INDUSTRIAL Microprocessors 1,818

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	On Chip Data RAM Width	Screening Level	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	CPU Family	No. of External Interrupts	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	ROM Words	RAM Words	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	RAM Bytes	Technology	Maximum Supply Current	Nominal Supply Voltage	No. of DMA Channels	No. of Serial I/Os	Sub-Category	ROM Programmability	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	Low Power Mode	JESD-609 Code
BSC9131CJE1KHHB	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	520	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V			16	32		GRID ARRAY, FINE PITCH		.97 V	105 Cel			-40 Cel		BOTTOM	1.97 mm			21 mm		YES	32				21 mm		CMOS		1 V					.8 mm	FIXED POINT	S-PBGA-B520			1000 rpm	YES
P5021PXE7TMB	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	1295	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V			16			GRID ARRAY		1.05 V	105 Cel			-40 Cel	TIN SILVER COPPER	BOTTOM	3.53 mm			37.5 mm		YES	64				37.5 mm		CMOS		1.1 V					1 mm	FIXED POINT	S-PBGA-B1295			1800 rpm	YES	e1
SCF5250CAG120	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	GULL WING	144	LFQFP	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V			25	32		FLATPACK, LOW PROFILE, FINE PITCH		1.08 V	85 Cel			-40 Cel	TIN	QUAD	1.6 mm			20 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	33.86 MHz	40	260	20 mm		CMOS		1.2 V					.5 mm	FIXED POINT	S-PQFP-G144	3		120 rpm	YES	e3
P5021NXN12QC	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	1295	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.23 V			16			GRID ARRAY		1.17 V	105 Cel			-40 Cel	TIN SILVER COPPER	BOTTOM	3.53 mm			37.5 mm		YES	64				37.5 mm		CMOS		1.2 V					1 mm	FIXED POINT	S-PBGA-B1295			2200 rpm	YES	e1
XPC850SRCZT50BU	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.465 V			26	32		GRID ARRAY		3.135 V	95 Cel			-40 Cel		BOTTOM	2.35 mm			23 mm		YES	32				23 mm		CMOS		3.3 V					1.27 mm	FIXED POINT	S-PBGA-B256			50 rpm	YES
BSC9132NXE7MNMB	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V			16	32		GRID ARRAY, FINE PITCH		.97 V	105 Cel			-40 Cel	TIN SILVER COPPER	BOTTOM	2.53 mm			23 mm		YES	32		30	245	23 mm		CMOS		1 V					.8 mm	FIXED POINT	S-PBGA-B780	3		1200 rpm	YES	e1
MC9S08GT60ACB	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	THROUGH-HOLE	42	SDIP	RECTANGULAR	PLASTIC/EPOXY	NO	NO	3.6 V				8	2/3.3	IN-LINE, SHRINK PITCH	SDIP42,.6	1.8 V	85 Cel			-40 Cel		DUAL	5.08 mm	61440		15.24 mm		NO		40 MHz			36.83 mm	4096	CMOS	7.5 mA	2 V			Microcontrollers	FLASH	1.778 mm	FIXED POINT	R-PDIP-T42	1	Not Qualified	40 rpm	YES
MC9S08PT16VTJ	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	NO	YES	5.5 V			0	8	3/5	SMALL OUTLINE	TSSOP20,.25	2.7 V	105 Cel	HCS08		-40 Cel	TIN	DUAL		16384				NO	0	20 MHz	40	260		2048	CMOS	14 mA	5 V			Microcontrollers	FLASH	.635 mm	FIXED POINT	R-PDSO-G20	3	Not Qualified	20 rpm	YES	e3
MPC7410THX400LE	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL		BGA	RECTANGULAR	PLASTIC/EPOXY	NO	YES	1.9 V						GRID ARRAY		1.7 V	105 Cel			-40 Cel	TIN LEAD	BOTTOM						NO			40	260			CMOS		1.8 V						FIXED POINT	R-PBGA-B	1	Not Qualified	400 rpm	NO	e0
