INDUSTRIAL Microprocessors 1,818

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	On Chip Data RAM Width	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	No. of External Interrupts	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	RAM Words	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Maximum Supply Current	Nominal Supply Voltage	No. of DMA Channels	No. of Serial I/Os	Sub-Category	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	Low Power Mode	JESD-609 Code
ST40RA166XH6	STMicroelectronics	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	372	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.95 V		32	32	1.8,3.3	GRID ARRAY	BGA372,20X20,50	1.65 V	85 Cel		-40 Cel	TIN LEAD	BOTTOM	2.6 mm		27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	27 MHz			27 mm	CMOS		1.8 V			Microprocessors	1.27 mm	FLOATING POINT	S-PBGA-B372		Not Qualified	166 rpm	YES	e0
EF6809PV	STMicroelectronics	MICROPROCESSOR, RISC	INDUSTRIAL	THROUGH-HOLE	40	DIP	RECTANGULAR	PLASTIC/EPOXY		NO				8	5	IN-LINE	DIP40,.6		85 Cel		-40 Cel	Tin/Lead (Sn/Pb)	DUAL											MOS		5 V			Microprocessors	2.54 mm		R-PDIP-T40		Not Qualified	1 rpm		e0
Z8004AB6	STMicroelectronics	MICROPROCESSOR	INDUSTRIAL	THROUGH-HOLE	40	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	NO	5.25 V		16	16		IN-LINE		4.75 V	85 Cel		-40 Cel		DUAL	4.445 mm		15.24 mm		NO	16	6.06 MHz				CMOS		5 V				2.54 mm	FIXED POINT	R-PDIP-T40		Not Qualified	6 rpm	NO
Z8002AB6	STMicroelectronics	MICROPROCESSOR	INDUSTRIAL	THROUGH-HOLE	40	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	NO	5.25 V	0	16	16		IN-LINE		4.75 V	85 Cel	3	-40 Cel		DUAL	4.445 mm	0	15.24 mm		NO	16	6 MHz				MOS	300 mA	5 V	0	0		2.54 mm	FIXED POINT	R-PDIP-T40		Not Qualified	6 rpm	YES
TS68008VFN8	STMicroelectronics	MICROPROCESSOR	INDUSTRIAL	J BEND	52	QCCJ	SQUARE	PLASTIC/EPOXY	NO	YES	5.25 V	0	22	16	5	CHIP CARRIER	LDCC52,.8SQ	4.75 V	85 Cel	7	-40 Cel	TIN LEAD	QUAD	5.08 mm	0	19.1262 mm		NO	8	8 MHz			19.1262 mm	NMOS		5 V	0	0	Microprocessors	1.27 mm	FIXED POINT	S-PQCC-J52		Not Qualified	8 rpm	NO	e0
Z8400HD6	STMicroelectronics	MICROPROCESSOR	INDUSTRIAL	THROUGH-HOLE	40	DIP	RECTANGULAR	CERAMIC, METAL-SEALED COFIRED	NO	NO	5.25 V	0	16	8	5	IN-LINE	DIP40,.6	4.75 V	85 Cel	2	-40 Cel	TIN LEAD	DUAL	3.6 mm	0	15.24 mm	DRAM REFRESH CONTROLLER	NO	8	8 MHz				NMOS	200 mA	5 V	0	0	Microprocessors	2.54 mm	FIXED POINT	R-CDIP-T40		Not Qualified	8 rpm	NO	e0
Z8002BB6	STMicroelectronics	MICROPROCESSOR	INDUSTRIAL	THROUGH-HOLE	40	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	NO	5.25 V	0	16	16		IN-LINE		4.75 V	85 Cel	3	-40 Cel		DUAL	4.445 mm	0	15.24 mm		NO	16	10 MHz				MOS	300 mA	5 V	0	0		2.54 mm	FIXED POINT	R-PDIP-T40		Not Qualified	10 rpm	YES
STM32MP157DAC3T	STMicroelectronics	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	361	TFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.25 V	8	26	32		GRID ARRAY, THIN PROFILE, FINE PITCH		.85 V	125 Cel		-40 Cel		BOTTOM	1.2 mm	724992	12 mm		YES	0	64 MHz			12 mm	CMOS	1000 mA	.9 V	48			.65 mm	FLOATING POINT	S-PBGA-B361			800 rpm	YES
STM32MP157DAB1T	STMicroelectronics	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	354	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.25 V	8	16	32		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA354,19X19,32	.85 V	105 Cel		-20 Cel		BOTTOM	1.29 mm	724992	16 mm		YES	16	64 MHz			16 mm	CMOS	865 mA	.9 V	48			.8 mm	FLOATING POINT	S-PBGA-B354			800 rpm	YES
STM32MP157DAD1T	STMicroelectronics	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	257	TFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.25 V	8	16	32		GRID ARRAY, THIN PROFILE, FINE PITCH		.85 V	105 Cel		-20 Cel		BOTTOM	1.2 mm	724992	10 mm		YES	16	64 MHz			10 mm	CMOS	865 mA	.9 V	48			.65 mm	FLOATING POINT	S-PBGA-B257			800 rpm	YES
STM32MP157DAA3T	STMicroelectronics	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	448	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.25 V	8	26	32		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA448,22X22,32	.85 V	125 Cel		-40 Cel		BOTTOM	1.32 mm	724992	18 mm		YES	0	64 MHz			18 mm	CMOS	1000 mA	.9 V	48			.8 mm	FLOATING POINT	S-PBGA-B448			800 rpm	YES
