INDUSTRIAL Microprocessors 1,818

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	No. of External Interrupts	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	RAM Words	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Maximum Supply Current	Nominal Supply Voltage	No. of DMA Channels	No. of Serial I/Os	Sub-Category	Bus Compatibility	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	Low Power Mode	JESD-609 Code	No. of I/O Lines
MPC8245TZU300D	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	352	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V	32	32	2,3.3	GRID ARRAY, LOW PROFILE	BGA352,26X26,50	1.7 V	105 Cel		-40 Cel	TIN LEAD	BOTTOM	1.65 mm		35 mm	ALSO OPERATES AT 2V SUPPLY	YES	32	66 MHz	30	220	35 mm	CMOS		1.8 V			Microprocessors		1.27 mm	FLOATING POINT	S-PBGA-B352	3	Not Qualified	300 rpm	YES	e0
MPC8535CVJATH	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	16	32		GRID ARRAY		.95 V	105 Cel		-40 Cel		BOTTOM	2.76 mm		29 mm		YES	64				29 mm	CMOS		1 V					1 mm	FIXED POINT	S-PBGA-B783			1250 rpm	YES
MPC8544ECVTALF	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	16	32		GRID ARRAY		.95 V	105 Cel		-40 Cel		BOTTOM	2.8 mm		29 mm		YES	64	133 MHz			29 mm	CMOS		1 V					1 mm	FLOATING POINT	S-PBGA-B783			667 rpm	YES
MC8640DTVU1067NE	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	1023	HBGA	SQUARE	CERAMIC	YES	YES	1 V	32	32		GRID ARRAY, HEAT SINK/SLUG	BGA1023,32X32,40	.9 V	105 Cel		-40 Cel		BOTTOM	2.77 mm		33 mm		YES	32	166.66 MHz			33 mm	CMOS		.95 V	4				1 mm	FLOATING POINT	S-CBGA-B1023			1067 rpm	NO
P1010CXN5DHA	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	425	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	16			GRID ARRAY, FINE PITCH	BGA425,23X23,32	.95 V	105 Cel	4	-40 Cel		BOTTOM	1.9 mm		19 mm		YES	32				19 mm	CMOS		1 V	4				.8 mm	FIXED POINT	S-PBGA-B425			533 rpm	NO
MPC8555CPXAKFX	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	64	32		GRID ARRAY		1.14 V	105 Cel		-40 Cel		BOTTOM	3.75 mm		29 mm		YES	64	166 MHz			29 mm	CMOS		1.2 V					1 mm	FLOATING POINT	S-PBGA-B783		Not Qualified	600 rpm	YES
MPC8347ECZQADFA	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	620	BGA	SQUARE	PLASTIC/EPOXY		YES			32	1.2,2.5,3.3	GRID ARRAY	BGA620,28X28,40		105 Cel		-40 Cel		BOTTOM											CMOS					Microprocessors		1 mm		S-PBGA-B620		Not Qualified	266 rpm
P1010NXN5KHA	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	425	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	16		1	GRID ARRAY, FINE PITCH	BGA425,23X23,32	.95 V	105 Cel	4	-40 Cel	Tin/Silver (Sn/Ag)	BOTTOM	1.9 mm		19 mm		YES	32		40	260	19 mm	CMOS		1 V	4		Microprocessors		.8 mm	FIXED POINT	S-PBGA-B425	3	Not Qualified	1000 rpm	NO	e2
P1010NXE5FHB	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	425	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	16			GRID ARRAY, FINE PITCH	BGA425,23X23,32	.95 V	105 Cel	4	-40 Cel		BOTTOM	1.9 mm		19 mm		YES	32				19 mm	CMOS		1 V	4				.8 mm	FIXED POINT	S-PBGA-B425			667 rpm	NO
MPC857TCZP66B	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	357	BGA	SQUARE	PLASTIC/EPOXY		YES			32	3.3	GRID ARRAY	BGA357,19X19,50		115 Cel		-40 Cel		BOTTOM													3.3 V			Microprocessors		1.27 mm		S-PBGA-B357		Not Qualified	66 rpm
MC9328MX1CVM15	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	256	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V	25	32	1.8,1.8/3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA256,16X16,32	1.7 V	85 Cel		-40 Cel	TIN SILVER COPPER OVER NICKEL	BOTTOM	1.6 mm		14 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	16 MHz	40	260	14 mm	CMOS		1.8 V			Microprocessors		.8 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	150 rpm	YES
MPC8541ECPXAPE	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	783	HBGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1.26 V	64	32		GRID ARRAY, HEAT SINK/SLUG		1.14 V	105 Cel		-40 Cel		BOTTOM	3.75 mm		29 mm		YES	64	166 MHz			29 mm	CMOS		1.2 V					1 mm	FLOATING POINT	R-PBGA-B783		Not Qualified	833 rpm	YES
