INDUSTRIAL Microprocessors 1,818

Reset All

Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	Screening Level	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	No. of External Interrupts	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Maximum Supply Current	Nominal Supply Voltage	No. of DMA Channels	No. of Serial I/Os	Sub-Category	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	Low Power Mode	JESD-609 Code
MPC8314CVRAGDA	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	620	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V			32	1,3.3	GRID ARRAY, HEAT SINK/SLUG	BGA620,28X28,40	.95 V	105 Cel		-40 Cel	TIN SILVER	BOTTOM	2.46 mm	29 mm		YES		66.67 MHz	40	260	29 mm	CMOS		1 V			Microprocessors	1 mm	FLOATING POINT	S-PBGA-B620	3	Not Qualified	400 rpm	YES	e2
MPC8555ECVTAPDX	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V		64	32		GRID ARRAY		1.14 V	105 Cel		-40 Cel		BOTTOM	3.75 mm	29 mm		YES	64	166 MHz			29 mm	CMOS		1.2 V				1 mm	FLOATING POINT	S-PBGA-B783		Not Qualified	833 rpm	YES
P1010CXN5FFB	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	425	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		16			GRID ARRAY, FINE PITCH	BGA425,23X23,32	.95 V	105 Cel	4	-40 Cel		BOTTOM	1.9 mm	19 mm		YES	32				19 mm	CMOS		1 V	4			.8 mm	FIXED POINT	S-PBGA-B425			667 rpm	NO
MPC8255ACZUMIBB	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	480	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	2.7 V		32			GRID ARRAY, LOW PROFILE		2.4 V	105 Cel		-40 Cel	TIN LEAD	BOTTOM	1.65 mm	37.5 mm		YES	64				37.5 mm	CMOS		2.5 V				1.27 mm	FLOATING POINT	S-PBGA-B480	3		266 rpm	YES	e0
SPC5121YVY400BR	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.47 V	AEC-Q100	0	32	1.4,3.3	GRID ARRAY	BGA516,26X26,40	1.33 V	85 Cel		-40 Cel	TIN SILVER	BOTTOM	2.55 mm	27 mm		YES	0		40	260	27 mm	CMOS		1.4 V			Microprocessors	1 mm	FIXED POINT	S-PBGA-B516	3	Not Qualified	400 rpm	YES	e2
MPC8555CVTAJDX	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V		64	32		GRID ARRAY		1.14 V	105 Cel		-40 Cel		BOTTOM	3.75 mm	29 mm		YES	64	166 MHz			29 mm	CMOS		1.2 V				1 mm	FLOATING POINT	S-PBGA-B783		Not Qualified	533 rpm	YES
MPC8347ECVRAGF	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	620	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V		32	32	1.2,2.5,3.3	GRID ARRAY	BGA620,28X28,40	1.14 V	105 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	2.46 mm	29 mm		YES	32	66 MHz			29 mm	CMOS		1.2 V			Microprocessors	1 mm	FLOATING POINT	S-PBGA-B620		Not Qualified	400 rpm	YES	e1
MPC8349CVVALDB	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	672	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V		32	32	1.3,1.8/2.5,2.5/3.3	GRID ARRAY, LOW PROFILE	BGA672,34X34,40	1.14 V	105 Cel		-40 Cel		BOTTOM	1.69 mm	35 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66 MHz			35 mm	CMOS		1.2 V			Microprocessors	1 mm	FLOATING POINT	S-PBGA-B672		Not Qualified	667 rpm	YES
MPC8541ECPXAJF	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	783	HBGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1.26 V		64	32		GRID ARRAY, HEAT SINK/SLUG		1.14 V	105 Cel		-40 Cel		BOTTOM	3.75 mm	29 mm		YES	64	166 MHz			29 mm	CMOS		1.2 V				1 mm	FLOATING POINT	R-PBGA-B783		Not Qualified	533 rpm	YES
MPC8555ECPXALFX	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V		64	32		GRID ARRAY		1.14 V	105 Cel		-40 Cel		BOTTOM	3.75 mm	29 mm		YES	64	166 MHz			29 mm	CMOS		1.2 V				1 mm	FLOATING POINT	S-PBGA-B783		Not Qualified	667 rpm	YES
T2081NXE8PTB	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.055 V		16			GRID ARRAY, FINE PITCH		.995 V	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm	23 mm		YES	64		30	250	23 mm	CMOS		1.025 V				.8 mm	FIXED POINT	S-PBGA-B780	3		1533 rpm	YES	e1
