INDUSTRIAL Microprocessors 1,818

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Part RoHS Manufacturer Peripheral IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material Integrated Cache Surface Mount Maximum Supply Voltage On Chip Data RAM Width Screening Level Address Bus Width DAC Channels Bit Size Power Supplies (V) Package Style (Meter) Package Equivalence Code Minimum Supply Voltage Maximum Operating Temperature CPU Family No. of External Interrupts Minimum Operating Temperature Terminal Finish ADC Channels Terminal Position DMA Channels Maximum Seated Height ROM Words RAM Words Width Data EEPROM Size Additional Features Boundary Scan Peripherals External Data Bus Width Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Total Dose (V) RAM Bytes Technology Analog To Digital Convertors Maximum Supply Current Nominal Supply Voltage No. of DMA Channels PWM Channels No. of Serial I/Os Sub-Category Connectivity ROM Programmability Bus Compatibility Terminal Pitch Format JESD-30 Code Moisture Sensitivity Level (MSL) Qualification Speed Low Power Mode JESD-609 Code On Chip Program ROM Width No. of I/O Lines

MGT5100TS/D

NXP Semiconductors

MICROPROCESSOR, RISC

INDUSTRIAL

BALL

272

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

32

32

GRID ARRAY

85 Cel

-40 Cel

BOTTOM

NO

32

CMOS

FLOATING POINT

S-PBGA-B272

Not Qualified

66 rpm

YES

BSC9131NJN1KHKB

NXP Semiconductors

MICROPROCESSOR, RISC

INDUSTRIAL

BALL

520

FBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

16

32

GRID ARRAY, FINE PITCH

.97 V

105 Cel

-40 Cel

BOTTOM

1.97 mm

21 mm

YES

32

21 mm

CMOS

1 V

.8 mm

FIXED POINT

S-PBGA-B520

1000 rpm

YES

P5021NXE72QB

NXP Semiconductors

MICROPROCESSOR, RISC

INDUSTRIAL

BALL

1295

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.23 V

16

GRID ARRAY

1.17 V

105 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

3.53 mm

37.5 mm

YES

64

37.5 mm

CMOS

1.2 V

1 mm

FIXED POINT

S-PBGA-B1295

2200 rpm

YES

e1

P5021PXN1VNC

NXP Semiconductors

MICROPROCESSOR, RISC

INDUSTRIAL

BALL

1295

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.15 V

16

GRID ARRAY

1.05 V

105 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

3.53 mm

37.5 mm

YES

64

37.5 mm

CMOS

1.1 V

1 mm

FIXED POINT

S-PBGA-B1295

2000 rpm

YES

e1

SVF331R3K1CKU2

NXP Semiconductors

MICROPROCESSOR, RISC

INDUSTRIAL

GULL WING

176

QFP

SQUARE

PLASTIC/EPOXY

YES

YES

1.26 V

0

FLATPACK

1.16 V

85 Cel

-40 Cel

TIN

QUAD

YES

0

40

260

CMOS

1.23 V

FLOATING POINT

S-PQFP-G176

3

266 rpm

YES

e3

BSC9131NJE1HHHB

NXP Semiconductors

MICROPROCESSOR, RISC

INDUSTRIAL

BALL

520

FBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

16

32

GRID ARRAY, FINE PITCH

.97 V

105 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.97 mm

21 mm

YES

32

30

245

21 mm

CMOS

1 V

.8 mm

FIXED POINT

S-PBGA-B520

3

800 rpm

YES

e1

SCC68070ADA84

NXP Semiconductors

MICROPROCESSOR, RISC

INDUSTRIAL

J BEND

84

QCCJ

SQUARE

PLASTIC/EPOXY

YES

32

5

CHIP CARRIER

LDCC84,1.2SQ

85 Cel

-40 Cel

QUAD

CMOS

130 mA

5 V

Microprocessors

1.27 mm

S-PQCC-J84

Not Qualified

17.5 rpm

SCF5250AG120

NXP Semiconductors

MICROPROCESSOR

INDUSTRIAL

GULL WING

144

LFQFP

SQUARE

PLASTIC/EPOXY

YES

YES

1.32 V

