Part | RoHS | Manufacturer | Memory IC Type | Temperature Grade | No. of Terminals | Package Code | Refresh Cycles | Package Shape | Total Dose (V) | Package Body Material | Surface Mount | No. of Functions | Technology | Screening Level | Nominal Negative Supply Voltage | Terminal Form | Parallel or Serial | Operating Mode | Maximum Supply Current | No. of Words | Self Refresh | Input/Output Type | Nominal Supply Voltage / Vsup (V) | Power Supplies (V) | Memory Width | Package Style (Meter) | Package Equivalence Code | Alternate Memory Width | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Reverse Pinout | Output Characteristics | Organization | No. of Words Code | Minimum Standby Voltage | Minimum Operating Temperature | Terminal Finish | Terminal Position | No. of Ports | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Maximum Clock Frequency (fCLK) | Width | Qualification | Memory Density | Minimum Supply Voltage (Vsup) | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Output Enable | Maximum Standby Current | Length | Maximum Access Time |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samsung |
ZBT SRAM |
INDUSTRIAL |
100 |
LQFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
524288 words |
2.5 |
32 |
FLATPACK, LOW PROFILE |
.65 mm |
85 Cel |
512KX32 |
512K |
-40 Cel |
QUAD |
R-PQFP-G100 |
2.625 V |
1.6 mm |
14 mm |
Not Qualified |
16777216 bit |
2.375 V |
PIPELINED ARCHITECTURE |
20 mm |
3.5 ns |
|||||||||||||||||||||||||
|
Samsung |
DDR SRAM |
INDUSTRIAL |
165 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
750 mA |
1048576 words |
COMMON |
1.8 |
1.5/1.8,1.8 |
36 |
GRID ARRAY, LOW PROFILE |
BGA165,11X15,40 |
SRAMs |
1 mm |
85 Cel |
3-STATE |
1MX36 |
1M |
1.7 V |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B165 |
2 |
1.9 V |
1.4 mm |
333 MHz |
15 mm |
Not Qualified |
37748736 bit |
1.7 V |
PIPELINED ARCHITECTURE |
e1 |
.3 Amp |
17 mm |
.45 ns |
||||||||||||
Samsung |
STANDARD SRAM |
COMMERCIAL |
32 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
25 mA |
524288 words |
COMMON |
3 |
3/3.3 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSSOP32,.56,20 |
SRAMs |
.5 mm |
70 Cel |
3-STATE |
512KX8 |
512K |
2 V |
0 Cel |
DUAL |
R-PDSO-G32 |
1 |
3.6 V |
1.2 mm |
8 mm |
Not Qualified |
4194304 bit |
2.7 V |
.00001 Amp |
11.8 mm |
70 ns |
|||||||||||||||||
|
Samsung |
STANDARD SRAM |
INDUSTRIAL |
165 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
4194304 words |
SEPARATE |
1.5/1.8,1.8 |
18 |
GRID ARRAY |
BGA165,11X15,40 |
SRAMs |
1 mm |
85 Cel |
3-STATE |
4MX18 |
4M |
1.7 V |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B165 |
166 MHz |
Not Qualified |
75497472 bit |
e1 |
.5 ns |
|||||||||||||||||||||||
Samsung |
STANDARD SRAM |
COMMERCIAL |
44 |
TSOP2 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
131072 words |
3.3 |
16 |
SMALL OUTLINE, THIN PROFILE |
.8 mm |
70 Cel |
128KX16 |
128K |
0 Cel |
DUAL |
R-PDSO-G44 |
3.6 V |
1.2 mm |
10.16 mm |
Not Qualified |
2097152 bit |
3 V |
18.41 mm |
85 ns |
||||||||||||||||||||||||||
