Part | RoHS | Manufacturer | Memory IC Type | Temperature Grade | No. of Terminals | Package Code | Refresh Cycles | Package Shape | Total Dose (V) | Package Body Material | Surface Mount | No. of Functions | Technology | Screening Level | Nominal Negative Supply Voltage | Terminal Form | Parallel or Serial | Operating Mode | Maximum Supply Current | No. of Words | Self Refresh | Input/Output Type | Nominal Supply Voltage / Vsup (V) | Power Supplies (V) | Memory Width | Package Style (Meter) | Package Equivalence Code | Alternate Memory Width | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Reverse Pinout | Output Characteristics | Organization | No. of Words Code | Minimum Standby Voltage | Minimum Operating Temperature | Terminal Finish | Terminal Position | No. of Ports | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Maximum Clock Frequency (fCLK) | Width | Qualification | Memory Density | Minimum Supply Voltage (Vsup) | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Output Enable | Maximum Standby Current | Length | Maximum Access Time |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Infineon Technologies |
STANDARD SRAM |
INDUSTRIAL |
165 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
325 mA |
524288 words |
COMMON |
2.5/3.3,3.3 |
36 |
GRID ARRAY |
BGA165,11X15,40 |
SRAMs |
1 mm |
85 Cel |
3-STATE |
512KX36 |
512K |
3.14 V |
-40 Cel |
BOTTOM |
R-PBGA-B165 |
225 MHz |
Not Qualified |
18874368 bit |
.06 Amp |
2.8 ns |
||||||||||||||||||||||||
|
Infineon Technologies |
ZBT SRAM |
COMMERCIAL |
165 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
350 mA |
524288 words |
COMMON |
3.3 |
2.5/3.3,3.3 |
36 |
GRID ARRAY, LOW PROFILE |
BGA165,11X15,40 |
SRAMs |
1 mm |
70 Cel |
3-STATE |
512KX36 |
512K |
3.14 V |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B165 |
3 |
3.6 V |
1.4 mm |
250 MHz |
13 mm |
Not Qualified |
18874368 bit |
3.135 V |
PIPELINED ARCHITECTURE |
e1 |
20 |
260 |
.07 Amp |
15 mm |
2.6 ns |
||||||||||
|
Infineon Technologies |
MULTI-PORT SRAM |
COMMERCIAL |
100 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
250 mA |
8192 words |
COMMON |
5 |
5 |
18 |
FLATPACK |
QFP100,.63SQ,20 |
SRAMs |
.5 mm |
70 Cel |
3-STATE |
8KX18 |
8K |
2 V |
0 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
2 |
S-PQFP-G100 |
3 |
Not Qualified |
147456 bit |
e4 |
260 |
.0015 Amp |
25 ns |
||||||||||||||||||
Infineon Technologies |
ZBT SRAM |
INDUSTRIAL |
165 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
1048576 words |
2.5 |
36 |
GRID ARRAY, LOW PROFILE |
1 mm |
85 Cel |
1MX36 |
1M |
-40 Cel |
TIN LEAD |
BOTTOM |
R-PBGA-B165 |
3 |
2.625 V |
1.4 mm |
15 mm |
37748736 bit |
2.375 V |
PIPELINED ARCHITECTURE |
e0 |
20 |
260 |
17 mm |
||||||||||||||||||||||
|
Infineon Technologies |
NON-VOLATILE SRAM |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
3 mA |
65536 words |
SEPARATE |
2.5 |
8 |
SMALL OUTLINE |
SOP8,.25 |
1.27 mm |
85 Cel |
3-STATE |
64KX8 |
64K |
2.4 V |
-40 Cel |
DUAL |
R-PDSO-G8 |
2.6 V |
1.727 mm |
40 MHz |
3.8985 mm |
524288 bit |
2.4 V |
NO |
.00015 Amp |
4.889 mm |
|||||||||||||||||||
|
Infineon Technologies |
STANDARD SRAM |
COMMERCIAL |
119 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
