 mm

Not Qualified

TOP

268435456 bit

1.7 V

TOP BOOT BLOCK, SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE

NOR TYPE

7.7 mm

100 ns

1.8

K8S1015EZC-DC1F0

Samsung

FLASH

COMMERCIAL

64

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

33554432 words

1.8

16

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.5 mm

70 Cel

32MX16

32M

0 Cel

BOTTOM

R-PBGA-B64

1.95 V

1 mm

536870912 bit

1.7 V

SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE

NOR TYPE

100 ns

1.8

KFG1216U2B-DIB6T

Samsung

FLASH

INDUSTRIAL

63

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

PARALLEL

64K

45 mA

33554432 words

NO

3/3.3

16

GRID ARRAY, FINE PITCH

BGA63,10X12,32

Flash Memories

.8 mm

85 Cel

32MX16

32M

-40 Cel

512

YES

TIN SILVER COPPER

YES

BOTTOM

R-PBGA-B63

3

Not Qualified

536870912 bit

1K

e1

260

SLC NAND TYPE

.00008 Amp

11 ns

NO

K8P2915UQB-DE4D0

Samsung

FLASH

COMMERCIAL EXTENDED

80

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

SYNCHRONOUS

4K,32K

55 mA

8388608 words

YES

3/3.3

16

GRID ARRAY

BGA80,8X12,32

Flash Memories

.8 mm

85 Cel

8MX16

8M

-25 Cel

16,254

YES

YES

BOTTOM

R-PBGA-B80

3

3.6 V

Not Qualified

BOTTOM/TOP

134217728 bit

2.7 V

8

260

NOR TYPE

.00003 Amp

YES

70 ns

2.7

YES

K8A6215EBC-FE7E0

Samsung

FLASH

OTHER

88

TFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

4194304 words

1.8

16

GRID ARRAY, THIN PROFILE, FINE PITCH

.8 mm

85 Cel

4MX16

4M

-25 Cel

BOTTOM

R-PBGA-B88

1.95 V

1.1 mm

8 mm

Not Qualified

BOTTOM

67108864 bit

1.7 V

BOTTOM BOOT BLOCK, SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE

11 mm

70 ns

1.8

K9W4G08U1M-PCB00

Samsung

FLASH

COMMERCIAL

48

TSOP1

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

268435456 words

3.3

8

SMALL OUTLINE, THIN PROFILE

.5 mm

70 Cel

256MX8

256M

0 Cel

DUAL

R-PDSO-G48

2

3.6 V

1.2 mm

12 mm

Not Qualified

2147483648 bit

2.7 V

CONTAINS ADDITIONAL 64M BIT NAND FLASH

SLC NAND TYPE

18.4 mm

30 ns

2.7

K8S5415EZC-FC1D0

Samsung

FLASH

COMMERCIAL

44

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

55 mA

16777216 words

1.8

16

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.5 mm

70 Cel

16MX16

16M

0 Cel

BOTTOM

R-PBGA-B44

1.95 V

1 mm

6.2 mm

Not Qualified

BOTTOM/TOP

268435456 bit

1.7 V

SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE

NOR TYPE

7.7 mm

100 ns

1.8

K8F5715EBM-SE1E0

Samsung

FLASH

OTHER

44

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

16K,64K

55 mA

16777216 words

1.8

YES

1.8

16

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA44,8X14,20

Flash Memories

.5 mm

85 Cel

16MX16

16M

-25 Cel

4,255

YES

TIN SILVER COPPER

YES

BOTTOM

R-PBGA-B44

2

1.95 V

1 mm

8 mm

Not Qualified

BOTTOM

268435456 bit

1.7 V

SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE

e1

NOR TYPE

.00002 Amp

9 mm

YES

100 ns

1.8

YES

K8C5615EBM-FE1C0

Samsung

FLASH

OTHER

167

LFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

16K,64K

55 mA

16777216 words

1.8

YES

1.8

16

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA167,12X15,32

Flash Memories

.8 mm

85 Cel

16MX16

16M

-25 Cel

4,255

YES

TIN LEAD

YES

BOTTOM

R-PBGA-B167

1.95 V

1.4 mm

10.5 mm

Not Qualified

BOTTOM

268435456 bit

1.7 V

SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE

e0

NOR TYPE

.00002 Amp

14 mm

YES

100 ns

1.8

YES

K8A3215EBE-DC7B

Samsung

FLASH

COMMERCIAL

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

SYNCHRONOUS

2097152 words

1.8

16

GRID ARRAY

70 Cel

2MX16

2M

0 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B

3

1.95 V

Not Qualified

33554432 bit

1.7 V

e1

260

90 ns

1.8

K8A6415ETC-SC7B

Samsung

FLASH

COMMERCIAL

88

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

SYNCHRONOUS

4K,32K

70 mA

4194304 words

1.8

YES

1.8

16

GRID ARRAY, FINE PITCH

BGA88,8X12,32

Flash Memories

.8 mm

70 Cel

4MX16

4M

0 Cel

8,127

YES

BOTTOM

R-PBGA-B88

8 mm

Not Qualified

TOP

67108864 bit

8

NOR TYPE

.00005 Amp

11 mm

YES

70 ns

YES

K8A6415EBC-DC7BT

Samsung

