Part | RoHS | Manufacturer | Memory IC Type | Temperature Grade | No. of Terminals | Package Code | Refresh Cycles | Package Shape | Total Dose (V) | Package Body Material | Surface Mount | No. of Functions | Technology | Screening Level | Nominal Negative Supply Voltage | Terminal Form | Parallel or Serial | Operating Mode | Maximum Supply Current | No. of Words | Self Refresh | Input/Output Type | Nominal Supply Voltage / Vsup (V) | Power Supplies (V) | Memory Width | Package Style (Meter) | Package Equivalence Code | Alternate Memory Width | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Reverse Pinout | Output Characteristics | Organization | No. of Words Code | Minimum Standby Voltage | Minimum Operating Temperature | Terminal Finish | Terminal Position | No. of Ports | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Maximum Clock Frequency (fCLK) | Width | Qualification | Memory Density | Minimum Supply Voltage (Vsup) | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Output Enable | Maximum Standby Current | Length | Maximum Access Time |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Renesas Electronics |
STANDARD SRAM |
MILITARY |
24 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
CMOS |
MIL-STD-883 Class B |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
85 mA |
2048 words |
COMMON |
5 |
5 |
8 |
IN-LINE |
DIP24,.3 |
SRAMs |
2.54 mm |
125 Cel |
3-STATE |
2KX8 |
2K |
2 V |
-55 Cel |
TIN LEAD |
DUAL |
1 |
R-GDIP-T24 |
5.5 V |
5.08 mm |
7.62 mm |
Not Qualified |
16384 bit |
4.5 V |
e0 |
YES |
.0002 Amp |
32.004 mm |
120 ns |
|||||||||||||
|
STMicroelectronics |
STANDARD SRAM |
COMMERCIAL |
24 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
80 mA |
2048 words |
COMMON |
5 |
5 |
8 |
IN-LINE |
DIP24,.6 |
SRAMs |
2.54 mm |
70 Cel |
3-STATE |
2KX8 |
2K |
4.75 V |
0 Cel |
MATTE TIN |
DUAL |
1 |
R-PDIP-T24 |
5.5 V |
9.65 mm |
15.24 mm |
Not Qualified |
16384 bit |
4.75 V |
e3 |
YES |
.003 Amp |
34.545 mm |
||||||||||||||
Xicor |
NON-VOLATILE SRAM |
COMMERCIAL |
18 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
NMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
256 words |
5 |
5 |
4 |
IN-LINE |
DIP18,.3 |
SRAMs |
2.54 mm |
70 Cel |
3-STATE |
256X4 |
256 |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
1 |
R-GDIP-T18 |
5.5 V |
Not Qualified |
1024 bit |
4.5 V |
e0 |
NO |
300 ns |
|||||||||||||||||||||
Xicor |
NON-VOLATILE SRAM |
INDUSTRIAL |
18 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
NMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
256 words |
5 |
5 |
4 |
IN-LINE |
DIP18,.3 |
SRAMs |
2.54 mm |
85 Cel |
3-STATE |
256X4 |
256 |
-40 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
1 |
R-GDIP-T18 |
5.5 V |
Not Qualified |