Samsung |
STANDARD SRAM |
COMMERCIAL |
165 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
750 mA |
1048576 words |
COMMON |
1.5/1.8,1.8 |
36 |
GRID ARRAY |
BGA165,11X15,40 |
SRAMs |
1 mm |
70 Cel |
3-STATE |
1MX36 |
1M |
1.7 V |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B165 |
3 |
333 MHz |
Not Qualified |
37748736 bit |
e1 |
.3 Amp |
.45 ns |
|||||||||||||||||||||
Samsung |
STANDARD SRAM |
INDUSTRIAL |
28 |
SOJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
70 mA |
32768 words |
COMMON |
3.3 |
3.3 |
8 |
SMALL OUTLINE |
SOJ28,.34 |
SRAMs |
1.27 mm |
85 Cel |
3-STATE |
32KX8 |
32K |
3 V |
-40 Cel |
TIN LEAD |
DUAL |
R-PDSO-J28 |
3.6 V |
3.76 mm |
7.62 mm |
Not Qualified |
262144 bit |
3 V |
TTL COMPATIBLE I/O |
e0 |
.0005 Amp |
18.42 mm |
12 ns |
|||||||||||||||
Samsung |
STANDARD SRAM |
COMMERCIAL |
44 |
TSOP2 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
200 mA |
65536 words |
COMMON |
3.3 |
3.3 |
16 |
SMALL OUTLINE, THIN PROFILE |
TSOP44,.46,32 |
SRAMs |
.8 mm |
70 Cel |
3-STATE |
64KX16 |
64K |
3 V |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDSO-G44 |
3.6 V |
1.2 mm |
10.16 mm |
Not Qualified |
1048576 bit |
3 V |
e0 |
.005 Amp |
18.41 mm |
8 ns |
||||||||||||||||
Samsung |
STANDARD SRAM |
COMMERCIAL |
48 |
TFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
65536 words |
3.3 |
16 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
.75 mm |
70 Cel |
64KX16 |
64K |
0 Cel |
BOTTOM |
R-PBGA-B48 |
3.6 V |
1.2 mm |
6 mm |
Not Qualified |
1048576 bit |
3 V |
TTL COMPATIBLE INPUTS/OUTPUTS |
7 mm |
12 ns |
|||||||||||||||||||||||||
Samsung |
STANDARD SRAM |
INDUSTRIAL |
32 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
25 mA |
524288 words |
COMMON |
3/3.3 |
8 |
SMALL OUTLINE |
SOP32,.56 |
SRAMs |
1.27 mm |
85 Cel |
3-STATE |
512KX8 |
512K |
2 V |
-40 Cel |
DUAL |
R-PDSO-G32 |
1 |
Not Qualified |
4194304 bit |
.00001 Amp |
85 ns |
||||||||||||||||||||||||
Samsung |
STANDARD SRAM |
COMMERCIAL |
22 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
100 mA |
16384 words |
COMMON |
5 |
5 |
4 |
IN-LINE |
DIP22,.3 |
SRAMs |
2.54 mm |
70 Cel |
3-STATE |
16KX4 |
16K |
4.5 V |
0 Cel |
TIN LEAD |
DUAL |
1 |
R-PDIP-T22 |
5.5 V |
5.08 mm |
7.62 mm |
Not Qualified |
65536 bit |
4.5 V |
BATTERY BACKUP |
e0 |
NO |
.002 Amp |
26.745 mm |
45 ns |
|||||||||||||
Samsung |
STANDARD SRAM |
COMMERCIAL |
32 |
TSOP2 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
73 mA |
131072 words |
COMMON |
5 |
5 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSOP32,.46 |
SRAMs |
1.27 mm |
70 Cel |
3-STATE |
128KX8 |
128K |
4.5 V |
0 Cel |
TIN LEAD |
DUAL |
R-PDSO-G32 |
5.5 V |
1.2 mm |
10.16 mm |
Not Qualified |
1048576 bit |
4.5 V |
e0 |
.005 Amp |
20.95 mm |
15 ns |
||||||||||||||||
Samsung |
CACHE SRAM |
COMMERCIAL |
52 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
J BEND |
PARALLEL |
SYNCHRONOUS |
65536 words |
3.3 |
18 |
CHIP CARRIER |
1.27 mm |
70 Cel |
64KX18 |
64K |
0 Cel |
QUAD |
S-PQCC-J52 |
3.47 V |
4.57 mm |
19.1262 mm |
