Part | RoHS | Manufacturer | Memory IC Type | Temperature Grade | No. of Terminals | Package Code | Refresh Cycles | Package Shape | Total Dose (V) | Package Body Material | Surface Mount | No. of Functions | Technology | Screening Level | Nominal Negative Supply Voltage | Terminal Form | Parallel or Serial | Operating Mode | Maximum Supply Current | No. of Words | Self Refresh | Input/Output Type | Nominal Supply Voltage / Vsup (V) | Power Supplies (V) | Memory Width | Package Style (Meter) | Package Equivalence Code | Alternate Memory Width | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Reverse Pinout | Output Characteristics | Organization | No. of Words Code | Minimum Standby Voltage | Minimum Operating Temperature | Terminal Finish | Terminal Position | No. of Ports | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Maximum Clock Frequency (fCLK) | Width | Qualification | Memory Density | Minimum Supply Voltage (Vsup) | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Output Enable | Maximum Standby Current | Length | Maximum Access Time |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Micron Technology |
STANDARD SRAM |
AUTOMOTIVE |
32 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
45 mA |
131072 words |
COMMON |
3.3 |
3.3 |
8 |
IN-LINE |
DIP32,.6 |
SRAMs |
2.54 mm |
125 Cel |
3-STATE |
128KX8 |
128K |
3 V |
-40 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDIP-T32 |
Not Qualified |
1048576 bit |
e0 |
.0003 Amp |
25 ns |
||||||||||||||||||||||
Micron Technology |
STANDARD SRAM |
MILITARY |
24 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
135 mA |
65536 words |
COMMON |
5 |
5 |
4 |
IN-LINE |
DIP24,.3 |
SRAMs |
2.54 mm |
125 Cel |
3-STATE |
64KX4 |
64K |
4.5 V |
-55 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDIP-T24 |
Not Qualified |
262144 bit |
e0 |
.007 Amp |
25 ns |
||||||||||||||||||||||
Micron Technology |
CACHE SRAM |
COMMERCIAL |
165 |
TBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
525 mA |
524288 words |
COMMON |
3.3 |
2.5/3.3,3.3 |
32 |
GRID ARRAY, THIN PROFILE |
BGA165,11X15,40 |
SRAMs |
1 mm |
70 Cel |
3-STATE |
512KX32 |
512K |
3.14 V |
0 Cel |
Tin/Lead (Sn/Pb) |
BOTTOM |
R-PBGA-B165 |
3.465 V |
1.2 mm |
200 MHz |
13 mm |
Not Qualified |
16777216 bit |
3.135 V |
PIPELINED ARCHITECTURE |
e0 |
.01 Amp |
15 mm |
3.1 ns |
||||||||||||||
Micron Technology |
STANDARD SRAM |
COMMERCIAL |
100 |
LQFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
32768 words |
3.3 |
32 |
FLATPACK, LOW PROFILE |
.65 mm |
70 Cel |
3-STATE |
32KX32 |
32K |
0 Cel |
TIN LEAD |
QUAD |
1 |
R-PQFP-G100 |
3.6 V |
1.6 mm |
14 mm |
Not Qualified |
1048576 bit |
3.135 V |
AUTOMATIC POWER-DOWN |
e0 |
YES |
20 mm |
|||||||||||||||||||||
Micron Technology |
PSEUDO STATIC RAM |
INDUSTRIAL |
54 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
2097152 words |
1.8 |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.75 mm |
85 Cel |
2MX16 |
2M |
-40 Cel |
TIN LEAD SILVER |
BOTTOM |
R-PBGA-B54 |
1.95 V |
1 mm |
6 mm |