1024 bit |
4.5 V |
e0 |
NO |
300 ns |
|||||||||||||||||||||
Xicor |
NON-VOLATILE SRAM |
MILITARY |
18 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
MOS |
38535Q/M;38534H;883B |
THROUGH-HOLE |
256 words |
5 |
5 |
4 |
IN-LINE |
DIP18,.3 |
SRAMs |
2.54 mm |
125 Cel |
256X4 |
256 |
-55 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-XDIP-T18 |
Not Qualified |
1024 bit |
e0 |
300 ns |
||||||||||||||||||||||||||||
Xicor |
NON-VOLATILE SRAM |
MILITARY |
18 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
MOS |
38535Q/M;38534H;883B |
THROUGH-HOLE |
256 words |
5 |
5 |
4 |
IN-LINE |
DIP18,.3 |
SRAMs |
2.54 mm |
125 Cel |
256X4 |
256 |
-55 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-XDIP-T18 |
Not Qualified |
1024 bit |
e0 |
300 ns |
||||||||||||||||||||||||||||
Xicor |
NON-VOLATILE SRAM |
MILITARY |
18 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
MOS |
38535Q/M;38534H;883B |
THROUGH-HOLE |
256 words |
5 |
5 |
4 |
IN-LINE |
DIP18,.3 |
SRAMs |
2.54 mm |
125 Cel |
256X4 |
256 |
-55 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-XDIP-T18 |
Not Qualified |
1024 bit |
e0 |
300 ns |
||||||||||||||||||||||||||||
|
Renesas Electronics |
STANDARD SRAM |
INDUSTRIAL |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
8192 words |
5 |
8 |
IN-LINE |
2.54 mm |
85 Cel |
8KX8 |
8K |
-40 Cel |
MATTE TIN |
DUAL |
R-PDIP-T28 |
1 |
5.5 V |
4.572 mm |
7.62 mm |
65536 bit |
4.5 V |
e3 |
260 |
34.671 mm |
19 ns |
||||||||||||||||||||||
|
Onsemi |
NON-VOLATILE SRAM |
INDUSTRIAL |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
SERIAL |
SYNCHRONOUS |
3 mA |
16 words |
5 |
5 |
16 |
IN-LINE |
DIP8,.3 |
SRAMs |
2.54 mm |
85 Cel |
16X16 |
16 |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDIP-T8 |
5.5 V |
5.33 mm |
7.62 mm |
Not Qualified |
256 bit |
4.5 V |
e4 |
260 |
.00003 Amp |
9.27 mm |
375 ns |
|||||||||||||||||
|
Cypress Semiconductor |
STANDARD SRAM |
COMMERCIAL |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
50 mA |
32768 words |
COMMON |
5 |
5 |
8 |
IN-LINE |
DIP28,.6 |
SRAMs |
2.54 mm |
70 Cel |
3-STATE |
32KX8 |
32K |
2 V |
0 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDIP-T28 |
1 |
5.5 V |
5.08 mm |
15.24 mm |
Not Qualified |
262144 bit |
4.5 V |
e4 |
40 |
260 |
36.322 mm |
70 ns |
|||||||||||||
Dallas Semiconductor |
NON-VOLATILE SRAM MODULE |
INDUSTRIAL |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
85 mA |
8192 words |
5 |
5 |
8 |
IN-LINE |
DIP28,.6 |
SRAMs |
2.54 mm |
85 Cel |
8KX8 |
8K |
-40 Cel |
TIN LEAD |
DUAL |
R-PDIP-T28 |
5.5 V |
Not Qualified |
65536 bit |
4.5 V |
e0 |
.005 Amp |
70 ns |
||||||||||||||||||||||
Maxim Integrated |
NON-VOLATILE SRAM MODULE |
INDUSTRIAL |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
PIN/PEG |