Not Qualified |
1179648 bit |
3.13 V |
19.1262 mm |
10 ns |
||||||||||||||||||||||||||
Samsung |
STANDARD SRAM |
INDUSTRIAL |
32 |
TSOP2 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
30 mA |
524288 words |
COMMON |
5 |
5 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSOP32,.46 |
SRAMs |
1.27 mm |
85 Cel |
3-STATE |
512KX8 |
512K |
2 V |
-40 Cel |
DUAL |
R-PDSO-G32 |
1 |
5.5 V |
1.2 mm |
10.16 mm |
Not Qualified |
4194304 bit |
4.5 V |
.000012 Amp |
20.95 mm |
55 ns |
|||||||||||||||||
Samsung |
STANDARD SRAM |
INDUSTRIAL |
32 |
SOJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
73 mA |
131072 words |
COMMON |
3.3 |
3.3 |
8 |
SMALL OUTLINE |
SOJ32,.44 |
SRAMs |
1.27 mm |
85 Cel |
3-STATE |
128KX8 |
128K |
2 V |
-40 Cel |
TIN LEAD |
DUAL |
R-PDSO-J32 |
3.6 V |
3.76 mm |
10.16 mm |
Not Qualified |
1048576 bit |
3 V |
e0 |
.0003 Amp |
20.96 mm |
15 ns |
||||||||||||||||
Samsung |
STANDARD SRAM |
COMMERCIAL |
48 |
FBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
65 mA |
65536 words |
COMMON |
3.3 |
3.3 |
16 |
GRID ARRAY, FINE PITCH |
BGA48,6X8,30 |
SRAMs |
.75 mm |
70 Cel |
3-STATE |
64KX16 |
64K |
2 V |
0 Cel |
Tin/Lead (Sn/Pb) |
BOTTOM |
R-PBGA-B48 |
Not Qualified |
1048576 bit |
e0 |
.001 Amp |
10 ns |
||||||||||||||||||||||
Samsung |
STANDARD SRAM |
INDUSTRIAL |
44 |
SOJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
240 mA |
262144 words |
COMMON |
3.3 |
3.3 |
16 |
SMALL OUTLINE |
SOJ44,.44 |
SRAMs |
1.27 mm |
85 Cel |
3-STATE |
256KX16 |
256K |
2 V |
-40 Cel |
TIN LEAD |
DUAL |
1 |
R-PDSO-J44 |
3.6 V |
3.76 mm |
10.16 mm |
Not Qualified |
4194304 bit |
3 V |
TTL COMPATIBLE INPUTS/OUTPUTS |
e0 |
YES |
.0007 Amp |
28.58 mm |
10 ns |
|||||||||||||
Samsung |
STANDARD SRAM |
COMMERCIAL |
119 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
262144 words |
3.3 |
36 |
GRID ARRAY |
1.27 mm |
70 Cel |
256KX36 |
256K |
0 Cel |
BOTTOM |
R-PBGA-B119 |
3.45 V |
14 mm |
Not Qualified |
9437184 bit |
3.15 V |
PIPELINED ARCHITECTURE |
22 mm |
2 ns |
||||||||||||||||||||||||||
Samsung |
CACHE SRAM |
COMMERCIAL |
119 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
330 mA |
524288 words |
COMMON |
3.3 |
2.5/3.3,3.3 |
18 |
GRID ARRAY |
BGA119,7X17,50 |
SRAMs |
1.27 mm |
70 Cel |
3-STATE |
512KX18 |
512K |
3.14 V |
0 Cel |
TIN LEAD |
BOTTOM |
R-PBGA-B119 |
3.465 V |
100 MHz |
14 mm |
Not Qualified |
9437184 bit |
3.135 V |
SELF-TIMED WRITE CYCLE; POWER DOWN OPTION |
e0 |
.03 Amp |
22 mm |
8.5 ns |
|||||||||||||||
|
Samsung |
STANDARD SRAM |
COMMERCIAL |
165 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
750 mA |
1048576 words |
COMMON |
1.5/1.8,1.8 |
36 |
GRID ARRAY |
BGA165,11X15,40 |
SRAMs |
1 mm |
70 Cel |
3-STATE |
1MX36 |
1M |
1.7 V |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B165 |
3 |
333 MHz |
Not Qualified |
37748736 bit |
e1 |
.3 Amp |
.45 ns |
||||||||||||||||||||
Samsung |
STANDARD SRAM |
COMMERCIAL |
44 |
SOJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
190 mA |
65536 words |
COMMON |
5 |
5 |
16 |
SMALL OUTLINE |
