INDUSTRIAL Microprocessors 1,818

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	On Chip Data RAM Width	Screening Level	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Nominal Supply Voltage	No. of DMA Channels	Sub-Category	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	Low Power Mode	JESD-609 Code
SCF5235F4CVM150	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V			24	32		GRID ARRAY, LOW PROFILE		1.4 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	17 mm	LOW POWER MODE TAKEN FROM LOW POWER MODE	YES	32	75 MHz	40	260	17 mm	CMOS	1.5 V			1 mm	FIXED POINT	S-PBGA-B256	3		150 rpm	YES	e1
BSC9131CJN1HHKB	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	520	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V			16	32		GRID ARRAY, FINE PITCH		.97 V	105 Cel	-40 Cel		BOTTOM	1.97 mm	21 mm		YES	32				21 mm	CMOS	1 V			.8 mm	FIXED POINT	S-PBGA-B520			800 rpm	YES
PS32V234CMN0AVUB	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	621	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V				64		GRID ARRAY, FINE PITCH		.95 V	105 Cel	-40 Cel		BOTTOM	2.44 mm	17 mm		YES					17 mm	CMOS	1 V			.65 mm	FLOATING POINT	S-PBGA-B621			1000 rpm	YES
PCM500ZUTA0A	NXP Semiconductors		INDUSTRIAL	BALL	324	BGA	SQUARE	PLASTIC/EPOXY		YES						1.8	GRID ARRAY	BGA324,30X30,40		85 Cel	-40 Cel		BOTTOM										CMOS	1.8 V		Microprocessors	1 mm		S-PBGA-B324		Not Qualified
P5021NXE1VNC	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	1295	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V			16			GRID ARRAY		1.05 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	3.53 mm	37.5 mm		YES	64				37.5 mm	CMOS	1.1 V			1 mm	FIXED POINT	S-PBGA-B1295			2000 rpm	YES	e1
P5021PXE1VNB	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	1295	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V			16			GRID ARRAY		1.05 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	3.53 mm	37.5 mm		YES	64				37.5 mm	CMOS	1.1 V			1 mm	FIXED POINT	S-PBGA-B1295			2000 rpm	YES	e1
XPC8245TZU333B	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL		BGA	RECTANGULAR	PLASTIC/EPOXY	NO	YES	2.1 V						GRID ARRAY		1.9 V	105 Cel	-40 Cel		BOTTOM				NO						CMOS	2 V				FIXED POINT	R-PBGA-B			333 rpm	NO
BSC9131NXE1KHKB	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	520	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V			16	32		GRID ARRAY, FINE PITCH		.97 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.97 mm	21 mm		YES	32		30	245	21 mm	CMOS	1 V			.8 mm	FIXED POINT	S-PBGA-B520	3		1000 rpm	YES	e1
BSC9131CXE1KHKB	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	520	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V			16	32		GRID ARRAY, FINE PITCH		.97 V	105 Cel	-40 Cel		BOTTOM	1.97 mm	21 mm		YES	32				21 mm	CMOS	1 V			.8 mm	FIXED POINT	S-PBGA-B520			1000 rpm	YES
BSC9131NJN1KHHB	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	520	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V			16	32		GRID ARRAY, FINE PITCH		.97 V	105 Cel	-40 Cel		BOTTOM	1.97 mm	21 mm		YES	32				21 mm	CMOS	1 V			.8 mm	FIXED POINT	S-PBGA-B520			1000 rpm	YES
SVF521R3K1CMK4	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	364	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.6 V			16			GRID ARRAY, LOW PROFILE, FINE PITCH		3 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.5 mm	17 mm		YES	16		40	260	17 mm	CMOS	3.3 V			.8 mm	FLOATING POINT	S-PBGA-B364	3		400 rpm	YES	e1
P5021NXE72QC	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	1295	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.23 V			16			GRID ARRAY		1.17 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	3.53 mm	37.5 mm		YES	64		30	245	37.5 mm	CMOS	1.2 V			1 mm	FIXED POINT	S-PBGA-B1295	3		2200 rpm	YES	e1
