Part | RoHS | Manufacturer | Peripheral IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Package Body Material | Integrated Cache | Surface Mount | Maximum Supply Voltage | On Chip Data RAM Width | Screening Level | Address Bus Width | DAC Channels | Bit Size | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Minimum Supply Voltage | Maximum Operating Temperature | CPU Family | No. of External Interrupts | Minimum Operating Temperature | Terminal Finish | ADC Channels | Terminal Position | DMA Channels | Maximum Seated Height | ROM Words | RAM Words | Width | Data EEPROM Size | Additional Features | Boundary Scan | Peripherals | External Data Bus Width | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Total Dose (V) | RAM Bytes | Technology | Analog To Digital Convertors | Maximum Supply Current | Nominal Supply Voltage | No. of DMA Channels | PWM Channels | No. of Serial I/Os | Sub-Category | Connectivity | ROM Programmability | Bus Compatibility | Terminal Pitch | Format | JESD-30 Code | Moisture Sensitivity Level (MSL) | Qualification | Speed | Low Power Mode | JESD-609 Code | On Chip Program ROM Width | No. of I/O Lines |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Analog Devices |
MICROPROCESSOR, RISC |
INDUSTRIAL |
GULL WING |
176 |
HLFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
3.47 V |
16 |
24 |
32 |
FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH |
QFP176,1.0SQ,20 |
3.13 V |
105 Cel |
-40 Cel |
QUAD |
1.6 mm |
196608 |
24 mm |
YES |
16 |
60 MHz |
30 |
260 |
24 mm |
CMOS |
3.3 V |
17 |
.5 mm |
FLOATING POINT |
S-PQFP-G176 |
3 |
240 rpm |
YES |
|||||||||||||||||||||||||||
|
Analog Devices |
MICROPROCESSOR |
INDUSTRIAL |
GULL WING |
176 |
HLFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.15 V |
24 |
40 |
1.1,3.3 |
FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH |
QFP176,1.0SQ,20 |
1.05 V |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
QUAD |
1.6 mm |
98304 |
24 mm |
YES |
16 |
25 MHz |
24 mm |
CMOS |
1.1 V |
Digital Signal Processors |
.5 mm |
FLOATING POINT |
S-PQFP-G176 |
3 |
Not Qualified |
350 rpm |
NO |
e3 |
||||||||||||||||||||||||||
Analog Devices |
MICROPROCESSOR, RISC |
INDUSTRIAL |
GULL WING |
176 |
HLFQFP |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
0 |
FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH |
105 Cel |
-40 Cel |
QUAD |
1.6 mm |
24 mm |
YES |
0 |
60 MHz |
24 mm |
CMOS |
3.3 V |
.5 mm |
FLOATING POINT |
S-PQFP-G176 |
240 rpm |
YES |
||||||||||||||||||||||||||||||||||||||
|
Analog Devices |
MICROPROCESSOR |
INDUSTRIAL |
GULL WING |
100 |
HLFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.15 V |
24 |
40 |
1.1,3.3 |
FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH |
QFP100,.63SQ,20 |
1.05 V |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
QUAD |
1.6 mm |
98304 |
14 mm |
YES |
16 |
25 MHz |
14 mm |
CMOS |
1.1 V |
Digital Signal Processors |
.5 mm |
FLOATING POINT |
S-PQFP-G100 |
3 |
