INDUSTRIAL Microprocessors 1,818

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	No. of External Interrupts	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Maximum Supply Current	Nominal Supply Voltage	No. of DMA Channels	No. of Serial I/Os	Sub-Category	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	Low Power Mode	JESD-609 Code
T2081NXN8PTB	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.055 V	16			GRID ARRAY, FINE PITCH		.995 V	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm	23 mm		YES	64		30	250	23 mm	CMOS		1.025 V				.8 mm	FIXED POINT	S-PBGA-B780	3		1533 rpm	YES	e1
MPC8541ECPXAPF	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	783	HBGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1.26 V	64	32		GRID ARRAY, HEAT SINK/SLUG		1.14 V	105 Cel		-40 Cel		BOTTOM	3.75 mm	29 mm		YES	64	166 MHz			29 mm	CMOS		1.2 V				1 mm	FLOATING POINT	R-PBGA-B783		Not Qualified	833 rpm	YES
MPC8572ECVJAULE	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	1023	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.155 V	16	32		GRID ARRAY		1.045 V	105 Cel		-40 Cel	TIN SILVER	BOTTOM	3.38 mm	33 mm		YES	64	133 MHz	30	245	33 mm	CMOS		1.1 V				1 mm	FIXED POINT	S-PBGA-B1023	3		1333 rpm	YES	e2
MPC8314ECVRAFDA	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	620	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		32	1,3.3	GRID ARRAY, HEAT SINK/SLUG	BGA620,28X28,40	.95 V	105 Cel		-40 Cel	TIN SILVER	BOTTOM	2.46 mm	29 mm		YES		66.67 MHz	40	260	29 mm	CMOS		1 V			Microprocessors	1 mm	FLOATING POINT	S-PBGA-B620	3	Not Qualified	333 rpm	YES	e2
MPC8541CVTALF	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	783	HBGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1.26 V	64	32		GRID ARRAY, HEAT SINK/SLUG		1.14 V	105 Cel		-40 Cel		BOTTOM	3.75 mm	29 mm		YES	64	166 MHz			29 mm	CMOS		1.2 V				1 mm	FLOATING POINT	R-PBGA-B783		Not Qualified	667 rpm	YES
MPC8347ECVVALDB	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	672	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	32	32		GRID ARRAY, LOW PROFILE		1.14 V	105 Cel		-40 Cel		BOTTOM	1.69 mm	35 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66 MHz			35 mm	CMOS		1.2 V				1 mm	FLOATING POINT	S-PBGA-B672		Not Qualified	667 rpm	YES
MPC8347ECZUADD	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	672	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	32	32	1.2,2.5,3.3	GRID ARRAY, LOW PROFILE	BGA672,34X34,40	1.14 V	105 Cel		-40 Cel	TIN LEAD	BOTTOM	1.69 mm	35 mm		YES	32	66 MHz			35 mm	CMOS		1.2 V			Microprocessors	1 mm	FLOATING POINT	S-PBGA-B672		Not Qualified	266 rpm	YES	e0
MPC8264ACZUPIB	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	480	BGA	SQUARE	PLASTIC/EPOXY		YES			32	2,3.3	GRID ARRAY	BGA480,29X29,50		105 Cel		-40 Cel		BOTTOM										CMOS					Microprocessors	1.27 mm		S-PBGA-B480		Not Qualified	266 rpm
MPC8541CVTALD	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	783	HBGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1.26 V	64	32		GRID ARRAY, HEAT SINK/SLUG		1.14 V	105 Cel		-40 Cel		BOTTOM	3.75 mm	29 mm		YES	64	166 MHz			29 mm	CMOS		1.2 V				1 mm	FLOATING POINT	R-PBGA-B783		Not Qualified	667 rpm	YES
MPC8555ECVTAQFX	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.35 V	64	32		GRID ARRAY		1.25 V	105 Cel		-40 Cel		BOTTOM	3.75 mm	29 mm		YES	64	166 MHz			29 mm	CMOS		1.3 V				1 mm	FLOATING POINT	S-PBGA-B783		Not Qualified	1000 rpm	YES
MPC8347CZUAJDB	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	672	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	32	32	1.2	GRID ARRAY, LOW PROFILE	BGA672,34X34,40	1.14 V	105 Cel		-40 Cel	TIN LEAD	BOTTOM	1.69 mm	35 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66 MHz	40	260	35 mm	CMOS		1.2 V			Microprocessors	1 mm	FLOATING POINT	S-PBGA-B672	3	Not Qualified	533 rpm	YES	e0