SCF5250VM120	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	196	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V			25	32		GRID ARRAY, LOW PROFILE		1.08 V	85 Cel	-40 Cel	TIN SILVER COPPER OVER NICKEL	BOTTOM	1.6 mm	15 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	33.86 MHz	40	260	15 mm	CMOS	1.2 V			1 mm	FIXED POINT	S-PBGA-B196	3		120 rpm	YES
P5021NXN72QB	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	1295	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.23 V			16			GRID ARRAY		1.17 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	3.53 mm	37.5 mm		YES	64				37.5 mm	CMOS	1.2 V			1 mm	FIXED POINT	S-PBGA-B1295			2200 rpm	YES	e1
SC103335VR400B	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	272	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.58 V		AEC-Q100	32	32	1.5,3.3	GRID ARRAY	BGA272,20X20,50	1.42 V	85 Cel	-40 Cel	TIN SILVER	BOTTOM	2.65 mm	27 mm		YES	32	66 MHz			27 mm	CMOS	1.5 V		Microprocessors	1.27 mm	FLOATING POINT	S-PBGA-B272	3	Not Qualified	400 rpm	YES	e2
P5021PXE72QB	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	1295	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.23 V			16			GRID ARRAY		1.17 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	3.53 mm	37.5 mm		YES	64				37.5 mm	CMOS	1.2 V			1 mm	FIXED POINT	S-PBGA-B1295			2200 rpm	YES	e1
XPC850DECZT50BU	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.465 V			26	32		GRID ARRAY		3.135 V	95 Cel	-40 Cel		BOTTOM	2.35 mm	23 mm		YES	32				23 mm	CMOS	3.3 V			1.27 mm	FIXED POINT	S-PBGA-B256			50 rpm	YES
BSC9131CXE1HHKB	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	520	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V			16	32		GRID ARRAY, FINE PITCH		.97 V	105 Cel	-40 Cel		BOTTOM	1.97 mm	21 mm		YES	32				21 mm	CMOS	1 V			.8 mm	FIXED POINT	S-PBGA-B520			800 rpm	YES
P5021PXN1VNB	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	1295	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V			16			GRID ARRAY		1.05 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	3.53 mm	37.5 mm		YES	64				37.5 mm	CMOS	1.1 V			1 mm	FIXED POINT	S-PBGA-B1295			2000 rpm	YES	e1
P5021NXN1VNC	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	1295	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V			16			GRID ARRAY		1.05 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	3.53 mm	37.5 mm		YES	64				37.5 mm	CMOS	1.1 V			1 mm	FIXED POINT	S-PBGA-B1295			2000 rpm	YES	e1
BSC9132NXN7KNKB	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V			16	32		GRID ARRAY, FINE PITCH		.97 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.53 mm	23 mm		YES	32		30	245	23 mm	CMOS	1 V			.8 mm	FIXED POINT	S-PBGA-B780	3		1000 rpm	YES	e1
BSC9131CXN1HHHB	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	520	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V			16	32		GRID ARRAY, FINE PITCH		.97 V	105 Cel	-40 Cel		BOTTOM	1.97 mm	21 mm		YES	32				21 mm	CMOS	1 V			.8 mm	FIXED POINT	S-PBGA-B520			800 rpm	YES
P5021PXN7VNC	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	1295	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V			16			GRID ARRAY		1.05 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	3.53 mm	37.5 mm		YES	64				37.5 mm	CMOS	1.1 V			1 mm	FIXED POINT	S-PBGA-B1295			2000 rpm	YES	e1
935321128557	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	620	BGA	SQUARE	PLASTIC	YES	YES	1.89 V				32		GRID ARRAY	BGA620,28X28,40	1.71 V	105 Cel	0 Cel	TIN SILVER	BOTTOM	2.46 mm	29 mm	ALSO REQUIRES 2.5 AND 3.3V SUPPLY	YES		66 MHz	40	260	29 mm	CMOS	1.8 V	4		1 mm	FLOATING POINT	S-PBGA-B620	3		400 rpm	YES	e2