25

32

FLATPACK, LOW PROFILE, FINE PITCH

1.08 V

85 Cel

-40 Cel

TIN

QUAD

1.6 mm

20 mm

ALSO REQUIRES 3.3V SUPPLY

YES

32

33.86 MHz

40

260

20 mm

CMOS

1.2 V

.5 mm

FIXED POINT

S-PQFP-G144

3

120 rpm

YES

e3

SCF5250CPV120

NXP Semiconductors

MICROPROCESSOR

INDUSTRIAL

GULL WING

144

LFQFP

SQUARE

PLASTIC/EPOXY

YES

YES

1.32 V

24

32

FLATPACK, LOW PROFILE, FINE PITCH

1.08 V

85 Cel

-40 Cel

QUAD

1.6 mm

20 mm

YES

16

33.86 MHz

20 mm

CMOS

1.2 V

.5 mm

FIXED POINT

S-PQFP-G144

120 rpm

YES

SVF311R3K2CKU2

NXP Semiconductors

MICROPROCESSOR, RISC

INDUSTRIAL

GULL WING

176

HLFQFP

SQUARE

PLASTIC/EPOXY

YES

YES

1.26 V

0

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

1.16 V

85 Cel

-40 Cel

TIN

QUAD

1.6 mm

24 mm

YES

0

40

260

24 mm

CMOS

1.23 V

.5 mm

FLOATING POINT

S-PQFP-G176

3

266 rpm

YES

e3

P5021PXN72QC

NXP Semiconductors

MICROPROCESSOR, RISC

INDUSTRIAL

BALL

1295

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.23 V

16

GRID ARRAY

1.17 V

105 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

3.53 mm

37.5 mm

YES

64

37.5 mm

CMOS

1.2 V

1 mm

FIXED POINT

S-PBGA-B1295

2200 rpm

YES

e1

BSC9131NJN1HHKB

NXP Semiconductors

MICROPROCESSOR, RISC

INDUSTRIAL

BALL

520

FBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

16

32

GRID ARRAY, FINE PITCH

.97 V

105 Cel

-40 Cel

BOTTOM

1.97 mm

21 mm

YES

32

21 mm

CMOS

1 V

.8 mm

FIXED POINT

S-PBGA-B520

800 rpm

YES

BSC9131CJE1KHKB

NXP Semiconductors

MICROPROCESSOR, RISC

INDUSTRIAL

BALL

520

FBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

16

32

GRID ARRAY, FINE PITCH

.97 V

105 Cel

-40 Cel

BOTTOM

1.97 mm

21 mm

YES

32

21 mm

CMOS

1 V

.8 mm

FIXED POINT

S-PBGA-B520

1000 rpm

YES

935322719557

NXP Semiconductors

MICROPROCESSOR, RISC

INDUSTRIAL

BALL

620

BGA

SQUARE

PLASTIC

YES

YES

1.89 V

32

GRID ARRAY

BGA620,28X28,40

1.71 V

105 Cel

0 Cel

TIN SILVER

BOTTOM

2.46 mm

29 mm

ALSO REQUIRES 2.5 AND 3.3V SUPPLY

YES

66 MHz

40

260

29 mm

CMOS

1.8 V

4

1 mm

FLOATING POINT

S-PBGA-B620

3

400 rpm

YES

e2

SVF522R3K1CMK4

NXP Semiconductors

MICROPROCESSOR, RISC

INDUSTRIAL

BALL

364

LFBGA

SQUARE

PLASTIC/EPOXY

YES

YES

3.6 V

16

GRID ARRAY, LOW PROFILE, FINE PITCH

3 V

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.5 mm

17 mm

YES

16

40

260

17 mm

CMOS

3.3 V

.8 mm

FLOATING POINT

S-PBGA-B364

3

400 rpm

YES

e1

SC103335VR400BR2

NXP Semiconductors

MICROPROCESSOR

INDUSTRIAL

BALL

272

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.58 V

AEC-Q100

32

32

1.5,3.3

GRID ARRAY

BGA272,20X20,50

1.42 V

85 Cel

-40 Cel

TIN SILVER

BOTTOM

2.65 mm

27 mm

YES

32

66 MHz

27 mm

CMOS

1.5 V

Microprocessors

1.27 mm

FLOATING POINT

S-PBGA-B272

3

Not Qualified

400 rpm

YES

e2

P5021NXE1TMC

NXP Semiconductors

MICROPROCESSOR, RISC

INDUSTRIAL

BALL

1295

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.15 V

16

GRID ARRAY

1.05 V

105 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

3.53 mm

37.5 mm

YES

64

37.5 mm

CMOS

1.1 V

1 mm

FIXED POINT

S-PBGA-B1295

1800 rpm

YES

e1

SVF531R3K1CMK4

NXP Semiconductors

MICROPROCESSOR, RISC

INDUSTRIAL

BALL

364

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.26 V

0

