Part | RoHS | Manufacturer | Memory IC Type | Temperature Grade | No. of Terminals | Package Code | Refresh Cycles | Package Shape | Total Dose (V) | Package Body Material | Surface Mount | No. of Functions | Technology | Screening Level | Nominal Negative Supply Voltage | Terminal Form | Parallel or Serial | Operating Mode | Maximum Supply Current | No. of Words | Self Refresh | Input/Output Type | Nominal Supply Voltage / Vsup (V) | Power Supplies (V) | Memory Width | Package Style (Meter) | Package Equivalence Code | Alternate Memory Width | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Reverse Pinout | Output Characteristics | Organization | No. of Words Code | Minimum Standby Voltage | Minimum Operating Temperature | Terminal Finish | Terminal Position | No. of Ports | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Maximum Clock Frequency (fCLK) | Width | Qualification | Memory Density | Minimum Supply Voltage (Vsup) | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Output Enable | Maximum Standby Current | Length | Maximum Access Time |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Micron Technology |
STANDARD SRAM |
MILITARY |
32 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
CMOS |
38535Q/M;38534H;883B |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
115 mA |
131072 words |
COMMON |
5 |
5 |
8 |
IN-LINE |
DIP32,.4 |
SRAMs |
2.54 mm |
125 Cel |
3-STATE |
128KX8 |
128K |
4.5 V |
-55 Cel |
DUAL |
R-XDIP-T32 |
1 |
Not Qualified |
1048576 bit |
.01 Amp |
55 ns |
||||||||||||||||||||||
Micron Technology |
STANDARD SRAM |
COMMERCIAL |
100 |
LQFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
300 mA |
131072 words |
COMMON |
3.3 |
3.3 |
32 |
FLATPACK, LOW PROFILE |
QFP100,.63X.87 |
SRAMs |
.65 mm |
70 Cel |
3-STATE |
128KX32 |
128K |
2 V |
0 Cel |
TIN LEAD |
QUAD |
1 |
R-PQFP-G100 |
3.465 V |
1.6 mm |
66 MHz |
14 mm |
Not Qualified |
4194304 bit |
3.135 V |
e0 |
YES |
20 mm |
7 ns |
||||||||||||||
Micron Technology |
ZBT SRAM |
COMMERCIAL |
100 |
LQFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
300 mA |
524288 words |
COMMON |
3.3 |
3.3 |
18 |
FLATPACK, LOW PROFILE |
QFP100,.63X.87 |
SRAMs |
.65 mm |
70 Cel |
3-STATE |
512KX18 |
512K |
3.14 V |
0 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
R-PQFP-G100 |
3.465 V |
1.6 mm |
100 MHz |
14 mm |
Not Qualified |
9437184 bit |
3.135 V |
FLOW-THROUGH ARCHITECTURE |
e0 |
.01 Amp |
20 mm |
7.5 ns |
||||||||||||||
Micron Technology |
STANDARD SRAM |
COMMERCIAL |
100 |
LQFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
230 mA |
32768 words |
COMMON |
3.3 |
3.3 |
32 |
FLATPACK, LOW PROFILE |
QFP100,.63X.87 |
SRAMs |
.65 mm |
70 Cel |
3-STATE |
32KX32 |
32K |
3.14 V |
0 Cel |
TIN LEAD |
QUAD |
1 |