Not Qualified |
350 rpm |
NO |
e3 |
||||||||||||||||||||||||||
Analog Devices |
MICROPROCESSOR |
INDUSTRIAL |
BALL |
324 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.15 V |
24 |
32 |
GRID ARRAY |
1.05 V |
85 Cel |
-40 Cel |
BOTTOM |
1.8 mm |
19 mm |
YES |
8 |
19 mm |
CMOS |
1.1 V |
1 mm |
FLOATING POINT |
S-PBGA-B324 |
Not Qualified |
450 rpm |
NO |
|||||||||||||||||||||||||||||||||||
|
Analog Devices |
MICROPROCESSOR |
INDUSTRIAL |
NO LEAD |
88 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
YES |
1.15 V |
1 |
24 |
40 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC88,.47SQ,20 |
1.05 V |
115 Cel |
3 |
0 Cel |
QUAD |
.9 mm |
5242880 |
12 mm |
YES |
16 |
12 mm |
CMOS |
500 mA |
1.1 V |
65 |
.5 mm |
FLOATING POINT |
S-XQCC-N88 |
400 rpm |
NO |
|||||||||||||||||||||||||||||
Analog Devices |
MICROPROCESSOR |
INDUSTRIAL |
BALL |
349 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.9 V |
25 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
1.7 V |
85 Cel |
-40 Cel |
BOTTOM |
1.5 mm |
19 mm |
ALSO AVAILABLE IN 3.3V AND 14 BIT ADDRESS |
YES |
16 |
19 mm |
CMOS |
1.8 V |
.8 mm |
FIXED POINT |
S-PBGA-B349 |
400 rpm |
YES |
||||||||||||||||||||||||||||||||||||
Analog Devices |
MICROPROCESSOR |
INDUSTRIAL |
BALL |
324 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.15 V |
16 |
GRID ARRAY |
85 Cel |
-40 Cel |
BOTTOM |
1.8 mm |
19 mm |
YES |
16 |
19 mm |
CMOS |
1 mm |
FLOATING POINT |
S-PBGA-B324 |
Not Qualified |
NO |
|||||||||||||||||||||||||||||||||||||||
Analog Devices |
MICROPROCESSOR |
INDUSTRIAL |
BALL |
349 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.9 V |
25 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
1.7 V |
85 Cel |
-40 Cel |
BOTTOM |
1.5 mm |
19 mm |
ALSO AVAILABLE IN 3.3V AND 14 BIT ADDRESS |
YES |
16 |
19 mm |
CMOS |
1.8 V |
.8 mm |
FIXED POINT |
S-PBGA-B349 |
500 rpm |
YES |
||||||||||||||||||||||||||||||||||||
|
Analog Devices |
MICROPROCESSOR |
INDUSTRIAL |
GULL WING |
100 |
HLFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.15 V |
24 |
40 |
1.1,3.3 |
FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH |
QFP176,1.0SQ,20 |
1.05 V |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
QUAD |
1.6 mm |
98304 |
14 mm |
YES |
16 |
25 MHz |
14 mm |
CMOS |
1.1 V |
Digital Signal Processors |
.5 mm |
FLOATING POINT |
S-PQFP-G100 |
3 |
Not Qualified |
400 rpm |
NO |
e3 |
||||||||||||||||||||||||||
|
Analog Devices |
MICROPROCESSOR |
INDUSTRIAL |
GULL WING |
176 |
HLFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.15 V |
24 |
40 |
1.1,3.3 |
FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH |
QFP176,1.0SQ,20 |
1.05 V |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
QUAD |
1.6 mm |
98304 |
24 mm |
YES |
16 |
25 MHz |
24 mm |
CMOS |
1.1 V |
Digital Signal Processors |
.5 mm |
FLOATING POINT |
S-PQFP-G176 |
3 |
Not Qualified |
400 rpm |
NO |
e3 |
||||||||||||||||||||||||||
Analog Devices |
MICROPROCESSOR, RISC |
INDUSTRIAL |
BALL |