GRID ARRAY

1.16 V

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

YES

0

40

260

CMOS

1.23 V

FLOATING POINT

S-PBGA-B364

3

400 rpm

YES

e1

BSC9131NXE1HHKB

NXP Semiconductors

MICROPROCESSOR, RISC

INDUSTRIAL

BALL

520

FBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

16

32

GRID ARRAY, FINE PITCH

.97 V

105 Cel

-40 Cel

BOTTOM

1.97 mm

21 mm

YES

32

21 mm

CMOS

1 V

.8 mm

FIXED POINT

S-PBGA-B520

800 rpm

YES

BSC9131CJN1KHKB

NXP Semiconductors

MICROPROCESSOR, RISC

INDUSTRIAL

BALL

520

FBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

16

32

GRID ARRAY, FINE PITCH

.97 V

105 Cel

-40 Cel

BOTTOM

1.97 mm

21 mm

YES

32

21 mm

CMOS

1 V

.8 mm

FIXED POINT

S-PBGA-B520

1000 rpm

YES

BSC9131NJE1KHKB

NXP Semiconductors

MICROPROCESSOR, RISC

INDUSTRIAL

BALL

520

FBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

16

32

GRID ARRAY, FINE PITCH

.97 V

105 Cel

-40 Cel

BOTTOM

1.97 mm

21 mm

YES

32

21 mm

CMOS

1 V

.8 mm

FIXED POINT

S-PBGA-B520

1000 rpm

YES

XPC850DSLCZT50BU

NXP Semiconductors

MICROPROCESSOR, RISC

INDUSTRIAL

BALL

256

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

3.465 V

26

32

GRID ARRAY

3.135 V

95 Cel

-40 Cel

BOTTOM

2.35 mm

23 mm

YES

32

23 mm

CMOS

3.3 V

1.27 mm

FIXED POINT

S-PBGA-B256

50 rpm

YES

P5021PXN1TMB

NXP Semiconductors

MICROPROCESSOR, RISC

INDUSTRIAL

BALL

1295

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.15 V

16

GRID ARRAY

1.05 V

105 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

3.53 mm

37.5 mm

YES

64

37.5 mm

CMOS

1.1 V

1 mm

FIXED POINT

S-PBGA-B1295

1800 rpm

YES

e1

P5021NXN12QB

NXP Semiconductors

MICROPROCESSOR, RISC

INDUSTRIAL

BALL

1295

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.23 V

16

GRID ARRAY

1.17 V

105 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

3.53 mm

37.5 mm

YES

64

37.5 mm

CMOS

1.2 V

1 mm

FIXED POINT

S-PBGA-B1295

2200 rpm

YES

e1

BSC9131CJN1HHHB

NXP Semiconductors

MICROPROCESSOR, RISC

INDUSTRIAL

BALL

520

FBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

16

32

GRID ARRAY, FINE PITCH

.97 V

105 Cel

-40 Cel

BOTTOM

1.97 mm

21 mm

YES

32

21 mm

CMOS

1 V

.8 mm

FIXED POINT

S-PBGA-B520

800 rpm

YES

P5021NXN7VNC

NXP Semiconductors

MICROPROCESSOR, RISC

INDUSTRIAL

BALL

1295

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.15 V

16

GRID ARRAY

1.05 V

105 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

3.53 mm

37.5 mm

YES

64

30

245

37.5 mm

CMOS

1.1 V

1 mm

FIXED POINT

S-PBGA-B1295

3

2000 rpm

YES

e1

XPC8245TZU266B

NXP Semiconductors

MICROPROCESSOR

INDUSTRIAL

BALL

352

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.9 V

32

32

32

GRID ARRAY

BGA352,26X26,50

1.7 V

105 Cel

-40 Cel

BOTTOM

1.65 mm

35 mm

ALSO OPERATES AT 2V SUPPLY

YES

32

35 mm

CMOS

1.8 V

1.27 mm

FLOATING POINT

S-PBGA-B352

266 rpm

YES

SVF532R2K1CMK4

NXP Semiconductors

MICROPROCESSOR, RISC

INDUSTRIAL

BALL

364

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.26 V

0

GRID ARRAY

1.16 V

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

YES

0

40

260

CMOS

1.23 V

FLOATING POINT

S-PBGA-B364

3

400 rpm

YES

e1

SCF5250CAG120R2

NXP Semiconductors

MICROPROCESSOR

INDUSTRIAL

GULL WING