R-PQFP-G100 |
3.6 V |
1.6 mm |
76 MHz |
14 mm |
Not Qualified |
1048576 bit |
3.135 V |
AUTOMATIC POWER-DOWN |
e0 |
YES |
.005 Amp |
20 mm |
7 ns |
||||||||||||
Micron Technology |
STANDARD SRAM |
INDUSTRIAL |
22 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
110 mA |
4096 words |
COMMON |
5 |
5 |
4 |
IN-LINE |
DIP22,.3 |
SRAMs |
2.54 mm |
85 Cel |
3-STATE |
4KX4 |
4K |
4.5 V |
-40 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDIP-T22 |
Not Qualified |
16384 bit |
e0 |
.003 Amp |
30 ns |
||||||||||||||||||||||
Micron Technology |
CACHE SRAM |
COMMERCIAL |
100 |
LQFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
32768 words |
3.3 |
32 |
FLATPACK, LOW PROFILE |
.65 mm |
70 Cel |
3-STATE |
32KX32 |
32K |
0 Cel |
TIN LEAD |
QUAD |
1 |
R-PQFP-G100 |
3.6 V |
1.6 mm |
14 mm |
Not Qualified |
1048576 bit |
3.135 V |
e0 |
YES |
20 mm |
||||||||||||||||||||||
Micron Technology |
CACHE SRAM MODULE |
COMMERCIAL |
160 |
DIMM |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
CMOS |
NO LEAD |
PARALLEL |
SYNCHRONOUS |
1000 mA |
65536 words |
COMMON |
3.3 |
3.3 |
72 |
MICROELECTRONIC ASSEMBLY |
DIMM160 |
SRAMs |
1.27 mm |
70 Cel |
3-STATE |
64KX72 |
64K |
3.14 V |
0 Cel |
DUAL |
1 |
R-XDMA-N160 |
3.465 V |
Not Qualified |
4718592 bit |
3.135 V |
YES |
.02 Amp |
9 ns |
|||||||||||||||||||
Micron Technology |
STANDARD SRAM |
INDUSTRIAL |
32 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
115 mA |
131072 words |
COMMON |
5 |
5 |
8 |
IN-LINE |
DIP32,.4 |
SRAMs |
2.54 mm |
85 Cel |
3-STATE |
128KX8 |
128K |
4.5 V |
-40 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDIP-T32 |
Not Qualified |
1048576 bit |
e0 |
.005 Amp |
35 ns |
||||||||||||||||||||||
Micron Technology |
STANDARD SRAM |
COMMERCIAL |
100 |
LQFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
32768 words |
3.3 |
36 |
FLATPACK, LOW PROFILE |
.65 mm |
70 Cel |
3-STATE |
32KX36 |
32K |
0 Cel |
TIN LEAD |
QUAD |
1 |
R-PQFP-G100 |
3.6 V |
1.6 mm |
14 mm |
Not Qualified |
1179648 bit |
3.135 V |
AUTOMATIC POWER-DOWN |
e0 |
YES |
20 mm |
|||||||||||||||||||||
Micron Technology |
STANDARD SRAM |
INDUSTRIAL |
32 |
SOJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
125 mA |
131072 words |
COMMON |
5 |
5 |
8 |
SMALL OUTLINE |
SOJ32,.44 |
SRAMs |
1.27 mm |
85 Cel |
3-STATE |
128KX8 |
128K |
4.5 V |
-40 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDSO-J32 |
Not Qualified |
1048576 bit |
e0 |
.005 Amp |
35 ns |
||||||||||||||||||||||
Micron Technology |
STANDARD SRAM |
AUTOMOTIVE |
24 |
SOJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
16384 words |
5 |
4 |
SMALL OUTLINE |
1.27 mm |
125 Cel |
3-STATE |
16KX4 |
16K |
2 V |
-40 Cel |
TIN LEAD |
DUAL |
1 |
R-PDSO-J24 |
5.5 V |
3.61 mm |
7.67 mm |
Not Qualified |
