| Part | RoHS | Manufacturer | Memory IC Type | Temperature Grade | No. of Terminals | Package Code | Refresh Cycles | Package Shape | Total Dose (V) | Package Body Material | Surface Mount | No. of Functions | Technology | Screening Level | Nominal Negative Supply Voltage | Terminal Form | Parallel or Serial | Operating Mode | Maximum Supply Current | No. of Words | Self Refresh | Input/Output Type | Nominal Supply Voltage / Vsup (V) | Power Supplies (V) | Memory Width | Package Style (Meter) | Package Equivalence Code | Alternate Memory Width | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Reverse Pinout | Output Characteristics | Organization | No. of Words Code | Minimum Standby Voltage | Minimum Operating Temperature | Terminal Finish | Terminal Position | No. of Ports | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Maximum Clock Frequency (fCLK) | Width | Qualification | Memory Density | Minimum Supply Voltage (Vsup) | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Output Enable | Maximum Standby Current | Length | Maximum Access Time |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Micron Technology |
STANDARD SRAM |
AUTOMOTIVE |
24 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
45 mA |
65536 words |
COMMON |
3.3 |
3.3 |
4 |
IN-LINE |
DIP24,.3 |
SRAMs |
2.54 mm |
125 Cel |
3-STATE |
64KX4 |
64K |
3 V |
-40 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDIP-T24 |
Not Qualified |
262144 bit |
e0 |
.0003 Amp |
25 ns |
||||||||||||||||||||||
|
Micron Technology |
STANDARD SRAM |
MILITARY |
54 |
TSOP2 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
262144 words |
3.3 |
16 |
SMALL OUTLINE, THIN PROFILE |
.8 mm |
125 Cel |
256KX16 |
256K |
-55 Cel |
MATTE TIN |
DUAL |
1 |
R-PDSO-G54 |
3.6 V |
1.2 mm |
10.16 mm |
Not Qualified |
4194304 bit |
3 V |
e3 |
YES |
22.25 mm |
35 ns |
||||||||||||||||||||||
|
Micron Technology |
PSEUDO STATIC RAM |
INDUSTRIAL |
54 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
2097152 words |
1.8 |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.75 mm |
85 Cel |
2MX16 |
2M |
-40 Cel |
TIN LEAD SILVER |
BOTTOM |
R-PBGA-B54 |
1.95 V |
1 mm |
6 mm |
Not Qualified |
33554432 bit |
1.7 V |
e0 |
8 mm |
60 ns |
||||||||||||||||||||||||
|
Micron Technology |
STANDARD SRAM |
MILITARY |
32 |
SOJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
115 mA |
131072 words |
COMMON |
5 |
5 |
8 |
SMALL OUTLINE |
SOJ32,.44 |
SRAMs |
1.27 mm |
125 Cel |
3-STATE |
128KX8 |
128K |
2 V |
-55 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
1 |
R-PDSO-J32 |
5.5 V |
3.68 mm |
10.21 mm |
Not Qualified |
1048576 bit |
4.5 V |
AUTOMATIC POWER-DOWN |
e0 |
YES |
.0002 Amp |
20.98 mm |
35 ns |
|||||||||||||
|
Micron Technology |
STANDARD SRAM |
MILITARY |
24 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
110 mA |
262144 words |
SEPARATE |
5 |
5 |
1 |
IN-LINE |
DIP24,.3 |
SRAMs |
2.54 mm |
125 Cel |
3-STATE |
256KX1 |
256K |
4.5 V |
-55 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-XDIP-T24 |
Not Qualified |
262144 bit |
e0 |
.008 Amp |
25 ns |
||||||||||||||||||||||