PARALLEL |
ASYNCHRONOUS |
85 mA |
8192 words |
5 |
5 |
8 |
MICROELECTRONIC ASSEMBLY |
DIP28,.6 |
SRAMs |
2.54 mm |
85 Cel |
8KX8 |
8K |
-40 Cel |
TIN LEAD |
DUAL |
R-PDMA-P28 |
5.5 V |
Not Qualified |
65536 bit |
4.5 V |
10 YEAR DATA RETENTION |
e0 |
.005 Amp |
70 ns |
|||||||||||||||||||||
|
Analog Devices |
NON-VOLATILE SRAM MODULE |
INDUSTRIAL |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
PIN/PEG |
PARALLEL |
ASYNCHRONOUS |
85 mA |
8192 words |
5 |
5 |
8 |
IN-LINE |
DIP28,.6 |
SRAMs |
2.54 mm |
85 Cel |
8KX8 |
8K |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
R-PDIP-P28 |
5.5 V |
10.668 mm |
15.24 mm |
Not Qualified |
65536 bit |
4.5 V |
10 YEAR DATA RETENTION |
e3 |
.01 Amp |
38.227 mm |
70 ns |
|||||||||||||||||
|
Maxim Integrated |
NON-VOLATILE SRAM MODULE |
COMMERCIAL |
28 |
DIP |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
CMOS |
PIN/PEG |
PARALLEL |
ASYNCHRONOUS |
75 mA |
8192 words |
5 |
5 |
8 |
MICROELECTRONIC ASSEMBLY |
DIP28,.6 |
SRAMs |
2.54 mm |
70 Cel |
8KX8 |
8K |
0 Cel |
MATTE TIN |
DUAL |
R-XDMA-P28 |
5.5 V |
Not Qualified |
65536 bit |
4.5 V |
10 YEAR DATA RETENTION |
e3 |
.005 Amp |
170 ns |
||||||||||||||||||||
Maxim Integrated |
NON-VOLATILE SRAM MODULE |
COMMERCIAL |
28 |
DIP |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
CMOS |
PIN/PEG |
PARALLEL |
ASYNCHRONOUS |
75 mA |
8192 words |
5 |
5 |
8 |
MICROELECTRONIC ASSEMBLY |
DIP28,.6 |
SRAMs |
2.54 mm |
70 Cel |
8KX8 |
8K |
0 Cel |
TIN LEAD |
DUAL |
R-XDMA-P28 |
1 |
5.5 V |
10.54 mm |
15.24 mm |
Not Qualified |
65536 bit |
4.5 V |
10 YEAR DATA RETENTION |
e0 |
.005 Amp |
38.865 mm |
170 ns |
|||||||||||||||||
Maxim Integrated |
NON-VOLATILE SRAM MODULE |
COMMERCIAL |
28 |
DIP |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
CMOS |
PIN/PEG |
PARALLEL |
ASYNCHRONOUS |
85 mA |
32768 words |
5 |
5 |
8 |
MICROELECTRONIC ASSEMBLY |
DIP28,.6 |
SRAMs |
2.54 mm |
70 Cel |
32KX8 |
32K |
0 Cel |
TIN LEAD |
DUAL |
R-XDMA-P28 |
5.5 V |
Not Qualified |
262144 bit |
4.5 V |
10 YEARS DATA RETENTION PERIOD |
e0 |
20 |
240 |
.005 Amp |
120 ns |
|||||||||||||||||||
|
Analog Devices |
NON-VOLATILE SRAM MODULE |
COMMERCIAL |
28 |
DIP |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
CMOS |
PIN/PEG |
PARALLEL |
ASYNCHRONOUS |
85 mA |
32768 words |
5 |
5 |
8 |
MICROELECTRONIC ASSEMBLY |
DIP28,.6 |
SRAMs |
2.54 mm |
70 Cel |
32KX8 |
32K |
0 Cel |
Matte Tin (Sn) - annealed |
DUAL |
R-XDMA-P28 |
1 |
5.5 V |
Not Qualified |
262144 bit |
4.5 V |
e3 |
.0006 Amp |
120 ns |
||||||||||||||||||||
Maxim Integrated |
NON-VOLATILE SRAM MODULE |
COMMERCIAL |
28 |
DIP |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
CMOS |
PIN/PEG |
PARALLEL |
ASYNCHRONOUS |
85 mA |
32768 words |
5 |
5 |
8 |
