FBGA Other Function Memory ICs 1,784

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Part RoHS Manufacturer Memory IC Type Temperature Grade No. of Terminals Package Code Refresh Cycles Package Shape Total Dose (V) Package Body Material Access Mode Surface Mount No. of Functions Technology Screening Level Terminal Form Parallel or Serial Operating Mode Sector Size (Words) Maximum Supply Current No. of Words Sequential Burst Length Self Refresh Input/Output Type Nominal Supply Voltage / Vsup (V) Mixed Memory Type Toggle Bit Power Supplies (V) Memory Width Package Style (Meter) Package Equivalence Code Sub-Category Minimum Data Retention Time Terminal Pitch Maximum Operating Temperature Reverse Pinout Output Characteristics Organization No. of Words Code Minimum Standby Voltage Minimum Operating Temperature No. of Sectors/Size Command User Interface Terminal Finish I2C Control Byte Terminal Position No. of Ports Write Protection JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Supply Voltage (Vsup) Maximum Seated Height Endurance Maximum Clock Frequency (fCLK) Width Qualification Serial Bus Type Boot Block Memory Density Minimum Supply Voltage (Vsup) Additional Features Page Size (words) JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Type Maximum Standby Current Interleaved Burst Length Length Common Flash Interface Maximum Access Time Programming Voltage (V) Data Polling