210 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
0 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
105 Cel |
-40 Cel |
BOTTOM |
1.5 mm |
15 mm |
YES |
0 |
60 MHz |
15 mm |
CMOS |
3.3 V |
.8 mm |
FLOATING POINT |
S-PBGA-B210 |
240 rpm |
YES |
||||||||||||||||||||||||||||||||||||||
|
Analog Devices |
MICROPROCESSOR, RISC |
INDUSTRIAL |
GULL WING |
176 |
HLFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
3.47 V |
16 |
24 |
32 |
FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH |
QFP176,1.0SQ,20 |
3.13 V |
105 Cel |
-40 Cel |
MATTE TIN |
QUAD |
1.6 mm |
196608 |
24 mm |
YES |
16 |
60 MHz |
30 |
260 |
24 mm |
CMOS |
3.3 V |
17 |
.5 mm |
FLOATING POINT |
S-PQFP-G176 |
3 |
240 rpm |
YES |
e3 |
|||||||||||||||||||||||||
|
Analog Devices |
MICROPROCESSOR, RISC |
INDUSTRIAL |
GULL WING |
120 |
HLFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
3.47 V |
16 |
5 |
32 |
FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH |
QFP120,.63SQ,16 |
3.13 V |
105 Cel |
-40 Cel |
QUAD |
1.6 mm |
196608 |
14 mm |
YES |
16 |
60 MHz |
30 |
260 |
14 mm |
CMOS |
3.3 V |
17 |
.4 mm |
FLOATING POINT |
S-PQFP-G120 |
3 |
240 rpm |
YES |
|||||||||||||||||||||||||||
|
Analog Devices |
MICROPROCESSOR, RISC |
INDUSTRIAL |
BALL |
212 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
3.47 V |
16 |
24 |
32 |
GRID ARRAY, LOW PROFILE |
BGA212,18X18,40 |
3.13 V |
105 Cel |
-40 Cel |
BOTTOM |
1.7 mm |
196608 |
19 mm |
YES |
16 |
60 MHz |
30 |
260 |
19 mm |
CMOS |
3.3 V |
17 |
1 mm |
FLOATING POINT |
S-PBGA-B212 |
3 |
240 rpm |
YES |
|||||||||||||||||||||||||||
|
Analog Devices |
MICROPROCESSOR, RISC |
INDUSTRIAL |
GULL WING |
176 |
HLFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
3.47 V |
16 |
24 |
32 |
FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH |
QFP176,1.0SQ,20 |
3.13 V |
105 Cel |
-40 Cel |
QUAD |
1.6 mm |
196608 |
24 mm |
YES |
16 |
60 MHz |
30 |
260 |
24 mm |
CMOS |
3.3 V |
17 |
.5 mm |
FLOATING POINT |
S-PQFP-G176 |
3 |
240 rpm |
YES |
|||||||||||||||||||||||||||
|
Analog Devices |
MICROPROCESSOR, RISC |
INDUSTRIAL |
GULL WING |
176 |
HLFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
3.47 V |
16 |
24 |
32 |
FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH |
QFP176,1.0SQ,20 |
3.13 V |
105 Cel |
-40 Cel |
QUAD |
1.6 mm |
196608 |
24 mm |
YES |
16 |
60 MHz |
30 |
260 |
24 mm |
CMOS |
3.3 V |
17 |
.5 mm |
FLOATING POINT |
S-PQFP-G176 |
3 |
240 rpm |
YES |
|||||||||||||||||||||||||||
|
Analog Devices |
MICROPROCESSOR |
INDUSTRIAL |
BALL |
349 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.32 V |
32 |
1.8/3.3 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA349,22X22,32 |
1.19 V |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
1.5 mm |
19 mm |
YES |
60 MHz |
30 |
260 |
19 mm |
CMOS |
1.25 V |
Microprocessors |
.8 mm |
FIXED POINT |
S-PBGA-B349 |
3 |
Not Qualified |
400 rpm |
YES |
e1 |
|||||||||||||||||||||||||||
STMicroelectronics |
MICROPROCESSOR |
INDUSTRIAL |