MICROELECTRONIC ASSEMBLY |
DIP28,.6 |
SRAMs |
2.54 mm |
70 Cel |
32KX8 |
32K |
0 Cel |
TIN LEAD |
DUAL |
R-XDMA-P28 |
1 |
5.5 V |
Not Qualified |
262144 bit |
4.5 V |
10 YEARS DATA RETENTION PERIOD |
e0 |
20 |
240 |
.005 Amp |
150 ns |
||||||||||||||||||
|
Analog Devices |
NON-VOLATILE SRAM MODULE |
COMMERCIAL |
28 |
DIP |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
CMOS |
PIN/PEG |
PARALLEL |
ASYNCHRONOUS |
85 mA |
32768 words |
5 |
5 |
8 |
MICROELECTRONIC ASSEMBLY |
DIP28,.6 |
SRAMs |
2.54 mm |
70 Cel |
32KX8 |
32K |
0 Cel |
Matte Tin (Sn) - annealed |
DUAL |
R-XDMA-P28 |
1 |
5.5 V |
Not Qualified |
262144 bit |
4.5 V |
e3 |
.0006 Amp |
150 ns |
||||||||||||||||||||
Dallas Semiconductor |
NON-VOLATILE SRAM MODULE |
INDUSTRIAL |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
85 mA |
32768 words |
5 |
5 |
8 |
IN-LINE |
DIP28,.6 |
SRAMs |
2.54 mm |
85 Cel |
32KX8 |
32K |
-40 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDIP-T28 |
5.5 V |
Not Qualified |
262144 bit |
4.5 V |
10 YEARS DATA RETENTION PERIOD |
e0 |
.005 Amp |
70 ns |
|||||||||||||||||||||
Maxim Integrated |
NON-VOLATILE SRAM MODULE |
INDUSTRIAL |
28 |
DIP |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
CMOS |
PIN/PEG |
PARALLEL |
ASYNCHRONOUS |
85 mA |
32768 words |
5 |
5 |
8 |
MICROELECTRONIC ASSEMBLY |
DIP28,.6 |
SRAMs |
2.54 mm |
85 Cel |
32KX8 |
32K |
-40 Cel |
TIN LEAD |
DUAL |
R-XDMA-P28 |
5.5 V |
Not Qualified |
262144 bit |
4.5 V |
e0 |
.005 Amp |
70 ns |
||||||||||||||||||||||
|
Analog Devices |
NON-VOLATILE SRAM MODULE |
INDUSTRIAL |
28 |
DIP |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
CMOS |
PIN/PEG |
PARALLEL |
ASYNCHRONOUS |
85 mA |
32768 words |
5 |
5 |
8 |
IN-LINE |
DIP28,.6 |
SRAMs |
2.54 mm |
85 Cel |
32KX8 |
32K |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
R-XDIP-P28 |
5.5 V |
9.4 mm |
15.24 mm |
Not Qualified |
262144 bit |
4.5 V |
e3 |
.0006 Amp |
38.227 mm |
70 ns |
||||||||||||||||||
Maxim Integrated |
NON-VOLATILE SRAM MODULE |
COMMERCIAL |
32 |
DIP |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
85 mA |
131072 words |
5 |
5 |
8 |
MICROELECTRONIC ASSEMBLY |
DIP32,.6 |
SRAMs |
2.54 mm |
70 Cel |
128KX8 |
128K |
0 Cel |
TIN LEAD |
DUAL |
R-XDMA-T32 |
1 |
5.25 V |
Not Qualified |
1048576 bit |
4.75 V |
e0 |
20 |
240 |
.005 Amp |
120 ns |
|||||||||||||||||||
|
Analog Devices |
NON-VOLATILE SRAM MODULE |
COMMERCIAL |
32 |
DIP |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
85 mA |
131072 words |
5 |
5 |
8 |
MICROELECTRONIC ASSEMBLY |
DIP32,.6 |
SRAMs |
2.54 mm |
70 Cel |
128KX8 |
128K |
0 Cel |
Matte Tin (Sn) - annealed |
DUAL |
R-XDMA-T32 |
1 |
5.25 V |
Not Qualified |
1048576 bit |
4.75 V |
e3 |
.0006 Amp |
120 ns |
||||||||||||||||||||
Maxim Integrated |