65536 bit |
4.5 V |
e0 |
YES |
15.9 mm |
10 ns |
||||||||||||||||||||
Micron Technology |
QDR SRAM |
COMMERCIAL |
165 |
TBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
490 mA |
2097152 words |
SEPARATE |
1.8 |
1.5/1.8,1.8 |
8 |
GRID ARRAY, THIN PROFILE |
BGA165,11X15,40 |
SRAMs |
1 mm |
70 Cel |
3-STATE |
2MX8 |
2M |
1.7 V |
0 Cel |
Tin/Lead (Sn/Pb) |
BOTTOM |
R-PBGA-B165 |
1.9 V |
1.2 mm |
200 MHz |
13 mm |
Not Qualified |
16777216 bit |
1.7 V |
PIPELINED ARCHITECTURE |
e0 |
.17 Amp |
15 mm |
.45 ns |
||||||||||||||
Micron Technology |
STANDARD SRAM |
MILITARY |
28 |
SOJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
262144 words |
5 |
4 |
SMALL OUTLINE |
1.27 mm |
125 Cel |
256KX4 |
256K |
2 V |
-55 Cel |
TIN LEAD |
DUAL |
1 |
R-PDSO-J28 |
5.5 V |
3.66 mm |
10.21 mm |
Not Qualified |
1048576 bit |
4.5 V |
e0 |
YES |
18.44 mm |
17 ns |
|||||||||||||||||||||
Micron Technology |
STANDARD SRAM |
MILITARY |
28 |
DFP |
RECTANGULAR |
CERAMIC |
YES |
CMOS |
38535Q/M;38534H;883B |
FLAT |
PARALLEL |
ASYNCHRONOUS |
90 mA |
8192 words |
COMMON |
5 |
5 |
8 |
FLATPACK |
FL28,.4 |
SRAMs |
1.27 mm |
125 Cel |
3-STATE |
8KX8 |
8K |
4.5 V |
-55 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-XDFP-F28 |
Not Qualified |
65536 bit |
e0 |
.01 Amp |
35 ns |
|||||||||||||||||||||
Micron Technology |
STANDARD SRAM |
AUTOMOTIVE |
28 |
ZIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
120 mA |
32768 words |
COMMON |
5 |
5 |
8 |
IN-LINE |
ZIP28,.1 |
SRAMs |
1.27 mm |
125 Cel |
3-STATE |
32KX8 |
32K |
4.5 V |
-40 Cel |
Tin/Lead (Sn/Pb) |
ZIG-ZAG |
R-PZIP-T28 |
Not Qualified |
262144 bit |
e0 |
.005 Amp |
20 ns |
||||||||||||||||||||||
Micron Technology |
ZBT SRAM |
COMMERCIAL |
119 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
275 mA |
131072 words |
COMMON |
3.3 |
3.3 |
36 |
GRID ARRAY |
BGA119,7X17,50 |
SRAMs |
1.27 mm |
70 Cel |
3-STATE |
128KX36 |
128K |
3.14 V |
0 Cel |
Tin/Lead (Sn/Pb) |
BOTTOM |
R-PBGA-B119 |
3.465 V |
2.4 mm |
90 MHz |
14 mm |
Not Qualified |
4718592 bit |
3.135 V |
e0 |
.01 Amp |
22 mm |
8.5 ns |
|||||||||||||||
Micron Technology |
STANDARD SRAM |
COMMERCIAL |
28 |
SOJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
190 mA |
262144 words |
COMMON |
5 |
5 |
4 |
SMALL OUTLINE |
SOJ28,.44 |
SRAMs |
1.27 mm |
70 Cel |
3-STATE |
256KX4 |
256K |
2 V |
0 Cel |
TIN LEAD |
DUAL |
1 |
R-PDSO-J28 |
5.5 V |
3.68 mm |
10.21 mm |
Not Qualified |
1048576 bit |
4.5 V |
e0 |
YES |
.00015 Amp |
18.44 mm |
12 ns |
||||||||||||||
Micron Technology |
STANDARD SRAM |
INDUSTRIAL |
28 |
SOJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
135 mA |
262144 words |
COMMON |
5 |
5 |
4 |
SMALL OUTLINE |
SOJ28,.44 |
SRAMs |
1.27 mm |
85 Cel |
3-STATE |
256KX4 |
256K |
2 V |
-40 Cel |