THROUGH-HOLE |
40 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
NO |
5.5 V |
0 |
16 |
8 |
5 |
IN-LINE |
DIP40,.6 |
4.5 V |
85 Cel |
2 |
-40 Cel |
TIN LEAD |
DUAL |
4.45 mm |
0 |
15.24 mm |
DRAM REFRESH CONTROLLER |
NO |
8 |
8 MHz |
52.18 mm |
CMOS |
25 mA |
5 V |
0 |
0 |
Microprocessors |
2.54 mm |
FIXED POINT |
R-PDIP-T40 |
Not Qualified |
8 rpm |
YES |
e0 |
||||||||||||||||||||||
STMicroelectronics |
MICROPROCESSOR |
INDUSTRIAL |
J BEND |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
5.5 V |
0 |
16 |
8 |
5 |
CHIP CARRIER |
LDCC44,.7SQ |
4.5 V |
85 Cel |
2 |
-40 Cel |
TIN LEAD |
QUAD |
4.57 mm |
0 |
16.5862 mm |
DRAM REFRESH CONTROLLER |
NO |
8 |
8 MHz |
16.5862 mm |
CMOS |
25 mA |
5 V |
0 |
0 |
Microprocessors |
1.27 mm |
FIXED POINT |
S-PQCC-J44 |
Not Qualified |
8 rpm |
YES |
e0 |
||||||||||||||||||||||
STMicroelectronics |
MICROPROCESSOR |
INDUSTRIAL |
THROUGH-HOLE |
40 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
NO |
5.5 V |
0 |
16 |
8 |
5 |
IN-LINE |
DIP40,.6 |
4.5 V |
85 Cel |
2 |
-40 Cel |
TIN LEAD |
DUAL |
4.45 mm |
0 |
15.24 mm |
DRAM REFRESH CONTROLLER |
NO |
8 |
4 MHz |
52.18 mm |
CMOS |
15 mA |
5 V |
0 |
0 |
Microprocessors |
2.54 mm |
FIXED POINT |
R-PDIP-T40 |
Not Qualified |
4 rpm |
YES |
e0 |
||||||||||||||||||||||
STMicroelectronics |
MICROPROCESSOR |
INDUSTRIAL |
THROUGH-HOLE |
40 |
DIP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
NO |
NO |
5.5 V |
0 |
16 |
8 |
5 |
IN-LINE |
DIP40,.6 |
4.5 V |
85 Cel |
2 |
-40 Cel |
TIN LEAD |
DUAL |
3.6 mm |
0 |
15.24 mm |
DRAM REFRESH CONTROLLER |
NO |
8 |
4 MHz |
CMOS |
15 mA |
5 V |
0 |
0 |
Microprocessors |
2.54 mm |
FIXED POINT |
R-CDIP-T40 |
Not Qualified |
4 rpm |
YES |
e0 |
|||||||||||||||||||||||
STMicroelectronics |
MICROPROCESSOR |
INDUSTRIAL |
THROUGH-HOLE |
40 |
DIP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
NO |
NO |
5.5 V |
0 |
16 |
8 |
5 |
IN-LINE |
DIP40,.6 |
4.5 V |
85 Cel |
2 |
-40 Cel |
TIN LEAD |
DUAL |
3.6 mm |
0 |
15.24 mm |
DRAM REFRESH CONTROLLER |
NO |
8 |
6 MHz |
CMOS |
22 mA |
5 V |
0 |
0 |
Microprocessors |
2.54 mm |
FIXED POINT |
R-CDIP-T40 |
Not Qualified |
6 rpm |
YES |
e0 |
|||||||||||||||||||||||
STMicroelectronics |
MICROPROCESSOR |
INDUSTRIAL |
J BEND |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
5.5 V |
0 |
16 |
8 |
5 |
CHIP CARRIER |
LDCC44,.7SQ |
4.5 V |
85 Cel |
2 |
-40 Cel |
TIN LEAD |
QUAD |
4.57 mm |
0 |
16.5862 mm |
DRAM REFRESH CONTROLLER |
NO |
8 |
6 MHz |
16.5862 mm |
CMOS |
22 mA |
5 V |
0 |
0 |
Microprocessors |
1.27 mm |
FIXED POINT |
S-PQCC-J44 |
Not Qualified |
6 rpm |
YES |
e0 |
||||||||||||||||||||||
STMicroelectronics |
MICROPROCESSOR |
INDUSTRIAL |
THROUGH-HOLE |
40 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
NO |
5.5 V |
0 |
16 |
8 |
5 |
IN-LINE |
DIP40,.6 |
4.5 V |
85 Cel |
2 |
-40 Cel |
TIN LEAD |
DUAL |
4.45 mm |
0 |
15.24 mm |
DRAM REFRESH CONTROLLER |
NO |
8 |
6 MHz |
52.18 mm |
CMOS |
22 mA |
5 V |
0 |
0 |
Microprocessors |