NON-VOLATILE SRAM MODULE |
COMMERCIAL |
32 |
DIP |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
85 mA |
131072 words |
5 |
5 |
8 |
MICROELECTRONIC ASSEMBLY |
DIP32,.6 |
SRAMs |
2.54 mm |
70 Cel |
128KX8 |
128K |
0 Cel |
TIN LEAD |
DUAL |
R-XDMA-T32 |
1 |
5.5 V |
Not Qualified |
1048576 bit |
4.5 V |
e0 |
.005 Amp |
85 ns |
|||||||||||||||||||||
|
Analog Devices |
NON-VOLATILE SRAM MODULE |
COMMERCIAL |
32 |
DIP |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
85 mA |
131072 words |
5 |
5 |
8 |
MICROELECTRONIC ASSEMBLY |
DIP32,.6 |
SRAMs |
2.54 mm |
70 Cel |
128KX8 |
128K |
0 Cel |
Matte Tin (Sn) - annealed |
DUAL |
R-XDMA-T32 |
5.5 V |
Not Qualified |
1048576 bit |
4.5 V |
e3 |
.0006 Amp |
85 ns |
|||||||||||||||||||||
Maxim Integrated |
NON-VOLATILE SRAM MODULE |
INDUSTRIAL |
32 |
DIP |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
85 mA |
131072 words |
5 |
5 |
8 |
MICROELECTRONIC ASSEMBLY |
DIP32,.6 |
SRAMs |
2.54 mm |
85 Cel |
128KX8 |
128K |
-40 Cel |
TIN LEAD |
DUAL |
R-XDMA-T32 |
5.5 V |
Not Qualified |
1048576 bit |
4.5 V |
e0 |
.005 Amp |
85 ns |
||||||||||||||||||||||
Microsemi |
STANDARD SRAM |
MILITARY |
32 |
DIP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
NO |
1 |
CMOS |
MIL-STD-883 |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
131072 words |
5 |
8 |
IN-LINE |
125 Cel |
128KX8 |
128K |
-55 Cel |
DUAL |
R-CDIP-T32 |
5.5 V |
10.16 mm |
Not Qualified |
1048576 bit |
4.5 V |
NOT SPECIFIED |
NOT SPECIFIED |
55 ns |
||||||||||||||||||||||||||
Renesas Electronics |
STANDARD SRAM |
MILITARY |
24 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
CMOS |
MIL-STD-883 Class B |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
105 mA |
2048 words |
COMMON |
5 |
5 |
8 |
IN-LINE |
DIP24,.3 |
SRAMs |
2.54 mm |
125 Cel |
3-STATE |
2KX8 |
2K |
2 V |
-55 Cel |
TIN LEAD |
DUAL |
1 |
R-GDIP-T24 |
5.5 V |
5.08 mm |
7.62 mm |
Not Qualified |
16384 bit |
4.5 V |
e0 |
YES |
.0002 Amp |
32.004 mm |
35 ns |
|||||||||||||
|
Amic Technology |
STANDARD SRAM |
COMMERCIAL |
32 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
70 mA |
131072 words |
COMMON |
5 |
5 |
8 |
IN-LINE |
DIP32,.6 |
SRAMs |
2.54 mm |
70 Cel |
3-STATE |
128KX8 |
128K |
2 V |
0 Cel |
DUAL |
R-PDIP-T32 |
5.5 V |
5.33 mm |
15.24 mm |
Not Qualified |
1048576 bit |
4.5 V |
NOT SPECIFIED |
NOT SPECIFIED |
YES |
.00001 Amp |
41.91 mm |
70 ns |
||||||||||||||
Zentrum Mikroelektronik Dresden Ag |
NON-VOLATILE SRAM |
INDUSTRIAL |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
95 mA |
8192 words |
5 |
5 |
8 |
IN-LINE |
DIP28,.6 |
SRAMs |
2.54 mm |
85 Cel |
3-STATE |
8KX8 |
8K |
-40 Cel |
TIN LEAD |
DUAL |
1 |
R-PDIP-T28 |
3 |
5.5 V |
5.1 mm |
15.24 mm |
Not Qualified |
65536 bit |
4.5 V |
e0 |
YES |
