Part | RoHS | Manufacturer | Memory IC Type | Temperature Grade | No. of Terminals | Package Code | Refresh Cycles | Package Shape | Total Dose (V) | Package Body Material | Surface Mount | No. of Functions | Technology | Screening Level | Nominal Negative Supply Voltage | Terminal Form | Parallel or Serial | Operating Mode | Maximum Supply Current | No. of Words | Self Refresh | Input/Output Type | Nominal Supply Voltage / Vsup (V) | Power Supplies (V) | Memory Width | Package Style (Meter) | Package Equivalence Code | Alternate Memory Width | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Reverse Pinout | Output Characteristics | Organization | No. of Words Code | Minimum Standby Voltage | Minimum Operating Temperature | Terminal Finish | Terminal Position | No. of Ports | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Maximum Clock Frequency (fCLK) | Width | Qualification | Memory Density | Minimum Supply Voltage (Vsup) | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Output Enable | Maximum Standby Current | Length | Maximum Access Time |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samsung |
STANDARD SRAM |
INDUSTRIAL |
48 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
30 mA |
1048576 words |
COMMON |
3 |
3/3.3 |
16 |
SMALL OUTLINE, THIN PROFILE |
TSSOP48,.8,20 |
SRAMs |
.5 mm |
85 Cel |
3-STATE |
1MX16 |
1M |
1.5 V |
-40 Cel |
TIN LEAD |
DUAL |
R-PDSO-G48 |
3.6 V |
1.2 mm |
12 mm |
Not Qualified |
16777216 bit |
2.7 V |
IT ALSO OPERATES AT 3.3V NOMINAL SUPPPLY |
e0 |
18.4 mm |
55 ns |
||||||||||||||||
Samsung |
CACHE SRAM |
COMMERCIAL |
100 |
LQFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
131072 words |
3.3 |
36 |
FLATPACK, LOW PROFILE |
.65 mm |
70 Cel |
128KX36 |
128K |
0 Cel |
QUAD |
R-PQFP-G100 |
3.465 V |
1.6 mm |
14 mm |
Not Qualified |
4718592 bit |
3.135 V |
20 mm |
3.1 ns |
||||||||||||||||||||||||||
Samsung |
STANDARD SRAM |
INDUSTRIAL |
44 |
TSOP2-R |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
45 mA |
262144 words |
COMMON |
3 |
3 |
16 |
SMALL OUTLINE, THIN PROFILE |
TSOP44,.46,32 |
SRAMs |
.8 mm |
85 Cel |
YES |
3-STATE |
256KX16 |
256K |
2 V |
-40 Cel |
DUAL |
R-PDSO-G44 |
3.3 V |
1.2 mm |
10.16 mm |
Not Qualified |
4194304 bit |
2.7 V |
30 |
240 |
18.41 mm |
85 ns |
||||||||||||||||
Samsung |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Samsung |
STANDARD SRAM |
COMMERCIAL |
48 |
TFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
105 mA |
65536 words |
COMMON |
5 |
5 |
16 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
BGA48,6X8,30 |
SRAMs |
.75 mm |
70 Cel |
3-STATE |
64KX16 |
64K |
4.5 V |
0 Cel |
TIN LEAD |
BOTTOM |
R-PBGA-B48 |
5.5 V |
1.2 mm |
6 mm |
Not Qualified |
1048576 bit |
4.5 V |
e0 |
.005 Amp |
7 mm |
10 ns |
||||||||||||||||
Samsung |
ZBT SRAM |
COMMERCIAL |