P5021PXE7VNC	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	1295	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V			16			GRID ARRAY		1.05 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	3.53 mm	37.5 mm		YES	64				37.5 mm	CMOS	1.1 V			1 mm	FIXED POINT	S-PBGA-B1295			2000 rpm	YES	e1
SVF312R3K2CKU2	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	GULL WING	176	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V			0			FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH		1.16 V	85 Cel	-40 Cel	TIN	QUAD	1.6 mm	24 mm		YES	0		40	260	24 mm	CMOS	1.23 V			.5 mm	FLOATING POINT	S-PQFP-G176	3		266 rpm	YES	e3
P5021PXE12QB	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	1295	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.23 V			16			GRID ARRAY		1.17 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	3.53 mm	37.5 mm		YES	64				37.5 mm	CMOS	1.2 V			1 mm	FIXED POINT	S-PBGA-B1295			2200 rpm	YES	e1
BSC9131CXN1KHKB	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	520	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V			16	32		GRID ARRAY, FINE PITCH		.97 V	105 Cel	-40 Cel		BOTTOM	1.97 mm	21 mm		YES	32				21 mm	CMOS	1 V			.8 mm	FIXED POINT	S-PBGA-B520			1000 rpm	YES
BSC9131NXN1KHHB	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	520	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V			16	32		GRID ARRAY, FINE PITCH		.97 V	105 Cel	-40 Cel		BOTTOM	1.97 mm	21 mm		YES	32				21 mm	CMOS	1 V			.8 mm	FIXED POINT	S-PBGA-B520			1000 rpm	YES
P5021NXN7TMC	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	1295	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V			16			GRID ARRAY		1.05 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	3.53 mm	37.5 mm		YES	64		30	245	37.5 mm	CMOS	1.1 V			1 mm	FIXED POINT	S-PBGA-B1295	3		1800 rpm	YES	e1
BSC9131NXN1HHHB	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	520	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V			16	32		GRID ARRAY, FINE PITCH		.97 V	105 Cel	-40 Cel		BOTTOM	1.97 mm	21 mm		YES	32				21 mm	CMOS	1 V			.8 mm	FIXED POINT	S-PBGA-B520			800 rpm	YES
P5021PXE1TMB	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	1295	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V			16			GRID ARRAY		1.05 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	3.53 mm	37.5 mm		YES	64				37.5 mm	CMOS	1.1 V			1 mm	FIXED POINT	S-PBGA-B1295			1800 rpm	YES	e1
P5021NXN1VNB	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	1295	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V			16			GRID ARRAY		1.05 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	3.53 mm	37.5 mm		YES	64				37.5 mm	CMOS	1.1 V			1 mm	FIXED POINT	S-PBGA-B1295			2000 rpm	YES	e1
SVF332R3K1CKU2	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	GULL WING	176	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	YES	3.6 V			0			FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH		3 V	85 Cel	-40 Cel	TIN	QUAD	1.6 mm	24 mm		YES	0		40	260	24 mm	CMOS	3.3 V			.5 mm	FLOATING POINT	S-PQFP-G176	3		266 rpm	YES	e3
P5021PXE7TMC	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	1295	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V			16			GRID ARRAY		1.05 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	3.53 mm	37.5 mm		YES	64				37.5 mm	CMOS	1.1 V			1 mm	FIXED POINT	S-PBGA-B1295			1800 rpm	YES	e1
P2020NSE2MHC,557	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.1 V			32			GRID ARRAY		1 V	85 Cel	-40 Cel		BOTTOM	2.46 mm	31 mm		YES	16	100 MHz			31 mm	CMOS	1.05 V			1 mm	FLOATING POINT	S-PBGA-B689			1200 rpm	YES
XPC8245TZU300B	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	352	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V	32		32	32		GRID ARRAY	BGA352,26X26,50	1.7 V	105 Cel	-40 Cel		BOTTOM	1.65 mm	35 mm	ALSO OPERATES AT 2V SUPPLY	YES	32				35 mm	CMOS	1.8 V			1.27 mm	FLOATING POINT	S-PBGA-B352			300 rpm	YES