SOJ44,.44 |
SRAMs |
1.27 mm |
70 Cel |
3-STATE |
64KX16 |
64K |
4.5 V |
0 Cel |
DUAL |
R-PDSO-J44 |
Not Qualified |
1048576 bit |
.008 Amp |
12 ns |
||||||||||||||||||||||||
|
Samsung |
STANDARD SRAM |
COMMERCIAL |
100 |
QFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
450 mA |
524288 words |
COMMON |
2.5/3.3,3.3 |
36 |
FLATPACK |
QFP100,.63X.87 |
SRAMs |
.635 mm |
70 Cel |
3-STATE |
512KX36 |
512K |
3.14 V |
0 Cel |
QUAD |
R-PQFP-G100 |
185 MHz |
Not Qualified |
18874368 bit |
.03 Amp |
3.3 ns |
|||||||||||||||||||||||
Samsung |
STANDARD SRAM |
COMMERCIAL |
28 |
SOJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
150 mA |
65536 words |
COMMON |
5 |
5 |
4 |
SMALL OUTLINE |
SOJ28,.34 |
SRAMs |
1.27 mm |
70 Cel |
3-STATE |
64KX4 |
64K |
4.5 V |
0 Cel |
TIN LEAD |
DUAL |
1 |
R-PDSO-J28 |
5.5 V |
3.76 mm |
7.62 mm |
Not Qualified |
262144 bit |
4.5 V |
TTL COMPATIBLE INPUTS/OUTPUTS/3.3V GTL COMPATIBLE I/O |
e0 |
YES |
.002 Amp |
18.42 mm |
12 ns |
|||||||||||||
Samsung |
STANDARD SRAM |
COMMERCIAL |
153 |
HBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
370 mA |
262144 words |
COMMON |
3.3 |
2.5/3.3,3.3 |
36 |
GRID ARRAY, HEAT SINK/SLUG |
BGA119,7X17,50 |
SRAMs |
1.27 mm |
70 Cel |
3-STATE |
256KX36 |
256K |
3.14 V |
0 Cel |
TIN LEAD |
BOTTOM |
R-PBGA-B153 |
3.45 V |
2.2 mm |
250 MHz |
14 mm |
Not Qualified |
9437184 bit |
3.15 V |
SEATED HT-CALCULATED |
e0 |
.12 Amp |
22 mm |
2.3 ns |
||||||||||||||
Samsung |
STANDARD SRAM |
COMMERCIAL |
24 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
100 mA |
262144 words |
SEPARATE |
5 |
5 |
1 |
IN-LINE |
DIP24,.3 |
SRAMs |
2.54 mm |
70 Cel |
3-STATE |
256KX1 |
256K |
2 V |
0 Cel |
TIN LEAD |
DUAL |
R-PDIP-T24 |
3 |
Not Qualified |
262144 bit |
e0 |
.00005 Amp |
35 ns |
|||||||||||||||||||||
Samsung |
CACHE SRAM |
INDUSTRIAL |
165 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
1048576 words |
3.3 |
36 |
GRID ARRAY, LOW PROFILE |
1 mm |
85 Cel |
1MX36 |
1M |
-40 Cel |
BOTTOM |
R-PBGA-B165 |
3.465 V |
1.4 mm |
15 mm |
Not Qualified |
37748736 bit |
3.135 V |
PIPELINED ARCHITECTURE |
17 mm |
2.6 ns |
|||||||||||||||||||||||||
Samsung |
ZBT SRAM |
COMMERCIAL |
119 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
1048576 words |
COMMON |
2.5/3.3,3.3 |
18 |
GRID ARRAY |
BGA119,7X17,50 |
SRAMs |
1.27 mm |
70 Cel |
3-STATE |
1MX18 |
1M |
3.14 V |
0 Cel |
TIN LEAD |
BOTTOM |
R-PBGA-B119 |
3 |
250 MHz |
Not Qualified |
18874368 bit |
e0 |
.01 Amp |
2.6 ns |
||||||||||||||||||||||
Samsung |
ZBT SRAM |
COMMERCIAL |
119 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
320 mA |
524288 words |
COMMON |
2.5/3.3,3.3 |
36 |
GRID ARRAY |
BGA119,7X17,50 |
SRAMs |
1.27 mm |
70 Cel |
3-STATE |
512KX36 |
512K |
3.14 V |
0 Cel |
TIN LEAD |
BOTTOM |
R-PBGA-B119 |
3 |
100 MHz |
Not Qualified |
18874368 bit |
e0 |
.03 Amp |
8.5 ns |
|||||||||||||||||||||
Samsung |
STANDARD SRAM |
INDUSTRIAL |
32 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
30 mA |
131072 words |
COMMON |
3.3 |
3.3 |
8 |
SMALL OUTLINE |
SOP32,.56 |