|
Micron Technology |
STANDARD SRAM |
INDUSTRIAL |
32 |
SOJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
131072 words |
5 |
8 |
SMALL OUTLINE |
1.27 mm |
85 Cel |
128KX8 |
128K |
-40 Cel |
DUAL |
R-PDSO-J32 |
5.5 V |
3.68 mm |
7.67 mm |
Not Qualified |
1048576 bit |
4.5 V |
TTL-COMPATIBLE INPUTS & OUTPUTS |
20.98 mm |
12 ns |
|||||||||||||||||||||||||
|
Micron Technology |
STANDARD SRAM |
COMMERCIAL |
100 |
LQFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
250 mA |
262144 words |
COMMON |
3.3 |
2.5,3.3 |
32 |
FLATPACK, LOW PROFILE |
QFP100,.63X.87 |
SRAMs |
.65 mm |
70 Cel |
3-STATE |
256KX32 |
256K |
3.14 V |
0 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
R-PQFP-G100 |
3.6 V |
1.6 mm |
94 MHz |
14 mm |
Not Qualified |
8388608 bit |
3.135 V |
AUTOMATIC POWER DOWN; SELF-TIMED WRITE CYCLE; INDIVIDUAL BYTE WRITE |
e0 |
.01 Amp |
20 mm |
9 ns |
||||||||||||||
|
Micron Technology |
ZBT SRAM |
COMMERCIAL |
119 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
250 mA |
262144 words |
COMMON |
3.3 |
3.3 |
18 |
GRID ARRAY |
BGA119,7X17,50 |
SRAMs |
1.27 mm |
70 Cel |
3-STATE |
256KX18 |
256K |
3.14 V |
0 Cel |
Tin/Lead (Sn/Pb) |
BOTTOM |
R-PBGA-B119 |
3.465 V |
2.4 mm |
83 MHz |
14 mm |
Not Qualified |
4718592 bit |
3.135 V |
e0 |
.01 Amp |
22 mm |
9 ns |
|||||||||||||||
|
Micron Technology |
CACHE SRAM |
COMMERCIAL |
52 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
220 mA |
8192 words |
COMMON |
5 |
5 |
18 |
FLATPACK |
QFP52,.52SQ |
SRAMs |
.65 mm |
70 Cel |
3-STATE |
8KX18 |
8K |
4.75 V |
0 Cel |
TIN LEAD |
QUAD |
1 |
S-PQFP-G52 |
5.25 V |
2.44 mm |
10 mm |
Not Qualified |
147456 bit |
4.75 V |
ADDRESS LATCH; 2-WAY SET ASSOCIATIVE |
e0 |
YES |
.02 Amp |
10 mm |
20 ns |
|||||||||||||
|
Micron Technology |
STANDARD SRAM |
MILITARY |
22 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
160 mA |
4096 words |
COMMON |
5 |
5 |
4 |
IN-LINE |
DIP22,.3 |
SRAMs |
2.54 mm |
125 Cel |
3-STATE |
4KX4 |
4K |
2 V |
-55 Cel |
TIN LEAD |
DUAL |
1 |
R-PDIP-T22 |
5.5 V |
4.32 mm |
7.62 mm |
Not Qualified |
16384 bit |
4.5 V |
e0 |
YES |
.00025 Amp |
26.165 mm |
8 ns |
||||||||||||||
|
Micron Technology |
STANDARD SRAM |
INDUSTRIAL |
119 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
262144 words |
3.3 |
32 |
GRID ARRAY |
1.27 mm |
85 Cel |
256KX32 |
256K |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B119 |
3.6 V |
2.4 mm |
14 mm |
Not Qualified |
8388608 bit |
3.135 V |
AUTOMATIC POWER DOWN; SELF-TIMED WRITE CYCLE; INDIVIDUAL BYTE WRITE |
e1 |
22 mm |
3.5 ns |
|||||||||||||||||||||||
|
Micron Technology |
STANDARD SRAM |
COMMERCIAL |
79 |
DIE |
UNSPECIFIED |
UNSPECIFIED |
YES |
1 |
CMOS |
NO LEAD |
PARALLEL |
SYNCHRONOUS |
262144 words |
3.3 |
18 |
UNCASED CHIP |
70 Cel |
3-STATE |
256KX18 |
256K |
0 Cel |
UPPER |
1 |
X-XUUC-N79 |
3.6 V |
Not Qualified |
4718592 bit |
3.135 V |
YES |
11 ns |
|||||||||||||||||||||||||||
|
Micron Technology |
STANDARD SRAM |
COMMERCIAL |
32 |
SOJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
1048576 words |
3.3 |
4 |
SMALL OUTLINE |
1.27 mm |
70 Cel |
3-STATE |
1MX4 |