MPC8541ECPXAKF	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	783	HBGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1.26 V	64	32		GRID ARRAY, HEAT SINK/SLUG		1.14 V	105 Cel		-40 Cel		BOTTOM	3.75 mm	29 mm		YES	64	166 MHz			29 mm	CMOS		1.2 V				1 mm	FLOATING POINT	R-PBGA-B783		Not Qualified	600 rpm	YES
MPC8555CVTALDX	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	64	32		GRID ARRAY		1.14 V	105 Cel		-40 Cel		BOTTOM	3.75 mm	29 mm		YES	64	166 MHz			29 mm	CMOS		1.2 V				1 mm	FLOATING POINT	S-PBGA-B783		Not Qualified	667 rpm	YES
MPC8560CVT667FC	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	64	32		GRID ARRAY		1.14 V	105 Cel		-40 Cel		BOTTOM	3.75 mm	29 mm		YES	64	166 MHz			29 mm	CMOS		1.2 V				1 mm	FIXED POINT	S-PBGA-B783		Not Qualified	667 rpm	YES
MPC8555ECPXAPF	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	15	32		GRID ARRAY		1.14 V	105 Cel		-40 Cel		BOTTOM	3.75 mm	29 mm		YES	64				29 mm	CMOS		1.2 V				1 mm	FIXED POINT	S-PBGA-B783		Not Qualified	833 rpm	YES
MPC8555ECPXAKDX	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	64	32		GRID ARRAY		1.14 V	105 Cel		-40 Cel		BOTTOM	3.75 mm	29 mm		YES	64	166 MHz			29 mm	CMOS		1.2 V				1 mm	FLOATING POINT	S-PBGA-B783		Not Qualified	600 rpm	YES
MPC8572ECLVJATLE	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	1023	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.155 V	16	32		GRID ARRAY		1.045 V	105 Cel		-40 Cel		BOTTOM	3.38 mm	33 mm		YES	64	133 MHz			33 mm	CMOS		1.1 V				1 mm	FIXED POINT	S-PBGA-B1023			1200 rpm	YES
T1040NXN7WQA	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V	16	64		GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.97 V	105 Cel	12	-40 Cel		BOTTOM	2.07 mm	23 mm		YES	64				23 mm	CMOS		1 V	8			.8 mm	FIXED POINT	S-PBGA-B780			1500 rpm	YES
MPC8555ECVTAJEX	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	64	32		GRID ARRAY		1.14 V	105 Cel		-40 Cel		BOTTOM	3.75 mm	29 mm		YES	64	166 MHz			29 mm	CMOS		1.2 V				1 mm	FLOATING POINT	S-PBGA-B783		Not Qualified	533 rpm	YES
P1010NXN5DFA	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	425	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	16		1	GRID ARRAY, FINE PITCH	BGA425,23X23,32	.95 V	105 Cel	4	-40 Cel	Tin/Silver (Sn/Ag)	BOTTOM	1.9 mm	19 mm		YES	32		40	260	19 mm	CMOS		1 V	4		Microprocessors	.8 mm	FIXED POINT	S-PBGA-B425	3	Not Qualified	533 rpm	NO	e2
MPC8245TZU333D	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	352	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	2.1 V	32	32	2,3.3	GRID ARRAY, LOW PROFILE	BGA352,26X26,50	1.9 V	105 Cel		-40 Cel	TIN LEAD	BOTTOM	1.65 mm	35 mm		YES	32	66 MHz	30	220	35 mm	CMOS		2 V			Microprocessors	1.27 mm	FLOATING POINT	S-PBGA-B352	3	Not Qualified	333 rpm	YES	e0
MPC8349CZUAGFB	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	672	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	32	32	1.2,1.8/2.5,2.5/3.3	GRID ARRAY, LOW PROFILE	BGA672,34X34,40	1.14 V	105 Cel		-40 Cel		BOTTOM	1.69 mm	35 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66 MHz			35 mm	CMOS		1.2 V			Microprocessors	1 mm	FLOATING POINT	S-PBGA-B672		Not Qualified	400 rpm	YES
T1023NXN7MQA	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	525	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V	16	64		GRID ARRAY, FINE PITCH	BGA525,23X23,32	.97 V	105 Cel	6	-40 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm	19 mm		YES	32		40	260	19 mm	CMOS	5 mA	1 V	2	5		.8 mm	FIXED POINT	S-PBGA-B525	3		1200 rpm	YES	e1