SRAMs |
1.27 mm |
85 Cel |
3-STATE |
128KX8 |
128K |
2 V |
-40 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDSO-G32 |
3.6 V |
3 mm |
11.43 mm |
Not Qualified |
1048576 bit |
3 V |
e0 |
20.47 mm |
100 ns |
|||||||||||||||||
Samsung |
STANDARD SRAM |
INDUSTRIAL |
32 |
TSOP2-R |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
30 mA |
524288 words |
COMMON |
3.3 |
3.3 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSOP32,.46 |
SRAMs |
1.27 mm |
85 Cel |
YES |
3-STATE |
512KX8 |
512K |
2 V |
-40 Cel |
TIN LEAD |
DUAL |
R-PDSO-G32 |
3.6 V |
1.2 mm |
10.16 mm |
Not Qualified |
4194304 bit |
3 V |
e0 |
20.95 mm |
85 ns |
||||||||||||||||
Samsung |
STANDARD SRAM |
COMMERCIAL |
32 |
TSOP1-R |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
32768 words |
3 |
8 |
SMALL OUTLINE, THIN PROFILE |
.5 mm |
70 Cel |
32KX8 |
32K |
0 Cel |
DUAL |
R-PDSO-G32 |
5.5 V |
1.2 mm |
8 mm |
Not Qualified |
262144 bit |
2.7 V |
BATTERY BACKUP |
12.4 mm |
240 ns |
|||||||||||||||||||||||||
Samsung |
STANDARD SRAM |
COMMERCIAL |
100 |
QFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
375 mA |
131072 words |
COMMON |
2.5/3.3,3.3 |
32 |
FLATPACK |
QFP100,.63X.87 |
SRAMs |
.635 mm |
70 Cel |
3-STATE |
128KX32 |
128K |
3.14 V |
0 Cel |
TIN LEAD |
QUAD |
R-PQFP-G100 |
3 |
138 MHz |
Not Qualified |
4194304 bit |
e0 |
.03 Amp |
4 ns |
|||||||||||||||||||||
|
Samsung |
ZBT SRAM |
INDUSTRIAL |
100 |
QFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
300 mA |
1048576 words |
COMMON |
2.5,3.3 |
18 |
FLATPACK |
QFP100,.63X.87 |
SRAMs |
.635 mm |
85 Cel |
3-STATE |
1MX18 |
1M |
3.14 V |
-40 Cel |
MATTE TIN |
QUAD |
R-PQFP-G100 |
1 |
167 MHz |
Not Qualified |
18874368 bit |
e3 |
.13 Amp |
3.5 ns |
||||||||||||||||||||
Samsung |
CACHE SRAM |
INDUSTRIAL |
100 |
LQFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
440 mA |
131072 words |
COMMON |
3.3 |
2.5/3.3,3.3 |
32 |
FLATPACK, LOW PROFILE |
QFP100,.63X.87 |
SRAMs |
.65 mm |
85 Cel |
3-STATE |
128KX32 |
128K |
3.14 V |
-40 Cel |
TIN LEAD |
QUAD |
R-PQFP-G100 |
3.6 V |
1.6 mm |
275 MHz |
14 mm |
Not Qualified |
4194304 bit |
3.135 V |
PIPELINED ARCHITECTURE |
e0 |
.05 Amp |
20 mm |
2.2 ns |
||||||||||||||
|
Samsung |
QDR SRAM |
INDUSTRIAL |
165 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
850 mA |
1048576 words |
SEPARATE |
1.8 |
1.5,1.8 |
18 |
GRID ARRAY, LOW PROFILE |
BGA165,11X15,40 |
SRAMs |
1 mm |
85 Cel |
3-STATE |
1MX18 |
1M |
1.7 V |
-40 Cel |
BOTTOM |
R-PBGA-B165 |
1.9 V |
1.4 mm |
400 MHz |
15 mm |
Not Qualified |
18874368 bit |
1.7 V |
PIPELINED ARCHITECTURE |
NOT SPECIFIED |
NOT SPECIFIED |
.35 Amp |
17 mm |
.45 ns |
|||||||||||||
Samsung |
STANDARD SRAM |
COMMERCIAL |
153 |
HBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
360 mA |
524288 words |
COMMON |
3.3 |
2.5/3.3,3.3 |
18 |
GRID ARRAY, HEAT SINK/SLUG |
BGA119,7X17,50 |
SRAMs |
1.27 mm |
70 Cel |
3-STATE |
512KX18 |
512K |
3.15 V |
0 Cel |
TIN LEAD |
BOTTOM |
R-PBGA-B153 |
3.45 V |
2.2 mm |
166.66 MHz |
14 mm |
Not Qualified |
9437184 bit |
3.15 V |