KAG00J007M-FGG2

Samsung

MEMORY CIRCUIT

OTHER

107

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

60 mA

FLASH+SDRAM

1.8,2.6

GRID ARRAY, FINE PITCH

BGA107,10X14,32

Other Memory ICs

.8 mm

85 Cel

-25 Cel

BOTTOM

R-PBGA-B107

Not Qualified

.000001 Amp

45 ns

K1S32161CC-BI700

Samsung

INDUSTRIAL

48

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

40 mA

2097152 words

COMMON

2.9

2.9

16

GRID ARRAY, FINE PITCH

BGA48,6X8,30

Other Memory ICs

.75 mm

85 Cel

3-STATE

2MX16

2M

-40 Cel

BOTTOM

R-PBGA-B48

Not Qualified

33554432 bit

.0001 Amp

70 ns

K1S32161CD-FI70T

Samsung

INDUSTRIAL

48

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

35 mA

2097152 words

COMMON

2.9

2.9

16

GRID ARRAY, FINE PITCH

BGA48,6X8,30

Other Memory ICs

.75 mm

85 Cel

3-STATE

2MX16

2M

-40 Cel

BOTTOM

R-PBGA-B48

Not Qualified

33554432 bit

.0001 Amp

70 ns

K5A3280YTC-T755

Samsung

MEMORY CIRCUIT

INDUSTRIAL

69

FBGA

SQUARE

PLASTIC/EPOXY

YES

CMOS

BALL

50 mA

3

FLASH+SRAM

3

GRID ARRAY, FINE PITCH

BGA69,10X10,32

Other Memory ICs

.8 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B69

Not Qualified

.000015 Amp

70 ns

KAL00B00BM-FGVV

Samsung

MEMORY CIRCUIT

OTHER

127

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

15 mA

1.8

FLASH+SDRAM

1.8

GRID ARRAY, FINE PITCH

BGA127,12X13,32

Other Memory ICs

.8 mm

85 Cel

-25 Cel

BOTTOM

R-PBGA-B127

Not Qualified

.00005 Amp

KBE00D002M-F407

Samsung

MEMORY CIRCUIT

OTHER

137

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

100 mA

1.8

FLASH+SDRAM

1.8

GRID ARRAY, FINE PITCH

BGA137,10X15,32

Other Memory ICs

.8 mm

85 Cel

-25 Cel

BOTTOM

R-PBGA-B137

Not Qualified

.000001 Amp

45 ns

K1C6416B8D-FI70T

Samsung

INDUSTRIAL

54

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

40 mA

4194304 words

COMMON

1.8

1.8

16

GRID ARRAY, FINE PITCH

BGA54,6X9,30

Other Memory ICs

.75 mm

85 Cel

3-STATE

4MX16

4M

-40 Cel

BOTTOM

R-PBGA-B54

3

Not Qualified

67108864 bit

240

.00003 Amp

70 ns

K1B6416B8D-BI700

Samsung

INDUSTRIAL

54

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

40 mA

4194304 words

COMMON

1.8

1.8

16

GRID ARRAY, FINE PITCH

BGA54,6X9,30

Other Memory ICs

.75 mm

85 Cel

3-STATE

4MX16

4M

-40 Cel

BOTTOM

R-PBGA-B54

Not Qualified

67108864 bit

.00012 Amp

70 ns

K1S64161CD-BI70T

Samsung

INDUSTRIAL

48

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

40 mA

4194304 words

COMMON

2.9

2.9

16

GRID ARRAY, FINE PITCH

BGA48,6X8,30

Other Memory ICs

.75 mm

85 Cel

3-STATE

4MX16

4M

-40 Cel

BOTTOM

R-PBGA-B48

Not Qualified

67108864 bit

.00012 Amp

70 ns

K1S6416BCD-BI700

Samsung

INDUSTRIAL

48

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

40 mA

4194304 words

COMMON

1.8

1.8

16

GRID ARRAY, FINE PITCH

BGA48,6X8,30

Other Memory ICs

.75 mm

85 Cel

3-STATE

4MX16

4M

-40 Cel

BOTTOM

R-PBGA-B48

Not Qualified

67108864 bit

.00012 Amp

70 ns

KAA00BB07M-DGUV

Samsung

MEMORY CIRCUIT

OTHER

137

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

15 mA

1.8

FLASH+PSRAM

1.8

GRID ARRAY, FINE PITCH

BGA137,10X15,32

Other Memory ICs

.8 mm

85 Cel

-25 Cel

BOTTOM

R-PBGA-B137

Not Qualified

.001 Amp

85 ns

K1S3216B1C-FI70

Samsung

INDUSTRIAL

48

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

30 mA

2097152 words

COMMON

1.8/2

16

GRID ARRAY, FINE PITCH

BGA48,6X8,30

Other Memory ICs

.75 mm

85 Cel

3-STATE

2MX16

2M

-40 Cel

BOTTOM

R-PBGA-B48

Not Qualified

33554432 bit

.0001 Amp

70 ns

KAD100300B-TNNL

Samsung

MEMORY CIRCUIT

INDUSTRIAL

69

FBGA

SQUARE

PLASTIC/EPOXY