144

LFQFP

SQUARE

PLASTIC/EPOXY

YES

YES

1.32 V

25

32

FLATPACK, LOW PROFILE, FINE PITCH

1.08 V

85 Cel

-40 Cel

TIN

QUAD

1.6 mm

20 mm

ALSO REQUIRES 3.3V SUPPLY

YES

32

33.86 MHz

40

260

20 mm

CMOS

1.2 V

.5 mm

FIXED POINT

S-PQFP-G144

3

120 rpm

YES

e3

P5021PXN7TMB

NXP Semiconductors

MICROPROCESSOR, RISC

INDUSTRIAL

BALL

1295

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.15 V

16

GRID ARRAY

1.05 V

105 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

3.53 mm

37.5 mm

YES

64

37.5 mm

CMOS

1.1 V

1 mm

FIXED POINT

S-PBGA-B1295

1800 rpm

YES

e1

P5021PXN7VNB

NXP Semiconductors

MICROPROCESSOR, RISC

INDUSTRIAL

BALL

1295

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.15 V

16

GRID ARRAY

1.05 V

105 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

3.53 mm

37.5 mm

YES

64

37.5 mm

CMOS

1.1 V

1 mm

FIXED POINT

S-PBGA-B1295

2000 rpm

YES

e1

P5021NXE7VNC

NXP Semiconductors

MICROPROCESSOR, RISC

INDUSTRIAL

BALL

1295

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.15 V

16

GRID ARRAY

1.05 V

105 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

3.53 mm

37.5 mm

YES

64

30

245

37.5 mm

CMOS

1.1 V

1 mm

FIXED POINT

S-PBGA-B1295

3

2000 rpm

YES

e1

SCP2201VMU

NXP Semiconductors

MICROPROCESSOR, RISC

INDUSTRIAL

BALL

236

LFBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.1 V

13

32

GRID ARRAY, LOW PROFILE, FINE PITCH

.9 V

105 Cel

-40 Cel

BOTTOM

1.34 mm

9 mm

YES

32

30 MHz

NOT SPECIFIED

NOT SPECIFIED

9 mm

CMOS

1 V

.5 mm

FIXED POINT

S-PBGA-B236

347.5 rpm

YES

SCF5250LAG100

NXP Semiconductors

MICROPROCESSOR

INDUSTRIAL

GULL WING

144

LFQFP

SQUARE

PLASTIC/EPOXY

YES

YES

1.32 V

25

32

FLATPACK, LOW PROFILE, FINE PITCH

1.08 V

85 Cel

-40 Cel

TIN

QUAD

1.6 mm

20 mm

ALSO REQUIRES 3.3V SUPPLY

YES

32

33.86 MHz

40

260

20 mm

CMOS

1.2 V

.5 mm

FIXED POINT

S-PQFP-G144

3

Not Qualified

100 rpm

YES

e3

XPC823CZT25Z3

NXP Semiconductors

MICROPROCESSOR

INDUSTRIAL

BALL

256

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

32

GRID ARRAY

85 Cel

-40 Cel

BOTTOM

YES

CMOS

FIXED POINT

S-PBGA-B256

25 rpm

YES

P5021NXN1TMC

NXP Semiconductors

MICROPROCESSOR, RISC

INDUSTRIAL

BALL

1295

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.15 V

16

GRID ARRAY

1.05 V

105 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

3.53 mm

37.5 mm

YES

64

37.5 mm

CMOS

1.1 V

1 mm

FIXED POINT

S-PBGA-B1295

1800 rpm

YES

e1

SCF5250EAG120

NXP Semiconductors

MICROPROCESSOR

INDUSTRIAL

GULL WING

144

LFQFP

SQUARE

PLASTIC/EPOXY

YES

YES

1.32 V

25

32

1.2,3.3

FLATPACK, LOW PROFILE, FINE PITCH

QFP144,.87SQ,20

1.08 V

85 Cel

-40 Cel

QUAD

1.6 mm

20 mm

ALSO REQUIRES 3.3V SUPPLY

YES

32

33.86 MHz

20 mm

CMOS

1.2 V

Microprocessors

.5 mm

FIXED POINT

S-PQFP-G144

Not Qualified

120 rpm

YES

SVF532R3K1CMK4

NXP Semiconductors

MICROPROCESSOR, RISC

INDUSTRIAL

BALL

364

LFBGA

SQUARE

PLASTIC/EPOXY

YES

YES

3.6 V

16

GRID ARRAY, LOW PROFILE, FINE PITCH

3 V

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.5 mm

17 mm

YES

16

40

260

17 mm

CMOS

3.3 V

.8 mm

FLOATING POINT

S-PBGA-B364

3

400 rpm

YES

e1

BSC9132NXE7KNKB

NXP Semiconductors

MICROPROCESSOR, RISC

INDUSTRIAL