165 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
524288 words |
3.3 |
36 |
GRID ARRAY, LOW PROFILE |
1 mm |
70 Cel |
512KX36 |
512K |
0 Cel |
BOTTOM |
R-PBGA-B165 |
3.465 V |
1.4 mm |
13 mm |
Not Qualified |
18874368 bit |
3.135 V |
FLOW-THROUGH ARCHITECTURE |
15 mm |
6.5 ns |
|||||||||||||||||||||||||
Samsung |
CACHE SRAM |
COMMERCIAL |
100 |
LQFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
430 mA |
524288 words |
COMMON |
3.3 |
2.5/3.3,3.3 |
36 |
FLATPACK, LOW PROFILE |
QFP100,.63X.87 |
SRAMs |
.65 mm |
70 Cel |
3-STATE |
512KX36 |
512K |
3.14 V |
0 Cel |
TIN LEAD |
QUAD |
R-PQFP-G100 |
3.465 V |
1.6 mm |
225 MHz |
14 mm |
Not Qualified |
18874368 bit |
3.135 V |
PIPELINED ARCHITECTURE |
e0 |
.06 Amp |
20 mm |
2.8 ns |
||||||||||||||
Samsung |
STANDARD SRAM |
153 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
550 mA |
131072 words |
COMMON |
1.5,2.5 |
36 |
GRID ARRAY |
BGA153,9X17,50 |
SRAMs |
1.27 mm |
3-STATE |
128KX36 |
128K |
2.4 V |
BOTTOM |
R-PBGA-B153 |
167 MHz |
Not Qualified |
4194304 bit |
.05 Amp |
3.3 ns |
|||||||||||||||||||||||||||
|
Samsung |
DDR SRAM |
COMMERCIAL |
165 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
600 mA |
2097152 words |
SEPARATE |
1.8 |
1.5/1.8,1.8 |
18 |
GRID ARRAY, LOW PROFILE |
BGA165,11X15,40 |
SRAMs |
1 mm |
70 Cel |
3-STATE |
2MX18 |
2M |
1.7 V |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B165 |
2 |
1.9 V |
1.4 mm |
250 MHz |
15 mm |
Not Qualified |
37748736 bit |
1.7 V |
PIPELINED ARCHITECTURE |
e1 |
.25 Amp |
17 mm |
.45 ns |
||||||||||||
Samsung |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Samsung |
STANDARD SRAM |
COMMERCIAL |
28 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
70 mA |
8192 words |
COMMON |
5 |
5 |
8 |
SMALL OUTLINE |
SOP28,.45 |
SRAMs |
1.27 mm |
70 Cel |
3-STATE |
8KX8 |
8K |
2 V |
0 Cel |
TIN LEAD |
DUAL |
1 |
R-PDSO-G28 |
5.5 V |
3 mm |
8.38 mm |
Not Qualified |
65536 bit |
4.5 V |
e0 |
YES |
.00005 Amp |
18.29 mm |
70 ns |
||||||||||||||
Samsung |
ZBT SRAM |
COMMERCIAL |
119 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
262144 words |
3.3 |
36 |
GRID ARRAY |
1.27 mm |
70 Cel |
256KX36 |
256K |
0 Cel |
BOTTOM |
R-PBGA-B119 |
3.465 V |
14 mm |
Not Qualified |
9437184 bit |
3.135 V |
22 mm |
4.2 ns |
|||||||||||||||||||||||||||
Samsung |
QDR SRAM |
COMMERCIAL |
165 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
1048576 words |
SEPARATE |
1.8 |
1.5/1.8,1.8 |
36 |
GRID ARRAY, LOW PROFILE |
BGA165,11X15,40 |
SRAMs |
1 mm |
70 Cel |
3-STATE |
1MX36 |
1M |
1.7 V |
0 Cel |
TIN LEAD |
BOTTOM |
R-PBGA-B165 |
1.9 V |
1.4 mm |
200 MHz |
15 mm |
Not Qualified |
37748736 bit |
1.7 V |
e0 |
17 mm |
2.2 ns |
|||||||||||||||||
|
Samsung |
STANDARD SRAM |
COMMERCIAL |
165 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
4194304 words |
SEPARATE |
1.5/1.8,1.8 |
18 |
GRID ARRAY |
