Part | RoHS | Manufacturer | Memory IC Type | Temperature Grade | No. of Terminals | Package Code | Refresh Cycles | Package Shape | Total Dose (V) | Package Body Material | Access Mode | Surface Mount | No. of Functions | Technology | Screening Level | Terminal Form | Parallel or Serial | Operating Mode | Sector Size (Words) | Maximum Supply Current | No. of Words | Sequential Burst Length | Self Refresh | Input/Output Type | Nominal Supply Voltage / Vsup (V) | Mixed Memory Type | Toggle Bit | Power Supplies (V) | Memory Width | Package Style (Meter) | Package Equivalence Code | Sub-Category | Minimum Data Retention Time | Terminal Pitch | Maximum Operating Temperature | Reverse Pinout | Output Characteristics | Organization | No. of Words Code | Minimum Standby Voltage | Minimum Operating Temperature | No. of Sectors/Size | Command User Interface | Terminal Finish | I2C Control Byte | Terminal Position | No. of Ports | Write Protection | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Endurance | Maximum Clock Frequency (fCLK) | Width | Qualification | Serial Bus Type | Boot Block | Memory Density | Minimum Supply Voltage (Vsup) | Additional Features | Page Size (words) | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Type | Maximum Standby Current | Interleaved Burst Length | Length | Common Flash Interface | Maximum Access Time | Programming Voltage (V) | Data Polling |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microsemi |
MEMORY CIRCUIT |
MILITARY |
66 |
PGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
NO |
1 |
CMOS |
PIN/PEG |
ASYNCHRONOUS |
524288 words |
5 |
32 |
GRID ARRAY |
2.54 mm |
125 Cel |
512KX32 |
512K |
-55 Cel |
GOLD |
PERPENDICULAR |
S-CPGA-P66 |
5.5 V |
5.7 mm |
35.2 mm |
Not Qualified |
16777216 bit |
4.5 V |
SRAM IS ORGANISED AS 512K X 32 |
e4 |
35.2 mm |
|||||||||||||||||||||||||||||||||||||||||
Microsemi |
MEMORY CIRCUIT |
MILITARY |
68 |
QFP |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
CMOS |
GULL WING |
ASYNCHRONOUS |
131072 words |
5 |
16 |
FLATPACK |
1.27 mm |
125 Cel |
128KX16 |
128K |
-55 Cel |
QUAD |
S-CQFP-G68 |
5.5 V |
3.56 mm |
23.88 mm |
2097152 bit |
4.5 V |
SRAM IS ORGANISED AS 128K X 32 |
23.88 mm |
||||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
MILITARY |
28 |
QCCN |
SQUARE |
CERAMIC |
YES |
TTL |
MIL-STD-883 Class B (Modified) |
NO LEAD |
CHIP CARRIER |
LCC28,.45SQ |
Other Memory ICs |
1.27 mm |
125 Cel |
-55 Cel |
QUAD |
S-XQCC-N28 |
Not Qualified |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
MILITARY |
28 |
QCCN |
SQUARE |
CERAMIC |
YES |
TTL |
38535Q/M;38534H;883B |
NO LEAD |
CHIP CARRIER |
LCC28,.45SQ |
Other Memory ICs |
1.27 mm |
125 Cel |
-55 Cel |
QUAD |
S-XQCC-N28 |
Not Qualified |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
MILITARY |
28 |
QCCN |
SQUARE |
CERAMIC |
YES |
TTL |
NO LEAD |
CHIP CARRIER |
LCC28,.45SQ |
Other Memory ICs |
1.27 mm |
125 Cel |
-55 Cel |
QUAD |
S-XQCC-N28 |