MPC8541ECVTAPD	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	783	HBGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1.26 V	64	32		GRID ARRAY, HEAT SINK/SLUG		1.14 V	105 Cel		-40 Cel		BOTTOM	3.75 mm		29 mm		YES	64	166 MHz			29 mm	CMOS		1.2 V					1 mm	FLOATING POINT	R-PBGA-B783		Not Qualified	833 rpm	YES
MPC8347ECZQAJD	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	620	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	32	32	1.2,2.5,3.3	GRID ARRAY	BGA620,28X28,40	1.14 V	105 Cel		-40 Cel	TIN LEAD	BOTTOM	2.46 mm		29 mm		YES	32	66 MHz			29 mm	CMOS		1.2 V			Microprocessors		1 mm	FLOATING POINT	S-PBGA-B620		Not Qualified	533 rpm	YES	e0
MPC8541ECVTAPE	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	783	HBGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1.26 V	64	32		GRID ARRAY, HEAT SINK/SLUG		1.14 V	105 Cel		-40 Cel		BOTTOM	3.75 mm		29 mm		YES	64	166 MHz			29 mm	CMOS		1.2 V					1 mm	FLOATING POINT	R-PBGA-B783		Not Qualified	833 rpm	YES
T2081NXN8MQB	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	780	BGA	SQUARE	PLASTIC/EPOXY	YES	YES			64		GRID ARRAY	BGA780(UNSPEC)		105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM					NO			30	250		CMOS								FIXED POINT	S-PBGA-B780	3		1200 rpm	NO	e1
MC8640THJ1000HE	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	1023	HBGA	SQUARE	CERAMIC	YES	YES	1.1 V	32	32		GRID ARRAY, HEAT SINK/SLUG	BGA1023,32X32,40	1 V	105 Cel		-40 Cel		BOTTOM	2.97 mm		33 mm		YES	32	166.66 MHz			33 mm	CMOS		1.05 V	4				1 mm	FLOATING POINT	S-CBGA-B1023			1000 rpm	NO
MPC8560CVT833LB	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	64	32		GRID ARRAY		1.14 V	105 Cel		-40 Cel		BOTTOM	3.75 mm		29 mm		YES	64	166 MHz			29 mm	CMOS		1.2 V					1 mm	FIXED POINT	S-PBGA-B783		Not Qualified	883 rpm	YES
MPC8572ECLVTAVNE	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	1023	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.155 V	16	32		GRID ARRAY		1.045 V	105 Cel		-40 Cel		BOTTOM	3.38 mm		33 mm		YES	64	133 MHz			33 mm	CMOS		1.1 V					1 mm	FIXED POINT	S-PBGA-B1023			1500 rpm	YES
MPC8555CPXALFX	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	64	32		GRID ARRAY		1.14 V	105 Cel		-40 Cel		BOTTOM	3.75 mm		29 mm		YES	64	166 MHz			29 mm	CMOS		1.2 V					1 mm	FLOATING POINT	S-PBGA-B783		Not Qualified	667 rpm	YES
MCIMX6L2EVN10AB	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	576	TFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V	16	32		GRID ARRAY, THIN PROFILE, FINE PITCH	BGA432,24X24,20	1.375 V	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.1 mm	16384	13 mm		YES	32		40	260	13 mm	CMOS	1100 mA					CAN; ETHERNET; IRDA; I2C; I2S; SPI; UART; USB	.5 mm	FIXED POINT	S-PBGA-B	3	Not Qualified	1000 rpm	YES	e1	162
MPC8347CVVAJFB	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	672	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	32	32	1.2	GRID ARRAY, LOW PROFILE	BGA672,34X34,40	1.14 V	105 Cel		-40 Cel	TIN SILVER	BOTTOM	1.69 mm		35 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66 MHz	40	260	35 mm	CMOS		1.2 V			Microprocessors		1 mm	FLOATING POINT	S-PBGA-B672	3	Not Qualified	533 rpm	YES	e2
MPC8555CPXAQFX	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.35 V	64	32		GRID ARRAY		1.25 V	105 Cel		-40 Cel		BOTTOM	3.75 mm		29 mm		YES	64	166 MHz			29 mm	CMOS		1.3 V					1 mm	FLOATING POINT	S-PBGA-B783		Not Qualified	1000 rpm	YES
MPC8572ECLVTARLE	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	1023	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.155 V	16	32		GRID ARRAY		1.045 V	105 Cel		-40 Cel		BOTTOM	3.38 mm		33 mm		YES	64	133 MHz			33 mm	CMOS		1.1 V					1 mm	FIXED POINT	S-PBGA-B1023			1067 rpm	YES
MPC8567CVTANGG	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	1023	BGA	SQUARE	PLASTIC/EPOXY		YES			32	1.1,1.8/2.5,2.5/3.3	GRID ARRAY	BGA1023,32X32,40		105 Cel		-45 Cel		BOTTOM																Microprocessors		1 mm		S-PBGA-B1023		Not Qualified	800 rpm