Not Qualified |
33554432 bit |
1.7 V |
e0 |
8 mm |
60 ns |
||||||||||||||||||||||||
Micron Technology |
SRAM MODULE |
COMMERCIAL |
40 |
DIP |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
250 mA |
131072 words |
COMMON |
5 |
5 |
8 |
MICROELECTRONIC ASSEMBLY |
DIP40,.6 |
16 |
SRAMs |
2.54 mm |
70 Cel |
3-STATE |
128KX8 |
128K |
4.5 V |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
1 |
R-XDMA-T40 |
5.5 V |
Not Qualified |
1048576 bit |
4.5 V |
e0 |
YES |
.02 Amp |
45 ns |
||||||||||||||||
Micron Technology |
STANDARD SRAM |
COMMERCIAL |
105 |
DIE |
UNSPECIFIED |
UNSPECIFIED |
YES |
1 |
CMOS |
NO LEAD |
PARALLEL |
SYNCHRONOUS |
32768 words |
3.3 |
32 |
UNCASED CHIP |
70 Cel |
3-STATE |
32KX32 |
32K |
0 Cel |
UPPER |
1 |
X-XUUC-N105 |
3.5 V |
Not Qualified |
1048576 bit |
3.1 V |
YES |
||||||||||||||||||||||||||||
Micron Technology |
STANDARD SRAM |
AUTOMOTIVE |
20 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
120 mA |
4096 words |
COMMON |
5 |
5 |
4 |
IN-LINE |
DIP20,.3 |
SRAMs |
2.54 mm |
125 Cel |
3-STATE |
4KX4 |
4K |
4.5 V |
-40 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-XDIP-T20 |
Not Qualified |
16384 bit |
e0 |
20 ns |
|||||||||||||||||||||||
Micron Technology |
STANDARD SRAM |
MILITARY |
24 |
SOJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
262144 words |
5 |
1 |
SMALL OUTLINE |
1.27 mm |
125 Cel |
3-STATE |
256KX1 |
256K |
2 V |
-55 Cel |
TIN LEAD |
DUAL |
1 |
R-PDSO-J24 |
5.5 V |
3.68 mm |
7.67 mm |
Not Qualified |
262144 bit |
4.5 V |
e0 |
NO |
15.9 mm |
20 ns |
||||||||||||||||||||
Micron Technology |
STATIC COLUMN DRAM |
COMMERCIAL |
20 |
ZIP |
512 |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
THROUGH-HOLE |
1048576 words |
SEPARATE |
5 |
5 |
1 |
IN-LINE |
ZIP20,.1 |
SRAMs |
1.27 mm |
70 Cel |
3-STATE |
1MX1 |
1M |
0 Cel |
Tin/Lead (Sn/Pb) |
ZIG-ZAG |
R-PZIP-T20 |
Not Qualified |
1048576 bit |
e0 |
150 ns |
||||||||||||||||||||||||||
Micron Technology |
DDR SRAM |
COMMERCIAL |
165 |
TBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
4194304 words |
1.8 |
9 |
GRID ARRAY, THIN PROFILE |
1 mm |
70 Cel |
4MX9 |
4M |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B165 |
1.9 V |
1.2 mm |
15 mm |
Not Qualified |
37748736 bit |
1.7 V |
PIPELINED ARCHITECTURE |
e1 |
17 mm |
.45 ns |
|||||||||||||||||||||||
Micron Technology |
STANDARD SRAM |
AUTOMOTIVE |
28 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
100 mA |
32768 words |
COMMON |
5 |
5 |
8 |
IN-LINE |
DIP28,.3 |
SRAMs |
2.54 mm |
125 Cel |
3-STATE |
32KX8 |
32K |
4.5 V |
-40 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-XDIP-T28 |
Not Qualified |
262144 bit |
e0 |
.008 Amp |
35 ns |
||||||||||||||||||||||
Micron Technology |
STANDARD SRAM |
AUTOMOTIVE |
22 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
120 mA |
16384 words |
COMMON |
5 |
5 |
4 |
IN-LINE |
DIP22,.3 |
SRAMs |
2.54 mm |
125 Cel |
3-STATE |
16KX4 |
16K |
4.5 V |
-40 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-XDIP-T22 |
Not Qualified |
65536 bit |