STM32MP157DAD3T	STMicroelectronics	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	257	TFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.25 V	8	16	32		GRID ARRAY, THIN PROFILE, FINE PITCH		.85 V	125 Cel		-40 Cel		BOTTOM	1.2 mm	724992	10 mm		YES	16	64 MHz			10 mm	CMOS	1000 mA	.9 V	48			.65 mm	FLOATING POINT	S-PBGA-B257			800 rpm	YES
STM32MP157DAD3	STMicroelectronics	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	257	TFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.25 V	8	16	32		GRID ARRAY, THIN PROFILE, FINE PITCH		.85 V	125 Cel		-40 Cel		BOTTOM	1.2 mm	724992	10 mm		YES	16	64 MHz			10 mm	CMOS	1000 mA	.9 V	48			.65 mm	FLOATING POINT	S-PBGA-B257			800 rpm	YES
STM32MP157AAB1T	STMicroelectronics	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	354	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.25 V	8	16	32		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA354,19X19,32	.85 V	105 Cel		-20 Cel		BOTTOM	1.29 mm	724992	16 mm		YES	16	64 MHz			16 mm	CMOS	865 mA	.9 V	48			.8 mm	FLOATING POINT	S-PBGA-B354			650 rpm	YES
STM32MP157DAA3	STMicroelectronics	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	448	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.25 V	8	26	32		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA448,22X22,32	.85 V	125 Cel		-40 Cel		BOTTOM	1.32 mm	724992	18 mm		YES	0	64 MHz			18 mm	CMOS	1000 mA	.9 V	48			.8 mm	FLOATING POINT	S-PBGA-B448			800 rpm	YES
STM32MP157AAA1	STMicroelectronics	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	448	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.25 V	8	26	32		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA448,22X22,32	.85 V	105 Cel		-20 Cel		BOTTOM	1.32 mm	724992	18 mm		YES	0	64 MHz			18 mm	CMOS	865 mA	.9 V	48			.8 mm	FLOATING POINT	S-PBGA-B448			650 rpm	YES
STM32MP157DAC1T	STMicroelectronics	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	361	TFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.25 V	8	26	32		GRID ARRAY, THIN PROFILE, FINE PITCH		.85 V	105 Cel		-20 Cel		BOTTOM	1.2 mm	724992	12 mm		YES	0	64 MHz			12 mm	CMOS	865 mA	.9 V	48			.65 mm	FLOATING POINT	S-PBGA-B361			800 rpm	YES
STM32MP157AAC1T	STMicroelectronics	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	361	TFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.25 V	8	26	32		GRID ARRAY, THIN PROFILE, FINE PITCH		.85 V	105 Cel		-20 Cel		BOTTOM	1.2 mm	724992	12 mm		YES	0	64 MHz			12 mm	CMOS	865 mA	.9 V	48			.65 mm	FLOATING POINT	S-PBGA-B361			650 rpm	YES
STM32MP157DAB3T	STMicroelectronics	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	354	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.25 V	8	16	32		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA354,19X19,32	.85 V	125 Cel		-40 Cel		BOTTOM	1.29 mm	724992	16 mm		YES	16	64 MHz			16 mm	CMOS	1000 mA	.9 V	48			.8 mm	FLOATING POINT	S-PBGA-B354			800 rpm	YES
STM32MP157DAC3	STMicroelectronics	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	361	TFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.25 V	8	26	32		GRID ARRAY, THIN PROFILE, FINE PITCH		.85 V	125 Cel		-40 Cel		BOTTOM	1.2 mm	724992	12 mm		YES	0	64 MHz			12 mm	CMOS	1000 mA	.9 V	48			.65 mm	FLOATING POINT	S-PBGA-B361			800 rpm	YES
STM32MP157AAA1T	STMicroelectronics	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	448	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.25 V	8	26	32		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA448,22X22,32	.85 V	105 Cel		-20 Cel		BOTTOM	1.32 mm	724992	18 mm		YES	0	64 MHz			18 mm	CMOS	865 mA	.9 V	48			.8 mm	FLOATING POINT	S-PBGA-B448			650 rpm	YES
STM32MP157AAC1	STMicroelectronics	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	361	TFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.25 V	8	26	32		GRID ARRAY, THIN PROFILE, FINE PITCH		.85 V	105 Cel		-20 Cel		BOTTOM	1.2 mm	724992	12 mm		YES	0	64 MHz			12 mm	CMOS	865 mA	.9 V	48			.65 mm	FLOATING POINT	S-PBGA-B361			650 rpm	YES