MPC850DECVR50BU	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.6 V	26	32	3.3	GRID ARRAY	BGA256,16X16,50	3 V	95 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	2.54 mm	23 mm		YES	32		40	260	23 mm	CMOS		3.3 V			Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	50 rpm	YES	e1
MPC850SRCVR50BU	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.6 V	26	32	3.3	GRID ARRAY	BGA256,16X16,50	3 V	95 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	2.54 mm	23 mm		YES	32		40	260	23 mm	CMOS		3.3 V			Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	50 rpm	YES	e1
MC8640TVJ1067NC	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	1023	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1 V	16	32		GRID ARRAY		.9 V	105 Cel		-40 Cel		BOTTOM	2.77 mm	33 mm		YES	64	166.66 MHz			33 mm	CMOS		.95 V				1 mm	FLOATING POINT	S-CBGA-B1023			1067 rpm	YES
MPC866PCZP100A	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V	32	32	1.8,3.3	GRID ARRAY	BGA357,19X19,50	1.7 V	100 Cel		-40 Cel	TIN LEAD SILVER	BOTTOM	2.52 mm	25 mm		YES	32		30	220	25 mm	CMOS		1.8 V			Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B357	3	Not Qualified	100 rpm	YES	e0
MPC862PCZQ80B	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.465 V	32	32		GRID ARRAY		3.135 V	105 Cel		-40 Cel	Tin/Lead/Silver (Sn/Pb/Ag)	BOTTOM	2.52 mm	25 mm		YES	32		30	245	25 mm	CMOS		3.3 V				1.27 mm	FIXED POINT	S-PBGA-B357	3		80 rpm	YES	e0
MC9328MX21SCVM	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.65 V	26	32		GRID ARRAY, LOW PROFILE, FINE PITCH		1.45 V	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.5 mm	17 mm		YES	32	32 MHz	40	260	17 mm	CMOS		1.5 V				.8 mm	FIXED POINT	S-PBGA-B289	3	Not Qualified	266 rpm	YES	e1
P1010CXN5HFA	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	425	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	16			GRID ARRAY, FINE PITCH	BGA425,23X23,32	.95 V	105 Cel	4	-40 Cel		BOTTOM	1.9 mm	19 mm		YES	32				19 mm	CMOS		1 V	4			.8 mm	FIXED POINT	S-PBGA-B425			800 rpm	NO
MPC8540CVT667LC	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	64	32		GRID ARRAY		1.14 V	105 Cel		-40 Cel		BOTTOM	3.85 mm	29 mm		YES	64	166 MHz			29 mm	CMOS		1.2 V				1 mm	FIXED POINT	S-PBGA-B783		Not Qualified	667 rpm	YES
P1010NXN5FFA	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	425	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	16		1	GRID ARRAY, FINE PITCH	BGA425,23X23,32	.95 V	105 Cel	4	-40 Cel	Tin/Silver (Sn/Ag)	BOTTOM	1.9 mm	19 mm		YES	32		40	260	19 mm	CMOS		1 V	4		Microprocessors	.8 mm	FIXED POINT	S-PBGA-B425	3	Not Qualified	667 rpm	NO	e2
T1040NXN7PQA	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V	16	64		GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.97 V	105 Cel	12	-40 Cel		BOTTOM	2.07 mm	23 mm		YES	64				23 mm	CMOS		1 V	8			.8 mm	FIXED POINT	S-PBGA-B780			1400 rpm	YES
MPC8555CPXALEX	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	64	32		GRID ARRAY		1.14 V	105 Cel		-40 Cel		BOTTOM	3.75 mm	29 mm		YES	64	166 MHz			29 mm	CMOS		1.2 V				1 mm	FLOATING POINT	S-PBGA-B783		Not Qualified	667 rpm	YES
MC9328MXSCVP10	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	225	LFBGA	SQUARE	PLASTIC/EPOXY	NO	YES	1.9 V	25	32		GRID ARRAY, LOW PROFILE, FINE PITCH		1.7 V	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	13 mm		YES	32	16 MHz	40	260	13 mm	CMOS		1.8 V				.8 mm	FIXED POINT	S-PBGA-B225	3	Not Qualified	100 rpm	YES	e1
MPC8349CZUALDB	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	672	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	32	32	1.3,1.8/2.5,2.5/3.3	GRID ARRAY, LOW PROFILE	BGA672,34X34,40	1.14 V	105 Cel		-40 Cel		BOTTOM	1.69 mm	35 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66 MHz			35 mm	CMOS		1.2 V			Microprocessors	1 mm	FLOATING POINT	S-PBGA-B672		Not Qualified	667 rpm	YES