275 mA |
524288 words |
COMMON |
2.5/3.3,3.3 |
36 |
GRID ARRAY |
BGA119,7X17,50 |
SRAMs |
1.27 mm |
70 Cel |
3-STATE |
512KX36 |
512K |
3.14 V |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B119 |
3 |
167 MHz |
Not Qualified |
18874368 bit |
e1 |
20 |
260 |
.07 Amp |
3.4 ns |
||||||||||||||||||
|
Infineon Technologies |
ZBT SRAM |
INDUSTRIAL |
100 |
LQFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
500 mA |
2097152 words |
COMMON |
3.3 |
2.5/3.3,3.3 |
36 |
FLATPACK, LOW PROFILE |
QFP100,.63X.87 |
SRAMs |
.65 mm |
85 Cel |
3-STATE |
2MX36 |
2M |
3.14 V |
-40 Cel |
MATTE TIN |
QUAD |
R-PQFP-G100 |
3 |
3.6 V |
1.6 mm |
250 MHz |
14 mm |
Not Qualified |
75497472 bit |
3.135 V |
PIPELINED ARCHITECTURE |
e3 |
40 |
260 |
20 mm |
3 ns |
|||||||||||
|
Infineon Technologies |
STANDARD SRAM |
INDUSTRIAL |
48 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
1048576 words |
3 |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.75 mm |
85 Cel |
1MX16 |
1M |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B48 |
3 |
3.6 V |
1 mm |
6 mm |
16777216 bit |
2.2 V |
e1 |
260 |
8 mm |
10 ns |
||||||||||||||||||||||
|
Infineon Technologies |
STANDARD SRAM |
INDUSTRIAL |
48 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
36 mA |
1048576 words |
COMMON |
5 |
16 |
SMALL OUTLINE, THIN PROFILE |
TSSOP48,.8,20 |
8 |
.5 mm |
85 Cel |
3-STATE |
1MX16 |
1M |
1 V |
-40 Cel |
DUAL |
1 |
R-PDSO-G48 |
5.5 V |
1.2 mm |
12 mm |
16777216 bit |
4.5 V |
YES |
.000016 Amp |
18.4 mm |
45 ns |
|||||||||||||||||
|
Infineon Technologies |
STANDARD SRAM |
INDUSTRIAL |
48 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
262144 words |
3 |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.75 mm |
85 Cel |
256KX16 |
256K |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B48 |
3 |
3.6 V |
1 mm |
6 mm |
4194304 bit |
2.2 V |
e1 |
260 |
8 mm |
45 ns |
||||||||||||||||||||||
|
Infineon Technologies |
ZBT SRAM |
INDUSTRIAL |
165 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
450 mA |
2097152 words |
COMMON |
2.5 |
2.5 |
36 |
GRID ARRAY, LOW PROFILE |
BGA165,11X15,40 |
SRAMs |
1 mm |
85 Cel |
3-STATE |
2MX36 |
2M |
2.38 V |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B165 |
3 |
2.625 V |
1.4 mm |
250 MHz |
15 mm |
Not Qualified |
75497472 bit |
2.375 V |
PIPELINED ARCHITECTURE |
e1 |
20 |
260 |
17 mm |
3 ns |
|||||||||||
|
Infineon Technologies |
NON-VOLATILE SRAM |
INDUSTRIAL |
48 |
TFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
65536 words |
3 |
16 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
.75 mm |
85 Cel |
64KX16 |
64K |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B48 |
2.7 V |
1.2 mm |
6 mm |
Not Qualified |
1048576 bit |
3.6 V |
e1 |
10 mm |
20 ns |
|||||||||||||||||||||||
|
Infineon Technologies |
CACHE SRAM |
COMMERCIAL |
100 |
LQFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
143 mA |
1048576 words |
COMMON |
3.3 |
18 |
FLATPACK, LOW PROFILE |
QFP100,.63X.87 |
.65 mm |
70 Cel |
3-STATE |
1MX18 |
1M |
3.135 V |
0 Cel |
PURE TIN |
QUAD |
1 |
R-PQFP-G100 |
3 |
3.63 V |
1.6 mm |
167 MHz |
14 mm |
18874368 bit |
3.135 V |
PIPE LINED ARCHITECTURE |
260 |
YES |
.075 Amp |