Not Qualified |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
MILITARY |
16 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
TTL |
MIL-STD-883 Class B (Modified) |
THROUGH-HOLE |
5 |
5 |
IN-LINE |
DIP16,.3 |
Other Memory ICs |
2.54 mm |
125 Cel |
-55 Cel |
DUAL |
R-XDIP-T16 |
Not Qualified |
|||||||||||||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
MILITARY |
28 |
QCCN |
SQUARE |
CERAMIC |
YES |
TTL |
38535Q/M;38534H;883B |
NO LEAD |
CHIP CARRIER |
LCC28,.45SQ |
Other Memory ICs |
1.27 mm |
125 Cel |
-55 Cel |
QUAD |
S-XQCC-N28 |
Not Qualified |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
OTP ROM |
MILITARY |
24 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
MOS |
38535Q/M;38534H;883B |
THROUGH-HOLE |
1024 words |
8 |
IN-LINE |
DIP24,.6 |
Other Memory ICs |
2.54 mm |
125 Cel |
3-STATE |
1KX8 |
1K |
-55 Cel |
DUAL |
R-XDIP-T24 |
Not Qualified |
8192 bit |
450 ns |
|||||||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
MILITARY |
28 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
TTL |
MIL-STD-883 Class B (Modified) |
THROUGH-HOLE |
IN-LINE |
DIP28,.6 |
Other Memory ICs |
2.54 mm |
125 Cel |
-55 Cel |
DUAL |
R-XDIP-T28 |
Not Qualified |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
MILITARY |
20 |
QCCN |
SQUARE |
CERAMIC |
YES |
CMOS |
38535Q/M;38534H;883B |
NO LEAD |
2/6 |
CHIP CARRIER |
LCC20,.35SQ |
Other Memory ICs |
1.27 mm |
125 Cel |
-55 Cel |
QUAD |
S-XQCC-N20 |
Not Qualified |
||||||||||||||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
MILITARY |
20 |
QCCN |
SQUARE |
CERAMIC |
YES |
CMOS |
NO LEAD |
2/6 |
CHIP CARRIER |
LCC20,.35SQ |
Other Memory ICs |
1.27 mm |
125 Cel |
-55 Cel |
QUAD |
S-XQCC-N20 |
Not Qualified |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
MILITARY |
16 |
DFP |
RECTANGULAR |
CERAMIC |
YES |
TTL |
MIL-STD-883 Class B (Modified) |
FLAT |
5 |
5 |
FLATPACK |
FL16,.3 |
Other Memory ICs |
1.27 mm |
125 Cel |
-55 Cel |
DUAL |
R-XDFP-F16 |
Not Qualified |
|||||||||||||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
MILITARY |
32 |
QCCN |
RECTANGULAR |
CERAMIC |
YES |
MOS |
38535Q/M;38534H;883B |
NO LEAD |
1024 words |
8 |
CHIP CARRIER |
LCC32,.45X.55 |
Other Memory ICs |
1.27 mm |
125 Cel |
3-STATE |
1KX8 |
1K |
-55 Cel |
QUAD |
R-XQCC-N32 |
Not Qualified |
8192 bit |
350 ns |
||||||||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
VIDEO DRAM |
MILITARY |
68 |
PGA |
SQUARE |
CERAMIC |
NO |
CMOS |
38535Q/M;38534H;883B |
PIN/PEG |
225 mA |
262144 words |
5 |
5 |
16 |
GRID ARRAY |
PGA68,9X9 |
Other Memory ICs |
2.54 mm |
125 Cel |
256KX16 |
256K |
-55 Cel |
PERPENDICULAR |
S-XPGA-P68 |
Not Qualified |
4194304 bit |
.012 Amp |
70 ns |
||||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
MILITARY |
28 |
QCCN |
SQUARE |
CERAMIC |
YES |
TTL |
38535Q/M;38534H;883B |
NO LEAD |
CHIP CARRIER |
LCC28,.45SQ |
Other Memory ICs |
1.27 mm |
125 Cel |
-55 Cel |
QUAD |
S-XQCC-N28 |
Not Qualified |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
MEMORY CIRCUIT |
