FBGA Other Function Memory ICs 1,784

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Part RoHS Manufacturer Memory IC Type Temperature Grade No. of Terminals Package Code Refresh Cycles Package Shape Total Dose (V) Package Body Material Access Mode Surface Mount No. of Functions Technology Screening Level Terminal Form Parallel or Serial Operating Mode Sector Size (Words) Maximum Supply Current No. of Words Sequential Burst Length Self Refresh Input/Output Type Nominal Supply Voltage / Vsup (V) Mixed Memory Type Toggle Bit Power Supplies (V) Memory Width Package Style (Meter) Package Equivalence Code Sub-Category Minimum Data Retention Time Terminal Pitch Maximum Operating Temperature Reverse Pinout Output Characteristics Organization No. of Words Code Minimum Standby Voltage Minimum Operating Temperature No. of Sectors/Size Command User Interface Terminal Finish I2C Control Byte Terminal Position No. of Ports Write Protection JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Supply Voltage (Vsup) Maximum Seated Height Endurance Maximum Clock Frequency (fCLK) Width Qualification Serial Bus Type Boot Block Memory Density Minimum Supply Voltage (Vsup) Additional Features Page Size (words) JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Type Maximum Standby Current Interleaved Burst Length Length Common Flash Interface Maximum Access Time Programming Voltage (V) Data Polling