20 mm |
3.4 ns |
|||||||||||||
Infineon Technologies |
STANDARD SRAM |
INDUSTRIAL |
48 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
262144 words |
3 |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.75 mm |
85 Cel |
256KX16 |
256K |
-40 Cel |
BOTTOM |
R-PBGA-B48 |
3.6 V |
1 mm |
6 mm |
4194304 bit |
2.2 V |
8 mm |
45 ns |
|||||||||||||||||||||||||||
|
Infineon Technologies |
ZBT SRAM |
INDUSTRIAL |
100 |
LQFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
250 mA |
262144 words |
COMMON |
3.3 |
2.5/3.3,3.3 |
36 |
FLATPACK, LOW PROFILE |
QFP100,.63X.87 |
SRAMs |
.65 mm |
85 Cel |
3-STATE |
256KX36 |
256K |
3.14 V |
-40 Cel |
MATTE TIN |
QUAD |
R-PQFP-G100 |
3 |
3.6 V |
1.6 mm |
250 MHz |
14 mm |
Not Qualified |
9437184 bit |
3.135 V |
PIPELINED ARCHITECTURE |
e3 |
40 |
260 |
.04 Amp |
20 mm |
2.8 ns |
||||||||||
|
Infineon Technologies |
CACHE SRAM |
INDUSTRIAL |
165 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
240 mA |
1048576 words |
COMMON |
2.5 |
36 |
GRID ARRAY, LOW PROFILE |
BGA165,11X15,40 |
1 mm |
85 Cel |
3-STATE |
1MX36 |
1M |
2.375 V |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
1 |
R-PBGA-B165 |
3 |
2.625 V |
1.4 mm |
250 MHz |
15 mm |
37748736 bit |
2.375 V |
PIPELINED ARCHITECTURE |
e1 |
260 |
YES |
.09 Amp |
17 mm |
2.5 ns |
||||||||||||
Infineon Technologies |
STANDARD SRAM |
COMMERCIAL |
32 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
60 mA |
131072 words |
COMMON |
5 |
5 |
8 |
SMALL OUTLINE |
SOP32,.56 |
SRAMs |
1.27 mm |
70 Cel |
3-STATE |
128KX8 |
128K |
2 V |
0 Cel |
TIN LEAD |
DUAL |
R-PDSO-G32 |
Not Qualified |
1048576 bit |
e0 |
.0001 Amp |
70 ns |
||||||||||||||||||||||
|
Infineon Technologies |
DDR SRAM |
COMMERCIAL |
165 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
560 mA |
1048576 words |
COMMON |
1.8 |
1.5/1.8,1.8 |
36 |
GRID ARRAY, LOW PROFILE |
BGA165,11X15,40 |
SRAMs |
1 mm |
70 Cel |
3-STATE |
1MX36 |
1M |
1.7 V |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B165 |
3 |
1.9 V |
1.4 mm |
300 MHz |
13 mm |
Not Qualified |
37748736 bit |
1.7 V |
PIPELINED ARCHITECTURE |
e1 |
30 |
260 |
.27 Amp |
15 mm |
.45 ns |
||||||||||
|
Infineon Technologies |
ZBT SRAM |
INDUSTRIAL |
100 |
LQFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
170 mA |
1048576 words |
COMMON |
3.3 |
36 |
FLATPACK, LOW PROFILE |
QFP100,.63X.87 |
.65 mm |
85 Cel |
3-STATE |
1MX36 |
1M |
3.135 V |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
1 |
R-PQFP-G100 |
3 |
3.63 V |
1.6 mm |
133 MHz |
14 mm |
37748736 bit |
3.135 V |
e4 |
260 |
YES |
.09 Amp |
20 mm |
6.5 ns |
|||||||||||||
Infineon Technologies |
ZBT SRAM |
INDUSTRIAL |
209 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
1048576 words |
COMMON |
2.5 |
1.8/2.5,2.5 |
72 |
GRID ARRAY |
BGA209,11X19,40 |
SRAMs |
1 mm |
85 Cel |
3-STATE |
1MX72 |
1M |
2.38 V |
-40 Cel |
TIN LEAD |
BOTTOM |
R-PBGA-B209 |
3 |
2.625 V |
1.96 mm |
200 MHz |
14 mm |
Not Qualified |
75497472 bit |
2.375 V |
PIPELINED ARCHITECTURE |
e0 |
220 |
22 mm |
3 ns |
||||||||||||||
Infineon Technologies |
STANDARD SRAM |
COMMERCIAL |
165 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
280 mA |
1048576 words |
COMMON |
2.5 |
2.5 |
18 |