MPC8555ECPXAJFX	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V		64	32		GRID ARRAY		1.14 V	105 Cel		-40 Cel		BOTTOM	3.75 mm	29 mm		YES	64	166 MHz			29 mm	CMOS		1.2 V				1 mm	FLOATING POINT	S-PBGA-B783		Not Qualified	533 rpm	YES
MPC8544ECVTAQG	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		16	32		GRID ARRAY		.95 V	105 Cel		-40 Cel		BOTTOM	2.8 mm	29 mm		YES	64	133 MHz			29 mm	CMOS		1 V				1 mm	FLOATING POINT	S-PBGA-B783			1000 rpm	YES
P1010CXN5HHA	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	425	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		16			GRID ARRAY, FINE PITCH	BGA425,23X23,32	.95 V	105 Cel	4	-40 Cel		BOTTOM	1.9 mm	19 mm		YES	32				19 mm	CMOS		1 V	4			.8 mm	FIXED POINT	S-PBGA-B425			800 rpm	NO
T1023NXN7PQA	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	525	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V		16	64		GRID ARRAY, FINE PITCH	BGA525,23X23,32	.97 V	105 Cel	6	-40 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm	19 mm		YES	32		40	260	19 mm	CMOS	5 mA	1 V	2	5		.8 mm	FIXED POINT	S-PBGA-B525	3		1400 rpm	YES	e1
MC8610TPX1066JB	NXP Semiconductors		INDUSTRIAL	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		16	32		GRID ARRAY		.95 V	105 Cel		-40 Cel	TIN LEAD	BOTTOM	2.7 mm	29 mm		YES	64		30	245	29 mm	CMOS		1 V				1 mm	FIXED POINT	S-PBGA-B783	3		1066 rpm	YES	e0
MPC8347CVVAJDB	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	672	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V		32	32	1.2	GRID ARRAY, LOW PROFILE	BGA672,34X34,40	1.14 V	105 Cel		-40 Cel	TIN SILVER	BOTTOM	1.69 mm	35 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66 MHz	40	260	35 mm	CMOS		1.2 V			Microprocessors	1 mm	FLOATING POINT	S-PBGA-B672	3	Not Qualified	533 rpm	YES	e2
MPC8555ECPXAJF	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V		15	32		GRID ARRAY		1.14 V	105 Cel		-40 Cel		BOTTOM	3.75 mm	29 mm		YES	64				29 mm	CMOS		1.2 V				1 mm	FIXED POINT	S-PBGA-B783		Not Qualified	533 rpm	YES
MPC8541ECPXAQE	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	783	HBGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1.35 V		64	32		GRID ARRAY, HEAT SINK/SLUG		1.25 V	105 Cel		-40 Cel		BOTTOM	3.75 mm	29 mm		YES	64	166 MHz			29 mm	CMOS		1.3 V				1 mm	FLOATING POINT	R-PBGA-B783		Not Qualified	1000 rpm	YES
MC8640TVJ1250HE	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	1023	HBGA	SQUARE	CERAMIC	YES	YES	1.1 V		32	32		GRID ARRAY, HEAT SINK/SLUG	BGA1023,32X32,40	1 V	105 Cel		-40 Cel	TIN SILVER	BOTTOM	2.77 mm	33 mm		YES	32	166.66 MHz	30	245	33 mm	CMOS		1.05 V	4			1 mm	FLOATING POINT	S-CBGA-B1023	3		1250 rpm	NO	e2
T2081NXE8TTB	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.055 V		16			GRID ARRAY, FINE PITCH		.995 V	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm	23 mm		YES	64		30	250	23 mm	CMOS		1.025 V				.8 mm	FIXED POINT	S-PBGA-B780	3		1800 rpm	YES	e1
MPC8541CVTAPD	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	783	HBGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1.26 V		64	32		GRID ARRAY, HEAT SINK/SLUG		1.14 V	105 Cel		-40 Cel		BOTTOM	3.75 mm	29 mm		YES	64	166 MHz			29 mm	CMOS		1.2 V				1 mm	FLOATING POINT	R-PBGA-B783		Not Qualified	833 rpm	YES
MPC8347ECVRAGDA	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	620	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V		32	32	1.2,2.5,3.3	GRID ARRAY	BGA620,28X28,40	1.14 V	105 Cel		-40 Cel		BOTTOM	2.46 mm	29 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66 MHz			29 mm	CMOS		1.2 V			Microprocessors	1 mm	FLOATING POINT	S-PBGA-B620		Not Qualified	400 rpm	YES