2.54 mm |
FIXED POINT |
R-PDIP-T40 |
Not Qualified |
6 rpm |
YES |
e0 |
||||||||||||||||||||||
STMicroelectronics |
MICROPROCESSOR |
INDUSTRIAL |
THROUGH-HOLE |
40 |
DIP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
NO |
NO |
5.5 V |
0 |
16 |
8 |
5 |
IN-LINE |
DIP40,.6 |
4.5 V |
85 Cel |
2 |
-40 Cel |
TIN LEAD |
DUAL |
3.6 mm |
0 |
15.24 mm |
DRAM REFRESH CONTROLLER |
NO |
8 |
8 MHz |
CMOS |
25 mA |
5 V |
0 |
0 |
Microprocessors |
2.54 mm |
FIXED POINT |
R-CDIP-T40 |
Not Qualified |
8 rpm |
YES |
e0 |
|||||||||||||||||||||||
STMicroelectronics |
MICROPROCESSOR, RISC |
INDUSTRIAL |
J BEND |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
8 |
5 |
CHIP CARRIER |
LDCC44,.7SQ |
85 Cel |
-40 Cel |
Tin/Lead (Sn/Pb) |
QUAD |
CMOS |
22 mA |
5 V |
Microprocessors |
1.27 mm |
S-PQCC-J44 |
Not Qualified |
6 rpm |
e0 |
||||||||||||||||||||||||||||||||||||||||
|
STMicroelectronics |
MICROPROCESSOR, RISC |
INDUSTRIAL |
BALL |
361 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.26 V |
GRID ARRAY, LOW PROFILE, FINE PITCH |
1.14 V |
85 Cel |
-40 Cel |
BOTTOM |
1.7 mm |
16 mm |
YES |
NOT SPECIFIED |
NOT SPECIFIED |
16 mm |
CMOS |
.8 mm |
FIXED POINT |
S-PBGA-B361 |
533 rpm |
NO |
|||||||||||||||||||||||||||||||||||||
STMicroelectronics |
MICROPROCESSOR |
INDUSTRIAL |
THROUGH-HOLE |
48 |
DIP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
NO |
NO |
5.25 V |
0 |
23 |
16 |
IN-LINE |
4.75 V |
85 Cel |
3 |
-40 Cel |
DUAL |
3.73 mm |
0 |
15.24 mm |
NO |
16 |
10 MHz |
MOS |
300 mA |
5 V |
0 |
0 |
2.54 mm |
FIXED POINT |
R-CDIP-T48 |
Not Qualified |
10 rpm |
YES |
|||||||||||||||||||||||||||||
STMicroelectronics |
MICROPROCESSOR, RISC |
INDUSTRIAL |
THROUGH-HOLE |
40 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
8 |
5 |
IN-LINE |
DIP40,.6 |
85 Cel |
-40 Cel |
TIN LEAD |
DUAL |
CMOS |
5 V |
Microprocessors |
2.54 mm |
R-XDIP-T40 |
Not Qualified |
1 rpm |
e0 |
|||||||||||||||||||||||||||||||||||||||||
STMicroelectronics |
MICROPROCESSOR, RISC |
INDUSTRIAL |
THROUGH-HOLE |
40 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
8 |
5 |
IN-LINE |
DIP40,.6 |
85 Cel |
-40 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
MOS |
5 V |
Microprocessors |
2.54 mm |
R-XDIP-T40 |
Not Qualified |
1.5 rpm |
e0 |
|||||||||||||||||||||||||||||||||||||||||
STMicroelectronics |
MICROPROCESSOR, RISC |
INDUSTRIAL |
BALL |
372 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.95 V |
32 |
32 |
1.8,3.3 |
GRID ARRAY |
BGA372,20X20,50 |
1.65 V |
85 Cel |
-40 Cel |
TIN LEAD |
BOTTOM |
2.6 mm |
27 mm |
ALSO REQUIRES 3.3V SUPPLY |
YES |
32 |
27 MHz |
27 mm |
CMOS |
1.8 V |
Microprocessors |
1.27 mm |
FLOATING POINT |
S-PBGA-B372 |
Not Qualified |
150 rpm |
YES |
e0 |
||||||||||||||||||||||||||||
STMicroelectronics |
MICROPROCESSOR, TRANSPUTER |
INDUSTRIAL |
J BEND |
84 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
5.5 V |
8 |
30 |
32 |
CHIP CARRIER |
4.5 V |
85 Cel |
1 |
-40 Cel |
QUAD |
5.08 mm |
1024 |
29.337 mm |