BSC9131NJE1HHKB	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	520	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V			16	32		GRID ARRAY, FINE PITCH		.97 V	105 Cel	-40 Cel		BOTTOM	1.97 mm	21 mm		YES	32				21 mm	CMOS	1 V			.8 mm	FIXED POINT	S-PBGA-B520			800 rpm	YES
SVF522R3K1CMK4R	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	364	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.6 V			16			GRID ARRAY, LOW PROFILE, FINE PITCH		3 V	85 Cel	-40 Cel		BOTTOM	1.5 mm	17 mm		YES	16				17 mm	CMOS	3.3 V			.8 mm	FLOATING POINT	S-PBGA-B364			400 rpm	YES
SVF311R3K1CKU2	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	GULL WING	176	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	YES	3.6 V			0			FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH		3 V	85 Cel	-40 Cel	TIN	QUAD	1.6 mm	24 mm		YES	0		40	260	24 mm	CMOS	3.3 V			.5 mm	FLOATING POINT	S-PQFP-G176	3		266 rpm	YES	e3
P5021PXN7TMC	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	1295	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V			16			GRID ARRAY		1.05 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	3.53 mm	37.5 mm		YES	64				37.5 mm	CMOS	1.1 V			1 mm	FIXED POINT	S-PBGA-B1295			1800 rpm	YES	e1
P5021NXN72QC	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	1295	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.23 V			16			GRID ARRAY		1.17 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	3.53 mm	37.5 mm		YES	64		30	245	37.5 mm	CMOS	1.2 V			1 mm	FIXED POINT	S-PBGA-B1295	3		2200 rpm	YES	e1
BSC9131CJN1KHHB	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	520	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V			16	32		GRID ARRAY, FINE PITCH		.97 V	105 Cel	-40 Cel		BOTTOM	1.97 mm	21 mm		YES	32				21 mm	CMOS	1 V			.8 mm	FIXED POINT	S-PBGA-B520			1000 rpm	YES
P5021PXE72QC	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	1295	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.23 V			16			GRID ARRAY		1.17 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	3.53 mm	37.5 mm		YES	64				37.5 mm	CMOS	1.2 V			1 mm	FIXED POINT	S-PBGA-B1295			2200 rpm	YES	e1
BSC9131NXN1KHKB	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	520	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V			16	32		GRID ARRAY, FINE PITCH		.97 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.97 mm	21 mm		YES	32		30	245	21 mm	CMOS	1 V			.8 mm	FIXED POINT	S-PBGA-B520	3		1000 rpm	YES	e1
P5021PXE7VNB	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	1295	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V			16			GRID ARRAY		1.05 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	3.53 mm	37.5 mm		YES	64				37.5 mm	CMOS	1.1 V			1 mm	FIXED POINT	S-PBGA-B1295			2000 rpm	YES	e1
BSC9131NXE1HHHB	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	520	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V			16	32		GRID ARRAY, FINE PITCH		.97 V	105 Cel	-40 Cel		BOTTOM	1.97 mm	21 mm		YES	32				21 mm	CMOS	1 V			.8 mm	FIXED POINT	S-PBGA-B520			800 rpm	YES
P5021PXE12QC	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	1295	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.23 V			16			GRID ARRAY		1.17 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	3.53 mm	37.5 mm		YES	64				37.5 mm	CMOS	1.2 V			1 mm	FIXED POINT	S-PBGA-B1295			2200 rpm	YES	e1

Microprocessors

A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.

Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.

Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.

One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.