MPC8260ACVVMIBB	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	480	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	2.7 V		32	32		GRID ARRAY, LOW PROFILE		2.4 V	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.65 mm	37.5 mm		YES	64		40	260	37.5 mm	CMOS		2.5 V				1.27 mm	FLOATING POINT	S-PBGA-B480	3		266 rpm	YES	e1
MPC8347ECZUALFA	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	672	BGA	SQUARE	PLASTIC/EPOXY		YES				32	1.2,2.5,3.3	GRID ARRAY	BGA672,34X34,40		105 Cel		-40 Cel		BOTTOM										CMOS					Microprocessors	1 mm		S-PBGA-B672		Not Qualified	667 rpm
MPC860PCZQ80D4	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES				32		GRID ARRAY			95 Cel		-40 Cel		BOTTOM						80 MHz				CMOS							FIXED POINT	S-PBGA-B357			80 rpm
LS1012AXE7EKA	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	NO LEAD	211	VFLGA	SQUARE	UNSPECIFIED	YES	YES	.93 V		16	64		GRID ARRAY, VERY THIN PROFILE, FINE PITCH		.87 V	105 Cel		-40 Cel		BOTTOM	.925 mm	9.6 mm		YES	16	25 MHz	40	260	9.6 mm	CMOS		.9 V				.5 mm	FIXED POINT	S-XBGA-N211	3		600 rpm	YES
MPC8572ECPXAULE	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	1023	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.155 V		16	32		GRID ARRAY		1.045 V	105 Cel		-40 Cel		BOTTOM	3.38 mm	33 mm		YES	64	133 MHz			33 mm	CMOS		1.1 V				1 mm	FIXED POINT	S-PBGA-B1023			1333 rpm	YES
MPC8555CVTAPFX	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V		64	32		GRID ARRAY		1.14 V	105 Cel		-40 Cel		BOTTOM	3.75 mm	29 mm		YES	64	166 MHz			29 mm	CMOS		1.2 V				1 mm	FLOATING POINT	S-PBGA-B783		Not Qualified	833 rpm	YES
MPC8555ECPXALD	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V		15	32		GRID ARRAY		1.14 V	105 Cel		-40 Cel		BOTTOM	3.75 mm	29 mm		YES	64				29 mm	CMOS		1.2 V				1 mm	FIXED POINT	S-PBGA-B783		Not Qualified	667 rpm	YES
MPC8347ECVVALFB	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	672	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V		32	32		GRID ARRAY, LOW PROFILE		1.14 V	105 Cel		-40 Cel		BOTTOM	1.69 mm	35 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66 MHz			35 mm	CMOS		1.2 V				1 mm	FLOATING POINT	S-PBGA-B672		Not Qualified	667 rpm	YES
MPC8347ECZUADF	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	672	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V		32	32	1.2,2.5,3.3	GRID ARRAY, LOW PROFILE	BGA672,34X34,40	1.14 V	105 Cel		-40 Cel	TIN LEAD	BOTTOM	1.69 mm	35 mm		YES	32	66 MHz			35 mm	CMOS		1.2 V			Microprocessors	1 mm	FLOATING POINT	S-PBGA-B672		Not Qualified	266 rpm	YES	e0
P1010CXN5FHA	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	425	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		16			GRID ARRAY, FINE PITCH	BGA425,23X23,32	.95 V	105 Cel	4	-40 Cel		BOTTOM	1.9 mm	19 mm		YES	32				19 mm	CMOS		1 V	4			.8 mm	FIXED POINT	S-PBGA-B425			667 rpm	NO
MPC8555CVTAQEX	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.35 V		64	32		GRID ARRAY		1.25 V	105 Cel		-40 Cel		BOTTOM	3.75 mm	29 mm		YES	64	166 MHz			29 mm	CMOS		1.3 V				1 mm	FLOATING POINT	S-PBGA-B783		Not Qualified	1000 rpm	YES
MPC8347ECVVAGF	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	672	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V		32	32	1.2,2.5,3.3	GRID ARRAY, LOW PROFILE	BGA672,34X34,40	1.14 V	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.69 mm	35 mm		YES	32	66 MHz			35 mm	CMOS		1.2 V			Microprocessors	1 mm	FLOATING POINT	S-PBGA-B672		Not Qualified	400 rpm	YES	e1
MPC8541CPXALD	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	783	HBGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1.26 V		64	32		GRID ARRAY, HEAT SINK/SLUG		1.14 V	105 Cel		-40 Cel		BOTTOM	3.75 mm	29 mm		YES	64	166 MHz			29 mm	CMOS		1.2 V				1 mm	FLOATING POINT	R-PBGA-B783		Not Qualified	667 rpm	YES