.003 Amp |
37.1 mm |
25 ns |
|||||||||||||||
Zentrum Mikroelektronik Dresden Ag |
NON-VOLATILE SRAM |
COMMERCIAL |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
90 mA |
8192 words |
5 |
5 |
8 |
IN-LINE |
DIP28,.3 |
SRAMs |
2.54 mm |
70 Cel |
3-STATE |
8KX8 |
8K |
0 Cel |
TIN LEAD |
DUAL |
1 |
R-PDIP-T28 |
3 |
5.5 V |
5.1 mm |
7.62 mm |
Not Qualified |
65536 bit |
4.5 V |
e0 |
YES |
.003 Amp |
34.7 mm |
25 ns |
|||||||||||||||
Zentrum Mikroelektronik Dresden Ag |
NON-VOLATILE SRAM |
COMMERCIAL |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
75 mA |
8192 words |
5 |
5 |
8 |
IN-LINE |
DIP28,.3 |
SRAMs |
2.54 mm |
70 Cel |
3-STATE |
8KX8 |
8K |
0 Cel |
TIN LEAD |
DUAL |
1 |
R-PDIP-T28 |
3 |
5.5 V |
5.1 mm |
7.62 mm |
Not Qualified |
65536 bit |
4.5 V |
e0 |
YES |
.003 Amp |
34.7 mm |
45 ns |
|||||||||||||||
Zentrum Mikroelektronik Dresden Ag |
NON-VOLATILE SRAM |
INDUSTRIAL |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
95 mA |
8192 words |
5 |
5 |
8 |
IN-LINE |
DIP28,.3 |
SRAMs |
2.54 mm |
85 Cel |
3-STATE |
8KX8 |
8K |
-40 Cel |
TIN LEAD |
DUAL |
1 |
R-PDIP-T28 |
3 |
5.5 V |
5.1 mm |
7.62 mm |
Not Qualified |
65536 bit |
4.5 V |
e0 |
YES |
.003 Amp |
34.7 mm |
25 ns |
|||||||||||||||
|
Zentrum Mikroelektronik Dresden Ag |
NON-VOLATILE SRAM |
INDUSTRIAL |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
95 mA |
8192 words |
5 |
5 |
8 |
IN-LINE |
DIP28,.3 |
SRAMs |
2.54 mm |
85 Cel |
8KX8 |
8K |
-40 Cel |
MATTE TIN |
DUAL |
R-PDIP-T28 |
3 |
5.5 V |
5.1 mm |
7.62 mm |
Not Qualified |
65536 bit |
4.5 V |
e3 |
.003 Amp |
34.7 mm |
25 ns |
|||||||||||||||||
Zentrum Mikroelektronik Dresden Ag |
NON-VOLATILE SRAM |
INDUSTRIAL |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
80 mA |
8192 words |
5 |
5 |
8 |
IN-LINE |
DIP28,.3 |
SRAMs |
2.54 mm |
85 Cel |
3-STATE |
8KX8 |
8K |
-40 Cel |
TIN LEAD |
DUAL |
1 |
R-PDIP-T28 |
3 |
5.5 V |
5.1 mm |
7.62 mm |
Not Qualified |
65536 bit |
4.5 V |
e0 |
YES |
.003 Amp |
34.7 mm |
45 ns |
|||||||||||||||
Winbond Electronics |
STANDARD SRAM |
COMMERCIAL |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
32768 words |
5 |
8 |
IN-LINE |
2.54 mm |
70 Cel |
3-STATE |
32KX8 |
32K |
2 V |
0 Cel |
DUAL |
1 |
R-PDIP-T28 |
5.5 V |
5.33 mm |
15.24 mm |
Not Qualified |
262144 bit |
4.5 V |
YES |
37.08 mm |
70 ns |
||||||||||||||||||||||
|
Microchip Technology |
STANDARD SRAM |
INDUSTRIAL |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
TS 16949 |
THROUGH-HOLE |
SERIAL |
SYNCHRONOUS |
10 mA |
131072 words |
COMMON/SEPARATE |
5 |
3/5 |
8 |
IN-LINE |
DIP8,.3 |
SRAMs |
2.54 mm |
85 Cel |
3-STATE |
128KX8 |
128K |
2.5 V |
-40 Cel |
MATTE TIN |
DUAL |
1 |
R-PDIP-T8 |
5.5 V |
5.334 mm |
20 MHz |
7.62 mm |
Not Qualified |
1048576 bit |
2.5 V |
e3 |