MILITARY |
16 |
DIP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
NO |
1 |
CMOS |
MIL-PRF-38535 Class B |
THROUGH-HOLE |
ASYNCHRONOUS |
4 words |
5 |
4 |
IN-LINE |
125 Cel |
4X4 |
4 |
-55 Cel |
DUAL |
R-CDIP-T16 |
5.5 V |
Not Qualified |
16 bit |
4.5 V |
|||||||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
MILITARY |
16 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
TTL |
38535Q/M;38534H;883B |
THROUGH-HOLE |
IN-LINE |
DIP16,.3 |
Other Memory ICs |
2.54 mm |
125 Cel |
-55 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-XDIP-T16 |
Not Qualified |
e0 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
MILITARY |
24 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
TTL |
38535Q/M;38534H;883B |
THROUGH-HOLE |
IN-LINE |
DIP24,.6 |
Other Memory ICs |
2.54 mm |
125 Cel |
-55 Cel |
DUAL |
R-XDIP-T24 |
Not Qualified |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
OTP ROM |
MILITARY |
24 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
MOS |
38535Q/M;38534H;883B |
THROUGH-HOLE |
1024 words |
8 |
IN-LINE |
DIP24,.6 |
Other Memory ICs |
2.54 mm |
125 Cel |
3-STATE |
1KX8 |
1K |
-55 Cel |
DUAL |
R-XDIP-T24 |
Not Qualified |
8192 bit |
450 ns |
|||||||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
MEMORY CIRCUIT |
MILITARY |
156 |
PGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
NO |
1 |
TTL |
PIN/PEG |
SYNCHRONOUS |
64 words |
5 |
40 |
GRID ARRAY |
125 Cel |
64X40 |
64 |
-55 Cel |
PERPENDICULAR |
S-CPGA-P156 |
5.5 V |
Not Qualified |
2560 bit |
4.5 V |
||||||||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
MILITARY |
16 |
DFP |
RECTANGULAR |
CERAMIC |
YES |
TTL |
MIL-STD-883 Class B (Modified) |
FLAT |
5 |
5 |
FLATPACK |
FL16,.3 |
Other Memory ICs |
1.27 mm |
125 Cel |
-55 Cel |
DUAL |
R-XDFP-F16 |
Not Qualified |
|||||||||||||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
MILITARY |
16 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
TTL |
MIL-STD-883 Class B (Modified) |
THROUGH-HOLE |
5 |
5 |
IN-LINE |
DIP16,.3 |
Other Memory ICs |
2.54 mm |
125 Cel |
-55 Cel |
DUAL |
R-XDIP-T16 |
Not Qualified |
|||||||||||||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
MEMORY CIRCUIT |
MILITARY |
156 |
PGA |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
NO |
1 |
TTL |
PIN/PEG |
SYNCHRONOUS |
64 words |
5 |
2,5 |
40 |
GRID ARRAY |
PGA156M,15X15MOD |
Other Memory ICs |
2.54 mm |
125 Cel |
64X40 |
64 |
-55 Cel |
PERPENDICULAR |
S-CPGA-P156 |
5.5 V |
Not Qualified |
2560 bit |
4.5 V |
NOT SPECIFIED |
NOT SPECIFIED |
||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
MILITARY |
32 |
QCCN |
RECTANGULAR |
CERAMIC |
YES |
MOS |
38535Q/M;38534H;883B |
NO LEAD |
1024 words |
8 |
CHIP CARRIER |
LCC32,.45X.55 |
Other Memory ICs |
1.27 mm |
125 Cel |
3-STATE |
1KX8 |
1K |
-55 Cel |
QUAD |
R-XQCC-N32 |
Not Qualified |
8192 bit |
450 ns |
||||||||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
MILITARY |
20 |
QCCN |
SQUARE |
CERAMIC |
YES |
CMOS |
NO LEAD |
2/6 |