LX2120XC72232B	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	.88 V			36	64		GRID ARRAY	BGA1517.39X39,40	.82 V	105 Cel		12	-40 Cel	TIN SILVER COPPER	BOTTOM	3.51 mm			40 mm		YES	128		30	245	40 mm		CMOS	.05 mA	.85 V		17			1 mm	FIXED POINT	S-PBGA-B1517	3		2200 rpm	YES	e1
MCF5234CVM150	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V			24	32		GRID ARRAY, LOW PROFILE		1.4 V	85 Cel			-40 Cel		BOTTOM	1.6 mm			17 mm	LOW POWER MODE TAKEN FROM LOW POWER MODE	YES	32	75 MHz	40	260	17 mm		CMOS		1.5 V					1 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	150 rpm	YES
MC68LC302CRC20	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	PIN/PEG	132	PGA	SQUARE	CERAMIC		NO					32	3.3,5	GRID ARRAY	PGA132,13X13		85 Cel			-40 Cel	Tin/Lead (Sn/Pb)	PERPENDICULAR													CMOS					Microprocessors		2.54 mm		S-XPGA-P132		Not Qualified	20 rpm		e0
LX2080XC72029B	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	.88 V			36	64		GRID ARRAY	BGA1517.39X39,40	.82 V	105 Cel		12	-40 Cel	TIN SILVER COPPER	BOTTOM	3.51 mm			40 mm		YES	128		30	245	40 mm		CMOS	.05 mA	.85 V		17			1 mm	FIXED POINT	S-PBGA-B1517	3		2000 rpm	YES	e1
LX2120XE71826B	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	.88 V			36	64		GRID ARRAY	BGA1517.39X39,40	.82 V	105 Cel		12	-40 Cel	TIN SILVER COPPER	BOTTOM	3.51 mm			40 mm		YES	128		30	245	40 mm		CMOS	.05 mA	.85 V		17			1 mm	FIXED POINT	S-PBGA-B1517	3		1800 rpm	YES	e1
MCF54450CVM180	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.65 V			32	32	1.5,1.8,2.5,3.3	GRID ARRAY, LOW PROFILE	BGA256,16X16,40	1.35 V	85 Cel			-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm			17 mm		YES	32	60 MHz	40	260	17 mm		CMOS		1.5 V			Microprocessors		1 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	180 rpm	YES	e1
MCF5274CVM166	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V			24	32		GRID ARRAY, LOW PROFILE		1.4 V	85 Cel			-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm			17 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	83 MHz	40	260	17 mm		CMOS		1.5 V					1 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	166 rpm	YES	e1
MCF5206EAB40	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	GULL WING	160	QFP	SQUARE	PLASTIC/EPOXY	YES	YES	3.6 V			28	32		FLATPACK		3 V	85 Cel			-40 Cel	TIN	QUAD	3.85 mm			28 mm		YES	32	40 MHz	30	245	28 mm		CMOS		3.3 V					.65 mm	FIXED POINT	S-PQFP-G160	3		40 rpm	YES	e3
MCF5480CVR166	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	388	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.6 V				32		GRID ARRAY		3 V	85 Cel			-40 Cel	TIN SILVER COPPER	BOTTOM	2.55 mm			27 mm		YES		66.67 MHz	40	260	27 mm		CMOS		3.3 V					1 mm	FLOATING POINT	S-PBGA-B388	3	Not Qualified	166.66 rpm	YES	e1
MCF5232CVM100	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	196	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V			24	32		GRID ARRAY, LOW PROFILE		1.4 V	85 Cel			-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm			15 mm	LOW POWER MODE TAKEN FROM LOW POWER MODE	YES	32	75 MHz	40	260	15 mm		CMOS		1.5 V					1 mm	FIXED POINT	S-PBGA-B196	3	Not Qualified	100 rpm	YES	e1