BGA165,11X15,40 |
SRAMs |
1 mm |
70 Cel |
3-STATE |
4MX18 |
4M |
1.7 V |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B165 |
3 |
250 MHz |
Not Qualified |
75497472 bit |
e1 |
.45 ns |
||||||||||||||||||||||
|
Samsung |
ZBT SRAM |
COMMERCIAL |
100 |
LQFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
360 mA |
2097152 words |
COMMON |
2.5 |
2.5,3.3 |
18 |
FLATPACK, LOW PROFILE |
QFP100,.63X.87 |
SRAMs |
.65 mm |
70 Cel |
3-STATE |
2MX18 |
2M |
2.38 V |
0 Cel |
TIN BISMUTH |
QUAD |
R-PQFP-G100 |
3 |
2.625 V |
1.6 mm |
166 MHz |
14 mm |
Not Qualified |
37748736 bit |
2.375 V |
PIPELINED ARCHITECTURE, IT CAN ALSO OPERATES AT 3.3V. |
e6 |
260 |
.1 Amp |
20 mm |
3.5 ns |
|||||||||||
Samsung |
ZBT SRAM |
INDUSTRIAL |
100 |
LQFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
131072 words |
3.3 |
36 |
FLATPACK, LOW PROFILE |
.65 mm |
85 Cel |
128KX36 |
128K |
-40 Cel |
QUAD |
R-PQFP-G100 |
3.465 V |
1.6 mm |
14 mm |
Not Qualified |
4718592 bit |
3.135 V |
FLOW-THROUGH ARCHITECTURE |
20 mm |
8 ns |
|||||||||||||||||||||||||
Samsung |
SRAM MODULE |
COMMERCIAL |
144 |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
CMOS |
NO LEAD |
PARALLEL |
SYNCHRONOUS |
1048576 words |
3.3 |
64 |
MICROELECTRONIC ASSEMBLY |
70 Cel |
1MX64 |
1M |
0 Cel |
DUAL |
R-XDMA-N144 |
3.6 V |
Not Qualified |
67108864 bit |
3 V |
6 ns |
|||||||||||||||||||||||||||||||
Samsung |
STANDARD SRAM |
AUTOMOTIVE |
32 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
25 mA |
131072 words |
COMMON |
5 |
5 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSSOP32,.8,20 |
SRAMs |
.5 mm |
125 Cel |
3-STATE |
128KX8 |
128K |
2 V |
-40 Cel |
TIN LEAD |
DUAL |
R-PDSO-G32 |
5.5 V |
1.2 mm |
8 mm |
Not Qualified |
1048576 bit |
4.5 V |
e0 |
18.4 mm |
55 ns |
|||||||||||||||||
Samsung |
DDR SRAM |
COMMERCIAL |
165 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
600 mA |
2097152 words |
COMMON |
1.8 |
1.5/1.8,1.8 |
18 |
GRID ARRAY, LOW PROFILE |
BGA165,11X15,40 |
SRAMs |
1 mm |
70 Cel |
3-STATE |
2MX18 |
2M |
1.7 V |
0 Cel |
TIN LEAD |
BOTTOM |
R-PBGA-B165 |
1.9 V |
1.4 mm |
250 MHz |
15 mm |
Not Qualified |
37748736 bit |
1.7 V |
PIPELINED ARCHITECTURE |
e0 |
.25 Amp |
17 mm |
.45 ns |
||||||||||||||
Samsung |
STANDARD SRAM |
INDUSTRIAL |
48 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
131072 words |
3.3 |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.75 mm |
85 Cel |
128KX16 |
128K |
-40 Cel |
BOTTOM |
R-PBGA-B48 |
3.6 V |
.94 mm |
6 mm |
Not Qualified |
2097152 bit |
3 V |
8 mm |
70 ns |
||||||||||||||||||||||||||
Samsung |
STANDARD SRAM |
INDUSTRIAL |
44 |
TSOP2-R |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
40 mA |
524288 words |
COMMON |
3 |
3 |
16 |
SMALL OUTLINE, THIN PROFILE |
TSOP44,.46,32 |
SRAMs |
.8 mm |
85 Cel |
YES |
3-STATE |
512KX16 |
512K |
1.5 V |
-40 Cel |
DUAL |