CHIP CARRIER |
LCC20,.35SQ |
Other Memory ICs |
1.27 mm |
125 Cel |
-55 Cel |
QUAD |
S-XQCC-N20 |
Not Qualified |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
MILITARY |
16 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
CMOS |
THROUGH-HOLE |
2/6 |
IN-LINE |
DIP16,.3 |
Other Memory ICs |
2.54 mm |
125 Cel |
-55 Cel |
DUAL |
R-XDIP-T16 |
Not Qualified |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
MILITARY |
24 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
TTL |
MIL-STD-883 Class B (Modified) |
THROUGH-HOLE |
IN-LINE |
DIP24,.3 |
Other Memory ICs |
2.54 mm |
125 Cel |
-55 Cel |
DUAL |
R-XDIP-T24 |
Not Qualified |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
MILITARY |
16 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
CMOS |
38535Q/M;38534H;883B |
THROUGH-HOLE |
2/6 |
IN-LINE |
DIP16,.3 |
Other Memory ICs |
2.54 mm |
125 Cel |
-55 Cel |
DUAL |
R-XDIP-T16 |
Not Qualified |
||||||||||||||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
MEMORY CIRCUIT |
MILITARY |
16 |
DFP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
CMOS |
FLAT |
ASYNCHRONOUS |
4 words |
5 |
4 |
FLATPACK |
125 Cel |
4X4 |
4 |
-55 Cel |
DUAL |
R-CDFP-F16 |
5.5 V |
Not Qualified |
16 bit |
4.5 V |
||||||||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
MILITARY |
32 |
QCCN |
RECTANGULAR |
CERAMIC |
YES |
MOS |
38535Q/M;38534H;883B |
NO LEAD |
8192 words |
COMMON |
8 |
CHIP CARRIER |
LCC32,.45X.55 |
Other Memory ICs |
1.27 mm |
125 Cel |
3-STATE |
8KX8 |
8K |
-55 Cel |
QUAD |
R-XQCC-N32 |
Not Qualified |
65536 bit |
450 ns |
|||||||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
MILITARY |
32 |
QCCN |
RECTANGULAR |
CERAMIC |
YES |
MOS |
38535Q/M;38534H;883B |
NO LEAD |
1024 words |
8 |
CHIP CARRIER |
LCC32,.45X.55 |
Other Memory ICs |
1.27 mm |
125 Cel |
3-STATE |
1KX8 |
1K |
-55 Cel |
QUAD |
R-XQCC-N32 |
Not Qualified |
8192 bit |
450 ns |
||||||||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
OTP ROM |
MILITARY |
28 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
MOS |
38535Q/M;38534H;883B |
THROUGH-HOLE |
8192 words |
COMMON |
8 |
IN-LINE |
DIP28,.6 |
Other Memory ICs |
2.54 mm |
125 Cel |
3-STATE |
8KX8 |
8K |
-55 Cel |
DUAL |
R-XDIP-T28 |
Not Qualified |
65536 bit |
450 ns |
||||||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
MEMORY CIRCUIT |
MILITARY |
16 |
DIP |
RECTANGULAR |
NO |
1 |
TTL |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
16 words |
5 |
4 |
IN-LINE |
SRAMs |
125 Cel |
3-STATE |
16X4 |
16 |
-55 Cel |
DUAL |
R-XDIP-T16 |
5.5 V |
Not Qualified |
64 bit |
4.5 V |
90 ns |
|||||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
MILITARY |
28 |
QCCN |
SQUARE |
CERAMIC |
YES |
TTL |
NO LEAD |
CHIP CARRIER |
LCC28,.45SQ |
Other Memory ICs |
1.27 mm |
125 Cel |
-55 Cel |
QUAD |
S-XQCC-N28 |
Not Qualified |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
MILITARY |
28 |
QCCN |
SQUARE |
CERAMIC |
YES |
TTL |
MIL-STD-883 Class B (Modified) |
NO LEAD |