STM32MP157AAD1	STMicroelectronics	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	257	TFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.25 V	8	16	32		GRID ARRAY, THIN PROFILE, FINE PITCH		.85 V	105 Cel		-20 Cel		BOTTOM	1.2 mm	724992	10 mm		YES	16	64 MHz			10 mm	CMOS	865 mA	.9 V	48			.65 mm	FLOATING POINT	S-PBGA-B257			650 rpm	YES
STM32MP157DAB3	STMicroelectronics	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	354	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.25 V	8	16	32		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA354,19X19,32	.85 V	125 Cel		-40 Cel		BOTTOM	1.29 mm	724992	16 mm		YES	16	64 MHz			16 mm	CMOS	1000 mA	.9 V	48			.8 mm	FLOATING POINT	S-PBGA-B354			800 rpm	YES
STM32MP157AAD1T	STMicroelectronics	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	257	TFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.25 V	8	16	32		GRID ARRAY, THIN PROFILE, FINE PITCH		.85 V	105 Cel		-20 Cel		BOTTOM	1.2 mm	724992	10 mm		YES	16	64 MHz			10 mm	CMOS	865 mA	.9 V	48			.65 mm	FLOATING POINT	S-PBGA-B257			650 rpm	YES
STM32MP157AAB1	STMicroelectronics	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	354	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.25 V	8	16	32		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA354,19X19,32	.85 V	105 Cel		-20 Cel		BOTTOM	1.29 mm	724992	16 mm		YES	16	64 MHz			16 mm	CMOS	865 mA	.9 V	48			.8 mm	FLOATING POINT	S-PBGA-B354			650 rpm	YES
STM32MP157DAA1T	STMicroelectronics	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	448	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.25 V	8	26	32		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA448,22X22,32	.85 V	105 Cel		-20 Cel		BOTTOM	1.32 mm	724992	18 mm		YES	0	64 MHz			18 mm	CMOS	865 mA	.9 V	48			.8 mm	FLOATING POINT	S-PBGA-B448			800 rpm	YES
Z84C00AC6	STMicroelectronics	MICROPROCESSOR	INDUSTRIAL	J BEND	44	QCCJ	SQUARE	PLASTIC/EPOXY	NO	YES	5.5 V	0	16	8	5	CHIP CARRIER	LDCC44,.7SQ	4.5 V	85 Cel	2	-40 Cel	TIN LEAD	QUAD	4.57 mm	0	16.5862 mm	DRAM REFRESH CONTROLLER	NO	8	4 MHz			16.5862 mm	CMOS	15 mA	5 V	0	0	Microprocessors	1.27 mm	FIXED POINT	S-PQCC-J44		Not Qualified	4 rpm	YES	e0
P5021NXE7VNB	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	1295	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V		16			GRID ARRAY		1.05 V	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	3.53 mm		37.5 mm		YES	64				37.5 mm	CMOS		1.1 V				1 mm	FIXED POINT	S-PBGA-B1295			2000 rpm	YES	e1
BSC9131CXN1KHHB	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	520	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		16	32		GRID ARRAY, FINE PITCH		.97 V	105 Cel		-40 Cel		BOTTOM	1.97 mm		21 mm		YES	32				21 mm	CMOS		1 V				.8 mm	FIXED POINT	S-PBGA-B520			1000 rpm	YES
P5021NXE1VNB	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	1295	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V		16			GRID ARRAY		1.05 V	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	3.53 mm		37.5 mm		YES	64				37.5 mm	CMOS		1.1 V				1 mm	FIXED POINT	S-PBGA-B1295			2000 rpm	YES	e1
XPC850CZT50BU	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.465 V		26	32		GRID ARRAY		3.135 V	95 Cel		-40 Cel		BOTTOM	2.35 mm		23 mm		YES	32				23 mm	CMOS		3.3 V				1.27 mm	FIXED POINT	S-PBGA-B256			50 rpm	YES
SCP2207VMU	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	236	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.1 V		13	32		GRID ARRAY, LOW PROFILE, FINE PITCH		.9 V	105 Cel		-40 Cel		BOTTOM	1.34 mm		9 mm		YES	32	30 MHz	NOT SPECIFIED	NOT SPECIFIED	9 mm	CMOS		1 V				.5 mm	FIXED POINT	S-PBGA-B236			347.5 rpm	YES
P5021PXE1VNC	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	1295	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V		16			GRID ARRAY		1.05 V	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	3.53 mm		37.5 mm		YES	64				37.5 mm	CMOS		1.1 V				1 mm	FIXED POINT	S-PBGA-B1295			2000 rpm	YES	e1
BSC9131NJN1HHHB	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	520	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		16	32		GRID ARRAY, FINE PITCH		.97 V	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.97 mm		21 mm		YES	32		30	245	21 mm	CMOS		1 V				.8 mm	FIXED POINT	S-PBGA-B520	3		800 rpm	YES	e1