NO |
32 |
29.337 mm |
CMOS |
5 V |
1 |
2 |
1.27 mm |
FIXED POINT |
S-PQCC-J84 |
Not Qualified |
20 rpm |
NO |
||||||||||||||||||||||||||||||
STMicroelectronics |
MICROPROCESSOR |
INDUSTRIAL |
THROUGH-HOLE |
40 |
DIP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
NO |
NO |
5.25 V |
16 |
16 |
IN-LINE |
4.75 V |
85 Cel |
-40 Cel |
DUAL |
3.6 mm |
15.24 mm |
NO |
16 |
6.06 MHz |
CMOS |
5 V |
2.54 mm |
FIXED POINT |
R-CDIP-T40 |
Not Qualified |
6 rpm |
NO |
|||||||||||||||||||||||||||||||||||
STMicroelectronics |
MICROPROCESSOR, RISC |
INDUSTRIAL |
THROUGH-HOLE |
40 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
8 |
5 |
IN-LINE |
DIP40,.6 |
85 Cel |
-40 Cel |
TIN LEAD |
DUAL |
CMOS |
5 V |
Microprocessors |
2.54 mm |
R-XDIP-T40 |
Not Qualified |
1 rpm |
e0 |
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|
STMicroelectronics |
MICROPROCESSOR, RISC |
INDUSTRIAL |
BALL |
361 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.26 V |
GRID ARRAY, LOW PROFILE, FINE PITCH |
1.14 V |
85 Cel |
-40 Cel |
BOTTOM |
1.7 mm |
16 mm |
YES |
NOT SPECIFIED |
NOT SPECIFIED |
16 mm |
CMOS |
.8 mm |
FIXED POINT |
S-PBGA-B361 |
450 rpm |
NO |
|||||||||||||||||||||||||||||||||||||
|
STMicroelectronics |
MICROPROCESSOR, RISC |
INDUSTRIAL |
BALL |
361 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.26 V |
GRID ARRAY, LOW PROFILE, FINE PITCH |
1.14 V |
85 Cel |
-40 Cel |
BOTTOM |
1.7 mm |
16 mm |
YES |
NOT SPECIFIED |
NOT SPECIFIED |
16 mm |
CMOS |
.8 mm |
FIXED POINT |
S-PBGA-B361 |
600 rpm |
NO |
|||||||||||||||||||||||||||||||||||||
STMicroelectronics |
MICROPROCESSOR, RISC |
INDUSTRIAL |
THROUGH-HOLE |
40 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
8 |
5 |
IN-LINE |
DIP40,.6 |
85 Cel |
-40 Cel |
TIN LEAD |
DUAL |
CMOS |
5 V |
Microprocessors |
2.54 mm |
R-XDIP-T40 |
Not Qualified |
1.5 rpm |
e0 |
|||||||||||||||||||||||||||||||||||||||||
STMicroelectronics |
MICROPROCESSOR |
INDUSTRIAL |
THROUGH-HOLE |
48 |
DIP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
NO |
NO |
5.25 V |
16 |
16 |
IN-LINE |
4.75 V |
85 Cel |
-40 Cel |
DUAL |
3.73 mm |
15.24 mm |
NO |
16 |
10 MHz |
CMOS |
5 V |
2.54 mm |
FIXED POINT |
R-CDIP-T48 |
Not Qualified |
10 rpm |
NO |
|||||||||||||||||||||||||||||||||||
STMicroelectronics |
MICROPROCESSOR, RISC |
INDUSTRIAL |
THROUGH-HOLE |
40 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
8 |
5 |
IN-LINE |
DIP40,.6 |
85 Cel |
-40 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
MOS |
5 V |
Microprocessors |
2.54 mm |
R-PDIP-T40 |
Not Qualified |
1.5 rpm |
e0 |
|||||||||||||||||||||||||||||||||||||||||
STMicroelectronics |
MICROPROCESSOR |
INDUSTRIAL |
THROUGH-HOLE |
48 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
NO |
5.25 V |
0 |
20 |
16 |
5 |
IN-LINE |
DIP48,.6 |
4.75 V |
85 Cel |
3 |
-40 Cel |
TIN LEAD |
DUAL |
5.08 mm |
0 |
15.24 mm |
NO |
8 |
8 MHz |
NMOS |
5 V |
0 |
0 |
Microprocessors |
2.54 mm |
FIXED POINT |
R-PDIP-T48 |
Not Qualified |
8 rpm |
