Part | RoHS | Manufacturer | Peripheral IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Package Body Material | Integrated Cache | Surface Mount | Maximum Supply Voltage | On Chip Data RAM Width | Screening Level | Address Bus Width | DAC Channels | Bit Size | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Minimum Supply Voltage | Maximum Operating Temperature | CPU Family | No. of External Interrupts | Minimum Operating Temperature | Terminal Finish | ADC Channels | Terminal Position | DMA Channels | Maximum Seated Height | ROM Words | RAM Words | Width | Data EEPROM Size | Additional Features | Boundary Scan | Peripherals | External Data Bus Width | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Total Dose (V) | RAM Bytes | Technology | Analog To Digital Convertors | Maximum Supply Current | Nominal Supply Voltage | No. of DMA Channels | PWM Channels | No. of Serial I/Os | Sub-Category | Connectivity | ROM Programmability | Bus Compatibility | Terminal Pitch | Format | JESD-30 Code | Moisture Sensitivity Level (MSL) | Qualification | Speed | Low Power Mode | JESD-609 Code | On Chip Program ROM Width | No. of I/O Lines |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
NXP Semiconductors |
MICROPROCESSOR, RISC |
INDUSTRIAL |
BALL |
272 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
32 |
32 |
GRID ARRAY |
85 Cel |
-40 Cel |
BOTTOM |
NO |
32 |
CMOS |
FLOATING POINT |
S-PBGA-B272 |
Not Qualified |
66 rpm |
YES |
||||||||||||||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROPROCESSOR, RISC |
INDUSTRIAL |
BALL |
520 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.05 V |
16 |
32 |
GRID ARRAY, FINE PITCH |
.97 V |
105 Cel |
-40 Cel |
BOTTOM |
1.97 mm |
21 mm |
YES |
32 |
21 mm |
CMOS |
1 V |
.8 mm |
FIXED POINT |
S-PBGA-B520 |
1000 rpm |
YES |
||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROPROCESSOR, RISC |
INDUSTRIAL |
BALL |
1295 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.23 V |
16 |
GRID ARRAY |
1.17 V |
105 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
3.53 mm |
37.5 mm |
YES |
64 |
37.5 mm |
CMOS |
1.2 V |
1 mm |
FIXED POINT |
S-PBGA-B1295 |
2200 rpm |
YES |
e1 |
||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROPROCESSOR, RISC |
INDUSTRIAL |
BALL |
1295 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.15 V |
16 |
GRID ARRAY |
1.05 V |
105 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
3.53 mm |
37.5 mm |
YES |
64 |
37.5 mm |
CMOS |
1.1 V |
1 mm |
FIXED POINT |
S-PBGA-B1295 |
2000 rpm |
YES |
e1 |
||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROPROCESSOR, RISC |
INDUSTRIAL |
GULL WING |
176 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.26 V |
0 |
FLATPACK |
1.16 V |
85 Cel |
-40 Cel |
TIN |
QUAD |
YES |
0 |
40 |
260 |
CMOS |
1.23 V |
FLOATING POINT |
S-PQFP-G176 |
3 |
266 rpm |
YES |
e3 |
|||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROPROCESSOR, RISC |
INDUSTRIAL |
BALL |
520 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.05 V |
16 |
32 |
GRID ARRAY, FINE PITCH |
.97 V |
105 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
1.97 mm |
21 mm |
YES |
32 |
30 |
245 |
21 mm |
CMOS |
1 V |
.8 mm |
FIXED POINT |
S-PBGA-B520 |
3 |
800 rpm |
YES |
e1 |
||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROPROCESSOR, RISC |
INDUSTRIAL |
J BEND |
84 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
32 |
5 |
CHIP CARRIER |
LDCC84,1.2SQ |
85 Cel |
-40 Cel |
QUAD |
CMOS |
130 mA |
5 V |
Microprocessors |
1.27 mm |
S-PQCC-J84 |
Not Qualified |
17.5 rpm |
||||||||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROPROCESSOR |
INDUSTRIAL |
GULL WING |
144 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.32 V |
25 |
32 |
FLATPACK, LOW PROFILE, FINE PITCH |
1.08 V |