TIN LEAD |
DUAL |
1 |
R-PDSO-J28 |
5.5 V |
3.68 mm |
10.21 mm |
Not Qualified |
1048576 bit |
4.5 V |
e0 |
YES |
.00017 Amp |
18.44 mm |
25 ns |
||||||||||||||
Micron Technology |
STANDARD SRAM |
COMMERCIAL |
100 |
LQFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
150 mA |
65536 words |
COMMON |
3.3 |
3.3 |
16 |
FLATPACK, LOW PROFILE |
QFP100,.63X.87 |
SRAMs |
.65 mm |
70 Cel |
3-STATE |
64KX16 |
64K |
3.14 V |
0 Cel |
TIN LEAD |
QUAD |
1 |
R-PQFP-G100 |
3.6 V |
1.6 mm |
14 mm |
Not Qualified |
1048576 bit |
3.135 V |
AUTOMATIC POWER-DOWN |
e0 |
YES |
.005 Amp |
20 mm |
12 ns |
|||||||||||||
Micron Technology |
STANDARD SRAM |
INDUSTRIAL |
119 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
262144 words |
3.3 |
18 |
GRID ARRAY |
1.27 mm |
85 Cel |
256KX18 |
256K |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B119 |
3.6 V |
2.4 mm |
14 mm |
Not Qualified |
4718592 bit |
3.135 V |
e1 |
22 mm |
2.3 ns |
||||||||||||||||||||||||
Micron Technology |
STANDARD SRAM |
INDUSTRIAL |
28 |
SOJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
65 mA |
1048576 words |
SEPARATE |
3.3 |
3.3 |
1 |
SMALL OUTLINE |
SOJ28,.44 |
SRAMs |
1.27 mm |
85 Cel |
3-STATE |
1MX1 |
1M |
2 V |
-40 Cel |
TIN LEAD |
DUAL |
1 |
R-PDSO-J28 |
3.6 V |
3.68 mm |
10.21 mm |
Not Qualified |
1048576 bit |
3 V |
e0 |
NO |
.00005 Amp |
18.44 mm |
20 ns |
||||||||||||||
Micron Technology |
STANDARD SRAM |
COMMERCIAL |
100 |
LQFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
262144 words |
3.3 |
16 |
FLATPACK, LOW PROFILE |
.65 mm |
70 Cel |
256KX16 |
256K |
0 Cel |
TIN LEAD |
QUAD |
R-PQFP-G100 |
3.6 V |
1.6 mm |
14 mm |
Not Qualified |
4194304 bit |
3.135 V |
e0 |
20 mm |
6 ns |
||||||||||||||||||||||||
Micron Technology |
STANDARD SRAM |
COMMERCIAL |
100 |
LQFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
131072 words |
3.3 |
36 |
FLATPACK, LOW PROFILE |
.65 mm |
70 Cel |
3-STATE |
128KX36 |
128K |
0 Cel |
TIN LEAD |
QUAD |
1 |
R-PQFP-G100 |
3.6 V |
1.6 mm |
14 mm |
Not Qualified |
4718592 bit |
3.135 V |
AUTOMATIC POWER-DOWN |
e0 |
YES |
20 mm |
5.5 ns |
||||||||||||||||||||
Micron Technology |
STANDARD SRAM |
MILITARY |
32 |
SOJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
120 mA |
32768 words |
COMMON |
5 |
5 |
9 |
SMALL OUTLINE |
SOJ32,.34 |
SRAMs |
1.27 mm |
125 Cel |
3-STATE |
32KX9 |
32K |
2 V |
-55 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
1 |
R-PDSO-J32 |
5.5 V |
3.66 mm |
7.67 mm |
Not Qualified |
294912 bit |
4.5 V |
e0 |
YES |
.0004 Amp |
20.98 mm |
20 ns |
||||||||||||||
Micron Technology |
CACHE SRAM |
COMMERCIAL |
100 |
LQFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
300 mA |
65536 words |
COMMON |
3.3 |
3.3 |
18 |
FLATPACK, LOW PROFILE |
QFP100,.63X.87 |
SRAMs |