R-PDSO-G44 |
3.3 V |
1.2 mm |
10.16 mm |
Not Qualified |
8388608 bit |
2.7 V |
30 |
240 |
.000006 Amp |
18.41 mm |
55 ns |
|||||||||||||||
Samsung |
STANDARD SRAM |
COMMERCIAL |
28 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
60 mA |
32768 words |
COMMON |
5 |
5 |
8 |
SMALL OUTLINE |
SOP28,.45 |
SRAMs |
1.27 mm |
70 Cel |
3-STATE |
32KX8 |
32K |
2 V |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDSO-G28 |
Not Qualified |
262144 bit |
e0 |
55 ns |
|||||||||||||||||||||||
Samsung |
STANDARD SRAM |
INDUSTRIAL |
32 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
40 mA |
65536 words |
COMMON |
3.3 |
3.3 |
8 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP32,.56,20 |
SRAMs |
.5 mm |
85 Cel |
3-STATE |
64KX8 |
64K |
2 V |
-40 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDSO-G32 |
Not Qualified |
524288 bit |
e0 |
85 ns |
|||||||||||||||||||||||
Samsung |
STANDARD SRAM |
COMMERCIAL |
48 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
65536 words |
5 |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.75 mm |
70 Cel |
64KX16 |
64K |
0 Cel |
BOTTOM |
R-PBGA-B48 |
5.5 V |
1 mm |
6 mm |
Not Qualified |
1048576 bit |
4.5 V |
NOT SPECIFIED |
NOT SPECIFIED |
7 mm |
10 ns |
||||||||||||||||||||||||
Samsung |
DDR SRAM |
COMMERCIAL |
165 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
450 mA |
524288 words |
COMMON |
1.8 |
1.5/1.8,1.8 |
36 |
GRID ARRAY, LOW PROFILE |
BGA165,11X15,40 |
SRAMs |
1 mm |
70 Cel |
3-STATE |
512KX36 |
512K |
1.7 V |
0 Cel |
TIN LEAD |
BOTTOM |
R-PBGA-B165 |
1.9 V |
1.4 mm |
200 MHz |
13 mm |
Not Qualified |
18874368 bit |
1.7 V |
PIPELINED ARCHITECTURE |
e0 |
.16 Amp |
15 mm |
.45 ns |
||||||||||||||
Samsung |
CACHE SRAM |
INDUSTRIAL |
100 |
LQFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
262144 words |
3.3 |
32 |
FLATPACK, LOW PROFILE |
.65 mm |
85 Cel |
256KX32 |
256K |
-40 Cel |
QUAD |
R-PQFP-G100 |
3.465 V |
1.6 mm |
14 mm |
Not Qualified |
8388608 bit |
3.135 V |
PIPELINED ARCHITECTURE |
20 mm |
3.8 ns |
|||||||||||||||||||||||||
Samsung |
STANDARD SRAM |
COMMERCIAL |
44 |
SOJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
65536 words |
5 |
16 |
SMALL OUTLINE |
1.27 mm |
70 Cel |
64KX16 |
64K |
0 Cel |
DUAL |
R-PDSO-J44 |
5.5 V |
3.76 mm |
10.16 mm |
Not Qualified |
1048576 bit |
4.5 V |
28.58 mm |
8 ns |
||||||||||||||||||||||||||
Samsung |
ZBT SRAM |
COMMERCIAL |
165 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
350 mA |
1048576 words |
COMMON |
2.5 |
2.5 |
18 |
GRID ARRAY, LOW PROFILE |
BGA165,11X15,40 |
SRAMs |
1 mm |
70 Cel |
3-STATE |
1MX18 |
1M |
2.38 V |
0 Cel |
TIN LEAD |
BOTTOM |
R-PBGA-B165 |
2.625 V |
1.4 mm |
167 MHz |
13 mm |
Not Qualified |
18874368 bit |
2.375 V |
PIPELINED ARCHITECTURE |
e0 |
.06 Amp |
15 mm |
3.5 ns |
||||||||||||||
Samsung |
STANDARD SRAM |
INDUSTRIAL |