1M |
2 V |
0 Cel |
TIN LEAD |
DUAL |
1 |
R-PDSO-J32 |
3.6 V |
3.68 mm |
10.21 mm |
Not Qualified |
4194304 bit |
3 V |
e0 |
YES |
20.98 mm |
12 ns |
||||||||||||||||||||
|
Micron Technology |
STANDARD SRAM |
COMMERCIAL |
77 |
DIE |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
CMOS |
NO LEAD |
PARALLEL |
SYNCHRONOUS |
262144 words |
3.3 |
16 |
UNCASED CHIP |
70 Cel |
3-STATE |
256KX16 |
256K |
0 Cel |
UPPER |
1 |
R-XUUC-N77 |
3.6 V |
Not Qualified |
4194304 bit |
3.135 V |
YES |
10 ns |
|||||||||||||||||||||||||||
|
Micron Technology |
STANDARD SRAM |
COMMERCIAL |
24 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
90 mA |
65536 words |
COMMON |
5 |
5 |
4 |
IN-LINE |
DIP24,.3 |
SRAMs |
2.54 mm |
70 Cel |
3-STATE |
64KX4 |
64K |
2 V |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-XDIP-T24 |
Not Qualified |
262144 bit |
e0 |
.0003 Amp |
45 ns |
||||||||||||||||||||||
|
Micron Technology |
STANDARD SRAM |
COMMERCIAL |
32 |
SOJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
524288 words |
3.3 |
8 |
SMALL OUTLINE |
1.27 mm |
70 Cel |
512KX8 |
512K |
2 V |
0 Cel |
DUAL |
1 |
R-PDSO-J32 |
3.63 V |
3.68 mm |
10.21 mm |
Not Qualified |
4194304 bit |
3 V |
YES |
20.98 mm |
20 ns |
|||||||||||||||||||||||
|
Micron Technology |
STANDARD SRAM |
MILITARY |
28 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
110 mA |
16384 words |
SEPARATE |
5 |
5 |
4 |
IN-LINE |
DIP28,.3 |
SRAMs |
2.54 mm |
125 Cel |
3-STATE |
16KX4 |
16K |
4.5 V |
-55 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-XDIP-T28 |
Not Qualified |
65536 bit |
e0 |
.005 Amp |
35 ns |
||||||||||||||||||||||
|
Micron Technology |
STANDARD SRAM |
COMMERCIAL |
54 |
SOJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
175 mA |
262144 words |
COMMON |
5 |
5 |
16 |
SMALL OUTLINE |
SOJ54,.44,32 |
SRAMs |
.8 mm |
70 Cel |
3-STATE |
256KX16 |
256K |
4.5 V |
0 Cel |
TIN LEAD |
DUAL |
1 |
R-PDSO-J54 |
5.5 V |
3.81 mm |
10.16 mm |
Not Qualified |
4194304 bit |
4.5 V |
e0 |
YES |
.002 Amp |
22.25 mm |
20 ns |
||||||||||||||
|
Micron Technology |
STANDARD SRAM |
AUTOMOTIVE |
54 |
SOJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
262144 words |
5 |
16 |
SMALL OUTLINE |
.8 mm |
125 Cel |
256KX16 |
256K |
2 V |
-40 Cel |
TIN LEAD |
DUAL |
1 |
R-PDSO-J54 |
5.5 V |
3.81 mm |
10.21 mm |
Not Qualified |
4194304 bit |
4.5 V |
e0 |
YES |
22.25 mm |
25 ns |
|||||||||||||||||||||
|
Micron Technology |
STANDARD SRAM |
INDUSTRIAL |
28 |
SOJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
8192 words |
5 |
8 |
SMALL OUTLINE |
1.27 mm |
85 Cel |
3-STATE |
8KX8 |
8K |
2 V |
-40 Cel |
TIN LEAD |
DUAL |
1 |
R-PDSO-J28 |
5.5 V |
3.66 mm |
7.67 mm |
Not Qualified |
65536 bit |
4.5 V |
TTL-COMPATIBLE INPUTS & OUTPUTS |
e0 |
YES |
18.44 mm |
10 ns |
|||||||||||||||||||
|
Micron Technology |
STANDARD SRAM |
MILITARY |
28 |
SOJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
90 mA |
65536 words |
COMMON |
5 |
5 |
4 |
SMALL OUTLINE |
SOJ28,.34 |
SRAMs |
1.27 mm |
125 Cel |
3-STATE |
64KX4 |
64K |
4.5 V |
-55 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDSO-J28 |