SEATED HT-CALCULATED |
e0 |
.12 Amp |
22 mm |
3 ns |
||||||||||||||
Samsung |
ZBT SRAM |
COMMERCIAL |
100 |
LQFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
430 mA |
524288 words |
COMMON |
2.5 |
2.5 |
36 |
FLATPACK, LOW PROFILE |
QFP100,.63X.87 |
SRAMs |
.65 mm |
70 Cel |
3-STATE |
512KX36 |
512K |
2.38 V |
0 Cel |
TIN LEAD |
QUAD |
R-PQFP-G100 |
2.625 V |
1.6 mm |
225 MHz |
14 mm |
Not Qualified |
18874368 bit |
2.375 V |
PIPELINED ARCHITECTURE |
e0 |
.06 Amp |
20 mm |
2.8 ns |
||||||||||||||
|
Samsung |
STANDARD SRAM |
INDUSTRIAL |
32 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
30 mA |
524288 words |
COMMON |
5 |
5 |
8 |
SMALL OUTLINE |
SOP32,.56 |
SRAMs |
1.27 mm |
85 Cel |
3-STATE |
512KX8 |
512K |
2 V |
-40 Cel |
DUAL |
R-PDSO-G32 |
3 |
5.5 V |
3 mm |
11.43 mm |
Not Qualified |
4194304 bit |
4.5 V |
260 |
.000012 Amp |
20.47 mm |
55 ns |
|||||||||||||||
Samsung |
STANDARD SRAM |
INDUSTRIAL |
32 |
TSOP2 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
73 mA |
131072 words |
COMMON |
5 |
5 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSOP32,.46 |
SRAMs |
1.27 mm |
85 Cel |
3-STATE |
128KX8 |
128K |
4.5 V |
-40 Cel |
TIN LEAD |
DUAL |
R-PDSO-G32 |
5.5 V |
1.2 mm |
10.16 mm |
Not Qualified |
1048576 bit |
4.5 V |
e0 |
.005 Amp |
20.95 mm |
15 ns |
||||||||||||||||
Samsung |
STANDARD SRAM |
COMMERCIAL |
44 |
TSOP2 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
262144 words |
5 |
16 |
SMALL OUTLINE, THIN PROFILE |
.8 mm |
70 Cel |
3-STATE |
256KX16 |
256K |
2 V |
0 Cel |
DUAL |
1 |
R-PDSO-G44 |
5.5 V |
1.2 mm |
10.16 mm |
Not Qualified |
4194304 bit |
4.5 V |
YES |
18.41 mm |
85 ns |
||||||||||||||||||||||
Samsung |
STANDARD SRAM |
COMMERCIAL |
28 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
70 mA |
32768 words |
COMMON |
5 |
5 |
8 |
SMALL OUTLINE |
SOP28,.5 |
SRAMs |
1.27 mm |
70 Cel |
3-STATE |
32KX8 |
32K |
2 V |
0 Cel |
TIN LEAD |
DUAL |
1 |
R-PDSO-G28 |
5.5 V |
3 mm |
8.38 mm |
Not Qualified |
262144 bit |
4.5 V |
e0 |
YES |
.00001 Amp |
18.29 mm |
100 ns |
||||||||||||||
Samsung |
ZBT SRAM |
COMMERCIAL |
100 |
LQFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
4194304 words |
1.8 |
18 |
FLATPACK, LOW PROFILE |
.65 mm |
70 Cel |
4MX18 |
4M |
0 Cel |
TIN LEAD |
QUAD |
R-PQFP-G100 |
1.95 V |
1.6 mm |
14 mm |
Not Qualified |
75497472 bit |
1.7 V |
PIPELINED ARCHITECTURE |
e0 |
20 mm |
3.5 ns |
|||||||||||||||||||||||
|
Samsung |
STANDARD SRAM |
AUTOMOTIVE |
32 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
25 mA |
131072 words |
COMMON |
5 |
5 |
8 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP32,.8,20 |
SRAMs |
.5 mm |
125 Cel |
3-STATE |
128KX8 |
128K |
2 V |
-40 Cel |
DUAL |
R-PDSO-G32 |
Not Qualified |
1048576 bit |
.000025 Amp |
70 ns |
|||||||||||||||||||||||
Samsung |
STANDARD SRAM |
COMMERCIAL |
24 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
120 mA |
16384 words |
COMMON |
5 |
5 |
4 |
IN-LINE |
DIP24,.3 |
SRAMs |
2.54 mm |
70 Cel |
3-STATE |
16KX4 |
16K |
4.5 V |
0 Cel |
TIN LEAD |
DUAL |
1 |