e0 |
.005 Amp |
30 ns |
||||||||||||||||||||||
Micron Technology |
STANDARD SRAM |
INDUSTRIAL |
24 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
65536 words |
5 |
4 |
IN-LINE |
2.54 mm |
85 Cel |
3-STATE |
64KX4 |
64K |
-40 Cel |
DUAL |
1 |
R-PDIP-T24 |
5.5 V |
4.32 mm |
7.62 mm |
Not Qualified |
262144 bit |
4.5 V |
NO |
31.495 mm |
15 ns |
|||||||||||||||||||||||
|
Micron Technology |
PSEUDO STATIC RAM |
INDUSTRIAL |
54 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
1048576 words |
1.8 |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.75 mm |
85 Cel |
1MX16 |
1M |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B54 |
1.95 V |
1 mm |
6 mm |
Not Qualified |
16777216 bit |
1.7 V |
e1 |
8 mm |
70 ns |
|||||||||||||||||||||||
Micron Technology |
CACHE SRAM |
COMMERCIAL |
100 |
LQFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
280 mA |
65536 words |
COMMON |
3.3 |
3.3 |
18 |
FLATPACK, LOW PROFILE |
QFP100,.63X.87 |
SRAMs |
.65 mm |
70 Cel |
3-STATE |
64KX18 |
64K |
3.14 V |
0 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
R-PQFP-G100 |
3.6 V |
1.6 mm |
133 MHz |
14 mm |
Not Qualified |
1179648 bit |
3.135 V |
PIPELINED ARCHITECTURE |
e0 |
.01 Amp |
20 mm |
4.2 ns |
||||||||||||||
Micron Technology |
ZBT SRAM |
COMMERCIAL |
100 |
LQFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
131072 words |
3.3 |
18 |
FLATPACK, LOW PROFILE |
.65 mm |
70 Cel |
3-STATE |
128KX18 |
128K |
0 Cel |
TIN LEAD |
QUAD |
1 |
R-PQFP-G100 |
3.465 V |
1.6 mm |
14 mm |
Not Qualified |
2359296 bit |
3.135 V |
e0 |
YES |
20 mm |
8 ns |
|||||||||||||||||||||
Micron Technology |
STANDARD SRAM |
COMMERCIAL |
52 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
SYNCHRONOUS |
65536 words |
3.3 |
18 |
CHIP CARRIER |
1.27 mm |
70 Cel |
3-STATE |
64KX18 |
64K |
0 Cel |
TIN LEAD |
QUAD |
1 |
S-PQCC-J52 |
3.465 V |
4.57 mm |
19.1262 mm |
Not Qualified |
1179648 bit |
3.135 V |
LINEAR BURST |
e0 |
YES |
19.1262 mm |
14 ns |
||||||||||||||||||||
Micron Technology |
STANDARD SRAM |
AUTOMOTIVE |
22 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
185 mA |
65536 words |
SEPARATE |
5 |
5 |
1 |
IN-LINE |
DIP22,.3 |
SRAMs |
2.54 mm |
125 Cel |
3-STATE |
64KX1 |
64K |
2 V |
-40 Cel |
TIN LEAD |
DUAL |
1 |
R-PDIP-T22 |
5.5 V |
4.32 mm |
7.62 mm |
Not Qualified |
65536 bit |
4.5 V |
TTL-COMPATIBLE INPUTS & OUTPUTS |
e0 |
NO |
.0003 Amp |
26.165 mm |
12 ns |
|||||||||||||
Micron Technology |
STANDARD SRAM |
COMMERCIAL |
100 |
DIE |
UNSPECIFIED |
UNSPECIFIED |
YES |
1 |
CMOS |
NO LEAD |
PARALLEL |
SYNCHRONOUS |
32768 words |
3.3 |
32 |
UNCASED CHIP |
70 Cel |
3-STATE |
32KX32 |
32K |
0 Cel |
UPPER |
1 |
X-XUUC-N100 |
3.465 V |
Not Qualified |
1048576 bit |
3.135 V |
AUTOMATIC POWER-DOWN |
YES |
|||||||||||||||||||||||||||
Micron Technology |
STANDARD SRAM |
MILITARY |
28 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
CMOS |
38535Q/M;38534H;883B |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
100 mA |
32768 words |
COMMON |
5 |
5 |
8 |
IN-LINE |
DIP28,.3 |