YES

HYBRID

BALL

40 mA

3

FLASH+PSRAM

3

GRID ARRAY, FINE PITCH

BGA69,10X10,32

Other Memory ICs

.8 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B69

Not Qualified

.00002 Amp

80 ns

KA100O015E-BJTT

Samsung

MEMORY CIRCUIT

OTHER

137

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

25 mA

1.8

FLASH+SDRAM

1.8

GRID ARRAY, FINE PITCH

BGA137,10X15,32

Other Memory ICs

.8 mm

85 Cel

-30 Cel

BOTTOM

R-PBGA-B137

Not Qualified

.002 Amp

KAB02D100M-TNGP

Samsung

MEMORY CIRCUIT

OTHER

80

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

HYBRID

BALL

35 mA

3

FLASH+PSRAM

3

GRID ARRAY, FINE PITCH

BGA80,8X13,32

Other Memory ICs

.8 mm

85 Cel

-25 Cel

BOTTOM

R-PBGA-B80

Not Qualified

.00001 Amp

85 ns

K1C6416B2D-BI700

Samsung

INDUSTRIAL

54

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

40 mA

4194304 words

COMMON

1.8

1.8

16

GRID ARRAY, FINE PITCH

BGA54,6X9,32

Other Memory ICs

.8 mm

85 Cel

3-STATE

4MX16

4M

-40 Cel

BOTTOM

R-PBGA-B54

3

Not Qualified

67108864 bit

260

.00003 Amp

70 ns

NANDB0R3N0DZPA5F

Micron Technology

MEMORY CIRCUIT

OTHER

152

FBGA

SQUARE

PLASTIC/EPOXY

YES

BALL

1.8

FLASH+SDRAM

1.8

GRID ARRAY, FINE PITCH

BGA152,21X21,25

Other Memory ICs

.635 mm

85 Cel

-30 Cel

BOTTOM

S-PBGA-B152

Not Qualified

NANDB9R3N0CZQA5E

Micron Technology

MEMORY CIRCUIT

OTHER

152

FBGA

SQUARE

PLASTIC/EPOXY

YES

BALL

1.8

FLASH+SDRAM

1.8

GRID ARRAY, FINE PITCH

BGA152,21X21,25

Other Memory ICs

.635 mm

85 Cel

-30 Cel

BOTTOM

S-PBGA-B152

Not Qualified

PF38F4070L0YTB0

Micron Technology

MEMORY CIRCUIT

103

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

BALL

80 mA

1.8

FLASH+SDRAM

1.8

GRID ARRAY, FINE PITCH

BGA103,9X12,32

Other Memory ICs

.8 mm

BOTTOM

R-PBGA-B103

Not Qualified

.00002 Amp

70 ns

NAND98R3M1BZBC5E

Micron Technology

MEMORY CIRCUIT

OTHER

137

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

BALL

1.8

FLASH+SDRAM

1.8

GRID ARRAY, FINE PITCH

BGA137,10X15,32

Other Memory ICs

.8 mm

85 Cel

-30 Cel

BOTTOM

R-PBGA-B137

Not Qualified

M36W0R5040T5ZAQF

Micron Technology

MEMORY CIRCUIT

OTHER

88

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

1.8

FLASH+PSRAM

1.8

GRID ARRAY, FINE PITCH

BGA88,8X12,32

Other Memory ICs

.8 mm

85 Cel

-30 Cel

BOTTOM

R-PBGA-B88

Not Qualified

.00001 Amp

70 ns

MT45W4MW16BFB-701WTES

Micron Technology

54

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

35 mA

4194304 words

COMMON

1.8,1.8/3

16

GRID ARRAY, FINE PITCH

BGA54,6X9,30

Other Memory ICs

.75 mm

3-STATE

4MX16

4M

BOTTOM

R-PBGA-B54

Not Qualified

67108864 bit

.00012 Amp

70 ns

M36P0R9060N0ZANF

Micron Technology

MEMORY CIRCUIT

OTHER

107

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

HYBRID

BALL

1.8

FLASH+PSRAM

1.8

GRID ARRAY, FINE PITCH

BGA107,9X12,32

Other Memory ICs

.8 mm

85 Cel

-30 Cel

BOTTOM

R-PBGA-B107

Not Qualified

96 ns

NANDC3R4N5AZCC5F

Micron Technology

MEMORY CIRCUIT

OTHER

137

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

BALL

1.8

FLASH+SDRAM

1.8

GRID ARRAY, FINE PITCH

BGA137,10X15,32

Other Memory ICs

.8 mm

85 Cel

-30 Cel

BOTTOM

R-PBGA-B137

Not Qualified

NANDA9R3N1CZBC5F

Micron Technology

MEMORY CIRCUIT

OTHER

137

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

BALL

1.8

FLASH+SDRAM

1.8

GRID ARRAY, FINE PITCH

BGA137,10X15,32

Other Memory ICs

.8 mm

85 Cel

-30 Cel

BOTTOM

R-PBGA-B137

Not Qualified

PF38F4040L0YWQ0

Micron Technology

MEMORY CIRCUIT

88

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

BALL

35 mA

1.8

FLASH+PSRAM

1.8

GRID ARRAY, FINE PITCH