GRID ARRAY |
BGA165,11X15,40 |
SRAMs |
1 mm |
70 Cel |
3-STATE |
1MX18 |
1M |
2.38 V |
0 Cel |
BOTTOM |
R-PBGA-B165 |
200 MHz |
Not Qualified |
18874368 bit |
.03 Amp |
3 ns |
|||||||||||||||||||||||
|
Infineon Technologies |
DDR SRAM |
COMMERCIAL |
165 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
650 mA |
1048576 words |
COMMON |
1.8 |
1.5/1.8,1.8 |
18 |
GRID ARRAY, LOW PROFILE |
BGA165,11X15,40 |
SRAMs |
1 mm |
70 Cel |
3-STATE |
1MX18 |
1M |
1.7 V |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B165 |
3 |
1.9 V |
1.4 mm |
550 MHz |
13 mm |
Not Qualified |
18874368 bit |
1.7 V |
PIPELINED ARCHITECTURE |
e1 |
30 |
260 |
.34 Amp |
15 mm |
.45 ns |
||||||||||
|
Infineon Technologies |
ZBT SRAM |
INDUSTRIAL |
165 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
350 mA |
524288 words |
COMMON |
3.3 |
2.5/3.3,3.3 |
36 |
GRID ARRAY, LOW PROFILE |
BGA165,11X15,40 |
SRAMs |
1 mm |
85 Cel |
3-STATE |
512KX36 |
512K |
3.14 V |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B165 |
3 |
3.6 V |
1.4 mm |
250 MHz |
13 mm |
Not Qualified |
18874368 bit |
3.135 V |
PIPELINED ARCHITECTURE |
e1 |
20 |
260 |
.07 Amp |
15 mm |
2.6 ns |
||||||||||
Infineon Technologies |
STANDARD SRAM |
INDUSTRIAL |
165 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
190 mA |
1048576 words |
COMMON |
2.5 |
2.5 |
18 |
GRID ARRAY |
BGA165,11X15,40 |
SRAMs |
1 mm |
85 Cel |
3-STATE |
1MX18 |
1M |
2.38 V |
-40 Cel |
BOTTOM |
R-PBGA-B165 |
150 MHz |
Not Qualified |
18874368 bit |
.03 Amp |
3.8 ns |
|||||||||||||||||||||||
|
Infineon Technologies |
STANDARD SRAM |
INDUSTRIAL |
48 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
32 mA |
1048576 words |
COMMON |
1.8 |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA48,6X8,30 |
8 |
.75 mm |
85 Cel |
3-STATE |
1MX16 |
1M |
1 V |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
1 |
R-PBGA-B48 |
3 |
2.2 V |
1 mm |
6 mm |
16777216 bit |
1.65 V |
e1 |
260 |
YES |
.000026 Amp |
8 mm |
55 ns |
|||||||||||||
Infineon Technologies |
MULTI-PORT SRAM |
INDUSTRIAL |
676 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
1300 mA |
65536 words |
COMMON |
1.8 |
1.8 |
40 |
GRID ARRAY |
BGA676,26X26,40 |
SRAMs |
1 mm |
85 Cel |
3-STATE |
64KX40 |
64K |
1.71 V |
-40 Cel |
BOTTOM |
4 |
S-PBGA-B676 |
167 MHz |
Not Qualified |
2621440 bit |
.01 Amp |
3.5 ns |
||||||||||||||||||||||
Infineon Technologies |
STANDARD SRAM |
INDUSTRIAL |
100 |
QFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
160 mA |
1048576 words |
COMMON |
2.5 |
2.5 |
18 |
FLATPACK |
QFP100,.63X.87 |
SRAMs |
.635 mm |
85 Cel |
3-STATE |
1MX18 |
1M |
2.38 V |
-40 Cel |
QUAD |
R-PQFP-G100 |
133 MHz |
Not Qualified |
18874368 bit |
.03 Amp |
4.2 ns |
|||||||||||||||||||||||
Infineon Technologies |
QDR II SRAM |
COMMERCIAL |
165 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
560 mA |
1048576 words |
SEPARATE |
1.8 |
1.5/1.8,1.8 |
18 |
GRID ARRAY, LOW PROFILE |
BGA165,11X15,40 |
SRAMs |
1 mm |
70 Cel |
3-STATE |
1MX18 |
1M |
1.7 V |
0 Cel |
TIN LEAD |
BOTTOM |
R-PBGA-B165 |
3 |
1.9 V |
1.4 mm |
250 MHz |
13 mm |
Not Qualified |
18874368 bit |
1.7 V |
PIPELINED ARCHITECTURE |
e0 |
20 |
260 |
.25 Amp |
15 mm |
.45 ns |
|||||||||||