LS1012AXN7EKB	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	NO LEAD	211	VFLGA	SQUARE	UNSPECIFIED	YES	YES	.93 V		16	64		GRID ARRAY, VERY THIN PROFILE, FINE PITCH		.87 V	105 Cel		-40 Cel		BOTTOM	.925 mm	9.6 mm		YES	16	25 MHz	40	260	9.6 mm	CMOS		.9 V				.5 mm	FIXED POINT	S-XBGA-N211	3		600 rpm	YES
P1010CXN5FFA	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	425	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		16			GRID ARRAY, FINE PITCH	BGA425,23X23,32	.95 V	105 Cel	4	-40 Cel		BOTTOM	1.9 mm	19 mm		YES	32				19 mm	CMOS		1 V	4			.8 mm	FIXED POINT	S-PBGA-B425			667 rpm	NO
MPC8560CVT667FB	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V		64	32		GRID ARRAY		1.14 V	105 Cel		-40 Cel		BOTTOM	3.75 mm	29 mm		YES	64	166 MHz			29 mm	CMOS		1.2 V				1 mm	FIXED POINT	S-PBGA-B783		Not Qualified	667 rpm	YES
MPC8568CVTAUJJ	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	1023	BGA	SQUARE	PLASTIC/EPOXY		YES				32	1.1,1.8/2.5,2.5/3.3	GRID ARRAY	BGA1023,32X32,40		105 Cel		-45 Cel		BOTTOM															Microprocessors	1 mm		S-PBGA-B1023		Not Qualified	1333 rpm
MPC8555CVTAKDX	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V		64	32		GRID ARRAY		1.14 V	105 Cel		-40 Cel		BOTTOM	3.75 mm	29 mm		YES	64	166 MHz			29 mm	CMOS		1.2 V				1 mm	FLOATING POINT	S-PBGA-B783		Not Qualified	600 rpm	YES
T2081NXE8P1B	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.055 V		16			GRID ARRAY, FINE PITCH		.995 V	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm	23 mm		YES	64		30	250	23 mm	CMOS		1.025 V				.8 mm	FIXED POINT	S-PBGA-B780	3		1533 rpm	YES	e1
MPC8541ECVTAKD	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	783	HBGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1.26 V		64	32		GRID ARRAY, HEAT SINK/SLUG		1.14 V	105 Cel		-40 Cel		BOTTOM	3.75 mm	29 mm		YES	64	166 MHz			29 mm	CMOS		1.2 V				1 mm	FLOATING POINT	R-PBGA-B783		Not Qualified	600 rpm	YES
MPC8347CVRADFB	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	620	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V		32	32		GRID ARRAY		1.14 V	105 Cel		-40 Cel		BOTTOM	2.46 mm	29 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66 MHz			29 mm	CMOS		1.2 V				1 mm	FLOATING POINT	S-PBGA-B620		Not Qualified	266 rpm	YES
MPC8541CPXAPF	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	783	HBGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1.26 V		64	32		GRID ARRAY, HEAT SINK/SLUG		1.14 V	105 Cel		-40 Cel		BOTTOM	3.75 mm	29 mm		YES	64	166 MHz			29 mm	CMOS		1.2 V				1 mm	FLOATING POINT	R-PBGA-B783		Not Qualified	833 rpm	YES
MC9328MX21CVK	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.65 V		26	32		GRID ARRAY, LOW PROFILE, FINE PITCH		1.45 V	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.49 mm	14 mm	ALSO REQUIRES 3.3 V I/O SUPPLY; UNAVAILABLE FOR IMPORT OR SALE IN US	YES	32	32 MHz	40	260	14 mm	CMOS		1.5 V				.65 mm	FIXED POINT	S-PBGA-B289	3	Not Qualified	266 rpm	YES	e1
T2081NXE8T1B	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.055 V		16			GRID ARRAY, FINE PITCH		.995 V	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm	23 mm		YES	64		30	250	23 mm	CMOS		1.025 V				.8 mm	FIXED POINT	S-PBGA-B780	3		1800 rpm	YES	e1
MPC8541CVTALE	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	783	HBGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1.26 V		64	32		GRID ARRAY, HEAT SINK/SLUG		1.14 V	105 Cel		-40 Cel		BOTTOM	3.75 mm	29 mm		YES	64	166 MHz			29 mm	CMOS		1.2 V				1 mm	FLOATING POINT	R-PBGA-B783		Not Qualified	667 rpm	YES

Microprocessors

A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.

Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.

Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.

One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.