Not Qualified |
262144 bit |
e0 |
.007 Amp |
45 ns |
||||||||||||||||||||||
|
Micron Technology |
STANDARD SRAM |
MILITARY |
36 |
SOJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
524288 words |
5 |
8 |
SMALL OUTLINE |
1.27 mm |
125 Cel |
512KX8 |
512K |
2 V |
-55 Cel |
DUAL |
1 |
R-PDSO-J36 |
5.5 V |
3.76 mm |
10.21 mm |
Not Qualified |
4194304 bit |
4.5 V |
YES |
23.52 mm |
12 ns |
|||||||||||||||||||||||
|
Micron Technology |
STANDARD SRAM |
INDUSTRIAL |
119 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
131072 words |
3.3 |
36 |
GRID ARRAY |
1.27 mm |
85 Cel |
128KX36 |
128K |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B119 |
3.6 V |
2.4 mm |
14 mm |
Not Qualified |
4718592 bit |
3.135 V |
e1 |
22 mm |
4 ns |
||||||||||||||||||||||||
|
Micron Technology |
STANDARD SRAM |
AUTOMOTIVE |
28 |
SOJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
150 mA |
1048576 words |
SEPARATE |
5 |
5 |
1 |
SMALL OUTLINE |
SOJ28,.34 |
SRAMs |
1.27 mm |
125 Cel |
3-STATE |
1MX1 |
1M |
2 V |
-40 Cel |
TIN LEAD |
DUAL |
1 |
R-PDSO-J28 |
5.5 V |
3.66 mm |
7.62 mm |
Not Qualified |
1048576 bit |
4.5 V |
e0 |
NO |
.001 Amp |
18.44 mm |
20 ns |
||||||||||||||
|
Micron Technology |
LATE-WRITE SRAM |
COMMERCIAL |
119 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
500 mA |
131072 words |
COMMON |
3.3 |
2.5,3.3 |
36 |
GRID ARRAY |
BGA119,7X17,50 |
SRAMs |
1.27 mm |
70 Cel |
3-STATE |
128KX36 |
128K |
3.1 V |
0 Cel |
TIN LEAD |
BOTTOM |
1 |
R-PBGA-B119 |
3.6 V |
2.4 mm |
14 mm |
Not Qualified |
4718592 bit |
3.1 V |
e0 |
YES |
.025 Amp |
22 mm |
2.5 ns |
||||||||||||||
|
Micron Technology |
PSEUDO STATIC RAM |
INDUSTRIAL |
48 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
25 mA |
4194304 words |
COMMON |
1.8 |
1.8,1.8/3 |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA48,6X8,30 |
Other Memory ICs |
.75 mm |
85 Cel |
3-STATE |
4MX16 |
4M |
-40 Cel |
TIN LEAD |
BOTTOM |
R-PBGA-B48 |
1.95 V |
1 mm |
6 mm |
Not Qualified |
67108864 bit |
1.7 V |
e0 |
.00012 Amp |
8 mm |
70 ns |
|||||||||||||||||
|
Micron Technology |
QDR SRAM |
COMMERCIAL |
165 |
TBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
2097152 words |
2.5 |
18 |
GRID ARRAY, THIN PROFILE |
1 mm |
70 Cel |
2MX18 |
2M |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B165 |
2.6 V |
1.2 mm |
15 mm |
Not Qualified |
37748736 bit |
2.4 V |
PIPELINED ARCHITECTURE |
e1 |
17 mm |
2.5 ns |
|||||||||||||||||||||||
|
Micron Technology |
STANDARD SRAM |
COMMERCIAL |
32 |
SOJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
260 mA |
262144 words |
COMMON |
5 |
5 |
4 |
SMALL OUTLINE |
SOJ32,.44 |
SRAMs |
1.27 mm |
70 Cel |
3-STATE |
256KX4 |
256K |
4.5 V |
0 Cel |
TIN LEAD |
DUAL |
1 |
R-PDSO-J32 |
5.5 V |
3.68 mm |
10.21 mm |
Not Qualified |
1048576 bit |
4.5 V |
e0 |
YES |
.005 Amp |
20.98 mm |
15 ns |
||||||||||||||
|
Micron Technology |
PSEUDO STATIC RAM |
INDUSTRIAL |
54 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
35 mA |
4194304 words |
COMMON |
1.8 |
1.8,3 |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA54,6X9,30 |
Other Memory ICs |
.75 mm |