.65 mm |
70 Cel |
3-STATE |
64KX18 |
64K |
3.14 V |
0 Cel |
TIN LEAD |
QUAD |
R-PQFP-G100 |
3.6 V |
1.6 mm |
100 MHz |
14 mm |
Not Qualified |
1179648 bit |
3.135 V |
BURST CONTROL; SELF TIMED WRITE CYCLE; REGISTER ADDRESS; BYTE WRITE CONTROL; AUTOMATIC POWER DOWN |
e0 |
.01 Amp |
20 mm |
5 ns |
||||||||||||||
Micron Technology |
STANDARD SRAM |
COMMERCIAL |
32 |
TSOP2 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
131072 words |
3.3 |
8 |
SMALL OUTLINE, THIN PROFILE |
1.27 mm |
70 Cel |
128KX8 |
128K |
0 Cel |
TIN LEAD |
DUAL |
1 |
R-PDSO-G32 |
3.63 V |
1.2 mm |
10.16 mm |
Not Qualified |
1048576 bit |
3 V |
e0 |
YES |
20.96 mm |
20 ns |
||||||||||||||||||||||
Micron Technology |
STANDARD SRAM |
AUTOMOTIVE |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
195 mA |
65536 words |
COMMON |
5 |
5 |
4 |
IN-LINE |
DIP28,.3 |
SRAMs |
2.54 mm |
125 Cel |
3-STATE |
64KX4 |
64K |
2 V |
-40 Cel |
TIN LEAD |
DUAL |
1 |
R-PDIP-T28 |
5.5 V |
4.32 mm |
7.62 mm |
Not Qualified |
262144 bit |
4.5 V |
e0 |
YES |
.0005 Amp |
36.83 mm |
12 ns |
||||||||||||||
Micron Technology |
STANDARD SRAM |
COMMERCIAL |
100 |
LQFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
325 mA |
65536 words |
COMMON |
3.3 |
3.3 |
36 |
FLATPACK, LOW PROFILE |
QFP100,.63X.87 |
SRAMs |
.65 mm |
70 Cel |
3-STATE |
64KX36 |
64K |
3.14 V |
0 Cel |
TIN LEAD |
QUAD |
1 |
R-PQFP-G100 |
3.6 V |
1.6 mm |
66 MHz |
14 mm |
Not Qualified |
2359296 bit |
3.135 V |
e0 |
YES |
.002 Amp |
20 mm |
7 ns |
|||||||||||||
Micron Technology |
STANDARD SRAM |
COMMERCIAL |
24 |
SOJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
165 mA |
4096 words |
COMMON |
5 |
5 |
4 |
SMALL OUTLINE |
SOJ24,.34 |
SRAMs |
1.27 mm |
70 Cel |
3-STATE |
4KX4 |
4K |
2 V |
0 Cel |
TIN LEAD |
DUAL |
1 |
R-PDSO-J24 |
5.5 V |
3.61 mm |
7.67 mm |
Not Qualified |
16384 bit |
4.5 V |
e0 |
NO |
15.9 mm |
15 ns |
|||||||||||||||
Micron Technology |
STANDARD SRAM |
INDUSTRIAL |
24 |
SOJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
110 mA |
4096 words |
COMMON |
5 |
5 |
4 |
SMALL OUTLINE |
SOJ24,.34 |
SRAMs |
1.27 mm |
85 Cel |
3-STATE |
4KX4 |
4K |
2 V |
-40 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDSO-J24 |
Not Qualified |
16384 bit |
e0 |
.00025 Amp |
30 ns |
||||||||||||||||||||||
Micron Technology |
STANDARD SRAM |
COMMERCIAL |
24 |
SOJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
130 mA |
65536 words |
SEPARATE |
5 |
5 |
1 |
SMALL OUTLINE |
SOJ24,.34 |
SRAMs |
1.27 mm |
70 Cel |
3-STATE |
64KX1 |
64K |
2 V |
0 Cel |
TIN LEAD |
DUAL |
1 |
R-PDSO-J24 |
5.5 V |
3.68 mm |
7.67 mm |
Not Qualified |
65536 bit |
4.5 V |
TTL-COMPATIBLE INPUTS & OUTPUTS |
e0 |
NO |
.0003 Amp |
15.9 mm |
25 ns |
|||||||||||||
Micron Technology |
STANDARD SRAM |
AUTOMOTIVE |