P2041NXE7NNC	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.89 V	16	32		GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	1.71 V	105 Cel	12	-40 Cel	TIN SILVER COPPER	BOTTOM	2.51 mm	23 mm	ALSO OPERATES WITH 2.5V NOM AND 3.3V NOM SUPPLY	YES	64	133 MHz	30	245	23 mm	CMOS		1.8 V	4	24		.8 mm	FIXED POINT	S-PBGA-B780	3		1333 rpm	YES	e1
MPC8347ECZQAGFA	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	620	BGA	SQUARE	PLASTIC/EPOXY		YES			32	1.2,2.5,3.3	GRID ARRAY	BGA620,28X28,40		105 Cel		-40 Cel		BOTTOM										CMOS					Microprocessors	1 mm		S-PBGA-B620		Not Qualified	400 rpm
MC8640DTVJ1250HC	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	1023	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.1 V	16	32		GRID ARRAY		1 V	105 Cel		-40 Cel		BOTTOM	2.77 mm	33 mm		YES	64	166.66 MHz			33 mm	CMOS		1.05 V				1 mm	FLOATING POINT	S-CBGA-B1023			1250 rpm	YES
MPC8535CVJAKGA	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	16	32		GRID ARRAY		.95 V	105 Cel		-40 Cel		BOTTOM	2.76 mm	29 mm		YES	64				29 mm	CMOS		1 V				1 mm	FIXED POINT	S-PBGA-B783			600 rpm	YES
MPC8555CPXAPFX	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	64	32		GRID ARRAY		1.14 V	105 Cel		-40 Cel		BOTTOM	3.75 mm	29 mm		YES	64	166 MHz			29 mm	CMOS		1.2 V				1 mm	FLOATING POINT	S-PBGA-B783		Not Qualified	833 rpm	YES
MPC8280CVRMIBX	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V	32	32		GRID ARRAY		1.45 V	105 Cel		-40 Cel		BOTTOM	2.55 mm	27 mm		YES	64	66.67 MHz			27 mm	CMOS		1.5 V				1 mm	FLOATING POINT	S-PBGA-B516		Not Qualified	266 rpm	NO
MPC8349CZUALD	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	672	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	32	32	1.2,2.5/3.3	GRID ARRAY, LOW PROFILE	BGA672,34X34,40	1.14 V	105 Cel		-40 Cel		BOTTOM	1.69 mm	35 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66 MHz			35 mm	CMOS		1.2 V			Microprocessors	1 mm	FIXED POINT	S-PBGA-B672	1	Not Qualified	667 rpm	YES
MC8640DTVU1067NC	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	1023	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1 V	32	32		GRID ARRAY		.9 V	105 Cel		-40 Cel	TIN SILVER	BOTTOM	2.97 mm	33 mm		YES	32	166.66 MHz	30	245	33 mm	CMOS		.95 V				1 mm	FLOATING POINT	S-CBGA-B1023	3	Not Qualified	1067 rpm	YES	e2
MPC8572ECLVJARLE	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	1023	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.155 V	16	32		GRID ARRAY		1.045 V	105 Cel		-40 Cel		BOTTOM	3.38 mm	33 mm		YES	64	133 MHz			33 mm	CMOS		1.1 V				1 mm	FIXED POINT	S-PBGA-B1023			1067 rpm	YES
MPC8560CVT667JC	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	64	32		GRID ARRAY		1.14 V	105 Cel		-40 Cel	TIN SILVER	BOTTOM	3.85 mm	29 mm		YES	64	166 MHz	40	260	29 mm	CMOS		1.2 V				1 mm	FIXED POINT	S-PBGA-B783	3	Not Qualified	667 rpm	YES	e2
T2081NXN8TTB	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.055 V	16			GRID ARRAY, FINE PITCH		.995 V	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm	23 mm		YES	64		30	250	23 mm	CMOS		1.025 V				.8 mm	FIXED POINT	S-PBGA-B780	3		1800 rpm	YES	e1
MPC8347ECZQALF	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	620	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	32	32	1.2,2.5,3.3	GRID ARRAY	BGA620,28X28,40	1.14 V	105 Cel		-40 Cel	TIN LEAD	BOTTOM	2.46 mm	29 mm		YES	32	66 MHz			29 mm	CMOS		1.2 V			Microprocessors	1 mm	FLOATING POINT	S-PBGA-B620		Not Qualified	667 rpm	YES	e0

Microprocessors

A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.

Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.

Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.

One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.