85 Cel |
3-STATE |
4MX16 |
4M |
-40 Cel |
TIN LEAD SILVER |
BOTTOM |
R-PBGA-B54 |
1.95 V |
1 mm |
6 mm |
Not Qualified |
67108864 bit |
1.7 V |
SYNCHRONOUS BURST MODE POSSIBLE |
e0 |
.00012 Amp |
8 mm |
70 ns |
||||||||||||||||
|
Micron Technology |
PSEUDO STATIC RAM |
OTHER |
54 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
35 mA |
2097152 words |
COMMON |
1.8 |
1.8,2.5 |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA54,6X9,30 |
Other Memory ICs |
.75 mm |
85 Cel |
3-STATE |
2MX16 |
2M |
-25 Cel |
TIN LEAD SILVER |
BOTTOM |
R-PBGA-B54 |
1.95 V |
1 mm |
6 mm |
Not Qualified |
33554432 bit |
1.7 V |
e0 |
.00011 Amp |
8 mm |
85 ns |
|||||||||||||||||
|
Micron Technology |
STANDARD SRAM |
AUTOMOTIVE |
32 |
QCCN |
RECTANGULAR |
CERAMIC |
YES |
CMOS |
NO LEAD |
PARALLEL |
ASYNCHRONOUS |
120 mA |
131072 words |
COMMON |
5 |
5 |
8 |
CHIP CARRIER |
LCC32,.45X.55 |
SRAMs |
1.27 mm |
125 Cel |
3-STATE |
128KX8 |
128K |
4.5 V |
-40 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
R-XQCC-N32 |
Not Qualified |
1048576 bit |
e0 |
.007 Amp |
35 ns |
||||||||||||||||||||||
|
Micron Technology |
STANDARD SRAM |
AUTOMOTIVE |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
135 mA |
262144 words |
COMMON |
5 |
5 |
4 |
IN-LINE |
DIP28,.4 |
SRAMs |
2.54 mm |
125 Cel |
3-STATE |
256KX4 |
256K |
2 V |
-40 Cel |
TIN LEAD |
DUAL |
1 |
R-PDIP-T28 |
5.5 V |
4.32 mm |
10.16 mm |
Not Qualified |
1048576 bit |
4.5 V |
e0 |
YES |
.001 Amp |
35.05 mm |
25 ns |
||||||||||||||
|
Micron Technology |
STANDARD SRAM |
COMMERCIAL |
77 |
DIE |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
CMOS |
NO LEAD |
PARALLEL |
SYNCHRONOUS |
262144 words |
3.3 |
16 |
UNCASED CHIP |
70 Cel |
3-STATE |
256KX16 |
256K |
0 Cel |
UPPER |
1 |
R-XUUC-N77 |
3.6 V |
Not Qualified |
4194304 bit |
3.135 V |
YES |
9 ns |
|||||||||||||||||||||||||||
|
Micron Technology |
SRAM MODULE |
COMMERCIAL |
160 |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
CMOS |
NO LEAD |
PARALLEL |
SYNCHRONOUS |
65536 words |
3.3 |
72 |
MICROELECTRONIC ASSEMBLY |
70 Cel |
3-STATE |
64KX72 |
64K |
2 V |
0 Cel |
DUAL |
1 |
R-XDMA-N160 |
3.465 V |
Not Qualified |
4718592 bit |
3.135 V |
OPTIONAL INTERLEAVED OR LINEAR BURST; BYTE WRITE CONTROL; SELF TIMED WRITE CYCLE |
YES |
11 ns |
||||||||||||||||||||||||||
|
Micron Technology |
STANDARD SRAM |
COMMERCIAL |
52 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
CMOS |
J BEND |
PARALLEL |
SYNCHRONOUS |
250 mA |
65536 words |
COMMON |
3.3 |
3.3 |
18 |
CHIP CARRIER |
LDCC52,.8SQ |
SRAMs |
1.27 mm |
70 Cel |
3-STATE |
64KX18 |
64K |
2 V |
0 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
S-PQCC-J52 |
Not Qualified |
1179648 bit |
e0 |
9 ns |
|||||||||||||||||||||||
|
Micron Technology |
STANDARD SRAM |
INDUSTRIAL |
22 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
135 mA |
4096 words |
COMMON |
5 |
5 |
4 |
IN-LINE |
DIP22,.3 |
SRAMs |
2.54 mm |
85 Cel |
3-STATE |
4KX4 |
4K |
2 V |
-40 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-XDIP-T22 |
Not Qualified |
16384 bit |
e0 |
.00025 Amp |
15 ns |
||||||||||||||||||||||
|