MC-242454F9-B10-BT3

Renesas Electronics

MEMORY CIRCUIT

COMMERCIAL

77

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

HYBRID

BALL

45 mA

FLASH+SRAM

2.6/3

GRID ARRAY, FINE PITCH

BGA77,8X14,32

Other Memory ICs

.8 mm

70 Cel

-20 Cel

BOTTOM

R-PBGA-B77

Not Qualified

.00001 Amp

100 ns

MC-242443F9-B95-BS1

Renesas Electronics

MEMORY CIRCUIT

COMMERCIAL

71

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

HYBRID

BALL

45 mA

FLASH+SRAM

2.6/3

GRID ARRAY, FINE PITCH

BGA71,8X12,32

Other Memory ICs

.8 mm

70 Cel

-20 Cel

BOTTOM

R-PBGA-B71

Not Qualified

.00001 Amp

90 ns

MC-242444F9-B90-BT3

Renesas Electronics

MEMORY CIRCUIT

COMMERCIAL

77

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

HYBRID

BALL

45 mA

FLASH+SRAM

2.6/3

GRID ARRAY, FINE PITCH

BGA77,8X14,32

Other Memory ICs

.8 mm

70 Cel

-20 Cel

BOTTOM

R-PBGA-B77

Not Qualified

.00001 Amp

80 ns

MC-242443F9-B10-BS1

Renesas Electronics

MEMORY CIRCUIT

COMMERCIAL

71

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

HYBRID

BALL

45 mA

FLASH+SRAM

2.6/3

GRID ARRAY, FINE PITCH

BGA71,8X12,32

Other Memory ICs

.8 mm

70 Cel

-20 Cel

BOTTOM

R-PBGA-B71

Not Qualified

.00001 Amp

100 ns

UPD4632312F9-BE95X-BT3

Renesas Electronics

OTHER

77

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

35 mA

2097152 words

COMMON

1.8,3

16

GRID ARRAY, FINE PITCH

BGA77,8X14,32

Other Memory ICs

.8 mm

85 Cel

3-STATE

2MX16

2M

-25 Cel

BOTTOM

R-PBGA-B77

Not Qualified

33554432 bit

.0001 Amp

95 ns

MC-242453F9-B90-BS1

Renesas Electronics

MEMORY CIRCUIT

COMMERCIAL

77

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

HYBRID

BALL

45 mA

FLASH+SRAM

2.6/3

GRID ARRAY, FINE PITCH

BGA77,8X14,32

Other Memory ICs

.8 mm

70 Cel

-20 Cel

BOTTOM

R-PBGA-B77

Not Qualified

.00001 Amp

80 ns

MC-24222311F9-E95X-CD5

Renesas Electronics

MEMORY CIRCUIT

OTHER

85

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

HYBRID

BALL

40 mA

FLASH+SRAM

1.8/3,3

GRID ARRAY, FINE PITCH

BGA85,10X12,32

Other Memory ICs

.8 mm

85 Cel

-25 Cel

BOTTOM

R-PBGA-B85

Not Qualified

.00001 Amp

95 ns

MC-242442F9-B90-BS1

Renesas Electronics

MEMORY CIRCUIT

COMMERCIAL

71

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

HYBRID

BALL

45 mA

FLASH+SRAM

2.6/3

GRID ARRAY, FINE PITCH

BGA71,8X12,32

Other Memory ICs

.8 mm

70 Cel

-20 Cel

BOTTOM

R-PBGA-B71

Not Qualified

.00001 Amp

80 ns

UPD4664312F9-CE90X-CR2

Renesas Electronics

OTHER

93

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

4194304 words

COMMON

1.8/2,2.5

16

GRID ARRAY, FINE PITCH

BGA93,10X14,32

Other Memory ICs

.8 mm

85 Cel

3-STATE

4MX16

4M

-25 Cel

BOTTOM

R-PBGA-B93

Not Qualified

67108864 bit

.00001 Amp

90 ns

MC-242444F9-B10-BS1

Renesas Electronics

MEMORY CIRCUIT

COMMERCIAL

77

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

HYBRID

BALL

45 mA

FLASH+SRAM

2.6/3

GRID ARRAY, FINE PITCH

BGA77,8X14,32

Other Memory ICs

.8 mm

70 Cel

-20 Cel

BOTTOM

R-PBGA-B77

Not Qualified

.00001 Amp

100 ns

MC-242452F9-B95-BS1

Renesas Electronics

MEMORY CIRCUIT

COMMERCIAL

71

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

HYBRID

BALL

45 mA

FLASH+SRAM

2.6/3

GRID ARRAY, FINE PITCH

BGA71,8X12,32

Other Memory ICs

.8 mm

70 Cel

-20 Cel

BOTTOM

R-PBGA-B71

Not Qualified

.00001 Amp

90 ns

MC-222243AF9-B85X-BT3

Renesas Electronics

MEMORY CIRCUIT

OTHER

77

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

HYBRID

BALL

45 mA

FLASH+SRAM

3/3.3

GRID ARRAY, FINE PITCH

BGA77,8X14,32

Other Memory ICs

.8 mm

85 Cel

-25 Cel

BOTTOM

R-PBGA-B77

Not Qualified

85 ns