32 |
SOJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
160 mA |
131072 words |
COMMON |
3.3 |
3.3 |
8 |
SMALL OUTLINE |
SOJ32,.44 |
SRAMs |
1.27 mm |
85 Cel |
3-STATE |
128KX8 |
128K |
2 V |
-40 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDSO-J32 |
Not Qualified |
1048576 bit |
e0 |
.0004 Amp |
8 ns |
||||||||||||||||||||||
Samsung |
STANDARD SRAM |
COMMERCIAL |
48 |
FBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
105 mA |
65536 words |
COMMON |
5 |
5 |
16 |
GRID ARRAY, FINE PITCH |
BGA48,6X8,30 |
SRAMs |
.75 mm |
70 Cel |
3-STATE |
64KX16 |
64K |
2 V |
0 Cel |
Tin/Lead (Sn/Pb) |
BOTTOM |
R-PBGA-B48 |
Not Qualified |
1048576 bit |
e0 |
.0003 Amp |
10 ns |
||||||||||||||||||||||
Samsung |
STANDARD SRAM |
INDUSTRIAL |
44 |
TSOP2-R |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
524288 words |
3 |
16 |
SMALL OUTLINE, THIN PROFILE |
.8 mm |
85 Cel |
512KX16 |
512K |
-40 Cel |
DUAL |
R-PDSO-G44 |
3.3 V |
1.2 mm |
10.16 mm |
Not Qualified |
8388608 bit |
2.7 V |
18.41 mm |
70 ns |
||||||||||||||||||||||||||
Samsung |
STANDARD SRAM |
COMMERCIAL |
32 |
TSOP2 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
131072 words |
3.3 |
8 |
SMALL OUTLINE, THIN PROFILE |
1.27 mm |
70 Cel |
128KX8 |
128K |
0 Cel |
DUAL |
R-PDSO-G32 |
3.6 V |
1.2 mm |
10.16 mm |
Not Qualified |
1048576 bit |
3 V |
20.95 mm |
20 ns |
||||||||||||||||||||||||||
Samsung |
STANDARD SRAM |
INDUSTRIAL |
32 |
SOJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
131072 words |
5 |
8 |
SMALL OUTLINE |
1.27 mm |
85 Cel |
128KX8 |
128K |
-40 Cel |
DUAL |
R-PDSO-J32 |
5.5 V |
3.76 mm |
10.16 mm |
Not Qualified |
1048576 bit |
4.5 V |
20.95 mm |
10 ns |
||||||||||||||||||||||||||
|
Samsung |
QDR SRAM |
COMMERCIAL |
165 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
300 mA |
1048576 words |
SEPARATE |
1.8 |
1.5/1.8,1.8 |
18 |
GRID ARRAY, LOW PROFILE |
BGA165,11X15,40 |
SRAMs |
1 mm |
70 Cel |
3-STATE |
1MX18 |
1M |
1.7 V |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B165 |
2 |
1.9 V |
1.4 mm |
166 MHz |
13 mm |
Not Qualified |
18874368 bit |
1.7 V |
PIPELINED ARCHITECTURE |
e1 |
.17 Amp |
15 mm |
.5 ns |
||||||||||||
Samsung |
STANDARD SRAM |
COMMERCIAL |
28 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
35 mA |
32768 words |
COMMON |
3 |
3 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSSOP28,.53,22 |
SRAMs |
.55 mm |
70 Cel |
3-STATE |
32KX8 |
32K |
2 V |
0 Cel |
TIN LEAD |
DUAL |
R-PDSO-G28 |
3.3 V |
1.2 mm |
8 mm |
Not Qualified |
262144 bit |
2.7 V |
e0 |
11.8 mm |
70 ns |
|||||||||||||||||
Samsung |
CACHE SRAM |
COMMERCIAL |
100 |
LQFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
230 mA |
262144 words |
COMMON |
3.3 |
2.5/3.3,3.3 |
18 |
FLATPACK, LOW PROFILE |
QFP100,.63X.87 |
SRAMs |
.65 mm |
70 Cel |
3-STATE |
256KX18 |
256K |
3.14 V |
0 Cel |
QUAD |