28 |
QCCN |
RECTANGULAR |
CERAMIC |
YES |
CMOS |
NO LEAD |
PARALLEL |
ASYNCHRONOUS |
140 mA |
8192 words |
COMMON |
5 |
5 |
8 |
CHIP CARRIER |
LCC28,.35X.55 |
SRAMs |
1.27 mm |
125 Cel |
3-STATE |
8KX8 |
8K |
4.5 V |
-40 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
R-XQCC-N28 |
Not Qualified |
65536 bit |
e0 |
.005 Amp |
15 ns |
||||||||||||||||||||||
Micron Technology |
STANDARD SRAM |
INDUSTRIAL |
32 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
131072 words |
COMMON |
3.3 |
3.3 |
8 |
IN-LINE |
DIP32,.4 |
SRAMs |
2.54 mm |
85 Cel |
3-STATE |
128KX8 |
128K |
2 V |
-40 Cel |
TIN LEAD |
DUAL |
1 |
R-PDIP-T32 |
3.6 V |
4.32 mm |
10.16 mm |
Not Qualified |
1048576 bit |
3 V |
e0 |
YES |
40.135 mm |
45 ns |
||||||||||||||||
Micron Technology |
ZBT SRAM |
COMMERCIAL |
100 |
LQFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
2097152 words |
3.3 |
18 |
FLATPACK, LOW PROFILE |
.65 mm |
70 Cel |
2MX18 |
2M |
0 Cel |
QUAD |
R-PQFP-G100 |
3.465 V |
1.6 mm |
14 mm |
Not Qualified |
37748736 bit |
3.135 V |
FLOW-THROUGH ARCHITECTURE |
20 mm |
6.5 ns |
|||||||||||||||||||||||||
Micron Technology |
STANDARD SRAM |
MILITARY |
24 |
SOJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
155 mA |
262144 words |
SEPARATE |
5 |
5 |
1 |
SMALL OUTLINE |
SOJ24,.34 |
SRAMs |
1.27 mm |
125 Cel |
3-STATE |
256KX1 |
256K |
4.5 V |
-55 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDSO-J24 |
Not Qualified |
262144 bit |
e0 |
.007 Amp |
15 ns |
||||||||||||||||||||||
Micron Technology |
STANDARD SRAM |
MILITARY |
32 |
QCCN |
RECTANGULAR |
CERAMIC |
YES |
CMOS |
NO LEAD |
PARALLEL |
ASYNCHRONOUS |
100 mA |
32768 words |
COMMON |
5 |
5 |
8 |
CHIP CARRIER |
LCC32,.45X.55 |
SRAMs |
1.27 mm |
125 Cel |
3-STATE |
32KX8 |
32K |
2 V |
-55 Cel |
QUAD |
R-XQCC-N32 |
Not Qualified |
262144 bit |
.0005 Amp |
55 ns |
||||||||||||||||||||||||
Micron Technology |
STANDARD SRAM |
COMMERCIAL |
28 |
SOJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
40 mA |
262144 words |
COMMON |
3.3 |
3.3 |
4 |
SMALL OUTLINE |
SOJ28,.34 |
SRAMs |
1.27 mm |
70 Cel |
3-STATE |
256KX4 |
256K |
2 V |
0 Cel |
TIN LEAD |
DUAL |
1 |
R-PDSO-J28 |
3.6 V |
3.66 mm |
7.62 mm |
Not Qualified |
1048576 bit |
3 V |
e0 |
YES |
.00005 Amp |
18.44 mm |
45 ns |
||||||||||||||
Micron Technology |
STANDARD SRAM |
COMMERCIAL |
119 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
450 mA |
262144 words |
COMMON |
3.3 |
3.3 |
36 |
GRID ARRAY |
BGA119,7X17,50 |
SRAMs |
1.27 mm |
70 Cel |
3-STATE |
256KX36 |
256K |
3.13 V |
0 Cel |
TIN LEAD |
BOTTOM |
R-PBGA-B119 |
3.6 V |
2.4 mm |
14 mm |
Not Qualified |
9437184 bit |
3.135 V |
AUTOMATIC POWER DOWN; SELF-TIMED WRITE CYCLE; INDIVIDUAL BYTE WRITE |
e0 |
.01 Amp |
22 mm |
3.5 ns |
|||||||||||||||