CHIP CARRIER |
LCC28,.45SQ |
Other Memory ICs |
1.27 mm |
125 Cel |
-55 Cel |
QUAD |
S-XQCC-N28 |
Not Qualified |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
OTP ROM |
MILITARY |
24 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
MOS |
38535Q/M;38534H;883B |
THROUGH-HOLE |
1024 words |
8 |
IN-LINE |
DIP24,.6 |
Other Memory ICs |
2.54 mm |
125 Cel |
3-STATE |
1KX8 |
1K |
-55 Cel |
DUAL |
R-XDIP-T24 |
Not Qualified |
8192 bit |
350 ns |
|||||||||||||||||||||||||||||||||||||||||||||||
Texas Instruments |
MEMORY CIRCUIT |
MILITARY |
16 |
DIP |
RECTANGULAR |
NO |
1 |
TTL |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
16 words |
5 |
4 |
IN-LINE |
SRAMs |
125 Cel |
3-STATE |
16X4 |
16 |
-55 Cel |
DUAL |
R-XDIP-T16 |
5.5 V |
Not Qualified |
64 bit |
4.5 V |
90 ns |
|||||||||||||||||||||||||||||||||||||||||||||
STMicroelectronics |
MEMORY CIRCUIT |
MILITARY |
40 |
DIP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
NO |
1 |
CMOS |
THROUGH-HOLE |
ASYNCHRONOUS |
250 mA |
128 words |
5 |
5 |
8 |
IN-LINE |
DIP40,.6 |
FIFOs |
2.54 mm |
125 Cel |
128X8 |
128 |
-55 Cel |
TIN LEAD |
DUAL |
R-CDIP-T40 |
5.25 V |
4 MHz |
15.24 mm |
Not Qualified |
1024 bit |
4.75 V |
e0 |
|||||||||||||||||||||||||||||||||||||||
STMicroelectronics |
MILITARY |
24 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
CMOS |
THROUGH-HOLE |
3/18 |
IN-LINE |
DIP24,.6 |
Other Memory ICs |
2.54 mm |
125 Cel |
-55 Cel |
DUAL |
R-XDIP-T24 |
Not Qualified |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||
STMicroelectronics |
MILITARY |
16 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
TTL |
THROUGH-HOLE |
5 |
5 |
IN-LINE |
DIP16,.3 |
Other Memory ICs |
2.54 mm |
125 Cel |
-55 Cel |
DUAL |
R-XDIP-T16 |
Not Qualified |
||||||||||||||||||||||||||||||||||||||||||||||||||||||
STMicroelectronics |
MILITARY |
24 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
CMOS |
THROUGH-HOLE |
3/18 |
IN-LINE |
DIP24,.6 |
Other Memory ICs |
2.54 mm |
125 Cel |
-55 Cel |
DUAL |
R-XDIP-T24 |
Not Qualified |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||
STMicroelectronics |
MEMORY CIRCUIT |
MILITARY |
40 |
DIP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
NO |
1 |
CMOS |
THROUGH-HOLE |
ASYNCHRONOUS |
250 mA |
128 words |
5 |
5 |
8 |
IN-LINE |
DIP40,.6 |
FIFOs |
2.54 mm |
125 Cel |
128X8 |
128 |
-55 Cel |
TIN LEAD |
DUAL |
R-CDIP-T40 |
5.25 V |
6 MHz |
15.24 mm |
Not Qualified |
1024 bit |
4.75 V |
e0 |
|||||||||||||||||||||||||||||||||||||||
|
Xilinx |
MEMORY CIRCUIT |
MILITARY |
8 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
CMOS |
THROUGH-HOLE |
SYNCHRONOUS |
36288 words |
5 |
1 |
IN-LINE |
2.54 mm |
125 Cel |
36288X1 |
36288 |
-55 Cel |
DUAL |
R-GDIP-T8 |
5.5 V |
5.08 mm |
7.62 mm |
Not Qualified |
36288 bit |
4.5 V |
NOT SPECIFIED |
NOT SPECIFIED |
10.16 mm |
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|
Xilinx |
MEMORY CIRCUIT |
MILITARY |
8 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
CMOS |
THROUGH-HOLE |