BSC9131CJE1HHKB	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	520	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		16	32		GRID ARRAY, FINE PITCH		.97 V	105 Cel		-40 Cel		BOTTOM	1.97 mm		21 mm		YES	32				21 mm	CMOS		1 V				.8 mm	FIXED POINT	S-PBGA-B520			800 rpm	YES
SVF312R3K1CKU2	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	GULL WING	176	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	YES	3.6 V		0			FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH		3 V	85 Cel		-40 Cel	MATTE TIN	QUAD	1.6 mm		24 mm		YES	0		40	260	24 mm	CMOS		3.3 V				.5 mm	FLOATING POINT	S-PQFP-G176	3		266 rpm	YES	e3
BSC9131NJE1KHHB	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	520	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		16	32		GRID ARRAY, FINE PITCH		.97 V	105 Cel		-40 Cel		BOTTOM	1.97 mm		21 mm		YES	32				21 mm	CMOS		1 V				.8 mm	FIXED POINT	S-PBGA-B520			1000 rpm	YES
XPC8245TZU350B	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL		BGA	RECTANGULAR	PLASTIC/EPOXY	NO	YES	2.1 V					GRID ARRAY		1.9 V	105 Cel		-40 Cel		BOTTOM					NO						CMOS		2 V					FIXED POINT	R-PBGA-B			350 rpm	NO
P5021NXN7VNB	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	1295	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V		16			GRID ARRAY		1.05 V	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	3.53 mm		37.5 mm		YES	64				37.5 mm	CMOS		1.1 V				1 mm	FIXED POINT	S-PBGA-B1295			2000 rpm	YES	e1
BSC9131CXN1HHKB	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	520	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		16	32		GRID ARRAY, FINE PITCH		.97 V	105 Cel		-40 Cel		BOTTOM	1.97 mm		21 mm		YES	32				21 mm	CMOS		1 V				.8 mm	FIXED POINT	S-PBGA-B520			800 rpm	YES
P5021PXN12QC	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	1295	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.23 V		16			GRID ARRAY		1.17 V	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	3.53 mm		37.5 mm		YES	64				37.5 mm	CMOS		1.2 V				1 mm	FIXED POINT	S-PBGA-B1295			2200 rpm	YES	e1
BSC9131NXE1KHHB	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	520	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		16	32		GRID ARRAY, FINE PITCH		.97 V	105 Cel		-40 Cel		BOTTOM	1.97 mm		21 mm		YES	32				21 mm	CMOS		1 V				.8 mm	FIXED POINT	S-PBGA-B520			1000 rpm	YES
BSC9132NXN7MNMB	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		16	32		GRID ARRAY, FINE PITCH		.97 V	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	2.53 mm		23 mm		YES	32		30	245	23 mm	CMOS		1 V				.8 mm	FIXED POINT	S-PBGA-B780	3		1200 rpm	YES	e1
P5021NXE7TMC	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	1295	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V		16			GRID ARRAY		1.05 V	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	3.53 mm		37.5 mm		YES	64		30	245	37.5 mm	CMOS		1.1 V				1 mm	FIXED POINT	S-PBGA-B1295	3		1800 rpm	YES	e1
P5021PXE1TMC	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	1295	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V		16			GRID ARRAY		1.05 V	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	3.53 mm		37.5 mm		YES	64				37.5 mm	CMOS		1.1 V				1 mm	FIXED POINT	S-PBGA-B1295			1800 rpm	YES	e1
P5021PXN12QB	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	1295	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.23 V		16			GRID ARRAY		1.17 V	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	3.53 mm		37.5 mm		YES	64				37.5 mm	CMOS		1.2 V				1 mm	FIXED POINT	S-PBGA-B1295			2200 rpm	YES	e1
SVF511R3K1CMK4	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	364	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.6 V		16			GRID ARRAY, LOW PROFILE, FINE PITCH		3 V	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.5 mm		17 mm		YES	16		40	260	17 mm	CMOS		3.3 V				.8 mm	FLOATING POINT	S-PBGA-B364	3		400 rpm	YES	e1

Microprocessors

A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.

Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.

Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.

One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.