UPD46128953F1-E12X-EB1

Renesas Electronics

OTHER

127

FBGA

SQUARE

PLASTIC/EPOXY

YES

CMOS

BALL

60 mA

4194304 words

COMMON

1.8

1.8

32

GRID ARRAY, FINE PITCH

BGA127,14X14,32

Other Memory ICs

.8 mm

85 Cel

3-STATE

4MX32

4M

-25 Cel

BOTTOM

S-PBGA-B127

83 MHz

Not Qualified

134217728 bit

UPD4664312F9-E85X-CR2

Renesas Electronics

OTHER

93

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

4194304 words

COMMON

1.8/2

16

GRID ARRAY, FINE PITCH

BGA93,10X14,32

Other Memory ICs

.8 mm

85 Cel

3-STATE

4MX16

4M

-25 Cel

BOTTOM

R-PBGA-B93

Not Qualified

67108864 bit

.00001 Amp

85 ns

UPD4664312F9-C85X-CR2

Renesas Electronics

OTHER

93

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

4194304 words

COMMON

2.5

2.5

16

GRID ARRAY, FINE PITCH

BGA93,10X14,32

Other Memory ICs

.8 mm

85 Cel

3-STATE

4MX16

4M

-25 Cel

BOTTOM

R-PBGA-B93

Not Qualified

67108864 bit

.00001 Amp

85 ns

UPD4664312-B65X-CR2

Renesas Electronics

OTHER

93

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

45 mA

4194304 words

COMMON

3

3

16

GRID ARRAY, FINE PITCH

BGA93,10X14,32

Other Memory ICs

.8 mm

85 Cel

3-STATE

4MX16

4M

-25 Cel

BOTTOM

R-PBGA-B93

Not Qualified

67108864 bit

.00001 Amp

65 ns

MC-24212361F9-E10X-CDX

Renesas Electronics

MEMORY CIRCUIT

OTHER

85

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

MOS

BALL

ASYNCHRONOUS

1048576 words

1.8

16

GRID ARRAY, FINE PITCH

.8 mm

85 Cel

1MX16

1M

-25 Cel

BOTTOM

R-PBGA-B85

1.95 V

8 mm

16777216 bit

1.65 V

ALSO OPERATES AT 2.6-3.1V, AND 4M X 16 RAM

11 mm

MC-242443F9-B95-BT3

Renesas Electronics

MEMORY CIRCUIT

COMMERCIAL

77

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

HYBRID

BALL

45 mA

FLASH+SRAM

2.6/3

GRID ARRAY, FINE PITCH

BGA77,8X14,32

Other Memory ICs

.8 mm

70 Cel

-20 Cel

BOTTOM

R-PBGA-B77

Not Qualified

.00001 Amp

90 ns

MC-222263F9-B85X-BT3

Renesas Electronics

MEMORY CIRCUIT

OTHER

77

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

HYBRID

BALL

50 mA

FLASH+SRAM

3/3.3

GRID ARRAY, FINE PITCH

BGA77,8X14,32

Other Memory ICs

.8 mm

85 Cel

-25 Cel

BOTTOM

R-PBGA-B77

Not Qualified

85 ns

MC-242454F9-B90-BS1

Renesas Electronics

MEMORY CIRCUIT

COMMERCIAL

77

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

HYBRID

BALL

45 mA

FLASH+SRAM

2.6/3

GRID ARRAY, FINE PITCH

BGA77,8X14,32

Other Memory ICs

.8 mm

70 Cel

-20 Cel

BOTTOM

R-PBGA-B77

Not Qualified

.00001 Amp

80 ns

MC-222244AF9-B85X-BT3

Renesas Electronics

MEMORY CIRCUIT

OTHER

77

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

HYBRID

BALL

45 mA

FLASH+SRAM

3/3.3

GRID ARRAY, FINE PITCH

BGA77,8X14,32

Other Memory ICs

.8 mm

85 Cel

-25 Cel

BOTTOM

R-PBGA-B77

Not Qualified

85 ns

UPD4616112F9-B95LX-BC2

Renesas Electronics

OTHER

48

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

35 mA

1048576 words

COMMON

2.7/3

16

GRID ARRAY, FINE PITCH

BGA48,6X8,30

Other Memory ICs

.75 mm

85 Cel

3-STATE

1MX16

1M

-25 Cel

BOTTOM

R-PBGA-B48

Not Qualified

16777216 bit

.00001 Amp

95 ns

MC-222273F9-B85X-BT3

Renesas Electronics

MEMORY CIRCUIT

OTHER

77

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

HYBRID

BALL

50 mA

FLASH+SRAM

3/3.3

GRID ARRAY, FINE PITCH

BGA77,8X14,32

Other Memory ICs

.8 mm

85 Cel

-25 Cel

BOTTOM

R-PBGA-B77

Not Qualified

85 ns

UPD4616112F9-BC80-BC2

Renesas Electronics

COMMERCIAL

48

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

35 mA

1048576 words

COMMON

2.7

2.7

16

GRID ARRAY, FINE PITCH

BGA48,6X8,30

Other Memory ICs

.75 mm

70 Cel

3-STATE

1MX16

1M

2.6 V

-20 Cel

Tin/Lead (Sn/Pb)