260 |
NO |
.00001 Amp |
9.271 mm |
|||||||||||
|
Renesas Electronics |
STANDARD SRAM |
INDUSTRIAL |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
100 mA |
8192 words |
5 |
8 |
IN-LINE |
2.54 mm |
85 Cel |
8KX8 |
8K |
-40 Cel |
MATTE TIN |
DUAL |
R-PDIP-T28 |
5.5 V |
4.572 mm |
7.62 mm |
65536 bit |
4.5 V |
e3 |
34.671 mm |
19 ns |
|||||||||||||||||||||||
Maxim Integrated |
NON-VOLATILE SRAM MODULE |
INDUSTRIAL |
24 |
DIP |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
CMOS |
PIN/PEG |
PARALLEL |
ASYNCHRONOUS |
15 mA |
2048 words |
5 |
5 |
8 |
MICROELECTRONIC ASSEMBLY |
DIP24,.6 |
SRAMs |
2.54 mm |
85 Cel |
2KX8 |
2K |
-40 Cel |
TIN LEAD |
DUAL |
R-XDMA-P24 |
1 |
5.5 V |
Not Qualified |
16384 bit |
4.5 V |
e0 |
40 |
260 |
.005 Amp |
200 ns |
|||||||||||||||||||
Dallas Semiconductor |
NON-VOLATILE SRAM MODULE |
INDUSTRIAL |
24 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
15 mA |
2048 words |
5 |
5 |
8 |
IN-LINE |
DIP24,.6 |
SRAMs |
2.54 mm |
85 Cel |
2KX8 |
2K |
-40 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDIP-T24 |
5.5 V |
Not Qualified |
16384 bit |
4.5 V |
e0 |
.005 Amp |
200 ns |
||||||||||||||||||||||
|
Analog Devices |
NON-VOLATILE SRAM MODULE |
INDUSTRIAL |
24 |
DIP |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
CMOS |
PIN/PEG |
PARALLEL |
ASYNCHRONOUS |
85 mA |
2048 words |
5 |
5 |
8 |
MICROELECTRONIC ASSEMBLY |
DIP24,.6 |
SRAMs |
2.54 mm |
85 Cel |
2KX8 |
2K |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
R-XDMA-P24 |
5.5 V |
Not Qualified |
16384 bit |
4.5 V |
e3 |
30 |
260 |
.01 Amp |
200 ns |
|||||||||||||||||||
Maxim Integrated |
NON-VOLATILE SRAM MODULE |
COMMERCIAL |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
PIN/PEG |
PARALLEL |
ASYNCHRONOUS |
75 mA |
8192 words |
5 |
5 |
8 |
MICROELECTRONIC ASSEMBLY |
DIP28,.6 |
SRAMs |
2.54 mm |
70 Cel |
8KX8 |
8K |
0 Cel |
TIN LEAD |
DUAL |
R-PDMA-P28 |
5.5 V |
10.54 mm |
15.24 mm |
Not Qualified |
65536 bit |
4.5 V |
10 YEAR DATA RETENTION |
e0 |
.005 Amp |
38.865 mm |
200 ns |
||||||||||||||||||
|
Analog Devices |
NON-VOLATILE SRAM MODULE |
COMMERCIAL |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
PIN/PEG |
PARALLEL |
ASYNCHRONOUS |
75 mA |
8192 words |
5 |
5 |
8 |
MICROELECTRONIC ASSEMBLY |
DIP28,.6 |
SRAMs |
2.54 mm |
70 Cel |
8KX8 |
8K |
0 Cel |
Matte Tin (Sn) - annealed |
DUAL |
R-PDMA-P28 |
5.5 V |
Not Qualified |
65536 bit |
4.5 V |
10 YEAR DATA RETENTION |
e3 |
.01 Amp |
200 ns |
||||||||||||||||||||
Dallas Semiconductor |
NON-VOLATILE SRAM MODULE |
INDUSTRIAL |
32 |
DIP |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
85 mA |
524288 words |
5 |
5 |
8 |
IN-LINE |
DIP32,.6 |
SRAMs |
2.54 mm |
85 Cel |
3-STATE |
512KX8 |
512K |
-40 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