BGA88,8X12,32

Other Memory ICs

.8 mm

BOTTOM

R-PBGA-B88

Not Qualified

.00011 Amp

85 ns

NANDA9R4N2AZBA5F

Micron Technology

MEMORY CIRCUIT

OTHER

149

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

BALL

1.8

FLASH+SDRAM

1.8

GRID ARRAY, FINE PITCH

BGA149,12X16,32

Other Memory ICs

.8 mm

85 Cel

-30 Cel

BOTTOM

R-PBGA-B149

Not Qualified

NANDA9R3N0CZQA5E

Micron Technology

MEMORY CIRCUIT

OTHER

152

FBGA

SQUARE

PLASTIC/EPOXY

YES

BALL

1.8

FLASH+SDRAM

1.8

GRID ARRAY, FINE PITCH

BGA152,21X21,25

Other Memory ICs

.635 mm

85 Cel

-30 Cel

BOTTOM

S-PBGA-B152

Not Qualified

NANDB9R3N0BZQA5F

Micron Technology

MEMORY CIRCUIT

OTHER

152

FBGA

SQUARE

PLASTIC/EPOXY

YES

BALL

1.8

FLASH+SDRAM

1.8

GRID ARRAY, FINE PITCH

BGA152,21X21,25

Other Memory ICs

.635 mm

85 Cel

-30 Cel

BOTTOM

S-PBGA-B152

Not Qualified

NANDB9R3N0BZQA5E

Micron Technology

MEMORY CIRCUIT

OTHER

152

FBGA

SQUARE

PLASTIC/EPOXY

YES

BALL

1.8

FLASH+SDRAM

1.8

GRID ARRAY, FINE PITCH

BGA152,21X21,25

Other Memory ICs

.635 mm

85 Cel

-30 Cel

BOTTOM

S-PBGA-B152

Not Qualified

NANDBAR3N6DZPC5E

Micron Technology

MEMORY CIRCUIT

OTHER

128

FBGA

SQUARE

PLASTIC/EPOXY

YES

BALL

1.8

FLASH+SDRAM

1.8

GRID ARRAY, FINE PITCH

BGA128,18X18,25

Other Memory ICs

.635 mm

85 Cel

-30 Cel

BOTTOM

S-PBGA-B128

Not Qualified

PF38F2030W0YCQ0

Micron Technology

MEMORY CIRCUIT

88

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

HYBRID

BALL

35 mA

1.8

FLASH+PSRAM

1.8

GRID ARRAY, FINE PITCH

BGA88,8X12,32

Other Memory ICs

.8 mm

BOTTOM

R-PBGA-B88

Not Qualified

.00011 Amp

70 ns

NANDB9R4N0CZBA5F

Micron Technology

MEMORY CIRCUIT

OTHER

149

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

BALL

1.8

FLASH+SDRAM

1.8

GRID ARRAY, FINE PITCH

BGA149,12X16,32

Other Memory ICs

.8 mm

85 Cel

-30 Cel

BOTTOM

R-PBGA-B149

Not Qualified

PF38F3050L0YFQ0

Micron Technology

MEMORY CIRCUIT

88

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

BALL

35 mA

1.8

FLASH+PSRAM

1.8

GRID ARRAY, FINE PITCH

BGA88,8X12,32

Other Memory ICs

.8 mm

BOTTOM

R-PBGA-B88

Not Qualified

.00011 Amp

85 ns

PF38F3060L0YBB0

Micron Technology

MEMORY CIRCUIT

103

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

BALL

80 mA

1.8

FLASH+SDRAM

1.8

GRID ARRAY, FINE PITCH

BGA103,9X12,32

Other Memory ICs

.8 mm

BOTTOM

R-PBGA-B103

Not Qualified

.00002 Amp

70 ns

NAND99R4M2BZBA5E

Micron Technology

MEMORY CIRCUIT

OTHER

149

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

BALL

1.8

FLASH+SDRAM

1.8

GRID ARRAY, FINE PITCH

BGA149,12X16,32

Other Memory ICs

.8 mm

85 Cel

-30 Cel

BOTTOM

R-PBGA-B149

Not Qualified

NANDBAR3N1BZPA5E

Micron Technology

MEMORY CIRCUIT

OTHER

152

FBGA

SQUARE

PLASTIC/EPOXY

YES

BALL

1.8

FLASH+SDRAM

1.8

GRID ARRAY, FINE PITCH

BGA152,21X21,25

Other Memory ICs

.635 mm

85 Cel

-30 Cel

BOTTOM

S-PBGA-B152

Not Qualified

PF38F3030L0ZTQ0

Micron Technology

MEMORY CIRCUIT

88

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

HYBRID

BALL

35 mA

1.8

FLASH+PSRAM

1.8

GRID ARRAY, FINE PITCH

BGA88,8X12,32

Other Memory ICs

.8 mm

BOTTOM

R-PBGA-B88

Not Qualified

88 ns

NANDB9R4N5DZBC5E

Micron Technology

MEMORY CIRCUIT

OTHER

137

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

BALL

1.8

FLASH+SDRAM

1.8

GRID ARRAY, FINE PITCH

BGA137,10X15,32

Other Memory ICs

.8 mm

85 Cel

-30 Cel

BOTTOM

R-PBGA-B137

Not Qualified

NAND98R3M0AZPA5F

Micron Technology

MEMORY CIRCUIT

OTHER

152

FBGA

SQUARE

PLASTIC/EPOXY

YES

BALL

1.8

FLASH+SDRAM

1.8

GRID ARRAY, FINE PITCH

BGA152,21X21,25