Infineon Technologies |
STANDARD SRAM |
COMMERCIAL |
209 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
1048576 words |
COMMON |
2.5/3.3,3.3 |
72 |
GRID ARRAY |
BGA209,11X19,40 |
SRAMs |
1 mm |
70 Cel |
3-STATE |
1MX72 |
1M |
3.14 V |
0 Cel |
BOTTOM |
R-PBGA-B209 |
300 MHz |
Not Qualified |
75497472 bit |
2.2 ns |
||||||||||||||||||||||||||
Infineon Technologies |
QDR II SRAM |
COMMERCIAL |
165 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
640 mA |
1048576 words |
SEPARATE |
1.8 |
1.5/1.8,1.8 |
18 |
GRID ARRAY, LOW PROFILE |
BGA165,11X15,40 |
SRAMs |
1 mm |
70 Cel |
3-STATE |
1MX18 |
1M |
1.7 V |
0 Cel |
TIN LEAD |
BOTTOM |
R-PBGA-B165 |
3 |
1.9 V |
1.4 mm |
300 MHz |
13 mm |
Not Qualified |
18874368 bit |
1.7 V |
PIPELINED ARCHITECTURE |
e0 |
20 |
260 |
.26 Amp |
15 mm |
.45 ns |
|||||||||||
Infineon Technologies |
QDR SRAM |
COMMERCIAL |
165 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
1570 mA |
4194304 words |
SEPARATE |
1.8 |
1.5,1.8 |
18 |
GRID ARRAY, LOW PROFILE |
BGA165,11X15,40 |
SRAMs |
1 mm |
70 Cel |
3-STATE |
4MX18 |
4M |
1.7 V |
0 Cel |
TIN LEAD |
BOTTOM |
R-PBGA-B165 |
3 |
1.9 V |
1.4 mm |
600 MHz |
13 mm |
Not Qualified |
75497472 bit |
1.7 V |
PIPELINED ARCHITECTURE |
e0 |
20 |
235 |
1.57 Amp |
15 mm |
.45 ns |
|||||||||||
|
Infineon Technologies |
STANDARD SRAM |
INDUSTRIAL |
54 |
TSOP2 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
110 mA |
1048576 words |
COMMON |
3.3 |
16 |
SMALL OUTLINE, THIN PROFILE |
TSOP54,.46,32 |
.8 mm |
85 Cel |
3-STATE |
1MX16 |
1M |
1 V |
-40 Cel |
PURE TIN |
DUAL |
1 |
R-PDSO-G54 |
3 |
3.6 V |
1.2 mm |
10.16 mm |
16777216 bit |
3 V |
260 |
YES |
.03 Amp |
22.415 mm |
10 ns |
|||||||||||||||
|
Infineon Technologies |
STANDARD SRAM |
INDUSTRIAL |
48 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
BALL |
PARALLEL |
ASYNCHRONOUS |
1048576 words |
COMMON |
3 |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA48,6X8,30 |
.75 mm |
85 Cel |
3-STATE |
1MX16 |
1M |
1 V |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
1 |
R-PBGA-B48 |
3 |
3.6 V |
1 mm |
6 mm |
16777216 bit |
2.2 V |
e1 |
YES |
8 mm |
55 ns |
||||||||||||||||
|
Infineon Technologies |
STANDARD SRAM |
AUTOMOTIVE |
44 |
TSOP2 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
35 mA |
524288 words |
COMMON |
5 |
5 |
16 |
SMALL OUTLINE, THIN PROFILE |
BGA48,6X8,30 |
SRAMs |
.8 mm |
125 Cel |
3-STATE |
512KX16 |
512K |
2 V |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G44 |
3 |
5.5 V |
1.194 mm |
10.16 mm |
Not Qualified |
8388608 bit |
4.5 V |
e4 |
20 |
260 |
.00003 Amp |
18.415 mm |
55 ns |
|||||||||||
|
Infineon Technologies |
STANDARD SRAM |
INDUSTRIAL |
44 |
TSOP2 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
25 mA |
524288 words |
COMMON |
3 |
16 |
SMALL OUTLINE, THIN PROFILE |
TSOP44,.46,32 |
.8 mm |
85 Cel |
3-STATE |
512KX16 |
512K |
3 V |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G44 |
3 |
3.6 V |
1.194 mm |
10.16 mm |
8388608 bit |
2.2 V |
e4 |
YES |
.0000065 Amp |
11.8365 mm |
45 ns |
||||||||||||||||
|
Infineon Technologies |
STANDARD SRAM |
COMMERCIAL |
28 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
65 mA |
8192 words |
COMMON |
5 |
5 |