1 |
R-XDIP-T32 |
5.5 V |
Not Qualified |
4194304 bit |
4.5 V |
10 YEAR DATA RETENTION PERIOD |
e0 |
YES |
.005 Amp |
70 ns |
||||||||||||||||||
Maxim Integrated |
NON-VOLATILE SRAM MODULE |
INDUSTRIAL |
32 |
DIP |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
CMOS |
PIN/PEG |
PARALLEL |
ASYNCHRONOUS |
85 mA |
524288 words |
5 |
5 |
8 |
MICROELECTRONIC ASSEMBLY |
DIP32,.6 |
SRAMs |
2.54 mm |
85 Cel |
512KX8 |
512K |
-40 Cel |
TIN LEAD |
DUAL |
R-XDMA-P32 |
5.5 V |
Not Qualified |
4194304 bit |
4.5 V |
10 YEAR DATA RETENTION |
e0 |
.005 Amp |
70 ns |
|||||||||||||||||||||
|
Analog Devices |
NON-VOLATILE SRAM MODULE |
INDUSTRIAL |
32 |
DIP |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
CMOS |
PIN/PEG |
PARALLEL |
ASYNCHRONOUS |
85 mA |
524288 words |
5 |
5 |
8 |
MICROELECTRONIC ASSEMBLY |
DIP32,.6 |
SRAMs |
2.54 mm |
85 Cel |
512KX8 |
512K |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
R-XDMA-P32 |
5.5 V |
Not Qualified |
4194304 bit |
4.5 V |
10 YEAR DATA RETENTION |
e3 |
.0006 Amp |
70 ns |
||||||||||||||||||||
Renesas Technology |
STANDARD SRAM |
COMMERCIAL |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
45 mA |
32768 words |
COMMON |
5 |
5 |
8 |
IN-LINE |
DIP28,.3 |
SRAMs |
2.54 mm |
70 Cel |
3-STATE |
32KX8 |
32K |
4.5 V |
0 Cel |
DUAL |
R-PDIP-T28 |
5.5 V |
Not Qualified |
262144 bit |
4.5 V |
.0001 Amp |
120 ns |
SRAM, or Static Random-Access Memory, is a type of volatile computer memory that stores data as a flip-flop, which retains the data as long as power is supplied to the system. SRAM is commonly used as cache memory and in other applications where high-speed access to data is required.
SRAM is a type of memory that is faster and more expensive than DRAM (Dynamic Random-Access Memory). It is commonly used as cache memory in computer systems and other digital devices to improve the speed of data access. SRAM is also used in applications where high-speed data processing is required, such as in networking equipment, video games, and other high-performance computing applications.
One of the advantages of using SRAM is that it provides faster access to data than other types of memory, such as DRAM. This is because SRAM does not need to be refreshed like DRAM, which makes it faster and more reliable. Additionally, SRAM uses less power than other types of memory, which makes it ideal for use in battery-powered devices.
One of the disadvantages of using SRAM is that it is more expensive and less dense than other types of memory, such as DRAM or flash memory. This means that it is not suitable for applications that require large amounts of memory at a low cost. Additionally, SRAM is volatile, which means that it cannot store data permanently.