Other Memory ICs

.635 mm

85 Cel

-30 Cel

BOTTOM

S-PBGA-B152

Not Qualified

NANDD3R4N5BZCC5F

Micron Technology

MEMORY CIRCUIT

OTHER

137

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

BALL

1.8

FLASH+SDRAM

1.8

GRID ARRAY, FINE PITCH

BGA137,10X15,32

Other Memory ICs

.8 mm

85 Cel

-30 Cel

BOTTOM

R-PBGA-B137

Not Qualified

PF38F2030W0YBQF

Micron Technology

MEMORY CIRCUIT

OTHER

88

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

HYBRID

BALL

55 mA

FLASH+PSRAM

1.8,3

GRID ARRAY, FINE PITCH

BGA88,8X12,32

Other Memory ICs

.8 mm

85 Cel

-25 Cel

BOTTOM

R-PBGA-B88

Not Qualified

.000005 Amp

PF38F4040L0YFQ0

Micron Technology

MEMORY CIRCUIT

88

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

BALL

35 mA

1.8

FLASH+PSRAM

1.8

GRID ARRAY, FINE PITCH

BGA88,8X12,32

Other Memory ICs

.8 mm

BOTTOM

R-PBGA-B88

Not Qualified

.00011 Amp

85 ns

RD38F3060L0YTB0

Micron Technology

MEMORY CIRCUIT

103

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

BALL

80 mA

1.8

FLASH+SDRAM

1.8

GRID ARRAY, FINE PITCH

BGA103,9X12,32

Other Memory ICs

.8 mm

BOTTOM

R-PBGA-B103

Not Qualified

.00002 Amp

70 ns

NAND98R4M2CZBA5E

Micron Technology

MEMORY CIRCUIT

OTHER

149

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

BALL

1.8

FLASH+SDRAM

1.8

GRID ARRAY, FINE PITCH

BGA149,12X16,32

Other Memory ICs

.8 mm

85 Cel

-30 Cel

BOTTOM

R-PBGA-B149

Not Qualified

MT28C64416W18AFW-F705P70TWTES

Micron Technology

MEMORY CIRCUIT

OTHER

77

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

1.8

FLASH+SRAM

1.8

GRID ARRAY, FINE PITCH

BGA77,8X10,32

Other Memory ICs

.8 mm

85 Cel

-25 Cel

BOTTOM

R-PBGA-B77

1

Not Qualified

.000115 Amp

70 ns

NANDA0R3N0BZQA5F

Micron Technology

MEMORY CIRCUIT

OTHER

152

FBGA

SQUARE

PLASTIC/EPOXY

YES

BALL

1.8

FLASH+SDRAM

1.8

GRID ARRAY, FINE PITCH

BGA152,21X21,25

Other Memory ICs

.635 mm

85 Cel

-30 Cel

BOTTOM

S-PBGA-B152

Not Qualified

PF38F3040L0YWQ0

Micron Technology

MEMORY CIRCUIT

88

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

BALL

35 mA

1.8

FLASH+PSRAM

1.8

GRID ARRAY, FINE PITCH

BGA88,8X12,32

Other Memory ICs

.8 mm

BOTTOM

R-PBGA-B88

Not Qualified

.00011 Amp

85 ns

Other Function Memory ICs

Other function memory ICs are a group of integrated circuits that perform specialized functions in addition to storing data. These ICs are used in a wide range of digital devices, including computers, smartphones, and electronic devices.

One example of an other function memory IC is cache memory. Cache memory is a type of memory that stores frequently accessed data and instructions. Cache memory is used to improve the performance of the system by reducing the time it takes to access data from the main memory.

Another example of an other function memory IC is dynamic random-access memory (DRAM). DRAM is a type of memory that stores data as a charge in a capacitor. DRAM is commonly used as the main memory in computers and other digital devices.

Static random-access memory (SRAM) is another type of other function memory IC. SRAM is a type of memory that stores data as a flip-flop, which retains the data as long as power is supplied to the system. SRAM is commonly used as cache memory and in other applications where high-speed access to data is required.

Memory controller ICs are another type of other function memory IC. Memory controller ICs are used to manage the flow of data between the CPU and the memory subsystem. These ICs are commonly used in computer systems and other digital devices to ensure that data is transferred efficiently and reliably.