FLASH

COMMERCIAL

88

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

SYNCHRONOUS

4K,32K

70 mA

4194304 words

1.8

YES

1.8

16

GRID ARRAY, FINE PITCH

BGA88,8X12,32

Flash Memories

.8 mm

70 Cel

4MX16

4M

0 Cel

8,127

YES

BOTTOM

R-PBGA-B88

8 mm

Not Qualified

BOTTOM

67108864 bit

8

NOR TYPE

.00005 Amp

11 mm

YES

70 ns

YES

K8S2815EBC-SE7B

Samsung

FLASH

OTHER

44

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

PARALLEL

4K,32K

70 mA

8388608 words

1.8

YES

1.8

16

GRID ARRAY, FINE PITCH

BGA44,8X14,20

Flash Memories

.5 mm

85 Cel

8MX16

8M

-25 Cel

8, 255

YES

YES

BOTTOM

R-PBGA-B44

Not Qualified

BOTTOM

134217728 bit

NOR TYPE

.00005 Amp

YES

70 ns

YES

K8D3216UTC-PC08T

Samsung

FLASH

COMMERCIAL

48

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

GULL WING

PARALLEL

8K,64K

50 mA

2097152 words

YES

3/3.3

16

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP48,.8,20

8

Flash Memories

.5 mm

70 Cel

2MX16

2M

0 Cel

8,63

YES

YES

DUAL

R-PDSO-G48

Not Qualified

TOP

33554432 bit

NOR TYPE

.000018 Amp

YES

80 ns

YES

K8P2815UQC-QC4C0

Samsung

FLASH

COMMERCIAL

56

TSOP1

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

8388608 words

3

16

SMALL OUTLINE, THIN PROFILE

.5 mm

70 Cel

8MX16

8M

0 Cel

DUAL

R-PDSO-G56

3.6 V

1.2 mm

14 mm

Not Qualified

BOTTOM/TOP

134217728 bit

2.7 V

BOTTOM BOOT BLOCK, TOP BOOT BLOCK

18.4 mm

65 ns

3

K8C5515ETM-FC1DT

Samsung

FLASH

COMMERCIAL

167

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

PARALLEL

16K,64K

55 mA

16777216 words

1.8

YES

1.8

16

GRID ARRAY, FINE PITCH

BGA167,12X15,32

Flash Memories

.8 mm

70 Cel

16MX16

16M

0 Cel

4,255

YES

YES

BOTTOM

R-PBGA-B167

3

Not Qualified

TOP

268435456 bit

240

NOR TYPE

.00002 Amp

YES

100 ns

YES

K8S5415EZB-DC1C0

Samsung

KFK8G16Q2M-DEB8T

Samsung

FLASH

OTHER

63

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

PARALLEL

64K

35 mA

536870912 words

1.8

YES

1.8

16

GRID ARRAY, FINE PITCH

BGA63,10X12,32

Flash Memories

.8 mm

85 Cel

512MX16

512M

-30 Cel

8K

YES

MATTE TIN

YES

BOTTOM

R-PBGA-B63

1

Not Qualified

8589934592 bit

2K

e3

SLC NAND TYPE

.0001 Amp

9 ns

NO

K9K1G08U0A-YIB00

Samsung

FLASH

INDUSTRIAL

48

TSOP1

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

134217728 words

3.3

8

SMALL OUTLINE, THIN PROFILE

.5 mm

85 Cel

128MX8

128M

-40 Cel

DUAL

R-PDSO-G48

3.6 V

1.2 mm

12 mm

Not Qualified

1073741824 bit

2.7 V

CONTAINS ADDITIONAL 32M BIT NAND FLASH

18.4 mm

30 ns

2.7

Flash Memory

Flash memory is a type of non-volatile computer memory that is commonly used in digital devices such as USB drives, solid-state drives, and digital cameras. It is a type of EEPROM (Electrically Erasable Programmable Read-Only Memory) that allows data to be erased and reprogrammed in blocks instead of one byte at a time. Flash memory uses a floating gate transistor to store data, which allows it to retain information even when the power is turned off.

Flash memory is widely used in digital devices because of its high capacity, small size, and fast access times. It is also more durable than other types of memory, such as hard disk drives, because it has no moving parts. This makes it ideal for use in portable devices that may be subject to physical shock or vibration.

There are two types of flash memory: NOR flash and NAND flash. NOR flash is faster than NAND flash, but it has lower density and higher cost per bit. NOR flash is typically used for code storage, such as firmware or boot code, because it provides faster access times. NAND flash has higher density and lower cost per bit, which makes it ideal for data storage applications.

Flash memory has a limited lifespan, as it can only be erased and reprogrammed a limited number of times. This is because the process of erasing and reprogramming the memory causes wear and tear on the floating gate transistor. However, modern flash memory devices have a sophisticated wear-leveling algorithm that distributes writes evenly across the memory, which extends the lifespan of the device.