MPC8347CZUAGFB	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	672	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	32	32	1.2	GRID ARRAY, LOW PROFILE	BGA672,34X34,40	1.14 V	105 Cel		-40 Cel		BOTTOM	1.69 mm		35 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66 MHz			35 mm	CMOS		1.2 V			Microprocessors		1 mm	FLOATING POINT	S-PBGA-B672	1	Not Qualified	400 rpm	YES
MPC8313CZQAGD	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	516	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V	32	32	1,1.8/2.5,3.3	GRID ARRAY, HEAT SINK/SLUG	BGA516,26X26,40	.95 V	105 Cel		-40 Cel	TIN LEAD	BOTTOM	2.55 mm		27 mm	ALSO REQUIRES 3.3V I/O SUPPLY	YES	32	66.67 MHz			27 mm	CMOS		1 V			Microprocessors		1 mm	FLOATING POINT	S-PBGA-B516	3	Not Qualified	400 rpm	YES	e0
MPC850CVR50BU	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.6 V	26	32	3.3	GRID ARRAY	BGA256,16X16,50	3 V	95 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	2.54 mm		23 mm		YES	32		40	260	23 mm	CMOS		3.3 V			Microprocessors		1.27 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	50 rpm	YES	e1
MPC8343ECZQAGDB	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	620	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	32	32	1.2,2.5,3.3	GRID ARRAY	BGA620,28X28,40	1.14 V	105 Cel		-40 Cel	TIN LEAD	BOTTOM	2.46 mm		29 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66 MHz	40	260	29 mm	CMOS		1.2 V			Microprocessors		1 mm	FLOATING POINT	S-PBGA-B620	3	Not Qualified	400 rpm	YES	e0
MPC8272CVRTIEX	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.575 V	32	32		GRID ARRAY		1.425 V	105 Cel		-40 Cel		BOTTOM	2.55 mm		27 mm	ALSO REQUIRES 3.3V SUPPLY	YES	64	66 MHz			27 mm	CMOS		1.5 V					1 mm	FLOATING POINT	S-PBGA-B516		Not Qualified	400 rpm	NO
MPC859DSLCZP66A	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V	32	32	1.8,3.3	GRID ARRAY	BGA357,19X19,50	1.7 V	100 Cel		-40 Cel	Tin/Lead (Sn/Pb)	BOTTOM	2.52 mm		25 mm		YES	32		30	220	25 mm	CMOS		1.8 V			Microprocessors		1.27 mm	FIXED POINT	S-PBGA-B357	3	Not Qualified	66 rpm	YES	e0
MPC850DECZQ66BU	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.6 V	26	32	3.3	GRID ARRAY	BGA256,16X16,50	3 V	95 Cel		-40 Cel	TIN LEAD	BOTTOM	2.54 mm		23 mm		YES	32				23 mm	CMOS		3.3 V			Microprocessors		1.27 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	66 rpm	YES	e0
T1013NXE7MQA	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	525	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V	16	64		GRID ARRAY, FINE PITCH	BGA525,23X23,32	.97 V	105 Cel	6	-40 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm		19 mm		YES	32		40	260	19 mm	CMOS	5 mA	1 V	2	5			.8 mm	FIXED POINT	S-PBGA-B525	3		1200 rpm	YES	e1
MPC8349ECZUAGF	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	672	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	32	32	1.2,2.5/3.3	GRID ARRAY, LOW PROFILE	BGA672,34X34,40	1.14 V	105 Cel		-40 Cel		BOTTOM	1.69 mm		35 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66 MHz			35 mm	CMOS		1.2 V			Microprocessors		1 mm	FIXED POINT	S-PBGA-B672	1	Not Qualified	400 rpm	YES
MPC8535CVJAQGA	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	16	32		GRID ARRAY		.95 V	105 Cel		-40 Cel		BOTTOM	2.76 mm		29 mm		YES	64				29 mm	CMOS		1 V					1 mm	FIXED POINT	S-PBGA-B783			1000 rpm	YES
MPC8343ECZQAGDA	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	620	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	32	32	1.2,2.5,3.3	GRID ARRAY	BGA620,28X28,40	1.14 V	105 Cel		-40 Cel		BOTTOM	2.46 mm		29 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66 MHz			29 mm	CMOS		1.2 V			Microprocessors		1 mm	FLOATING POINT	S-PBGA-B620	1	Not Qualified	400 rpm	YES