85 Cel |
-40 Cel |
TIN |
QUAD |
1.6 mm |
20 mm |
ALSO REQUIRES 3.3V SUPPLY |
YES |
32 |
33.86 MHz |
40 |
260 |
20 mm |
CMOS |
1.2 V |
.5 mm |
FIXED POINT |
S-PQFP-G144 |
3 |
120 rpm |
YES |
e3 |
||||||||||||||||||||||||||||
NXP Semiconductors |
MICROPROCESSOR |
INDUSTRIAL |
GULL WING |
144 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.32 V |
24 |
32 |
FLATPACK, LOW PROFILE, FINE PITCH |
1.08 V |
85 Cel |
-40 Cel |
QUAD |
1.6 mm |
20 mm |
YES |
16 |
33.86 MHz |
20 mm |
CMOS |
1.2 V |
.5 mm |
FIXED POINT |
S-PQFP-G144 |
120 rpm |
YES |
|||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROPROCESSOR, RISC |
INDUSTRIAL |
GULL WING |
176 |
HLFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.26 V |
0 |
FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH |
1.16 V |
85 Cel |
-40 Cel |
TIN |
QUAD |
1.6 mm |
24 mm |
YES |
0 |
40 |
260 |
24 mm |
CMOS |
1.23 V |
.5 mm |
FLOATING POINT |
S-PQFP-G176 |
3 |
266 rpm |
YES |
e3 |
|||||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROPROCESSOR, RISC |
INDUSTRIAL |
BALL |
1295 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.23 V |
16 |
GRID ARRAY |
1.17 V |
105 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
3.53 mm |
37.5 mm |
YES |
64 |
37.5 mm |
CMOS |
1.2 V |
1 mm |
FIXED POINT |
S-PBGA-B1295 |
2200 rpm |
YES |
e1 |
||||||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROPROCESSOR, RISC |
INDUSTRIAL |
BALL |
520 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.05 V |
16 |
32 |
GRID ARRAY, FINE PITCH |
.97 V |
105 Cel |
-40 Cel |
BOTTOM |
1.97 mm |
21 mm |
YES |
32 |
21 mm |
CMOS |
1 V |
.8 mm |
FIXED POINT |
S-PBGA-B520 |
800 rpm |
YES |
||||||||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROPROCESSOR, RISC |
INDUSTRIAL |
BALL |
520 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.05 V |
16 |
32 |
GRID ARRAY, FINE PITCH |
.97 V |
105 Cel |
-40 Cel |
BOTTOM |
1.97 mm |
21 mm |
YES |
32 |
21 mm |
CMOS |
1 V |
.8 mm |
FIXED POINT |
S-PBGA-B520 |
1000 rpm |
YES |
||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROPROCESSOR, RISC |
INDUSTRIAL |
BALL |
620 |
BGA |
SQUARE |
PLASTIC |
YES |
YES |
1.89 V |
32 |
GRID ARRAY |
BGA620,28X28,40 |
1.71 V |
105 Cel |
0 Cel |
TIN SILVER |
BOTTOM |
2.46 mm |
29 mm |
ALSO REQUIRES 2.5 AND 3.3V SUPPLY |
YES |
66 MHz |
40 |
260 |
29 mm |
CMOS |
1.8 V |
4 |
1 mm |
FLOATING POINT |
S-PBGA-B620 |
3 |
400 rpm |
YES |
e2 |
||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROPROCESSOR, RISC |
INDUSTRIAL |
BALL |
364 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
3.6 V |
16 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
3 V |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
1.5 mm |
17 mm |
YES |
16 |
40 |
260 |
17 mm |
CMOS |
3.3 V |
.8 mm |
FLOATING POINT |
S-PBGA-B364 |
3 |
400 rpm |
YES |
e1 |
|||||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROPROCESSOR |
INDUSTRIAL |
BALL |
272 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.58 V |
AEC-Q100 |
32 |
32 |
1.5,3.3 |
GRID ARRAY |
BGA272,20X20,50 |
1.42 V |
85 Cel |
-40 Cel |
TIN SILVER |
BOTTOM |
2.65 mm |
27 mm |
YES |
32 |
66 MHz |
27 mm |
CMOS |
1.5 V |
Microprocessors |
1.27 mm |
FLOATING POINT |
S-PBGA-B272 |
3 |
Not Qualified |
400 rpm |
YES |
e2 |
||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROPROCESSOR, RISC |
INDUSTRIAL |
BALL |
1295 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.15 V |
16 |
GRID ARRAY |
1.05 V |
105 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
3.53 mm |
37.5 mm |
YES |
64 |
37.5 mm |
CMOS |
1.1 V |
1 mm |
FIXED POINT |
S-PBGA-B1295 |
1800 rpm |
YES |
e1 |
||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROPROCESSOR, RISC |
INDUSTRIAL |
BALL |
364 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.26 V |
0 |