BALL

780

FBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

16

32

GRID ARRAY, FINE PITCH

.97 V

105 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

2.53 mm

23 mm

YES

32

30

245

23 mm

CMOS

1 V

.8 mm

FIXED POINT

S-PBGA-B780

3

1000 rpm

YES

e1

SVF321R3K1CKU2

NXP Semiconductors

MICROPROCESSOR, RISC

INDUSTRIAL

GULL WING

176

HLFQFP

SQUARE

PLASTIC/EPOXY

YES

YES

3.6 V

0

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

3 V

85 Cel

-40 Cel

TIN

QUAD

1.6 mm

24 mm

YES

0

40

260

24 mm

CMOS

3.3 V

.5 mm

FLOATING POINT

S-PQFP-G176

3

266 rpm

YES

e3

BSC9131CXE1KHHB

NXP Semiconductors

MICROPROCESSOR, RISC

INDUSTRIAL

BALL

520

FBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

16

32

GRID ARRAY, FINE PITCH

.97 V

105 Cel

-40 Cel

BOTTOM

1.97 mm

21 mm

YES

32

21 mm

CMOS

1 V

.8 mm

FIXED POINT

S-PBGA-B520

1000 rpm

YES

BSC9131CXE1HHHB

NXP Semiconductors

MICROPROCESSOR, RISC

INDUSTRIAL

BALL

520

FBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

16

32

GRID ARRAY, FINE PITCH

.97 V

105 Cel

-40 Cel

BOTTOM

1.97 mm

21 mm

YES

32

21 mm

CMOS

1 V

.8 mm

FIXED POINT

S-PBGA-B520

800 rpm

YES

P5021NXE12QB

NXP Semiconductors

MICROPROCESSOR, RISC

INDUSTRIAL

BALL

1295

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.23 V

16

GRID ARRAY

1.17 V

105 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

3.53 mm

37.5 mm

YES

64

37.5 mm

CMOS

1.2 V

1 mm

FIXED POINT

S-PBGA-B1295

2200 rpm

YES

e1

P5021NXE12QC

NXP Semiconductors

MICROPROCESSOR, RISC

INDUSTRIAL

BALL

1295

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.23 V

16

GRID ARRAY

1.17 V

105 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

3.53 mm

37.5 mm

YES

64

37.5 mm

CMOS

1.2 V

1 mm

FIXED POINT

S-PBGA-B1295

2200 rpm

YES

e1

P5021PXN72QB

NXP Semiconductors

MICROPROCESSOR, RISC

INDUSTRIAL

BALL

1295

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.23 V

16

GRID ARRAY

1.17 V

105 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

3.53 mm

37.5 mm

YES

64

37.5 mm

CMOS

1.2 V

1 mm

FIXED POINT

S-PBGA-B1295

2200 rpm

YES

e1

BSC9131CJE1HHHB

NXP Semiconductors

MICROPROCESSOR, RISC

INDUSTRIAL

BALL

520

FBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

16

32

GRID ARRAY, FINE PITCH

.97 V

105 Cel

-40 Cel

BOTTOM

1.97 mm

21 mm

YES

32

21 mm

CMOS

1 V

.8 mm

FIXED POINT

S-PBGA-B520

800 rpm

YES

BSC9131NXN1HHKB

NXP Semiconductors

MICROPROCESSOR, RISC

INDUSTRIAL

BALL

520

FBGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.05 V

16

32

GRID ARRAY, FINE PITCH

.97 V

105 Cel

-40 Cel

BOTTOM

1.97 mm

21 mm

YES

32

21 mm

CMOS

1 V

.8 mm

FIXED POINT

S-PBGA-B520

800 rpm

YES

P5021PXN1TMC

NXP Semiconductors

MICROPROCESSOR, RISC

INDUSTRIAL

BALL

1295

BGA

SQUARE

PLASTIC/EPOXY

YES

YES

1.15 V

16

GRID ARRAY

1.05 V

105 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

3.53 mm

37.5 mm

YES

64

37.5 mm

CMOS

1.1 V

1 mm

FIXED POINT

S-PBGA-B1295

1800 rpm

YES

e1

Microprocessors

A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.

Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.

Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.

One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.