INDUSTRIAL Microprocessors 1,818

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	Screening Level	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	No. of External Interrupts	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Maximum Supply Current	Nominal Supply Voltage	No. of DMA Channels	No. of Serial I/Os	Sub-Category	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	Low Power Mode	JESD-609 Code
MPC8347ECVRALF	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	620	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V		32	32	1.2,2.5,3.3	GRID ARRAY	BGA620,28X28,40	1.14 V	105 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	2.46 mm	29 mm		YES	32	66 MHz			29 mm	CMOS		1.2 V			Microprocessors	1 mm	FLOATING POINT	S-PBGA-B620		Not Qualified	667 rpm	YES	e1
MPC8560CVT833FB	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V		64	32		GRID ARRAY		1.14 V	105 Cel		-40 Cel		BOTTOM	3.75 mm	29 mm		YES	64	166 MHz			29 mm	CMOS		1.2 V				1 mm	FIXED POINT	S-PBGA-B783		Not Qualified	883 rpm	YES
P1010NXN5DHA	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	425	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		16			GRID ARRAY, FINE PITCH	BGA425,23X23,32	.95 V	105 Cel	4	-40 Cel		BOTTOM	1.9 mm	19 mm		YES	32				19 mm	CMOS		1 V	4			.8 mm	FIXED POINT	S-PBGA-B425			533 rpm	NO
MPC850DECVR66BU	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.6 V		26	32	3.3	GRID ARRAY	BGA256,16X16,50	3 V	95 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	2.54 mm	23 mm		YES	32		40	260	23 mm	CMOS		3.3 V			Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	66 rpm	YES	e1
MPC8347ECVVAGDA	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	672	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V		32	32	1.2,2.5,3.3	GRID ARRAY, LOW PROFILE	BGA672,34X34,40	1.14 V	105 Cel		-40 Cel		BOTTOM	1.69 mm	35 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66 MHz			35 mm	CMOS		1.2 V			Microprocessors	1 mm	FLOATING POINT	S-PBGA-B672		Not Qualified	400 rpm	YES
MPC8280CVRKHBX	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V		32	32		GRID ARRAY		1.45 V	105 Cel		-40 Cel		BOTTOM	2.55 mm	27 mm		YES	64	66.67 MHz			27 mm	CMOS		1.5 V				1 mm	FLOATING POINT	S-PBGA-B516		Not Qualified	233 rpm	NO
MPC8313ECZQADDC	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	516	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		15			GRID ARRAY, HEAT SINK/SLUG		.95 V	105 Cel		-40 Cel	TIN LEAD	BOTTOM	2.55 mm	27 mm		YES	32		40	260	27 mm	CMOS		1 V				1 mm	FLOATING POINT	S-PBGA-B516	3		266 rpm	YES	e0
MPC8347ECVRADFA	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	620	BGA	SQUARE	PLASTIC/EPOXY		YES				32	1.2,2.5,3.3	GRID ARRAY	BGA620,28X28,40		105 Cel		-40 Cel		BOTTOM										CMOS					Microprocessors	1 mm		S-PBGA-B620		Not Qualified	266 rpm
MPC8540CVT833LB	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V		64	32		GRID ARRAY		1.14 V	105 Cel		-40 Cel		BOTTOM	3.85 mm	29 mm		YES	64	166 MHz			29 mm	CMOS		1.2 V				1 mm	FIXED POINT	S-PBGA-B783		Not Qualified	667 rpm	YES
T1040NXN7MQA	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V		16	64		GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.97 V	105 Cel	12	-40 Cel		BOTTOM	2.07 mm	23 mm		YES	64				23 mm	CMOS		1 V	8			.8 mm	FIXED POINT	S-PBGA-B780			1200 rpm	YES
MPC8555ECPXAJDX	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V		64	32		GRID ARRAY		1.14 V	105 Cel		-40 Cel		BOTTOM	3.75 mm	29 mm		YES	64	166 MHz			29 mm	CMOS		1.2 V				1 mm	FLOATING POINT	S-PBGA-B783		Not Qualified	533 rpm	YES
MPC8555ECVTAPD	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V		15	32		GRID ARRAY		1.14 V	105 Cel		-40 Cel		BOTTOM	3.75 mm	29 mm		YES	64				29 mm	CMOS		1.2 V				1 mm	FIXED POINT	S-PBGA-B783		Not Qualified	833 rpm	YES