MPC8541ECVTAQE	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	783	HBGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1.35 V	64	32		GRID ARRAY, HEAT SINK/SLUG		1.25 V	105 Cel		-40 Cel		BOTTOM	3.75 mm		29 mm		YES	64	166 MHz			29 mm	CMOS		1.3 V					1 mm	FLOATING POINT	R-PBGA-B783		Not Qualified	1000 rpm	YES
MPC8347CZUADFB	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	672	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	32	32		GRID ARRAY, LOW PROFILE		1.14 V	105 Cel		-40 Cel		BOTTOM	1.69 mm		35 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66 MHz			35 mm	CMOS		1.2 V					1 mm	FLOATING POINT	S-PBGA-B672		Not Qualified	266 rpm	YES
T2081NXN8MQLB	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.055 V	16			GRID ARRAY, FINE PITCH		.995 V	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm		23 mm		YES	64		30	250	23 mm	CMOS		1.025 V					.8 mm	FIXED POINT	S-PBGA-B780	3		1200 rpm	YES	e1
MPC8555CVTAJEX	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	64	32		GRID ARRAY		1.14 V	105 Cel		-40 Cel		BOTTOM	3.75 mm		29 mm		YES	64	166 MHz			29 mm	CMOS		1.2 V					1 mm	FLOATING POINT	S-PBGA-B783		Not Qualified	533 rpm	YES
MPC8245TVV350D	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	352	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	2.1 V	32	32	2,3.3	GRID ARRAY, LOW PROFILE	BGA352,26X26,50	1.9 V	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.65 mm		35 mm		YES	32	66 MHz	30	245	35 mm	CMOS		2 V			Microprocessors		1.27 mm	FLOATING POINT	S-PBGA-B352	3	Not Qualified	350 rpm	YES	e1
MPC8347ECZQADF	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	620	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	32	32	1.2,2.5,3.3	GRID ARRAY	BGA620,28X28,40	1.14 V	105 Cel		-40 Cel	TIN LEAD	BOTTOM	2.46 mm		29 mm		YES	32	66 MHz			29 mm	CMOS		1.2 V			Microprocessors		1 mm	FLOATING POINT	S-PBGA-B620		Not Qualified	266 rpm	YES	e0
MPC8347ECVVAJDB	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	672	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	32	32	1.2,2.5,3.3	GRID ARRAY, LOW PROFILE	BGA672,34X34,40	1.14 V	105 Cel		-40 Cel		BOTTOM	1.69 mm		35 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66 MHz	40	260	35 mm	CMOS		1.2 V			Microprocessors		1 mm	FLOATING POINT	S-PBGA-B672	3	Not Qualified	533 rpm	YES
MPC8347ECZQAGFB	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	620	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	32	32		GRID ARRAY		1.14 V	105 Cel		-40 Cel		BOTTOM	2.46 mm		29 mm	ALSO REQUIRES 2.5V AND 3.3V SUPPLY	YES	32	66 MHz			29 mm	CMOS		1.2 V					1 mm	FLOATING POINT	S-PBGA-B620		Not Qualified	400 rpm	YES
MPC8347ECZUAJFA	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	672	BGA	SQUARE	PLASTIC/EPOXY		YES			32	1.2,2.5,3.3	GRID ARRAY	BGA672,34X34,40		105 Cel		-40 Cel		BOTTOM											CMOS					Microprocessors		1 mm		S-PBGA-B672		Not Qualified	533 rpm
MPC8541ECVTAPF	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	783	HBGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1.26 V	64	32		GRID ARRAY, HEAT SINK/SLUG		1.14 V	105 Cel		-40 Cel		BOTTOM	3.75 mm		29 mm		YES	64	166 MHz			29 mm	CMOS		1.2 V					1 mm	FLOATING POINT	R-PBGA-B783		Not Qualified	833 rpm	YES
P1010NXE5FHA	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	425	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	16			GRID ARRAY, FINE PITCH	BGA425,23X23,32	.95 V	105 Cel	4	-40 Cel		BOTTOM	1.9 mm		19 mm		YES	32				19 mm	CMOS		1 V	4				.8 mm	FIXED POINT	S-PBGA-B425			667 rpm	NO
P1010CXE5FHB	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	425	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	16			GRID ARRAY, FINE PITCH	BGA425,23X23,32	.95 V	105 Cel	4	-40 Cel		BOTTOM	1.9 mm		19 mm		YES	32				19 mm	CMOS		1 V	4				.8 mm	FIXED POINT	S-PBGA-B425			667 rpm	NO

Microprocessors

A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.

Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.

Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.

One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.