SRAMs |
2.54 mm |
125 Cel |
3-STATE |
32KX8 |
32K |
2 V |
-55 Cel |
DUAL |
R-XDIP-T28 |
Not Qualified |
262144 bit |
.0005 Amp |
70 ns |
|||||||||||||||||||||||
Micron Technology |
STANDARD SRAM |
COMMERCIAL |
119 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
625 mA |
131072 words |
COMMON |
3.3 |
3.3 |
36 |
GRID ARRAY |
BGA119,7X17,50 |
SRAMs |
1.27 mm |
70 Cel |
3-STATE |
128KX36 |
128K |
3.14 V |
0 Cel |
Tin/Lead (Sn/Pb) |
BOTTOM |
R-PBGA-B119 |
250 MHz |
Not Qualified |
4718592 bit |
e0 |
.01 Amp |
2.3 ns |
|||||||||||||||||||||
Micron Technology |
STANDARD SRAM |
COMMERCIAL |
100 |
QFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
475 mA |
262144 words |
COMMON |
3.3 |
3.3 |
18 |
FLATPACK |
QFP100,.63X.87 |
SRAMs |
.635 mm |
70 Cel |
3-STATE |
256KX18 |
256K |
3.14 V |
0 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
R-PQFP-G100 |
166 MHz |
Not Qualified |
4718592 bit |
e0 |
.01 Amp |
3.5 ns |
|||||||||||||||||||||
Micron Technology |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Micron Technology |
STANDARD SRAM |
INDUSTRIAL |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
65536 words |
3.3 |
4 |
IN-LINE |
2.54 mm |
85 Cel |
64KX4 |
64K |
-40 Cel |
DUAL |
1 |
R-PDIP-T28 |
3.6 V |
4.32 mm |
7.62 mm |
Not Qualified |
262144 bit |
3 V |
YES |
36.83 mm |
25 ns |
||||||||||||||||||||||||
|
Micron Technology |
PSEUDO STATIC RAM |
OTHER |
54 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
35 mA |
4194304 words |
COMMON |
1.8 |
1.8,1.8/3 |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA54,6X9,30 |
Other Memory ICs |
.75 mm |
85 Cel |
3-STATE |
4MX16 |
4M |
-30 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B54 |
1.95 V |
1 mm |
6 mm |
Not Qualified |
67108864 bit |
1.7 V |
SYNCHRONOUS BURST MODE POSSIBLE |
e1 |
260 |
.00012 Amp |
8 mm |
85 ns |
||||||||||||||
Micron Technology |
STANDARD SRAM |
COMMERCIAL |
100 |
LQFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
131072 words |
3.3 |
18 |
FLATPACK, LOW PROFILE |
.65 mm |
70 Cel |
3-STATE |
128KX18 |
128K |
0 Cel |
TIN LEAD |
QUAD |
1 |
R-PQFP-G100 |
3.6 V |
1.6 mm |
14 mm |
Not Qualified |
2359296 bit |
3.135 V |
AUTOMATIC POWER-DOWN |
e0 |
YES |
20 mm |
|||||||||||||||||||||
Micron Technology |
STANDARD SRAM |
COMMERCIAL |
100 |
QFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
325 mA |
65536 words |
COMMON |
3.3 |
3.3 |
32 |
FLATPACK |
QFP100,.63X.87 |
SRAMs |
.635 mm |
70 Cel |
3-STATE |
64KX32 |
64K |
3.14 V |
0 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
R-PQFP-G100 |
66 MHz |
Not Qualified |
2097152 bit |
e0 |
.005 Amp |
7 ns |
|||||||||||||||||||||
Micron Technology |
LATE-WRITE SRAM |
COMMERCIAL |
119 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
450 mA |
262144 words |
COMMON |
3.3 |
2.5,3.3 |
18 |
GRID ARRAY |
BGA119,7X17,50 |
SRAMs |
1.27 mm |
70 Cel |
3-STATE |
256KX18 |
256K |
3.1 V |
0 Cel |
TIN LEAD |
BOTTOM |
1 |
R-PBGA-B119 |
3.6 V |
2.4 mm |
14 mm |
Not Qualified |
4718592 bit |
3.1 V |
e0 |
YES |
.025 Amp |