SPC5121YVY400B	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.47 V	AEC-Q100	0	32	1.4,3.3	GRID ARRAY	BGA516,26X26,40	1.33 V	85 Cel		-40 Cel	TIN SILVER	BOTTOM	2.55 mm	27 mm		YES	0		40	260	27 mm	CMOS		1.4 V			Microprocessors	1 mm	FIXED POINT	S-PBGA-B516	3	Not Qualified	400 rpm	YES	e2
MC9328MX21CVM	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.65 V		26	32		GRID ARRAY, LOW PROFILE, FINE PITCH		1.45 V	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	17 mm	ALSO REQUIRES 3.3 V I/O SUPPLY; UNAVAILABLE FOR IMPORT OR SALE IN US	YES	32	32 MHz	40	260	17 mm	CMOS		1.5 V				.8 mm	FIXED POINT	S-PBGA-B289	3	Not Qualified	266 rpm	YES	e1
P1010CXN5DFB	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	425	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		16			GRID ARRAY, FINE PITCH	BGA425,23X23,32	.95 V	105 Cel	4	-40 Cel		BOTTOM	1.9 mm	19 mm		YES	32				19 mm	CMOS		1 V	4			.8 mm	FIXED POINT	S-PBGA-B425			533 rpm	NO
MPC8541CPXAKD	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	783	HBGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1.26 V		64	32		GRID ARRAY, HEAT SINK/SLUG		1.14 V	105 Cel		-40 Cel		BOTTOM	3.75 mm	29 mm		YES	64	166 MHz			29 mm	CMOS		1.2 V				1 mm	FLOATING POINT	R-PBGA-B783		Not Qualified	600 rpm	YES
MPC8343ECVRAGDA	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	620	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V		32	32	1.2,2.5,3.3	GRID ARRAY	BGA620,28X28,40	1.14 V	105 Cel		-40 Cel		BOTTOM	2.46 mm	29 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66 MHz			29 mm	CMOS		1.2 V			Microprocessors	1 mm	FLOATING POINT	S-PBGA-B620		Not Qualified	400 rpm	YES
MPC8555ECVTAJE	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V		15	32		GRID ARRAY		1.14 V	105 Cel		-40 Cel		BOTTOM	3.75 mm	29 mm		YES	64				29 mm	CMOS		1.2 V				1 mm	FIXED POINT	S-PBGA-B783		Not Qualified	533 rpm	YES
MPC8347ECVRADFB	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	620	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V		32	32		GRID ARRAY		1.14 V	105 Cel		-40 Cel		BOTTOM	2.46 mm	29 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66 MHz			29 mm	CMOS		1.2 V				1 mm	FLOATING POINT	S-PBGA-B620		Not Qualified	266 rpm	YES
MPC8572ECLVJAVNE	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	1023	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.155 V		16	32		GRID ARRAY		1.045 V	105 Cel		-40 Cel		BOTTOM	3.38 mm	33 mm		YES	64	133 MHz			33 mm	CMOS		1.1 V				1 mm	FIXED POINT	S-PBGA-B1023			1500 rpm	YES
MPC8347ECZUAGF	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	672	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V		32	32	1.2,2.5,3.3	GRID ARRAY, LOW PROFILE	BGA672,34X34,40	1.14 V	105 Cel		-40 Cel	TIN LEAD	BOTTOM	1.69 mm	35 mm		YES	32	66 MHz			35 mm	CMOS		1.2 V			Microprocessors	1 mm	FLOATING POINT	S-PBGA-B672		Not Qualified	400 rpm	YES	e0
MPC862PCZP66B	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	357	BGA	SQUARE	PLASTIC/EPOXY		YES				32	3.3	GRID ARRAY	BGA357,19X19,50		115 Cel		-40 Cel		BOTTOM												3.3 V			Microprocessors	1.27 mm		S-PBGA-B357		Not Qualified	66 rpm
MPC8280CVRUPEX	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V		32	32		GRID ARRAY		1.45 V	105 Cel		-40 Cel		BOTTOM	2.55 mm	27 mm		YES	64	100 MHz			27 mm	CMOS		1.5 V				1 mm	FLOATING POINT	S-PBGA-B516		Not Qualified	450 rpm	NO
MPC8308CVMADDA	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	473	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		14			GRID ARRAY, LOW PROFILE, FINE PITCH		.95 V	105 Cel		-40 Cel	TIN SILVER	BOTTOM	1.54 mm	19 mm		YES	32		40	260	19 mm	CMOS		1 V				.8 mm	FLOATING POINT	S-PBGA-B473	3	Not Qualified	266 rpm	YES	e2
MC8640TVU1250HC	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	1023	BGA	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	YES	1.1 V		32	32		GRID ARRAY		1 V	105 Cel		-40 Cel	TIN SILVER	BOTTOM	2.97 mm	33 mm		YES	32	166.66 MHz	30	245	33 mm	CMOS		1.05 V				1 mm	FLOATING POINT	S-CBGA-B1023	3	Not Qualified	1250 rpm	YES	e2