MCF5407CAI162	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	GULL WING	208	QFP	SQUARE	PLASTIC/EPOXY		YES					32	3.3	FLATPACK	QFP208,1.2SQ,20		85 Cel			-40 Cel	TIN	QUAD									30	245			CMOS		3.3 V			Microprocessors		.5 mm		S-PQFP-G208	3	Not Qualified	162 rpm		e3
MCF5208CAB166	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	GULL WING	160	QFP	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V			24	32	1.5,1.8/3.3	FLATPACK	QFP160,1.2SQ	1.4 V	85 Cel			-40 Cel	TIN	QUAD	3.85 mm			28 mm		YES	32	40 MHz	40	260	28 mm		CMOS		1.5 V			Microprocessors		.65 mm	FIXED POINT	S-PQFP-G160	3	Not Qualified	166.67 rpm	YES	e3
MC9S08PT16VWJ	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	NO	YES	5.5 V			0	8	3/5	SMALL OUTLINE	SOP20,.4	2.7 V	105 Cel	HCS08		-40 Cel	TIN	DUAL		16384				NO	0	20 MHz	40	260		2048	CMOS	14 mA	5 V			Microcontrollers	FLASH	1.27 mm	FIXED POINT	R-PDSO-G20	3	Not Qualified	20 rpm	YES	e3
FS32V234CKN1VUB	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	621	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	8		0	64		GRID ARRAY, FINE PITCH	BGA621,25X25,25	.95 V	125 Cel		1	-40 Cel	TIN SILVER	BOTTOM	2.44 mm		4194304	17 mm		YES	0	40 MHz	40	260	17 mm		CMOS		1 V	32	0			.65 mm	FLOATING POINT	S-PBGA-B621	3		1000 rpm	YES	e2
MPC603EFE133TX	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	GULL WING	240	FQFP	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	3.465 V			32	32	3.3	FLATPACK, FINE PITCH	QFP240,1.3SQ,20	3.135 V	105 Cel			-40 Cel	TIN LEAD	QUAD	4.15 mm			32 mm	ALSO REQUIRES 3.3V I/O SUPPLY	YES	64	133.33 MHz			32 mm		CMOS		3.3 V			Microprocessors		.5 mm	FLOATING POINT	S-CQFP-G240		Not Qualified	133 rpm	YES	e0
MCF52277CVM166	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	196	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V			24	32	1.5,1.8,2.5,3.3	GRID ARRAY	BGA196,14X14,40	1.4 V	85 Cel			-40 Cel		BOTTOM	1.75 mm			15 mm		YES	32	66.67 MHz	NOT SPECIFIED	NOT SPECIFIED	15 mm		CMOS		1.5 V			Microprocessors		1 mm	FIXED POINT	S-PBGA-B196		Not Qualified	166.67 rpm	NO
MCF5274LCVM166	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	196	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V			24	32		GRID ARRAY, LOW PROFILE		1.4 V	85 Cel			-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm			15 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	83 MHz	40	260	15 mm		CMOS		1.5 V					1 mm	FIXED POINT	S-PBGA-B196	3	Not Qualified	166 rpm	YES	e1
LX2160XE72029B	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	.88 V			36	64		GRID ARRAY	BGA1517.39X39,40	.82 V	105 Cel		12	-40 Cel	TIN SILVER COPPER	BOTTOM	3.51 mm			40 mm		YES	128		30	245	40 mm		CMOS	.05 mA	.85 V		17			1 mm	FIXED POINT	S-PBGA-B1517	3		2000 rpm	YES	e1
MCF5483CVR166	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	388	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.6 V				32		GRID ARRAY		3 V	85 Cel			-40 Cel	TIN SILVER COPPER	BOTTOM	2.55 mm			27 mm		YES		66.67 MHz	40	260	27 mm		CMOS		3.3 V					1 mm	FLOATING POINT	S-PBGA-B388	3	Not Qualified	166.66 rpm	YES	e1