Micron Technology |
CACHE SRAM |
INDUSTRIAL |
100 |
LQFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
131072 words |
3.3 |
32 |
FLATPACK, LOW PROFILE |
.65 mm |
85 Cel |
128KX32 |
128K |
-40 Cel |
QUAD |
R-PQFP-G100 |
3.6 V |
1.6 mm |
14 mm |
Not Qualified |
4194304 bit |
3.135 V |
20 mm |
3.5 ns |
||||||||||||||||||||||||||
Micron Technology |
STANDARD SRAM |
COMMERCIAL |
100 |
LQFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
475 mA |
32768 words |
COMMON |
3.3 |
3.3 |
36 |
FLATPACK, LOW PROFILE |
QFP100,.7X.9 |
SRAMs |
.65 mm |
70 Cel |
3-STATE |
32KX36 |
32K |
2 V |
0 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
1 |
R-PQFP-G100 |
3.465 V |
1.6 mm |
125 MHz |
14 mm |
Not Qualified |
1179648 bit |
3.135 V |
OPTIONAL INTERLEAVED OR LINEAR BURST; BYTE WRITE CONTROL; SELF TIMED WRITE CYCLE |
e0 |
YES |
20 mm |
4.5 ns |
|||||||||||||
Micron Technology |
STANDARD SRAM |
COMMERCIAL |
100 |
LQFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
65536 words |
3.3 |
18 |
FLATPACK, LOW PROFILE |
.65 mm |
70 Cel |
3-STATE |
64KX18 |
64K |
0 Cel |
TIN LEAD |
QUAD |
1 |
R-PQFP-G100 |
3.465 V |
1.6 mm |
14 mm |
Not Qualified |
1179648 bit |
3.135 V |
AUTOMATIC POWER-DOWN |
e0 |
YES |
20 mm |
|||||||||||||||||||||
Micron Technology |
STANDARD SRAM |
AUTOMOTIVE |
32 |
SOJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
165 mA |
131072 words |
COMMON |
5 |
5 |
8 |
SMALL OUTLINE |
SOJ32,.44 |
SRAMs |
1.27 mm |
125 Cel |
3-STATE |
128KX8 |
128K |
2 V |
-40 Cel |
TIN LEAD |
DUAL |
1 |
R-PDSO-J32 |
5.5 V |
3.68 mm |
10.21 mm |
Not Qualified |
1048576 bit |
4.5 V |
TTL-COMPATIBLE INPUTS & OUTPUTS |
e0 |
YES |
.00015 Amp |
20.98 mm |
15 ns |
|||||||||||||
Micron Technology |
CACHE SRAM |
COMMERCIAL |
100 |
LQFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
340 mA |
131072 words |
COMMON |
3.3 |
3.3 |
18 |
FLATPACK, LOW PROFILE |
QFP100,.63X.87 |
SRAMs |
.65 mm |
70 Cel |
3-STATE |
128KX18 |
128K |
3.14 V |
0 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
R-PQFP-G100 |
3.6 V |
1.6 mm |
166 MHz |
14 mm |
Not Qualified |
2359296 bit |
3.135 V |
e0 |
.01 Amp |
20 mm |
3.5 ns |
|||||||||||||||
Micron Technology |
ZBT SRAM |
COMMERCIAL |
165 |
TBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
1048576 words |
2.5 |
36 |
GRID ARRAY, THIN PROFILE |
1 mm |
70 Cel |
1MX36 |
1M |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B165 |
2.625 V |
1.2 mm |
15 mm |
Not Qualified |
37748736 bit |
2.375 V |
PIPELINED ARCHITECTURE |
e1 |
17 mm |
3.2 ns |
|||||||||||||||||||||||
Micron Technology |
STANDARD SRAM |
INDUSTRIAL |
22 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
185 mA |
4096 words |
COMMON |
5 |
5 |
4 |
IN-LINE |
DIP22,.3 |
SRAMs |
2.54 mm |
85 Cel |
3-STATE |