8 |
SMALL OUTLINE |
SOP28,.45 |
SRAMs |
1.27 mm |
70 Cel |
3-STATE |
8KX8 |
8K |
4.5 V |
0 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G28 |
3 |
Not Qualified |
65536 bit |
e4 |
20 |
260 |
.0025 Amp |
45 ns |
||||||||||||||||||
|
Infineon Technologies |
STANDARD SRAM |
COMMERCIAL |
165 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
670 mA |
524288 words |
SEPARATE |
1.8 |
1.5/1.8,1.8 |
36 |
GRID ARRAY, LOW PROFILE |
BGA165,11X15,40 |
SRAMs |
1 mm |
70 Cel |
3-STATE |
512KX36 |
512K |
1.7 V |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B165 |
3 |
1.9 V |
1.4 mm |
250 MHz |
13 mm |
Not Qualified |
18874368 bit |
1.7 V |
PIPELINED ARCHITECTURE |
e1 |
30 |
260 |
.25 Amp |
15 mm |
.45 ns |
||||||||||
|
Infineon Technologies |
STANDARD SRAM |
INDUSTRIAL |
36 |
SOJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
45 mA |
524288 words |
COMMON |
5 |
8 |
SMALL OUTLINE |
SOJ36,.44 |
1.27 mm |
85 Cel |
3-STATE |
512KX8 |
512K |
1 V |
-40 Cel |
PURE TIN |
DUAL |
1 |
R-PDSO-J36 |
3 |
5.5 V |
3.7592 mm |
10.16 mm |
4194304 bit |
4.5 V |
260 |
YES |
.008 Amp |
23.495 mm |
10 ns |
|||||||||||||||
|
Infineon Technologies |
STANDARD SRAM |
INDUSTRIAL |
44 |
TSOP2 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
262144 words |
3 |
16 |
SMALL OUTLINE, THIN PROFILE |
.8 mm |
85 Cel |
256KX16 |
256K |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G44 |
3 |
3.6 V |
1.194 mm |
10.16 mm |
4194304 bit |
2.2 V |
e4 |
260 |
18.415 mm |
45 ns |
||||||||||||||||||||||
Infineon Technologies |
QDR II PLUS SRAM |
INDUSTRIAL |
165 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
1290 mA |
4194304 words |
SEPARATE |
1.8 |
1.5/1.8,1.8 |
36 |
GRID ARRAY, LOW PROFILE |
BGA165,11X15,40 |
SRAMs |
1 mm |
85 Cel |
3-STATE |
4MX36 |
4M |
1.7 V |
-40 Cel |
TIN LEAD |
BOTTOM |
1 |
R-PBGA-B165 |
3 |
1.9 V |
1.4 mm |
450 MHz |
15 mm |
Not Qualified |
150994944 bit |
1.7 V |
PIPELINED ARCHITECTURE |
e0 |
NO |
.46 Amp |
17 mm |
.45 ns |
|||||||||||
|
Infineon Technologies |
QDR SRAM |
TIN SILVER COPPER |
3 |
e1 |
||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Infineon Technologies |
STANDARD SRAM |
INDUSTRIAL |
44 |
TSOP2 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
36 mA |
1048576 words |
5 |
8 |
SMALL OUTLINE, THIN PROFILE |
.8 mm |
85 Cel |
1MX8 |
1M |
-40 Cel |
DUAL |
R-PDSO-G44 |
5.5 V |
1.194 mm |
10.16 mm |
8388608 bit |
4.5 V |
18.415 mm |
45 ns |
|||||||||||||||||||||||||
|
Infineon Technologies |
STANDARD SRAM |
INDUSTRIAL |
48 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
1048576 words |
1.8 |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.75 mm |
85 Cel |
1MX16 |
1M |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B48 |
3 |
2.2 V |
1 mm |
6 mm |
16777216 bit |
1.65 V |
e1 |
260 |
8 mm |
15 ns |
||||||||||||||||||||||
|
Infineon Technologies |
ZBT SRAM |
INDUSTRIAL |
165 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
435 mA |
2097152 words |
COMMON |
2.5 |
1.8/2.5,2.5 |
18 |
GRID ARRAY, LOW PROFILE |
BGA165,11X15,40 |
SRAMs |
1 mm |
85 Cel |
3-STATE |
2MX18 |
2M |
2.38 V |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B165 |
3 |
2.625 V |
1.4 mm |
250 MHz |
15 mm |
Not Qualified |