GRID ARRAY |
1.16 V |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
YES |
0 |
40 |
260 |
CMOS |
1.23 V |
FLOATING POINT |
S-PBGA-B364 |
3 |
400 rpm |
YES |
e1 |
|||||||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROPROCESSOR, RISC |
INDUSTRIAL |
BALL |
520 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.05 V |
16 |
32 |
GRID ARRAY, FINE PITCH |
.97 V |
105 Cel |
-40 Cel |
BOTTOM |
1.97 mm |
21 mm |
YES |
32 |
21 mm |
CMOS |
1 V |
.8 mm |
FIXED POINT |
S-PBGA-B520 |
800 rpm |
YES |
||||||||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROPROCESSOR, RISC |
INDUSTRIAL |
BALL |
520 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.05 V |
16 |
32 |
GRID ARRAY, FINE PITCH |
.97 V |
105 Cel |
-40 Cel |
BOTTOM |
1.97 mm |
21 mm |
YES |
32 |
21 mm |
CMOS |
1 V |
.8 mm |
FIXED POINT |
S-PBGA-B520 |
1000 rpm |
YES |
||||||||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROPROCESSOR, RISC |
INDUSTRIAL |
BALL |
520 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.05 V |
16 |
32 |
GRID ARRAY, FINE PITCH |
.97 V |
105 Cel |
-40 Cel |
BOTTOM |
1.97 mm |
21 mm |
YES |
32 |
21 mm |
CMOS |
1 V |
.8 mm |
FIXED POINT |
S-PBGA-B520 |
1000 rpm |
YES |
||||||||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROPROCESSOR, RISC |
INDUSTRIAL |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
3.465 V |
26 |
32 |
GRID ARRAY |
3.135 V |
95 Cel |
-40 Cel |
BOTTOM |
2.35 mm |
23 mm |
YES |
32 |
23 mm |
CMOS |
3.3 V |
1.27 mm |
FIXED POINT |
S-PBGA-B256 |
50 rpm |
YES |
||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROPROCESSOR, RISC |
INDUSTRIAL |
BALL |
1295 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.15 V |
16 |
GRID ARRAY |
1.05 V |
105 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
3.53 mm |
37.5 mm |
YES |
64 |
37.5 mm |
CMOS |
1.1 V |
1 mm |
FIXED POINT |
S-PBGA-B1295 |
1800 rpm |
YES |
e1 |
||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROPROCESSOR, RISC |
INDUSTRIAL |
BALL |
1295 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.23 V |
16 |
GRID ARRAY |
1.17 V |
105 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
3.53 mm |
37.5 mm |
YES |
64 |
37.5 mm |
CMOS |
1.2 V |
1 mm |
FIXED POINT |
S-PBGA-B1295 |
2200 rpm |
YES |
e1 |
||||||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROPROCESSOR, RISC |
INDUSTRIAL |
BALL |
520 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.05 V |
16 |
32 |
GRID ARRAY, FINE PITCH |
.97 V |
105 Cel |
-40 Cel |
BOTTOM |
1.97 mm |
21 mm |
YES |
32 |
21 mm |
CMOS |
1 V |
.8 mm |
FIXED POINT |
S-PBGA-B520 |
800 rpm |
YES |
||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROPROCESSOR, RISC |
INDUSTRIAL |
BALL |
1295 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.15 V |
16 |
GRID ARRAY |
1.05 V |
105 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
3.53 mm |
37.5 mm |
YES |
64 |
30 |
245 |
37.5 mm |
CMOS |
1.1 V |
1 mm |
FIXED POINT |
S-PBGA-B1295 |
3 |
2000 rpm |
YES |
e1 |
|||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROPROCESSOR |
INDUSTRIAL |
BALL |
352 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.9 V |
32 |
32 |
32 |
GRID ARRAY |
BGA352,26X26,50 |
1.7 V |
105 Cel |
-40 Cel |
BOTTOM |
1.65 mm |
35 mm |
ALSO OPERATES AT 2V SUPPLY |
YES |
32 |
35 mm |
CMOS |
1.8 V |
1.27 mm |
FLOATING POINT |
S-PBGA-B352 |
266 rpm |
YES |
|||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROPROCESSOR, RISC |
INDUSTRIAL |
BALL |
364 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.26 V |
0 |
GRID ARRAY |
1.16 V |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
YES |
0 |
40 |
260 |
CMOS |
1.23 V |
FLOATING POINT |
S-PBGA-B364 |
3 |
400 rpm |
YES |
e1 |
|||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROPROCESSOR |
INDUSTRIAL |
GULL WING |