NO |
e0 |
|||||||||||||||||||||||||
STMicroelectronics |
MICROPROCESSOR, RISC |
INDUSTRIAL |
THROUGH-HOLE |
40 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
8 |
5 |
IN-LINE |
DIP40,.6 |
85 Cel |
-40 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
MOS |
5 V |
Microprocessors |
2.54 mm |
R-XDIP-T40 |
Not Qualified |
1.5 rpm |
e0 |
|||||||||||||||||||||||||||||||||||||||||
STMicroelectronics |
MICROPROCESSOR |
INDUSTRIAL |
THROUGH-HOLE |
48 |
DIP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
NO |
NO |
5.25 V |
0 |
23 |
16 |
IN-LINE |
4.75 V |
85 Cel |
3 |
-40 Cel |
DUAL |
3.73 mm |
0 |
15.24 mm |
NO |
16 |
6 MHz |
MOS |
300 mA |
5 V |
0 |
0 |
2.54 mm |
FIXED POINT |
R-CDIP-T48 |
Not Qualified |
6 rpm |
YES |
|||||||||||||||||||||||||||||
STMicroelectronics |
MICROPROCESSOR |
INDUSTRIAL |
BALL |
452 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
64 |
1.26,1.8,3.3 |
GRID ARRAY |
BGA452,26X26,40 |
85 Cel |
-40 Cel |
BOTTOM |
CMOS |
Microprocessors |
1 mm |
S-PBGA-B452 |
Not Qualified |
800 rpm |
||||||||||||||||||||||||||||||||||||||||||||
STMicroelectronics |
MICROPROCESSOR |
INDUSTRIAL |
THROUGH-HOLE |
48 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
NO |
5.25 V |
0 |
23 |
16 |
IN-LINE |
4.75 V |
85 Cel |
3 |
-40 Cel |
DUAL |
0 |
15.24 mm |
NO |
16 |
6 MHz |
MOS |
300 mA |
5 V |
0 |
0 |
2.54 mm |
FIXED POINT |
R-PDIP-T48 |
Not Qualified |
6 rpm |
YES |
||||||||||||||||||||||||||||||
STMicroelectronics |
MICROPROCESSOR |
INDUSTRIAL |
THROUGH-HOLE |
64 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
NO |
5.25 V |
0 |
24 |
16 |
5 |
IN-LINE |
DIP64,.9 |
4.75 V |
85 Cel |
7 |
-40 Cel |
TIN LEAD |
DUAL |
5.59 mm |
0 |
22.86 mm |
NO |
16 |
8 MHz |
81.535 mm |
NMOS |
5 V |
0 |
0 |
Microprocessors |
2.54 mm |
FIXED POINT |
R-PDIP-T64 |
Not Qualified |
8 rpm |
NO |
e0 |
||||||||||||||||||||||||
|
STMicroelectronics |
MICROPROCESSOR, RISC |
INDUSTRIAL |
BALL |
289 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.3 V |
24 |
32 |
1.2,1.8,3.3 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA289,17X17,32 |
1.14 V |
85 Cel |
-40 Cel |
TIN SILVER |
BOTTOM |
1.7 mm |
15 mm |
YES |
16 |
33 MHz |
15 mm |
CMOS |
400 mA |
1.2 V |
Microprocessors |
.8 mm |
FIXED POINT |
S-PBGA-B289 |
3 |
Not Qualified |
333 rpm |
YES |
e2 |
||||||||||||||||||||||||||
STMicroelectronics |
MICROPROCESSOR |
INDUSTRIAL |
THROUGH-HOLE |
40 |
DIP |
RECTANGULAR |
CERAMIC, METAL-SEALED COFIRED |
NO |
NO |
5.25 V |
0 |
16 |
8 |
5 |
IN-LINE |
DIP40,.6 |
4.75 V |
85 Cel |
2 |
-40 Cel |
TIN LEAD |
DUAL |
3.6 mm |
0 |
15.24 mm |
DRAM REFRESH CONTROLLER |
NO |
8 |
4 MHz |
NMOS |
200 mA |
5 V |
0 |
0 |
Microprocessors |
2.54 mm |
FIXED POINT |
R-CDIP-T40 |
Not Qualified |
4 rpm |
NO |
e0 |
A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.
Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.
Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.
One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.