MPC8255ACVVMHBB	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	480	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	2.7 V		32			GRID ARRAY, LOW PROFILE		2.4 V	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.65 mm	37.5 mm		YES	64		40	260	37.5 mm	CMOS		2.5 V				1.27 mm	FLOATING POINT	S-PBGA-B480	3		266 rpm	YES	e1
MPC8541ECVTAQF	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	783	HBGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1.35 V		64	32		GRID ARRAY, HEAT SINK/SLUG		1.25 V	105 Cel		-40 Cel		BOTTOM	3.75 mm	29 mm		YES	64	166 MHz			29 mm	CMOS		1.3 V				1 mm	FLOATING POINT	R-PBGA-B783		Not Qualified	1000 rpm	YES
MPC8347CZUALDB	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	672	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V		32	32		GRID ARRAY, LOW PROFILE		1.14 V	105 Cel		-40 Cel		BOTTOM	1.69 mm	35 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66 MHz			35 mm	CMOS		1.2 V				1 mm	FLOATING POINT	S-PBGA-B672		Not Qualified	667 rpm	YES
MPC8544ECVTANG	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		16	32		GRID ARRAY		.95 V	105 Cel		-40 Cel		BOTTOM	2.8 mm	29 mm		YES	64	133 MHz			29 mm	CMOS		1 V				1 mm	FLOATING POINT	S-PBGA-B783			800 rpm	YES
P1010CXE5DFA	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	425	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		16			GRID ARRAY, FINE PITCH	BGA425,23X23,32	.95 V	105 Cel	4	-40 Cel		BOTTOM	1.9 mm	19 mm		YES	32				19 mm	CMOS		1 V	4			.8 mm	FIXED POINT	S-PBGA-B425			533 rpm	NO
MPC8347ECVRAJD	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	620	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V		32	32	1.2,2.5,3.3	GRID ARRAY	BGA620,28X28,40	1.14 V	105 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	2.46 mm	29 mm		YES	32	66 MHz			29 mm	CMOS		1.2 V			Microprocessors	1 mm	FLOATING POINT	S-PBGA-B620		Not Qualified	533 rpm	YES	e1
P1010CXN5HHB	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	425	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		16			GRID ARRAY, FINE PITCH	BGA425,23X23,32	.95 V	105 Cel	4	-40 Cel		BOTTOM	1.9 mm	19 mm		YES	32				19 mm	CMOS		1 V	4			.8 mm	FIXED POINT	S-PBGA-B425			800 rpm	NO
P1010CXE5HHB	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	425	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		16			GRID ARRAY, FINE PITCH	BGA425,23X23,32	.95 V	105 Cel	4	-40 Cel		BOTTOM	1.9 mm	19 mm		YES	32				19 mm	CMOS		1 V	4			.8 mm	FIXED POINT	S-PBGA-B425			800 rpm	NO
MPC8313CVRAGDC	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	516	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		15			GRID ARRAY, HEAT SINK/SLUG		.95 V	105 Cel		-40 Cel	TIN SILVER	BOTTOM	2.55 mm	27 mm		YES	32		40	260	27 mm	CMOS		1 V				1 mm	FLOATING POINT	S-PBGA-B516	3		400 rpm	YES	e2
MPC8349ECVVAGF	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	672	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V		32	32	1.2,2.5/3.3	GRID ARRAY, LOW PROFILE	BGA672,34X34,40	1.14 V	105 Cel		-40 Cel		BOTTOM	1.69 mm	35 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66 MHz			35 mm	CMOS		1.2 V			Microprocessors	1 mm	FIXED POINT	S-PBGA-B672		Not Qualified	400 rpm	YES
MPC8349CVVAGF	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	672	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V		32	32	1.2,2.5/3.3	GRID ARRAY, LOW PROFILE	BGA672,34X34,40	1.14 V	105 Cel		-40 Cel		BOTTOM	1.69 mm	35 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66 MHz			35 mm	CMOS		1.2 V			Microprocessors	1 mm	FIXED POINT	S-PBGA-B672		Not Qualified	400 rpm	YES
T1013NXN7KQA	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	525	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V		16	64		GRID ARRAY, FINE PITCH	BGA525,23X23,32	.97 V	105 Cel	6	-40 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm	19 mm		YES	32		40	260	19 mm	CMOS	5 mA	1 V	2	5		.8 mm	FIXED POINT	S-PBGA-B525	3		1000 rpm	YES	e1