LX2160XE71826B	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	.88 V			36	64		GRID ARRAY	BGA1517.39X39,40	.82 V	105 Cel		12	-40 Cel	TIN SILVER COPPER	BOTTOM	3.51 mm			40 mm		YES	128		30	245	40 mm		CMOS	.05 mA	.85 V		17			1 mm	FIXED POINT	S-PBGA-B1517	3		1800 rpm	YES	e1
MCF53014CMJ240J	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V			24	32		GRID ARRAY		1.08 V	85 Cel			-40 Cel	TIN SILVER COPPER	BOTTOM						YES	32	80 MHz	40	260			CMOS								FIXED POINT	S-PBGA-B256	3	Not Qualified	240 rpm	YES	e1
MCF5271CVM150	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	196	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V			24	32		GRID ARRAY, LOW PROFILE		1.4 V	85 Cel			-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm			15 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	75 MHz	40	260	15 mm		CMOS		1.5 V					1 mm	FIXED POINT	S-PBGA-B196	3	Not Qualified	150 rpm	YES	e1
MC68SEC000CAA20	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	GULL WING	64	QFP	SQUARE	PLASTIC/EPOXY		YES					32	5	FLATPACK	QFP64,.66SQ,32		85 Cel			-40 Cel	TIN	QUAD									40	260			CMOS	70 mA	5 V			Microprocessors		.8 mm		S-PQFP-G64	3	Not Qualified	20 rpm		e3
MC68SEC000CAA10	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	GULL WING	64	QFP	SQUARE	PLASTIC/EPOXY		YES					32	5	FLATPACK	QFP64,.66SQ,32		85 Cel			-40 Cel	TIN	QUAD									40	260			CMOS	30 mA	5 V			Microprocessors		.8 mm		S-PQFP-G64	3	Not Qualified	10 rpm		e3
MCF53012CQT240	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	GULL WING	208	QFP	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V			24			FLATPACK		1.08 V	85 Cel			-40 Cel		QUAD						YES	32	48 MHz					CMOS								FIXED POINT	S-PQFP-G208			240 rpm	YES
MCF53014CMJ240	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V			24			GRID ARRAY		1.08 V	85 Cel			-40 Cel		BOTTOM						YES	32	48 MHz					CMOS								FIXED POINT	S-PBGA-B256			240 rpm	YES
MC9S08PT8VWJ	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	NO	YES	5.5 V			0	8	3/5	SMALL OUTLINE	SOP20,.4	2.7 V	105 Cel	HCS08		-40 Cel	TIN	DUAL		8192				NO	0	20 MHz	40	260		2048	CMOS	14 mA	5 V			Microcontrollers	FLASH	1.27 mm	FIXED POINT	R-PDSO-G20	3	Not Qualified	20 rpm	YES	e3
MPC603ERX133TX	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	255	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	3.465 V			32	32	3.3	GRID ARRAY	BGA255,16X16,50	3.135 V	105 Cel			-40 Cel	TIN LEAD	BOTTOM	3 mm			21 mm	ALSO REQUIRES 3.3V I/O SUPPLY	YES	64	133.33 MHz			21 mm		CMOS		3.3 V			Microprocessors		1.27 mm	FLOATING POINT	S-CBGA-B255		Not Qualified	133 rpm	YES	e0
LX2120XN71826B	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	.88 V			36	64		GRID ARRAY	BGA1517.39X39,40	.82 V	105 Cel		12	-40 Cel	TIN SILVER COPPER	BOTTOM	3.51 mm			40 mm		YES	128		30	245	40 mm		CMOS	.05 mA	.85 V		17			1 mm	FIXED POINT	S-PBGA-B1517	3		1800 rpm	YES	e1
MC68SEC000CPB20	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	GULL WING	64	FQFP	SQUARE	PLASTIC/EPOXY	NO	YES				24	32		FLATPACK, FINE PITCH			85 Cel			-40 Cel		QUAD				10 mm	CAN ALSO OPERATE WITH 5V SUPPLY		16	20 MHz			10 mm		CMOS		3.3 V					.5 mm	FIXED POINT	S-PQFP-G64		Not Qualified	20 rpm	YES