R-PQFP-G100 |
1 |
3.6 V |
1.6 mm |
117 MHz |
14 mm |
Not Qualified |
4718592 bit |
3.135 V |
FLOW-THROUGH ARCHITECTURE |
.05 Amp |
20 mm |
7.5 ns |
|||||||||||||||
Samsung |
STANDARD SRAM |
COMMERCIAL |
32 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
40 mA |
65536 words |
COMMON |
3.3 |
3.3 |
8 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP32,.8,20 |
SRAMs |
.5 mm |
70 Cel |
3-STATE |
64KX8 |
64K |
2 V |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDSO-G32 |
Not Qualified |
524288 bit |
e0 |
70 ns |
|||||||||||||||||||||||
Samsung |
QDR SRAM |
165 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
BALL |
GRID ARRAY |
BOTTOM |
R-PBGA-B165 |
3 |
Not Qualified |
240 |
|||||||||||||||||||||||||||||||||||||||||||||
Samsung |
ZBT SRAM |
COMMERCIAL |
100 |
LQFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
131072 words |
3.3 |
32 |
FLATPACK, LOW PROFILE |
.65 mm |
70 Cel |
128KX32 |
128K |
0 Cel |
QUAD |
R-PQFP-G100 |
3.465 V |
1.6 mm |
14 mm |
Not Qualified |
4194304 bit |
3.135 V |
FLOW-THROUGH ARCHITECTURE |
20 mm |
8 ns |
|||||||||||||||||||||||||
|
Samsung |
STANDARD SRAM |
AUTOMOTIVE |
32 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
25 mA |
524288 words |
COMMON |
3/3.3 |
8 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP32,.56,20 |
SRAMs |
.5 mm |
125 Cel |
3-STATE |
512KX8 |
512K |
2 V |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-G32 |
1 |
Not Qualified |
4194304 bit |
e3 |
.00003 Amp |
70 ns |
|||||||||||||||||||||
Samsung |
STANDARD SRAM |
COMMERCIAL |
165 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
2097152 words |
SEPARATE |
1.5/1.8,1.8 |
36 |
GRID ARRAY |
BGA165,11X15,40 |
SRAMs |
1 mm |
70 Cel |
3-STATE |
2MX36 |
2M |
1.7 V |
0 Cel |
TIN LEAD |
BOTTOM |
R-PBGA-B165 |
3 |
166 MHz |
Not Qualified |
75497472 bit |
e0 |
.5 ns |
|||||||||||||||||||||||
Samsung |
STANDARD SRAM |
COMMERCIAL |
153 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
600 mA |
2097152 words |
COMMON |
1.8/2.5 |
18 |
GRID ARRAY |
BGA153,9X17,50 |
SRAMs |
1.27 mm |
70 Cel |
3-STATE |
2MX18 |
2M |
1.7 V |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B153 |
3 |
375 MHz |
Not Qualified |
37748736 bit |
e1 |
.3 Amp |
||||||||||||||||||||||
Samsung |
NON-VOLATILE SRAM |
COMMERCIAL |
68 |
UNSPECIFIED |
UNSPECIFIED |
NO |
1 |
MOS |
UNSPECIFIED |
PARALLEL |
ASYNCHRONOUS |
2097152 words |
5 |
8 |
MICROELECTRONIC ASSEMBLY |
16 |
55 Cel |
3-STATE |
2MX8 |
2M |
0 Cel |
UNSPECIFIED |
1 |
X-XXMA-X68 |
5.25 V |
Not Qualified |
16777216 bit |
4.75 V |
YES |
200 ns |
|||||||||||||||||||||||||||
Samsung |
STANDARD SRAM |
INDUSTRIAL |
48 |
TFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
524288 words |
2 |
16 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
.75 mm |
85 Cel |
512KX16 |
512K |
-40 Cel |
BOTTOM |
R-PBGA-B48 |
2.2 V |
1.2 mm |