R-PDIP-T24 |
5.5 V |
5.08 mm |
7.62 mm |
Not Qualified |
65536 bit |
4.5 V |
BATTERY BACKUP |
e0 |
YES |
.002 Amp |
31.625 mm |
35 ns |
|||||||||||||
|
Samsung |
STANDARD SRAM |
COMMERCIAL |
100 |
QFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
350 mA |
262144 words |
COMMON |
2.5 |
2.5 |
18 |
FLATPACK |
QFP100,.63X.87 |
SRAMs |
.635 mm |
70 Cel |
3-STATE |
256KX18 |
256K |
2.37 V |
0 Cel |
QUAD |
R-PQFP-G100 |
166 MHz |
Not Qualified |
4718592 bit |
.04 Amp |
3.5 ns |
||||||||||||||||||||||
Samsung |
STANDARD SRAM |
COMMERCIAL |
24 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
130 mA |
16384 words |
COMMON |
5 |
5 |
4 |
IN-LINE |
DIP24,.3 |
SRAMs |
2.54 mm |
70 Cel |
3-STATE |
16KX4 |
16K |
2 V |
0 Cel |
TIN LEAD |
DUAL |
1 |
R-PDIP-T24 |
5.5 V |
5.08 mm |
7.62 mm |
Not Qualified |
65536 bit |
4.5 V |
e0 |
YES |
.00005 Amp |
31.625 mm |
15 ns |
||||||||||||||
|
Samsung |
DDR SRAM |
COMMERCIAL |
165 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
650 mA |
2097152 words |
SEPARATE |
1.8 |
1.5/1.8,1.8 |
18 |
GRID ARRAY, LOW PROFILE |
BGA165,11X15,40 |
SRAMs |
1 mm |
70 Cel |
3-STATE |
2MX18 |
2M |
1.7 V |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B165 |
2 |
1.9 V |
1.4 mm |
300 MHz |
15 mm |
Not Qualified |
37748736 bit |
1.7 V |
PIPELINED ARCHITECTURE |
e1 |
.28 Amp |
17 mm |
.45 ns |
||||||||||||
|
Samsung |
ZBT SRAM |
INDUSTRIAL |
100 |
QFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
2097152 words |
COMMON |
2.5 |
2.5 |
36 |
FLATPACK |
QFP100,.63X.87 |
SRAMs |
.635 mm |
85 Cel |
3-STATE |
2MX36 |
2M |
2.38 V |
-40 Cel |
TIN SILVER COPPER |
QUAD |
R-PQFP-G100 |
250 MHz |
Not Qualified |
75497472 bit |
e1 |
2.6 ns |
SRAM, or Static Random-Access Memory, is a type of volatile computer memory that stores data as a flip-flop, which retains the data as long as power is supplied to the system. SRAM is commonly used as cache memory and in other applications where high-speed access to data is required.
SRAM is a type of memory that is faster and more expensive than DRAM (Dynamic Random-Access Memory). It is commonly used as cache memory in computer systems and other digital devices to improve the speed of data access. SRAM is also used in applications where high-speed data processing is required, such as in networking equipment, video games, and other high-performance computing applications.
One of the advantages of using SRAM is that it provides faster access to data than other types of memory, such as DRAM. This is because SRAM does not need to be refreshed like DRAM, which makes it faster and more reliable. Additionally, SRAM uses less power than other types of memory, which makes it ideal for use in battery-powered devices.
One of the disadvantages of using SRAM is that it is more expensive and less dense than other types of memory, such as DRAM or flash memory. This means that it is not suitable for applications that require large amounts of memory at a low cost. Additionally, SRAM is volatile, which means that it cannot store data permanently.