4KX4 |
4K |
2 V |
-40 Cel |
TIN LEAD |
DUAL |
1 |
R-PDIP-T22 |
5.5 V |
4.32 mm |
7.62 mm |
Not Qualified |
16384 bit |
4.5 V |
e0 |
YES |
.0003 Amp |
26.165 mm |
12 ns |
||||||||||||||
Micron Technology |
STANDARD SRAM |
COMMERCIAL |
24 |
SOJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
165 mA |
2048 words |
COMMON |
5 |
5 |
8 |
SMALL OUTLINE |
SOJ24,.34 |
SRAMs |
1.27 mm |
70 Cel |
3-STATE |
2KX8 |
2K |
2 V |
0 Cel |
TIN LEAD |
DUAL |
1 |
R-PDSO-J24 |
5.5 V |
3.61 mm |
7.67 mm |
Not Qualified |
16384 bit |
4.5 V |
e0 |
YES |
.0003 Amp |
15.9 mm |
15 ns |
||||||||||||||
Micron Technology |
STANDARD SRAM |
MILITARY |
24 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
CMOS |
38535Q/M;38534H;883B |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
130 mA |
2048 words |
COMMON |
5 |
5 |
8 |
IN-LINE |
DIP24,.3 |
SRAMs |
2.54 mm |
125 Cel |
3-STATE |
2KX8 |
2K |
2 V |
-55 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-XDIP-T24 |
Not Qualified |
16384 bit |
e0 |
.001 Amp |
15 ns |
|||||||||||||||||||||
Micron Technology |
STANDARD SRAM |
AUTOMOTIVE |
28 |
SOJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
90 mA |
8192 words |
COMMON |
5 |
5 |
8 |
SMALL OUTLINE |
SOJ28,.34 |
SRAMs |
1.27 mm |
125 Cel |
3-STATE |
8KX8 |
8K |
4.5 V |
-40 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDSO-J28 |
Not Qualified |
65536 bit |
e0 |
.003 Amp |
35 ns |
SRAM, or Static Random-Access Memory, is a type of volatile computer memory that stores data as a flip-flop, which retains the data as long as power is supplied to the system. SRAM is commonly used as cache memory and in other applications where high-speed access to data is required.
SRAM is a type of memory that is faster and more expensive than DRAM (Dynamic Random-Access Memory). It is commonly used as cache memory in computer systems and other digital devices to improve the speed of data access. SRAM is also used in applications where high-speed data processing is required, such as in networking equipment, video games, and other high-performance computing applications.
One of the advantages of using SRAM is that it provides faster access to data than other types of memory, such as DRAM. This is because SRAM does not need to be refreshed like DRAM, which makes it faster and more reliable. Additionally, SRAM uses less power than other types of memory, which makes it ideal for use in battery-powered devices.
One of the disadvantages of using SRAM is that it is more expensive and less dense than other types of memory, such as DRAM or flash memory. This means that it is not suitable for applications that require large amounts of memory at a low cost. Additionally, SRAM is volatile, which means that it cannot store data permanently.