Micron Technology |
STANDARD SRAM |
AUTOMOTIVE |
24 |
SOJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
175 mA |
16384 words |
SEPARATE |
5 |
5 |
1 |
SMALL OUTLINE |
SOJ24,.34 |
SRAMs |
1.27 mm |
125 Cel |
3-STATE |
16KX1 |
16K |
4.5 V |
-40 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDSO-J24 |
Not Qualified |
16384 bit |
e0 |
.005 Amp |
15 ns |
||||||||||||||||||||||
|
Micron Technology |
STANDARD SRAM |
COMMERCIAL |
24 |
SOJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
130 mA |
16384 words |
COMMON |
5 |
5 |
4 |
SMALL OUTLINE |
SOJ24,.34 |
SRAMs |
1.27 mm |
70 Cel |
3-STATE |
16KX4 |
16K |
4.5 V |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDSO-J24 |
Not Qualified |
65536 bit |
e0 |
.005 Amp |
25 ns |
||||||||||||||||||||||
|
Micron Technology |
STANDARD SRAM |
COMMERCIAL |
100 |
LQFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
375 mA |
32768 words |
COMMON |
3.3 |
3.3 |
32 |
FLATPACK, LOW PROFILE |
QFP100,.63X.87 |
SRAMs |
.65 mm |
70 Cel |
3-STATE |
32KX32 |
32K |
3.14 V |
0 Cel |
TIN LEAD |
QUAD |
1 |
R-PQFP-G100 |
3.6 V |
1.6 mm |
83 MHz |
14 mm |
Not Qualified |
1048576 bit |
3.135 V |
e0 |
YES |
.002 Amp |
20 mm |
6 ns |
|||||||||||||
|
Micron Technology |
STANDARD SRAM |
COMMERCIAL |
100 |
LQFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
235 mA |
65536 words |
COMMON |
3.3 |
3.3 |
18 |
FLATPACK, LOW PROFILE |
QFP100,.63X.87 |
SRAMs |
.65 mm |
70 Cel |
3-STATE |
64KX18 |
64K |
2 V |
0 Cel |
TIN LEAD |
QUAD |
1 |
R-PQFP-G100 |
3.6 V |
1.6 mm |
14 mm |
Not Qualified |
1179648 bit |
3.135 V |
OPTIONAL INTERLEAVED OR LINEAR BURST |
e0 |
YES |
20 mm |
8 ns |
||||||||||||||
|
Micron Technology |
ZBT SRAM |
COMMERCIAL |
100 |
LQFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
1048576 words |
2.5 |
32 |
FLATPACK, LOW PROFILE |
.65 mm |
70 Cel |
1MX32 |
1M |
0 Cel |
QUAD |
R-PQFP-G100 |
2.625 V |
1.6 mm |
14 mm |
Not Qualified |
33554432 bit |
2.375 V |
FLOW-THROUGH ARCHITECTURE |
20 mm |
8.5 ns |
|||||||||||||||||||||||||
|
Micron Technology |
STANDARD SRAM |
AUTOMOTIVE |
28 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
110 mA |
32768 words |
COMMON |
5 |
5 |
8 |
IN-LINE |
DIP28,.3 |
SRAMs |
2.54 mm |
125 Cel |
3-STATE |
32KX8 |
32K |
4.5 V |
-40 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-XDIP-T28 |
Not Qualified |
262144 bit |
e0 |
.008 Amp |
25 ns |
||||||||||||||||||||||
|
Micron Technology |
SRAM MODULE |
COMMERCIAL |
64 |
SIMM |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
CMOS |
NO LEAD |
PARALLEL |
ASYNCHRONOUS |
560 mA |
131072 words |
COMMON |
5 |
5 |
32 |
MICROELECTRONIC ASSEMBLY |
SSIM64 |
SRAMs |
1.27 mm |
70 Cel |
3-STATE |
128KX32 |
128K |
2 V |
0 Cel |
SINGLE |
1 |
R-XSMA-N64 |
5.5 V |
15.113 mm |
Not Qualified |
4194304 bit |
4.5 V |
YES |
.0006 Amp |
25 ns |
||||||||||||||||||
|
Micron Technology |
STANDARD SRAM |
MILITARY |
24 |
SOJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
4096 words |
5 |
4 |
SMALL OUTLINE |
1.27 mm |
125 Cel |
3-STATE |
4KX4 |
4K |
2 V |
-55 Cel |
TIN LEAD |
DUAL |
1 |
R-PDSO-J24 |
5.5 V |
3.61 mm |
7.67 mm |