BOTTOM

R-PBGA-B48

Not Qualified

16777216 bit

e0

.00001 Amp

80 ns

MC-222264F9-B85X-BT3

Renesas Electronics

MEMORY CIRCUIT

OTHER

77

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

HYBRID

BALL

50 mA

FLASH+SRAM

3/3.3

GRID ARRAY, FINE PITCH

BGA77,8X14,32

Other Memory ICs

.8 mm

85 Cel

-25 Cel

BOTTOM

R-PBGA-B77

Not Qualified

85 ns

UPD4664312F9-BE85X-CR2

Renesas Electronics

OTHER

93

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

4194304 words

COMMON

1.8/2,3

16

GRID ARRAY, FINE PITCH

BGA93,10X14,32

Other Memory ICs

.8 mm

85 Cel

3-STATE

4MX16

4M

-25 Cel

BOTTOM

R-PBGA-B93

Not Qualified

67108864 bit

.00001 Amp

85 ns

UPD46128512F9-E11X-CR2

Renesas Electronics

OTHER

93

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

60 mA

8388608 words

COMMON

1.8

1.8

16

GRID ARRAY, FINE PITCH

BGA93,10X14,32

Other Memory ICs

.8 mm

85 Cel

3-STATE

8MX16

8M

-30 Cel

BOTTOM

R-PBGA-B93

Not Qualified

134217728 bit

.00025 Amp

70 ns

MC-222253AF9-B85X-BT3

Renesas Electronics

MEMORY CIRCUIT

OTHER

77

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

HYBRID

BALL

45 mA

FLASH+SRAM

3/3.3

GRID ARRAY, FINE PITCH

BGA77,8X14,32

Other Memory ICs

.8 mm

85 Cel

-25 Cel

BOTTOM

R-PBGA-B77

Not Qualified

85 ns

MC-242444F9-B10-BT3

Renesas Electronics

MEMORY CIRCUIT

COMMERCIAL

77

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

HYBRID

BALL

45 mA

FLASH+SRAM

2.6/3

GRID ARRAY, FINE PITCH

BGA77,8X14,32

Other Memory ICs

.8 mm

70 Cel

-20 Cel

BOTTOM

R-PBGA-B77

Not Qualified

.00001 Amp

100 ns

MC-242444F9-B95-BT3

Renesas Electronics

MEMORY CIRCUIT

COMMERCIAL

77

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

HYBRID

BALL

45 mA

FLASH+SRAM

2.6/3

GRID ARRAY, FINE PITCH

BGA77,8X14,32

Other Memory ICs

.8 mm

70 Cel

-20 Cel

BOTTOM

R-PBGA-B77

Not Qualified

.00001 Amp

90 ns

MC-242442F9-B95-BS1

Renesas Electronics

MEMORY CIRCUIT

COMMERCIAL

71

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

HYBRID

BALL

45 mA

FLASH+SRAM

2.6/3

GRID ARRAY, FINE PITCH

BGA71,8X12,32

Other Memory ICs

.8 mm

70 Cel

-20 Cel

BOTTOM

R-PBGA-B71

Not Qualified

.00001 Amp

90 ns

MC-242452F9-B95-BT3

Renesas Electronics

MEMORY CIRCUIT

COMMERCIAL

77

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

HYBRID

BALL

45 mA

FLASH+SRAM

2.6/3

GRID ARRAY, FINE PITCH

BGA77,8X14,32

Other Memory ICs

.8 mm

70 Cel

-20 Cel

BOTTOM

R-PBGA-B77

Not Qualified

.00001 Amp

90 ns

MC-24212361F9-E90X-CDX

Renesas Electronics

MEMORY CIRCUIT

OTHER

85

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

MOS

BALL

ASYNCHRONOUS

1048576 words

1.8

16

GRID ARRAY, FINE PITCH

.8 mm

85 Cel

1MX16

1M

-25 Cel

BOTTOM

R-PBGA-B85

1.95 V

8 mm

16777216 bit

1.65 V

ALSO OPERATES AT 2.6-3.1V, AND 4M X 16 RAM

11 mm

MC-242454F9-B10-BS1