144 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.32 V |
25 |
32 |
FLATPACK, LOW PROFILE, FINE PITCH |
1.08 V |
85 Cel |
-40 Cel |
TIN |
QUAD |
1.6 mm |
20 mm |
ALSO REQUIRES 3.3V SUPPLY |
YES |
32 |
33.86 MHz |
40 |
260 |
20 mm |
CMOS |
1.2 V |
.5 mm |
FIXED POINT |
S-PQFP-G144 |
3 |
120 rpm |
YES |
e3 |
||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROPROCESSOR, RISC |
INDUSTRIAL |
BALL |
1295 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.15 V |
16 |
GRID ARRAY |
1.05 V |
105 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
3.53 mm |
37.5 mm |
YES |
64 |
37.5 mm |
CMOS |
1.1 V |
1 mm |
FIXED POINT |
S-PBGA-B1295 |
1800 rpm |
YES |
e1 |
||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROPROCESSOR, RISC |
INDUSTRIAL |
BALL |
1295 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.15 V |
16 |
GRID ARRAY |
1.05 V |
105 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
3.53 mm |
37.5 mm |
YES |
64 |
37.5 mm |
CMOS |
1.1 V |
1 mm |
FIXED POINT |
S-PBGA-B1295 |
2000 rpm |
YES |
e1 |
||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROPROCESSOR, RISC |
INDUSTRIAL |
BALL |
1295 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.15 V |
16 |
GRID ARRAY |
1.05 V |
105 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
3.53 mm |
37.5 mm |
YES |
64 |
30 |
245 |
37.5 mm |
CMOS |
1.1 V |
1 mm |
FIXED POINT |
S-PBGA-B1295 |
3 |
2000 rpm |
YES |
e1 |
|||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROPROCESSOR, RISC |
INDUSTRIAL |
BALL |
236 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.1 V |
13 |
32 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
.9 V |
105 Cel |
-40 Cel |
BOTTOM |
1.34 mm |
9 mm |
YES |
32 |
30 MHz |
NOT SPECIFIED |
NOT SPECIFIED |
9 mm |
CMOS |
1 V |
.5 mm |
FIXED POINT |
S-PBGA-B236 |
347.5 rpm |
YES |
|||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROPROCESSOR |
INDUSTRIAL |
GULL WING |
144 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.32 V |
25 |
32 |
FLATPACK, LOW PROFILE, FINE PITCH |
1.08 V |
85 Cel |
-40 Cel |
TIN |
QUAD |
1.6 mm |
20 mm |
ALSO REQUIRES 3.3V SUPPLY |
YES |
32 |
33.86 MHz |
40 |
260 |
20 mm |
CMOS |
1.2 V |
.5 mm |
FIXED POINT |
S-PQFP-G144 |
3 |
Not Qualified |
100 rpm |
YES |
e3 |
|||||||||||||||||||||||||||
NXP Semiconductors |
MICROPROCESSOR |
INDUSTRIAL |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
32 |
GRID ARRAY |
85 Cel |
-40 Cel |
BOTTOM |
YES |
CMOS |
FIXED POINT |
S-PBGA-B256 |
25 rpm |
YES |
|||||||||||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROPROCESSOR, RISC |
INDUSTRIAL |
BALL |
1295 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.15 V |
16 |
GRID ARRAY |
1.05 V |
105 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
3.53 mm |
37.5 mm |
YES |
64 |
37.5 mm |
CMOS |
1.1 V |
1 mm |
FIXED POINT |
S-PBGA-B1295 |
1800 rpm |
YES |
e1 |
||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROPROCESSOR |
INDUSTRIAL |
GULL WING |
144 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.32 V |
25 |
32 |
1.2,3.3 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP144,.87SQ,20 |
1.08 V |
85 Cel |
-40 Cel |
QUAD |
1.6 mm |
20 mm |
ALSO REQUIRES 3.3V SUPPLY |
YES |
32 |
33.86 MHz |
20 mm |
CMOS |
1.2 V |
Microprocessors |
.5 mm |
FIXED POINT |
S-PQFP-G144 |
Not Qualified |
120 rpm |
YES |
|||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROPROCESSOR, RISC |
INDUSTRIAL |
BALL |
364 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
3.6 V |
16 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
3 V |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
1.5 mm |
17 mm |
YES |
16 |
40 |
260 |
17 mm |
CMOS |
3.3 V |
.8 mm |
FLOATING POINT |
S-PBGA-B364 |
3 |
400 rpm |
YES |
e1 |
|||||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROPROCESSOR, RISC |