Not Qualified |
16384 bit |
4.5 V |
e0 |
NO |
15.9 mm |
12 ns |
||||||||||||||||||||
|
Micron Technology |
STANDARD SRAM |
MILITARY |
28 |
SOJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
32768 words |
3.3 |
8 |
SMALL OUTLINE |
1.27 mm |
125 Cel |
32KX8 |
32K |
2 V |
-55 Cel |
TIN LEAD |
DUAL |
1 |
R-PDSO-J28 |
3.6 V |
3.66 mm |
7.67 mm |
Not Qualified |
262144 bit |
3 V |
e0 |
YES |
18.44 mm |
35 ns |
|||||||||||||||||||||
|
Micron Technology |
STANDARD SRAM |
COMMERCIAL |
100 |
LQFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
250 mA |
65536 words |
COMMON |
3.3 |
3.3 |
16 |
FLATPACK, LOW PROFILE |
QFP100,.63X.87 |
SRAMs |
.65 mm |
70 Cel |
3-STATE |
64KX16 |
64K |
3.14 V |
0 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
1 |
R-PQFP-G100 |
3.6 V |
1.6 mm |
14 mm |
Not Qualified |
1048576 bit |
3.135 V |
AUTOMATIC POWER-DOWN |
e0 |
YES |
.005 Amp |
20 mm |
8.5 ns |
|||||||||||||
|
Micron Technology |
STANDARD SRAM |
COMMERCIAL |
100 |
QFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
325 mA |
65536 words |
COMMON |
3.3 |
3.3 |
32 |
FLATPACK |
QFP100,.63X.87 |
SRAMs |
.635 mm |
70 Cel |
3-STATE |
64KX32 |
64K |
2 V |
0 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
R-PQFP-G100 |
66 MHz |
Not Qualified |
2097152 bit |
e0 |
7 ns |
||||||||||||||||||||||
|
Micron Technology |
STANDARD SRAM |
MILITARY |
22 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
CMOS |
38535Q/M;38534H;883B |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
90 mA |
16384 words |
COMMON |
5 |
5 |
4 |
IN-LINE |
DIP22,.3 |
SRAMs |
2.54 mm |
125 Cel |
3-STATE |
16KX4 |
16K |
2 V |
-55 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-XDIP-T22 |
Not Qualified |
65536 bit |
e0 |
.0003 Amp |
45 ns |
SRAM, or Static Random-Access Memory, is a type of volatile computer memory that stores data as a flip-flop, which retains the data as long as power is supplied to the system. SRAM is commonly used as cache memory and in other applications where high-speed access to data is required.
SRAM is a type of memory that is faster and more expensive than DRAM (Dynamic Random-Access Memory). It is commonly used as cache memory in computer systems and other digital devices to improve the speed of data access. SRAM is also used in applications where high-speed data processing is required, such as in networking equipment, video games, and other high-performance computing applications.
One of the advantages of using SRAM is that it provides faster access to data than other types of memory, such as DRAM. This is because SRAM does not need to be refreshed like DRAM, which makes it faster and more reliable. Additionally, SRAM uses less power than other types of memory, which makes it ideal for use in battery-powered devices.
One of the disadvantages of using SRAM is that it is more expensive and less dense than other types of memory, such as DRAM or flash memory. This means that it is not suitable for applications that require large amounts of memory at a low cost. Additionally, SRAM is volatile, which means that it cannot store data permanently.