Renesas Electronics

MEMORY CIRCUIT

COMMERCIAL

77

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

HYBRID

BALL

45 mA

FLASH+SRAM

2.6/3

GRID ARRAY, FINE PITCH

BGA77,8X14,32

Other Memory ICs

.8 mm

70 Cel

-20 Cel

BOTTOM

R-PBGA-B77

Not Qualified

.00001 Amp

100 ns

MC-242453F9-B10-BT3

Renesas Electronics

MEMORY CIRCUIT

COMMERCIAL

77

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

HYBRID

BALL

45 mA

FLASH+SRAM

2.6/3

GRID ARRAY, FINE PITCH

BGA77,8X14,32

Other Memory ICs

.8 mm

70 Cel

-20 Cel

BOTTOM

R-PBGA-B77

Not Qualified

.00001 Amp

100 ns

K1B3216BDD-FI70

Samsung

INDUSTRIAL

54

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

35 mA

2097152 words

COMMON

1.8

1.8

16

GRID ARRAY, FINE PITCH

BGA54,6X9,30

Other Memory ICs

.75 mm

85 Cel

3-STATE

2MX16

2M

-40 Cel

BOTTOM

R-PBGA-B54

Not Qualified

33554432 bit

.0001 Amp

70 ns

KAL00B00BM-FGXV

Samsung

MEMORY CIRCUIT

OTHER

127

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

15 mA

1.8

FLASH+SDRAM

1.8

GRID ARRAY, FINE PITCH

BGA127,12X13,32

Other Memory ICs

.8 mm

85 Cel

-25 Cel

BOTTOM

R-PBGA-B127

Not Qualified

.00005 Amp

KAB02D100M-TLGP

Samsung

MEMORY CIRCUIT

OTHER

80

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

HYBRID

BALL

35 mA

3

FLASH+PSRAM

3

GRID ARRAY, FINE PITCH

BGA80,8X13,32

Other Memory ICs

.8 mm

85 Cel

-25 Cel

BOTTOM

R-PBGA-B80

Not Qualified

.00001 Amp

85 ns

K522H1HACF-B050

Samsung

MEMORY CIRCUIT

OTHER

153

FBGA

SQUARE

PLASTIC/EPOXY

YES

CMOS

BALL

25 mA

1.8

FLASH+SDRAM

1.8

GRID ARRAY, FINE PITCH

BGA153,14X14,20

Other Memory ICs

.5 mm

85 Cel

-25 Cel

BOTTOM

S-PBGA-B153

Not Qualified

.002 Amp

K1S32161CE-FI70T

Samsung

INDUSTRIAL

48

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

35 mA

2097152 words

COMMON

2.9

2.9

16

GRID ARRAY, FINE PITCH

BGA48,6X8,30

Other Memory ICs

.75 mm

85 Cel

3-STATE

2MX16

2M

-40 Cel

BOTTOM

R-PBGA-B48

3

Not Qualified

33554432 bit

240

.0001 Amp

70 ns

K5A3340YTC-T855

Samsung

MEMORY CIRCUIT

INDUSTRIAL

69

FBGA

SQUARE

PLASTIC/EPOXY

YES

CMOS

BALL

77 mA

3

FLASH+SRAM

3

GRID ARRAY, FINE PITCH

BGA69,10X10,32

Other Memory ICs

.8 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B69

Not Qualified

.00001 Amp

80 ns

K1S6416BCD-FI70T

Samsung

INDUSTRIAL

48

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

40 mA

4194304 words

COMMON

1.8

1.8

16

GRID ARRAY, FINE PITCH

BGA48,6X8,30

Other Memory ICs

.75 mm

85 Cel

3-STATE

4MX16

4M

-40 Cel

BOTTOM

R-PBGA-B48

Not Qualified

67108864 bit

.00012 Amp

70 ns

K1B3216BDD-BI700

Samsung

INDUSTRIAL

54

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

35 mA

2097152 words

COMMON

1.8

1.8

16

GRID ARRAY, FINE PITCH

BGA54,6X9,30

Other Memory ICs

.75 mm

85 Cel

3-STATE

2MX16

2M

-40 Cel

BOTTOM

R-PBGA-B54