MCF5234CVM100	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V			24	32		GRID ARRAY, LOW PROFILE		1.4 V	85 Cel			-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm			17 mm	LOW POWER MODE TAKEN FROM LOW POWER MODE	YES	32	75 MHz	40	260	17 mm		CMOS		1.5 V					1 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	100 rpm	YES	e1
FS32V234BMN1VUB	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	621	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	8	AEC-Q100	0	64		GRID ARRAY, FINE PITCH	BGA621,25X25,25	.95 V	125 Cel		1	-40 Cel	TIN SILVER	BOTTOM	2.44 mm		4194304	17 mm		YES	0	40 MHz	40	260	17 mm		CMOS		1 V	32	0			.65 mm	FLOATING POINT	S-PBGA-B621	3		800 rpm	YES	e2
MC9S08PT8VTJ	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	GULL WING	20	TSSOP	RECTANGULAR	PLASTIC/EPOXY		YES					8	3/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP20,.25		105 Cel	HCS08		-40 Cel	TIN	DUAL		8192							40	260		2048	CMOS	14 mA				Microcontrollers	FLASH	.635 mm		R-PDSO-G20	3	Not Qualified	20 rpm		e3
LX2120XC72029B	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	.88 V			36	64		GRID ARRAY	BGA1517.39X39,40	.82 V	105 Cel		12	-40 Cel	TIN SILVER COPPER	BOTTOM	3.51 mm			40 mm		YES	128		30	245	40 mm		CMOS	.05 mA	.85 V		17			1 mm	FIXED POINT	S-PBGA-B1517	3		2000 rpm	YES	e1
MCF54450ACVM180	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES				14	32	1.5,1.8,2.5,3.3	GRID ARRAY, LOW PROFILE	BGA256,16X16,40		85 Cel			-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm			17 mm		YES	16		40	260	17 mm		CMOS					Microprocessors		1 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	180 rpm	YES	e1
MC68SEC000CAA16	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	GULL WING	64	QFP	SQUARE	PLASTIC/EPOXY		YES					32	5	FLATPACK	QFP64,.66SQ,32		85 Cel			-40 Cel	TIN	QUAD									40	260			CMOS	50 mA	5 V			Microprocessors		.8 mm		S-PQFP-G64	3	Not Qualified	16.67 rpm		e3
MCF53010CQT240	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	GULL WING	208	QFP	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V			24			FLATPACK		1.08 V	85 Cel			-40 Cel		QUAD						YES	32	48 MHz					CMOS								FIXED POINT	S-PQFP-G208			240 rpm	YES
MC68330CFE8V	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	GULL WING	132	BQFP	SQUARE	PLASTIC/EPOXY	NO	YES	3.6 V			32	32		FLATPACK, BUMPER		3 V	85 Cel			-40 Cel		QUAD	4.57 mm			24.13 mm		YES	16	8.39 MHz			24.13 mm		HCMOS		3.3 V					.635 mm	FIXED POINT	S-PQFP-G132		Not Qualified	8.39 rpm	YES
MC68SEC000CPB16	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	GULL WING	64	FQFP	SQUARE	PLASTIC/EPOXY	NO	YES				24	32		FLATPACK, FINE PITCH			85 Cel			-40 Cel		QUAD				10 mm	CAN ALSO OPERATE WITH 5V SUPPLY		16	16 MHz			10 mm		CMOS		3.3 V					.5 mm	FIXED POINT	S-PQFP-G64		Not Qualified	16 rpm	YES

Microprocessors

A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.

Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.

Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.

One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.