SYNCHRONOUS |
65536 words |
5 |
1 |
IN-LINE |
2.54 mm |
125 Cel |
64KX1 |
64K |
-55 Cel |
MATTE TIN |
DUAL |
R-GDIP-T8 |
5.5 V |
5.08 mm |
7.62 mm |
Not Qualified |
65536 bit |
4.5 V |
e3 |
10.16 mm |
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Renesas Electronics |
OTP ROM |
MILITARY |
24 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
CMOS |
MIL-STD-883 Class B (Modified) |
THROUGH-HOLE |
6 mA |
1024 words |
COMMON |
4 |
IN-LINE |
DIP24,.6 |
Other Memory ICs |
2.54 mm |
125 Cel |
3-STATE |
1KX4 |
1K |
-55 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-XDIP-T24 |
Not Qualified |
4096 bit |
e0 |
.00004 Amp |
600 ns |
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Renesas Electronics |
MEMORY CIRCUIT |
MILITARY |
68 |
PGA |
SQUARE |
CERAMIC |
NO |
CMOS |
38535Q/M;38534H;883B |
PIN/PEG |
80 mA |
5 |
5 |
GRID ARRAY |
PGA68,11X11 |
Other Memory ICs |
2.54 mm |
125 Cel |
-55 Cel |
TIN LEAD |
PERPENDICULAR |
S-XPGA-P68 |
Not Qualified |
e0 |
|||||||||||||||||||||||||||||||||||||||||||||||||
Renesas Electronics |
MEMORY CIRCUIT |
MILITARY |
68 |
PGA |
SQUARE |
CERAMIC |
NO |
CMOS |
PIN/PEG |
5 |
5 |
GRID ARRAY |
PGA68,11X11 |
Other Memory ICs |
2.54 mm |
125 Cel |
-55 Cel |
TIN LEAD |
PERPENDICULAR |
S-XPGA-P68 |
Not Qualified |
e0 |
|||||||||||||||||||||||||||||||||||||||||||||||||||
Renesas Electronics |
MEMORY CIRCUIT |
MILITARY |
68 |
PGA |
SQUARE |
CERAMIC |
NO |
CMOS |
38535Q/M;38534H;883B |
PIN/PEG |
80 mA |
5 |
5 |
GRID ARRAY |
PGA68,11X11 |
Other Memory ICs |
2.54 mm |
125 Cel |
-55 Cel |
TIN LEAD |
PERPENDICULAR |
S-XPGA-P68 |
Not Qualified |
e0 |
Other function memory ICs are a group of integrated circuits that perform specialized functions in addition to storing data. These ICs are used in a wide range of digital devices, including computers, smartphones, and electronic devices.
One example of an other function memory IC is cache memory. Cache memory is a type of memory that stores frequently accessed data and instructions. Cache memory is used to improve the performance of the system by reducing the time it takes to access data from the main memory.
Another example of an other function memory IC is dynamic random-access memory (DRAM). DRAM is a type of memory that stores data as a charge in a capacitor. DRAM is commonly used as the main memory in computers and other digital devices.
Static random-access memory (SRAM) is another type of other function memory IC. SRAM is a type of memory that stores data as a flip-flop, which retains the data as long as power is supplied to the system. SRAM is commonly used as cache memory and in other applications where high-speed access to data is required.
Memory controller ICs are another type of other function memory IC. Memory controller ICs are used to manage the flow of data between the CPU and the memory subsystem. These ICs are commonly used in computer systems and other digital devices to ensure that data is transferred efficiently and reliably.