8 mm |
Not Qualified |
8388608 bit |
1.65 V |
IT CAN ALSO OPERATES AT 1.8 V |
12 mm |
70 ns |
|||||||||||||||||||||||||
Samsung |
QDR SRAM |
COMMERCIAL |
165 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
1048576 words |
1.8 |
36 |
GRID ARRAY, LOW PROFILE |
1 mm |
70 Cel |
1MX36 |
1M |
0 Cel |
BOTTOM |
R-PBGA-B165 |
1.9 V |
1.4 mm |
15 mm |
Not Qualified |
37748736 bit |
1.7 V |
PIPELINED ARCHITECTURE |
17 mm |
.45 ns |
|||||||||||||||||||||||||
Samsung |
STANDARD SRAM |
INDUSTRIAL |
100 |
QFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
290 mA |
131072 words |
COMMON |
2.5/3.3,3.3 |
32 |
FLATPACK |
QFP100,.63X.87 |
SRAMs |
.635 mm |
85 Cel |
3-STATE |
128KX32 |
128K |
3.14 V |
-40 Cel |
QUAD |
R-PQFP-G100 |
1 |
167 MHz |
Not Qualified |
4194304 bit |
.05 Amp |
3.5 ns |
|||||||||||||||||||||||
Samsung |
STANDARD SRAM |
INDUSTRIAL |
32 |
SOJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
130 mA |
262144 words |
COMMON |
3.3 |
3.3 |
4 |
SMALL OUTLINE |
SOJ32,.44 |
SRAMs |
1.27 mm |
85 Cel |
3-STATE |
256KX4 |
256K |
2 V |
-40 Cel |
TIN LEAD |
DUAL |
R-PDSO-J32 |
3 |
Not Qualified |
1048576 bit |
e0 |
.0003 Amp |
12 ns |
|||||||||||||||||||||
Samsung |
STANDARD SRAM |
153 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
700 mA |
131072 words |
COMMON |
1.5,2.5 |
36 |
GRID ARRAY |
BGA153,9X17,50 |
SRAMs |
1.27 mm |
3-STATE |
128KX36 |
128K |
2.4 V |
BOTTOM |
R-PBGA-B153 |
250 MHz |
Not Qualified |
4194304 bit |
.05 Amp |
2.2 ns |
SRAM, or Static Random-Access Memory, is a type of volatile computer memory that stores data as a flip-flop, which retains the data as long as power is supplied to the system. SRAM is commonly used as cache memory and in other applications where high-speed access to data is required.
SRAM is a type of memory that is faster and more expensive than DRAM (Dynamic Random-Access Memory). It is commonly used as cache memory in computer systems and other digital devices to improve the speed of data access. SRAM is also used in applications where high-speed data processing is required, such as in networking equipment, video games, and other high-performance computing applications.
One of the advantages of using SRAM is that it provides faster access to data than other types of memory, such as DRAM. This is because SRAM does not need to be refreshed like DRAM, which makes it faster and more reliable. Additionally, SRAM uses less power than other types of memory, which makes it ideal for use in battery-powered devices.
One of the disadvantages of using SRAM is that it is more expensive and less dense than other types of memory, such as DRAM or flash memory. This means that it is not suitable for applications that require large amounts of memory at a low cost. Additionally, SRAM is volatile, which means that it cannot store data permanently.