22 mm |
2.5 ns |
||||||||||||||
Micron Technology |
STANDARD SRAM |
COMMERCIAL |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
75 mA |
262144 words |
COMMON |
3.3 |
3.3 |
4 |
IN-LINE |
DIP28,.4 |
SRAMs |
2.54 mm |
70 Cel |
3-STATE |
256KX4 |
256K |
2 V |
0 Cel |
TIN LEAD |
DUAL |
1 |
R-PDIP-T28 |
3.6 V |
4.32 mm |
10.16 mm |
Not Qualified |
1048576 bit |
3 V |
e0 |
YES |
.00005 Amp |
35.05 mm |
17 ns |
||||||||||||||
Micron Technology |
ZBT SRAM |
COMMERCIAL |
100 |
LQFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
300 mA |
524288 words |
COMMON |
3.3 |
3.3 |
18 |
FLATPACK, LOW PROFILE |
QFP100,.63X.87 |
SRAMs |
.65 mm |
70 Cel |
3-STATE |
512KX18 |
512K |
3.14 V |
0 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
R-PQFP-G100 |
3.465 V |
1.6 mm |
100 MHz |
14 mm |
Not Qualified |
9437184 bit |
3.135 V |
PIPELINED ARCHITECTURE |
e0 |
.01 Amp |
20 mm |
5 ns |
||||||||||||||
Micron Technology |
STANDARD SRAM |
MILITARY |
24 |
SOJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
185 mA |
16384 words |
COMMON |
5 |
5 |
4 |
SMALL OUTLINE |
SOJ24,.34 |
SRAMs |
1.27 mm |
125 Cel |
3-STATE |
16KX4 |
16K |
4.5 V |
-55 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDSO-J24 |
Not Qualified |
65536 bit |
e0 |
.005 Amp |
12 ns |
||||||||||||||||||||||
Micron Technology |
ZBT SRAM |
COMMERCIAL |
100 |
LQFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
131072 words |
3.3 |
36 |
FLATPACK, LOW PROFILE |
.65 mm |
70 Cel |
3-STATE |
128KX36 |
128K |
0 Cel |
TIN LEAD |
QUAD |
1 |
R-PQFP-G100 |
3.465 V |
1.6 mm |
14 mm |
Not Qualified |
4718592 bit |
3.135 V |
e0 |
YES |
20 mm |
8 ns |
|||||||||||||||||||||
Micron Technology |
STANDARD SRAM |
COMMERCIAL |
100 |
LQFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
300 mA |
131072 words |
COMMON |
3.3 |
3.3 |
36 |
FLATPACK, LOW PROFILE |
QFP100,.63X.87 |
SRAMs |
.65 mm |
70 Cel |
3-STATE |
128KX36 |
128K |
3.14 V |
0 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
1 |
R-PQFP-G100 |
3.465 V |
1.6 mm |
67 MHz |
14 mm |
Not Qualified |
4718592 bit |
3.135 V |
e0 |
YES |
.002 Amp |
20 mm |
11 ns |
|||||||||||||
Micron Technology |
STANDARD SRAM |
INDUSTRIAL |
28 |
QCCN |
RECTANGULAR |
CERAMIC |
YES |
CMOS |
NO LEAD |
PARALLEL |
ASYNCHRONOUS |
140 mA |
16384 words |
SEPARATE |
5 |
5 |
4 |
CHIP CARRIER |
LCC28,.35X.55 |
SRAMs |
1.27 mm |
85 Cel |
3-STATE |
16KX4 |
16K |
4.5 V |
-40 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
R-XQCC-N28 |
Not Qualified |
65536 bit |
e0 |
.005 Amp |
15 ns |
||||||||||||||||||||||
Micron Technology |
STANDARD SRAM |
COMMERCIAL |
32 |
SOJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
125 mA |
131072 words |
COMMON |
5 |
5 |
8 |
SMALL OUTLINE |
SOJ32,.44 |
SRAMs |
1.27 mm |
70 Cel |
3-STATE |
128KX8 |
128K |
4.5 V |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDSO-J32 |
Not Qualified |
1048576 bit |
e0 |
.005 Amp |
25 ns |
||||||||||||||||||||||
Micron Technology |
STANDARD SRAM |
COMMERCIAL |
100 |
LQFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