INDUSTRIAL |
BALL |
780 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.05 V |
16 |
32 |
GRID ARRAY, FINE PITCH |
.97 V |
105 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
2.53 mm |
23 mm |
YES |
32 |
30 |
245 |
23 mm |
CMOS |
1 V |
.8 mm |
FIXED POINT |
S-PBGA-B780 |
3 |
1000 rpm |
YES |
e1 |
||||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROPROCESSOR, RISC |
INDUSTRIAL |
GULL WING |
176 |
HLFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
3.6 V |
0 |
FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH |
3 V |
85 Cel |
-40 Cel |
TIN |
QUAD |
1.6 mm |
24 mm |
YES |
0 |
40 |
260 |
24 mm |
CMOS |
3.3 V |
.5 mm |
FLOATING POINT |
S-PQFP-G176 |
3 |
266 rpm |
YES |
e3 |
|||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROPROCESSOR, RISC |
INDUSTRIAL |
BALL |
520 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.05 V |
16 |
32 |
GRID ARRAY, FINE PITCH |
.97 V |
105 Cel |
-40 Cel |
BOTTOM |
1.97 mm |
21 mm |
YES |
32 |
21 mm |
CMOS |
1 V |
.8 mm |
FIXED POINT |
S-PBGA-B520 |
1000 rpm |
YES |
||||||||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROPROCESSOR, RISC |
INDUSTRIAL |
BALL |
520 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.05 V |
16 |
32 |
GRID ARRAY, FINE PITCH |
.97 V |
105 Cel |
-40 Cel |
BOTTOM |
1.97 mm |
21 mm |
YES |
32 |
21 mm |
CMOS |
1 V |
.8 mm |
FIXED POINT |
S-PBGA-B520 |
800 rpm |
YES |
||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROPROCESSOR, RISC |
INDUSTRIAL |
BALL |
1295 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.23 V |
16 |
GRID ARRAY |
1.17 V |
105 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
3.53 mm |
37.5 mm |
YES |
64 |
37.5 mm |
CMOS |
1.2 V |
1 mm |
FIXED POINT |
S-PBGA-B1295 |
2200 rpm |
YES |
e1 |
||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROPROCESSOR, RISC |
INDUSTRIAL |
BALL |
1295 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.23 V |
16 |
GRID ARRAY |
1.17 V |
105 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
3.53 mm |
37.5 mm |
YES |
64 |
37.5 mm |
CMOS |
1.2 V |
1 mm |
FIXED POINT |
S-PBGA-B1295 |
2200 rpm |
YES |
e1 |
||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROPROCESSOR, RISC |
INDUSTRIAL |
BALL |
1295 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.23 V |
16 |
GRID ARRAY |
1.17 V |
105 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
3.53 mm |
37.5 mm |
YES |
64 |
37.5 mm |
CMOS |
1.2 V |
1 mm |
FIXED POINT |
S-PBGA-B1295 |
2200 rpm |
YES |
e1 |
||||||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROPROCESSOR, RISC |
INDUSTRIAL |
BALL |
520 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.05 V |
16 |
32 |
GRID ARRAY, FINE PITCH |
.97 V |
105 Cel |
-40 Cel |
BOTTOM |
1.97 mm |
21 mm |
YES |
32 |
21 mm |
CMOS |
1 V |
.8 mm |
FIXED POINT |
S-PBGA-B520 |
800 rpm |
YES |
||||||||||||||||||||||||||||||||||||
NXP Semiconductors |
MICROPROCESSOR, RISC |
INDUSTRIAL |
BALL |
520 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.05 V |
16 |
32 |
GRID ARRAY, FINE PITCH |
.97 V |
105 Cel |
-40 Cel |
BOTTOM |
1.97 mm |
21 mm |
YES |
32 |
21 mm |
CMOS |
1 V |
.8 mm |
FIXED POINT |
S-PBGA-B520 |
800 rpm |
YES |
||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROPROCESSOR, RISC |
INDUSTRIAL |
BALL |
1295 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.15 V |
16 |
GRID ARRAY |
1.05 V |
105 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
3.53 mm |
37.5 mm |
YES |
64 |
37.5 mm |
CMOS |
1.1 V |
1 mm |
FIXED POINT |
S-PBGA-B1295 |
1800 rpm |
YES |
e1 |
A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.
Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.
Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.
One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.