Not Qualified

33554432 bit

.0001 Amp

70 ns

K5A3380YTC-T755

Samsung

MEMORY CIRCUIT

INDUSTRIAL

69

FBGA

SQUARE

PLASTIC/EPOXY

YES

CMOS

BALL

50 mA

3

FLASH+SRAM

3

GRID ARRAY, FINE PITCH

BGA69,10X10,32

Other Memory ICs

.8 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B69

Not Qualified

.000015 Amp

70 ns

KAD060300B-TLLL

Samsung

MEMORY CIRCUIT

INDUSTRIAL

69

FBGA

SQUARE

PLASTIC/EPOXY

YES

HYBRID

BALL

40 mA

3

FLASH+PSRAM

3

GRID ARRAY, FINE PITCH

BGA69,10X10,32

Other Memory ICs

.8 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B69

Not Qualified

.00002 Amp

70 ns

KAA00B209M-TGQX

Samsung

MEMORY CIRCUIT

OTHER

127

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

HYBRID

BALL

35 mA

FLASH+PSRAM+SRAM

1.8,3

GRID ARRAY, FINE PITCH

BGA127,12X13,32

Other Memory ICs

.8 mm

85 Cel

-25 Cel

BOTTOM

R-PBGA-B127

Not Qualified

.00001 Amp

90 ns

KAA00B209M-TGQV

Samsung

MEMORY CIRCUIT

OTHER

127

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

HYBRID

BALL

35 mA

FLASH+PSRAM+SRAM

1.8,3

GRID ARRAY, FINE PITCH

BGA127,12X13,32

Other Memory ICs

.8 mm

85 Cel

-25 Cel

BOTTOM

R-PBGA-B127

Not Qualified

.00001 Amp

90 ns

KBB06A300M-T402

Samsung

MEMORY CIRCUIT

OTHER

80

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

40 mA

3

FLASH+PSRAM

3

GRID ARRAY, FINE PITCH

BGA80,8X13,32

Other Memory ICs

.8 mm

85 Cel

-25 Cel

BOTTOM

R-PBGA-B80

Not Qualified

.00002 Amp

70 ns

Other Function Memory ICs

Other function memory ICs are a group of integrated circuits that perform specialized functions in addition to storing data. These ICs are used in a wide range of digital devices, including computers, smartphones, and electronic devices.

One example of an other function memory IC is cache memory. Cache memory is a type of memory that stores frequently accessed data and instructions. Cache memory is used to improve the performance of the system by reducing the time it takes to access data from the main memory.

Another example of an other function memory IC is dynamic random-access memory (DRAM). DRAM is a type of memory that stores data as a charge in a capacitor. DRAM is commonly used as the main memory in computers and other digital devices.

Static random-access memory (SRAM) is another type of other function memory IC. SRAM is a type of memory that stores data as a flip-flop, which retains the data as long as power is supplied to the system. SRAM is commonly used as cache memory and in other applications where high-speed access to data is required.

Memory controller ICs are another type of other function memory IC. Memory controller ICs are used to manage the flow of data between the CPU and the memory subsystem. These ICs are commonly used in computer systems and other digital devices to ensure that data is transferred efficiently and reliably.