32768 words |
3.3 |
32 |
FLATPACK, LOW PROFILE |
.65 mm |
70 Cel |
3-STATE |
32KX32 |
32K |
2 V |
0 Cel |
TIN LEAD |
QUAD |
1 |
R-PQFP-G100 |
3.6 V |
1.6 mm |
14 mm |
Not Qualified |
1048576 bit |
3.135 V |
e0 |
YES |
20 mm |
|||||||||||||||||||||
Micron Technology |
CACHE SRAM MODULE |
COMMERCIAL |
160 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
CMOS |
NO LEAD |
PARALLEL |
SYNCHRONOUS |
800 mA |
32768 words |
COMMON |
3.3 |
3.3 |
72 |
MICROELECTRONIC ASSEMBLY |
DIMM160 |
SRAMs |
1.27 mm |
70 Cel |
3-STATE |
32KX72 |
32K |
2 V |
0 Cel |
DUAL |
1 |
R-XDMA-N160 |
3.465 V |
Not Qualified |
2359296 bit |
3.135 V |
YES |
5 ns |
||||||||||||||||||||
Micron Technology |
SRAM MODULE |
COMMERCIAL |
160 |
DIMM |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
NO LEAD |
PARALLEL |
SYNCHRONOUS |
1200 mA |
65536 words |
COMMON |
3.3 |
3.3 |
72 |
MICROELECTRONIC ASSEMBLY |
DIMM160 |
SRAMs |
1.27 mm |
70 Cel |
3-STATE |
64KX72 |
64K |
2 V |
0 Cel |
DUAL |
R-PDMA-N160 |
Not Qualified |
4718592 bit |
6 ns |
|||||||||||||||||||||||||
Micron Technology |
STANDARD SRAM |
AUTOMOTIVE |
28 |
QCCN |
RECTANGULAR |
CERAMIC |
YES |
CMOS |
NO LEAD |
PARALLEL |
ASYNCHRONOUS |
150 mA |
16384 words |
COMMON |
5 |
5 |
4 |
CHIP CARRIER |
LCC28,.35X.55 |
SRAMs |
1.27 mm |
125 Cel |
3-STATE |
16KX4 |
16K |
4.5 V |
-40 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
R-XQCC-N28 |
Not Qualified |
65536 bit |
e0 |
.005 Amp |
12 ns |
||||||||||||||||||||||
Micron Technology |
STANDARD SRAM |
MILITARY |
22 |
QCCN |
RECTANGULAR |
CERAMIC |
YES |
CMOS |
38535Q/M;38534H;883B |
NO LEAD |
PARALLEL |
ASYNCHRONOUS |
120 mA |
65536 words |
SEPARATE |
5 |
5 |
1 |
CHIP CARRIER |
LCC22,.3X.5 |
SRAMs |
1.27 mm |
125 Cel |
3-STATE |
64KX1 |
64K |
4.5 V |
-55 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
R-XQCC-N22 |
Not Qualified |
65536 bit |
e0 |
.01 Amp |
20 ns |
|||||||||||||||||||||
Micron Technology |
STANDARD SRAM |
MILITARY |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
110 mA |
16384 words |
SEPARATE |
5 |
5 |
4 |
IN-LINE |
DIP28,.3 |
SRAMs |
2.54 mm |
125 Cel |
3-STATE |
16KX4 |
16K |
4.5 V |
-55 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDIP-T28 |
Not Qualified |
65536 bit |
e0 |
.005 Amp |
30 ns |
||||||||||||||||||||||
Micron Technology |
PSEUDO STATIC RAM |
INDUSTRIAL |
54 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
35 mA |
2097152 words |
COMMON |
1.8 |
1.8,2.5 |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA54,6X9,30 |
Other Memory ICs |
.75 mm |
85 Cel |
3-STATE |
2MX16 |
2M |
-40 Cel |
TIN LEAD SILVER |
BOTTOM |
R-PBGA-B54 |
1.95 V |
1 mm |
6 mm |
Not Qualified |
33554432 bit |
1.7 V |
e0 |
.00009 Amp |
8 mm |
70 ns |
|||||||||||||||||
Micron Technology |
CACHE SRAM MODULE |
COMMERCIAL |
160 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
CMOS |
NO LEAD |
PARALLEL |
SYNCHRONOUS |
450 mA |
32768 words |
COMMON |
3.3 |
3.3 |
64 |
MICROELECTRONIC ASSEMBLY |
DIMM160 |
SRAMs |
1.27 mm |
70 Cel |
3-STATE |
32KX64 |