37748736 bit |
2.375 V |
PIPELINED ARCHITECTURE |
e1 |
20 |
260 |
.12 Amp |
17 mm |
2.6 ns |
||||||||||
|
Infineon Technologies |
STANDARD SRAM |
AUTOMOTIVE |
100 |
LQFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
GULL WING |
PARALLEL |
SYNCHRONOUS |
180 mA |
262144 words |
COMMON |
3.3 |
2.5/3.3,3.3 |
36 |
FLATPACK, LOW PROFILE |
QFP100,.63X.87 |
SRAMs |
.65 mm |
125 Cel |
3-STATE |
256KX36 |
256K |
3.14 V |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
R-PQFP-G100 |
3 |
3.6 V |
1.6 mm |
100 MHz |
14 mm |
Not Qualified |
9437184 bit |
3.135 V |
FLOW-THROUGH ARCHITECTURE |
e4 |
40 |
260 |
.04 Amp |
20 mm |
8.5 ns |
|||||||||
Infineon Technologies |
ZBT SRAM |
INDUSTRIAL |
165 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
435 mA |
2097152 words |
COMMON |
2.5 |
1.8/2.5,2.5 |
18 |
GRID ARRAY, LOW PROFILE |
BGA165,11X15,40 |
SRAMs |
1 mm |
85 Cel |
3-STATE |
2MX18 |
2M |
2.38 V |
-40 Cel |
TIN LEAD |
BOTTOM |
R-PBGA-B165 |
3 |
2.625 V |
1.4 mm |
250 MHz |
15 mm |
Not Qualified |
37748736 bit |
2.375 V |
PIPELINED ARCHITECTURE |
e0 |
220 |
.12 Amp |
17 mm |
2.6 ns |
||||||||||||
Infineon Technologies |
STANDARD SRAM |
COMMERCIAL |
119 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
4194304 words |
COMMON |
2.5/3.3,3.3 |
18 |
GRID ARRAY |
BGA119,7X17,50 |
SRAMs |
1.27 mm |
70 Cel |
3-STATE |
4MX18 |
4M |
3.14 V |
0 Cel |
BOTTOM |
R-PBGA-B119 |
300 MHz |
Not Qualified |
75497472 bit |
2.2 ns |
||||||||||||||||||||||||||
|
Infineon Technologies |
MULTI-PORT SRAM |
COMMERCIAL |
52 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
2048 words |
5 |
8 |
CHIP CARRIER |
1.27 mm |
70 Cel |
2KX8 |
2K |
0 Cel |
MATTE TIN |
QUAD |
S-PQCC-J52 |
3 |
5.5 V |
5.08 mm |
19.1262 mm |
Not Qualified |
16384 bit |
4.5 V |
AUTOMATIC POWER-DOWN; INTERRUPT FLAG |
e3 |
30 |
260 |
19.1262 mm |
15 ns |
SRAM, or Static Random-Access Memory, is a type of volatile computer memory that stores data as a flip-flop, which retains the data as long as power is supplied to the system. SRAM is commonly used as cache memory and in other applications where high-speed access to data is required.
SRAM is a type of memory that is faster and more expensive than DRAM (Dynamic Random-Access Memory). It is commonly used as cache memory in computer systems and other digital devices to improve the speed of data access. SRAM is also used in applications where high-speed data processing is required, such as in networking equipment, video games, and other high-performance computing applications.
One of the advantages of using SRAM is that it provides faster access to data than other types of memory, such as DRAM. This is because SRAM does not need to be refreshed like DRAM, which makes it faster and more reliable. Additionally, SRAM uses less power than other types of memory, which makes it ideal for use in battery-powered devices.
One of the disadvantages of using SRAM is that it is more expensive and less dense than other types of memory, such as DRAM or flash memory. This means that it is not suitable for applications that require large amounts of memory at a low cost. Additionally, SRAM is volatile, which means that it cannot store data permanently.