MPC8343CZQAGDB	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	620	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V		32	32	1.2,2.5,3.3	GRID ARRAY	BGA620,28X28,40	1.14 V	105 Cel		-40 Cel	TIN LEAD	BOTTOM	2.46 mm	29 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66 MHz	40	260	29 mm	CMOS		1.2 V			Microprocessors	1 mm	FLOATING POINT	S-PBGA-B620	3	Not Qualified	400 rpm	YES	e0
P1010CXE5KHA	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	425	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		16			GRID ARRAY, FINE PITCH	BGA425,23X23,32	.95 V	105 Cel	4	-40 Cel		BOTTOM	1.9 mm	19 mm		YES	32				19 mm	CMOS		1 V	4			.8 mm	FIXED POINT	S-PBGA-B425			1000 rpm	NO
MPC8347ECZQAJFB	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	620	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V		32	32		GRID ARRAY		1.14 V	105 Cel		-40 Cel		BOTTOM	2.46 mm	29 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66 MHz			29 mm	CMOS		1.2 V				1 mm	FLOATING POINT	S-PBGA-B620		Not Qualified	533 rpm	YES
MC8640DTVJ1000HE	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	1023	HBGA	SQUARE	CERAMIC	YES	YES	1.1 V		32	32		GRID ARRAY, HEAT SINK/SLUG	BGA1023,32X32,40	1 V	105 Cel		-40 Cel	TIN SILVER	BOTTOM	2.77 mm	33 mm		YES	32	166.66 MHz	30	245	33 mm	CMOS		1.05 V	4			1 mm	FLOATING POINT	S-CBGA-B1023	3		1000 rpm	NO	e2
T1023NXE7KQA	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	525	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V		16	64		GRID ARRAY, FINE PITCH	BGA525,23X23,32	.97 V	105 Cel	6	-40 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm	19 mm		YES	32		40	260	19 mm	CMOS	5 mA	1 V	2	5		.8 mm	FIXED POINT	S-PBGA-B525	3		1000 rpm	YES	e1
MPC8347ECVRAGFA	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	620	BGA	SQUARE	PLASTIC/EPOXY		YES				32	1.2,2.5,3.3	GRID ARRAY	BGA620,28X28,40		105 Cel		-40 Cel		BOTTOM										CMOS					Microprocessors	1 mm		S-PBGA-B620		Not Qualified	400 rpm
P1010CXN5KFA	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	425	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		16			GRID ARRAY, FINE PITCH	BGA425,23X23,32	.95 V	105 Cel	4	-40 Cel		BOTTOM	1.9 mm	19 mm		YES	32				19 mm	CMOS		1 V	4			.8 mm	FIXED POINT	S-PBGA-B425			1000 rpm	NO
T1040NXN7WQB	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V		16	64		GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.97 V	105 Cel	12	-40 Cel		BOTTOM	2.07 mm	23 mm		YES	64				23 mm	CMOS		1 V	8			.8 mm	FIXED POINT	S-PBGA-B780			1500 rpm	YES
MPC5200CBV400	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	272	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.58 V		32			GRID ARRAY		1.42 V	85 Cel		-40 Cel	TIN LEAD SILVER	BOTTOM	2.65 mm	27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	35 MHz	30	240	27 mm	CMOS		1.5 V				1.27 mm	FLOATING POINT	S-PBGA-B272	3	Not Qualified	400 rpm	YES	e0
MPC8347CVVADFB	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	672	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V		32	32		GRID ARRAY, LOW PROFILE		1.14 V	105 Cel		-40 Cel		BOTTOM	1.69 mm	35 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66 MHz			35 mm	CMOS		1.2 V				1 mm	FLOATING POINT	S-PBGA-B672		Not Qualified	266 rpm	YES
MPC8347ECZUALDB	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	672	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V		32	32		GRID ARRAY, LOW PROFILE		1.14 V	105 Cel		-40 Cel		BOTTOM	1.69 mm	35 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66 MHz			35 mm	CMOS		1.2 V				1 mm	FLOATING POINT	S-PBGA-B672		Not Qualified	667 rpm	YES

Microprocessors

A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.

Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.

Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.

One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.