32K |
2 V |
0 Cel |
DUAL |
1 |
R-XDMA-N160 |
3.465 V |
Not Qualified |
2097152 bit |
3.135 V |
YES |
12 ns |
||||||||||||||||||||
Micron Technology |
STANDARD SRAM |
MILITARY |
32 |
SOJ |
RECTANGULAR |
CERAMIC |
YES |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
155 mA |
131072 words |
COMMON |
5 |
5 |
8 |
SMALL OUTLINE |
SOJ32,.44 |
SRAMs |
1.27 mm |
125 Cel |
3-STATE |
128KX8 |
128K |
4.5 V |
-55 Cel |
DUAL |
R-XDSO-J32 |
1 |
Not Qualified |
1048576 bit |
.01 Amp |
20 ns |
|||||||||||||||||||||||
Micron Technology |
STANDARD SRAM |
AUTOMOTIVE |
28 |
SOJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
45 mA |
1048576 words |
SEPARATE |
3.3 |
3.3 |
1 |
SMALL OUTLINE |
SOJ28,.44 |
SRAMs |
1.27 mm |
125 Cel |
3-STATE |
1MX1 |
1M |
3 V |
-40 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDSO-J28 |
Not Qualified |
1048576 bit |
e0 |
.0003 Amp |
35 ns |
||||||||||||||||||||||
Micron Technology |
PSEUDO STATIC RAM |
OTHER |
48 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
1048576 words |
1.8 |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.75 mm |
85 Cel |
1MX16 |
1M |
-25 Cel |
TIN LEAD SILVER |
BOTTOM |
R-PBGA-B48 |
1.95 V |
1 mm |
6 mm |
Not Qualified |
16777216 bit |
1.7 V |
e0 |
8 mm |
60 ns |
||||||||||||||||||||||||
Micron Technology |
STANDARD SRAM |
MILITARY |
32 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
CMOS |
38535Q/M;38534H;883B |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
115 mA |
131072 words |
COMMON |
5 |
5 |
8 |
IN-LINE |
DIP32,.4 |
SRAMs |
2.54 mm |
125 Cel |
3-STATE |
128KX8 |
128K |
4.5 V |
-55 Cel |
DUAL |
R-XDIP-T32 |
Not Qualified |
1048576 bit |
.01 Amp |
55 ns |
SRAM, or Static Random-Access Memory, is a type of volatile computer memory that stores data as a flip-flop, which retains the data as long as power is supplied to the system. SRAM is commonly used as cache memory and in other applications where high-speed access to data is required.
SRAM is a type of memory that is faster and more expensive than DRAM (Dynamic Random-Access Memory). It is commonly used as cache memory in computer systems and other digital devices to improve the speed of data access. SRAM is also used in applications where high-speed data processing is required, such as in networking equipment, video games, and other high-performance computing applications.
One of the advantages of using SRAM is that it provides faster access to data than other types of memory, such as DRAM. This is because SRAM does not need to be refreshed like DRAM, which makes it faster and more reliable. Additionally, SRAM uses less power than other types of memory, which makes it ideal for use in battery-powered devices.
One of the disadvantages of using SRAM is that it is more expensive and less dense than other types of memory, such as DRAM or flash memory. This means that it is not suitable for applications that require large amounts of memory at a low cost. Additionally, SRAM is volatile, which means that it cannot store data permanently.